JP6725226B2 - Display panel - Google Patents

Description

One embodiment of the present invention relates to a display panel.

Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. Alternatively, one embodiment of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, as a technical field of one embodiment of the present invention disclosed more specifically in this specification, a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, a driving method thereof, or a manufacturing method thereof, Can be mentioned as an example.

A liquid crystal display device having a configuration in which a condensing unit and a pixel electrode are provided on the same surface side of a substrate, and a region for transmitting visible light of the pixel electrode is overlapped on the optical axis of the condensing unit, There is known a liquid crystal display device having a configuration in which an anisotropic light converging means having a light converging direction Y is used and the non-light converging direction Y and the major axis direction of a region of a pixel electrode that transmits visible light are aligned. (Patent Document 1).

JP, 2011-191750, A

An object of one embodiment of the present invention is to provide a highly reliable display panel. Alternatively, it is an object of one embodiment of the present invention to provide a novel display panel.

Note that the description of these problems does not prevent the existence of other problems. Note that one embodiment of the present invention does not need to solve all of these problems. It should be noted that problems other than these are obvious from the description of the specification, drawings, claims, etc., and problems other than these can be extracted from the description of the specification, drawings, claims, etc. Is.

(1) One embodiment of the present invention is a display panel including a signal line and a pixel.

The pixel is electrically connected to the signal line, and the pixel has a first display element, a first conductive film, a second conductive film, a first insulating film, a second insulating film, and a pixel circuit. And a second display element.

The first display element includes at least a layer containing a liquid crystal material.

The first conductive film is electrically connected to the first display element, the second conductive film has a region overlapping with the first conductive film, and the second insulating film is the second conductive film and the first conductive film. The pixel circuit is electrically connected to the second conductive film, and the second display element is electrically connected to the pixel circuit.

The first insulating film has a region sandwiched between the first conductive film and a layer containing a liquid crystal material, and the first insulating film has an opening in a region which does not overlap with the layer containing a liquid crystal material. The second insulating film has an opening, the second conductive film is electrically connected to the first conductive film in the opening, and the pixel circuit is electrically connected to the signal line.

(2) One embodiment of the present invention is the above display panel, in which the pixel circuit includes a switch. The switch includes a transistor, and the transistor includes an oxide semiconductor.

(3) Further, one embodiment of the present invention is the above-described display panel, in which the second display element has a function of displaying in the same direction as the display direction of the first display element.

(4) One embodiment of the present invention is the above display panel, wherein the second display element has a function of displaying in a region surrounded by a region in which the first display element displays.

(5) One embodiment of the present invention is the above display panel, in which the first display element has a reflective film and a function of controlling the intensity of reflected light.

The reflective film has a function of reflecting incident light, and the reflective film has an opening. The second display element has a function of emitting light toward the opening.

(6) Further, one embodiment of the present invention is the above display panel including the above pixel, a group of a plurality of pixels, another group of a plurality of pixels, and a scan line.

A group of a plurality of pixels includes the above pixels and is arranged in the row direction. Another group of a plurality of pixels includes the above pixels and is arranged in a column direction intersecting the row direction.

The scan line is electrically connected to a plurality of pixels arranged in the row direction.

Another group of a plurality of pixels arranged in the column direction is electrically connected to the signal line.

Another pixel adjacent to the one pixel in the row direction or the column direction has an opening portion arranged in the other pixel differently from the arrangement of the opening portion with respect to the one pixel.

Note that in the drawings attached to this specification, the constituent elements are classified by function and the block diagram is shown as a block independent from each other, but it is difficult to completely separate actual constituent elements by function. It is possible that a component is involved in more than one function.

In this specification, the names of source and drain of a transistor are switched depending on the polarity of the transistor and the level of potential applied to each terminal. Generally, in an n-channel transistor, a terminal to which a low potential is applied is called a source and a terminal to which a high potential is applied is called a drain. In addition, in a p-channel transistor, a terminal to which a low potential is applied is called a drain and a terminal to which a high potential is applied is called a source. In this specification, for convenience, the connection relationship of the transistors may be described assuming that the source and the drain are fixed, but in reality, the names of the source and the drain are interchanged in accordance with the above potential relationship. ..

In this specification, the source of a transistor means a source region which is part of a semiconductor film functioning as an active layer or a source electrode connected to the semiconductor film. Similarly, the drain of a transistor means a drain region which is a part of the semiconductor film or a drain electrode connected to the semiconductor film. The gate means a gate electrode.

In this specification, a state in which transistors are connected in series means a state in which only one of a source and a drain of a first transistor is connected to only one of a source and a drain of a second transistor, for example. To do. In addition, the state in which the transistors are connected in parallel means that one of the source and the drain of the first transistor is connected to one of the source and the drain of the second transistor and the other of the source and the drain of the first transistor is It means a state of being connected to the other of the source and the drain of the second transistor.

In this specification, a connection means an electrical connection and corresponds to a state in which current, voltage, or potential can be supplied or transmitted. Therefore, the state of being connected does not necessarily mean a state of being directly connected, and a wiring, a resistor, a diode, a transistor, or the like may be supplied so that current, voltage, or potential can be supplied or transmitted. The state of being indirectly connected via a circuit element is also included in the category.

In this specification, even when components that are independent on the circuit diagram are connected to each other, in reality, for example, when one portion of a wiring functions as an electrode, It may also have the functions of the components of. In this specification, the term “connection” is included in the category even when one conductive film has functions of a plurality of components.

In addition, in this specification, one of a first electrode and a second electrode of a transistor is a source electrode and the other is a drain electrode.

According to one embodiment of the present invention, a novel display panel which is highly convenient or reliable can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have to have all of these effects. It should be noted that the effects other than these are apparent from the description of the specification, drawings, claims, etc., and it is possible to extract other effects from the description of the specification, drawings, claims, etc. Is.

6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. FIG. 3 is a circuit diagram illustrating a pixel circuit according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6A and 6B are diagrams illustrating a structure of a display panel according to an embodiment. 6 is a flow diagram illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6 is a flow diagram illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A to 6C are diagrams illustrating a method for manufacturing a display panel according to an embodiment. 6A and 6B each illustrate a structure of a transistor of an embodiment. 6A and 6B each illustrate a structure of a transistor of an embodiment. FIG. 3 illustrates a structure of an input/output device according to an embodiment. 3A and 3B are a block diagram and a perspective view illustrating a structure of an information processing device according to an embodiment. 3A and 3B are a block diagram and a circuit diagram illustrating a structure of a display portion according to an embodiment. 6 is a flowchart illustrating a program according to the embodiment. FIG. 4 is a schematic diagram illustrating image information according to the embodiment. 3A and 3B are a cross-sectional view and a circuit diagram illustrating a structure of a semiconductor device according to an embodiment. FIG. 3 is a block diagram illustrating a structure of a CPU according to an embodiment. FIG. 6 is a circuit diagram illustrating a structure of a memory element according to an embodiment. 6A to 6C each illustrate a structure of an electronic device according to an embodiment.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously modified without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that, in the structure of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and repeated description thereof is omitted.

(Embodiment 1)
In this embodiment, the structure of the display panel of one embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a diagram illustrating a structure of a display panel 700 of one embodiment of the present invention. FIG. 1A is a bottom view of the display panel 700 of one embodiment of the present invention. 1B-1 is a bottom view illustrating part of FIG. 1A, and FIG. 1B-2 omits part of the structure illustrated in FIG. 1B-1. It is a bottom view explaining.

2A and 2B are diagrams illustrating a structure of the display panel 700 of one embodiment of the present invention. 2A is a cross-sectional view taken along the line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, X11-X12 in FIG. 1A. 2B is a cross-sectional view illustrating part of the structure of the display panel, and FIG. 2C is a cross-sectional view illustrating part of the structure of the display panel.

FIG. 3 illustrates a structure of the display panel 700 of one embodiment of the present invention. FIG. 3 is a circuit diagram of the pixel circuit 530(i,j) and the pixel circuit 530(i,j+1) that can be used for the pixel circuit included in the display panel 700 of one embodiment of the present invention.

4A and 4B are diagrams illustrating a structure of the display panel 700 of one embodiment of the present invention. FIG. 4A is a block diagram illustrating an arrangement of pixels, wirings, and the like that can be used in the display panel 700 of one embodiment of the present invention. 4B-1 and 4B-2 are schematic diagrams illustrating the arrangement of the openings 751H that can be used in the display panel 700 of one embodiment of the present invention.

<Configuration example of display panel 1. >
The display panel 700 described in this embodiment includes the signal line S1(j) and the pixel 702(i,j) (see FIGS. 1B-1 and 1B-2).

The pixel 702(i,j) is electrically connected to the signal line S1(j).

The pixel 702(i,j) includes a first display element 750(i,j), a first conductive film, a second conductive film, a first insulating film 501A, and a second insulating film 501C. And a pixel circuit 530 (i, j) and a second display element 550 (i, j) (see FIGS. 2A and 3).

The first display element 750(i,j) includes a layer 753 containing at least a liquid crystal material.

The first conductive film is electrically connected to the first display element 750(i,j) (see FIG. 2A). For example, the first conductive film can be used for the first electrode 751(i,j) of the first display element 750(i,j).

The second conductive film has a region overlapping with the first conductive film. For example, the second conductive film can be used for the conductive film 512B which functions as a source electrode or a drain electrode of a transistor which can be used for the switch SW1.

The first insulating film 501A includes a region sandwiched between the first conductive film and the layer 753 containing a liquid crystal material (see FIG. 2A). Further, the first insulating film 501A has an opening in a region which does not overlap with the layer 753 containing a liquid crystal material. Specifically, the first insulating film 501A has an opening 594B and an opening 594C. In other words, the first insulating film 501A does not have an opening in a region overlapping with the pixel 702(i,j).

The second insulating film 501C includes a region sandwiched between the second conductive film and the first conductive film.

The pixel circuit 530(i,j) is electrically connected to the second conductive film. For example, a transistor including the second conductive film for the conductive film 512B which functions as a source electrode or a drain electrode can be used for the switch SW1 of the pixel circuit 530(i,j) (FIGS. 2A and 3). reference).

The second display element 550(i,j) is electrically connected to the pixel circuit 530(i,j).

A first connection portion 591A is provided in the second insulating film 501C (see FIG. 2A).

The second conductive film is electrically connected to the first conductive film at the first connection portion 591A. For example, the conductive film 512B is electrically connected to the first electrode 751(i,j) which also serves as the first conductive film.

The pixel circuit 530(i,j) is electrically connected to the signal line S1(j) (see FIG. 3). Note that the conductive film 512A is electrically connected to the signal line S1(j) (see FIGS. 2A and 3).

The first electrode 751(i,j) has a side end portion embedded in the second insulating film 501C.

The pixel circuit 530(i,j) of the display panel described in this embodiment includes the switch SW1. The switch SW1 includes a transistor, and the transistor includes an oxide semiconductor.

The second display element 550(i,j) of the display panel described in this embodiment has a function of displaying in the same direction as the display direction of the first display element 750(i,j). Equipped with. For example, the direction in which the first display element 750(i,j) displays by controlling the intensity of external light is shown by a dashed arrow in the figure. The direction in which the second display element 550(i,j) displays is indicated by a solid arrow in the figure (see FIG. 2A).

In addition, the second display element 550(i,j) of the display panel described in this embodiment displays in a region surrounded by a region where the first display element 750(i,j) displays. It has a function (see FIG. 4B-1 or FIG. 4B-2). Note that the first display element 750(i,j) displays in a region overlapping with the first electrode 751(i,j), and the second display element 550(i,j) has an opening 751H. Display in the overlapping area.

Further, the first display element 750(i,j) of the display panel described in this embodiment has a reflective film having a function of reflecting incident light, a function of controlling the intensity of reflected light, and Have. The reflective film has an opening 751H. Note that, for example, the first conductive film, the first electrode 751(i,j), or the like can be used for the reflective film of the first display element 750(i,j).

Further, the second display element 550(i,j) has a function of emitting light toward the opening 751H.

The display panel described in this embodiment includes a pixel 702(i,j), a group of pixels 702(i,1) to 702(i,n), and another group of pixels 702(1, j) to the pixel 702(m, j) and the scan line G1(i) (see FIG. 4A). In addition, i is an integer of 1 or more and m or less, j is an integer of 1 or more and n or less, and m and n are integers of 1 or more.

The display panel described in this embodiment includes the scan line G2(i), the wiring CSCOM, and the wiring ANO.

The group of pixels 702(i,1) to 702(i,n) includes the pixel 702(i,j) and is arranged in the row direction (direction shown by arrow R in the figure).

Further, another group of pixels 702(1,j) to 702(m,j) includes the pixel 702(i,j), and extends in the column direction intersecting the row direction (direction indicated by arrow C in the figure). It is installed in.

The scan line G1(i) is electrically connected to the group of pixels 702(i, 1) to 702(i, n) arranged in the row direction.

Another group of pixels 702(1,j) to 702(m,j) arranged in the column direction are electrically connected to the signal line S1(j).

For example, the pixel 702(i,j+1) adjacent to the pixel 702(i,j) in the row direction is arranged in the pixel 702(i,j+1) differently from the arrangement of the opening 751H with respect to the pixel 702(i,j). (See FIG. 4(B-1)).

For example, the pixel 702(i+1, j) adjacent to the pixel 702(i, j) in the column direction is arranged in the pixel 702(i+1, j) differently from the arrangement of the opening 751H for the pixel 702(i, j). (See FIG. 4B-2). Note that, for example, the first electrode 751(i,j) can be used for the reflective film.

The display panel of one embodiment of the present invention includes a first display element, a first conductive film which is electrically connected to the first display element, and a second overlapping area which overlaps with the first conductive film. A conductive film, an insulating film having a region sandwiched between the second conductive film and the first conductive film, a pixel circuit electrically connected to the second conductive film, and a pixel circuit electrically connected The second insulating film is provided with an opening, and the second conductive film is electrically connected to the first conductive film through the opening.

Accordingly, for example, by using the pixel circuit that can be formed by using the same process, the first display element, and the second display element that performs display using a method different from that of the first display element, Can be driven. As a result, it is possible to provide a novel display panel that is highly convenient or reliable.

In the display panel of one embodiment of the present invention, the first display element and the second display element can be driven independently. For example, the power consumption of the display panel can be suppressed by driving only the first display element in a very bright environment such as outdoor daylight. Further, in a bright environment such as under cloudy weather outdoors or under an indoor fluorescent lamp, by driving the first display element and the second display element, display with high display quality can be performed. In a dark environment such as outdoors at night or in a room without lighting, it is not required that the display on the display panel have high brightness. Therefore, by driving only the second display element, power consumption is suppressed and display quality is reduced. A high display can be performed.

The display panel described in this embodiment includes the terminal 519B and the conductive film 511B (see FIG. 2A).

The second insulating film 501C includes a region sandwiched between the terminal 519B and the conductive film 511B. In addition, the second insulating film 501C is provided with a third connection portion 591B.

The terminal 519B is electrically connected to the conductive film 511B at the third connection portion 591B. The conductive film 511B is electrically connected to the pixel circuit 530(i,j). Note that, for example, when the first electrode 751(i,j) or the first conductive film is used for the reflective film, the surface functioning as a contact of the terminal 519B is the first electrode 751(i,j) The first display element 750(i,j) faces the same direction as the surface facing the light entering.

Accordingly, power or a signal can be supplied to the pixel circuit through the terminal. As a result, it is possible to provide a novel display panel that is highly convenient or reliable.

In the display panel described in this embodiment, the first insulating film 501A does not have an opening in a region where the first insulating film 501A overlaps with the pixel 702(i,j); It is possible to prevent impurities such as water from entering the second display element 550(i,j). As a result, a highly reliable display panel can be provided.

The flexible printed circuit board FPC1 is electrically connected to the terminal 519B through the anisotropic conductive connection layer ACF1 provided in the opening 594B.

The first display element 750(i,j) of the display panel described in this embodiment includes a layer 753 containing a liquid crystal material, a first electrode 751(i,j), and a second electrode 752. , Is provided. Note that the second electrode 752 is arranged so that an electric field for controlling alignment of the liquid crystal material is formed between the second electrode 752 and the first electrode 751(i,j).

The display panel described in this embodiment includes an alignment film AF1 and an alignment film AF2. The alignment film AF2 is provided so that the layer 753 containing a liquid crystal material is sandwiched between the alignment film AF2 and the alignment film AF1.

In addition, the second display element 550(i,j) of the display panel described in this embodiment includes the third electrode 551(i,j), the fourth electrode 552, and a light-emitting organic compound. And a containing layer 553(j).

The fourth electrode 552 has a region overlapping with the third electrode 551(i,j). The layer 553(j) containing a light-emitting organic compound is provided between the third electrode 551(i,j) and the fourth electrode 552. Then, the third electrode 551(i,j) is electrically connected to the pixel circuit 530(i,j) at the second connection portion 592.

The pixel 702(i,j) of the display panel described in this embodiment includes the coloring film CF1, the light-blocking film BM, the insulating film 771, and the functional film 770P.

The coloring film CF1 includes a region overlapping with the first display element 750(i,j). The light-blocking film BM has an opening in a region overlapping with the first display element 750(i,j).

The insulating film 771 is provided between the colored film CF1 and the layer 753 containing a liquid crystal material or between the light-blocking film BM and the layer 753 containing a liquid crystal material. Thereby, the unevenness based on the thickness of the colored film CF1 can be flattened. Alternatively, diffusion of impurities from the light-blocking film BM, the coloring film CF1, or the like into the layer 753 containing a liquid crystal material can be suppressed.

The functional film 770P includes a region overlapping with the first display element 750(i,j). The functional film 770P is provided so as to sandwich the substrate 770 between the functional film 770P and the first display element 750(i,j).

The display panel described in this embodiment includes a substrate 570, a substrate 770, and a functional layer 520.

The substrate 770 has a region overlapping with the substrate 570. The functional layer 520 is disposed between the substrate 570 and the substrate 770.

The functional layer 520 includes a pixel circuit 530(i,j) including the switch SW1, a second display element 550(i,j), an insulating film 521, and an insulating film 528. Further, the functional layer 520 includes an insulating film 518 and an insulating film 516.

The insulating film 521 is provided between the pixel circuit 530(i,j) and the second display element 550(i,j).

The insulating film 528 is provided between the insulating film 521 and the substrate 570 and has an opening in a region overlapping with the second display element 550(i,j). The insulating film 528 formed along the periphery of the third electrode 551(i,j) can prevent a short circuit between the third electrode 551(i,j) and the fourth electrode 552.

The insulating film 518 includes a region provided between the insulating film 521 and the pixel circuit 530(i,j), and the insulating film 516 is provided between the insulating film 518 and the pixel circuit 530(i,j). Area.

The display panel described in this embodiment includes the bonding layer 505, the sealing material 705, and the structure KB1.

The bonding layer 505 is provided between the functional layer 520 and the substrate 570 and has a function of bonding the functional layer 520 and the substrate 570 together.

The sealing material 705 is provided between the functional layer 520 and the substrate 770 and has a function of bonding the functional layer 520 and the substrate 770 together.

The structure KB1 has a function of providing a predetermined gap between the functional layer 520 and the substrate 770.

The display panel described in this embodiment includes the terminal 519C, the conductive film 511C, and the conductor CP.

