TW201407805A - Solar cells - Google Patents
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- TW201407805A TW201407805A TW102122329A TW102122329A TW201407805A TW 201407805 A TW201407805 A TW 201407805A TW 102122329 A TW102122329 A TW 102122329A TW 102122329 A TW102122329 A TW 102122329A TW 201407805 A TW201407805 A TW 201407805A
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- Prior art keywords
- nanowire
- substrate
- graphite
- nanowires
- core
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- 239000002070 nanowire Substances 0.000 claims abstract description 376
- 239000000758 substrate Substances 0.000 claims abstract description 205
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035209—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
- H01L31/035227—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022475—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of indium tin oxide [ITO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Description
本發明係關於用於在石墨基板上磊晶生長奈米線且隨後給彼等奈米線提供殼層及導電塗層之一方法。特定而言,本發明採用分子束磊晶技術以在石墨基板上磊晶及理想地垂直生長奈米線,從而允許一殼層材料及然後一外部導電塗層材料被攜載於該等奈米線上。所得經塗佈核心殼層奈米線形成本發明之一進一步態樣。具有石墨基板及外部導電塗層之核心殼層奈米線形成可用於在太陽能應用中吸收光子之一電池。 The present invention relates to a method for epitaxially growing nanowires on a graphite substrate and subsequently providing a sheath and a conductive coating to the nanowires. In particular, the present invention employs molecular beam epitaxy to epitaxially and ideally grow the nanowires on a graphite substrate, thereby allowing a shell material and then an outer conductive coating material to be carried on the nanowires. on-line. The resulting coated core shell nanowires form a further aspect of the invention. A core shell nanowire with a graphite substrate and an outer conductive coating forms a cell that can be used to absorb photons in solar applications.
近年來,由於奈米技術變成一重要工程學科,因此已增強對半導體奈米線之關注。已發現奈米線(某些作者亦將其稱為奈米鬚、奈米棒、奈米柱或奈米圓柱等)在多種電裝置(諸如感測器、LED之太陽能電池)中之重要應用。 In recent years, as nanotechnology has become an important engineering discipline, attention has been raised to semiconductor nanowires. It has been found that nanowires (some authors also refer to them as nanobes, nanorods, nanopillars or nanocylinders) are important applications in a variety of electrical devices, such as sensors, LED solar cells. .
出於此應用之目的,術語奈米線應解釋為基本上呈一維形式(亦即,具有其寬度或直徑及其長度通常介於幾百nm至幾μm之範圍內之奈米尺寸)之一結構。通常,將奈米線視為具有不大於500nm之至少兩個維度。 For the purposes of this application, the term nanowire is to be interpreted as being substantially in one-dimensional form (i.e., having a width or diameter and a nanometer dimension whose length is typically in the range of a few hundred nanometers to a few millimeters). a structure. Typically, the nanowires are considered to have at least two dimensions of no more than 500 nm.
在奈米尺度上控制一維生長提供用於組合材料及操縱性質(包含機械性質、電性質、光學性質、熱電性質、壓電性質及電磁性質)以及用以設計新穎裝置之獨特機會。 Controlling one-dimensional growth at the nanoscale provides a unique opportunity to combine materials and handling properties including mechanical, electrical, optical, thermoelectric, piezoelectric, and electromagnetic properties, as well as to design novel devices.
存在諸多不同類型之奈米線,包含金屬(例如,Ni、Pt、Au)奈米線、半導電(例如,Si、InP、GaN、GaAs、ZnO等)奈米線、及絕緣 (例如,SiO2、TiO2)奈米線。儘管設想下文詳細概述之原理適用於所有方式之奈米線技術,但本發明人主要關注半導體奈米線。 There are many different types of nanowires, including metal (eg, Ni, Pt, Au) nanowires, semiconducting (eg, Si, InP, GaN, GaAs, ZnO, etc.) nanowires, and insulation (eg, SiO 2 , TiO 2 ) nanowire. Although the principles detailed below are contemplated for use in all manner of nanowire technology, the inventors have focused primarily on semiconductor nanowires.
習用上,一直在與奈米線自身相同之一基板上生長半導體奈米線(同質磊晶生長)。因此,GaAs奈米線生長於GaAs基板上,以此類推。當然,此確保基板之晶體結構與生長之奈米線之晶體結構之間存在一晶格匹配。基板及奈米線兩者可具有相同晶體結構。 Conventionally, a semiconductor nanowire (homogeneous epitaxial growth) has been grown on one of the same substrates as the nanowire itself. Therefore, the GaAs nanowires are grown on a GaAs substrate, and so on. Of course, this ensures a lattice match between the crystal structure of the substrate and the crystal structure of the grown nanowire. Both the substrate and the nanowires may have the same crystal structure.
然而,在一匹配基板上生長一奈米線係極昂貴且具限制性的。舉例而言,GaAs基板需要經特定製造且彼係昂貴的。為確保奈米線沿通常偏好之[111]B方向生長,與具有(001)定向之表面之較常見基板相比,該基板需要經專門切片以具有(111)B定向之表面。(111)B定向之GaAs基板比(001)定向之GaAs基板昂貴。此外,不管怎樣,GaAs不係用以攜載一奈米線之理想材料。舉例而言,GaAs係脆的且不係惰性的。GaAs不係撓性的或透明的。將較佳地,可採用其他較有吸引力之基板。 However, growing a nanowire on a matching substrate is extremely expensive and restrictive. For example, GaAs substrates need to be specifically manufactured and expensive. To ensure that the nanowires grow along the generally preferred [111] B direction, the substrate needs to be specifically sliced to have a (111) B oriented surface compared to a more common substrate having a (001) oriented surface. A (111) B oriented GaAs substrate is more expensive than a (001) oriented GaAs substrate. In addition, GaAs is not ideal for carrying a nanowire. For example, GaAs is brittle and not inert. GaAs is not flexible or transparent. Preferably, other more attractive substrates can be employed.
本發明人尋求擺脫此等限制性基板之方式。當然,進行此不僅係使用一不同基板之一問題。基板一不同於正生長之奈米線,依據定義,基板與奈米線之間就存在一可能晶格不匹配,以及存在待考量之眾多其他可能問題。然而,文獻含有其他工作者在替代基板上生長半導體奈米線之多次嘗試。 The inventors sought ways to get rid of such limiting substrates. Of course, doing this is not only a matter of using one different substrate. The substrate is different from the positively grown nanowire. By definition, there is a possible lattice mismatch between the substrate and the nanowire, and there are many other possible problems to be considered. However, the literature contains several attempts by other workers to grow semiconductor nanowires on alternative substrates.
在Plissard等人之Nanotechnology 21(2010)(385602-10)中,已做出使用Ga作為一催化劑在矽(111)定向之基板上生長垂直GaAs奈米線之多次嘗試。顯然,矽係一較佳電子基板,但其呈純形式時亦係昂貴的。此外,矽不係透明的且不係撓性的。其與金(奈米線生長中通常使用之一催化劑)亦具有一消極相互作用。金可擴散至矽中並在奈米線與基板中形成中間隙缺陷狀態。實際上,Plissard等人總結使用金與一Si基板係不期望的並開發一無金奈米線生長技術。 In Plissard et al., Nanotechnology 21 (2010) (385602-10), several attempts have been made to grow vertical GaAs nanowires on a ytterbium (111) oriented substrate using Ga as a catalyst. Obviously, tantalum is a preferred electronic substrate, but it is also expensive when it is in pure form. In addition, the crucible is not transparent and not flexible. It also has a negative interaction with gold (one of the catalysts commonly used in nanowire growth). Gold can diffuse into the crucible and form a mid-gap defect state in the nanowire and the substrate. In fact, Plissard et al. summarized the undesired use of gold and a Si substrate and developed a gold-free nanowire growth technique.
本發明人尋求在石墨基板上磊晶生長奈米線。石墨基板係由石墨烯或其衍生物之單個層或多個層構成之基板。在其最純形式中,石墨烯係藉助配置成一蜂巢式晶格圖案之雙電子鍵(稱作一sp2鍵)結合在一起之碳原子之一單原子層厚薄片。與諸如GaAs基板之其他半導體基板不同,石墨基板係提供用於生長奈米線之一理想基板之極廉價可易於獲得材料。使用極少分層之石墨烯基板係理想的,此乃因此等石墨烯基板係薄、輕且撓性的,但極堅固。其電性質可自高度導電修改為絕緣的。其亦不受任何事物影響、係極惰性的且因此可與金及其他催化劑相容。 The inventors sought to epitaxially grow nanowires on a graphite substrate. The graphite substrate is a substrate composed of a single layer or a plurality of layers of graphene or a derivative thereof. In its purest form, graphene is a single atomic layer thick sheet of carbon atoms bonded together by a two-electron bond (referred to as a sp 2 bond) configured as a honeycomb lattice pattern. Unlike other semiconductor substrates such as GaAs substrates, graphite substrates provide an extremely inexpensive and readily available material for growing an ideal substrate for a nanowire. It is desirable to use a graphene-based plate which is rarely layered, so that the graphene-based plate is thin, light and flexible, but extremely strong. Its electrical properties can be modified from highly conductive to insulative. It is also unaffected by anything, extremely inert and therefore compatible with gold and other catalysts.
然而,此等不同材料種類之間的奈米線之無缺陷磊晶生長不係顯而易見的,此乃因(大部分)半導體係在表面處具有反應性懸鍵之三維形,而石墨具有在表面處不具有懸鍵之一個二維蜂巢式結構且因此形成一極惰性且疏水表面。 However, the defect-free epitaxial growth of the nanowires between these different material types is not obvious, since (most) semiconductor systems have a three-dimensional shape of reactive dangling bonds at the surface, while graphite has a surface There is no two-dimensional honeycomb structure with dangling bonds and thus forms a very inert and hydrophobic surface.
在諸如石墨之基板上生長奈米線亦可具挑戰性,此乃因已察覺基板與生長之奈米線之間將存在大晶格不匹配。大晶格不匹配可導致具有差排之有缺陷奈米線或實際上導致完全無奈米線生長。磊晶生長奈米線以使得奈米線將係有序的及選用匹配基板之一相容晶體結構係重要的。 The growth of nanowires on substrates such as graphite can also be challenging because it has been observed that there will be a large lattice mismatch between the substrate and the growing nanowire. Large lattice mismatches can result in defective nanowires with poor rows or actually result in complete nanowire growth. Epitaxial growth of the nanowires is important so that the nanowires will be ordered and one of the matching substrates will be compatible with the crystal structure.
對於諸多應用,奈米線可垂直於基板表面垂直生長將係重要的。半導體奈米線通常沿[111]方向(若為立方體晶體結構)或方向(若為六邊形晶體結構)生長。此意指需要將基板表面(111)或(0001)定向,其中基板之表面原子配置成一六邊形對稱性。 For many applications, it is important that the nanowires grow vertically perpendicular to the surface of the substrate. Semiconductor nanowires are typically grown in the [111] direction (if cubic crystal structure) or in the direction (if hexagonal crystal structure). This means that the substrate surface (111) or (0001) needs to be oriented, wherein the surface atoms of the substrate are arranged in a hexagonal symmetry.
在可於一石墨表面上生長一半導體奈米線之前仍存留諸多困難以待克服。 There are still many difficulties to overcome before a semiconductor nanowire can be grown on a graphite surface.
如上文所述,已做出在Si(111)基板上生長垂直GaAs奈米線之多次嘗試。本發明僅係關於石墨基板。亦已做出在石墨基板上生長結晶 奈米材料之某些嘗試。 As mentioned above, many attempts have been made to grow vertical GaAs nanowires on Si (111) substrates. The invention is only concerned with graphite substrates. Has also made crystal growth on graphite substrates Some attempts at nanomaterials.
在JACS(2010,132,3270-3271)中,Ni、Co及Fe之氧化物及氫氧化物之奈米晶體合成於一石墨烯支撐體上。 In JACS (2010, 132, 3270-3271), nanocrystals of oxides and hydroxides of Ni, Co and Fe are synthesized on a graphene support.
在Appl.Phys Lett.(95,213101(2009))中,Kim等人報告生長於石墨烯層上之垂直對準之ZnO奈米結構。此等係使用無催化劑有機金屬氣相磊晶(MOVPE)之生長,及ZnO奈米結構之表面形態取決於生長溫度。 In Appl. Phys Lett. (95, 213101 (2009)), Kim et al. report a vertically aligned ZnO nanostructure grown on a graphene layer. These are grown using catalyst-free organometallic vapor phase epitaxy (MOVPE), and the surface morphology of the ZnO nanostructure depends on the growth temperature.
本發明人已發現某些化合物/元素之磊晶奈米線可生長於石墨基板上。由於石墨基板在表面處不具有懸鍵且與像矽及GaAs之典型半導體相比,具有極短原子鍵長度,因此沒有理由預期奈米線在其上之成核及磊晶生長。如下文驚人地所述,取決於半導體原子如何放置於石墨烯之表面上,當使用石墨烯時與諸多半導體存在一良好晶格匹配。 The inventors have discovered that certain compound/element epitaxial nanowires can be grown on a graphite substrate. Since the graphite substrate does not have a dangling bond at the surface and has a very short atomic bond length compared to a typical semiconductor such as germanium and GaAs, there is no reason to expect nucleation and epitaxial growth of the nanowire thereon. As surprisingly described below, depending on how the semiconductor atoms are placed on the surface of the graphene, there is a good lattice match with many semiconductors when graphene is used.
特定而言,使用分子束磊晶就奈米線生長而言提供優良結果。特定而言,本發明使得能夠在石墨基板上生長IV族、II-VI族或(特定而言)III-V族半導體奈米線。本發明人已使用此驚人能力來在導電石墨基板上生長磊晶奈米線且已開發形成可吸收光子及因此提供太陽能技術及作為光偵測器之價值之光伏打電池之概念。 In particular, the use of molecular beam epitaxy provides excellent results in terms of nanowire growth. In particular, the present invention enables the growth of Group IV, II-VI or (specifically) Group III-V semiconductor nanowires on a graphite substrate. The inventors have used this amazing ability to grow epitaxial nanowires on conductive graphite substrates and have developed the concept of photovoltaic cells that can absorb photons and thus provide solar energy technology and value as a photodetector.
因此,自一項態樣來看,本發明提供一種物質組合物,特定而言一種光伏打電池,其包括:至少一個核心半導體奈米線,其在一石墨基板上,該至少一個核心奈米線已磊晶生長於該基板上,其中該奈米線包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素;一半導體殼層,其環繞該核心奈米線,該殼層包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素以使得該核 心奈米線及該殼層分別形成一n型半導體及一p型半導體,或反之亦然;及一外部導電塗層,其環繞該殼層,該外部導電塗層形成一電極觸點。 Thus, in one aspect, the present invention provides a composition of matter, in particular a photovoltaic cell comprising: at least one core semiconductor nanowire on a graphite substrate, the at least one core nanoparticle a wire has been epitaxially grown on the substrate, wherein the nanowire comprises at least one III-V compound or at least one II-VI compound or at least one Group IV element; a semiconductor shell surrounding the core nanowire The shell layer comprises at least one group III-V compound or at least one group II-VI compound or at least one group IV element such that the core The core nanowire and the shell layer form an n-type semiconductor and a p-type semiconductor, respectively, or vice versa; and an outer conductive coating surrounds the shell layer, the outer conductive coating forming an electrode contact.
自另一態樣來看,本發明提供一種物質組合物,特定而言一種光伏打電池,其包括:至少一個核心半導體奈米線,其在一石墨基板上,該至少一個核心奈米線已磊晶生長於該基板上,其中該奈米線包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素;一半導體殼層,其環繞該核心奈米線,該殼層包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素以使得該核心奈米線及該殼層分別形成一n型半導體及一p型半導體,或反之亦然;及視情況一外部導電塗層,其環繞該殼層,該外部導電塗層形成一電極觸點。 Viewed from another aspect, the present invention provides a composition of matter, in particular a photovoltaic cell comprising: at least one core semiconductor nanowire on a graphite substrate, the at least one core nanowire has Epitaxial growth on the substrate, wherein the nanowire comprises at least one III-V compound or at least one II-VI compound or at least one group IV element; a semiconductor shell surrounding the core nanowire, The shell layer comprises at least one group III-V compound or at least one group II-VI compound or at least one group IV element such that the core nanowire and the shell layer form an n-type semiconductor and a p-type semiconductor, respectively, or vice versa And, as the case may be, an external conductive coating surrounding the shell, the outer conductive coating forming an electrode contact.
自另一態樣來看,本發明提供一種用於製備如上文中所定義之一電池之方法,該方法包括:(I)將II-VI族元素或III-V族元素或至少一種IV族元素較佳地經由一分子束提供至該石墨基板之表面;(II)自該石墨基板之該表面磊晶生長至少一個奈米線以提供一奈米線核心;(III)給該至少一個奈米線核心塗佈包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素之一殼層以使得該核心奈米線及該殼層分別形成一n/p接面或一p/n接面;及(IV)給該殼層塗佈環繞該殼層之一外部導電塗層,該外部導電塗層形成一電極觸點,較佳地一透明電極觸點。 Viewed from another aspect, the present invention provides a method for preparing a battery as defined above, the method comprising: (I) a Group II-VI element or a Group III-V element or at least one Group IV element Preferably provided to the surface of the graphite substrate via a molecular beam; (II) epitaxially growing at least one nanowire from the surface of the graphite substrate to provide a nanowire core; (III) giving the at least one nano The wire core coating comprises at least one III-V compound or at least one II-VI compound or at least one shell of a Group IV element such that the core nanowire and the shell layer form an n/p junction or a p/n junction; and (IV) coating the shell with an outer conductive coating surrounding one of the shell layers, the outer conductive coating forming an electrode contact, preferably a transparent electrode contact.
