TSMC

Last updated

24°46′25″N120°59′55″E / 24.77361°N 120.99861°E / 24.77361; 120.99861 (TSMC Fab 2) )
Taiwan Semiconductor Manufacturing Company Limited
Native name
台積電
Company typePublic company
ISIN US8740391003
Industry
Founded Industrial Technology Research Institute, Hsinchu, Taiwan
(21 February 1987;37 years ago (1987-02-21))
Founder Morris Chang
Headquarters,
Area served
Worldwide
Key people
Che Chia Wei (Chairman and CEO) [1]
Production output
  • Decrease2.svg12 million 12-inch equivalent wafers (2023)
Services
  • Manufacture of integrated circuits
  • mask services
  • integrated circuits packaging
  • multi wafer foundry services
RevenueDecrease2.svg US$69.30 billion (2023)
Decrease2.svgUS$26.88 billion (2023)
Increase2.svgUS$30.09 billion (2023)
Total assets Increase2.svgUS$169.6 billion (2023)
Total equity Increase2.svgUS$112.7 billion (2023)
Number of employees
Increase2.svg 76,478 (2023)
Divisions SSMC (38.8% joint venture with NXP)
Subsidiaries
  • WaferTech
  • TSMC Nanjing Company Ltd.
  • JASM
Chinese name
Traditional Chinese 台灣積體電路製造股份有限公司
Transcriptions
Standard Mandarin
Hanyu Pinyin Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī
Bopomofo ㄊㄞˊ ㄨㄢ ㄐㄧ ㄊㄧˇ ㄉㄧㄢˋ ㄌㄨˋ ㄓˋ ㄗㄠˋ ㄍㄨˇ ㄈㄣˋ ㄧㄡˇ ㄒㄧㄢˋ ㄍㄨㄥ ㄙ
Wade–Giles T'ai2-wan1 Chi1-t'i3 Tien4-lu4 Chih4-tsao4 Ku3-fen4 You3-hsien4 Kung1-ssŭ1
Southern Min
Hokkien POJ Tâi-oân chek-thé tiān-lō͘ chè-chō kó͘-hūn iú-hān kong-si
Tâi-lô Tâi-uân tsik-thé tiān-lōo tsè-tsō kóo-hūn iú-hān kong-si
150 mm wafer
Fab 3 Hsinchu
( 24°46′31″N120°59′28″E / 24.77528°N 120.99111°E / 24.77528; 120.99111 (TSMC Fab 3) )
200 mm wafer
Fab 5 Hsinchu
( 24°46′25″N120°59′55″E / 24.77361°N 120.99861°E / 24.77361; 120.99861 (TSMC Fab 5) )
200 mm wafer
Fab 6 Shanhua District
( 23°06′36.2″N120°16′24.7″E / 23.110056°N 120.273528°E / 23.110056; 120.273528 (TSMC Fab 6) )
200 mm waferphases 1 & 2 operational
Fab 8 Hsinchu
( 24°45′44″N121°01′11″E / 24.76222°N 121.01972°E / 24.76222; 121.01972 (TSMC Fab 8) )
200 mm wafer
Fab 10 Songjiang, Shanghai
( 31°2′7.6″N121°9′33″E / 31.035444°N 121.15917°E / 31.035444; 121.15917 (TSMC Fab 10) )
200 mm waferTSMC China Company Limited
Fab 11 Camas, Washington
( 45°37′7.7″N122°27′20″W / 45.618806°N 122.45556°W / 45.618806; -122.45556 (TSMC Fab 11) )
200 mm waferWaferTech L.L.C.; 100% TSMC
Fab 12A Hsinchu
( 24°46′24.9″N121°0′47.2″E / 24.773583°N 121.013111°E / 24.773583; 121.013111 (TSMC Fab 12A) )
300 mm waferphases 1, 2, 4–7 operational, phase 8 under construction, and phase 9 planned
TSMC head office
Fab 12B Hsinchu
( 24°46′37″N120°59′35″E / 24.77694°N 120.99306°E / 24.77694; 120.99306 (TSMC Fab 12B) )
300 mm waferTSMC R&D Center, phase 3 operational
Fab 14 Shanhua District
( 23°06′46.2″N120°16′26.9″E / 23.112833°N 120.274139°E / 23.112833; 120.274139 (TSMC Fab 14) )
300 mm waferphases 1–7 operational, phase 8 under construction
Fab 15 Taichung
( 24°12′41.3″N120°37′2.4″E / 24.211472°N 120.617333°E / 24.211472; 120.617333 (TSMC Fab 15) )
300 mm waferphases 1–7 operational
Fab 16 Nanjing, Jiangsu
( 31°58′33″N118°31′59″E / 31.97583°N 118.53306°E / 31.97583; 118.53306 (TSMC Fab 16) )
300 mm waferTSMC Nanjing Company Limited
Fab 18 Anding District, Tainan
( 23°07′05″N120°15′45″E / 23.11806°N 120.26250°E / 23.11806; 120.26250 (TSMC Fab 18) )
300 mm waferphases 1–8 operational
Fab 20 Hsinchu
( 24°45′51″N121°0′10″E / 24.76417°N 121.00278°E / 24.76417; 121.00278 (TSMC Fab 20) )
300 mm waferplanned in 4 phases
Fab 21 Phoenix, Arizona
( 33°46′30″N112°09′30″W / 33.77500°N 112.15833°W / 33.77500; -112.15833 (TSMC Fab 21) )
300 mm waferphase 1 under construction, opening projected for the end of 2024; phase 2 under construction, opening projected for the end of 2026
Fab 22 Kaohsiung
( 22°42′35″N120°18′44″E / 22.70972°N 120.31222°E / 22.70972; 120.31222 (TSMC Fab 22) )
300 mm wafer3 phases planned; phase 1 under construction
JASM
(Fab 23)
Kumamoto (Japan)
( 32°53′8″N130°50′33″E / 32.88556°N 130.84250°E / 32.88556; 130.84250 (TSMC Fab 23) )
300 mm waferJapan Advanced Semiconductor Manufacturing, Inc.