The second insulating film 501C includes a region sandwiched between the terminal 519C and the conductive film 511C. Further, the second insulating film 501C is provided with a third connection portion 591C.

The terminal 519C is electrically connected to the conductive film 511C at the third connection portion 591C. The conductive film 511C is electrically connected to the pixel circuit 530(i,j).

The conductor CP is sandwiched between the terminal 519C and the second electrode 752 and electrically connects the terminal 519C and the second electrode 752. For example, conductive particles can be used for the conductor CP.

In addition, the display panel described in this embodiment includes a driver circuit GD and a driver circuit SD (see FIGS. 1A and 4A).

The driver circuit GD is electrically connected to the scan line G1(i). The drive circuit GD includes, for example, a transistor MD. Specifically, a transistor including a semiconductor film which can be formed in the same step as the transistor included in the pixel circuit 530(i,j) can be used for the transistor MD (FIGS. 2A and 2C). )reference).

The drive circuit SD is electrically connected to the signal line S1(j). The driver circuit SD is electrically connected to a terminal which can be formed in the same step as the terminal 519B or the terminal 519C by using a conductive material, for example.

The individual elements constituting the display panel will be described below. Note that these configurations cannot be clearly separated, and one configuration may double as another configuration or may include part of another configuration.

For example, the first conductive film can be used for the first electrode 751(i,j). Further, the first conductive film can be used as the reflective film.

Further, the second conductive film can be used as the conductive film 512B having a function of a source electrode or a drain electrode of a transistor.

<<Configuration Example 1. 》
The display panel of one embodiment of the present invention includes the substrate 570, the substrate 770, the structure KB1 sealing material 705, or the bonding layer 505.

In addition, the display panel of one embodiment of the present invention includes the functional layer 520, the insulating film 521, and the insulating film 528.

Further, the display panel of one embodiment of the present invention includes the signal line S1(j), the signal line S2(j), the scan line G1(i), the scan line G2(i), the wiring CSCOM, and the wiring ANO.

In addition, the display panel of one embodiment of the present invention includes the first conductive film or the second conductive film.

Further, the display panel of one embodiment of the present invention includes the terminal 519B, the terminal 519C, the conductive film 511B, or the conductive film 511C.

The display panel of one embodiment of the present invention includes the pixel circuit 530(i,j) and the switch SW1.

In addition, a display panel of one embodiment of the present invention includes a first display element 750(i,j), a first electrode 751(i,j), a reflective film, an opening 751H, a layer 753 containing a liquid crystal material, Two electrodes 752.

In addition, the display panel of one embodiment of the present invention includes an alignment film AF1, an alignment film AF2, a coloring film CF1, a light-blocking film BM, an insulating film 771, and a functional film 770P.

In the display panel of one embodiment of the present invention, the second display element 550(i,j), the third electrode 551(i,j), the fourth electrode 552, or the layer 553 containing a light-emitting organic compound ( j).

In addition, the display panel of one embodiment of the present invention includes the second insulating film 501C.

In addition, the display panel of one embodiment of the present invention includes the driver circuit GD or the driver circuit SD.

<Substrate 570>
A material having heat resistance high enough to withstand heat treatment in a manufacturing process can be used for the substrate 570 or the like. Specifically, a non-alkali glass having a thickness of 0.7 mm can be used.

For example, the areas of the sixth generation (1500 mm×1850 mm), the seventh generation (1870 mm×2200 mm), the eighth generation (2200 mm×2400 mm), the ninth generation (2400 mm×2800 mm), the tenth generation (2950 mm×3400 mm), etc. A large glass substrate can be used as the substrate 570 or the like. Thereby, a large-sized display device can be manufactured.

An organic material, an inorganic material, a composite material of an organic material and an inorganic material, or the like can be used for the substrate 570 or the like. For example, an inorganic material such as glass, ceramics, or metal can be used for the substrate 570 or the like.

Specifically, non-alkali glass, soda-lime glass, potash glass, crystal glass, quartz, sapphire, or the like can be used for the substrate 570 or the like. Specifically, an inorganic oxide film, an inorganic nitride film, an inorganic oxynitride film, or the like can be used for the substrate 570 or the like. For example, silicon oxide, silicon nitride, silicon oxynitride, an alumina film, or the like can be used for the substrate 570 or the like. SUS, aluminum, or the like can be used for the substrate 570 or the like.

For example, a single crystal semiconductor substrate formed of silicon or silicon carbide, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, an SOI substrate, or the like can be used for the substrate 570 or the like. Accordingly, the semiconductor element can be formed on the substrate 570 or the like.

For example, an organic material such as resin, resin film, or plastic can be used for the substrate 570 or the like. Specifically, a resin film or a resin plate of polyester, polyolefin, polyamide, polyimide, polycarbonate, acrylic resin, or the like can be used for the substrate 570 or the like.

For example, a metal plate, a thin glass plate, or a composite material in which a film of an inorganic material or the like is attached to a resin film or the like can be used for the substrate 570 or the like. For example, a composite material in which a fibrous or particulate metal, glass, an inorganic material, or the like is dispersed in a resin film can be used for the substrate 570 or the like. For example, a composite material in which a fibrous or particulate resin, an organic material, or the like is dispersed in an inorganic material can be used for the substrate 570 or the like.

Further, a single-layer material or a material in which a plurality of layers is stacked can be used for the substrate 570 or the like. For example, a material in which a base material and an insulating film or the like which prevents diffusion of impurities contained in the base material are stacked can be used for the substrate 570 and the like. Specifically, a material in which one or a plurality of films selected from a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, or the like for preventing diffusion of glass and impurities contained in glass is stacked is used for the substrate 570 or the like. be able to. Alternatively, a material in which a resin and a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like which prevent diffusion of impurities passing through the resin are stacked can be used for the substrate 570 or the like.

Specifically, a resin film such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or acrylic resin, a resin plate, or a laminate can be used for the substrate 570 or the like.

Specifically, a material containing a resin having a siloxane bond such as polyester, polyolefin, polyamide (nylon, aramid, or the like), polyimide, polycarbonate, polyurethane, acrylic resin, epoxy resin, or silicone can be used for the substrate 570 or the like.

Specifically, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), acrylic, or the like can be used for the substrate 570 or the like.

Further, paper, wood, or the like can be used for the substrate 570 or the like.

For example, a flexible substrate can be used as the substrate 570 or the like.

Note that a method of forming a transistor, a capacitor, or the like directly on the substrate can be used. Further, for example, a method can be used in which a transistor, a capacitor, or the like is formed over a substrate for a process that has heat resistance to heat applied during a manufacturing process, and the formed transistor, the capacitor, or the like is transferred to the substrate 570 or the like. Accordingly, for example, a transistor, a capacitor, or the like can be formed over a flexible substrate.

<Substrate 770>
For example, a material having a light-transmitting property can be used for the substrate 770. Specifically, a material selected from the materials that can be used for the substrate 570 can be used for the substrate 770. Specifically, non-alkali glass polished to a thickness of 0.7 mm or a thickness of about 0.1 mm can be used.

<<Structure KB1>>
For example, an organic material, an inorganic material, or a composite material of an organic material and an inorganic material can be used for the structure KB1 and the like. Thereby, a predetermined space can be provided between the structures sandwiching the structure KB1 and the like.

Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate, polysiloxane, acrylic resin, or the like, or a composite material of a plurality of resins selected from these, or the like can be used for the structure KB1 or the like. Alternatively, a photosensitive material may be used.

<<Sealing material 705>>
An inorganic material, an organic material, a composite material of an inorganic material and an organic material, or the like can be used for the sealing material 705 or the like.

For example, an organic material such as a heat-meltable resin or a curable resin can be used for the sealing material 705 and the like.

For example, an organic material such as a reaction curable adhesive, a photocurable adhesive, a thermosetting adhesive, and/or an anaerobic adhesive can be used for the sealing material 705 and the like.

Specifically, an adhesive containing an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a polyimide resin, an imide resin, a PVC (polyvinyl chloride) resin, a PVB (polyvinyl butyral) resin, an EVA (ethylene vinyl acetate) resin, or the like. Can be used for the sealing material 705 and the like.

<<Joining layer 505>>
For example, a material that can be used for the sealing material 705 can be used for the bonding layer 505.

<<Insulation film 521>>
For example, an insulating inorganic material, an insulating organic material, or an insulating composite material containing an inorganic material and an organic material can be used for the insulating film 521 and the like.

Specifically, an inorganic oxide film, an inorganic nitride film, an inorganic oxynitride film, or the like, or a stacked material in which a plurality of these are stacked can be used for the insulating film 521 and the like. For example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like, or a film containing a stacked material in which a plurality of these films are stacked can be used for the insulating film 521 and the like.

Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate, polysiloxane, acrylic resin, or the like, or a laminated material or a composite material of a plurality of resins selected from these can be used for the insulating film 521 or the like. Alternatively, a photosensitive material may be used.

This makes it possible to flatten the steps caused by various structures overlapping the insulating film 521, for example.

<<Insulation film 528>>
For example, a material that can be used for the insulating film 521 can be used for the insulating film 528 and the like. Specifically, a film containing polyimide having a thickness of 1 μm can be used for the insulating film 528.

<<First Insulating Film 501A>>
For example, a material that can be used for the insulating film 521 can be used for the first insulating film 501A. Specifically, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like, or a film including a stacked material in which a plurality of these films are stacked can be used for the first insulating film 501A. In particular, it is preferable that the first insulating film 501A include a silicon nitride film. With such a structure, an impurity such as moisture can be effectively prevented from entering the second display element 550(i, j) from the layer 753 containing a liquid crystal material side; therefore, one embodiment of the present invention The display panel can be made highly reliable.

Note that if the thickness of the first insulating film 501A is too thick, the response of the liquid crystal in the first display element 750(i,j) might be low. Further, if the thickness of the first insulating film 501A is too thin, the effect of suppressing the intrusion of impurities may be reduced. From the above, it is preferable that the thickness of the first insulating film 501A be as thin as possible while satisfying the reliability required for the second display element 550(i,j).

<<Second insulating film 501C>>
For example, a material that can be used for the insulating film 521 can be used for the second insulating film 501C. Specifically, a material containing silicon and oxygen can be used for the second insulating film 501C. This can suppress diffusion of impurities into the pixel circuit, the second display element, or the like.

For example, a 200-nm-thick film containing silicon, oxygen, and nitrogen can be used as the second insulating film 501C.

Note that the second insulating film 501C is provided with a first connecting portion 591A, a third connecting portion 591B, and a third connecting portion 591C.

<< Wiring, terminal, conductive film >>
A material having conductivity can be used for the wiring and the like. Specifically, a material having conductivity can be used as the signal line S1(j), the signal line S2(j), the scan line G1(i), the scan line G2(i), the wiring CSCOM, the wiring ANO, the terminal 519B, and the like. It can be used for the terminal 519C, the conductive film 511B, the conductive film 511C, or the like.

For example, an inorganic conductive material, an organic conductive material, a metal, a conductive ceramics, or the like can be used for the wiring or the like.

Specifically, a metal element selected from aluminum, gold, platinum, silver, copper, chromium, tantalum, titanium, molybdenum, tungsten, nickel, iron, cobalt, palladium, or manganese can be used for the wiring and the like. .. Alternatively, an alloy containing the above metal element or the like can be used for the wiring or the like. In particular, an alloy of copper and manganese is suitable for fine processing using a wet etching method.

Specifically, a two-layer structure in which a titanium film is stacked over an aluminum film, a two-layer structure in which a titanium film is stacked over a titanium nitride film, a two-layer structure in which a tungsten film is stacked over a titanium nitride film, a tantalum nitride film, or A two-layer structure in which a tungsten film is stacked on a tungsten nitride film, a three-layer structure in which a titanium film and an aluminum film are stacked on the titanium film, and a titanium film is further formed thereover can be used for wiring or the like. ..

Specifically, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium is added can be used for the wiring or the like.

Specifically, a film containing graphene or graphite can be used for a wiring or the like.

For example, by forming a film containing graphene oxide and reducing the film containing graphene oxide, a film containing graphene can be formed. Examples of the reducing method include a method of applying heat and a method of using a reducing agent.

Specifically, a conductive polymer can be used for wiring or the like.

<<First Conductive Film, Second Conductive Film>>
For example, a material that can be used for a wiring or the like can be used for the first conductive film or the second conductive film.

Further, the first electrode 571(i,j), the wiring, or the like can be used for the first conductive film.

Further, the conductive film 512B of the transistor which can be used for the switch SW1, a wiring, or the like can be used as the second conductive film.

<<Pixel Circuit 530(i,j)>>
The pixel circuit 530(i,j) is electrically connected to the signal line S1(j), the signal line S2(j), the scan line G1(i), the scan line G2(i), the wiring CSCOM, and the wiring ANO. (See Figure 3).

The pixel circuit 530(i,j+1) is electrically connected to the signal line S1(j+1), the signal line S2(j+1), the scan line G1(i), the scan line G2(i), the wiring CSCOM, and the wiring ANO. ..

Note that when the voltage used for the signal supplied to the signal line S2(j) is different from the voltage used for the signal supplied to the signal line S1(j+1), the signal line S1(j+1) is separated from the signal line S2(j). Deploy. Specifically, the signal line S2(j+1) is arranged so as to be adjacent to the signal line S2(j).

The pixel circuit 530(i,j) includes a switch SW1, a capacitor C1, a switch SW2, a transistor M, and a capacitor C2.

For example, a transistor including a gate electrode electrically connected to the scan line G1(i) and a first electrode electrically connected to the signal line S1(j) can be used for the switch SW1. ..

The capacitor C1 includes a first electrode electrically connected to the second electrode of the transistor used for the switch SW1 and a second electrode electrically connected to the wiring CSCOM.

For example, a transistor including a gate electrode electrically connected to the scan line G2(i) and a first electrode electrically connected to the signal line S2(j) can be used for the switch SW2. ..

The transistor M has a gate electrode electrically connected to the second electrode of the transistor used for the switch SW2 and a first electrode electrically connected to the wiring ANO.

Note that a transistor including a conductive film provided so as to sandwich the semiconductor film with the gate electrode can be used as the transistor M. For example, a conductive film which is electrically connected to a wiring which can supply the same potential as the first electrode of the transistor M can be used.

The capacitor C2 has a first electrode electrically connected to the second electrode of the transistor used for the switch SW2 and a second electrode electrically connected to the first electrode of the transistor M. ..

Note that the first electrode of the first display element 750 is electrically connected to the second electrode of the transistor used for the switch SW1, and the second electrode of the first display element 750 is electrically connected to the wiring VCOM1. To do. Accordingly, the first display element 750 can be driven.

In addition, the first electrode of the second display element 550 is electrically connected to the second electrode of the transistor M, and the second electrode of the second display element 550 is electrically connected to the wiring VCOM2. As a result, the second display element 550 can be driven.

<<Switch SW1, Switch SW2, Transistor M, Transistor MD>>
For example, a bottom-gate transistor or a top-gate transistor can be used for the switch SW1, the switch SW2, the transistor M, the transistor MD, and the like.

For example, a transistor in which a semiconductor containing a Group 14 element is used for a semiconductor film can be used. Specifically, a semiconductor containing silicon can be used for the semiconductor film. For example, a transistor in which single crystal silicon, polysilicon, microcrystalline silicon, amorphous silicon, or the like is used for a semiconductor film can be used.

For example, a transistor including an oxide semiconductor for a semiconductor film can be used. Specifically, an oxide semiconductor containing indium or an oxide semiconductor containing indium, gallium, and zinc can be used for the semiconductor film.

As an example, as compared with a transistor using amorphous silicon for a semiconductor film, a transistor having a smaller leak current in an off state can be used for the switch SW1, the switch SW2, the transistor M, the transistor MD, and the like. Specifically, a transistor including an oxide semiconductor for the semiconductor film 508 can be used for the switch SW1, the switch SW2, the transistor M, the transistor MD, and the like.

Accordingly, it is possible to extend the time during which the pixel circuit can hold an image signal, as compared with a pixel circuit that uses a transistor in which amorphous silicon is used for a semiconductor film. Specifically, the selection signal can be supplied at a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than once per minute while suppressing the occurrence of flicker. As a result, fatigue accumulated in the user of the display panel can be reduced. In addition, power consumption associated with driving can be reduced.

A transistor that can be used for the switch SW1 includes the semiconductor film 508 and the conductive film 504 including a region overlapping with the semiconductor film 508 (see FIG. 2B). A transistor that can be used for the switch SW1 includes a conductive film 512A and a conductive film 512B.

Note that the conductive film 504 has a function of a gate electrode and the insulating film 506 has a function of a gate insulating film. The conductive film 512A has one of a source electrode function and a drain electrode function, and the conductive film 512B has another function of a source electrode and a drain electrode.

A transistor including the conductive film 524 which is provided so as to sandwich the semiconductor film 508 with the conductive film 504 can be used for the transistor M (see FIG. 2C).

A conductive film in which a 10-nm-thick film containing tantalum and nitrogen and a 300-nm-thick film containing copper are stacked in this order can be used as the conductive film 504.

A material in which a 400-nm-thick film containing silicon and nitrogen and a 200-nm-thick film containing silicon, oxygen, and nitrogen are stacked can be used for the insulating film 506.

A 25-nm-thick film containing indium, gallium, and zinc can be used for the semiconductor film 508.

A conductive film in which a 50-nm-thick film containing tungsten, a 400-nm-thick film containing aluminum, and a 100-nm-thick film containing titanium are stacked in this order is used as the conductive film 512A or the conductive film 512B. You can

<<First Display Element 750(i,j)>>
For example, a display element having a function of controlling reflection or transmission of light can be used for the first display element 750(i,j). For example, a structure in which a liquid crystal element and a polarizing plate are combined or a shutter-type MEMS display element or the like can be used. By using the reflective display element, the power consumption of the display panel can be suppressed. Specifically, a reflective liquid crystal display element can be used for the first display element 750.

IPS (In-Plane-Switching) mode, TN (Twisted Nematic) mode, FFS (Fringe Field Switching) mode, ASM (Axially Symmetric aligned Micro-cell) mode, OCB (Optically Compensated Birefringence) mode, FLC (Ferroelectric Liquid Crystal) A liquid crystal element which can be driven by a driving method such as a mode or an AFLC (Antiferroelectric Liquid Crystal) mode can be used.

In addition, for example, a vertical alignment (VA) mode, specifically, a MVA (Multi-Domain Vertical Alignment) mode, a PVA (Patterned Vertical Alignment) mode, an ECB (Electrically Aligned Coined-Vinyl-Saturated-Pin) mode, and an ECB (Electrically Aligned Coined-Vinyl) PA mode. A liquid crystal element that can be driven by a driving method such as an (Advanced Super-View) mode can be used.

As the liquid crystal material used for the layer 753 containing a liquid crystal material, for example, thermotropic liquid crystal, low-molecular liquid crystal, polymer liquid crystal, polymer dispersed liquid crystal, ferroelectric liquid crystal, antiferroelectric liquid crystal, or the like can be used. Alternatively, a liquid crystal material which exhibits a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, or the like can be used. Alternatively, a liquid crystal material exhibiting a blue phase can be used.