自另一態樣來看,本發明提供一種用於製備如上文中所定義之一電池之方法,其中在存在一催化劑之情況下於一石墨基板上磊晶生 長至少一個奈米線。 Viewed from another aspect, the present invention provides a method for preparing a battery as defined above, wherein a crystal is epitaxially grown in the presence of a catalyst At least one nanowire.
視情況,可化學/物理修改該石墨基板之表面以增強奈米線之該磊晶生長。 Optionally, the surface of the graphite substrate can be chemically/physically modified to enhance the epitaxial growth of the nanowires.
自另一態樣來看,本發明提供一種包括如上文中所定義之一電池之裝置,諸如一太陽能電池。 Viewed from another aspect, the invention provides a device comprising a battery as defined above, such as a solar cell.
自另一態樣來看,本發明提供一種包括複數個如上文中所定義之光伏打電池之太陽能電池。 Viewed from another aspect, the invention provides a solar cell comprising a plurality of photovoltaic cells as defined above.
自另一態樣來看,本發明提供一種包括複數個如上文中所定義之光伏打電池之太陽能電池,其中該等光伏打電池中之至少兩者具有一不同帶隙且藉此吸收不同波長之光。 In another aspect, the present invention provides a solar cell comprising a plurality of photovoltaic cells as defined above, wherein at least two of the photovoltaic cells have a different band gap and thereby absorb different wavelengths Light.
一III-V族化合物意指包括來自III族之至少一個離子及來自V族之至少一個離子之一化合物。類似地,一II-VI族化合物係包括至少一種II族離子及至少一種VI族離子之一化合物。在此應用中,術語(II)族涵蓋典型(IIa)族週期及(IIb)族週期(亦即,鹼土系列元素及Zn系列元素)兩者。IV族元素包含Si及Ge。將瞭解,術語IV族元素既涵蓋單一IV族元素且亦涵蓋可組合以形成諸如SiC或SiGe之一化合物之兩種此等元素之存在。可存在來自每一族之一種以上離子(例如)以便形成InGaAs等等。 A III-V compound means a compound comprising at least one ion from Group III and at least one ion from Group V. Similarly, a Group II-VI compound includes at least one Group II ion and at least one VI Group ion compound. In this application, the term (II) family encompasses both the typical (IIa) family cycle and the (IIb) family cycle (ie, the alkaline earth series elements and the Zn series elements). Group IV elements include Si and Ge. It will be appreciated that the term Group IV element encompasses both a single Group IV element and also encompasses the presence of two such elements that can be combined to form a compound such as SiC or SiGe. There may be more than one ion from each family (for example) to form InGaAs or the like.
本文中使用術語奈米線來闡述奈米尺寸之一固態線形結構。奈米線較佳貫穿大部分奈米線(例如,其長度之至少75%)具有一均勻直徑。術語奈米線意欲涵蓋奈米棒、奈米柱、奈米圓柱或奈米鬚之使用,此等中之某些可具有錐形端結構。奈米線可據說係基本上呈具有其寬度或直徑及其長度通常介於幾百nm至幾μm(例如,6微米至8微米)之範圍內之奈米尺寸之一維形式。通常,奈米線將具有不大於700nm(理想地不大於600nm,尤其不大於500nm)之兩個維度。 The term nanowire is used herein to describe a solid linear structure of one of the nanometer dimensions. The nanowire preferably has a uniform diameter throughout most of the nanowires (e.g., at least 75% of its length). The term nanowire is intended to encompass the use of nanorods, nanopillars, nanocylinders or nanowhiskers, some of which may have a tapered end structure. The nanowires can be said to be substantially in the form of one of the nanometer dimensions having a width or diameter and a length generally ranging from a few hundred nanometers to a few micrometers (e.g., 6 micrometers to 8 micrometers). Typically, the nanowires will have two dimensions of no more than 700 nm (ideally no more than 600 nm, especially no more than 500 nm).
理想地,在奈米線之基底處及在奈米線之頂部處之直徑應保持約相同(例如,在彼此之20%內)。將瞭解,該線必須在最頂部處變窄,通常形成一半球。 Ideally, the diameters at the base of the nanowire and at the top of the nanowire should remain about the same (e.g., within 20% of each other). It will be appreciated that the line must be narrowed at the very top, usually forming a half ball.
將瞭解,基板較佳包括複數個奈米線。此可稱作一奈米線陣列。 It will be appreciated that the substrate preferably includes a plurality of nanowires. This can be referred to as a nanowire array.
石墨基板係由石墨烯或其衍生物之單個層或多個層構成之基板。術語石墨烯指代呈一蜂巢式晶體結構之sp2鍵結碳原子之一平面薄片。石墨烯之衍生物係具有表面修改之彼等衍生物。舉例而言,氫原子可附著至石墨烯表面以形成石墨烷。具有連同碳及氫原子一起附著至表面之氧原子之石墨烯稱作石墨烯氧化物。表面修改亦可能藉由化學摻雜或氧/氫電漿處理。 The graphite substrate is a substrate composed of a single layer or a plurality of layers of graphene or a derivative thereof. The term graphene refers to a planar sheet of sp 2 bonded carbon atoms in a honeycomb structure. The derivatives of graphene are derivatives having surface modifications. For example, a hydrogen atom can be attached to the surface of the graphene to form a graphane. Graphene having an oxygen atom attached to a surface together with carbon and hydrogen atoms is called a graphene oxide. Surface modification may also be treated by chemical doping or oxygen/hydrogen plasma.
術語磊晶源自Greek詞根「epi」(意指「在...上方」)及「taxis」(意指「以有序方式」)。奈米線之原子配置係基於基板之晶體結構。磊晶係此項技術內常用之一術語。磊晶生長在本文中意指模擬基板之定向之一奈米線在基板上之生長。 The term epitaxy is derived from the Greek roots "epi" (meaning "above") and "taxis" (meaning "in an orderly manner"). The atomic configuration of the nanowire is based on the crystal structure of the substrate. Epitaxy is a term commonly used in this technology. Epitaxial growth as used herein means the growth of one of the orientations of the simulated substrate on the substrate.
分子束磊晶(MBE)係在結晶基板上形成沈積之一方法。藉由在一真空中加熱一結晶基板來執行MBE程序以便給基板之晶格結構供能。然後,將一(多個)原子或分子質量束引導至基板之表面上。上文所使用之術語元素意欲涵蓋彼元素之原子、分子或離子之應用。當經引導原子或分子到達基板之表面處時,經引導原子或分子遇到基板之經供能晶格結構或如下文所詳細闡述之一催化劑液滴。隨時間推移,入射原子形成一奈米線。 Molecular beam epitaxy (MBE) is one of the methods of forming a deposit on a crystalline substrate. The MBE process is performed to heat the lattice structure of the substrate by heating a crystalline substrate in a vacuum. The atomic or molecular mass beam(s) are then directed onto the surface of the substrate. The term element as used above is intended to encompass the use of atoms, molecules or ions of the element. When the directed atom or molecule reaches the surface of the substrate, the directed atom or molecule encounters an energized lattice structure of the substrate or one of the catalyst droplets as detailed below. Over time, the incident atoms form a nanowire.
術語光伏打電池用於暗示半導體核心/殼層材料及兩個電極(觸點)之存在。電池可將光子自陽光轉換成電。 The term photovoltaic cell is used to indicate the presence of a semiconductor core/shell material and two electrodes (contacts). The battery converts photons from sunlight to electricity.
術語n/p接面或一p/n接面暗示核心層或殼層中之一者係一p型半導體及另一者係一n型半導體,因此在兩個層之間的界面處形成一徑 向p/n接面。 The term n/p junction or a p/n junction implies that one of the core layer or the shell layer is a p-type semiconductor and the other is an n-type semiconductor, thus forming a junction at the interface between the two layers. path Connect to p/n.
圖1a至圖1d展示在將原子放置於1)H位點及B位點(圖1a、圖1b及圖1d)上及2)H位點或B位點(圖1c)上時之原子配置。在圖1e中,對照其晶格常數來標繪III-V半導體(以及Si及ZnO)之帶隙能量。垂直實(虛)彩色線繪示相對於石墨烯之一理想晶體之晶格常數,該理想晶體將給出與用於具有四種不同原子配置(圖1a至圖1d)之一立方體(六邊形)晶體之石墨烯之完美晶格匹配。該標繪圖顯現在石墨基板上磊晶生長垂直半導體奈米線之巨大可能性。在某些半導體之情形中,針對一種建議原子組態,與石墨烯之晶格不匹配極小(例如,InAs、GaSb及ZnO)。對於像GaAs之其他半導體,晶格不匹配相當大且存在於兩種不同原子組態(如在圖1b或圖1c中)之間。 Figure 1a to Figure 1d show the atomic configuration when atoms are placed on 1) H and B sites (Figures 1a, 1b and 1d) and 2) H sites or B sites (Figure 1c). . In Figure 1e, the band gap energy of the III-V semiconductor (and Si and ZnO) is plotted against its lattice constant. A vertical solid (virtual) color line depicts the lattice constant of an ideal crystal relative to one of the graphenes, which will be given and used for one of the four different atomic configurations (Fig. 1a to Fig. 1d) (six sides) Perfect crystal lattice matching of crystalline graphene. This plot shows the great possibility of epitaxially growing vertical semiconductor nanowires on a graphite substrate. In the case of certain semiconductors, the lattice mismatch with graphene is minimal for a proposed atomic configuration (eg, InAs, GaSb, and ZnO). For other semiconductors like GaAs, the lattice mismatch is quite large and exists between two different atomic configurations (as in Figure 1b or Figure 1c).
圖2展示一MBE實驗設置。 Figure 2 shows an MBE experiment setup.
圖3a係生長於石墨上之Ga(自)催化之GaAs奈米線之一理想化繪示。 Figure 3a is an idealized representation of one of the Ga (self) catalyzed GaAs nanowires grown on graphite.
圖3b係藉由MBE而生長於一凝析石墨片上之兩個垂直Ga輔助之GaAs奈米線之一45°傾斜視圖SEM影像。球形粒子係Ga液滴。 Figure 3b is a 45° oblique view SEM image of two vertical Ga-assisted GaAs nanowires grown on a condensed graphite sheet by MBE. Spherical particle system Ga droplets.
圖3c係磊晶生長於凝析石墨之頂部上之一垂直Ga輔助之GaAs奈米線之石墨/奈米線界面之一剖面TEM影像。 Figure 3c is a cross-sectional TEM image of a graphite/nano-line interface of a vertical Ga-assisted GaAs nanowire epitaxially grown on top of the condensate graphite.
圖4展示已蝕刻有孔的石墨表面上之一遮罩之一繪示。 Figure 4 shows one of the masks on the surface of the graphite that has been etched with holes.
圖5a展示藉由一金屬催化劑輔助之蒸氣-液體-固體(VLS)方法而生長之半導電奈米線之一示意性影像。基板係沈積於一SiO2基板上之石墨烯。 Figure 5a shows a schematic image of a semiconducting nanowire grown by a metal catalyst assisted vapor-liquid-solid (VLS) process. The substrate is graphene deposited on a SiO 2 substrate.
圖5b展示如圖5a中之一示意性影像,但此處石墨烯作為一頂部觸點材料。其亦可設想為其中兩個石墨烯層作為兩個端子之一奈米線太陽能電池。 Figure 5b shows a schematic image as in Figure 5a, but here graphene is used as a top contact material. It is also conceivable that two of the graphene layers serve as one of the two terminals of the nanowire solar cell.
圖6a展示藉由MBE而生長於一Si(111)基板上之Ga輔助之GaAs奈米線陣列之一傾斜視圖SEM影像。 Figure 6a shows an oblique view SEM image of a Ga-assisted GaAs nanowire array grown on a Si (111) substrate by MBE.
圖6b展示覆蓋有沈積於頂部上之一石墨烯層之GaAs奈米線陣列之一SEM影像。奈米線陣列如在圖6a中地生長。 Figure 6b shows an SEM image of a GaAs nanowire array covered with a graphene layer deposited on top. The nanowire array was grown as in Figure 6a.
圖6c展示具有部分沈積於頂部上之一石墨烯層之GaAs奈米線陣列之一經放大SEM影像。奈米線陣列如在圖6a中地生長。 Figure 6c shows an enlarged SEM image of one of the GaAs nanowire arrays having a graphene layer partially deposited on top. The nanowire array was grown as in Figure 6a.
圖7係本發明之一徑向核心殼層奈米線太陽能電池之一示意性繪示。奈米線磊晶生長於具備一個二氧化矽遮罩之一石墨烯基板上。載體材料係金屬箔或玻璃。奈米線核心係GaAs,殼層材料係AlGaAs且使用一AlZnO頂部塗層。 Figure 7 is a schematic illustration of one of the radial core shell nanowire solar cells of the present invention. The nanowire epitaxial growth is carried out on a graphene-based plate having a cerium oxide mask. The carrier material is a metal foil or glass. The core of the nanowire is GaAs, the shell material is AlGaAs and an AlZnO top coat is used.
圖8係使用石墨烯作為一共同中間層之一雙接面太陽能電池結構之一示意圖,其中兩個作用層並聯連接。第一作用低帶隙材料可係任何半導體太陽能電池材料,例如,一基於Si之n-p接面太陽能電池。第一電池之頂部上之第二作用高帶隙材料由作為用於兩個電池之一共同(可使用共同p型或共同n型觸點)中間觸點之石墨烯、石墨烯上之p-n核心殼層III-V半導體奈米線陣列及一頂部透明導電層構成。頂部導電層可係包含石墨烯之任何透明導電材料。 Figure 8 is a schematic diagram of a double junction solar cell structure using graphene as a common intermediate layer in which two active layers are connected in parallel. The first active low bandgap material can be any semiconductor solar cell material, for example, a Si based n-p junction solar cell. The second active high bandgap material on top of the first cell is made of graphene, pn core on graphene as an intermediate contact for one of the two cells (a common p-type or common n-type contact can be used) The shell III-V semiconductor nanowire array and a top transparent conductive layer are formed. The top conductive layer can be any transparent conductive material comprising graphene.
現將參考以下非限制性實例來闡述本發明。 The invention will now be illustrated with reference to the following non-limiting examples.
奈米線生長於配備有一Ga雙絲單元、一In SUMO雙絲單元及一As閥控裂解單元之一Varian Gen II模組分子束磊晶(MBE)系統中,從而允許固定二聚物及四聚物之比例。在本研究中,砷之主要種類為As4。在一凝析石墨片上或在一石墨烯膜(1個單層厚至7個單層厚)上執行NW之生長,該凝析石墨片或石墨烯膜藉由一化學汽相沈積 (CVD)技術直接生長於沈積於一經氧化矽晶圓上之一Ni或Cu膜上。CVD石墨烯膜購自美國之「石墨烯超級市場(Graphene Supermarket)」。樣本使用兩種不同程序而製備。在第一程序中,樣本藉由異丙醇而清潔,後續接著藉助氮之一吹乾,且然後In鍵結至矽晶圓。在第二程序中,在一電子束蒸發器室中將一~30nm厚SiO2層沈積於使用第一程序製備之樣本上,之後使用電子束微影及電漿蝕刻在SiO2中製作直徑為~100nm之孔。 The nanowire is grown in a Varian Gen II module molecular beam epitaxy (MBE) system equipped with a Ga double wire unit, an In SUMO double wire unit and an As valve controlled cracking unit, thereby allowing the immobilization of the dimer and the four The ratio of the polymer. In this study, the main species of arsenic is As 4 . NW growth is performed on a condensed graphite sheet or on a graphene film (1 single layer thick to 7 single layer thick) by a chemical vapor deposition (CVD) of the condensed graphite sheet or graphene film The technique is directly grown on a Ni or Cu film deposited on a cerium oxide wafer. The CVD graphene film was purchased from "Graphene Supermarket" in the United States. Samples were prepared using two different procedures. In the first procedure, the sample is cleaned by isopropyl alcohol, followed by a blow drying with one of the nitrogens, and then In is bonded to the germanium wafer. In the second procedure, a layer of -30 nm thick SiO 2 is deposited on a sample prepared using the first procedure in an electron beam evaporator chamber, and then the diameter is made in SiO 2 using electron beam lithography and plasma etching. ~100nm hole.
然後將樣本載入至用於奈米線生長之MBE系統中。然後,將基板溫度增加至適於GaAs/InAs奈米線生長之一溫度:亦即,分別610℃/450℃。首先在通常介於5分鐘至10分鐘之範圍(取決於Ga/In通量及所期望液滴大小)內之一時間間隔期間將Ga/In通量供應至表面,同時關閉As擋門,以起始表面上之Ga/In液滴之形成。GaAs/InAs奈米線生長藉由同時打開Ga/In瀉流單元之擋門及As瀉流單元之擋門及閥而起始。預設定Ga/In瀉流單元之溫度以產生0.1μm/小時之一標稱平面生長速率。為形成GaAs奈米線,使用1.1×10-6托之一As4通量,而將As4通量設定為4×10-6托以形成InAs奈米線。 The sample is then loaded into an MBE system for nanowire growth. Then, the substrate temperature is increased to a temperature suitable for the growth of the GaAs/InAs nanowire: that is, 610 ° C / 450 ° C, respectively. First, supply Ga/In flux to the surface during one of the time intervals typically between 5 minutes and 10 minutes (depending on the Ga/In flux and the desired droplet size) while closing the As gate to Formation of Ga/In droplets on the starting surface. The GaAs/InAs nanowire growth is initiated by simultaneously opening the gate of the Ga/In effusion cell and the gate and valve of the As bleed unit. The temperature of the Ga/In effusion cell is preset to produce a nominal planar growth rate of 0.1 μm/hour. To form a GaAs nanowire, an As 4 flux of 1.1 × 10 -6 Torr was used, and the As 4 flux was set to 4 × 10 -6 Torr to form an InAs nanowire.
