KR101674135B1 - Probe card - Google Patents

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Publication number
KR101674135B1
KR101674135B1 KR1020100003060A KR20100003060A KR101674135B1 KR 101674135 B1 KR101674135 B1 KR 101674135B1 KR 1020100003060 A KR1020100003060 A KR 1020100003060A KR 20100003060 A KR20100003060 A KR 20100003060A KR 101674135 B1 KR101674135 B1 KR 101674135B1
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KR
South Korea
Prior art keywords
interface blocks
support substrate
probe
probe card
interface
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KR1020100003060A
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Korean (ko)
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KR20110083053A (en
Inventor
김형익
이호준
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(주)엠투엔
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Priority to KR1020100003060A priority Critical patent/KR101674135B1/en
Priority to PCT/KR2010/009143 priority patent/WO2011087215A2/en
Publication of KR20110083053A publication Critical patent/KR20110083053A/en
Application granted granted Critical
Publication of KR101674135B1 publication Critical patent/KR101674135B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Power Engineering (AREA)

Abstract

The probe card includes probe structures, engraved substrates, interface blocks, a support substrate, and a circuit substrate. The probe structures have probes that transmit and receive electrical signals to the chip pads of the test object through physical contact. The engraved substrates are each disposed at the bottom of the probe structures, electrically connected to the probes, and have wirings with different intervals on the upper and lower surfaces. The interface blocks are respectively disposed under the engraved substrates and have connection members connected to the wirings and spaced from each other on the upper and lower surfaces. The support substrate has through holes into which the interface blocks are removably inserted, and supports the interface blocks. The circuit board is disposed under the support substrate and has wirings electrically connected to the connection members of the interface blocks, respectively.

Figure R1020100003060

Description

Probe card {Probe card}

The present invention relates to a probe card, and more particularly to a probe card comprising a probe in contact with a pad of a semiconductor element.

In general, a semiconductor device includes a Fab process for forming an electric circuit including electric devices on a silicon wafer used as a semiconductor substrate, an EDS (electrical) device for inspecting electrical characteristics of the semiconductor devices formed in the fab process, die sorting process, and a package assembling process for encapsulating and individualizing the semiconductor elements with epoxy resin, respectively.

The EDS process is performed to identify a defective semiconductor device among the semiconductor devices. The EDS process is performed using an inspection apparatus called a probe card. The probe card applies an electrical signal in a state where a probe is in contact with a pad of the semiconductor elements, and determines a defect by a signal checked from the applied electrical signal.

Since the size of the wafer is increased and a plurality of chips are formed on a single wafer, a probe card for inspecting the chips is also becoming larger. The probes are attached to the ceramic substrate by a plurality of probes to simultaneously test the plurality of chips. At this time, the ceramic substrate serves as a space converter for converting a narrow pitch terminal into a wide pitch, and has a thermal expansion coefficient similar to that of the silicon wafer, thereby minimizing a change in position of the probe and the chip pad of the wafer due to thermal deformation.

However, it is difficult to fabricate a probe card including a ceramic substrate having a large area corresponding to the size of the wafer, and in the case where the probe is defective, it is difficult to selectively replace or repair the defective probe.

The present invention provides a probe card that is easy to manufacture and maintain.

A probe card according to the present invention includes a probe structure having a probe for transmitting and receiving an electrical signal to and from an chip pad of a test object through a physical contact, and a probe card disposed on a lower portion of the probe structures and electrically connected to the probe, A plurality of interfacing boards disposed on the lower side of the engraved substrates respectively and each having connection members connected to the interconnection and spaced from each other on the upper and lower surfaces, And a circuit board having a supporting substrate for supporting the interface blocks and a wiring board disposed at a lower portion of the supporting board and having wirings electrically connected to the connecting members of the interface blocks, .

According to one embodiment of the present invention, the interface blocks have a hook at the upper or lower end and a guide pin projecting from the hook to the support substrate, the support substrate corresponding to the shape of the hook, A latching groove for receiving the latching jaw, and a guide hole for receiving the guide pin on the bottom surface of the latching groove for aligning the position of the interface block.

According to an embodiment of the present invention, the probe card may further include fastening screws passing through the latching jaws of the interface blocks and the latching grooves of the support substrate to fasten the interface blocks to the support substrate .

According to one embodiment of the present invention, the interface blocks and the sidewalls of the through holes of the support substrate may be spaced apart from each other to prevent the support substrate from being deformed due to thermal expansion of the interface blocks.