<<First Electrode 751(i,j)>>
For example, a material used for wiring or the like can be used for the first electrode 751(i,j). Specifically, a reflective film can be used for the first electrode 751(i,j).

《Reflective film》
For example, a material that reflects visible light can be used for the reflective film. Specifically, a material containing silver can be used for the reflective film. For example, a material containing silver and palladium or a material containing silver and copper can be used for the reflective film.

The reflective film reflects light transmitted through the layer 753 containing a liquid crystal material, for example. Accordingly, the first display element 750 can be a reflective liquid crystal element. Further, for example, a material having unevenness on the surface can be used for the reflective film. This makes it possible to reflect incident light in various directions and display white.

Note that the structure is not limited to using the first electrode 751(i,j) for the reflective film. For example, a structure in which a reflective film is provided between the layer 753 containing a liquid crystal material and the first electrode 751(i,j) can be used. Alternatively, a structure in which the first electrode 751(i,j) having a light-transmitting property is provided between the reflective film and the layer 753 containing a liquid crystal material can be used.

<Opening 751H>
If the value of the ratio of the total area of the openings 751H to the total area of the non-openings is too large, the display using the first display element 750(i,j) becomes dark. If the ratio of the total area of the openings 751H to the total area of the non-openings is too small, the display using the second display element 550(i,j) will be dark.

If the area of the opening 751H provided in the reflective film is too small, the efficiency of light that can be extracted from the light emitted from the second display element 550 is reduced.

A shape such as a polygon, a quadrangle, an ellipse, a circle, or a cross can be used as the shape of the opening 751H. In addition, an elongated strip shape, a slit shape, or a checkered shape can be used for the shape of the opening 751H. Further, the opening 751H may be arranged close to an adjacent pixel. Preferably, the opening 751H is arranged close to another pixel having a function of displaying the same color. Accordingly, a phenomenon (also referred to as crosstalk) in which light emitted from the second display element 550 enters a coloring film provided in an adjacent pixel can be suppressed.

<<second electrode 752>>
For example, a material having a property of transmitting visible light and having conductivity can be used for the second electrode 752.

For example, a conductive oxide, a metal film which is thin enough to transmit light, or metal nanowires can be used for the second electrode 752.

Specifically, a conductive oxide containing indium can be used for the second electrode 752. Alternatively, a metal thin film having a thickness of 1 nm to 10 nm can be used for the second electrode 752. Alternatively, a metal nanowire containing silver can be used for the second electrode 752.

Specifically, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, zinc oxide to which aluminum is added, or the like can be used for the second electrode 752.

<<Alignment film AF1, alignment film AF2>>
For example, a material containing polyimide or the like can be used for the alignment film AF1 or the alignment film AF2. Specifically, a material formed by using a rabining treatment or a photo-alignment technique so as to be oriented in a predetermined direction can be used.

For example, a film containing soluble polyimide can be used for the alignment film AF1 or the alignment film AF2.

<<Coloring film CF1>>
A material that transmits light of a predetermined color can be used for the colored film CF1. Thereby, the colored film CF1 can be used for a color filter, for example.

For example, a material that transmits blue light, a material that transmits green light, a material that transmits red light, a material that transmits yellow light, a material that transmits white light, or the like is used for the coloring film CF1. it can.

<<Shading film BM>>
A material that blocks light transmission can be used for the light shielding film BM. As a result, the light shielding film BM can be used as a black matrix, for example.

<<Insulation film 771>>
For example, polyimide, epoxy resin, acrylic resin, or the like can be used for the insulating film 771.

<Functional film 770P>
For example, a polarizing plate, a retardation film, a diffusion film, an antireflection film, a light collecting film, or the like can be used for the functional film 770P. Alternatively, a polarizing plate containing a dichroic dye can be used for the functional film 770P.

Further, an antistatic film that suppresses adhesion of dust, a water-repellent film that prevents dirt from adhering, a hard coat film that suppresses the occurrence of scratches due to use, or the like can be used as the functional film 770P.

<<Second Display Element 550(i,j)>>
For example, a light emitting element can be used for the second display element 550(i,j). Specifically, an organic electroluminescent element, an inorganic electroluminescent element, a light emitting diode, or the like can be used for the second display element 550(i,j).

For example, a stacked body that emits blue light, a stacked body that emits green light, or a stacked body that emits red light is used as a light-emitting organic material. It can be used for the layer 553(j) containing a compound.

For example, a strip-shaped stacked body which is long in the column direction along the signal line S1(j) can be used for the layer 553(j) containing a light-emitting organic compound. In addition, a strip-shaped stacked body that is long in the column direction along the signal line S1(j+1) that emits light of a color different from that of the layer 553(j) containing a light-emitting organic compound is a layer containing a light-emitting organic compound. 553(j+1).

Alternatively, for example, a stacked body which is stacked so as to emit white light can be used for the layer 553(j) containing a light-emitting organic compound and the layer 553(j+1) containing a light-emitting organic compound. Specifically, a layer containing a light-emitting organic compound containing a fluorescent material that emits blue light, a layer containing a material other than the fluorescent material that emits green and red light, or a fluorescent material that emits yellow light. A stack including a layer containing a material other than the above can be used for the layer 553(j) containing a light-emitting organic compound and the layer 553(j+1) containing a light-emitting organic compound.

For example, a material that can be used for a wiring or the like can be used for the third electrode 551(i,j) or the fourth electrode 552.

For example, a material having a property of transmitting visible light, which is selected from materials that can be used for wiring or the like, can be used for the third electrode 551(i,j).

Specifically, a conductive oxide or a conductive oxide containing indium, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide added with gallium, or the like is used as the third electrode 551(i). , J). Alternatively, a metal film which is thin enough to transmit light can be used for the third electrode 551(i,j).

For example, a material having reflectivity with respect to visible light selected from materials that can be used for wiring or the like can be used for the fourth electrode 552.

<Drive circuit GD>
Various sequential circuits such as a shift register can be used for the driving circuit GD. For example, the transistor MD, the capacitor, or the like can be used for the driver circuit GD. Specifically, a transistor including a semiconductor film which can be formed in the same step as the transistor M can be used.

Alternatively, a structure different from that of the transistor that can be used for the switch SW1 can be used for the transistor MD. Specifically, a transistor including the conductive film 524 can be used for the transistor MD (see FIG. 2C).

A conductive film 524 is provided so as to sandwich the semiconductor film 508 with the conductive film 504, an insulating film 516 is provided between the conductive film 524 and the semiconductor film 508, and a space between the semiconductor film 508 and the conductive film 504 is provided. An insulating film 506 is provided on the substrate. For example, the conductive film 524 is electrically connected to a wiring which supplies the same potential as the conductive film 504.

Note that the same structure as the transistor M can be used for the transistor MD.

<Drive circuit SD>
For example, an integrated circuit can be used as the drive circuit SD. Specifically, an integrated circuit formed on a silicon substrate can be used for the drive circuit SD.

For example, the driver circuit SD can be mounted on a pad electrically connected to the pixel circuit 530(i,j) by using a COG (Chip on glass) method. Specifically, an integrated circuit can be mounted on the pad by using an anisotropic conductive film.

Note that the pad can be formed in the same step as the terminal 519B or the terminal 519C.

<Configuration example of display panel 2. >
FIG. 5 illustrates a structure of a display panel 700A of one embodiment of the present invention. FIG. 5A is a cross-sectional view taken along the section line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, X11-X12 in FIG. FIG. 5B is a cross-sectional view illustrating part of the structure of the display panel.

Note that the display panel 700A is different from the display panel 700 described with reference to FIG. 2 in that it has a top-gate transistor instead of a bottom-gate transistor. Here, the above description will be referred to for the portions that can use the same configuration as the above description, and different portions will be described in detail.

<<Switch SW1A, transistor MA, transistor MDA>>
A transistor, a transistor MA, and a transistor MDA which can be used for the switch SW1A include a conductive film 504 including a region overlapping with the insulating film 501C, and a semiconductor film 508 including a region provided between the insulating film 501C and the conductive film 504. , Is provided. Note that the conductive film 504 has a function of a gate electrode (see FIG. 5B).

The semiconductor film 508 includes a first region 508A and a second region 508B which do not overlap with the conductive film 504, and a third region 508C which overlaps with the conductive film 504 between the first region 508A and the second region 508B. Equipped with.

The transistor MDB includes an insulating film 506 between the third region 508C and the conductive film 504. Note that the insulating film 506 has a function of a gate insulating film.

The first region 508A and the second region 508B have lower resistivity than the third region 508C and have a function of a source region or a function of a drain region.

The conductive film 504 can be used as a mask. Accordingly, the third region 508C can be formed in a self-aligned manner using the conductive film 504 as a mask.

The transistor MDB includes a conductive film 512A in contact with the first region 508A and a conductive film 512B in contact with the second region 508B. The conductive films 512A and 512B have a function of a source electrode or a drain electrode. Although the conductive films 512A and 512B are located over the semiconductor film 508 in FIGS. 5A and 5B, the semiconductor film 508 may be provided over the conductive films 512A and 512B.

A transistor that can be formed in the same process as the transistor MDB can be used as the transistor MB.

<Configuration example of display panel 3. >
6A and 6B are diagrams illustrating a structure of the display panel 700B of one embodiment of the present invention. FIG. 6A is a cross-sectional view taken along the section line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, X11-X12 in FIG. FIG. 6B is a cross-sectional view illustrating part of the structure of the display panel.

Note that the display panel 700B is different from the display panel 700 described with reference to FIG. 2 in that it has a top-gate transistor instead of a bottom-gate transistor. Here, the above description will be referred to for the portions that can use the same configuration as the above description, and different portions will be described in detail.

<<Switch SW1B, Transistor MB, Transistor MDB>>
A transistor, a transistor MB, and a transistor MDB which can be used for the switch SW1B include a conductive film 504 including a region overlapping with the insulating film 501C, and a semiconductor film 508 including a region provided between the insulating film 501C and the conductive film 504. , Is provided. Note that the conductive film 504 has a function of a gate electrode (see FIG. 6B).

The semiconductor film 508 includes a first region 508A and a second region 508B which do not overlap with the conductive film 504, and a third region 508C which overlaps with the conductive film 504 between the first region 508A and the second region 508B. Equipped with.

The transistor MDB includes an insulating film 506 between the third region 508C and the conductive film 504. Note that the insulating film 506 has a function of a gate insulating film.

The first region 508A and the second region 508B have lower resistivity than the third region 508C and have a function of a source region or a function of a drain region.

Note that the first region 508A and the second region 508B can be formed in the semiconductor film 508 by using the method for controlling the resistivity of the oxide semiconductor, which is described in detail at the end of this embodiment, for example. Specifically, plasma treatment using a gas containing a rare gas can be applied.

Further, for example, the conductive film 504 can be used as a mask. Accordingly, the third region 508C can be formed in a self-aligned manner using the conductive film 504 as a mask.

The transistor MDB includes a conductive film 512A in contact with the first region 508A and a conductive film 512B in contact with the second region 508B. The conductive films 512A and 512B have a function of a source electrode or a drain electrode.

A transistor that can be formed in the same process as the transistor MDB can be used as the transistor MB.

<Configuration example of display panel 4. >
7A and 7B are diagrams illustrating a structure of a display panel 700C of one embodiment of the present invention. FIG. 7A is a cross-sectional view taken along the line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, and X11-X12 of FIG. 1A. FIG. 7B is a cross-sectional view illustrating part of the structure of the display panel.

The display panel 700C is different from the display panel 700 described with reference to FIG. 2 in that a channel protection type transistor is provided instead of the channel etching type transistor. Here, the above description will be referred to for the portions that can use the same configuration as the above description, and different portions will be described in detail.

<<Switch SW1C, Transistor MC, Transistor MDC>>
The transistor which can be used for the switch SW1C, the transistor MC, and the transistor MDC each include an insulating film 509 between the semiconductor film 508 and the conductive films 512A and 512B. The conductive film 512A and the semiconductor film 508 are electrically connected to each other through the opening portion of the insulating film 509. In addition, the conductive film 512B and the semiconductor film 508 are electrically connected to each other through the opening portion of the insulating film 509 (see FIGS. 7B and 7C).

The insulating film 509 functions as a protective film for the semiconductor film 508. With such a structure, thinning of the semiconductor film 508 due to etching at the time of processing the conductive films 512A and 512B can be suppressed.

As the insulating film 509, for example, a material similar to that of the insulating film 506 can be used.

<Configuration example of display panel 5. >
FIG. 8 illustrates a structure of a display panel of one embodiment of the present invention. FIG. 8 is a cross-sectional view of the display panel 700D of one embodiment of the present invention, which is taken along cutting line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, or X11-X12 illustrated in FIG. ..

Note that the display panel 700D illustrated in FIG. 8 has a structure in which the structure of the first display element 750(i,j), the structure of the opening over the terminal 519B, and the structure of connection between the second electrode 752 and the terminal 519C are different from each other. The display panel 700 is different from the display panel 700 described with reference to FIG.

The insulating film 529 includes a region sandwiched between the first insulating film 501A and the first electrode 751(i,j). The second electrode 752 is provided so as to be in contact with the first insulating film 501A and be separated from the first electrode 751(i,j) by the insulating film 529. The second electrode 752 is electrically connected to the terminal 519C through the opening 595 provided in the insulating film 529.

Further, the opening 596B is provided in the first insulating film 501A and the insulating film 529.

The display panel 700D includes a liquid crystal display element that can operate in the FFS mode, for example, as the first display element 750(i,j).

Note that when the display element 750(i,j) is operated in the FFS mode, a circularly polarizing plate is used as the functional film 770P and a positive liquid crystal is used as a liquid crystal material used for the layer 753 containing a liquid crystal material. Here, the positive type liquid crystal refers to a liquid crystal having a positive dielectric anisotropy. Further, the alignment film AF1 and the alignment film AF1 are aligned so that the liquid crystal included in the layer 753 containing a liquid crystal material is aligned in a substantially vertical direction with respect to the substrate 770 in a state where voltage is not applied to the display element 750(i,j). It is preferable to configure AF2.

<Configuration example of display panel 6. >
9A and 9B are diagrams illustrating a structure of a display panel of one embodiment of the present invention. FIG. 9 is a cross-sectional view of the display panel 700E of one embodiment of the present invention, which is taken along the cutting line X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, or X11-X12 illustrated in FIG. ..

Note that the display panel 700E illustrated in FIG. 9 is different from the display panel 700D described with reference to FIG. 8A in the structure of the opening 596B.

The opening 596B is provided so that part of its end portion is aligned with the sealing material 705. In other words, the ends of the first insulating film 501A and the insulating film 529 coincide with the ends of the sealing material 705. Note that the opening 596B can be formed by etching using the sealing material 705 or the substrate 770 as a mask.

<Method for controlling resistivity of oxide semiconductor>
A method for controlling the resistivity of the oxide semiconductor film will be described.

An oxide semiconductor film having a predetermined resistivity can be used for the semiconductor film 508, the conductive film 524, or the like.

For example, a method of controlling the concentration of impurities such as hydrogen and water contained in the oxide semiconductor film and/or oxygen vacancies in the film can be used as a method of controlling the resistivity of the oxide semiconductor.

Specifically, plasma treatment can be used as a method for increasing or reducing the concentration of impurities such as hydrogen and water and/or oxygen vacancies in the film.

Specifically, plasma treatment performed using a rare gas (He, Ne, Ar, Kr, Xe), a gas containing one or more selected from hydrogen, boron, phosphorus, and nitrogen can be applied. For example, plasma treatment under Ar atmosphere, plasma treatment under mixed gas atmosphere of Ar and hydrogen, plasma treatment under ammonia atmosphere, plasma treatment under mixed gas atmosphere of Ar and ammonia, or under nitrogen atmosphere Plasma treatment or the like can be applied. Accordingly, an oxide semiconductor film having high carrier density and low resistivity can be obtained.

Alternatively, by using an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or the like, hydrogen, boron, phosphorus, or nitrogen may be injected into the oxide semiconductor film to form an oxide semiconductor film having low resistivity. it can.

Alternatively, a method in which an insulating film containing hydrogen is formed in contact with the oxide semiconductor film and hydrogen is diffused from the insulating film into the oxide semiconductor film can be used. Accordingly, the carrier density of the oxide semiconductor film can be increased and the resistivity can be reduced.

For example, hydrogen can be effectively contained in the oxide semiconductor film by forming an insulating film in which the hydrogen concentration in the film is 1×10 ²² atoms/cm ³ or more in contact with the oxide semiconductor film. Specifically, the silicon nitride film can be used as an insulating film formed in contact with the oxide semiconductor film.

Hydrogen contained in the oxide semiconductor film reacts with oxygen bonded to a metal atom to be water, and also forms oxygen vacancies in a lattice from which oxygen is released (or a portion from which oxygen is released). When hydrogen enters the oxygen vacancies, electrons which are carriers may be generated. In addition, a part of hydrogen may be combined with oxygen which is combined with a metal atom to generate an electron which is a carrier. Accordingly, an oxide semiconductor film having high carrier density and low resistivity can be obtained.

Specifically, the hydrogen concentration obtained by secondary ion mass spectrometry (SIMS: Secondary Ion Mass Spectrometry) is 8×10 ¹⁹ atoms/cm ³ or more, preferably 1×10 ²⁰ atoms/cm ³ or more, and more preferably The oxide semiconductor having a density of 5×10 ²⁰ atoms/cm ³ or more can be favorably used for the conductive film 524.

On the other hand, an oxide semiconductor having high resistivity can be used for a semiconductor film in which a channel of a transistor is formed. Specifically, it can be preferably used for the semiconductor film 508.

For example, an insulating film containing oxygen, in other words, an insulating film capable of releasing oxygen is formed in contact with an oxide semiconductor, and oxygen is supplied from the insulating film to the oxide semiconductor film so that the oxide film in the film or the interface The oxygen deficiency can be compensated. Thus, an oxide semiconductor film having high resistivity can be obtained.

For example, a silicon oxide film or a silicon oxynitride film can be used as the insulating film which can release oxygen.

The oxide semiconductor film in which oxygen vacancies are filled and the hydrogen concentration is reduced can be said to be a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film. Here, “substantially intrinsic” means that the oxide semiconductor film has a carrier density of less than 8×10 ¹¹ /cm ³ , preferably less than 1×10 ¹¹ /cm ³ , and more preferably 1×10 ¹⁰ /cm 3. It is less than ³ . A highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has few carrier generation sources and thus can have a low carrier density. In addition, since a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, the density of trap states can be reduced.

A transistor including a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has an extremely small off-state current, a channel width of 1×10 ⁶ μm, and a channel length L of 10 μm. When the voltage between the source electrode and the drain electrode (drain voltage) is in the range of 1 V to 10 V, the off-current can have the characteristic of being less than the measurement limit of the semiconductor parameter analyzer, that is, 1×10 ⁻¹³ A or less.

The transistor including the above-described highly-purified intrinsic or substantially highly-purified intrinsic oxide semiconductor film for a channel region has high variation in electrical characteristics and high reliability.