對於GaAs核心奈米線之p型摻雜,使用鈹(Be)。將Be電池溫度設定為990℃,此賦予3×1018cm-3之一標稱p型摻雜濃度。在上文所提及之條件下,進行奈米線生長達3小時之一持續時間,並藉由關閉所有擋門及同時將基板傾斜降溫至室溫而停止該生長。對於GaAs核心奈米線之n型摻雜,在電池溫度440℃下使用碲(Te),此對應於4×1018cm-3之標稱n型摻雜濃度。經Te摻雜GaAs奈米線在基板溫度580℃下及在8×10-7托之一As通量之情況下而生長。所有其他條件與用於經Be摻雜奈米線相同。 For p-type doping of GaAs core nanowires, beryllium (Be) is used. The Be cell temperature was set to 990 ° C, which gave a nominal p-type doping concentration of 3 x 10 18 cm -3 . Under the conditions mentioned above, the nanowire growth was carried out for a duration of 3 hours, and the growth was stopped by closing all the gates and simultaneously tilting the substrate to room temperature. For the n-type doping of the GaAs core nanowire, germanium (Te) is used at a battery temperature of 440 ° C, which corresponds to a nominal n-type doping concentration of 4 × 10 18 cm -3 . The Te-doped GaAs nanowires were grown at a substrate temperature of 580 ° C and at an As flux of 8 × 10 -7 Torr. All other conditions are the same as for the Be-doped nanowire.
最後,亦生長具有一經Si摻雜GaAs n殼層之經Be摻雜GaAs p核心以及具有一經Be摻雜GaAs p殼層之經Te摻雜GaAs n核心。在生長 經Be摻雜GaAs p核心之後,藉由實施10min之一生長中斷將Ga液滴耗盡至奈米線材料中,其中關閉Ga擋門並將As通量增加至1×10-5托。為生長經Si摻雜n型GaAs殼層,將基板溫度減小至540℃並將As通量增加至1.5×10-5托。當打開擋門時,僅在形成一核心殼層結構之GaAs核心之側面上發生生長。在Si電池溫度1295℃下進行GaAs殼層生長達1小時之一持續時間,此將產生1×1018cm-3之一標稱n型摻雜濃度。在經Te摻雜GaAs核心及經Be摻雜GaAs殼層之情況下,將基板溫度增加至610℃以用於殼層生長且所使用As通量為4×10-6托。 Finally, a Be-doped GaAs p core with a Si-doped GaAs n shell and a Te-doped GaAs n core with a Be-doped GaAs p shell are also grown. After growing the Be-doped GaAs p core, the Ga droplets were depleted into the nanowire material by performing a growth interruption of 10 min, in which the Ga gate was closed and the As flux was increased to 1 × 10 -5 Torr. . To grow the Si-doped n-type GaAs shell layer, the substrate temperature was reduced to 540 ° C and the As flux was increased to 1.5 × 10 -5 Torr. When the shutter is opened, growth occurs only on the side of the GaAs core forming a core shell structure. The GaAs shell growth was carried out at a Si cell temperature of 1295 ° C for a duration of one hour, which would result in a nominal n-type doping concentration of 1 x 10 18 cm -3 . In the case of a Te-doped GaAs core and a Be-doped GaAs shell, the substrate temperature was increased to 610 ° C for shell growth and the As flux used was 4 × 10 -6 Torr.
藉由使用Be作為p摻雜劑及使用Te作為n摻雜劑來生長軸向p-n及n-p接面GaAs核心奈米線。使用與實例1相同之生長條件,生長GaAsp(n)核心達1.5小時之一持續時間。然後,關閉Be(Te)擋門並打開Te(Be)擋門以切換摻雜劑,及持續該生長達1.5小時。 The axial p-n and n-p junction GaAs core nanowires were grown by using Be as the p-dopant and Te as the n-dopant. The GaAsp(n) core was grown for one of the durations of 1.5 hours using the same growth conditions as in Example 1. Then, close the Be(Te) gate and open the Te(Be) gate to switch the dopant and continue the growth for 1.5 hours.
藉由使用原子層沈積(ALD)來沈積經Al摻雜ZnO(AZO)而製成具有一透明觸點之經MBE生長之奈米線之一最終保形蓋。對於ALD,在具有以10sccm之一流動速率之一氬載體氣體之一定製流動型反應器中在50毫托之一壓力及200℃之一溫度下使用三甲基鋁、二乙基鋅及去離子水作為前體。 A final conformal cover of one of the MBE grown nanowires having a transparent contact is formed by depositing Al-doped ZnO (AZO) using atomic layer deposition (ALD). For ALD, use trimethylaluminum, diethylzinc and go in a custom flow type reactor with one of argon carrier gases at a flow rate of 10 sccm at one of 50 mTorr and one temperature of 200 °C. Ionic water acts as a precursor.
使用生長於Cu箔上之石墨層(<5層)。由於石墨層在CVD生長期間形成於Cu箔之兩側上,因此藉由氧電漿來移除形成於一側上之石墨層以曝露用於蝕刻之Cu。然後,將此浸入一稀硝酸鐵(Fe(NO3)3)溶液(<5%)中以完全蝕除Cu。在整夜蝕刻(>8小時)之後,將石墨層漂浮於換成去離子水之蝕刻溶液上。在用去離子水進一步清洗數次之後,將石墨層與去離子水一起轉移至奈米線陣列上。去離子水在不具有任 何N2吹入之一清潔室中自然變乾。 A graphite layer (<5 layers) grown on a Cu foil was used. Since the graphite layer is formed on both sides of the Cu foil during CVD growth, the graphite layer formed on one side is removed by oxygen plasma to expose Cu for etching. Then, this was immersed in a dilute iron nitrate (Fe(NO 3 ) 3 ) solution (<5%) to completely etch Cu. After overnight etching (>8 hours), the graphite layer was floated on an etching solution that was replaced with deionized water. After further washing with deionized water several times, the graphite layer was transferred to the array of nanowires together with deionized water. Deionized water naturally dries out in a clean room without any N 2 blowing.
本發明係關於作為一第一步驟之奈米線在一石墨基板上之磊晶生長。本發明之組合物包括基板及生長於其上之奈米線兩者。 The present invention relates to epitaxial growth of a nanowire as a first step on a graphite substrate. The composition of the present invention comprises both a substrate and a nanowire grown thereon.
具有磊晶生長之一奈米線提供與所形成材料之同質性,此可增強各種端性質,例如,機械性質、光學性質或電性質。 One of the nanowires with epitaxial growth provides homogeneity with the material being formed, which can enhance various end properties, such as mechanical, optical or electrical properties.
磊晶奈米線可自氣態或液態前體而生長。由於基板充當一種子晶體,因此所沈積奈米線可採取與基板之彼等晶格結構及定向相同之一晶格結構及定向。此不同於甚至在單個晶體基板上沈積多晶膜或非晶膜之其他薄膜沈積方法。 The epitaxial nanowire can be grown from a gaseous or liquid precursor. Since the substrate acts as a sub-crystal, the deposited nanowires can take one of the same lattice structures and orientations as the lattice structure and orientation of the substrate. This is different from other thin film deposition methods in which a polycrystalline film or an amorphous film is deposited even on a single crystal substrate.
在本發明中,基板係一石墨基板,更尤其地,其係石墨烯。如本文中所使用,術語石墨烯指代密集地封裝於一蜂巢式(六邊形)晶體晶格中之sp2鍵結碳原子之一平面薄片。此石墨烯基板應含有不多於10層之石墨烯或其衍生物,較佳地不多於5層(其稱作一極少分層之石墨烯)。尤其較佳地,其係石墨烯之一單原子厚平面薄片。 In the present invention, the substrate is a graphite substrate, and more particularly, it is graphene. As used herein, the term graphene refers to a planar sheet of sp 2 bonded carbon atoms densely packed in a honeycomb (hexagonal) crystal lattice. The graphene-based plate should contain no more than 10 layers of graphene or a derivative thereof, preferably no more than 5 layers (referred to as a very little layered graphene). Particularly preferably, it is a monoatomic thick planar sheet of graphene.
結晶或「片」形式之石墨由堆疊在一起之諸多石墨烯薄片(亦即,10個以上薄片)組成。因此,石墨基板意指由一個或複數個石墨烯薄片形成之一基板。 The crystalline or "slice" form of graphite consists of a plurality of graphene sheets (i.e., more than 10 sheets) stacked together. Therefore, a graphite substrate means a substrate formed of one or a plurality of graphene sheets.
較佳地,基板之厚度為20nm或小於20nm。石墨烯薄片堆疊以形成具有0.335nm之一平面間間隔之石墨。較佳之基板包括僅幾個此等層且理想地,其厚度可小於10nm。甚至更佳地,其厚度可為5nm或小於5nm。基板之面積不受限制。此可為多達0.5mm2或更多,例如,多達5mm2或更多,諸如多達10cm2。因此,基板之面積僅受實用性限制。 Preferably, the thickness of the substrate is 20 nm or less. The graphene sheets were stacked to form graphite having an interplanar spacing of 0.335 nm. Preferred substrates include only a few of these layers and desirably, the thickness can be less than 10 nm. Even more preferably, the thickness may be 5 nm or less. The area of the substrate is not limited. This can be up to 0.5 mm 2 or more, for example up to 5 mm 2 or more, such as up to 10 cm 2 . Therefore, the area of the substrate is limited only by practicality.
將清楚,可需要支撐石墨基板以允許在其上生長奈米線。然而,在某些實施例中,例如,其中石墨層形成一串接電池中之一基板及頂部電極觸點兩者,如下文所闡述,可不需要此支撐體。石墨烯薄 片可支撐於包含習用半導體基板及透明玻璃之任何種類之材料上。較佳使用二氧化矽或SiC。支撐體必須係惰性的。直接在沈積於一經氧化矽晶圓上之金屬膜上或直接在金屬箔上生長石墨基板亦係可能的。然後,石墨基板可藉由蝕刻與金屬拆離且易於轉移至任何材料上。 It will be appreciated that it may be desirable to support the graphite substrate to allow growth of the nanowires thereon. However, in some embodiments, for example, where the graphite layer forms both a substrate and a top electrode contact in a series of cells, such a support may not be required as set forth below. Graphene thin The sheet can be supported on any type of material comprising a conventional semiconductor substrate and transparent glass. Preferably, cerium oxide or SiC is used. The support must be inert. It is also possible to deposit a graphite substrate directly on a metal film deposited on a cerium oxide wafer or directly on a metal foil. The graphite substrate can then be detached from the metal by etching and easily transferred to any material.
對於一堆疊中之最底部或底部電池(如本文中稍後所闡述),電池基板不需要係透明的。因此,若金屬箔上之石墨烯用作一基板,則此可直接用作底部電極。因此,在此情形中,石墨烯不需要自金屬箔移除。然而,若一電池不係一堆疊中之底部電池,則基板應係透明的以允許光向下穿透至一堆疊中之下一電池。 For the bottommost or bottom cell in a stack (as explained later herein), the battery substrate need not be transparent. Therefore, if graphene on the metal foil is used as a substrate, this can be directly used as the bottom electrode. Therefore, in this case, graphene does not need to be removed from the metal foil. However, if a battery is not a bottom cell in a stack, the substrate should be transparent to allow light to penetrate down to the next cell in a stack.
在一高度較佳實施例中,所使用之載體材料將係透明的,例如,玻璃。一透明載體材料之使用在太陽能技術領域中係重要的以允許光穿透本發明之太陽能電池。 In a highly preferred embodiment, the carrier material used will be transparent, such as glass. The use of a transparent support material is important in the field of solar technology to allow light to penetrate the solar cell of the present invention.
在一高度較佳實施例中,石墨基板係自一凝析(Kish)石墨剝落之一經層壓基板或係一高定向熱解石墨(HOPG)。另一選擇為,其可係由(例如)Cu、Ni或Pt製成之金屬膜或金屬箔上之一經化學汽相沈積(CVD)生長之石墨烯基板。 In a highly preferred embodiment, the graphite substrate is one of a delaminated (Kish) graphite delaminated substrate or a highly oriented pyrolytic graphite (HOPG). Alternatively, it may be a graphene-based plate grown by chemical vapor deposition (CVD) on a metal film or a metal foil made of, for example, Cu, Ni or Pt.
雖然較佳在未進行修改之情況下使用石墨基板,但可修改石墨基板之表面。舉例而言,其可用氫、氧、NO2或其組合之電漿來處理。基板之氧化可增強奈米線成核。亦可較佳預處理基板(舉例而言)以確保在奈米線生長之前的純度。藉助諸如HF或BOE之一強酸之處理係一選項。可用異丙醇、丙酮或N-甲基-2-吡咯啶酮來沖洗基板以清除表面雜質。 Although it is preferred to use a graphite substrate without modification, the surface of the graphite substrate can be modified. For example, it can be treated with a slurry of hydrogen, oxygen, NO 2, or a combination thereof. Oxidation of the substrate enhances nanowire nucleation. It is also preferred to pretreat the substrate, for example, to ensure purity prior to growth of the nanowire. A treatment with a strong acid such as HF or BOE is an option. The substrate can be rinsed with isopropanol, acetone or N-methyl-2-pyrrolidone to remove surface impurities.
經清潔石墨表面可進一步藉由摻雜來修改。摻雜劑原子或分子可充當用於生長奈米線之一種子。可藉由吸附諸如金屬氯化物(FeCl3、AuCl3或GaCl3)、NO2、HNO3、芳香族分子或氨之有機或無機分子而摻雜石墨基板。因此,可在一摻雜步驟中使用FeCl3、AuCl3或 GaCl3之一溶液。 The cleaned graphite surface can be further modified by doping. A dopant atom or molecule can serve as a seed for growing the nanowire. The graphite substrate can be doped by adsorbing organic or inorganic molecules such as metal chlorides (FeCl 3 , AuCl 3 or GaCl 3 ), NO 2 , HNO 3 , aromatic molecules or ammonia. Therefore, a solution of one of FeCl 3 , AuCl 3 or GaCl 3 can be used in a doping step.
因此,亦設想石墨基板之表面可在其生長期間藉由併入諸如B、N、S或Si之摻雜劑之取代摻雜方法而摻雜。 Therefore, it is also contemplated that the surface of the graphite substrate may be doped during its growth by a doping method of doping a dopant such as B, N, S or Si.
較佳地,石墨基板摻雜有與奈米線相同之摻雜材料。 Preferably, the graphite substrate is doped with the same dopant material as the nanowire.
使用石墨基板(理想地薄石墨基板)在本發明中係高度有利的,此乃因此等石墨基板係薄但極堅固的、輕且撓性的、高度導電且導熱的。該等石墨基板在本文中較佳採用之低厚度處係透明的,其係不滲透且惰性的。 The use of a graphite substrate (ideally a thin graphite substrate) is highly advantageous in the present invention, whereby the graphite substrate is therefore thin but extremely strong, light and flexible, highly conductive and thermally conductive. The graphite substrates are transparent at the low thicknesses preferred for use herein and are impermeable and inert.
為增強石墨基板之導電率,具有高導電率(>103S/cm)之金屬奈米結構(諸如奈米線及奈米粒子)可(特定而言)以其部分互連(例如,一Ag奈米線/石墨烯混合頂部觸點)之此一方式分散於頂部上。 To enhance the conductivity of the graphite substrate, metal nanostructures (such as nanowires and nanoparticles) having a high electrical conductivity (>10 3 S/cm) may (particularly) be partially interconnected (eg, one This way of the Ag nanowire/graphene mixed top contact) is dispersed on the top.
為製備具商業重要性之奈米線,此等奈米線基本上在基板上磊晶生長。亦理想地,生長垂直於基板及因此理想地沿[111](針對立方體晶體結構)或(針對六邊形晶體結構)方向而發生。如上文所述,無法保證其中彼基板材料不同於正生長之奈米線之一特定基板係可能的。然而,本發明人已藉由判定半導體奈米線中之原子與石墨烯薄片中之碳原子之間的一可能晶格匹配而判定石墨基板上之磊晶生長係可能的。 To prepare commercially important nanowires, these nanowires are substantially epitaxially grown on a substrate. Also desirably, the growth occurs perpendicular to the substrate and thus desirably along [111] (for cubic crystal structures) or (for hexagonal crystal structures) directions. As described above, it is not possible to ensure that one of the substrate materials is different from a specific substrate of one of the positively grown nanowires. However, the inventors have determined that epitaxial growth on a graphite substrate is possible by determining a possible lattice match between the atoms in the semiconductor nanowire and the carbon atoms in the graphene sheets.
石墨烯層中之碳-碳鍵長度為約0.142nm。石墨具有六邊形晶體幾何形狀。本發明人已驚人地認識到石墨可提供其上可生長半導體奈米線之一基板,此乃因生長之奈米線材料與石墨基板之間的晶格不匹配可係極低的。 The carbon-carbon bond length in the graphene layer is about 0.142 nm. Graphite has a hexagonal crystal geometry. The inventors have surprisingly recognized that graphite can provide one of the substrates on which semiconductor nanowires can be grown, since the lattice mismatch between the grown nanowire material and the graphite substrate can be extremely low.