joint venture founded by TSMC (70%), SSSC (20%), and Denso (10%)
under construction, opening projected for the end of 2024

SSMCSingapore
( 1°22′58″N103°56′5.7″E / 1.38278°N 103.934917°E / 1.38278; 103.934917 (SSMC (TSMC-NXP JV)) )
200 mm wafer Systems on Silicon Manufacturing Cooperation, 1998 founded as joint venture by TSMC, Philips Semiconductors (now NXP Semiconductors), and EDB Investments, Singapore. In November 2006 EDB left the joint venture and TSMC raised their stake in SSMC to 38.8%, NXP to 61.2%.
Advanced Backend Fab 1 Hsinchu
( 24°46′39.6″N120°59′28.9″E / 24.777667°N 120.991361°E / 24.777667; 120.991361 (TSMC Advanced Backend Fab 1) )
Backend
Advanced Backend Fab 2 Shanhua District
( 23°06′46.2″N120°16′26.9″E / 23.112833°N 120.274139°E / 23.112833; 120.274139 (TSMC Advanced Backend Fab 2) )
BackendAP2B and AP2C operational
Advanced Backend Fab 3 Longtan District, Taoyuan
( 24°53′01″N121°11′11″E / 24.883541°N 121.186478°E / 24.883541; 121.186478 (TSMC Advanced Backend Fab 3) )
Backend
Advanced Backend Fab 5 Taichung
( 24°12′52.9″N120°37′05.1″E / 24.214694°N 120.618083°E / 24.214694; 120.618083 (TSMC Advanced Backend Fab 5) )
Backend
Advanced Backend Fab 6 Zhunan
( 24°42′25″N120°54′26″E / 24.70694°N 120.90722°E / 24.70694; 120.90722 (TSMC Advanced Backend Fab 6) )
Backendplanned in 3 phases, AP6A operational, phases B & C under construction
Advanced Backend Fab 7 Taibo City, Chiayi County
( 23°28′27.1″N120°18′05.9″E / 23.474194°N 120.301639°E / 23.474194; 120.301639 (TSMC Advanced Backend Fab 7) )
Backendplanned in 2 phases

Arizona

Fab 21 under construction in Phoenix, Arizona in November 2023 231105-1 TSMC Fab 21 construction.jpg
Fab 21 under construction in Phoenix, Arizona in November 2023

In 2020, TSMC announced a planned fab in Phoenix, Arizona, intended to begin production by 2024 at a rate of 20,000 wafers per month. As of 2020, TSMC announced that it would bring its newest 5 nm process to the Arizona facility, a significant break from its prior practice of limiting US fabs to older technologies. The Arizona plant was estimated to not be fully operational until 2024, when the 5 nm process is projected to be replaced by TSMC's 3 nm process as the latest technology. [118] At launch it will be the most advanced fab in the United States. [119] TSMC plans to spend $12 billion on the project over eight years, beginning in 2021. [118] TSMC claimed the plant will create 1,900 full-time jobs. [120]