Specifically, the hydrogen concentration obtained by secondary ion mass spectrometry (SIMS: Secondary Ion Mass Spectrometry) is 2×10 ²⁰ atoms/cm ³ or less, preferably 5×10 ¹⁹ atoms/cm ³ or less, and more preferably Is 1×10 ¹⁹ atoms/cm ³ or less, less than 5×10 ¹⁸ atoms/cm ³ , preferably 1×10 ¹⁸ atoms/cm ³ or less, more preferably 5×10 ¹⁷ atoms/cm ³ or less, further preferably 1 An oxide semiconductor having a density of ×10 ¹⁶ atoms/cm ³ or less can be favorably used as a semiconductor in which a channel of a transistor is formed.

Note that an oxide semiconductor film having a higher hydrogen concentration and/or an amount of oxygen vacancies and a lower resistivity than the semiconductor film 508 is used for the conductive film 524.

Further, a film containing hydrogen at a concentration which is twice or more, preferably 10 times or more the concentration of hydrogen contained in the semiconductor film 508 can be used as the conductive film 524.

A film having a resistivity of 1×10 ⁻⁸ times or more and less than 1×10 ⁻¹ times the resistivity of the semiconductor film 508 can be used for the conductive film 524.

^{Specifically, 1 × 10 -3 1 × 10} 4 less [Omega] cm or more [Omega] cm, preferably, a 1 × ^{10 -3} Ωcm or more 1 × ^{10 -1} Ωcm less than a is film, can be used for the conductive film 524.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 2)
In this embodiment, a method for manufacturing a display panel of one embodiment of the present invention will be described with reference to FIGS.

FIG. 10 is a flowchart illustrating a method for manufacturing the display panel 700 of one embodiment of the present invention. 11 to 17 are cross-sectional views of the display panel 700 in the manufacturing process along cutting lines X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, and X11-X12 illustrated in FIG. Is.

FIG. 18 is a flowchart illustrating a method for manufacturing the display panel 700E of one embodiment of the present invention. 19 to 22 are cross-sectional views of the display panel 700E in the manufacturing process along cutting lines X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, and X11-X12 illustrated in FIG. Is.

<Display panel manufacturing method 1>
The method for manufacturing the display panel 700 described in this embodiment has the following 12 steps.

<< the first step >>
In the first step, the first insulating film 501A is formed over the substrate for the process (see FIG. 10U1). For example, the first insulating film 501A is formed so that the separation film 510W is sandwiched between the first insulating film 501A and the substrate 510.

For example, a substrate including the substrate 510 and a peeling film 510W including a region overlapping with the substrate 510 can be used as a substrate for a process.

A material having heat resistance high enough to withstand heat treatment in a manufacturing process can be used for the substrate 510.

An organic material, an inorganic material, a composite material of an organic material and an inorganic material, or the like can be used for the substrate 510. For example, an inorganic material such as glass, ceramics, or metal can be used for the substrate 510.

Specifically, non-alkali glass, soda-lime glass, potash glass, crystal glass, quartz, sapphire, or the like can be used for the substrate 510. Specifically, an inorganic oxide film, an inorganic nitride film, an inorganic oxynitride film, or the like can be used for the substrate 510. For example, silicon oxide, silicon nitride, silicon oxynitride, an alumina film, or the like can be used for the substrate 510. SUS, aluminum, or the like can be used for the substrate 510.

For example, an organic material such as resin, resin film, or plastic can be used for the substrate 510. Specifically, a resin film or a resin plate of polyester, polyolefin, polyamide, polyimide, polycarbonate, acrylic resin, or the like can be used for the substrate 510.

For example, a metal plate, a thin glass plate, or a composite material in which a film of an inorganic material or the like is attached to a resin film or the like can be used for the substrate 510. For example, a composite material in which a fibrous or particulate metal, glass, an inorganic material, or the like is dispersed in a resin film can be used for the substrate 510. For example, a composite material in which a fibrous or particulate resin, an organic material, or the like is dispersed in an inorganic material can be used for the substrate 510.

Further, a single layer material or a material in which a plurality of layers is stacked can be used for the substrate 510. For example, a material in which a base material and an insulating film or the like which prevents diffusion of impurities contained in the base material are stacked can be used for the substrate 510.

For example, in the ninth step, a material having a function of separating the first insulating film 501A from the substrate 510 can be used for the peeling film 510W.

Note that the first insulating film 501A can be separated from the substrate 510 by leaving the peeling film 510W on the substrate 510 side. Alternatively, the separation film 510W can be separated from the substrate 510 together with the first insulating film 501A.

Specifically, when a non-alkali glass substrate is used as the substrate 510, a film containing tungsten or the like is used as the peeling film 510W, and a film containing an inorganic oxide or an inorganic oxynitride is used as the first insulating film 501A, The first insulating film 501A can be separated from the substrate 510 by leaving the peeling film 510W on the 510 side.

When a non-alkali glass substrate is used for the substrate 510, a film containing polyimide is used for the peeling film 510W, and a film containing various materials is used for the first insulating film 501A, the peeling film 510W is used together with the first insulating film 501A. Can be separated from the substrate 510.

For example, the first insulating film 501A is formed so as to be in contact with the peeling film 510W. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used. Then, an unnecessary portion is removed by a lithography method or the like to form a first insulating film 501A.

Note that the shape of the first insulating film 501A may be larger than that of the peeling film 510W so that the first insulating film 501A is in contact with the substrate 510 at the outer peripheral portion of the first insulating film 501A. Accordingly, it is possible to suppress the occurrence of the problem that the first insulating film 501A is unintentionally separated from the substrate for the process.

Specifically, a 0.7 mm-thick glass plate is used for the substrate 510, and a 30-nm-thick tungsten film provided over the substrate 510 is used for the peeling film 510W. Then, a film including a stacked material in which a 200-nm-thick silicon oxynitride film and a 200-nm-thick silicon nitride are stacked in this order from the separation film 510W side can be used for the first insulating film 501A. Note that the silicon oxynitride film has a composition of oxygen higher than that of nitrogen, and the silicon nitride oxide film has a composition of nitrogen higher than that of oxygen.

<Second step>
In the second step, the first conductive film and the terminal are formed (see FIG. 10U2). Note that in this manufacturing method, the first conductive film is a stack of a transparent conductive film and a reflective film, the first electrode 751(i,j) is used for the transparent conductive film, and the electrode 751A(i,j) is used for the reflective film. An example using will be described.

For example, the reflective film includes the opening 751H and the terminals include the terminals 519B and 519C.

For example, a film containing a conductive material is formed in contact with the insulating film 501A. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used. Then, an unnecessary portion is removed by a lithography method or an etching method to form the first electrode 751(i,j), the electrode 751A(i,j), the terminal 519B, and the terminal 519C.

<<3rd step>>
In the third step, a second insulating film 501C which covers the conductive film and the terminal is formed (see FIG. 10U3). Note that a third insulating film having a region overlapping with the second insulating film 501C may be formed subsequent to the second insulating film 501C.

The second insulating film 501C has an opening.

For example, a film having a function of suppressing diffusion of impurities is formed so as to cover the reflective film and the terminal. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used.

Next, an opening reaching the electrode 751A and an opening reaching the terminals 519B and 519C are formed by a lithography method or the like, so that the second insulating film 501C is formed.

<<4th step>>
In the fourth step, the first connection portion 591A electrically connected to the reflective film and the third connection portions 591B and 591C electrically connected to the terminals 519B and 519C are formed (FIG. 10 (U4)). And FIG. 11). Note that the conductive film 504 that functions as a gate electrode of the transistor M, the transistor MD, or the transistor that can be used as the switch SW1 may be formed with the first connection portion 591A and the terminals 519B and 519C.

For example, a film containing a conductive material is formed in contact with the second insulating film 501C, the opening reaching the electrode 751A, the terminal 519B, and the opening reaching the terminal 519C. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used.

Then, unnecessary portions are removed by a lithography method and an etching method, so that the first connecting portion 591A, the third connecting portions 593B and 593C, and the conductive film 504 are formed.

<<5th step>>
In the fifth step, a pixel circuit electrically connected to the first connecting portion 591 and the third connecting portion 593 is formed (see FIG. 10 (U5)).

For example, a film containing a conductive material, a film containing an insulating material, a film containing a semiconductor material, or the like is formed by a chemical vapor deposition method, a sputtering method, or the like. Further, unnecessary portions of the film are removed by using a lithography method and an etching method. That is, a pixel circuit including the transistor M, the transistor MD, the transistor functioning as the switch SW1, and the like is formed by combining the film formation method, the lithography method, and the etching method.

Next, an insulating film 516, an insulating film 518, or the like which protects an element such as a transistor included in the pixel circuit is formed. In addition, a conductive film 524 which functions as a second gate electrode is formed between the insulating films 516 and 518.

Next, an insulating film 521 is formed and openings for reaching the pixel circuit are formed in the insulating film 516, the insulating film 518, and the insulating film 521.

<<6th step>>
In the sixth step, the second connection portion 592 which is connected to the pixel circuit is formed (see FIG. 10 (U6) and FIG. 12). Note that wiring may be formed with the second connection portion 592.

For example, a film containing a conductive material is formed. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used.

Then, an unnecessary portion is removed by a lithography method and an etching method to form the second connection portion 592.

<< 7th step >>
In the seventh step, the second display element 550 which is electrically connected to the second connecting portion 592 is formed (see FIGS. 10U7 and 13).

The third electrode 551(i,j) is formed so as to be electrically connected to the second connection portion 592. For example, a film containing a conductive material is formed. Specifically, a chemical vapor deposition method, a sputtering method, or the like can be used. Then, an unnecessary portion is removed by a lithography method and an etching method, so that the third electrode 551(i,j) is formed.

Next, the insulating film 528 having an opening is formed in a region overlapping with the third electrode 551(i,j). Note that the end portion of the third electrode 551(i,j) is covered with the insulating film 528. For example, a photosensitive resin is deposited. Specifically, a coating method or the like can be used. Then, an unnecessary portion is removed by a lithography method or the like to form an insulating film 528.

Next, a layer 553(j) containing a light-emitting organic compound is formed so as to cover the third electrode 551(i,j) exposed in the opening of the insulating film 528. Specifically, a vapor deposition method using a shadow mask method, a printing method, an inkjet method, or the like can be used.

Next, a fourth electrode 552 is formed so that the layer 553(j) containing a light-emitting organic compound is sandwiched between the layer 553(j) and the third electrode 551(i,j). Specifically, a vapor deposition method using a shadow mask method, a sputtering method, or the like can be used.

<<8th step>>
In the eighth step, the substrate 570 is stacked (see FIG. 10 (U8) and FIG. 14).

For example, a resin having fluidity or the like is applied to form the bonding layer 505. Specifically, a coating method, a printing method, an inkjet method, or the like can be used. Alternatively, a bonding resin 505 is formed by attaching a fluid resin or the like which is formed in a sheet shape in advance.

Next, the functional layer 520 and the substrate 570 are attached to each other using the bonding layer 505.

<< 9th step >>
In the ninth step, the process substrate 510 is separated (see FIG. 10 (U9) and FIG. 15).

For example, a part of the peeling film 510W may be partially removed by a method of piercing the peeling layer 510W from the substrate 510 side for processing with a sharp tip, a method of using a laser or the like (for example, a laser ablation method), or the like. From the insulating film 501A. Thereby, the starting point of peeling can be formed.

Next, the process substrate 510 is gradually separated from the starting point of peeling.

Note that the vicinity of the interface between the peeling film 510W and the first insulating film 501A may be irradiated with ions to peel off while removing static electricity. Specifically, the ions generated by using an ionizer may be irradiated. In addition, the liquid that permeates the liquid or is ejected from the nozzle may be sprayed on the interface between the peeling film 510W and the first insulating film 501A. For example, water, a polar solvent, or a liquid that dissolves the peeling film 510W can be used as a liquid to be permeated or a liquid to be sprayed. By allowing the liquid to permeate, it is possible to suppress the influence of static electricity or the like generated due to peeling.

In particular, when a film containing tungsten oxide is used for the peeling layer 510W, the substrate 510 is separated while infiltrating or spraying a liquid containing water. As a result, the stress associated with peeling can be reduced.

<< 10th step >>
In the tenth step, a part of the first insulating film 501A is removed to expose the terminal (see FIG. 10 (U10) and FIG. 16).

For example, part of the first insulating film 501A can be removed by a lithography method or the like. Specifically, the opening 594B and the opening 594C are formed by a lithography method or the like to expose the terminal 519B and the terminal 519C.

<<Eleventh Step>>
In the eleventh step, the first display element is formed (see FIG. 10 (U11) and FIG. 17).

For example, a counter substrate is prepared. Specifically, a counter substrate in which the light-shielding film BM, the coloring film CF1, the insulating film 771, the second electrode 752, the structure KB1 and the alignment film AF2 are formed over the substrate 770 is prepared.

Then, an alignment film AF1 including a region overlapping with the second insulating film 501C and the first electrode 751(i,j) is formed. Specifically, it is formed by using a printing method or a rubbing method.

Then, the sealing material 705 is formed. Specifically, a resin having fluidity is applied in a frame shape using a dispenser or a printing method. A material containing the conductive member CP is applied to a region overlapping with the terminal 519C.

Next, a liquid crystal material is dropped in a region surrounded by the frame-shaped sealing material 705. Specifically, a dispenser or the like is used.

Next, the substrate 770 is attached to the second insulating film 501C with the use of the sealing material 705. Note that the structure KB1 is sandwiched between the second insulating film 501C and the terminal 519C and the second electrode 752 are electrically connected using the conductive member CP provided in the opening 594C.

<<Twelfth Step>>
In the twelfth step, the anisotropic conductive connection layer ACF1 and the flexible printed circuit board FPC1 are connected to the terminal 519B through the opening 594B (see FIG. 10 (U12) and FIG. 2(A)).

The method for manufacturing the display panel 700 described in this embodiment includes a step of separating the substrate 510 for steps and a step of removing the first insulating film 501A to expose the reflective film and the terminal. To be done. As a result, it is possible to reduce the step generated at the end of the reflective film and make it difficult for alignment defects and the like to occur due to the step. Further, the surface functioning as a contact of the terminal can be exposed. As a result, it is possible to provide a method for manufacturing a novel display panel which is highly convenient or reliable.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

<Display panel manufacturing method 2>
The manufacturing method of the display panel 700E described in this embodiment has 12 steps shown in the flowchart of FIG. Note that among the 11 steps shown in FIG. 18, the same steps as those in FIG. 10 can apply the above manufacturing method of the display panel 700. Only steps different from those in FIG. 10 will be described below in detail.

<< the first step >>
In the first step, the first insulating film 501A is formed over the substrate for the process (see FIG. 18U1).

<Second step>
In the second step, a second electrode, an insulating film, a first conductive film, and a terminal are formed (see FIG. 18 (U2) and FIG. 19).

For example, a film containing a conductive material is formed in contact with the insulating film 501A. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used. Then, an unnecessary portion is removed by a lithography method or an etching method, so that the second electrode 752 is formed.

Then, an insulating film 529 is formed so as to be in contact with the second electrode 752 and the insulating film 501A. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used.

For example, a film having a function of suppressing diffusion of impurities is formed so as to cover the reflective film and the terminal. Specifically, a chemical vapor deposition method, a sputtering method, a coating method, or the like can be used.

Then, an opening 595 reaching the second electrode 752 is formed by a lithography method or the like, so that an insulating film 529 is formed.

Then, a first conductive film and a terminal are formed over the insulating film 529 and the second electrode 752. For the method of forming the first conductive film and the terminal, the second step of the method for manufacturing the display panel 700 can be referred to.

<<3rd step>>
In the third step, a second insulating film 501C which covers the conductive film and the terminal is formed (see FIG. 18U3).

<<4th step>>
In the fourth step, the first connection portion 591A electrically connected to the reflective film and the third connection portions 591B and 591C electrically connected to the terminals 519B and 519C are formed (FIG. 18 (U4)). ).

<<5th step>>
In the fifth step, a pixel circuit which is electrically connected to the first connecting portion 591 and the third connecting portion 593 is formed (see FIG. 18 (U5)).

<<6th step>>
In the sixth step, the second connection portion 592 which is connected to the pixel circuit is formed (see FIG. 18 (U6)).

<< 7th step >>
In the seventh step, the second display element 550 which is electrically connected to the second connection portion 592 is formed (see FIG. 18 (U7)).

<<8th step>>
In the eighth step, the substrate 570 is stacked (see FIG. 18 (U8)).

<< 9th step >>
In the ninth step, the process substrate 510 is separated (see FIG. 18 (U9) and FIG. 20).

<< 10th step >>
In the tenth step, the first display element is formed (see FIG. 18 (U10) and FIG. 21). For the method for forming the first display element 750(i,j), the eleventh step of the method for manufacturing the display panel 700 can be referred to.

<<Eleventh Step>>
In the eleventh step, parts of the first insulating film 501A and the insulating film 529 are removed to expose the terminals (see FIGS. 18U11 and 22).

For example, part of the first insulating film 501A and the insulating film 529 can be removed by an etching method. At this time, since the sealing material 705 or the substrate 770 can be used as a mask, the removal can be performed without forming a resist mask or the like. Specifically, the removal can be performed by a wet etching method using the sealing material 705 as a mask. Alternatively, the substrate 770 may be removed by a dry etching method using the substrate 770 as a mask (see FIG. 23).

The terminal 519B is exposed by removing a part of the first insulating film 501A and the insulating film 529 to form an opening 596B.

<<Twelfth Step>>
In the twelfth step, the anisotropic conductive connection layer ACF1 and the flexible printed circuit board FPC1 are connected to the terminal 519B through the opening 596B (see FIG. 18 (U12) and FIG. 9).

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 3)
In this embodiment, a structure of a transistor that can be used in the display panel of one embodiment of the present invention will be described with reference to FIGS.

<Example of configuration of semiconductor device>
24A is a top view of the transistor 100, and FIG. 24C is a cross-sectional view taken along a cutting line X1-X2 in FIG. 24A, and FIG. 24A corresponds to a cross-sectional view of a cutting plane taken along the cutting line Y1-Y2 shown in FIG. Note that in FIG. 24A, some components of the transistor 100 (such as an insulating film functioning as a gate insulating film) are omitted for simplicity. The cutting line X1-X2 direction may be referred to as a channel length direction, and the cutting line Y1-Y2 direction may be referred to as a channel width direction. Note that in the top view of the transistor, some of the components are omitted in the following drawings, as in FIG. 24A, in some cases.

Note that the transistor 100 can be used for the display panel described in Embodiment 1.

For example, when the transistor 100 is used as the transistor M, the substrate 102 is the third insulating film 501C, the conductive film 104 is the conductive film 504, and the stacked film in which the insulating film 106 and the insulating film 107 are stacked is the insulating film 506. Insulating the oxide semiconductor film 108 as the semiconductor film 508, the conductive film 112a as the conductive film 512A, the conductive film 112b as the conductive film 512B, and the insulating film 114 and the insulating film 116 as the insulating film 516 The film 118 can be replaced with the insulating film 518.

The transistor 100 includes a conductive film 104 which functions as a gate electrode over a substrate 102, an insulating film 106 over the substrate 102 and the conductive film 104, an insulating film 107 over the insulating film 106, and an oxide semiconductor film over the insulating film 107. 108, a conductive film 112a which functions as a source electrode electrically connected to the oxide semiconductor film 108, and a conductive film 112b which functions as a drain electrode electrically connected to the oxide semiconductor film 108. In addition, insulating films 114 and 116 and an insulating film 118 are provided over the transistor 100, more specifically, the conductive films 112a and 112b and the oxide semiconductor film 108. The insulating films 114, 116, and 118 have a function as protective insulating films of the transistor 100.