發明人已認識到,由於石墨基板之六邊形對稱性及具有一立方體晶體結構的沿[111]方向生長之一奈米線之(111)平面中(或具有一六邊形晶體結構的沿方向生長之一奈米線之(0001)平面中)之半導體原子之六邊形對稱性,因此可在生長之奈米線與基板之間達成一緊密晶格 匹配。 The inventors have recognized that due to the hexagonal symmetry of the graphite substrate and the (111) plane of one of the nanowires grown in the [111] direction with a cubic crystal structure (or an edge having a hexagonal crystal structure) The hexagonal symmetry of the semiconductor atoms in the (0001) plane of one of the nanowires, so that a tight lattice can be achieved between the grown nanowire and the substrate. match.
圖1a至圖1d展示以將不發生晶格不匹配之此一方式放置的石墨烯層中之碳原子之六邊形晶格之頂部上之一奈米線之(111)(或(0001))平面中之半導體原子之四種不同六邊形結構組態。作為石墨烯之頂部上之可能半導體吸附位點,考量1)在石墨烯之六邊形碳環之中心上方(H位點)及2)在碳原子之間的橋上方(B位點),如圖1a中之箭頭所指示。 1a to 1d show (111) (or (0001)) one of the nanowires on the top of a hexagonal lattice of carbon atoms in a graphene layer in which the lattice mismatch does not occur. The configuration of four different hexagonal structures of semiconductor atoms in a plane. As a possible semiconductor adsorption site on the top of graphene, consider 1) above the center of the hexagonal carbon ring of graphene (H site) and 2) above the bridge between carbon atoms (B site), As indicated by the arrows in Figure 1a.
該等圖展示在該等原子放置於1)H位點及B位點(圖1a、圖1b及圖1d)及2)H位點或B位點(圖1c)上時,一立方體晶體之(111)平面(六邊形之(0001)平面)中之半導體原子之一理想化晶格匹配配置。虛線強調(111)平面中之半導體原子之晶格之六邊形對稱性。每一原子配置之此等六邊形之相對旋轉寫於每一圖之頂部上。對於(圖1a)及(圖1d),分別為±10.9°及±16.1°之兩種相對定向係可能的(影像中僅展示+旋轉)。 The figures show a cubic crystal when the atoms are placed at 1) H and B (Fig. 1a, Fig. 1b and Fig. 1d) and 2) H or B (Fig. 1c). An idealized lattice matching configuration of one of the (111) planes (the (0001) plane of the hexagon). The dashed line emphasizes the hexagonal symmetry of the crystal lattice of the semiconductor atoms in the (111) plane. The relative rotation of these hexagons for each atomic configuration is written on top of each figure. For (Fig. 1a) and (Fig. 1d), two relative orientations of ±10.9° and ±16.1°, respectively, are possible (only + rotation is shown in the image).
圖1e展示(a)、(b)、(c)及(d)中之原子配置之人工晶格匹配晶格常數。虛線及實線分別對應於此等晶格之六邊形(a1)及立方體(a=a1×2)晶相。正方形(■)及六邊形分別表示針對Si、ZnO及III-V族半導體之立方體相及六邊形相。具有兩種不同色彩之正方形(GaAs、AlAs、AlSb)指示半導體可選用石墨烯上之兩種原子配置中之任一者。該圖顯現在石墨基板上磊晶生長垂直半導體奈米線之巨大可能性。 Figure 1e shows the artificial lattice matching lattice constants for the atomic configurations in (a), (b), (c), and (d). The dotted line and the solid line correspond to the hexagon (a 1 ) and the cube of the lattices respectively (a=a 1 × 2) Crystal phase. Squares (■) and hexagons represent cubic and hexagonal phases for Si, ZnO, and III-V semiconductors, respectively. Squares with two different colors (GaAs, AlAs, AlSb) indicate that the semiconductor can be selected from either of the two atomic configurations on graphene. This figure shows the great possibility of epitaxial growth of vertical semiconductor nanowires on a graphite substrate.
若半導體原子放置於如在圖1a中之交替H位點及B位點上方,則若一立方體半導體晶體之晶格常數a(晶格常數a定義為立方體單位單元之邊長)等於4.607Å,則可達成一確切晶格匹配。一些立方體半導體存在有接近於此值之晶格常數,其中最接近為SiC(a=4.36Å)、AlN(a=4.40Å)及GaN(a=4.51Å)。對於六邊形半導體晶體,若晶格常數a1等於3.258Å,則將達成確切晶格匹配。一些六邊形半導體存在有接近於此值之晶格常數,其中最接近為SiC(a1=3.07Å)、AlN (a1=3.11Å)、GaN(a1=3.19Å)及ZnO(a1=3.25Å)晶體。 If a semiconductor atom is placed above the alternating H site and B site as in FIG. 1a, if a cubic semiconductor crystal has a lattice constant a (the lattice constant a is defined as the side length of the cubic unit cell) is equal to 4.670 Å, An exact lattice match can be achieved. Some cubic semiconductors have lattice constants close to this value, the closest being SiC (a = 4.36 Å), AlN (a = 4.40 Å), and GaN (a = 4.51 Å). For a hexagonal semiconductor crystal, if the lattice constant a 1 is equal to 3.258 Å, an exact lattice match will be achieved. Some hexagonal semiconductors have lattice constants close to this value, the closest of which is SiC (a 1 =3.07Å), AlN (a 1 =3.11Å), GaN (a 1 =3.19Å), and ZnO(a). 1 = 3.25 Å) crystal.
若半導體原子放置於如在圖1b中之交替H位點及B位點上方,則若一立方體半導體晶體之晶格常數a等於:1.422Å(碳原子距離)×3/2×sqr(6)=5.225Å,則可達成一確切晶格匹配。此接近於Si(a=5.43Å)、GaP(a=5.45Å)、AlP(a=5.45Å)、InN(a=4.98Å)及ZnS(a=5.42Å)之晶格常數。對於六邊形半導體晶體,若晶格常數a1等於:1.422Å×3/2×sqr(3)=3.694Å,則將達成確切晶格匹配。此接近於InN(a1=3.54Å)及ZnS(a1=3.82Å)晶體之六邊形形式之a1晶格常數。 If a semiconductor atom is placed above the alternating H and B sites as in Figure 1b, then if a cubic semiconductor crystal has a lattice constant a equal to: 1.422 Å (carbon atom distance) × 3/2 × sqr (6) =5.225Å, an exact lattice match can be achieved. This is close to the lattice constants of Si (a = 5.43 Å), GaP (a = 5.45 Å), AlP (a = 5.45 Å), InN (a = 4.98 Å), and ZnS (a = 5.42 Å). For a hexagonal semiconductor crystal, if the lattice constant a 1 is equal to: 1.422 Å × 3 / 2 × sqr (3) = 3.694 Å, the exact lattice matching will be achieved. This is close to the a 1 lattice constant of the hexagonal form of InN (a 1 = 3.54 Å) and ZnS (a 1 = 3.82 Å) crystals.
對於如圖1c中之原子組態,若一立方體半導體晶體之晶格常數a等於:1.422Å(碳原子距離)×3×sqr(2)=6.033Å,則可達成一確切晶格匹配。此接近於III-V族化合物(諸如InAs、GaAs、InP、GaSb、AlSb及AlAs)及II-VI族化合物(諸如MgSe、ZnTe、CdSe及ZnSe)半導體晶體之晶格常數。特定而言,此接近於III-V族化合物(諸如InAs(a=6.058Å)、GaSb(a=6.096Å)及AlSb(a=6.136Å))及II-VI族化合物(諸如ZnTe(a=6.103Å)及CdSe(a=6.052Å))半導體晶體之晶格常數。 For the atomic configuration as in Figure 1c, if the lattice constant a of a cubic semiconductor crystal is equal to: 1.422 Å (carbon atom distance) x 3 x sqr(2) = 6.033 Å, an exact lattice match can be achieved. This is close to the lattice constant of the III-V compound (such as InAs, GaAs, InP, GaSb, AlSb, and AlAs) and the II-VI compound (such as MgSe, ZnTe, CdSe, and ZnSe) semiconductor crystals. In particular, this is close to Group III-V compounds (such as InAs (a = 6.058 Å), GaSb (a = 6.096 Å) and AlSb (a = 6.136 Å)) and Group II-VI compounds (such as ZnTe (a = 6.103Å) and CdSe (a=6.052Å)) The lattice constant of the semiconductor crystal.
對於六邊形半導體晶體,若晶格常數a1等於:1.422Å(碳原子距離)×3=4.266Å,則將達成確切晶格匹配。此接近於II-VI材料CdS(a1=4.160Å)及CdSe(a1=4.30Å)晶體之六邊形形式之a1晶格常數。 For a hexagonal semiconductor crystal, if the lattice constant a 1 is equal to: 1.422 Å (carbon atom distance) × 3 = 4.266 Å, an exact lattice match will be achieved. This is close to the a 1 lattice constant of the hexagonal form of the CdS (a 1 = 4.160 Å) and CdSe (a 1 = 4.30 Å) crystals of the II-VI material.
若半導體原子放置於如在圖1d中之交替H位點及B位點上方,則若一立方體半導體晶體之晶格常數a等於6.28Å,則可達成一確切晶格匹配。此接近於InSb(a=6.479Å)、MgTe(a=6.42Å)及CdTe(a=6.48Å)之晶格常數。對於六邊形半導體晶體,若晶格常數a1等於4.44Å,則將達成確切晶格匹配。此接近於InSb(a1=4.58Å)、MgTe(a1=4.54Å)及CdTe(a1=4.58Å)晶體之六邊形形式之a1晶格常數。 If a semiconductor atom is placed above the alternating H and B sites as in Figure 1d, an exact lattice match can be achieved if the lattice constant a of a cubic semiconductor crystal is equal to 6.28 Å. This is close to the lattice constant of InSb (a = 6.479 Å), MgTe (a = 6.42 Å), and CdTe (a = 6.48 Å). For a hexagonal semiconductor crystal, if the lattice constant a 1 is equal to 4.44 Å, an exact lattice match will be achieved. This is close to the a 1 lattice constant of the hexagonal form of InSb (a 1 = 4.58 Å), MgTe (a 1 = 4.54 Å), and CdTe (a 1 = 4.58 Å) crystals.
在不希望受理論限制之情況下,由於石墨層中之碳原子之六邊形對稱性,及分別沿[111]及晶體方向(用於大部分奈米線生長之一較佳方向)之立方體或六邊形半導體之原子之六邊形對稱性,因此在半導體原子理想地以一六邊形圖案放置於石墨基板之碳原子上方時,可達成石墨基板與半導體之間的一緊密晶格匹配。此係一新且驚人發現且可使得能夠在石墨基板上磊晶生長奈米線。 Without wishing to be bound by theory, due to the hexagonal symmetry of the carbon atoms in the graphite layer, and the cubes along the [111] and crystal directions (for the preferred direction of most of the nanowire growth) Or the hexagonal symmetry of the atoms of the hexagonal semiconductor, so that when the semiconductor atoms are ideally placed in a hexagonal pattern over the carbon atoms of the graphite substrate, a tight lattice matching between the graphite substrate and the semiconductor can be achieved. . This is a new and surprising discovery and can enable epitaxial growth of nanowires on graphite substrates.
如上文所闡述之半導體原子之四種不同六邊形配置可使得此等材料之半導體奈米線能夠垂直生長以在一薄基於碳之石墨材料之頂部上形成獨立奈米線。 The four different hexagonal configurations of the semiconductor atoms as set forth above allow the semiconductor nanowires of such materials to grow vertically to form individual nanowires on top of a thin carbon-based graphite material.
舉例而言,雖然理想地在一生長之奈米線與基板之間不存在晶格不匹配,但奈米線可容納比薄膜多得多之晶格不匹配。本發明之奈米線可具有與基板多達約10%之一晶格不匹配,且磊晶生長仍係可能的。理想地,晶格不匹配應為7.5%或小於7.5%,例如,5%或小於5%。 For example, although it is desirable to have no lattice mismatch between a grown nanowire and a substrate, the nanowire can accommodate much more lattice mismatch than the thin film. The nanowires of the present invention can have a lattice mismatch of up to about 10% of the substrate, and epitaxial growth is still possible. Ideally, the lattice mismatch should be 7.5% or less than 7.5%, for example, 5% or less than 5%.
對於像立方體InAs(a=6.058Å)、立方體GaSb(a=6.093Å)、立方體CdSe(a=6.052Å)、六邊形CdSe(a1=4.30Å)及六邊形ZnO(a1=3.25Å)之某些半導體,晶格不匹配如此小(<~1%)以致可預期此等半導體之優良生長。 For cubes like InAs (a=6.058Å), cube GaSb (a=6.093Å), cubic CdSe (a=6.052Å), hexagonal CdSe (a 1 =4.30Å) and hexagonal ZnO (a 1 =3.25 Some semiconductors of Å) have a lattice mismatch that is so small (<~1%) that excellent growth of such semiconductors can be expected.
對於像GaAs(a=5.653Å)之某些半導體,當半導體原子放置於與在圖1c(a=6.033Å且因此GaAs之晶格常數小6.3%)中相同之位點或如在圖1b(a=5.255Å且因此GaAs之晶格常數大8.2%)中之交替H位點及B位點上(兩種配置皆係可能的)時,晶格不匹配相當小。本發明之方法可使得上文所提及材料之半導體奈米線能夠垂直生長以在一薄基於碳之石墨材料之頂部上形成獨立奈米線。 For some semiconductors like GaAs (a = 5.653 Å), the semiconductor atoms are placed at the same location as in Figure 1c (a = 6.033 Å and therefore the lattice constant of GaAs is 6.3%) or as in Figure 1b ( The lattice mismatch is quite small when the alternating H and B sites in the a = 5.255 Å and therefore the GFP lattice constant is 8.2%) (both configurations are possible). The method of the present invention enables the semiconductor nanowires of the materials mentioned above to be grown vertically to form individual nanowires on top of a thin carbon-based graphite material.
本發明中所生長之奈米線之長度可自250nm至數微米,例如,多達8微米或多達6微米。較佳地,奈米線之長度為至少1微米。在生 長複數個奈米線之情況下,較佳地,其全部滿足此等尺寸要求。理想地,生長於一基板上之至少90%之奈米線之長度將為至少1微米。較佳地,實質上所有奈米線之長度將為至少1微米。 The length of the nanowires grown in the present invention can range from 250 nm to several microns, for example, up to 8 microns or up to 6 microns. Preferably, the length of the nanowire is at least 1 micron. Alive In the case of a plurality of nanowires, preferably, all of them satisfy these dimensional requirements. Ideally, at least 90% of the nanowires grown on a substrate will have a length of at least 1 micron. Preferably, substantially all of the nanowires will have a length of at least 1 micron.
此外,將較佳地,所生長之奈米線具有相同尺寸,例如,在彼此之10%內。因此,一基板上之至少90%(較佳地實質上全部)之奈米線將較佳地具有相同直徑及/或相同長度(亦即,在彼此之直徑/長度之10%內)。因此,基本上,熟習此項技術者正尋找同質性及就尺寸而言實質上相同之奈米線。 Furthermore, it will be preferred that the grown nanowires have the same size, for example within 10% of each other. Thus, at least 90% (preferably substantially all) of the nanowires on a substrate will preferably have the same diameter and/or the same length (i.e., within 10% of the diameter/length of each other). Therefore, basically, those skilled in the art are looking for nanowires of homogeneity and substantially the same in terms of size.
奈米線之長度通常受生長程序運行之時間之長度控制。一較長程序通常導致一(長得多)較長奈米線。 The length of the nanowire is usually controlled by the length of time the growth program is run. A longer procedure usually results in a (longer) longer nanowire.
奈米線通常具有一六邊形剖面形狀。該奈米線可具有25nm至700nm(諸如25nm至600nm,尤其25nm至500nm)之一剖面直徑(亦即,其厚度)。如上文所述,貫穿大部分奈米線,該直徑理想地係恆定的。奈米線直徑可受用於製成如下文進一步所闡述之奈米線之原子之比率之操縱控制。 The nanowires usually have a hexagonal cross-sectional shape. The nanowire may have a cross-sectional diameter (ie, its thickness) of 25 nm to 700 nm (such as 25 nm to 600 nm, especially 25 nm to 500 nm). As described above, the diameter is ideally constant throughout most of the nanowires. The diameter of the nanowires can be manipulated to produce a ratio of atoms of the nanowires as further explained below.
此外,奈米線之長度及直徑可受形成其之溫度影響。較高溫度促成高縱橫比(亦即,較長及/或較薄奈米線)。熟習此項技術者能夠操縱生長程序以設計所期望尺寸之奈米線。 In addition, the length and diameter of the nanowires can be affected by the temperature at which they are formed. Higher temperatures contribute to high aspect ratios (i.e., longer and/or thinner nanowires). Those skilled in the art will be able to manipulate the growth program to design a nanowire of the desired size.
本發明之奈米線由至少一種III-V化合物、至少一種II-VI化合物形成,或其可係自選自Si、Ge、Sn或Pb(尤其Si及Ge)之至少一種IV族元素生長之奈米線。因此,設想純IV族奈米線或奈米線(諸如SiC及SiGe)之形成。 The nanowire of the present invention is formed of at least one III-V compound, at least one II-VI compound, or it may be derived from at least one Group IV element selected from Si, Ge, Sn or Pb (especially Si and Ge). Rice noodles. Therefore, the formation of a pure Group IV nanowire or a nanowire such as SiC and SiGe is contemplated.