According to an embodiment of the present invention, the interval between the interface blocks and the side walls of the through holes may be 60 to 300 mu m.

According to one embodiment of the present invention, the interface blocks are made of a plastic material, and the supporting substrate may be made of a ceramic or a metal material.

According to one embodiment of the present invention, the connecting members may be pogo pins resiliently contacting the first wires of the engraved substrates and the second wires of the circuit board.

According to one embodiment of the present invention, the connecting members are conductive pins that are bonded by solder and first wirings of the engraved substrates, and the probe card is disposed between the supporting substrate and the circuit board, And an interposer electrically connecting the connecting members of the blocks with the second wires of the circuit board.

According to an embodiment of the present invention, the probe structures each include a guide plate having a slit and having a locking step at both ends of the slit, and a guide plate coupled to a lower surface of the guide plate, A body portion inserted into the slit so as to be caught by the latching jaw and having a lower portion protruding from a lower surface of the guide plate and having both left and right ends fixed between the latching jaw and the upper surface of the fixing plate; A contact portion inserted in the slit and having a longitudinal end protruding from the upper surface of the guide plate and contacting the chip pad; a terminal portion inserted into the through hole and having a longitudinal end protruding from the lower surface of the stationary plate, And the like.

The probe card according to the present invention can cope with the size of a wafer without forming a ceramic substrate having a large area by using a sculptured substrate. In addition, since the probe card can easily fasten and replace the interface blocks on the support substrate, it is easy to manufacture and maintain the probe card.

The interface block can be accurately aligned with the support substrate by using the guide hole of the support substrate and the guide pin of the interface block. In addition, since the interface block and the support substrate are spaced apart from each other, deformation of the support substrate due to thermal expansion of the interface block can be prevented.

1 is a cross-sectional view illustrating a probe card according to an embodiment of the present invention.
FIG. 2 is an enlarged view for explaining the probe structure shown in FIG. 1. FIG.
3 is an exploded perspective view of the probe structure shown in FIG.
4 is an exploded cross-sectional view illustrating the combination of the interface block and the support substrate shown in FIG.
5 is a cross-sectional view illustrating a probe card according to another embodiment of the present invention.

Hereinafter, a probe card according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a cross-sectional view illustrating a probe card according to an embodiment of the present invention.

1, the probe card 1000 is for inspecting chip pads of a wafer to be inspected and includes probe structures 100, a plurality of engraved substrates 200, an interface block 300, 400 and a circuit board 500.

FIG. 2 is an enlarged view for explaining the probe structure shown in FIG. 1, and FIG. 3 is an exploded perspective view of the probe structure shown in FIG.

1 to 3, the probe structures 100 include a guide plate 110, a fixed plate 120, and a probe 130. The probe structure 100 has a structure in which the probe 130 is fixed between the guide plate 110 and the fixed plate 120.

The guide plate 110 has, for example, a rectangular plate shape. The shape of the guide plate 110 is not limited to a rectangular plate shape, and may have various shapes corresponding to the object to be inspected. The guide plate 110 has a first slit 112 for receiving and guiding the probe 130 at a central portion thereof. The first slit 112 is formed to penetrate in a vertical direction (e.g., a vertical direction). The guide plate 110 is provided with a plurality of first slits 112. The first slits 112 may be arranged in two rows so as to be offset from each other, or may be arranged in two rows so as to face each other. Alternatively, the first slits 112 may be arranged to correspond to the arrangement of chip pads of the object to be inspected. An inner side of the first slit 112 has a hook 112a for hooking the probe 130 thereon. The latching protrusions 112a are formed at both ends of the first slit 112 in the left and right directions (e.g., longitudinal direction). The engaging step 112a is formed at a predetermined depth from the lower surface of the guide plate 110. [

Further, the guide plate 110 has a fastening hole 114. The fastening holes 114 are provided to provide convenience in aligning the engaging positions and engaging stability in the process of engaging the guide plate 110 and the fastening plate 120. The fastening protrusion 124 of the fastening plate 120 is inserted into the fastening hole 114. Therefore, the fastening holes 114 are provided corresponding to the fixing protrusions 124. The guide plate 110 is provided with at least one fastening hole 114, and preferably, a plurality of fastening holes 114 are provided. For example, the guide plate 110 may be provided with four fastening holes 114, and the four fastening holes 114 may be provided at four corners of the guide plate 110, respectively.