The oxide semiconductor film 108 includes a first oxide semiconductor film 108a on the conductive film 104 side which functions as a gate electrode and a second oxide semiconductor film 108b over the first oxide semiconductor film 108a. Have. The insulating films 106 and 107 have a function as a gate insulating film of the transistor 100.

As the oxide semiconductor film 108, an In-M (M represents Ti, Ga, Sn, Y, Zr, La, Ce, Nd, or Hf) oxide or an In-M-Zn oxide is used. it can. In particular, it is preferable to use an In-M-Zn oxide for the oxide semiconductor film 108.

In addition, the first oxide semiconductor film 108a has a first region in which the atomic ratio of In is higher than that of M. In addition, the second oxide semiconductor film 108b has a second region in which the atomic ratio of In is smaller than that of the first oxide semiconductor film 108a. In addition, the second region has a portion thinner than the first region.

When the first oxide semiconductor film 108a includes the first region in which the atomic ratio of In is higher than that of M, the field-effect mobility of the transistor 100 (may be simply referred to as mobility or μFE). Can be higher. Specifically, the field-effect mobility of the transistor 100 can exceed 10 cm ² /Vs.

For example, when the above-described transistor having high field-effect mobility is used for a gate driver that generates a gate signal (in particular, a demultiplexer connected to the output terminal of a shift register included in the gate driver), the frame width is narrow (narrow). A semiconductor device or a display device can be provided.

On the other hand, when the first oxide semiconductor film 108a has the first region in which the atomic ratio of In is higher than the atomic ratio of M, the electrical characteristics of the transistor 100 are likely to change during light irradiation. However, in the semiconductor device of one embodiment of the present invention, the second oxide semiconductor film 108b is formed over the first oxide semiconductor film 108a. In addition, the thickness of the channel region of the second oxide semiconductor film 108b is smaller than that of the first oxide semiconductor film 108a.

Further, since the second oxide semiconductor film 108b has the second region in which the atomic ratio of In is smaller than that of the first oxide semiconductor film 108a, Eg is larger than that of the first oxide semiconductor film 108a. Become. Therefore, the oxide semiconductor film 108, which has a stacked-layer structure of the first oxide semiconductor film 108a and the second oxide semiconductor film 108b, has high resistance to the negative optical bias stress test.

With the oxide semiconductor film having the above structure, the amount of light absorbed by the oxide semiconductor film 108 at the time of light irradiation can be reduced. Therefore, variation in electric characteristics of the transistor 100 at the time of light irradiation can be suppressed. In addition, in the semiconductor device of one embodiment of the present invention, the insulating film 114 or the insulating film 116 contains excess oxygen; thus, fluctuations in electrical characteristics of the transistor 100 due to light irradiation can be further suppressed. ..

Here, the oxide semiconductor film 108 is described in detail with reference to FIG.

24B is an enlarged cross-sectional view of the vicinity of the oxide semiconductor film 108 in the cross section of the transistor 100 illustrated in FIG.

In FIG. 24B, the thickness of the first oxide semiconductor film 108a is shown as t1, and the thickness of the second oxide semiconductor film 108b is shown as t2-1 and t2-2. Since the second oxide semiconductor film 108b is provided over the first oxide semiconductor film 108a, the first oxide semiconductor film 108a is etched by an etching gas or an etching gas when the conductive films 112a and 112b are formed. Not exposed to solution etc. Therefore, in the first oxide semiconductor film 108a, there is no or very little film loss. On the other hand, in the second oxide semiconductor film 108b, when the conductive films 112a and 112b are formed, a portion of the second oxide semiconductor film 108b which does not overlap with the conductive films 112a and 112b is etched to form a depressed portion. It That is, the thickness of a region of the second oxide semiconductor film 108b which overlaps with the conductive films 112a and 112b is t2-1, and the thickness of a region of the second oxide semiconductor film 108b which does not overlap with the conductive films 112a and 112b is equal to t2-1. It becomes t2-2.

The thickness relationship between the first oxide semiconductor film 108a and the second oxide semiconductor film 108b is preferably t2-1>t1>t2-2. With such a film thickness relationship, a transistor having high field-effect mobility and a small amount of change in threshold voltage during light irradiation can be obtained.

Further, in the oxide semiconductor film 108 included in the transistor 100, when oxygen vacancies are formed, electrons that are carriers are generated, so that the oxide semiconductor film 108 tends to have normally-on characteristics. Therefore, it is important to reduce oxygen vacancies in the oxide semiconductor film 108, particularly oxygen vacancies in the first oxide semiconductor film 108a in order to obtain stable transistor characteristics. Therefore, in the structure of the transistor of one embodiment of the present invention, excess oxygen is introduced into the insulating film over the oxide semiconductor film 108, here, the insulating film 114 and/or the insulating film 116 over the oxide semiconductor film 108. Accordingly, oxygen is moved from the insulating film 114 and/or the insulating film 116 into the oxide semiconductor film 108, so that oxygen vacancies in the oxide semiconductor film 108, particularly in the first oxide semiconductor film 108a, are filled. Characterize.

It is more preferable that the insulating films 114 and 116 have a region containing oxygen in excess of the stoichiometric composition (oxygen excess region). In other words, the insulating films 114 and 116 are insulating films capable of releasing oxygen. Note that in order to provide the oxygen-excessive regions in the insulating films 114 and 116, oxygen is introduced into the insulating films 114 and 116 after film formation to form the oxygen-excessive regions, for example. As a method for introducing oxygen, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, plasma treatment, or the like can be used.

In addition, in order to fill oxygen vacancies in the first oxide semiconductor film 108a, it is preferable to reduce the thickness of the second oxide semiconductor film 108b in the vicinity of the channel region. Therefore, the relationship of t2-2<t1 should be satisfied. For example, the thickness of the second oxide semiconductor film 108b in the vicinity of the channel region is preferably 1 nm to 20 nm, more preferably 3 nm to 10 nm.

Hereinafter, other components included in the semiconductor device of this embodiment will be described in detail.

"substrate"
There is no particular limitation on the material of the substrate 102, but it is necessary that the substrate 102 have at least heat resistance high enough to withstand heat treatment performed later. For example, a glass substrate, a ceramic substrate, a quartz substrate, a sapphire substrate, or the like may be used as the substrate 102. Alternatively, a single crystal semiconductor substrate formed using silicon or silicon carbide, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, an SOI substrate, or the like can be used, and a semiconductor element is provided over these substrates. Alternatively, the substrate may be used as the substrate 102.

Alternatively, a flexible substrate may be used as the substrate 102, and the transistor 100 may be formed directly on the flexible substrate. Alternatively, a separation layer may be provided between the substrate 102 and the transistor 100. The peeling layer can be used for separating a semiconductor device over the peeling layer, separating it from the substrate 102, and transferring it to another substrate. At that time, the transistor 100 can be transferred to a substrate having low heat resistance or a flexible substrate.

<<Conductive film that functions as gate electrode, source electrode, and drain electrode>>
As the conductive film 104 which functions as a gate electrode, the conductive film 112a which functions as a source electrode, and the conductive film 112b which functions as a drain electrode, chromium (Cr), copper (Cu), aluminum (Al), and gold (Au) are used. , Silver (Ag), zinc (Zn), molybdenum (Mo), tantalum (Ta), titanium (Ti), tungsten (W), manganese (Mn), nickel (Ni), iron (Fe), cobalt (Co). It can be formed by using a metal element selected from the above, an alloy containing the above metal element as a component, an alloy in which the above metal elements are combined, or the like.

The conductive films 104, 112a, and 112b may have a single-layer structure or a stacked structure including two or more layers. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which a titanium film is stacked over an aluminum film, a two-layer structure in which a titanium film is stacked over a titanium nitride film, and a tungsten film is stacked over a titanium nitride film. There are a layer structure, a two-layer structure in which a tungsten film is stacked on a tantalum nitride film or a tungsten nitride film, a titanium film, and a three-layer structure in which an aluminum film is stacked on the titanium film and a titanium film is further formed thereon. is there. Alternatively, an alloy film or a nitride film in which aluminum is combined with one or more selected from titanium, tantalum, tungsten, molybdenum, chromium, neodymium, and scandium may be used.

The conductive films 104, 112a, and 112b have indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, and indium tin oxide containing titanium oxide. Alternatively, a light-transmitting conductive material such as indium zinc oxide, indium tin oxide to which silicon oxide is added, or the like can be used.

A Cu—X alloy film (X is Mn, Ni, Cr, Fe, Co, Mo, Ta, or Ti) may be applied to the conductive films 104, 112a, and 112b. By using the Cu-X alloy film, it is possible to process by a wet etching process, so that the manufacturing cost can be suppressed.

<<Insulating film that functions as a gate insulating film>>
As the insulating films 106 and 107 which function as gate insulating films of the transistor 100, a silicon oxide film, a silicon oxynitride film, a nitride nitride film is formed by a plasma chemical vapor deposition (PECVD) method, a sputtering method, or the like. One or more of silicon oxide film, silicon nitride film, aluminum oxide film, hafnium oxide film, yttrium oxide film, zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film, cerium oxide film and neodymium oxide film. The insulating film containing can be used, respectively. Note that a single-layer insulating film selected from the above materials or an insulating film having three or more layers may be used instead of the stacked structure of the insulating films 106 and 107.

The insulating film 106 also has a function as a blocking film that suppresses oxygen permeation. For example, in the case where excess oxygen is supplied to the insulating films 107, 114, 116, and/or the oxide semiconductor film 108, the insulating film 106 can suppress permeation of oxygen.

Note that the insulating film 107 which is in contact with the oxide semiconductor film 108 which functions as a channel region of the transistor 100 is preferably an oxide insulating film and is a region containing oxygen in excess of the stoichiometric composition (oxygen excess region). ) Is more preferable. In other words, the insulating film 107 is an insulating film capable of releasing oxygen. Note that the oxygen excess region may be provided in the insulating film 107, for example, by forming the insulating film 107 in an oxygen atmosphere. Alternatively, oxygen may be introduced into the formed insulating film 107 to form an oxygen excess region. As a method for introducing oxygen, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, plasma treatment, or the like can be used.

When hafnium oxide is used as the insulating film 107, the following effects are obtained. Hafnium oxide has a higher relative dielectric constant than silicon oxide or silicon oxynitride. Therefore, the film thickness can be increased as compared with the case where silicon oxide is used, so that the leakage current due to the tunnel current can be reduced. That is, a transistor with a small off-state current can be realized. Further, hafnium oxide having a crystalline structure has a higher relative dielectric constant than hafnium oxide having an amorphous structure. Therefore, it is preferable to use hafnium oxide having a crystal structure in order to obtain a transistor with a low off-state current. Examples of the crystal structure include monoclinic system and cubic system. However, one embodiment of the present invention is not limited to these.

Note that in this embodiment mode, a silicon nitride film is formed as the insulating film 106 and a silicon oxide film is formed as the insulating film 107. Since the silicon nitride film has a higher relative permittivity than a silicon oxide film and a large film thickness necessary to obtain a capacitance equivalent to that of the silicon oxide film, a silicon nitride film is used as a gate insulating film of the transistor 150. By including, the insulating film can be physically thickened. Therefore, a decrease in withstand voltage of the transistor 100 can be suppressed, and further, the withstand voltage can be improved and electrostatic breakdown of the transistor 100 can be suppressed.

<<Oxide semiconductor film>>
The oxide semiconductor film 108 can be formed using any of the above materials.

In the case where the oxide semiconductor film 108 is an In-M-Zn oxide, the atomic ratio of metal elements of a sputtering target used for forming the In-M-Zn oxide satisfies In?M and Zn?M. It is preferable. As the atomic ratio of the metal elements of such a sputtering target, In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:. 3, In:M:Zn=3:1:2, and In:M:Zn=4:2:4.1 are preferable.

In the case where the oxide semiconductor film 108 is an In-M-Zn oxide, it is preferable to use a target including a polycrystalline In-M-Zn oxide as a sputtering target. By using a target including a polycrystalline In-M-Zn oxide, the oxide semiconductor film 108 having crystallinity can be easily formed. Note that the atomic ratio of the formed oxide semiconductor film 108 includes a variation of ±40% in the atomic ratio of the metal element contained in the sputtering target as an error. For example, when the atomic ratio of In:Ga:Zn=4:2:4.1 is used as the sputtering target, the atomic ratio of the oxide semiconductor film 108 to be formed is In:Ga:Zn=4:. It may be around 2:3.

For example, as the first oxide semiconductor film 108a, In:M:Zn=2:1:3, In:M:Zn=3:1:2, and In:M:Zn=4:2:4 described above. It may be formed using a sputtering target of No. 1 or the like. Further, the second oxide semiconductor film 108b may be formed using the above In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, or the like. Note that the atomic ratio of the metal elements of the sputtering target used for the second oxide semiconductor film 108b does not need to satisfy In≧M and Zn≧M, and may be a composition that satisfies In≧M and Zn<M. Specifically, In:M:Zn=1:3:2 and the like can be mentioned.

The oxide semiconductor film 108 has an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more. Thus, the off-state current of the transistor 100 can be reduced by using an oxide semiconductor with a wide energy gap. In particular, an oxide semiconductor film having an energy gap of 2 eV or more, preferably 2 eV or more and 3.0 eV or less is used for the first oxide semiconductor film 108 a, and an energy gap of 2 eV or more is used for the second oxide semiconductor film 108 b. It is preferable to use an oxide semiconductor film of 0.5 eV or more and 3.5 eV or less. In addition, it is preferable that the energy gap of the second oxide semiconductor film 108b be larger than that of the first oxide semiconductor film 108a.

The thickness of each of the first oxide semiconductor film 108a and the second oxide semiconductor film 108b is 3 nm or more and 200 nm or less, preferably 3 nm or more and 100 nm or less, more preferably 3 nm or more and 50 nm or less. Note that it is preferable that the above-described relationship of film thickness be satisfied.

An oxide semiconductor film having a low carrier density is used as the second oxide semiconductor film 108b. For example, the second oxide semiconductor film 108b has a carrier density of 1×10 ¹⁷ pieces/cm ³ or lower, preferably 1×10 ¹⁵ pieces/cm ³ or lower, more preferably 1×10 ¹³ pieces/cm ³ or lower, More preferably, it is 1×10 ¹¹ pieces/cm ³ or less.

Note that the composition is not limited to these, and a material having an appropriate composition may be used depending on required semiconductor characteristics and electrical characteristics of a transistor (such as field-effect mobility and threshold voltage). In addition, in order to obtain required semiconductor characteristics of the transistor, carrier density, impurity concentration, defect density of the first oxide semiconductor film 108a and the second oxide semiconductor film 108b, atomic ratio of metal element to oxygen, and the like. It is preferable that the interatomic distance, the density and the like are appropriate.

Note that as the first oxide semiconductor film 108a and the second oxide semiconductor film 108b, an oxide semiconductor film having a low impurity concentration and a low density of defect states is used, so that further excellent electrical characteristics can be obtained. A transistor having the above can be manufactured, which is preferable. Here, a low impurity concentration and a low density of defect states (a small number of oxygen vacancies) is referred to as high-purity intrinsic or substantially high-purity intrinsic. A highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has few carrier generation sources and thus can have a low carrier density. Thus, a transistor in which a channel region is formed in the oxide semiconductor film rarely has negative threshold voltage (is rarely normally on). Further, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states and thus has a low density of trap states in some cases. Further, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a significantly small off-state current, has a channel width of 1×10 ⁶ μm, and has a channel length L of 10 μm. When the voltage between the drain electrodes (drain voltage) is in the range of 1 V to 10 V, it is possible to obtain a characteristic that the off current is less than the measurement limit of the semiconductor parameter analyzer, that is, 1×10 ⁻¹³ A or less.

Therefore, a transistor in which a channel region is formed in the high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor film can be a highly reliable transistor with less variation in electric characteristics. Note that the charge trapped in the trap level of the oxide semiconductor film takes a long time to disappear and may behave like fixed charge. Therefore, electric characteristics of a transistor in which a channel region is formed in an oxide semiconductor film with high trap level density might be unstable. Impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, and the like.

Hydrogen contained in the oxide semiconductor film reacts with oxygen bonded to a metal atom to be water, and also forms oxygen vacancies in a lattice from which oxygen is released (or a portion from which oxygen is released). When hydrogen enters the oxygen vacancies, electrons which are carriers may be generated. Further, part of hydrogen may be bonded to oxygen which is bonded to a metal atom to generate an electron which is a carrier. Therefore, a transistor including an oxide semiconductor film containing hydrogen is likely to have normally-on characteristics. Therefore, it is preferable that hydrogen in the oxide semiconductor film 108 be reduced as much as possible. Specifically, in the oxide semiconductor film 108, the hydrogen concentration obtained by SIMS analysis is 2×10 ²⁰ atoms/cm ³ or lower, preferably 5×10 ¹⁹ atoms/cm ³ or lower, more preferably 1×10 ¹⁹ or lower. atoms/cm ³ or less, 5×10 ¹⁸ atoms/cm ³ or less, preferably 1×10 ¹⁸ atoms/cm ³ or less, more preferably 5×10 ¹⁷ atoms/cm ³ or less, further preferably 1×10 ¹⁶ atoms/cm ³ or less. and cm ³ or less.

In addition, the first oxide semiconductor film 108a preferably has a portion where the hydrogen concentration is lower than that of the second oxide semiconductor film 108b. The first oxide semiconductor film 108a has a portion where the hydrogen concentration is lower than that of the second oxide semiconductor film 108b, whereby a highly reliable semiconductor device can be obtained.

In addition, when the first oxide semiconductor film 108a contains silicon or carbon which is one of Group 14 elements, oxygen vacancies in the first oxide semiconductor film 108a increase and the oxide becomes n-type. Therefore, the concentration of silicon or carbon in the first oxide semiconductor film 108a and the concentration of silicon or carbon near the interface with the first oxide semiconductor film 108a (concentration obtained by SIMS analysis) are 2×10. ^{It is 18} atoms/cm ³ or less, preferably 2×10 ¹⁷ atoms/cm ³ or less.

In the first oxide semiconductor film 108a, the concentration of alkali metal or alkaline earth metal obtained by SIMS analysis is 1×10 ¹⁸ atoms/cm ³ or less, preferably 2×10 ¹⁶ atoms/cm ³ or less. To do. Alkali metal and alkaline earth metal may generate carriers when combined with an oxide semiconductor, which might increase off-state current of the transistor. Therefore, it is preferable to reduce the concentration of the alkali metal or the alkaline earth metal in the first oxide semiconductor film 108a.

Further, when nitrogen is contained in the first oxide semiconductor film 108a, electrons that are carriers are generated, carrier density is increased, and n-type is easily generated. As a result, a transistor including an oxide semiconductor film containing nitrogen is likely to have normally-on characteristics. Therefore, in the oxide semiconductor film, nitrogen is preferably reduced as much as possible. For example, the nitrogen concentration obtained by SIMS analysis is preferably 5×10 ¹⁸ atoms/cm ³ or less.