II族元素為Be、Mg、Ca、Zn、Cd及Hg。此處,較佳選項為Zn及Cd。 Group II elements are Be, Mg, Ca, Zn, Cd and Hg. Preferred options here are Zn and Cd.
III族選項為B、Al、Ga、In及Tl。此處,較佳選項為Ga、Al及In。 Group III options are B, Al, Ga, In, and Tl. Here, preferred options are Ga, Al, and In.
V族選項為N、P、As、Sb。所有選項皆係較佳的。 The V family options are N, P, As, Sb. All options are preferred.
VI族選項包含O、S、Se及Te。較佳使用Se及Te。 The VI family options include O, S, Se, and Te. Se and Te are preferably used.
較佳製造一III-V族化合物。將瞭解,在奈米線生長期間形成之任何化合物不需要係完全理想配比的,此乃因存在摻雜之可能性,如下文所論述。 It is preferred to produce a Group III-V compound. It will be appreciated that any compound formed during the growth of the nanowire does not need to be completely stoichiometric due to the possibility of doping, as discussed below.
用於奈米線製造之較佳化合物包含InAs、GaAs、InP、GaSb、InSb、GaP、ZnTe、SiC、CdSe及ZnSe。高度較佳地使用GaAs或InAs。其它選項包含Si、ZnO、GaN、AlN及InN。 Preferred compounds for the manufacture of nanowires include InAs, GaAs, InP, GaSb, InSb, GaP, ZnTe, SiC, CdSe, and ZnSe. GaAs or InAs are preferably used highly. Other options include Si, ZnO, GaN, AlN, and InN.
雖然較佳使用二元材料,但沒有理由藉由本發明之方法無法生長三元或四元奈米線等。只要所討論之化合物之晶格匹配基板(尤其石墨烯)之晶格,便可預期磊晶生長。因此,其中存在兩個III族陽離子與一V族陰離子之三元系統在此處係一選項,諸如InGaAs及AlGaAs。因此,三元化合物可具有化學式XYZ,其中X係一III族元素,Y係不同於X及Z之一III或V族元素,及Z係一V族元素。XYZ中之X與Y或Y與Z莫耳比較佳為0.2至0.8,亦即,化學式較佳為XxY1-xZ(或XY1-xZx),其中下標x為0.2至0.8。四元系統可由化學式AxB1-xCyD1-y表示,其中A及B係III族元素且C及D係V族元素。再次,下標x及y通常為0.2至0.8。熟習此項技術者將清楚其他選項。 Although a binary material is preferably used, there is no reason why it is impossible to grow a ternary or quaternary nanowire or the like by the method of the present invention. Epitaxial growth can be expected as long as the crystal lattice of the compound in question matches the crystal lattice of the substrate, especially graphene. Thus, a ternary system in which two Group III cations and a Group V anion are present is an option here, such as InGaAs and AlGaAs. Thus, the ternary compound may have the chemical formula XYZ, wherein X is a Group III element, Y is different from X and Z one of Group III or V elements, and Z is a Group V element. X and Y or Y and Z mole in XYZ are preferably from 0.2 to 0.8, that is, the chemical formula is preferably X x Y 1-x Z (or XY 1-x Z x ), wherein the subscript x is 0.2 to 0.8. The quaternary system can be represented by the chemical formula A x B 1-x C y D 1-y , where A and B are Group III elements and C and D are Group V elements. Again, the subscripts x and y are typically between 0.2 and 0.8. Those skilled in the art will be aware of other options.
欲摻雜之奈米線在本發明之範疇內。摻雜通常涉及將雜質離子引入至奈米線中。此等雜質離子可以多達1019/cm3(較佳多達1018/cm3)之一位準引入。如所期望,奈米線可係經p摻雜的或經n摻雜的,但如下文所述,可能存在一未經摻雜層。經摻雜半導體係不純導體,而未經摻雜半導體係純質的。 The nanowire to be doped is within the scope of the present invention. Doping generally involves introducing impurity ions into the nanowires. These impurity ions can be introduced at one of up to 10 19 /cm 3 (preferably up to 10 18 /cm 3 ). As desired, the nanowires can be p-doped or n-doped, but as described below, there may be an undoped layer. The doped semiconductor is an impure conductor and the undoped semiconductor is pure.
具有比電洞濃度大之一電子濃度之不純半導體稱為n型半導體。在n型半導體中,電子係多數載流子且電洞係少數載流子。N型半導體藉由用施體雜質來摻雜一純質半導體而形成。用於III-V化合物之適 合施體可為(例如)Si及Te。 An impure semiconductor having an electron concentration greater than the concentration of the hole is referred to as an n-type semiconductor. In an n-type semiconductor, electrons are majority carriers and holes are minority carriers. The N-type semiconductor is formed by doping a pure semiconductor with a donor impurity. Suitable for III-V compounds The combined body can be, for example, Si and Te.
p型半導體具有比電子濃度大之一電洞濃度。片語「p型」指代電洞之正電荷。在p型半導體中,電洞係多數載流子且電子係少數載流子。P型半導體藉由用受體雜質摻雜一純質半導體而形成。用於III-V化合物之適合受體可為(例如)Be及Zn。將瞭解,在某些情形中,一雜質將充當一III-V化合物中之一施體還是受體將取決於生長表面之定向及生長條件。摻雜劑可在生長程序期間或在其形成之後藉由奈米線之離子植入而引入。 The p-type semiconductor has a hole concentration greater than the electron concentration. The phrase "p-type" refers to the positive charge of a hole. In a p-type semiconductor, a hole is a majority carrier and an electron is a minority carrier. A P-type semiconductor is formed by doping a pure semiconductor with a acceptor impurity. Suitable acceptors for the III-V compound can be, for example, Be and Zn. It will be appreciated that in some cases, whether an impurity will act as one of the III-V compounds or the acceptor will depend on the orientation of the growth surface and the growth conditions. The dopant can be introduced by ion implantation of the nanowire during or after the growth process.
用於IV族奈米線之適合施體可為(例如)P及As。用於IV族之適合受體可為(例如)B及Al。用於II-VI化合物之適合施體通常易於發現且可為(例如)Al及Ga。適合受體對於諸多II-VI化合物可較難以發現但可為(例如)Li及Mg。 Suitable donors for the Group IV nanowires can be, for example, P and As. Suitable acceptors for Group IV can be, for example, B and Al. Suitable donors for the II-VI compound are generally readily detectable and can be, for example, Al and Ga. Suitable receptors are more difficult to find for many II-VI compounds but can be, for example, Li and Mg.
本發明之奈米線磊晶生長。其透過共價鍵、離子鍵或準凡得瓦結合附著至下伏石墨基板。因此,在基板與奈米線之基底之接面處,晶體平面磊晶形成於奈米線內。此等晶體平面沿相同晶體方向一個在另一個上地進行構建,從而允許奈米線之磊晶生長。較佳地,奈米線垂直生長。此處,術語垂直地用於暗示奈米線垂直於石墨支撐體生長。將瞭解,在實驗科學中,生長角度可不係確切地90°,而是術語垂直地暗示奈米線在垂直(vertical/perpendicular)之約10°內,例如,5°內。 The nanowire of the present invention is epitaxially grown. It is attached to the underlying graphite substrate by a covalent bond, an ionic bond or a quasi-vana combination. Therefore, at the junction of the substrate and the substrate of the nanowire, crystal plane epitaxy is formed in the nanowire. These crystal planes are constructed one above the other in the same crystal direction, allowing epitaxial growth of the nanowires. Preferably, the nanowires grow vertically. Here, the term is used vertically to imply that the nanowires are grown perpendicular to the graphite support. It will be appreciated that in experimental science, the angle of growth may not be exactly 90°, but rather the term vertically implies that the nanowire is within about 10° of vertical/perpendicular, for example, within 5°.
將瞭解,基板較佳包括複數個奈米線。較佳地,奈米線約彼此平行地生長。因此,較佳地,至少90%(例如,至少95%,較佳地實質上所有)奈米線自基板之相同平面沿相同方向生長。 It will be appreciated that the substrate preferably includes a plurality of nanowires. Preferably, the nanowires grow about parallel to each other. Thus, preferably, at least 90% (e.g., at least 95%, preferably substantially all) of the nanowires are grown in the same direction from the same plane of the substrate.
將瞭解,在其中可發生磊晶生長之一基板內存在諸多平面。較佳地,實質上所有奈米線生長於相同平面中以使得其係平行的。更佳地,彼平面垂直於基板。 It will be appreciated that there are many planes in one of the substrates in which epitaxial growth can occur. Preferably, substantially all of the nanowires are grown in the same plane such that they are parallel. More preferably, the plane is perpendicular to the substrate.
本發明之奈米線應較佳地針對具有立方體晶體結構之奈米線沿[111]方向生長及針對具有六邊形晶體結構之奈米線沿方向生長。若生長之奈米線之晶體結構係立方體的,則此亦表示其中發生軸向生長的立方體奈米線與催化劑液滴之間的(111)界面。若奈米線具有一六邊形晶體結構,則奈米線與催化劑液滴之間的(0001)界面表示其中發生軸向生長之平面。平面(111)及(0001)兩者皆表示奈米線之相同(六邊形)平面,該平面之命名僅取決於生長之奈米線之晶體結構而變化。 The nanowire of the present invention should preferably be grown in the [111] direction for a nanowire having a cubic crystal structure and in the direction of a nanowire having a hexagonal crystal structure. If the crystal structure of the grown nanowire is cubic, this also indicates the (111) interface between the cubic nanowire in which axial growth occurs and the catalyst droplet. If the nanowire has a hexagonal crystal structure, the (0001) interface between the nanowire and the catalyst droplet represents a plane in which axial growth occurs. Both planes (111) and (0001) represent the same (hexagonal) plane of the nanowire, and the nomenclature of this plane depends only on the crystal structure of the grown nanowire.
奈米線較佳地藉由分子束磊晶(MBE)而生長。雖然欲使用之汽相沈積在本發明之範疇內,例如,一CVD,尤其一有機金屬CVD(MOCVD)或有機金屬氣相磊晶(MOVPE)方法,但高度較佳地使用MBE。在此方法中,基板具備每一反應物之一分子束,例如,較佳地同時供應之一III族元素及一V族元素。可藉助藉由使用遷移增強型磊晶(MEE)或原子層MBE(ALMBE)之MBE技術來達成對奈米線在石墨基板上之成核及生長之一較高程度之控制,其中可替代地供應(例如)III及V族元素。 The nanowires are preferably grown by molecular beam epitaxy (MBE). Although vapor phase deposition to be used is within the scope of the present invention, for example, a CVD, especially an organometallic CVD (MOCVD) or organometallic vapor phase epitaxy (MOVPE) process, MBE is highly preferred. In this method, the substrate is provided with a molecular beam of one of each reactant, for example, preferably one of a group III element and a group V element are simultaneously supplied. Control of a higher degree of nucleation and growth of the nanowire on the graphite substrate can be achieved by means of MBE technology using migration enhanced epitaxy (MEE) or atomic layer MBE (ALMBE), alternatively Supply, for example, Group III and V elements.
一較佳技術係固態源MBE,其中在單獨瀉流單元中加熱極純元素(諸如鎵及砷),直至其開始緩慢地蒸發(例如,鎵)或昇華(例如,砷)。然後,氣態元素凝結於基板上,其中氣態元素可彼此反應。在鎵及砷之實例中,形成單晶GaAs。術語「束」之使用暗示所蒸發原子(例如,鎵)或分子(例如,As4或As2)在其到達基板上之前彼此不相互作用或不與真空室氣體相互作用。 A preferred technique is a solid state source MBE in which very pure elements, such as gallium and arsenic, are heated in a separate effusion cell until they begin to slowly evaporate (eg, gallium) or sublimate (eg, arsenic). The gaseous element then condenses on the substrate, wherein the gaseous elements can react with each other. In the examples of gallium and arsenic, single crystal GaAs is formed. The use of the term "bundle" implies that the vaporized atoms (eg, gallium) or molecules (eg, As 4 or As 2 ) do not interact with each other or interact with the vacuum chamber gases before they reach the substrate.
亦可易於使用MBE而引入摻雜離子。圖2係一MBE機器之一可能設置。 It is also easy to introduce doping ions using MBE. Figure 2 is a possible setup of one of the MBE machines.
MBE發生於具有通常約10-10托至10-9托之一背景壓力之超高真空中。奈米結構通常(諸如)以多達幾μm/小時(諸如約10μm/小時)之一速 度緩慢生長。此允許奈米線磊晶生長並使結構效能最大化。 MBE occurs in an ultra-high vacuum having a background pressure of typically from about 10-10 Torr to 10 -9 Torr. The nanostructures are typically grown slowly, such as at a rate of up to a few μm/hour, such as about 10 μm/hour. This allows epitaxial growth of the nanowires and maximizes structural efficiency.
在存在或在不存在一催化劑之情況下欲生長之奈米線在本發明之範疇內。因此,無催化劑生長之奈米線係本發明之一實施例。 Nanowires to be grown in the presence or absence of a catalyst are within the scope of the invention. Thus, a nanowire without catalyst growth is an embodiment of the invention.
較佳地,在生長程序中使用一催化劑。催化劑可係構成奈米線之元素中之一者-所謂的自催化,或不同於構成奈米線之元素中之任一者。 Preferably, a catalyst is used in the growth procedure. The catalyst may be one of the elements constituting the nanowire - so-called autocatalysis, or any of the elements constituting the nanowire.
對於催化劑輔助之生長,催化劑可為Au或Ag,或者催化劑可係來自奈米線生長中所使用之族之一金屬(例如,II或III族金屬),尤其構成實際奈米線之金屬元素中之一者(自催化)。因此,使用III族之另一元素作為一催化劑以用於生長一III-V奈米線係可能的,例如,使用Ga作為一催化劑以用於一In(V族)奈米線等等。較佳地,催化劑為Au,或生長係自催化的(亦即,Ga用於一Ga(V族)奈米線等等)。該催化劑可沈積於石墨基板上以充當用於生長奈米線之一成核位點。理想地,此可藉由提供形成於基板表面上方之催化材料之一薄膜而達成。當熔化催化劑膜(通常形成具有半導體奈米線成份中之一或多者之一共晶合金)時,其在基板上形成液滴且此等液滴形成其中可生長奈米線之點。此稱作蒸氣-液體-固體生長(VLS),此乃因催化劑係液體,分子束係蒸氣及奈米線提供固體組分。在某些情形中,藉由一所謂的蒸氣-固體-固體生長(VSS)機制,催化劑粒子在奈米線生長期間亦可為固體。當奈米線生長(藉由VLS方法)時,液體(例如,金)液滴保持在奈米線之頂部上。此繪示於各圖中。 For catalyst-assisted growth, the catalyst may be Au or Ag, or the catalyst may be from one of the metals used in the growth of the nanowire (eg, Group II or III metals), especially among the metal elements of the actual nanowire. One of them (self-catalytic). Therefore, it is possible to use another element of the group III as a catalyst for growing a III-V nanowire, for example, using Ga as a catalyst for an In (V group) nanowire or the like. Preferably, the catalyst is Au, or the growth system is autocatalytic (i.e., Ga is used for a Ga (V group) nanowire, etc.). The catalyst can be deposited on a graphite substrate to serve as a nucleation site for growing the nanowires. Ideally, this can be achieved by providing a film of one of the catalytic materials formed over the surface of the substrate. When the catalyst film is melted (generally forming a eutectic alloy having one or more of the semiconductor nanowire components), it forms droplets on the substrate and the droplets form a point where the nanowires can be grown. This is referred to as vapor-liquid-solid growth (VLS) because the catalyst system liquid, molecular beam vapor and nanowire provide a solid component. In some cases, the catalyst particles may also be solid during the growth of the nanowires by a so-called vapor-solid-solid growth (VSS) mechanism. When the nanowires are grown (by the VLS method), liquid (eg, gold) droplets remain on top of the nanowire. This is shown in the figures.
如上文所述,製備自催化之奈米線亦係可能的。自催化意指奈米線之組分中之一者充當用於其生長之一催化劑。 As described above, it is also possible to prepare autocatalytic nanowires. Autocatalytic means one of the components of the nanowire acts as a catalyst for its growth.
舉例而言,一Ga層可施加至基板、經熔化以形成充當用於生長含Ga之奈米線之成核位點之液滴。再次,一Ga金屬部分可最終定位於奈米線之頂部上。可使用II族或III族金屬作為催化劑以用於含有該 催化劑作為一組分之奈米線來實現一類似程序。 For example, a Ga layer can be applied to the substrate, melted to form droplets that serve as nucleation sites for growing Ga-containing nanowires. Again, a Ga metal portion can be finally positioned on top of the nanowire. Group II or Group III metals can be used as catalysts for containing the The catalyst is used as a component of the nanowire to achieve a similar procedure.