Since the guide plates 110 serve to transmit electric signals, the guide plates 110 are preferably made of an insulating material for insulation between the probes 130. For example, the guide plate 110 may include a ceramic material or a silicon material, and these guide plates may be used alone or in combination.

The fixing plate 120 is coupled to the lower surface of the guide plate 110 to face each other. The fixing plate 120 has a shape corresponding to the guide plate 110. For example, since the guide plate 110 has a rectangular plate shape, the fixing plate 120 may have a rectangular plate shape. The fixed plate 120 is inserted into the first slit 112 of the guide plate 110 and presses the lower side of the guided probe 130. The probe 130 is fixed to the guide plate 110 Plate 120, as shown in FIG. The fixing plate 120 has a through hole 122 corresponding to the first slit 112 of the guide plate 110 at a central portion and a part of the probe 130 is inserted into the through hole 122. Therefore, the through-hole 122 is positioned so as to correspond to the arrangement position of the probe 130. The through holes 122 may be opened (or rectangular) so that the terminal portions 133 of the plurality of probes 130 arranged in a line are inserted into the first slits 112. That is, when the probes 130 are arranged in two rows, the fixed plate 120 may be provided with two rectangular through holes 122 corresponding to the probes 130 arranged in each column. The width of the through hole 122 is smaller than the left and right lengths of the probe 130 so that both ends of the probe 130 can be pressed.

The fixing plate 120 is made of an insulating material for insulation between the probes 130 like the guide plate 110. Examples of the insulating material include a ceramic material and a silicon material, and they may be used alone or in combination.

The fixing plate 120 is provided with fixing protrusions 124 for providing convenience such as stability of the connection, which is a position where the fixing plate 120 is engaged with the guide plate 110. The fixing protrusion 124 corresponds to the fixing hole 114 formed in the guide plate 110. That is, the fixing protrusions 124 of the fixing plate 120 are provided at the positions corresponding to the fixing holes 114. For example, in the case where four fastening holes 114 are formed in the four corners of the guide plate 110, four fastening protrusions 124 are provided at the four corners of the fastening plate 120. The fixing protrusion 124 may have a cylindrical shape, and the fixing hole 114 may have a circular shape as the fixing protrusion 134 has a cylindrical shape.

In the above description, the fastening holes 114 are provided in the guide plate 110 and the fixing protrusions 124 corresponding to the fastening holes 114 are provided in the fastening plate 120. However, in contrast to the above, the guide plate 110 is provided with the fixing protrusion 124 and the fixing plate 120 may be provided with the fixing hole 114.

The probe structure 100 may include an adhesive film 102 sandwiched between the guide plate 110 and the fixed plate 120. The adhesive film 102 is provided for coupling the fixing plate 120 and the guide plate 110. The adhesive film 102 is provided with a hole 102a at a position corresponding to the fixing protrusion 124 so that the fixing protrusion 124 can pass through. An example of the adhesive film 102 is a nonconductive film (NCF). In the case of using the nonconductive film (NCF) as the adhesive film 102, the bonding process is performed at a temperature of about 180 to 220 DEG C in a state where a nonconductive film (NCF) is interposed between the fixing plate 120 and the guide plate 110 ≪ / RTI > As described above, since the coupling process of the guide plate 110 and the fixing plate 120 is performed at a relatively low temperature, thermal deformation of the probe 130 and peripheral components can be minimized. Alternatively, another bonding means such as a double-sided tape may be used as the adhesive film 102 interposed between the guide plate 110 and the fixing plate 120.

The probe 130 directly contacts the chip pads to transfer electrical signals. The probe 130 is inserted into and guided by the first slit 112 of the guide plate 110 and is fixed between the guide plate 110 and the fixed plate 120. A plurality of probes 130 are typically provided in the probe structure 100.

The probe 130 has a thin thickness (e.g., a thin plate shape) and may include a body portion 131, a contact portion 132, and a terminal portion 133. The probe 130 may have a body 131, a contact 132, and a terminal 133 formed in a unitary structure.