Further, each of the first oxide semiconductor film 108a and the second oxide semiconductor film 108b may have a non-single-crystal structure. The non-single-crystal structure includes, for example, a CAAC-OS (C Axis Aligned Crystalline Oxide Semiconductor), a polycrystalline structure, a microcrystalline structure, or an amorphous structure, which will be described later. In the non-single-crystal structure, the amorphous structure has the highest defect level density and the CAAC-OS has the lowest defect level density.

<<Insulating film that functions as a protective insulating film for transistors>>
The insulating films 114 and 116 have a function of supplying oxygen to the oxide semiconductor film 108. The insulating film 118 has a function as a protective insulating film of the transistor 100. The insulating films 114 and 116 contain oxygen. The insulating film 114 is an insulating film that can transmit oxygen. Note that the insulating film 114 also functions as a damage mitigating film for the oxide semiconductor film 108 when the insulating film 116 to be formed later is formed.

As the insulating film 114, silicon oxide, silicon oxynitride, or the like having a thickness of 5 nm to 150 nm inclusive, preferably 5 nm to 50 nm inclusive can be used.

Further, the insulating film 114 preferably has a small amount of defects, and typically, by ESR measurement, a spin density of a signal which appears at g=2.001 which is derived from a dangling bond of silicon is 3×10 ¹⁷ spins/. It is preferably cm ³ or less. This is because if the density of defects in the insulating film 114 is high, oxygen is bonded to the defects and the amount of oxygen that permeates the insulating film 114 is reduced.

Note that in the insulating film 114, some oxygen which enters the insulating film 114 from the outside does not move to the outside of the insulating film 114 and remains in the insulating film 114 in some cases. In addition, when oxygen enters the insulating film 114 and oxygen contained in the insulating film 114 moves to the outside of the insulating film 114, oxygen may move in the insulating film 114. When an oxide insulating film which can transmit oxygen is formed as the insulating film 114, oxygen released from the insulating film 116, which is provided over the insulating film 114, moves to the oxide semiconductor film 108 through the insulating film 114. Can be made.

The insulating film 114 can be formed using an oxide insulating film having a low level density due to nitrogen oxide. Note that the level density due to the nitrogen oxide can be formed between energy (Ev_os) at the upper end of the valence band of the oxide semiconductor film and energy (Ec_os) at the lower end of the conduction band of the oxide semiconductor film. There are cases. As the oxide insulating film, a silicon oxynitride film that releases a small amount of nitrogen oxide, an aluminum oxynitride film that releases a small amount of nitrogen oxide, or the like can be used.

Note that a silicon oxynitride film that releases a small amount of nitrogen oxide is a film that releases more ammonia than the amount of released nitrogen oxide in a thermal desorption gas analysis method. Is 1×10 ¹⁸ pieces/cm ³ or more and 5×10 ¹⁹ pieces/cm ³ or less. Note that the amount of released ammonia is an amount released by heat treatment at a surface temperature of the film of 50° C. to 650° C., preferably 50° C. to 550° C.

Nitrogen oxide (NO _x , x is 0 or more and 2 or less, preferably 1 or more and 2 or less), typically NO ₂ or NO forms a level in the insulating film 114 or the like. The level is located in the energy gap of the oxide semiconductor film 108. Therefore, when nitrogen oxide diffuses to the interface between the insulating film 114 and the oxide semiconductor film 108, the level may trap electrons on the insulating film 114 side. As a result, the trapped electrons remain in the vicinity of the interface between the insulating film 114 and the oxide semiconductor film 108, so that the threshold voltage of the transistor is shifted in the positive direction.

In addition, nitrogen oxides react with ammonia and oxygen in heat treatment. The nitrogen oxide contained in the insulating film 114 reacts with ammonia contained in the insulating film 116 in the heat treatment, so that the nitrogen oxide contained in the insulating film 114 is reduced. Therefore, electrons are less likely to be trapped at the interface between the insulating film 114 and the oxide semiconductor film 108.

By using the above oxide insulating film as the insulating film 114, shift of the threshold voltage of the transistor can be reduced and variation in electric characteristics of the transistor can be reduced.

Note that the insulating film 114 has a g-value of 2.037 or more in a spectrum obtained by measurement with an ESR of 100 K or less by heat treatment in a manufacturing process of a transistor, typically 300° C. or higher and lower than 350° C. A first signal of 2.039 or less, a second signal of g value of 2.001 or more and 2.003 or less, and a third signal of g value of 1.964 or more and 1.966 or less are observed. The split width of the first signal and the second signal and the split width of the second signal and the third signal are about 5 mT in the ESR measurement of the X band. Further, a first signal having a g value of 2.037 to 2.039, a second signal having a g value of 2.001 to 2.003, and a g value of 1.964 to 1.966. The total spin density of the third signal is less than 1×10 ¹⁸ spins/cm ³ , typically 1×10 ¹⁷ spins/cm ³ or more and less than 1×10 ¹⁸ spins/cm ³ .

In the ESR spectrum of 100 K or less, a first signal having a g value of 2.037 or more and 2.039 or less, a second signal having a g value of 2.001 or more and 2.003 or less, and a g value of 1.964 or more 1 The third signal of 0.966 or less corresponds to a signal caused by nitrogen oxide (NO _x , x is 0 or more and 2 or less, preferably 1 or more and 2 or less). Typical examples of nitrogen oxides include nitric oxide and nitrogen dioxide. That is, the first signal having a g value of 2.037 or more and 2.039 or less, the second signal having a g value of 2.001 or more and 2.003 or less, and the g value of 1.964 or more and 1.966 or less. It can be said that the smaller the total sum of spin densities of the third signal, the smaller the content of nitrogen oxide contained in the oxide insulating film.

Further, the oxide insulating film has a nitrogen concentration measured by SIMS of 6×10 ²⁰ atoms/cm ³ or less.

The surface temperature of the film is 220° C. or higher and 350° C. or lower, and the oxide insulating film is formed by a PECVD method using silane and dinitrogen monoxide to form a dense and high hardness film. Can be formed.

The insulating film 116 is formed using an oxide insulating film which contains more oxygen than oxygen which satisfies the stoichiometric composition. In the oxide insulating film containing oxygen in excess of the stoichiometric composition, part of oxygen is released by heating. An oxide insulating film containing more oxygen than the stoichiometric composition has a desorption amount of oxygen of 1.0×10 ¹⁹ atoms/cm ³ or more in terms of oxygen atoms in TDS analysis. , And preferably an oxide insulating film having a density of 3.0×10 ²⁰ atoms/cm ³ or more. The surface temperature of the film in the TDS is preferably 100° C. or higher and 700° C. or lower, or 100° C. or higher and 500° C. or lower.

As the insulating film 116, silicon oxide, silicon oxynitride, or the like having a thickness of 30 nm to 500 nm, preferably 50 nm to 400 nm can be used.

Further, the insulating film 116 preferably has a small amount of defects, and typically, the spin density of a signal appearing at g=2.001 derived from a dangling bond of silicon is 1.5×10 ¹⁸ by ESR measurement. It is preferably less than spins/cm ³ , and more preferably 1×10 ¹⁸ spins/cm ³ or less. Note that the insulating film 116 is farther from the oxide semiconductor film 108 than the insulating film 114, and thus may have higher defect density than the insulating film 114.

Further, since the insulating films 114 and 116 can be formed of the same kind of material, the interface between the insulating films 114 and 116 may not be clearly confirmed. Therefore, in this embodiment, the interface between the insulating film 114 and the insulating film 116 is illustrated by a broken line. Although a two-layer structure of the insulating film 114 and the insulating film 116 has been described in this embodiment, the present invention is not limited to this and may have a single-layer structure of the insulating film 114, for example.

The insulating film 118 contains nitrogen. The insulating film 118 contains nitrogen and silicon. The insulating film 118 has a function of blocking oxygen, hydrogen, water, alkali metal, alkaline earth metal, and the like. By providing the insulating film 118, diffusion of oxygen from the oxide semiconductor film 108 to the outside, diffusion of oxygen contained in the insulating films 114 and 116 to the outside, hydrogen from the outside to the oxide semiconductor film 108, It is possible to prevent water from entering. As the insulating film 118, for example, a nitride insulating film can be used. Examples of the nitride insulating film include silicon nitride, silicon nitride oxide, aluminum nitride, aluminum nitride oxide, and the like. Note that an oxide insulating film having a blocking effect against oxygen, hydrogen, water, or the like may be provided instead of the nitride insulating film having a blocking effect against oxygen, hydrogen, water, an alkali metal, an alkaline earth metal, or the like. Examples of the oxide insulating film having a blocking effect against oxygen, hydrogen, water, and the like include aluminum oxide, aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide, yttrium oxynitride, hafnium oxide, hafnium oxynitride, and the like.

Although various films such as a conductive film, an insulating film, and an oxide semiconductor film described above can be formed by a sputtering method or a PECVD method, another method such as a thermal CVD (Chemical Vapor Deposition) method can be used. You may form by. As an example of the thermal CVD method, a MOCVD (Metal Organic Chemical Vapor Deposition) method or an ALD (Atomic Layer Deposition) method may be used.

Since the thermal CVD method is a film forming method that does not use plasma, it has an advantage that defects are not generated due to plasma damage.

In the thermal CVD method, a raw material gas and an oxidant may be simultaneously sent into a chamber, the inside of the chamber may be at atmospheric pressure or reduced pressure, and the film may be deposited by reacting in the vicinity of the substrate or on the substrate and depositing on the substrate. ..

Further, in the ALD method, the inside of the chamber may be under atmospheric pressure or reduced pressure, raw material gases for the reaction may be sequentially introduced into the chamber, and the order of gas introduction may be repeated to form a film. For example, by switching respective switching valves (also called high-speed valves), two or more kinds of raw material gases are sequentially supplied to the chamber, and the first raw material gas is mixed with the first raw material gas or at the same time after that so that plural kinds of raw material gases are not mixed. An active gas (argon, nitrogen, etc.) is introduced, and a second source gas is introduced. When the inert gas is introduced at the same time, the inert gas becomes a carrier gas, and the inert gas may be introduced at the same time when the second source gas is introduced. Further, instead of introducing the inert gas, the second raw material gas may be introduced after exhausting the first raw material gas by vacuum evacuation. The first source gas is adsorbed on the surface of the substrate to form the first layer, and reacts with the second source gas introduced later, so that the second layer is laminated on the first layer. A thin film is formed. By repeating the gas introduction sequence a plurality of times until the desired thickness is achieved, a thin film having excellent step coverage can be formed. Since the thickness of the thin film can be adjusted by the number of times the gas introduction sequence is repeated, it is possible to precisely adjust the film thickness, which is suitable for producing a fine FET.

The thermal CVD method such as the MOCVD method and the ALD method can form various films such as the conductive film, the insulating film, the oxide semiconductor film, and the metal oxide film of the above-described embodiment. For example, an In-Ga-ZnO film. When forming a film, trimethylindium, trimethylgallium, and dimethylzinc are used. The chemical formula of trimethylindium is In(CH ₃ ) ₃ . The chemical formula of trimethylgallium is Ga(CH ₃ ) ₃ . The chemical formula of dimethylzinc is Zn(CH ₃ ) ₂ . Further, without being limited to these combinations, triethylgallium (chemical formula Ga(C ₂ H ₅ ) ₃ ) can be used instead of trimethylgallium, and diethyl zinc (chemical formula Zn(C ₂ H ₅ )) can be used instead of dimethylzinc. ₂ ) can also be used.

For example, when a hafnium oxide film is formed by a film forming apparatus utilizing ALD, a liquid containing a solvent and a hafnium precursor compound (hafnium alkoxide or hafnium amide such as tetrakisdimethylamide hafnium (TDMAH)) is vaporized. Two kinds of gases are used, a raw material gas and ozone (O ₃ ) as an oxidant. The chemical formula of tetrakisdimethylamido hafnium is Hf[N(CH ₃ ) ₂ ] ₄ . Further, as another material liquid, there is tetrakis(ethylmethylamido)hafnium or the like.

For example, when an aluminum oxide film is formed by a film forming apparatus using ALD, a raw material gas obtained by vaporizing a liquid containing a solvent and an aluminum precursor compound (trimethylaluminum (TMA), etc.) and H ₂ as an oxidant. Two kinds of gas of O are used. The chemical formula of trimethylaluminum is Al(CH ₃ ) ₃ . Other material liquids include tris(dimethylamide)aluminum, triisobutylaluminum, aluminum tris(2,2,6,6-tetramethyl-3,5-heptanedionate), and the like.

For example, when a silicon oxide film is formed by a film forming apparatus using ALD, hexachlorodisilane is adsorbed on the film formation surface, chlorine contained in the adsorbed material is removed, and an oxidizing gas (O ₂ , monoxide is used). Dinitrogen) radicals are supplied to react with the adsorbate.

For example, when forming a tungsten film by a film forming apparatus using ALD, WF ₆ gas and B ₂ H ₆ gas are sequentially and repeatedly introduced to form an initial tungsten film, and then WF ₆ gas and H ₂ gas are added. A tungsten film is formed using gas. Note that SiH ₄ gas may be used instead of B ₂ H ₆ gas.

For example, in the case of forming an oxide semiconductor film, for example, an In—Ga—ZnO film by a film formation apparatus utilizing ALD, In(CH ₃ ) ₃ gas and O ₃ gas are sequentially and repeatedly introduced to introduce In—O. A layer is formed, then a GaO layer is formed using Ga(CH ₃ ) ₃ gas and O ₃ gas, and then a ZnO layer is formed using Zn(CH ₃ ) ₂ gas and O ₃ gas. The order of these layers is not limited to this example. Further, a mixed compound layer such as an In—Ga—O layer, an In—Zn—O layer, or a Ga—Zn—O layer may be formed by mixing these gases. Incidentally, the O ₃ gas may be used the H _{2 O} gas obtained by bubbling with an inert gas such as Ar in place of, but better to use an O ₃ gas containing no H are preferred. Further, In(C ₂ H ₅ ) ₃ gas may be used instead of In(CH ₃ ) ₃ gas. Further, Ga(C ₂ H ₅ ) ₃ gas may be used instead of Ga(CH ₃ ) ₃ gas. Alternatively, Zn(CH ₃ ) ₂ gas may be used.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 4)
In this embodiment, a structure of a transistor that can be used in the display panel of one embodiment of the present invention will be described with reference to FIGS.

<Example of configuration of semiconductor device>
25A is a top view of the transistor 100, and FIG. 25B corresponds to a cross-sectional view taken along a cutting line X1-X2 in FIG. 25A, and FIG. 25A corresponds to a cross-sectional view of the cross section taken along the line Y1-Y2 shown in FIG. Note that in FIG. 25A, some components of the transistor 100 (such as an insulating film functioning as a gate insulating film) are omitted in order to avoid complexity. The cutting line X1-X2 direction may be referred to as a channel length direction, and the cutting line Y1-Y2 direction may be referred to as a channel width direction. Note that in the top view of the transistor, some of the components are omitted in the following drawings, as in FIG. 25A, in some cases.

Note that the transistor 100 can be used for the display panel described in Embodiment 1.

For example, when the transistor 100 is used for the transistor MD, the substrate 102 is used as the third insulating film 501C, the conductive film 104 is used as the conductive film 504, and the stacked film in which the insulating film 106 and the insulating film 107 are stacked is used as the insulating film 506. Insulating the oxide semiconductor film 108 as the semiconductor film 508, the conductive film 112a as the conductive film 512A, the conductive film 112b as the conductive film 512B, and the insulating film 114 and the insulating film 116 as the insulating film 516 The film 118 can be replaced with the insulating film 518, and the conductive film 120b can be replaced with the conductive film 524.

The transistor 100 includes a conductive film 104 which functions as a first gate electrode over a substrate 102, an insulating film 106 over the substrate 102 and the conductive film 104, an insulating film 107 over the insulating film 106, and an oxide over the insulating film 107. Object semiconductor film 108, a conductive film 112a which functions as a source electrode electrically connected to the oxide semiconductor film 108, and a conductive film 112b which functions as a drain electrode electrically connected to the oxide semiconductor film 108, The insulating films 114 and 116 over the oxide semiconductor film 108, the conductive films 112a, and 112b, the conductive film 120a which is provided over the insulating film 116, and is electrically connected to the conductive film 112b, and over the insulating film 116. The conductive film 120b and the insulating film 116 and the insulating film 118 over the conductive films 120a and 120b are included.

In addition, in the transistor 100, the insulating films 106 and 107 function as a first gate insulating film of the transistor 100, and the insulating films 114 and 116 function as a second gate insulating film of the transistor 100. However, the insulating film 118 has a function as a protective insulating film of the transistor 100. Note that in this specification and the like, the insulating films 106 and 107 are referred to as a first insulating film, the insulating films 114 and 116 are referred to as a second insulating film, and the insulating film 118 is referred to as a third insulating film. is there.

Note that the conductive film 120b can be used for the second gate electrode of the transistor 100.

When the transistor 100 is used for a pixel portion of a display panel, the conductive film 120a can be used for an electrode of a display element or the like.

The oxide semiconductor film 108 includes the oxide semiconductor film 108b on the conductive film 104 side which functions as a first gate electrode and the oxide semiconductor film 108c over the oxide semiconductor film 108b. In addition, the oxide semiconductor film 108b and the oxide semiconductor film 108c include In, M (M is Al, Ga, Y, or Sn), and Zn.

For example, the oxide semiconductor film 108b preferably includes a region where the atomic ratio of In is higher than that of M. Further, the oxide semiconductor film 108c preferably has a region in which the number of In atoms is smaller than that of the oxide semiconductor film 108b.

When the oxide semiconductor film 108b has a region where the atomic ratio of In is higher than the atomic ratio of M, the field-effect mobility of the transistor 100 (may be simply referred to as mobility or μFE) can be increased. it can. Specifically, the field-effect mobility of the transistor 100 can exceed 10 cm ² /Vs, and more preferably the field-effect mobility of the transistor 100 can exceed 30 cm ² /Vs.

For example, when the above-described transistor having high field-effect mobility is used for a gate driver that generates a gate signal (in particular, a demultiplexer connected to the output terminal of a shift register included in the gate driver), the frame width is narrow (narrow). A semiconductor device or a display device can be provided.

On the other hand, in the case where the oxide semiconductor film 108b has a region where the atomic ratio of In is higher than the atomic ratio of M, the electrical characteristics of the transistor 100 are likely to change during light irradiation. However, in the semiconductor device of one embodiment of the present invention, the oxide semiconductor film 108c is formed over the oxide semiconductor film 108b. Further, since the oxide semiconductor film 108c has a region where the atomic ratio of In is smaller than that of the oxide semiconductor film 108b, Eg is higher than that of the oxide semiconductor film 108b. Therefore, the oxide semiconductor film 108, which has a stacked-layer structure of the oxide semiconductor film 108b and the oxide semiconductor film 108c, can have higher resistance in the negative optical bias stress test.