更詳細地,可在一段時間內將一Ga/In通量供應至基板表面以在加熱基板後旋即起始表面上之Ga/In液滴之形成。然後,可將基板溫度設定為適於生長所討論之奈米線之一溫度。生長溫度可介於300℃至700℃之範圍內。然而,所採用之溫度僅限於奈米線中之材料及催化劑材料之本質。對於GaAs,一較佳溫度為590℃至630℃,例如,610℃。對於InAs,範圍較低,舉例而言,430℃至540℃,諸如450℃。 In more detail, a Ga/In flux can be supplied to the surface of the substrate over a period of time to form the Ga/In droplets on the starting surface immediately after heating the substrate. The substrate temperature can then be set to a temperature suitable for growing one of the nanowires in question. The growth temperature can range from 300 °C to 700 °C. However, the temperatures employed are limited to the nature of the materials and catalyst materials in the nanowire. For GaAs, a preferred temperature is from 590 ° C to 630 ° C, for example, 610 ° C. For InAs, the range is lower, for example, 430 ° C to 540 ° C, such as 450 ° C.
一旦已沈積及熔化一催化劑膜,便可藉由同時打開Ga/In瀉流單元之擋門及離子瀉流單元之計數器而起始奈米線生長。 Once a catalyst film has been deposited and melted, the nanowire growth can be initiated by simultaneously opening the gate of the Ga/In effusion cell and the counter of the ion effusion cell.
瀉流單元之溫度可用於控制生長速率。在習用平面(逐層)生長期間所量測之適宜生長速率為0.05μm/小時至2μm/小時,例如,0.1μm/小時。 The temperature of the effusion unit can be used to control the growth rate. A suitable growth rate measured during conventional planar (layer by layer) growth is from 0.05 μm/hr to 2 μm/hr, for example, 0.1 μm/hr.
分子束之壓力亦可取決於正生長之奈米線之本質而調整。束等效壓力之適合位準介於1×10-7托與1×10-5托之間。 The pressure of the molecular beam can also be adjusted depending on the nature of the nanowire being grown. The suitable level of the beam equivalent pressure is between 1 x 10 -7 Torr and 1 x 10 -5 Torr.
已驚人地發現,使用MBE往往致使GaAs奈米線在一GaAs基板之(111)B平面上垂直地生長。 It has been surprisingly found that the use of MBE tends to cause the GaAs nanowires to grow vertically on the (111) B plane of a GaAs substrate.
可變化反應物(例如,III族原子與V族分子)之間的束通量比,較佳通量比取決於其他生長參數及正生長之奈米線之本質。 The beam flux ratio between the variable reactants (e.g., Group III atoms and Group V molecules), the preferred flux ratio depends on other growth parameters and the nature of the positively growing nanowire.
已發現,反應物之間的束通量比可影響奈米線之晶體結構。舉例而言,使用Au作為一催化劑,在540℃之一生長溫度下生長GaAs奈米線,一Ga通量等於0.6μm/小時之一平面(逐層)生長速率,及As4之9×10-6托之一束等效壓力(BEP)產生纖維鋅礦晶體結構。與此相反,在相同生長溫度下生長GaAs奈米線,但其中一Ga通量等於0.9μm/小時之一平面生長速率,且As4之4×10-6托之一BEP產生閃鋅礦晶體結構。 It has been found that the beam flux ratio between the reactants can affect the crystal structure of the nanowire. For example, using Au as a catalyst, a GaAs nanowire is grown at a growth temperature of 540 ° C, a Ga flux equal to a plane (layer by layer) growth rate of 0.6 μm / hour, and 9 × 10 of As 4 A bundle of equivalent pressure (BEP) of -6 Torr produces a wurtzite crystal structure. In contrast, GaAs nanowires were grown at the same growth temperature, but one of the Ga fluxes was equal to a plane growth rate of 0.9 μm/hr, and 4 of 10 Å to 6 Å of As 4 produced sphalerite crystals. structure.
在某些情形中,奈米線直徑可藉由改變生長參數而變化。舉例而言,當在其中藉由As4通量來判定軸向奈米線生長速率之條件下生長自催化之GaAs奈米線時,可藉由增加/減小Ga:As4通量比而增加/減小奈米線直徑。因此,熟習此項技術者能夠以若干方式操縱奈米線。 In some cases, the diameter of the nanowire can be varied by changing the growth parameters. For example, when an autocatalytic GaAs nanowire is grown under the condition that the axial nanowire growth rate is determined by the As 4 flux, the Ga:As 4 flux ratio can be increased/decreased. Increase/decrease the diameter of the nanowire. Thus, those skilled in the art are able to manipulate the nanowires in a number of ways.
因此,本發明之一實施例採用一多步驟,諸如兩個步驟、生長程序,例如,以分別使奈米線成核及奈米線生長最佳化。 Thus, one embodiment of the present invention employs a multi-step process, such as two steps, a growth procedure, for example, to optimize nanowire nucleation and nanowire growth, respectively.
MBE之一顯著益處係可(舉例而言)藉由使用反射高能量電子繞射(RHEED)而在原位分析生長之奈米線。RHEED係通常用於表徵結晶材料之表面之一技術。在奈米線藉由其他技術(諸如MOVPE)而形成之情況下,無法如此容易地應用此技術。 One of the significant benefits of MBE is that the grown nanowires can be analyzed in situ, for example, by using reflected high energy electron diffraction (RHEED). RHEED is a technique commonly used to characterize the surface of crystalline materials. In the case where the nanowire is formed by other techniques such as MOVPE, this technique cannot be applied so easily.
上文所闡述之技術之一個限制係在基板之表面上存在對生長奈米線之處之有限控制。奈米線將生長於形成一催化劑液滴之處,但存在對可形成彼等液滴之處之極小控制。一進一步問題係無法易於控制液滴之大小。若形成太小而不能起始一奈米線之成核之液滴,則奈米線之良率可較低。此在使用金催化時係一特定問題,此乃因由金形成之液滴可太小而不能允許高產生奈米線生長。 One limitation of the techniques set forth above is the limited control of where the nanowires are present on the surface of the substrate. The nanowires will grow where a catalyst droplet is formed, but there is minimal control over where droplets can be formed. A further problem is that it is not easy to control the size of the droplets. If the formation is too small to initiate the nucleation of a nanowire, the yield of the nanowire can be lower. This is a particular problem when using gold catalysis because the droplets formed from gold can be too small to allow high nanowire growth.
為製備奈米線之一較規律陣列,發明人設想在基板上使用一遮罩。此遮罩可具備規律孔,其中奈米線可貫穿表面同質地生長。使用習用光/電子束微影或奈米壓印可易於製作遮罩中之孔圖案。亦可使用經聚焦離子束技術以在用於奈米線生長之石墨表面上形成成核位點之一規律陣列。 To prepare a more regular array of nanowires, the inventors envisioned using a mask on the substrate. The mask can have regular holes in which the nanowires can grow homogenously across the surface. Hole patterns in the mask can be easily fabricated using conventional light/electron beam lithography or nanoimprinting. A focused ion beam technique can also be used to form a regular array of nucleation sites on the surface of the graphite used for nanowire growth.
因此,一遮罩可施加至基板且經蝕刻有(視情況)以一規律圖案之曝露石墨基板表面之孔。此外,可仔細控制孔之大小。然後,可將催化劑引入至彼等孔中以提供用於奈米線生長之成核位點。藉由規律地配置孔,可生長奈米線之一規律圖案。 Thus, a mask can be applied to the substrate and etched (as appropriate) with a pattern of exposed holes in the surface of the graphite substrate. In addition, the size of the holes can be carefully controlled. Catalysts can then be introduced into their pores to provide nucleation sites for nanowire growth. By regularly arranging the holes, a regular pattern of the nanowires can be grown.
此外,可控制孔之大小以確保在每一孔中可生長僅一個奈米 線。最後,孔可製成有其中形成於孔內之催化劑之液滴足夠大以允許奈米線生長之一大小。以此方式,可甚至使用Au催化來生長奈米線之一規律陣列。 In addition, the size of the holes can be controlled to ensure that only one nanometer can be grown in each well line. Finally, the pores can be made with a droplet in which the catalyst formed in the pores is large enough to allow for the growth of the nanowires. In this way, Au catalysis can be used to grow a regular array of nanowires.
遮罩材料可係在沈積時不顯著損壞下伏石墨層之任何材料。此實施例中所使用之孔可稍微大於奈米線直徑,例如,多達200nm。最小孔大小可為50nm,較佳地,至少100nm至200nm。 The mask material can be any material that does not significantly damage the underlying graphite layer during deposition. The pores used in this embodiment may be slightly larger than the diameter of the nanowire, for example, up to 200 nm. The minimum pore size may be 50 nm, preferably at least 100 nm to 200 nm.
遮罩自身可由一惰性化合物(諸如二氧化矽或氮化矽)製成。其可藉由任何適宜技術(諸如藉由電子束沈積、CVD、電漿增強型CVD及濺鍍)提供於基板表面上。遮罩自身之厚度可小於50nm。 The mask itself may be made of an inert compound such as hafnium oxide or tantalum nitride. It can be provided on the surface of the substrate by any suitable technique, such as by electron beam deposition, CVD, plasma enhanced CVD, and sputtering. The thickness of the mask itself can be less than 50 nm.
在一高度較佳實施例中,遮罩亦在石墨基板與下文所論述之外部塗層之間提供一絕緣層。 In a highly preferred embodiment, the mask also provides an insulating layer between the graphite substrate and the outer coating discussed below.
為在一石墨基板上製備經定位Au催化之奈米線,可在於遮罩中蝕刻孔圖案之後沈積(諸如)具有小於50nm之一厚度之一薄Au層。該沈積可藉助頂部上之一光阻劑或電子束阻劑而做出。藉由移除光阻劑或電子束阻劑,即一所謂的「剝離」程序,可製作石墨基板表面上之Au點之一規律陣列化圖案。視情況,在製作之後可部分或完全移除遮罩。 To prepare a positioned Au catalyzed nanowire on a graphite substrate, a thin Au layer having a thickness of less than 50 nm can be deposited, for example, after etching the hole pattern in the mask. This deposition can be made by means of a photoresist or electron beam resist on the top. A regularly patterned pattern of Au dots on the surface of the graphite substrate can be made by removing the photoresist or electron beam resist, a so-called "peeling" procedure. The mask may be partially or completely removed after fabrication, as appropriate.
雖然在本發明中較佳採用催化劑輔助之生長技術,但設想,奈米線可在不存在催化劑之情況下生長於石墨基板上。此結合一遮罩可係尤其可能的。 Although catalyst-assisted growth techniques are preferred in the present invention, it is contemplated that the nanowires can be grown on a graphite substrate in the absence of a catalyst. This can be especially possible in combination with a mask.
特定而言,簡單使用蒸氣-固體生長可達成奈米線生長。因此,在MBE之上下文中,在不具有任何催化劑之情況下至基板之反應物(例如,In及As)之簡單施加可產生一奈米線之形成。此形成本發明之一進一步態樣,本發明因此提供在一石墨基板上直接生長由上文所闡述之元素形成之一半導體奈米線。因此,術語直接暗示不存在用以達成生長之一催化劑膜。 In particular, nanowire growth can be achieved simply by using vapor-solid growth. Thus, in the context of MBE, the simple application of reactants (e.g., In and As) to the substrate without any catalyst can result in the formation of a nanowire. This forms a further aspect of the invention which thus provides for the direct growth of a semiconductor nanowire formed from the elements set forth above on a graphite substrate. Therefore, the term directly implies that there is no catalyst film to achieve growth.
如上文所述,本發明之奈米線較佳生長為立方體(閃鋅礦)或六邊形(纖維鋅礦)結構。發明人已發現,藉由操縱饋送至基板之反應物之量來改變生長之奈米線之晶體結構係可能的,如上文所論述。舉例而言,較高饋送量之Ga迫使一GaAs晶體成為立方體晶體結構。較低饋送量促成一六邊形結構。藉由操縱反應物濃度,因此可改變奈米線內之晶體結構。 As described above, the nanowire of the present invention preferably grows into a cubic (sphalerite) or hexagonal (zinc-zinc) structure. The inventors have discovered that it is possible to alter the crystal structure of the grown nanowires by manipulating the amount of reactants fed to the substrate, as discussed above. For example, a higher feed amount of Ga forces a GaAs crystal into a cubic crystal structure. The lower feed amount contributes to a hexagonal structure. By manipulating the concentration of the reactants, the crystal structure within the nanowire can be altered.
在生長程序期間形成欲改變之奈米線之材料之本質亦在本發明之範疇內。因此,藉由改變分子束之本質,不同結構之一部分將引入至一奈米線中。一初始GaAs奈米線可(舉例而言)藉由自一Ga進料改變為一In進料而擴充有一InAs奈米線區段。然後,GaAs/InAs奈米線可藉由改變回至一Ga進料而擴充有一GaAs奈米線區段,以此類推。再次,藉由開發具有不同電性質之不同結構,發明人提供具有令人關注且可操縱之電子性質之奈米線。 The nature of the material forming the nanowire to be altered during the growth procedure is also within the scope of the invention. Thus, by changing the nature of the molecular beam, a portion of the different structures will be introduced into a nanowire. An initial GaAs nanowire can extend, for example, an InAs nanowire segment by changing from a Ga feed to an In feed. The GaAs/InAs nanowire can then be expanded with a GaAs nanowire segment by changing back to a Ga feed, and so on. Again, by developing different structures with different electrical properties, the inventors provide nanowires with interesting and steerable electronic properties.
就此而言,一奈米線經生長以具有軸向存在於奈米線內之一n/p接面係本發明之一進一步態樣。此可藉由在奈米線生長時改變摻雜材料之本質而達成。因此,在初始生長期間,一n型摻雜型態可用於將n型導電性引入至奈米線中。藉由在生長程序期間將摻雜劑改變為一p型摻雜劑,奈米線則可包括p型導電性。此等兩個半導體之間的接面形成一軸向n/p型接面。將瞭解,在此奈米線中n及p半導體之次序可變化,其中p或n型材料在頂部上且相反半導體在下方。 In this regard, a nanowire is grown to have one of the n/p junctions axially present in the nanowire. This can be achieved by changing the nature of the dopant material as it grows on the nanowire. Thus, during initial growth, an n-type dopant pattern can be used to introduce n-type conductivity into the nanowire. The nanowires can include p-type conductivity by changing the dopant to a p-type dopant during the growth process. The junction between the two semiconductors forms an axial n/p junction. It will be appreciated that the order of the n and p semiconductors in this nanowire can vary, with the p or n type material on top and the opposite semiconductor on the bottom.
此軸向類型接面在太陽能電池具備一石墨烯頂部觸點層時係尤其有用的,如本文中所闡述。亦注意,在存在一軸向p/n接面之處不要求存在一徑向殼層。 This axial type junction is particularly useful when the solar cell has a graphene top contact layer, as set forth herein. It is also noted that a radial shell is not required where an axial p/n junction is present.
因此,自一進一步態樣來看,本發明提供一種物質組合物,特定而言一種光伏打電池,其包括:至少一個奈米線,其在一石墨基板上,該至少一個奈米線已磊 晶生長於該基板上,其中該奈米線包括:一底部部分,其包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素,該底部部分已經摻雜以形成一n型或p型半導體;及一上部部分,其包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素,該上部部分已經摻雜以使得該上部部分形成與該底部部分之半導體相反之一n型半導體或p型半導體。 Therefore, in a further aspect, the present invention provides a composition of matter, in particular a photovoltaic cell comprising: at least one nanowire on a graphite substrate, the at least one nanowire has been rendered Crystal growth on the substrate, wherein the nanowire comprises: a bottom portion comprising at least one III-V compound or at least one II-VI compound or at least one Group IV element, the bottom portion having been doped to form An n-type or p-type semiconductor; and an upper portion comprising at least one III-V compound or at least one II-VI compound or at least one group IV element, the upper portion having been doped such that the upper portion is formed The semiconductor of the bottom portion is opposite to one of the n-type semiconductors or the p-type semiconductors.
用於形成奈米線之摻雜劑及材料之本質與上文相同。較佳地,奈米線之頂部部分及底部部分兩者皆由相同化合物(例如,諸如GaAs之一III-V族化合物)形成。 The nature of the dopants and materials used to form the nanowires is the same as above. Preferably, both the top portion and the bottom portion of the nanowire are formed of the same compound (eg, a compound of the III-V group such as GaAs).
接面較佳放置於奈米線之約一半處。自n型導電性至p型導電性之改變或反之自p型導電性至n型導電性之改變可僅藉由改變摻雜原子之本質而達成。因此,當該改變為所期望時,停止供應第一摻雜劑元素,及開始供應適於提供相反導電性之一第二摻雜元素。此在上文所闡述之MBE程序之上下文中可易於達成。 The junction is preferably placed about half of the nanowire. The change from n-type conductivity to p-type conductivity or vice versa from p-type conductivity to n-type conductivity can be achieved only by changing the nature of the dopant atoms. Therefore, when the change is desired, the supply of the first dopant element is stopped, and the supply of the second dopant element suitable for providing one of the opposite conductivity is started. This can be easily achieved in the context of the MBE procedure set forth above.
雖然不必提供具有一殼層之此軸向n/p型奈米線,但一殼層可有助於鈍化。此鈍化將用以減少表面空乏及載體重組且藉此增加太陽能電池效率。 Although it is not necessary to provide such an axial n/p type nanowire having a shell layer, a shell layer may contribute to passivation. This passivation will be used to reduce surface depletion and carrier recombination and thereby increase solar cell efficiency.