The body portion 131 has a length corresponding to the first slit 112 and the width in the vertical direction is slightly larger than the depth of the engaging step 112a. The body portion 132 is inserted into the first slit 112 such that the left and right ends of the body portion 132 are caught by the engagement protrusions 112a of the first slits 112. [ That is, when the body portion 132 is inserted by a predetermined depth by the engagement protrusion 112a, the body portion 132 is no longer inserted. The upper part of the body part 132 is inserted into the first slit 112 and the lower part of the body part 132 is protruded to the lower surface of the guide plate 110. In other words, since the width of the body portion 131 in the vertical direction is greater than the depth of the latching protrusion 112a, the lower portion of the body portion 131 is inserted into the lower surface of the guide plate 110 Respectively. A lower portion of the body portion 131 protruding from the lower surface of the guide plate 110 generates a clearance between the guide plate 110 and the fixed plate 120. A coupling pressure (for example, a bonding pressure) between the guide plate 110 and the fixing plate 120 is applied to the body part 131 by the clearance of the body part 131, And the stationary plate 120, as shown in Fig. Here, since the fixing plate 120 is provided with the through holes 122 corresponding to the first slits 112, the left and right ends of the body portion 131 are pressed by the clearance. That is, both ends of the body part 131 are pressed and fixed between the engaging protrusions 112a and the upper surface of the fixing plate 120, respectively.

The contact portion 132 extends upward from the body portion 131. Accordingly, the contact portion 132 is inserted into the first slit 112 of the guide plate 110, and the terminating portion is formed to protrude from the upper surface of the guide plate 110. The contact portion 132 serves to directly contact the chip pad of the object to be inspected. The contact portion 132 is formed so as to be in elastic contact with the chip pad of the object to be inspected. For example, the contact portion 132 may be composed of the contact column portion 132a, the contact beam portion 132b, and the contact tip portion 132c. The contact pillar portion 132a has an upstanding structure extending upward from the body portion 131. [ The contact beam portion 132b extends in the form of a cantilever in the horizontal direction from the end of the contact column portion 132a. That is, the contact beam portion 132b extends in the longitudinal direction of the first slit 112 from the end portion of the contact column portion 132a. The contact tip portion 132c has an upstanding structure extending upward from the end of the contact beam portion 132b. At least the contact tip portion 132b protrudes from the upper surface of the guide plate 110 in the contact portion 132. The cantilevered contact beam portion 132b is bent by the pressure in the vertical direction generated when the contact tip portion 132c contacts the chip pad and the contact beam portion 132b is returned when the pressure is removed . Therefore, the contact portion 132 is elastically brought into contact with the chip pad.

The terminal portion 133 extends downward from the body portion 131. Therefore, the terminal portion 133 is inserted into the through hole 122 of the fixing plate 120, and the terminal portion is formed so as to protrude from the lower surface of the fixing plate 120. The terminal portion 133 serves to receive an electric signal for testing the inspection object. The terminal portion 133 is formed so as to be able to elastically contact a contact (not shown) for transferring a test electric signal. For example, the terminal portion 133 may be composed of the terminal column portion 133a, the terminal beam portion 133b, and the terminal tip portion 133c. The terminal post 133a has a standing structure extending downward from the lower end of the body 131. [ The terminal beam portion 133b extends in the form of a cantilever along the horizontal direction (for example, the longitudinal direction of the first slit 112) from the terminating end of the terminal post 133a. The terminal tip portion 133c has a standing structure extending downward from the terminal end of the terminal beam portion 133b. At least the terminal tip portion 133c of the terminal portion 133 protrudes from the bottom surface of the fixing plate 120.

The length of the terminal beam portion 133b of the probe 130 is shorter than the length of the contact beam portion 132b. As such, this is to make the contact portion 132 have a smaller elasticity than the terminal portion 133. [ Since the contact portion 132 is frequently brought into contact with the chip pad every time the inspection is performed, a relatively small elasticity is preferable because deformation can be suppressed. On the other hand, since the terminal portion 133 is used for a long period of time when the probe structure 100 is installed, it is preferable that the terminal portion 133 has a relatively high elasticity. The length of the contact beam portion 132b is longer than the length of the terminal beam portion 133b so that the contact portion 132 has a relatively smaller elasticity than the terminal portion 133. [ Alternatively, the probe 130 may have the same length as the contact beam portion 132b and the terminal beam portion 133b.

The probe 130 may have a mutual symmetrical shape with respect to the body portion 131 with respect to the contact portion 132 and the terminal portion 133. For example, the contact pillar portion 132a and the terminal pillar portion 133a are likewise located on the left side of the body portion 131, and the contact tip portion 132c and the terminal tip portion 133c are located on the same side of the body portion 131 And is located on the right side. Since the contact portion 132 and the terminal portion 133 have mutually symmetrical shapes, the contact pressure received by the contact portion 132 and the contact pressure received by the terminal portion 133 are canceled each other to suppress torsion of the probe 130 . Alternatively, the contact portion 132 and the terminal portion 133 may have a mutually asymmetric shape with respect to the body portion 131.