In addition, impurities such as hydrogen or moisture mixed in the oxide semiconductor film 108, particularly in the channel region of the oxide semiconductor film 108b affect the transistor characteristics, which causes a problem. Therefore, it is preferable that the channel region in the oxide semiconductor film 108b contain less impurities such as hydrogen or moisture. In addition, oxygen vacancies formed in the channel region in the oxide semiconductor film 108b affect transistor characteristics, which causes a problem. For example, when oxygen vacancies are formed in the channel region of the oxide semiconductor film 108b, hydrogen is bonded to the oxygen vacancies and serves as a carrier supply source. When a carrier supply source is generated in the channel region of the oxide semiconductor film 108b, electric characteristics of the transistor 100 including the oxide semiconductor film 108b is changed, typically, a threshold voltage is shifted. Therefore, it is preferable that the oxygen vacancy in the channel region of the oxide semiconductor film 108b be as small as possible.

Therefore, in one embodiment of the present invention, an insulating film which is in contact with the oxide semiconductor film 108, specifically, an insulating film 107 which is formed below the oxide semiconductor film 108 and an insulating film which is formed above the oxide semiconductor film 108 are formed. The insulating films 114 and 116 thus formed contain excess oxygen. By moving oxygen or excess oxygen from the insulating film 107 and the insulating films 114 and 116 to the oxide semiconductor film 108, oxygen vacancies in the oxide semiconductor film can be reduced. Therefore, it is possible to suppress electrical characteristics of the transistor 100, in particular, fluctuation of the transistor 100 due to light irradiation.

In addition, in one embodiment of the present invention, since the insulating film 107 and the insulating films 114 and 116 contain excess oxygen, a manufacturing method in which the number of manufacturing steps is not increased or the number of manufacturing steps is extremely small is used. Therefore, the yield of the transistor 100 can be increased.

Specifically, in the step of forming the oxide semiconductor film 108b, the oxide semiconductor film 108b is formed in an atmosphere containing oxygen gas by a sputtering method, so that the surface where the oxide semiconductor film 108b is formed is formed. Then, oxygen or excess oxygen is added to the insulating film 107.

In addition, in the step of forming the conductive films 120a and 120b, the conductive films 120a and 120b are formed in an atmosphere containing oxygen gas by a sputtering method, so that the conductive films 120a and 120b are formed surfaces. Oxygen or excess oxygen is added to 116. Note that when oxygen or excess oxygen is added to the insulating film 116, oxygen or excess oxygen may be added to the insulating film 114 located below the insulating film 116 and the oxide semiconductor film 108.

<Oxide conductor>
Next, the oxide conductor will be described. In the step of forming the conductive films 120a and 120b, the conductive films 120a and 120b function as protective films which suppress release of oxygen from the insulating films 114 and 116. The conductive films 120a and 120b each have a function as a semiconductor before the step of forming the insulating film 118, and the conductive films 120a and 120b are made of a conductor after the step of forming the insulating film 118. Has the function of.

In order for the conductive films 120a and 120b to function as conductors, oxygen vacancies are formed in the conductive films 120a and 120b, and hydrogen is added to the oxygen vacancies from the insulating film 118, so that donor levels are formed in the vicinity of the conduction band. It As a result, the conductive films 120a and 120b have high conductivity and become conductors. The conductive films 120a and 120b that have been made conductive can be referred to as oxide conductors. In general, an oxide semiconductor has a large energy gap and thus has a property of transmitting visible light. On the other hand, the oxide conductor is an oxide semiconductor having a donor level near the conduction band. Therefore, the oxide conductor is less affected by absorption by the donor level and has a light-transmitting property similar to that of an oxide semiconductor with respect to visible light.

<Components of semiconductor device>
The components included in the semiconductor device of this embodiment will be described in detail below.

Note that as the following materials, the same materials as those described in Embodiment 3 can be used.

The material that can be used for the substrate 102 described in Embodiment 3 can be used for the substrate 102. In addition, a material that can be used for the insulating films 106 and 107 described in Embodiment 3 can be used for the insulating films 106 and 107.

Further, a material which can be used for the conductive film functioning as the gate electrode, the source electrode, and the drain electrode described in Embodiment 3 is used for the conductive film functioning as the first gate electrode, the source electrode, and the drain electrode. be able to.

<<Oxide semiconductor film>>
The oxide semiconductor film 108 can be formed using any of the above materials.

In the case where the oxide semiconductor film 108b is an In-M-Zn oxide, the atomic ratio of the metal elements in the sputtering target used for forming the In-M-Zn oxide preferably satisfies In>M. As the atomic ratio of the metal elements of such a sputtering target, In:M:Zn=2:1:3, In:M:Zn=3:1:2, In:M:Zn=4:2:4. 1 etc. are mentioned.

In the case where the oxide semiconductor film 108c is an In-M-Zn oxide, the atomic ratio of metal elements in the sputtering target used for forming the In-M-Zn oxide may satisfy In?M. preferable. As the atomic ratio of the metal elements of such a sputtering target, In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=1:3:. 2, In:M:Zn=1:3:4, In:M:Zn=1:3:6, In:M:Zn=1:4:5, and the like.

In the case where the oxide semiconductor film 108b and the oxide semiconductor film 108c are In-M-Zn oxides, a target including a polycrystalline In-M-Zn oxide is preferably used as a sputtering target. By using a target including a polycrystalline In-M-Zn oxide, the oxide semiconductor film 108b and the oxide semiconductor film 108c having crystallinity can be easily formed. Note that the atomic ratios of the oxide semiconductor film 108b and the oxide semiconductor film 108c which are formed each include a variation of ±40% in the atomic ratio of the metal elements contained in the above sputtering target as an error. For example, when the atomic ratio of In:Ga:Zn=4:2:4.1 is used as the sputtering target of the oxide semiconductor film 108b, the atomic ratio of the oxide semiconductor film 108b to be formed is In:Ga:Zn=4:2:4.1. Ga:Zn may be in the vicinity of 4:2:3.

The oxide semiconductor film 108 has an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more. Thus, the off-state current of the transistor 100 can be reduced by using an oxide semiconductor with a wide energy gap. In particular, an oxide semiconductor film having an energy gap of 2 eV or more, preferably 2 eV or more and 3.0 eV or less is used for the oxide semiconductor film 108 b, and an energy gap of 2.5 eV or more and 3.5 eV is used for the oxide semiconductor film 108 c. It is preferable to use the following oxide semiconductor films. In addition, it is preferable that the oxide semiconductor film 108c have a larger energy gap than the oxide semiconductor film 108b.

The thicknesses of the oxide semiconductor film 108b and the oxide semiconductor film 108c are each 3 nm to 200 nm, preferably 3 nm to 100 nm, further preferably 3 nm to 50 nm.

Further, as the oxide semiconductor film 108c, an oxide semiconductor film having a low carrier density is used. For example, the second oxide semiconductor film 108c has a carrier density of 1×10 ¹⁷ pieces/cm ³ or lower, preferably 1×10 ¹⁵ pieces/cm ³ or lower, more preferably 1×10 ¹³ pieces/cm ³ or lower, More preferably, it is 1×10 ¹¹ pieces/cm ³ or less.

Note that the composition is not limited to these, and a material having an appropriate composition may be used depending on required semiconductor characteristics and electrical characteristics of a transistor (such as field-effect mobility and threshold voltage). Further, in order to obtain required semiconductor characteristics of the transistor, carrier density and impurity concentration of the oxide semiconductor film 108b and the oxide semiconductor film 108c, defect density, atomic ratio of metal element and oxygen, interatomic distance, density It is preferable that the above are suitable.

Note that as the oxide semiconductor film 108b and the oxide semiconductor film 108c, an oxide semiconductor film having low impurity concentration and low density of defect states is used, so that a transistor having further excellent electrical characteristics can be manufactured. Is preferred and is preferable.

In addition, it is preferable that hydrogen in the oxide semiconductor film 108 be reduced as much as possible. Specifically, in the oxide semiconductor film 108, the hydrogen concentration obtained by SIMS analysis is 2×10 ²⁰ atoms/cm ³ or lower, preferably 5×10 ¹⁹ atoms/cm ³ or lower, more preferably 1×10 ¹⁹ or lower. atoms/cm ³ or less, 5×10 ¹⁸ atoms/cm ³ or less, preferably 1×10 ¹⁸ atoms/cm ³ or less, more preferably 5×10 ¹⁷ atoms/cm ³ or less, further preferably 1×10 ¹⁶ atoms/cm ³ or less. and cm ³ or less.

Further, the oxide semiconductor film 108b preferably has a region with lower hydrogen concentration than the oxide semiconductor film 108c. The oxide semiconductor film 108b has a region with lower hydrogen concentration than the oxide semiconductor film 108c, so that a highly reliable semiconductor device can be obtained.

Further, when the oxide semiconductor film 108b contains silicon or carbon which is one of Group 14 elements, oxygen vacancies in the oxide semiconductor film 108b increase and the oxide semiconductor film 108b becomes n-type. Therefore, the concentration of silicon or carbon in the oxide semiconductor film 108b and the concentration of silicon or carbon near the interface with the oxide semiconductor film 108b (the concentration obtained by SIMS analysis) are 2×10 ¹⁸ atoms/cm ³ or less. , Preferably 2×10 ¹⁷ atoms/cm ³ or less.

In the oxide semiconductor film 108b, the concentration of alkali metal or alkaline earth metal obtained by SIMS analysis is set at 1×10 ¹⁸ atoms/cm ³ or lower, preferably 2×10 ¹⁶ atoms/cm ³ or lower. Alkali metal and alkaline earth metal may generate carriers when combined with an oxide semiconductor, which might increase off-state current of the transistor. Therefore, it is preferable to reduce the concentration of the alkali metal or the alkaline earth metal in the oxide semiconductor film 108b.

When the oxide semiconductor film 108b contains nitrogen, electrons which are carriers are generated, carrier density is increased, and n-type is easily generated. As a result, a transistor including an oxide semiconductor film containing nitrogen is likely to have normally-on characteristics. Therefore, in the oxide semiconductor film, nitrogen is preferably reduced as much as possible. For example, the nitrogen concentration obtained by SIMS analysis is preferably 5×10 ¹⁸ atoms/cm ³ or less.

The oxide semiconductor film 108b and the oxide semiconductor film 108c may each have a non-single-crystal structure. The non-single-crystal structure includes, for example, a CAAC-OS (C Axis Aligned Crystalline Oxide Semiconductor), a polycrystalline structure, a microcrystalline structure, or an amorphous structure, which will be described later. In the non-single-crystal structure, the amorphous structure has the highest defect level density and the CAAC-OS has the lowest defect level density.

<<Insulating film that functions as a second gate insulating film>>
The insulating films 114 and 116 function as a second gate insulating film of the transistor 100. The insulating films 114 and 116 have a function of supplying oxygen to the oxide semiconductor film 108. That is, the insulating films 114 and 116 contain oxygen. The insulating film 114 is an insulating film that can transmit oxygen. Note that the insulating film 114 also functions as a damage mitigating film for the oxide semiconductor film 108 when the insulating film 116 to be formed later is formed.

For example, the insulating films 114 and 116 described in Embodiment 3 can be used for the insulating films 114 and 116.

<<Oxide Semiconductor Film Functioning as Conductive Film and Oxide Semiconductor Film Functioning as Second Gate Electrode>>
The same material as the above-described oxide semiconductor film 108 can be used for the conductive film 120a functioning as a conductive film and the conductive film 120b functioning as a second gate electrode.

That is, the conductive film 120a which functions as a conductive film and the conductive film 120b which functions as a second gate electrode include a metal element contained in the oxide semiconductor film 108 (the oxide semiconductor film 108b and the oxide semiconductor film 108c). .. For example, when the conductive film 120b functioning as the second gate electrode and the oxide semiconductor film 108 (the oxide semiconductor film 108b and the oxide semiconductor film 108c) have the same metal element, the manufacturing cost can be reduced. Can be suppressed.

For example, in the case of an In-M-Zn oxide, the conductive film 120a functioning as a conductive film and the conductive film 120b functioning as a second gate electrode are used for forming an In-M-Zn oxide. The atomic ratio of the metal elements of the sputtering target preferably satisfies In≧M. As the atomic ratio of the metal elements of such a sputtering target, In:M:Zn=2:1:3, In:M:Zn=3:1:2, In:M:Zn=4:2:4. 1 etc. are mentioned.

The structure of the conductive film 120a which functions as a conductive film and the conductive film 120b which functions as a second gate electrode can be a single-layer structure or a stacked structure of two or more layers. Note that when the conductive films 120a and 120b have a stacked structure, the composition of the sputtering target is not limited to the above.

<<Insulating film that functions as a protective insulating film for transistors>>
The insulating film 118 functions as a protective insulating film of the transistor 100.

The insulating film 118 has one or both of hydrogen and nitrogen. Alternatively, the insulating film 118 includes nitrogen and silicon. The insulating film 118 has a function of blocking oxygen, hydrogen, water, alkali metal, alkaline earth metal, and the like. By providing the insulating film 118, diffusion of oxygen from the oxide semiconductor film 108 to the outside, diffusion of oxygen contained in the insulating films 114 and 116 to the outside, hydrogen from the outside to the oxide semiconductor film 108, It is possible to prevent water from entering.

The insulating film 118 has a function of supplying one or both of hydrogen and nitrogen to the conductive film 120a which functions as a conductive film and the conductive film 120b which functions as a second gate electrode. In particular, the insulating film 118 preferably contains hydrogen and has a function of supplying the hydrogen to the conductive films 120a and 120b. By supplying hydrogen from the insulating film 118 to the conductive films 120a and 120b, the conductive films 120a and 120b function as conductors.

As the insulating film 118, for example, a nitride insulating film can be used. Examples of the nitride insulating film include silicon nitride, silicon nitride oxide, aluminum nitride, aluminum nitride oxide, and the like.

Although various films such as a conductive film, an insulating film, and an oxide semiconductor film described above can be formed by a sputtering method or a PECVD method, another method such as a thermal CVD (Chemical Vapor Deposition) method can be used. You may form by. As an example of the thermal CVD method, a MOCVD (Metal Organic Chemical Vapor Deposition) method or an ALD (Atomic Layer Deposition) method may be used.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 5)
In this embodiment, the structure of the input/output device of one embodiment of the present invention will be described with reference to FIG.

FIG. 26 is an exploded view illustrating the configuration of the input/output device 800.

The input/output device 800 includes a display panel 806 and a touch sensor 804 including a region overlapping with the display panel 806. The input/output device 800 can be referred to as a touch panel.

The input/output device 800 accommodates the drive circuit 810 that drives the touch sensor 804 and the display panel 806, the battery 811 that supplies power to the drive circuit 810, the touch sensor 804, the display panel 806, the drive circuit 810, and the battery 811. It has a housing part.

<Touch sensor 804>
The touch sensor 804 has a region overlapping with the display panel 806. The FPC 803 is electrically connected to the touch sensor 804.

For example, a resistance film method, an electrostatic capacity method, a method using a photoelectric conversion element, or the like can be used for the touch sensor 804.

Note that the touch sensor 804 may be used as part of the display panel 806.

<Display panel 806>
For example, the display panel described in Embodiment 1 can be used as the display panel 806. Note that the FPC 805 is electrically connected to the display panel 806.

<Drive circuit 810>
For example, a power supply circuit, a signal processing circuit, or the like can be used for the driver circuit 810. In addition, you may utilize the electric power which a battery or an external commercial power supply supplies.

The signal processing circuit has a function of outputting a video signal, a clock signal, and the like.

The power supply circuit has a function of supplying predetermined power.

<<Case>>
For example, the upper cover 801, the lower cover 802 fitted to the upper cover 801, and the frame 809 accommodated in the area surrounded by the upper cover 801 and the lower cover 802 can be used for the housing portion.

The frame 809 has a function of protecting the display panel 806, a function of blocking an electromagnetic wave generated by the operation of the driving circuit 810, or a function of a heat sink.

Metal, resin, elastomer, or the like can be used for the upper cover 801, the lower cover 802, or the frame 809.

<Battery 811>
The battery 811 has a function of supplying electric power.

Note that a member such as a polarizing plate, a retardation plate, or a prism sheet can be used for the input/output device 800.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 6)
In this embodiment, a structure of an information processing device of one embodiment of the present invention will be described with reference to FIGS.

FIG. 27A is a block diagram illustrating the configuration of the information processing device 200. 27B and 27C are projection diagrams illustrating an example of the outer appearance of the information processing device 200.

FIG. 28A is a block diagram illustrating the structure of the display portion 230. FIG. 28B is a block diagram illustrating the structure of the display portion 230B. FIG. 28C is a circuit diagram illustrating the structure of the pixel 232(i,j).

<Example of configuration of information processing device>
The information processing device 200 described in this embodiment includes a calculation device 210 and an input/output device 220 (see FIG. 27A).

The arithmetic device 210 is supplied with the position information P1 and has a function of supplying the image information V and the control information.

The input/output device 220 has a function of supplying the position information P1 and is supplied with the image information V and the control information.

The input/output device 220 includes a display unit 230 that displays the image information V and an input unit 240 that supplies the position information P1.

The display unit 230 also includes a first display element and a second display element that overlaps the first display element. In addition, a first pixel circuit which drives the first display element and a second pixel circuit which drives the second display element are provided.

The input unit 240 has a function of detecting the position of the pointer and supplying the position information P1 determined based on the position.

The arithmetic device 210 has a function of determining the moving speed of the pointer based on the position information P1.

The arithmetic device 210 has a function of determining the contrast or the brightness of the image information V based on the moving speed.

The information processing device 200 described in the present embodiment includes an input/output device 220 which is supplied with position information P1 and is supplied with image information, and an arithmetic device 210 which is supplied with position information P1 and is supplied with image information V. The calculation device 210 has a function of determining the contrast or the brightness of the image information V based on the moving speed of the position information P1.

As a result, when moving the display position of the image information, it is possible to reduce the burden on the eyes of the user, and it is possible to provide a display that is easy on the eyes of the user. Further, it is possible to reduce power consumption and provide excellent visibility even in a bright place such as direct sunlight. As a result, it is possible to provide a new information processing device that is highly convenient or reliable.

<Structure>
One embodiment of the present invention includes the arithmetic device 210 or the input/output device 220.

<<Computing device 210>>
The arithmetic device 210 includes an arithmetic unit 211 and a storage unit 212. Further, the transmission path 214 and the input/output interface 215 are provided (see FIG. 27A).

<<Calculator 211>>
The arithmetic unit 211 has a function of executing a program, for example. For example, the CPU described in Embodiment 7 can be used. Thereby, the power consumption can be sufficiently reduced.

<<Memory unit 212>>
The storage unit 212 has a function of storing, for example, a program executed by the calculation unit 211, initial information, setting information, an image, or the like.

Specifically, a hard disk, a flash memory, a memory including a transistor including an oxide semiconductor, or the like can be used.

<<I/O interface 215, transmission path 214>>
The input/output interface 215 includes a terminal or wiring, supplies information, and has a function of receiving information. For example, it can be electrically connected to the transmission path 214. Further, it can be electrically connected to the input/output device 220.

The transmission path 214 includes wiring, supplies information, and has a function of receiving information. For example, it can be electrically connected to the input/output interface 215. Further, it can be electrically connected to the arithmetic unit 211, the storage unit 212 or the input/output interface 215.

<<I/O device 220>>
The input/output device 220 includes a display unit 230, an input unit 240, a detection unit 250, or a communication unit 290.

<<Display 230>>
The display portion 230 has a display area 231, a drive circuit GD, and a drive circuit SD (see FIG. 28A). For example, the display panel described in Embodiment 1 can be used. Thereby, power consumption can be reduced.