如上文所述,此軸向類型接面較佳連同一頂部觸點(尤其由一石墨基板形成之一頂部觸點)一起使用。彼基板較佳係透明的,此乃因其形成一頂部層。此類型之複數個電池可經堆疊以形成一串接電池,如下文進一步所定義。欲連同一徑向核心殼層電池一起使用之此軸向類型電池亦在本發明之範疇內。 As noted above, this axial type of junction is preferably used with the same top contact (especially one of the top contacts formed by a graphite substrate). The substrate is preferably transparent because it forms a top layer. A plurality of batteries of this type can be stacked to form a tandem battery, as further defined below. This axial type battery to be used with the same radial core shell battery is also within the scope of the present invention.
然後,所生長奈米線磊晶地過生長有一徑向殼層。因此,此作為一整體形成奈米線之一核心殼層類型配置。本發明之奈米線可藉由習知方法(諸如上文關於以MBE生長之奈米線所論述之彼等方法)而塗 佈。殼層應覆蓋核心表面之全部。 Then, the grown nanowires are epitaxially grown with a radial shell. Therefore, this forms a core shell type configuration of the nanowire as a whole. The nanowires of the present invention can be applied by conventional methods such as those discussed above for the MBE grown nanowires. cloth. The shell should cover all of the core surface.
殼層材料將由用於奈米線核心的如上文所闡述之一III-V族或II-VI族化合物或(多種)IV族元素形成。核心材料及殼層材料兩者皆需要充當半導體以產生有用奈米線及因此太陽能電池。最佳地,就週期表而言,核心材料與殼層材料匹配。因此,III-V族奈米線核心較佳具有III-V族殼層。II-VI族核心可攜載II-VI族殼層,以此類推。 The shell material will be formed from one of the Group III-V or II-VI compounds or Group IV elements as described above for the core of the nanowire. Both the core material and the shell material need to act as a semiconductor to produce useful nanowires and thus solar cells. Optimally, in terms of the periodic table, the core material matches the shell material. Therefore, the III-V family nanowire core preferably has a III-V shell layer. The II-VI core can carry the II-VI shell, and so on.
更佳地,核心與殼層中之元素中之至少一者相同,較佳地兩種元素相同。在一項實施例中,用於核心及殼層之化合物相同且僅在摻雜型態之本質方面不同。 More preferably, the core is identical to at least one of the elements in the shell, preferably the two elements are the same. In one embodiment, the compounds for the core and shell layers are identical and differ only in the nature of the doping profile.
需要摻雜殼層材料以使得其形成與由核心奈米線形成之接面相反之一p或n接面。因此,一經p摻雜核心可由一經n摻雜殼層覆蓋(或反之亦然)。較佳地,核心係一經p摻雜半導體,而殼層係一經n摻雜半導體。可在上文中關於核心奈米線發現摻雜之一論述。 It is desirable to dope the shell material such that it forms one of the p or n junctions opposite the junction formed by the core nanowires. Thus, a p-doped core can be covered by an n-doped shell (or vice versa). Preferably, the core is a p-doped semiconductor and the shell is an n-doped semiconductor. One can be discussed above in relation to the discovery of doping on the core nanowire.
在一項實施例中,當核心奈米線係一III-V族奈米線時,則殼層可係一混合III-V族殼層,亦即,包括來自III族之兩種元素及來自V族之一種元素,例如,AlGaAs。將瞭解,在此等三元(或四元)化合物中,所組合之Al及Ga之量滿足As(當然,根據摻雜)之價位,但可存在變化量之Al及Ga。 In one embodiment, when the core nanowire is a III-V group nanowire, the shell layer may be a mixed III-V shell layer, that is, including two elements from the group III and An element of the V group, for example, AlGaAs. It will be appreciated that in such ternary (or quaternary) compounds, the amount of Al and Ga combined satisfies the price of As (of course, depending on the doping), but varying amounts of Al and Ga may be present.
因此,三元化合物可具有化學式XYZ,其中X係一III族元素,Y係不同於X及Z之一III或V族元素,及Z係一V族元素。XYZ中之X與Y或Y與Z莫耳比較佳為0.2至0.8,亦即,化學式較佳為XxY1-xZ(或XY1-xZx),其中下標x為0.2至0.8。四元系統可由化學式AxB1-xCyD1-y表示,其中A及B係III族元素且C及D係IV族元素。再次,下標x及y通常為0.2至0.8。 Thus, the ternary compound may have the chemical formula XYZ, wherein X is a Group III element, Y is different from X and Z one of Group III or V elements, and Z is a Group V element. X and Y or Y and Z mole in XYZ are preferably from 0.2 to 0.8, that is, the chemical formula is preferably X x Y 1-x Z (or XY 1-x Z x ), wherein the subscript x is 0.2 to 0.8. The quaternary system can be represented by the chemical formula A x B 1-x C y D 1-y , where A and B are Group III elements and C and D are Group IV elements. Again, the subscripts x and y are typically between 0.2 and 0.8.
一純質(i)未經摻雜層亦可用於徑向p核心與n殼層(或反之亦然)結構之間以增強太陽能電池效能。此中間層(i)可藉由在繼續生長經摻雜 殼層之前首先生長未經摻雜之徑向殼層而製成。 A pure (i) undoped layer can also be used between the radial p core and n shell (or vice versa) structures to enhance solar cell performance. This intermediate layer (i) can be doped by continuing growth The shell layer is first formed by growing an undoped radial shell layer.
藉由使用適當摻雜技術來生長其中存在一「p-i-n」或「n-i-p」結構之一殼層將亦係可能的。因此,首先,該殼層可經p摻雜(覆蓋一p核心奈米線),之後引入一未經摻雜純質殼層及經n摻雜殼層(或反之亦然)。 It is also possible to grow a shell in which a "p-i-n" or "n-i-p" structure is present by using an appropriate doping technique. Thus, first, the shell layer can be p-doped (covering a p-core nanowire) followed by an undoped pure shell layer and an n-doped shell layer (or vice versa).
因此,自另一態樣來看,本發明提供一種如上文中所定義之物質組合物,其中一純質層(未經摻雜)位於核心與殼層之間。理想地,未經摻雜層之本質將與核心或殼層或者兩者之本質相同,亦即,若核心奈米線係經摻雜GaAs,則未經摻雜層僅係未經摻雜GaAs。 Thus, in another aspect, the invention provides a composition of matter as defined above, wherein a pure layer (undoped) is located between the core and the shell. Ideally, the nature of the undoped layer will be essentially the same as the core or shell or both, ie if the core nanowire is doped with GaAs, the undoped layer is only undoped GaAs .
殼層中所使用之摻雜劑與奈米線中所使用之彼等摻雜劑相同且上文已論述。核心/殼層是形成一p接面還是形成一n接面隨摻雜劑之本質、其量等等而變。熟習此項技術者熟悉此等半導體材料之摻雜以引入p型或n型導電性。 The dopants used in the shell are the same as those used in the nanowires and have been discussed above. Whether the core/shell layer forms a p-junction or an n-junction varies with the nature of the dopant, its amount, and the like. Those skilled in the art are familiar with the doping of such semiconductor materials to introduce p-type or n-type conductivity.
特別較佳地,殼層材料係一n型GaAs殼層。核心較佳係一p型GaAs。 Particularly preferably, the shell material is an n-type GaAs shell. The core is preferably a p-type GaAs.
殼層之厚度為約若干奈米,例如,10nm至500nm。殼層較佳比奈米線核心薄。 The thickness of the shell layer is about several nanometers, for example, 10 nm to 500 nm. The shell layer is preferably thinner than the core of the nanowire.
使用具有p及n接面之一兩層核心殼層奈米線形成電流流動之一徑向可能。當然,需要提供電極以形成一電池。石墨基板係一導體且因此提供底部電極。較佳地,核心殼層奈米線亦具備經設計以充當一透明導電頂部觸點之一外部導電塗層。此頂部觸點及基於石墨基板之底部觸點之存在形成一電路且因此允許電流在所吸收光子於核心殼層奈米線中產生自由載流子時在電池中流動。 It is possible to form one of the current flows using one of the core layers of the p and n junctions. Of course, it is necessary to provide electrodes to form a battery. The graphite substrate is a conductor and thus provides a bottom electrode. Preferably, the core shell nanowire also has an outer conductive coating designed to act as one of the transparent conductive top contacts. The presence of the top contact and the bottom contact based on the graphite substrate forms a circuit and thus allows current to flow in the cell as the absorbed photons generate free carriers in the core shell nanowire.
外部塗層較佳係透明的。允許光子穿透外部塗層並由奈米線內之半導體核心或殼層材料吸收係較佳的。外部塗層亦必須係一導體。 The outer coating is preferably transparent. It is preferred to allow photons to penetrate the outer coating and to be absorbed by the semiconductor core or shell material within the nanowire. The outer coating must also be a conductor.
外部塗層較佳由一混合金屬氧化物形成。較佳地,該塗層由一過渡金屬或者(III)或(IV)族金屬之一混合金屬氧化物形成。過渡金屬較佳係一第10族至第12族金屬。理想地,其來自第一過渡系,例如,Zn。較佳(III)或(IV)族金屬為In、Sn、Al或Ge。 The outer coating is preferably formed of a mixed metal oxide. Preferably, the coating is formed of a transition metal or a mixed metal oxide of one of the (III) or (IV) metals. The transition metal is preferably a Group 10 to Group 12 metal. Ideally, it comes from a first transition system, such as Zn. Preferably, the metal of Group (III) or (IV) is In, Sn, Al or Ge.
因此,本發明中所使用之塗層包含InSnO(經Sn摻雜之InO或ITO)及AlZnO(經Al摻雜之ZnO或AZO)。 Therefore, the coating used in the present invention contains InSnO (Sn-doped InO or ITO) and AlZnO (Al-doped ZnO or AZO).
存在外部殼層以允許高導電率而同時係透明的。實際上,石墨烯充當一個電極,且外部塗層充當一第二電極。 There is an outer shell to allow for high conductivity while being transparent. In fact, graphene acts as an electrode and the outer coating acts as a second electrode.
可使用原子層沈積或濺鍍來施加外部塗層。 The outer coating can be applied using atomic layer deposition or sputtering.
塗層之厚度為約若干奈米,例如,10nm至100nm。外部塗層理想地應係保形的且儘可能薄的,但此處在透明(薄層)與導電率(較厚層)之間存在一折衷。 The thickness of the coating is about several nanometers, for example, 10 nm to 100 nm. The outer coating should ideally be conformal and as thin as possible, but here there is a trade-off between transparency (thin layer) and electrical conductivity (thicker layer).
外部塗層將需要不僅覆蓋奈米線且亦覆蓋其上生長奈米線之基板。當然,形成一底部觸點之石墨基板不可能與由外部殼層形成之頂部觸點直接接觸。因此,可需要在石墨基板之頂部上提供一絕緣層。便利地,此可使用如上文中所定義之一個二氧化矽遮罩而達成。 The outer coating will require a substrate that covers not only the nanowire but also the nanowires that are grown thereon. Of course, the graphite substrate forming a bottom contact is unlikely to be in direct contact with the top contact formed by the outer casing. Therefore, it may be desirable to provide an insulating layer on top of the graphite substrate. Conveniently, this can be achieved using a cerium oxide mask as defined above.
奈米線經設計以覆蓋石墨基板之表面之至少5%。理想地,覆蓋可為石墨表面之多達20%。因此,此等百分比指代奈米線之基底下方之表面積。此等密度允許一低光反射及高光子吸收。光子由奈米線之核心組分及殼層組分兩者吸收。在不希望受理論限制之情況下,在一經p摻雜核心及經n摻雜殼層奈米線中,設想,光將自上方引導至奈米線上。在奈米線中吸收光子並產生自由電荷。電荷載流子係帶負電之電子及帶正電之電洞。電子電荷移動穿過n型殼層至頂部觸點。因此,實際上,電子可設想為在奈米線中徑向行進以到達頂部觸點。由於外部塗層充當一電極,因此電子僅不得不通過一極短距離至電極,亦即,電子僅不得不行進穿過幾十nm之n型殼層,之後才與一導體接 觸。正電荷(電洞)向下通過奈米線至其他底部觸點(石墨基板)基底層,且電荷極迅速地向下通過奈米線至觸點。 The nanowires are designed to cover at least 5% of the surface of the graphite substrate. Ideally, the coverage can be as much as 20% of the graphite surface. Thus, these percentages refer to the surface area below the substrate of the nanowire. These densities allow for a low light reflection and high photon absorption. The photons are absorbed by both the core component and the shell component of the nanowire. Without wishing to be bound by theory, in a p-doped core and an n-doped shell nanowire, it is envisaged that light will be directed from above to the nanowire. Photons are absorbed in the nanowire and produce a free charge. The charge carrier is a negatively charged electron and a positively charged hole. The electron charge moves through the n-shell to the top contact. Thus, in practice, electrons can be envisaged to travel radially in the nanowire to reach the top contact. Since the outer coating acts as an electrode, the electrons only have to pass a very short distance to the electrode, that is, the electron has to travel through only a few tens of nm of the n-type shell before being connected to a conductor. touch. The positive charge (hole) passes down the nanowire to the other bottom contact (graphite substrate) substrate layer, and the charge passes very rapidly down through the nanowire to the contact.
頂部觸點設計之本質可取決於系統。若出現關於表面狀態之問題,則在徑向半導體殼層外側具有一鈍化層,而非僅具有在奈米線之頂部部分處與半導體殼層直接接觸之頂部觸點可係重要的。此徑向鈍化層可藉由化學鈍化(例如,使用一硫化銨溶液)或藉由將經摻雜奈米線殼層過生長有一未經摻雜(純質)磊晶窗層(例如,一GaAs奈米線殼層之一AlGaAs窗層)而引入。然後,奈米線可嵌入一透明絕緣體(例如,苯并環丁烯樹脂(BCB))中,之後一透明導電頂部觸點(例如,ITO或AZO)經製成以附著至奈米線尖端之導電部分。可在Mariani等人之Nano Lett(2011,11,2490-2494)中發現GaAs奈米線之鈍化之一論述。 The nature of the top contact design can depend on the system. If a problem with the surface state occurs, it may be important to have a passivation layer on the outside of the radial semiconductor shell, rather than having only the top contact in direct contact with the semiconductor shell at the top portion of the nanowire. The radial passivation layer may be undoped (pure) epitaxial window layer by chemical passivation (eg, using an ammonium sulfide solution) or by overgrowing the doped nanowire shell layer (eg, one Introduced as an AlGaAs window layer of one of the GaAs nanowire shell layers. The nanowire can then be embedded in a transparent insulator (eg, benzocyclobutene resin (BCB)), after which a transparent conductive top contact (eg, ITO or AZO) is formed to adhere to the tip of the nanowire. Conductive part. One discussion of the passivation of GaAs nanowires can be found in Maria Let et al. (2011, 11, 2490-2494).
具有用於電子行進之此等短距離意指電子收集時間可比電子熱化時間短,及因此,本發明之電池可係極高效的。高於34%之效率係可能的。 Having such a short distance for electron travel means that the electron collection time can be shorter than the electron heating time, and thus, the battery of the present invention can be extremely efficient. Efficiency above 34% is possible.
藉由在電池上提供一進一步金屬頂部觸點來供應外部塗層觸點亦係可能的。金屬頂部觸點較佳為金或典型電極類型金屬(諸如Pt、Pd、Ti、Ge及Au)之一金屬或合金。 It is also possible to supply an external coating contact by providing a further metal top contact on the battery. The metal top contact is preferably a metal or alloy of gold or a typical electrode type metal such as Pt, Pd, Ti, Ge, and Au.
以此方式,頂部觸點由亦與金屬頂部觸點接觸之外部塗層形成。電荷可迅速地向下通過導電外部塗層至頂部觸點。 In this way, the top contact is formed by an outer coating that is also in contact with the metal top contact. The charge can quickly pass down through the conductive outer coating to the top contact.
將瞭解,由一特定核心殼層奈米線吸收之光子將取決於所討論之材料之帶隙。帶隙通常指代價帶之頂部與導電帶之底部之間的能量差(以電子伏特為單位)。此等於將一電子自價帶之頂部運送至導電帶之底部以使得電子變成能夠在半導體材料內自由移動之一行動電荷載流子所需之能量。因此帶隙係判定光子為在半導體中形成自由載流子所需之最小能量之一主要因素。 It will be appreciated that the photons absorbed by a particular core shell nanowire will depend on the band gap of the material in question. Bandgap usually refers to the energy difference (in electron volts) between the top of the cost band and the bottom of the conductive strip. This is equivalent to transporting the top of an electron from the valence band to the bottom of the conductive strip to make the electrons become the energy required to move one of the mobile charge carriers within the semiconductor material. The bandgap system therefore determines that photons are one of the primary factors required to form free carriers in the semiconductor.
具有小於帶隙之能量之光子將不能在半導體中形成任何自由載 流子,且因此不吸收任何光。藉助大於帶隙之光子已形成之自由載流子將釋放其能量之部分(等於光子能量與帶隙能量之間的差之量)以進行加熱。因此,太陽能電池之效率極大地取決於材料之帶隙。 Photons with energy less than the band gap will not form any free load in the semiconductor Streams, and therefore do not absorb any light. The free carriers that have been formed by photons larger than the band gap will release a portion of their energy (equal to the difference between the photon energy and the band gap energy) for heating. Therefore, the efficiency of a solar cell depends greatly on the band gap of the material.
藉由操縱核心及殼層奈米線中之半導體材料之化學組合物,可產生具有不同帶隙之材料。 Materials having different band gaps can be produced by manipulating the chemical composition of the semiconductor material in the core and shell nanowires.