The probe 130 is made of a conductive material to transmit electric signals between the tester and the object to be inspected. Examples of the conductive material include a probe 130 made of a metal such as a nickel-cobalt alloy (Ni-Co), a nickel-iron alloy (Ni-Fe), a nickel-palladium alloy (Ni- Co-W). ≪ / RTI >

The probe structure 100 is shown as including three pairs of probes 130 so that one probe structure 100 can inspect three chips. That is, one probe structure 100 can test a plurality of chips. As another example, the probe structure 100 may include a pair of rows of probes 130 so that one probe structure 100 may inspect one chip.

Referring again to FIG. 1, the engraved substrates 200 are disposed below the probe structures 100, respectively. The probe structures 100 may be attached to the upper surface of the engraved substrates 200 by an attachment member (not shown). An example of the adhesive member is an anisotropic non-conductive film (NCF).

The engraved substrates 200 have a plurality of first wirings 210. The first wires 210 are connected to the probes 130 of the probe structures 100, respectively. The spacing of the first wires 210 on the upper surface of the engraved substrates 200 and the spacing of the first wires 210 on the lower surface of the engraved substrates 200 are different from each other. Specifically, the distance between the first wirings 210 on the lower surface is greater than the distance between the first wirings 210 on the upper surface. Accordingly, the engraved substrates 200 serve as a space transformer for converting a narrow pitch to a wide pitch.

4 is an exploded cross-sectional view illustrating the combination of the interface block and the support substrate shown in FIG.

Referring to FIGS. 1 and 4, the interface blocks 300 and the supporting substrate 400 are disposed below the engraved substrates 200.

The interface blocks 300 are respectively disposed under the engraved substrates 200 and have connection members 310. An example of the connecting members 310 is a pogo pin. The connection members 310 are electrically connected to the first wires 210 and the second wires 510 of the circuit board 500 described below. Since the pogo pin has elasticity, the connection members 310 can maintain contact with the first wires 210 and the second wires 510.

The connection members 310 are arranged to penetrate the interface blocks 300 up and down. For example, in a state where the interface blocks 300 are separated into upper and lower portions, the connecting members 310 are inserted into the through holes formed in the upper and lower interface blocks 300, The connection members 310 may be disposed in the interface blocks 300 by combining the interface blocks 300 of the interface blocks 300. [ As another example, by inserting the connecting members 310 into the through holes formed in the interface blocks 300 at the upper side or the lower side of the interface blocks 300, As shown in FIG. Therefore, the interval between the connection members 310 in the interface blocks 300 is constant.

Each of the interface blocks 300 has a latching jaw 320 and a guide pin 330. The latching protrusions 320 extend in the horizontal direction from both sides of the lower end of the interface block 300. The guide pin 330 protrudes upward from the latching protrusion 320 toward the support substrate 400.

The supporting board 400 has through holes 410 to which the interface blocks 300 are detachably inserted to support the interface blocks 300. The interface blocks 300 are inserted into the through holes 410 and can be easily coupled to the support substrate 400. The interface blocks 300 are removed from the through holes 410 and are easily separated from the support substrate 400. [ .

The supporting substrate 400 has a latching groove 420 and a guide hole 430. The latching groove 420 is formed on a lower surface of the through hole 410 and corresponds to the shape of the latching jaw 320 to receive the latching jaw 320. The guide hole 430 is formed on the bottom surface of the engaging groove 420 and receives the guide pin 330.

The engaging protrusion 320 and the guide pin 330 are provided at the lower end of the interface block 300 and the engaging groove 420 and the guide hole 430 are formed on the lower surface of the supporting substrate 400 The engaging protrusion 320 and the guide pin 330 are provided at the upper end of the interface block 300 and the engaging groove 420 and the guide hole 430 are formed on the support substrate 300. [ 400, respectively.

Since the guide pins 330 are accommodated in the guide holes 430 when the interface blocks 300 are inserted into the through holes 410 of the support substrate 400, And can be aligned accurately.