In December 2022, TSMC announced its plans to triple its investment in the Arizona plants in response to the growing tensions between the US and China and the supply chain disruption that has led to chip shortages. [121] In that same month, TSMC stated that they were running into major cost issues, because the cost of construction of buildings and facilities in the US is four to five times what an identical plant would cost in Taiwan, (due to higher costs of labor, red tape, and training), as well as difficulty finding qualified personnel (for which it has hired US workers and sent them for training in Taiwan for 12–18 months.) These additional production costs will increase the cost of TSMC's chips made in the US to at least 50% more than the cost of chips made in Taiwan. [122] [123] [124] In July 2023 TSMC warned that US talent was insufficient, so Taiwanese workers will need to be brought in for a limited time, and that the chip factory won't be operational until 2025. [125] In September 2023, an analyst said the chips will still need to be sent back to Taiwan for packaging. [126] In January 2024, TSMC chairman Liu again warned that Arizona lacked workers with the specialized skills to hire and that TSMC's second Arizona plant likely won't start volume production of advanced chips until 2027 or 2028. [127]

In April 2024, the US Commerce Department agreed to provide $6.6 billion in direct funding and up to $5 billion in loans to TSMC for the purposes of creating semiconductor manufacturing facilities in Arizona. This action falls under the CHIPS and Science Act and is intended to boost domestic chip production for the USA. [128]

Central Taiwan Science Park

The investment of US$9.4 billion to build its third 300mm wafer fabrication facility in Central Taiwan Science Park (Fab 15) was originally announced in 2010. [129] The facility was expected to manufacture over 100,000 wafers a month and generate US$5 billion per year of revenue. [130] TSMC has continued to expand advanced 28 nm manufacturing capacity at Fab 15. [131] On 12 January 2011, TSMC announced the acquisition of land from Powerchip Semiconductor for NT$2.9 billion (US$96 million) to build two additional 300mm fabs (Fab 12B) to cope with increasing global demand. [132]

WaferTech subsidiary

WaferTech, a subsidiary of TSMC, is a pure-play semiconductor foundry based in Camas, Washington, 32 km (20 mi) outside Portland, Oregon. The WaferTech campus contains a 9.3 ha (23 acres) complex housed on 105 ha (260 acres), with a main fabrication facility consisting of a 12,000 m2 (130,000 sq ft) 200mm wafer fabrication plant. [133] The site is the second-largest pure-play foundry in the United States, employing 1,100 workers.[ citation needed ] The largest is GlobalFoundries Fab 8 in Malta, New York, which employs over 3,000 workers with over 278,709 m2 (3,000,000 sq ft) under one roof.[ citation needed ] As of 2024, the facility supports node sizes of 0.35, 0.30, 0.25, 0.22, 0.18, and 0.16 micrometers, with an emphasis on embedded flash process technology. [134]

History

WaferTech was established in June 1996 as a joint venture with TSMC, Altera, Analog Devices, and ISSI as key partners. The four companies and minor individual investors placed US$1.2 billion into this venture, which was at the time the single largest startup investment in the state of Washington. The company started production in July 1998 in its 200mm semiconductor fabrication plant. Its first product was a 0.35 micrometer part for Altera.[ citation needed ] TSMC bought out the joint venture partners in 2000 and acquired full control, operating it as a fully owned subsidiary. [135] In 2015, Tsung Kuo was named company president and fab director of WaferTech. [136]

Japan

In November 2021, TSMC and Sony announced that TSMC would be establishing a new subsidiary named Japan Advanced Semiconductor Manufacturing  [ ja; zh ] (JASM) in Kumamoto, Japan. The new subsidiary will manufacture 22- and 28-nanometer processes. The initial investment will be approximately $7 billion, with Sony investing approximately $500 million for a less than 20% stake. Construction of the fabrication plant is expected to start in 2022, with production targeted to begin two years later in 2024

Germany

In August 2023, TSMC committed €3.5 billion to a €10+ billion factory in Dresden, Germany. The plant is subsidised with €5 billion from the German government. Three European companies (Robert Bosch GmbH, Infineon Technologies, and NXP Semiconductors) invested in the plant in return for a 10% share each. The resulting joint venture with TSMC is named European Semiconductor Manufacturing Company (ESMC). [137] [138] [139] [140] The factory is planned to be fully operational in 2029 with a monthly capacity of 40,000 12-inch wafers. [141]

See also

Related Research Articles

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<span class="mw-page-title-main">Powerchip</span> Taiwanese integrated circuit manufacturer

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