為使一太陽能電池之效能最大化,儘可能多地吸收光子係重要的。一特定電池將吸收之光子之本質及電池可產生多少電力在很大程度上由帶隙決定。帶隙之大小隨核心層及殼層而變且可因此取決於所使用之材料之本質而變化。因此,發明人設想如上文中所定義之複數個不同電池可用於形成吸收跨越波長之一寬度之光子之太陽能電池。藉由提供具有不同帶隙之電池,每一電池將吸收來自與其他電池之彼等太陽能光譜不同之太陽能光譜之一部分之光子。此使太陽能電池之效能最大化,此乃因其允許較少熱損失及吸收一較寬光譜之光子。組合複數個此等不同電池應使得能夠形成一高度高效之太陽能電池。 In order to maximize the effectiveness of a solar cell, it is important to absorb as much photon as possible. The nature of the photons that a particular battery will absorb and how much power the battery can produce is largely determined by the bandgap. The size of the band gap varies with the core layer and the shell layer and can therefore vary depending on the nature of the material used. Accordingly, the inventors contemplate that a plurality of different cells as defined above can be used to form a solar cell that absorbs photons that span one width of the wavelength. By providing batteries with different band gaps, each cell will absorb photons from a portion of the solar spectrum that is different from the solar spectra of the other cells. This maximizes the performance of the solar cell because it allows for less heat loss and absorbs a wider spectrum of photons. Combining a plurality of such different batteries should enable the formation of a highly efficient solar cell.
因此,自另一態樣來看,本發明提供一種包括具有不同帶隙的如上文中所定義之至少兩個電池之太陽能電池。此等電池在本文中稱作串接電池。 Thus, in another aspect, the present invention provides a solar cell comprising at least two cells having different band gaps as defined above. Such batteries are referred to herein as series connected batteries.
電池應彼此吸收不同波長之光,例如,藍色光及紅色光。 The batteries should absorb light of different wavelengths from each other, for example, blue light and red light.
對一裝置內之電池之配置不存在特定限制。然而,設想,該等電池可精確地彼此上下堆疊。奈米線生長程序往往產生相同長度之奈米線。因此,一電池之頂部表面通常平坦。因此,上方之一電池之底部可位於下方之電池之頂部上。因此,頂部電池之底部觸點係透明的以允許光子穿透至下方之太陽能電池係重要的。所堆疊電池之間亦應存在一絕緣體(或氣隙)。 There are no specific restrictions on the configuration of the battery within a device. However, it is envisaged that the batteries can be stacked on top of one another precisely. Nanowire growth programs often produce nanowires of the same length. Therefore, the top surface of a battery is generally flat. Therefore, the bottom of one of the upper batteries can be located on the top of the battery below. Therefore, it is important that the bottom contact of the top cell is transparent to allow photons to penetrate below the solar cell. There should also be an insulator (or air gap) between the stacked cells.
因此,在一項實施例中,一頂部電池可吸收藍色光光子。一下 部電池可吸收紅色光光子。所吸收之光子之本質由帶隙判定。在一堆疊中之底部電池中具有較低帶隙材料係較佳的。自底部至頂部之堆疊次序較佳反映最低至最高之帶隙。 Thus, in one embodiment, a top cell can absorb blue photons. a bit The battery absorbs red photons. The nature of the absorbed photons is determined by the band gap. It is preferred to have a lower bandgap material in the bottom cell in a stack. The stacking order from bottom to top preferably reflects the lowest to highest band gap.
堆疊電池中之奈米線不需要對準。 The nanowires in the stacked battery do not need to be aligned.
當然,沒有理由將太陽能電池限於可見光。例如,GaSb奈米線具有較低帶隙且將吸收IR光子。 Of course, there is no reason to limit solar cells to visible light. For example, the GaSb nanowire has a lower band gap and will absorb IR photons.
較佳地,在使用中,在太陽能電池中將奈米線定向為與陽光之方向平行。因此,光主要向下通過奈米線之長度且不徑向跨越奈米線。使用像用以將光聚焦至電池中之一透鏡之一光收集器可係一選項,如在聚光光伏打(CPV)應用中所做出。 Preferably, in use, the nanowires are oriented in a solar cell parallel to the direction of the sunlight. Thus, the light passes primarily down the length of the nanowire and does not radially span the nanowire. The use of a light collector such as one for focusing light onto one of the cells of the battery can be an option, as is done in concentrated photovoltaic (CPV) applications.
每一電池可為1微米至2微米長,因此,串接電池可為2微米至4微米且三重電池之高度可為3微米至6微米。 Each cell can be from 1 micron to 2 microns long, so a tandem cell can be from 2 microns to 4 microns and a triple cell can be from 3 microns to 6 microns in height.
結合太陽能電池之其他設計(諸如一傳統薄膜p-n接面電池)來使用本發明之一電池亦係可能的。特定而言,藉由使用石墨烯作為一共同中間(導電且透明)層在不進行堆疊之情況下做出一雙(理想地,基於一第一低帶隙電池及一第二高帶隙電池)接面串接電池亦係可能的,其中兩個作用電池並聯或串聯連接。 It is also possible to use a battery of the present invention in combination with other designs of solar cells, such as a conventional thin film p-n junction cell. In particular, by using graphene as a common intermediate (conductive and transparent) layer, a pair is made without stacking (ideally, based on a first low bandgap cell and a second high bandgap cell) It is also possible to connect the batteries in series, in which the two active cells are connected in parallel or in series.
藉由具有並聯(串聯)連接之兩個電池與一共同中間石墨烯層,可獨立地自每一電池添加短路電流(開路電壓)。在並聯組態中,以下各項將亦係可能的:「斷開」頂部觸點與底部觸點之間的連接,及在跨越每一電池之不同電壓下獨立地操作上部及下部電池,但仍具有作為共同觸點之共同中間層。在此情形中,在兩個電池之間不存在絕緣層(或氣隙)。 Short circuit current (open circuit voltage) can be independently added from each battery by having two cells connected in parallel (series) and a common intermediate graphene layer. In a parallel configuration, the following will also be possible: "break" the connection between the top and bottom contacts, and operate the upper and lower batteries independently at different voltages across each cell, but There is still a common intermediate layer as a common contact. In this case, there is no insulating layer (or air gap) between the two cells.
此對於並聯連接之電池係特別有利的,此乃因可在不要求電流匹配當串聯連接兩個電池時(如在傳統多接面串接電池中)將需要之電流之情況下達成一高太陽能電池效率。 This is particularly advantageous for battery cells that are connected in parallel, because a high solar energy can be achieved without requiring current matching when two cells are connected in series (as in a conventional multi-junction battery). Battery efficiency.
第一電池(低帶隙)可係在頂部上具有經轉移石墨烯之一傳統薄膜p-n接面電池,該石墨烯既充當共同中間層(亦即,頂部電極)且亦充當用於生長頂部奈米線核心殼層太陽能電池(第二電池)之基板。 The first cell (low band gap) may be a conventional thin film pn junction cell having a transferred graphene on top, which serves as both a common intermediate layer (ie, a top electrode) and also serves as a growth top A substrate of a rice noodle core shell solar cell (second cell).
因此,自另一態樣來看,本發明提供一種物質組合物,特定而言一種串接光伏打電池,其包括:(A)至少一個核心半導體奈米線,其在一石墨基板上,該至少一個核心奈米線已磊晶生長於該基板上,其中該奈米線包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素;一半導體殼層,其環繞該核心奈米線,該殼層包括至少一種III-V族化合物或至少一種II-VI族化合物或至少一種IV族元素以使得該核心奈米線及該殼層分別形成一n型半導體及一p型半導體,或反之亦然;及一外部導電塗層,其環繞該殼層,該外部導電塗層形成一電極觸點;及(B)一薄膜p-n接面電池,其具有一底部電極及一頂部電極;其中該石墨基板既充當該薄膜電池之該頂部電極且亦充當用於該等奈米線之該生長之該基板。 Therefore, in another aspect, the present invention provides a composition of matter, in particular a tandem photovoltaic cell comprising: (A) at least one core semiconductor nanowire on a graphite substrate, the At least one core nanowire has been epitaxially grown on the substrate, wherein the nanowire comprises at least one III-V compound or at least one II-VI compound or at least one Group IV element; a semiconductor shell surrounding The core nanowire, the shell layer comprising at least one group III-V compound or at least one group II-VI compound or at least one group IV element such that the core nanowire and the shell layer form an n-type semiconductor and a a p-type semiconductor, or vice versa; and an outer conductive coating surrounding the shell, the outer conductive coating forming an electrode contact; and (B) a thin film pn junction cell having a bottom electrode and a top electrode; wherein the graphite substrate acts as both the top electrode of the thin film battery and also serves as the substrate for the growth of the nanowires.
因此,理想地,石墨層形成用於奈米線生長之一透明基板同時充當薄膜接面電池之一電極。 Therefore, ideally, the graphite layer forms one of the transparent substrates for nanowire growth while serving as one of the electrodes of the thin film junction cell.
將瞭解,然後,此串接電池在頂部上可另外包括一進一步堆疊電池,以此類推。因此,本發明之一電池可堆疊於此串接電池之頂部層上以提供一個三重電池結構。如需要,可在所堆疊電池與串接電池之間使用一介電層或氣隙。 It will be appreciated that this tandem battery can then additionally include a further stacked battery on top, and so on. Thus, one of the batteries of the present invention can be stacked on the top layer of the tandem cell to provide a triple cell structure. If desired, a dielectric layer or air gap can be used between the stacked battery and the series battery.
在本發明之一進一步可能實施例中,電池可具備一石墨頂部層。一石墨層可放置於所形成徑向p/n接面核心殼層及經塗佈奈米線 或軸向p/n接面奈米線之頂部上。顯然,此與奈米線形成一頂部觸點。較佳地,石墨頂部層實質上與基板層平行。亦將瞭解,石墨層之面積不需要與基板之面積相同。可需要若干石墨層來形成一頂部層。 In a further possible embodiment of the invention, the battery can be provided with a graphite top layer. A graphite layer can be placed on the formed radial p/n junction core shell and coated nanowires Or on the top of the axial p/n junction nanowire. Obviously, this forms a top contact with the nanowire. Preferably, the graphite top layer is substantially parallel to the substrate layer. It will also be appreciated that the area of the graphite layer need not be the same as the area of the substrate. Several graphite layers may be required to form a top layer.
所使用之石墨層可與上文關於基板所詳細闡述之彼等石墨層相同。頂部層係石墨的,更尤其,其係石墨烯。 The graphite layers used may be the same as those of the graphite layers detailed above with respect to the substrate. The top layer is graphite, and more particularly, it is graphene.
較佳地,頂部層之厚度為20nm或小於20nm。甚至更佳地,石墨頂部觸點之厚度可為5nm或小於5nm。 Preferably, the thickness of the top layer is 20 nm or less. Even more preferably, the graphite top contact may have a thickness of 5 nm or less.
可藉由任何適宜方法來達成頂部觸點至所形成奈米線之施加。可使用類似於用於將石墨層轉移至基板載體的先前所提及之彼等方法之方法。來自凝析石墨、高定向熱解石墨(HOPG)或CVD之石墨層可藉由機械或化學方法而剝落。然後,可將其轉移至蝕刻溶液(諸如HF或酸性溶液)中以移除Cu(Ni、Pt)(尤其對於經CVD生長之石墨層)及來自剝落程序之任何污染物。可將蝕刻溶液進一步換成其他溶液(諸如去離子水)以清潔石墨層。然後,可將石墨層轉移至所形成奈米線上作為頂部觸點。再次,電子束阻劑或光阻劑可用於在剝落及轉移程序期間支撐薄石墨層,該電子束阻劑或光阻劑在沈積之後可移除。 The application of the top contact to the formed nanowire can be achieved by any suitable method. A method similar to the previously mentioned methods for transferring a graphite layer to a substrate carrier can be used. Graphite layers from condensed graphite, highly oriented pyrolytic graphite (HOPG) or CVD can be spalled by mechanical or chemical means. It can then be transferred to an etching solution such as HF or an acidic solution to remove Cu(Ni, Pt) (especially for CVD-grown graphite layers) and any contaminants from the spalling process. The etching solution can be further changed to another solution such as deionized water to clean the graphite layer. The graphite layer can then be transferred to the formed nanowire as a top contact. Again, an electron beam resist or photoresist can be used to support the thin graphite layer during the spalling and transfer process, which can be removed after deposition.
較佳地,石墨層在蝕刻及清洗之後完全變乾,之後其轉移至奈米線陣列之頂部。為增強石墨層與奈米線之間的接觸,可在此「乾」轉移期間施加一濕度壓力及熱。 Preferably, the graphite layer is completely dried after etching and cleaning, after which it is transferred to the top of the array of nanowires. To enhance the contact between the graphite layer and the nanowire, a humidity pressure and heat can be applied during this "dry" transfer.
另一選擇為,石墨層可與一溶液(例如,去離子水)一起轉移至奈米線陣列之頂部上。隨著溶液變乾,石墨層自然形成至下伏奈米線之一緊密接觸。在此「濕」轉移方法中,溶液在乾燥程序期間之表面張力可彎曲或破壞奈米線陣列。為在使用此濕方法之情況下防止此,較佳採用較穩健奈米線。具有>200nm之一直徑之奈米線可係適合的。另一選擇為,可使用支撐垂直奈米線結構之圖案化有孔之基板。亦可使用臨界點乾燥技術以避免在乾燥程序期間由表面張力造成之任何損壞。 Alternatively, the graphite layer can be transferred to a top of the array of nanowires along with a solution (eg, deionized water). As the solution dries, the graphite layer naturally forms into close contact with one of the underlying nanowires. In this "wet" transfer method, the surface tension of the solution during the drying process can bend or destroy the array of nanowires. To prevent this in the case of using this wet method, a more robust nanowire is preferred. A nanowire having a diameter of >200 nm may be suitable. Alternatively, a patterned apertured substrate supporting a vertical nanowire structure can be used. Critical point drying techniques can also be used to avoid any damage caused by surface tension during the drying process.
若在一奈米線陣列上存在一水滴且移除該水滴之嘗試涉及(舉例而言)一氮吹,則水滴藉由蒸發將變得愈來愈小,但水滴因表面張力將總是試圖保持一球形形式。此可損壞或破壞環繞水滴或在水滴內側之奈米結構。 If there is a water droplet on a nanowire array and the attempt to remove the water droplet involves, for example, a nitrogen blow, the water droplet will become smaller and smaller by evaporation, but the water droplet will always try due to surface tension. Keep a spherical form. This can damage or destroy the nanostructure surrounding the water droplets or inside the water droplets.
臨界點乾燥避免此問題。藉由增加溫度及壓力,可移除液體與氣體之間的相界且可易於移除水。 Critical point drying avoids this problem. By increasing the temperature and pressure, the phase boundary between the liquid and the gas can be removed and the water can be easily removed.
頂部觸點石墨層較佳地係透明、導電且撓性的。為增強石墨層與如進一步所生長之奈米線之頂部上之金屬粒子之電及機械接觸,可使用一退火後程序。在沈積石墨頂部觸點之後,可將樣本在一惰性氣氛(例如,氬)或真空中退火。溫度可為多達600℃。退火時間可為多達10min。 The top contact graphite layer is preferably transparent, electrically conductive and flexible. To enhance the electrical and mechanical contact of the graphite layer with the metal particles on top of the further grown nanowires, an annealing procedure can be used. After depositing the graphite top contact, the sample can be annealed in an inert atmosphere (eg, argon) or vacuum. The temperature can be as much as 600 ° C. The annealing time can be as much as 10 min.
亦可利用石墨頂部觸點之摻雜。石墨頂部觸點之主要載流子可藉由摻雜而控制為電洞或電子。在石墨頂部觸點中及在半導電奈米線中具有相同摻雜類型係較佳的。舉例而言,在殼層中具有p摻雜之一核心殼層奈米線應與頂部石墨層之p摻雜匹配。在奈米線之上部部分處具有p摻雜之一軸向p/n接面奈米線應與頂部石墨層之p摻雜匹配。為增強石墨頂部觸點之導電率,具有高導電率(>103S/cm)之金屬奈米結構(諸如奈米線及奈米粒子)可(特定而言)以其部分互連(例如,一Ag奈米線/石墨烯混合頂部觸點)之此一方式分散於頂部上。 Doping of the top contact of the graphite can also be utilized. The main carriers of the graphite top contact can be controlled to be holes or electrons by doping. It is preferred to have the same doping type in the graphite top contact and in the semiconducting nanowire. For example, a core shell nanowire having p-doping in the shell layer should match the p-doping of the top graphite layer. One of the axial p/n junction nanowires having p-doping at the upper portion of the nanowire should match the p-doping of the top graphite layer. To enhance the conductivity of the top contact of the graphite, metal nanostructures (such as nanowires and nanoparticles) having a high electrical conductivity (>10 3 S/cm) may (particularly) be partially interconnected (eg This way, an Ag nanowire/graphene mixed top contact) is dispersed on top.
在製造太陽能電池時可使用本發明之奈米線。此太陽能電池具有同時為高效、廉價且撓性之可能。 The nanowire of the present invention can be used in the manufacture of a solar cell. This solar cell has the potential to be both efficient, inexpensive, and flexible.
現將關於以下非限制性實例及各圖進一步論述本發明。 The invention will now be further discussed with respect to the following non-limiting examples and figures.
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US11257967B2 (en) | 2022-02-22 |
JP6343608B2 (en) | 2018-06-13 |
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CN104685637B (en) | 2017-11-28 |
BR112014031949A2 (en) | 2017-06-27 |
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