The interface blocks 300 and the support substrate 400 are fastened together by fastening screws 440. The fastening screws 440 fasten the fastening protrusions 320 of the interface blocks 300 and the fastening grooves 420 of the support substrate 400. Since the interface block 300 can be easily fastened to the support substrate 400, the interface block 300 can be assembled easily. Since the interface block 300 can be easily separated from the support substrate 400 by loosening the fastening screws 440 when the interface block 300 is defective, Replacement is also easy.

The interface blocks 300 are made of a plastic material and are manufactured by inserting the connecting members 310 after being molded by an injection method. Since the interface blocks 300 are formed by injection molding of the plastic material, the interface blocks 300 are easily manufactured, and the interface blocks 300 can be manufactured rapidly in a large amount. The thermal expansion coefficient of the interface blocks 300 is about 15 to 50 占 퐉 / m 占 폚.

The support substrate 400 may include a ceramic or a metal material. The metal material may include an iron alloy material. The iron alloys include iron-nickel alloys (invar), iron-nickel-cobalt alloys (super invar), iron-cobalt-nickel alloys (stainless invar) And the like. The thermal expansion coefficient of the support substrate 400 may be about 4 to 12 占 퐉 / m 占 폚.

The interface blocks 300 and the support substrate 400 are spaced apart from each other. Specifically, the interface blocks 300 and the sidewalls of the through holes 410 are spaced apart from each other. It is possible to prevent the support board 400 from being deformed due to the thermal expansion of the interface blocks 300 during the high temperature test of the probe card 1000.

The interface blocks 300 and the sidewalls of the through holes 410 may be spaced apart from each other by a predetermined distance D. Specifically, the distance D may be calculated by summing up the thermal expansion amount of the interface block 300, the machining tolerance and the assembly tolerance of the interface block 300 and the support substrate 400. The thermal expansion amount of the interface block 300 varies depending on the material of the interface block 300 and the longest transverse length of the interface block 300. In addition, the machining tolerance and the assembly tolerance may be changed depending on the material of the interface block 300 and the support substrate 400.

When the distance D between the interface blocks 300 and the sidewalls of the through holes 410 is less than about 60 탆, the processing tolerances and assembly tolerances are small, It is difficult to process and assemble the interface block 300 and the interface block 300 is thermally expanded to make contact with the support substrate 400 because the gap D is too narrow. Accordingly, the supporting substrate 400 can be deformed. When the distance D between the interface blocks 300 and the sidewalls of the through holes 410 is greater than about 300 탆, the processing tolerances and assembly tolerances are large, It is difficult to precisely align the interface block 300 with the support substrate 400 because the interval D is too wide and it is difficult to precisely align the interface block 300 with the support substrate 400. Due to the thermal expansion of the interface block 300, A defective contact may occur between the pogo pins 310 of the chip board 300 and the first wiring 210 of the chip board 200. Therefore, the distance D between the interface blocks 300 and the sidewalls of the through-holes 410 may be about 60 to 300 占 퐉.

For example, if the longest cross-sectional length of the interface block 300 with a thermal expansion coefficient of about 15 to 50 占 퐉 / m 占 폚 is about 8 to 13 mm and the inspection for the chip is performed at a temperature of about 80 占 폚, The thermal expansion coefficient of the interface block 300, which is calculated by multiplying the thermal expansion coefficient of the interface block 300 by the temperature change amount and the longest transverse section length, is about 10 to 50 μm. The processing tolerances of the interface blocks 300 and the support substrate 400 are about 30 to 40 mu m and the assembly tolerance is about 20 to 30 mu m. Therefore, it is more preferable that the interval D is about 60 to 120 mu m.

Meanwhile, the engraved substrates 200 may be attached to the supporting substrate 400 by an attaching member. An example of the attachment member is an anisotropic nonconductive film. After the engraved substrates 200 are attached to the known substrate 400, the interface blocks 300 may be inserted into the through holes 410 from the bottom of the supporting substrate 400.

As another example, the engraved substrates 200 may be attached to the interface blocks 300, respectively. At this time, the size of the engraved substrates 200 and the size of the interface blocks 300 are the same, and the engraved substrates 200 and the interface blocks 300 are separated from the lower portion of the supporting substrate 400, (Not shown).

Referring again to FIG. 1, the circuit board 500 has a flat plate shape and is disposed below the supporting board 400. The circuit board 500 has second wires 510 electrically connected to the connection members 310 of the interface blocks 300.

On the other hand, a connection terminal is formed along the edge of the upper surface of the lower surface of the circuit board 500 to connect with the pogo pin of the test head, and the connection terminal is electrically connected to the second wires 510.

Although not shown, a reinforcing plate may be provided on the lower surface of the circuit board 500. The reinforcing plate reinforces the circuit board 500 to prevent warping or distortion of the circuit board 500. The reinforcing plate is made of a metal material. Examples of the metal material include aluminum, an aluminum alloy, iron, and an iron alloy.

As described above, the probe card 1000 may correspond to the size of the wafer by applying the piece substrates 200. Therefore, since a large-area ceramic substrate is not required, the probe card 1000 can be easily manufactured.

Also, since the probe card 1000 can easily fasten and replace the interface block 300 on the support substrate 400, it is easy to manufacture and maintain the probe card 1000.

5 is a cross-sectional view illustrating a probe card according to another embodiment of the present invention.

5, the probe card 2000 is used to inspect chip pads of a wafer to be inspected and includes probe structures 1100, engraved substrates 1200, interface blocks 1300, 1400, an interposer 1500, and a circuit board 1600.

The connecting member 1310 of the interface block 1300 has a conductive pin shape and the connecting member 1310 and the first wires 1210 of the engraved substrates 1200 are bonded by the solder, The engraved substrates 1200, the interface blocks 1300, the supporting substrate 1400, and the interposer 1500 are disposed between the substrate 1100 and the circuit board 1600, And the circuit board 1600 are similar to the probe structures 100, the engraved substrates 200, the interface blocks 300, the supporting substrate 400, and the circuit substrate 500 with reference to FIGS. Is substantially the same as the description of FIG.

Since the connecting member 1310 has a conductive pin shape, the connection of the engraved substrates 1200 with the first wires 1210 may be poor. Since the connecting members 1310 and the first wires 1210 of the engraved substrates 1200 are bonded by the solder, the connecting members 1310 and the first wires 1210 can be stably connected.

Since the connecting member 1310 of the interface block 1300 has a conductive pin shape, contact with the second wires 1610 of the circuit board 1600 may be poor. The interposer 1500 is disposed between the support substrate 1400 and the circuit board 1600 and is connected to the connection member 1310 of the interface block 1300 and the second And electrically connects the connection member 1310 and the second wires 1610 by press-connecting with the wires 1610.

Specifically, the interposer 1500 includes connectors 1510 and a support member 1520 for supporting the connectors 1510.

The connectors 1510 are made of a conductive elastic material. Due to the elastic force of the connecting bodies 1510, the connecting bodies 1510 can contact the connecting member 1310 and the second wires 1610. Accordingly, the connection members 1510 electrically connect the connection member 1310 and the second wiring 1610.

The support member 1520 has a flat plate shape and supports the connecting bodies 1510. Therefore, the connecting bodies 1510 can be kept in contact with the connecting member 1310 and the second wiring 1610. Since the support member 1520 is made of an insulating material, it is possible to prevent a short circuit between the connection bodies 1510.

The connecting member 1310 may further include a head having a larger area than the connecting member 1310 at one end. When the connecting member 1310 and the interface block 1300 are assembled, the connecting member 1310 can be easily assembled to the interface block 1300 because the head serves as a latching jaw.

Also, the area of contact of the connection member 1310 with the connectors 1510 of the interposer 1500 is increased due to the head. Therefore, the connection member 1310 can stably contact the connection bodies 1510 of the interposer 1500. [

As described above, the probe card 2000 may correspond to the size of the wafer by applying the engraved substrates 1200. Therefore, since a large-area ceramic substrate is unnecessary, the probe card 2000 can be easily manufactured.

In addition, since the probe card 2000 can easily fasten and replace the interface block 1300 to the support substrate 1400, the probe card 2000 can be easily manufactured and maintained.

The probe card according to the present invention can cope with the size of a wafer without forming a ceramic substrate having a large area by using a sculptured substrate. In addition, since the probe card can easily fasten and replace the interface blocks on the support substrate, it is easy to manufacture and maintain the probe card.

The interface block can be accurately aligned with the support substrate by using the guide hole of the support substrate and the guide pin of the interface block. In addition, since the interface block and the support substrate are spaced apart from each other, deformation of the support substrate due to thermal expansion of the interface block can be prevented.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

1000: probe card 100: probe structure
110: guide plate 120: stationary plate
130: probe 200:
210: first wiring 300: interface block
310: connecting member 320:
330: guide pin 400: support substrate
410: through hole 420: latching groove 17
430: guide hole 500: circuit board
510: second wiring

Claims (9)

Probe structures having probes for transmitting and receiving electrical signals to chip pads of a test object through physical contact;
A plurality of scribed substrates disposed on the bottom of the probe structures, each scribed on the upper and lower surfaces, the scribed substrates being electrically connected to the probes;
Interface blocks disposed at the bottom of the engraved substrates respectively and having connection members connected to the wires and having the same interval at the upper and lower surfaces;
A support substrate having through holes through which the interface blocks are removably inserted, the support substrate supporting the interface blocks; And
And a circuit board disposed at a lower portion of the support substrate and having wiring lines electrically connected to the connection members of the interface blocks,
Each of the probe structures includes:
A guide plate having a slit and having engaging protrusions at both ends of the slit;
A fixing plate coupled to a lower surface of the guide plate and having a through hole corresponding to the slit; And
A body portion inserted into the slit so as to be caught by the latching jaw, a lower portion protruding from the lower surface of the guide plate and having both left and right ends fixed between the latching jaw and the upper surface of the fixing plate, A contact portion that protrudes from the upper surface of the guide plate and contacts the chip pad; and a terminal portion inserted in the through hole of the fixing plate and having a terminal portion protruding from the lower surface of the fixed plate, Wherein the probe card comprises a probe card. [2] The apparatus of claim 1, wherein the interface blocks have a latching jaw at an upper or lower end and a guide pin protruding from the latching jaw toward the support substrate,
Wherein the supporting substrate has a latching groove corresponding to the shape of the latching jaw and accommodating the latching jaw and a guide hole for accommodating the guide pin on the bottom surface of the latching groove for aligning the position of the interface block Probe card. The probe card according to claim 2, further comprising fastening screws passing through the fastening jaws of the interface blocks and the fastening grooves of the support substrate to fasten the interface blocks and the support substrate. 3. The probe card of claim 2, wherein the sidewalls of the interface blocks and the through holes are spaced from each other to prevent deformation of the support substrate due to thermal expansion of the interface blocks. 5. The probe card of claim 4, wherein a distance between the interface blocks and the side walls of the through holes is 60 to 300 占 퐉. The probe card according to claim 1, wherein the interface blocks are made of a plastic material, and the support substrate is made of ceramic or metal. The probe card according to claim 1, wherein the connecting members are pogo pins resiliently contacting the first wires of the piece substrates and the second wires of the circuit board. The conductive pin according to claim 1, wherein the connecting members are conductive pins bonded by solder and first wires of the engraved substrates,
Further comprising an interposer disposed between the support substrate and the circuit board and electrically connecting the connection members of the interface blocks to the second wires of the circuit board. delete
KR1020100003060A 2010-01-13 2010-01-13 Probe card KR101674135B1 (en)

Priority Applications (2)

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KR1020100003060A KR101674135B1 (en) 2010-01-13 2010-01-13 Probe card
PCT/KR2010/009143 WO2011087215A2 (en) 2010-01-13 2010-12-21 Probe card

Applications Claiming Priority (1)

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KR1020100003060A KR101674135B1 (en) 2010-01-13 2010-01-13 Probe card

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KR101785428B1 (en) 2016-04-21 2017-10-16 (주) 마이크로프랜드 Test Socket of Semiconductor Device
IT201600079679A1 (en) * 2016-07-28 2018-01-28 Technoprobe Spa Measurement board for electronic devices
IT201700017061A1 (en) * 2017-02-15 2018-08-15 Technoprobe Spa Improved measurement card for high frequency applications
CN107272046B (en) * 2017-06-09 2023-10-03 东莞中子科学中心 Detector for measuring beam profile
KR102139584B1 (en) * 2019-03-07 2020-07-30 (주)티에스이 Socket for testing semiconductor device
KR102342805B1 (en) * 2019-12-26 2021-12-23 (주)포인트엔지니어링 Probe card
KR102361396B1 (en) * 2020-04-22 2022-02-10 (주)포인트엔지니어링 Anodic oxide structure and probe card comprising thereof
KR102388030B1 (en) * 2020-07-15 2022-04-20 (주)엠투엔 Probe pin, method for manufaturing the same and probe card including the same
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WO2011087215A2 (en) 2011-07-21
WO2011087215A3 (en) 2011-11-10

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