The display region 231 includes one or a plurality of pixels 232(i,j) and the scanning lines G1(i) and G2( electrically connected to the pixels 232(i,j) arranged in the row direction. i) and the signal line S1(j) and the signal line S2(j) electrically connected to the pixel 232(i,j) arranged in the column direction intersecting the row direction. In addition, i is an integer of 1 or more and m or less, j is an integer of 1 or more and n or less, and m and n are integers of 1 or more.

Note that the pixel 232(i,j) includes a scan line G1(i), a scan line G2(i), a signal line S1(j), a signal line S2(j), a wiring ANO, a wiring CSCOM, a wiring VCOM1, and a wiring VCOM2. It is electrically connected (see FIG. 28C).

In addition, the display portion can include a plurality of driver circuits. For example, the display portion 230B can include a driver circuit GDA and a driver circuit GDB (see FIG. 28B).

<Drive circuit GD>
The drive circuit GD has a function of supplying a selection signal based on control information.

For example, it has a function of supplying a selection signal to one scanning line at a frequency of 30 Hz or higher, preferably 60 Hz or higher based on the control information. As a result, the moving image can be displayed smoothly.

For example, it has a function of supplying a selection signal to one scanning line at a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than once per minute, based on the control information. As a result, a still image can be displayed with flicker suppressed.

Further, for example, when a plurality of drive circuits are provided, the frequency with which the drive circuit GDA supplies the selection signal and the frequency with which the drive circuit GDB supplies the selection signal can be made different. Specifically, the selection signal can be supplied to the region where the moving image is smoothly displayed, more frequently than the region where the still image is displayed in a state where flicker is suppressed.

<Drive circuit SD>
The drive circuit SD has a function of supplying an image signal based on the image information V.

<<Pixel 232(i,j)>>
The pixel 232(i,j) includes the first display element 235LC and the second display element 235EL overlapping with the first display element 235LC. In addition, a pixel circuit which drives the first display element 235LC and the second display element 235EL is provided (see FIG. 28C).

<<First Display Element 235LC>>
For example, a display element having a function of controlling reflection or transmission of light can be used for the display element 235LC. For example, a structure in which a liquid crystal element and a polarizing plate are combined or a shutter-type MEMS display element or the like can be used. By using the reflective display element, the power consumption of the display panel can be suppressed. Specifically, a reflective liquid crystal display element can be used for the display element 235LC.

The first display element 235LC has a first electrode, a second electrode, and a liquid crystal layer. The liquid crystal layer includes a liquid crystal material whose orientation can be controlled using a voltage between the first electrode and the second electrode. For example, an electric field in a thickness direction of a liquid crystal layer (also referred to as a vertical direction), a horizontal direction, or an oblique direction can be used as an electric field for controlling alignment of a liquid crystal material.

<<Second display element 235EL>>
For example, a display element having a function of emitting light can be used for the second display element 235EL. Specifically, an organic EL element can be used.

Specifically, an organic EL element having a function of emitting white light can be used for the second display element 235EL. Alternatively, an organic EL element which emits blue light, green light, or red light can be used for the second display element 235EL.

<<Pixel circuit>>
A circuit having a function of driving the first display element or the second display element can be used for the pixel circuit.

A switch, a transistor, a diode, a resistance element, an inductor, a capacitance element, or the like can be used for the pixel circuit.

For example, one or more transistors can be used in the switch. Alternatively, a plurality of transistors connected in parallel, a plurality of transistors connected in series, and a plurality of transistors connected in combination of series and parallel can be used for one switch.

<<Transistor>>
For example, a semiconductor film which can be formed in the same step can be used for a driver circuit and a transistor of a pixel circuit.

For example, a bottom-gate transistor or a top-gate transistor can be used.

By the way, for example, a bottom gate type transistor manufacturing line using amorphous silicon as a semiconductor can be easily modified into a bottom gate type transistor manufacturing line using an oxide semiconductor as a semiconductor. Further, for example, a top gate type manufacturing line using polysilicon as a semiconductor can be easily modified into a top gate type transistor manufacturing line using an oxide semiconductor as a semiconductor.

For example, a transistor including a semiconductor containing a Group 14 element can be used. Specifically, a semiconductor containing silicon can be used for the semiconductor film. For example, a transistor in which single crystal silicon, polysilicon, microcrystalline silicon, amorphous silicon, or the like is used for a semiconductor film can be used.

Note that the temperature required for manufacturing a transistor including polysilicon as a semiconductor is lower than that of a transistor including single crystal silicon as a semiconductor.

Further, the field effect mobility of a transistor using polysilicon as a semiconductor is higher than that of a transistor using amorphous silicon as a semiconductor. Thereby, the aperture ratio of the pixel can be improved. Further, a pixel provided with extremely high definition, a gate driver circuit, and a source driver circuit can be formed over the same substrate. As a result, the number of components that make up the electronic device can be reduced.

Further, the reliability of a transistor using polysilicon as a semiconductor is higher than that of a transistor using amorphous silicon as a semiconductor.

For example, a transistor including an oxide semiconductor can be used. Specifically, an oxide semiconductor containing indium or an oxide semiconductor containing indium, gallium, and zinc can be used for the semiconductor film.

As an example, a transistor whose leak current in the off state is smaller than that of a transistor using amorphous silicon for a semiconductor film can be used. Specifically, a transistor including an oxide semiconductor for a semiconductor film can be used.

Accordingly, the time for which the pixel circuit can hold the image signal can be made longer than the time for which the pixel circuit which uses the transistor using amorphous silicon for the semiconductor film can hold. Specifically, the selection signal can be supplied at a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than once per minute while suppressing the occurrence of flicker. As a result, fatigue accumulated in the user of the information processing device can be reduced. In addition, power consumption associated with driving can be reduced.

In addition, for example, a transistor including a compound semiconductor can be used. Specifically, a semiconductor containing gallium arsenide can be used for the semiconductor film.

For example, a transistor including an organic semiconductor can be used. Specifically, an organic semiconductor containing polyacene or graphene can be used for the semiconductor film.

<Input section 240>
Various human interfaces and the like can be used for the input unit 240 (see FIG. 27A).

For example, a keyboard, a mouse, a touch sensor, a microphone, a camera, or the like can be used as the input unit 240. Note that a touch sensor including a region overlapping with the display portion 230 can be used. An input/output device including a display unit 230 and a touch sensor including a region overlapping the display unit 230 can be referred to as a touch panel.

For example, the user can use the finger touching the touch panel as a pointer to make various gestures (tap, drag, swipe, pinch-in, etc.).

For example, the arithmetic device 210 may analyze information such as the position or trajectory of the finger touching the touch panel, and determine that a specific gesture has been supplied when the analysis result satisfies a predetermined condition. Accordingly, the user can supply a predetermined operation command that is associated with a predetermined gesture in advance by using the gesture.

For example, the user can supply the “scroll command” for changing the display position of the image information by using a gesture of moving a finger touching the touch panel along the touch panel.

<<Detection unit 250>>
The detection unit 250 has a function of detecting the surrounding state and acquiring the information P2.

For example, cameras, acceleration sensors, orientation sensors, pressure sensors, temperature sensors. A humidity sensor, an illuminance sensor, a GPS (Global Positioning System) signal receiving circuit, or the like can be used for the detection unit 250.

For example, when the arithmetic device 210 determines that the ambient brightness detected by the illuminance sensor of the detection unit 250 is sufficiently bright as compared with the predetermined illuminance, the image information is displayed using the first display element 235LC. indicate. Alternatively, when it is determined that the image is dim, the image information is displayed using the first display element 235LC and the second display element 235EL. Alternatively, when it is determined that the image is dark, the image information is displayed using the second display element 235EL.

Specifically, a reflective liquid crystal element or/and an organic EL element is used to display an image based on the ambient brightness.

Thereby, for example, it is possible to display image information using a reflective display element in an environment with strong external light and a self-luminous display element in a dim environment. As a result, it is possible to provide a novel information processing apparatus with reduced power consumption and excellent convenience or reliability.

For example, a sensor having a function of detecting the chromaticity of ambient light can be used as the detection unit 250. Specifically, a CCD camera or the like can be used. Thereby, for example, the bias of the white balance can be compensated based on the chromaticity of the ambient light detected by the detection unit 250.

Specifically, in the first step, the deviation of the white balance of ambient light is detected.

In the second step, the intensity of light of a color that is insufficient in the image to be displayed by reflecting ambient light using the first display element is predicted.

In the third step, the first display element is used to reflect ambient light, and the second display element is used to emit light so as to compensate for the insufficient color of light to display an image.

Accordingly, by using the light reflected by the first display element and the light emitted by the second display element, the ambient light whose white balance is biased can be displayed with the bias of the white balance being corrected. As a result, it is possible to provide a novel information processing device which is capable of displaying an image with reduced power consumption or white balance and which is excellent in convenience or reliability.

<<Communication unit 290>>
The communication unit 290 has a function of supplying information to the network and acquiring the information from the network.

"program"
One embodiment of the present invention will be described with reference to FIGS. 29 and 30 using a program of one embodiment of the present invention.

29A is a flowchart illustrating main processing of a program of one embodiment of the present invention, and FIG. 29B is a flowchart illustrating interrupt processing.

FIG. 30 is a schematic diagram illustrating a method of displaying image information on the display unit 230.

A program of one embodiment of the present invention is a program including the following steps (see FIG. 29A).

In the first step, settings are initialized (see FIG. 29A (S1)).

As an example, the predetermined image information and the second mode can be used for the initial setting.

For example, a still image can be used as the predetermined image information. Alternatively, a mode in which the selection signal is supplied at a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than once per minute can be used as the second mode.

In the second step, interrupt processing is permitted (see FIG. 29A (S2)). It should be noted that the arithmetic unit to which the interrupt process is permitted can perform the interrupt process in parallel with the main process. The arithmetic unit that has returned from the interrupt processing to the main processing can reflect the result obtained by performing the interrupt processing in the main processing.

When the value of the counter is the initial value, the arithmetic unit may be caused to perform interrupt processing, and the counter may be set to a value other than the initial value when returning from the interrupt processing. As a result, it is possible to always perform interrupt processing after starting the program.

In the third step, the image information is displayed in the predetermined mode selected in the first step or the interruption process (see FIGS. 29A and 29S).

As an example, the predetermined image information is displayed in the second mode based on the initial setting.

Specifically, predetermined image information is displayed using a mode in which a selection signal is supplied to one scan line at a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than once per minute.

For example, a selection signal is supplied at time T1 and the first image information PIC1 is displayed on the display unit 230 (see FIG. 30). Further, for example, a selection signal is supplied at time T2 after one second to display predetermined image information.

Alternatively, one image information is displayed in the second mode when a predetermined event is not supplied in the interrupt process.

For example, a selection signal is supplied at time T5, and the fourth image information PIC4 is displayed on the display unit 230. Further, for example, at time T6, which is one second later, a selection signal is supplied to display the same image information. The period from time T5 to time T6 can be the same as the period from time T1 to time T2.

As an example, in the interrupt process, when a predetermined event is supplied, the predetermined image information is displayed in the first mode.

Specifically, in the interrupt process, when an event associated with a "page turning instruction" is supplied, a mode in which a selection signal is supplied to one scanning line at a frequency of 30 Hz or higher, preferably 60 Hz or higher is used. The display is switched from one image information displayed to another image information.

Alternatively, in the interrupt process, when an event associated with a “scroll command” is supplied, it is displayed using a mode in which a selection signal is supplied to one scanning line at a frequency of 30 Hz or higher, preferably 60 Hz or higher. The second image information PIC2 including a part of the first image information PIC1 and a part continuous thereto is displayed.

As a result, for example, a moving image in which the images are gradually switched according to the “page turning instruction” can be displayed smoothly. Alternatively, it is possible to smoothly display a moving image in which the image gradually moves according to the “scroll command”.

Specifically, the selection signal is supplied at time T3 after the event associated with the "scroll command" is supplied, and the second image information PIC2 in which the display position and the like are changed is displayed (see FIG. 30). .. Further, the selection signal is supplied at time T4, and the third image information PIC3 whose display position and the like are changed is displayed. The period from time T2 to time T3, the period from time T3 to time T4, and the period from time T4 to time T5 are shorter than the period from time T1 to time T2.

In the fourth step, if the end command is supplied, the process proceeds to the fifth step, and if the end command is not supplied, the process proceeds to the third step (see FIG. 29(A) (S4). ).

It should be noted that, for example, in the interrupt processing, a termination instruction can be supplied.

The fifth step ends (see FIG. 29A (S5)).

The interrupt processing includes the following sixth to ninth steps (see FIG. 29B).

In the sixth step, if the predetermined event is supplied during the predetermined period, the process proceeds to the seventh step, and if the predetermined event is not supplied, the process proceeds to the eighth step (FIG. 29 ( B) (see S6)).

For example, the predetermined period can be less than 0.5 seconds, and preferably less than 0.1 seconds.

Further, for example, an event associated with the end command can be included in the predetermined event.

In the seventh step, the first mode is selected (see FIG. 29B (S7)).

In the eighth step, the second mode is selected (see FIG. 29B (S8)).

In the ninth step, the interrupt processing is restored (see FIG. 29B (S9)).

《Predetermined event》
Different events can be associated with different instructions.

For example, a “page-turning instruction” that switches the display from one image information displayed to another image information, a display position of a part where one image information is displayed is moved, and another part continuous to a part is displayed. There is a "scroll instruction" for displaying.

For example, an event such as "click" or "drag" supplied using a pointing device such as a mouse, an event such as "tap", "drag" or "swipe" supplied to a touch panel using a finger or the like as a pointer. Can be used.

For example, the position of the slide bar pointed by using the pointer, the swipe speed, the drag speed, and the like can be used to give arguments to various commands.

Specifically, give an argument that determines the speed of turning the page used when executing the "page turning instruction" and an argument that determines the speed of moving the display position used when executing the "scroll instruction". be able to.

Further, for example, the display brightness, contrast, or tint may be changed according to the page turning speed and/or the scrolling speed.

Specifically, when the page turning speed and/or the scrolling speed is faster than a predetermined speed, the display may be displayed such that the brightness of the display becomes darker in synchronization with the speed.

Alternatively, when the page turning speed and/or the scrolling speed is faster than a predetermined speed, the display may be displayed such that the contrast decreases in synchronization with the speed.

For example, a speed at which it is difficult to follow the displayed image with eyes can be used as the predetermined speed.

Further, it is possible to use a method of reducing the contrast by bringing a bright gradation region included in image information closer to a dark gradation.

Further, it is possible to use a method of bringing a dark gradation region included in image information closer to a bright gradation to reduce the contrast.

Specifically, when the page turning speed and/or the scrolling speed is faster than a predetermined speed, it may be displayed so that the yellowish color becomes stronger in synchronization with the speed. Alternatively, it may be displayed such that the bluish color is weakened.

By the way, you may detect the use environment of an information processing apparatus using the detection part 250, and generate image information based on the detected information. For example, it is possible to detect the brightness of the environment or the like and use a color matching the user's taste as the background of the image information (see FIG. 27B).

By the way, you may receive the information delivered to the specific space using the communication part 290, and generate image information based on the received information. For example, it is possible to receive and display a teaching material distributed in a classroom such as a school or a university, and use it as a textbook. Alternatively, a material distributed in a conference room of a company or the like can be received and displayed (see FIG. 27C).

This makes it possible to provide a suitable environment for the user who uses the information processing apparatus 200.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

(Embodiment 7)
In this embodiment mode, a semiconductor device (memory device) which can retain stored contents even when power is not supplied and has no limitation on the number of times of writing, and a CPU including the semiconductor device will be described. The CPU described in this embodiment can be used in, for example, the information processing device described in Embodiment 6.

<Memory device>
FIG. 31 shows an example of a semiconductor device (memory device) which can retain stored contents even when power is not supplied and has no limitation on the number of times of writing. Note that FIG. 31B is a circuit diagram of FIG. 31A.

The semiconductor device illustrated in FIGS. 31A and 31B includes a transistor 3200 including a first semiconductor material, a transistor 3300 including a second semiconductor material, and a capacitor 3400.

The first semiconductor material and the second semiconductor material are preferably materials having different energy gaps. For example, the first semiconductor material is a semiconductor material other than an oxide semiconductor (silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, organic semiconductor, etc.), The second semiconductor material can be an oxide semiconductor. A transistor including single crystal silicon or the like as a material other than an oxide semiconductor can easily operate at high speed. On the other hand, a transistor including an oxide semiconductor has low off-state current.

The transistor 3300 is a transistor in which a channel is formed in a semiconductor layer including an oxide semiconductor. Since the off-state current of the transistor 3300 is small, the memory content can be held for a long time by using the off-state current. In other words, a semiconductor memory device that does not require a refresh operation or has a very low refresh operation frequency can be provided, so that power consumption can be sufficiently reduced.

In FIG. 31B, the first wiring 3001 is electrically connected to the source electrode of the transistor 3200, and the second wiring 3002 is electrically connected to the drain electrode of the transistor 3200. In addition, the third wiring 3003 is electrically connected to one of a source electrode and a drain electrode of the transistor 3300, and the fourth wiring 3004 is electrically connected to a gate electrode of the transistor 3300. The other of the gate electrode of the transistor 3200 and the source or drain electrode of the transistor 3300 is electrically connected to one of the electrodes of the capacitor 3400, and the fifth wiring 3005 is electrically connected to the other of the electrodes of the capacitor 3400. Connected to each other.

In the semiconductor device illustrated in FIG. 31A, writing, holding, and reading data can be performed as follows by taking advantage of the fact that the potential of the gate electrode of the transistor 3200 can be held.

Writing and holding of information will be described. First, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned on, so that the transistor 3300 is turned on. Accordingly, the potential of the third wiring 3003 is applied to the gate electrode of the transistor 3200 and the capacitor 3400. That is, predetermined charge is given to the gate of the transistor 3200 (writing). Here, it is assumed that either one of the charges that gives two different potential levels (hereinafter referred to as Low level charge and High level charge) is given. After that, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned off and the transistor 3300 is turned off, so that the charge given to the gate of the transistor 3200 is held (holding).

Since the off-state current of the transistor 3300 is extremely small, the charge of the gate of the transistor 3200 is held for a long time.

Next, reading of information will be described. When an appropriate potential (reading potential) is applied to the fifth wiring 3005 in the state where a predetermined potential (constant potential) is applied to the first wiring 3001, the charge amount held in the gate of the transistor 3200 is changed according to the amount of charge held in the gate of the transistor 3200. The second wiring 3002 has different potentials. In general, when the transistor 3200 is an n-channel type, the apparent threshold value Vth_H in the case where the gate electrode of the transistor 3200 is supplied with High level charge is This is because it becomes lower than the apparent threshold value Vth_L. Here, the apparent threshold voltage refers to a potential of the fifth wiring 3005 which is necessary to turn on the transistor 3200. Therefore, by setting the potential of the fifth wiring 3005 to the potential V0 between Vth_H and Vth_L, the charge given to the gate of the transistor 3200 can be determined. For example, in writing, when high-level charge is applied, if the potential of the fifth wiring 3005 becomes V0 (>Vth_H), the transistor 3200 is turned on. When the low-level charge is applied, the transistor 3200 remains in the “off state” even when the potential of the fifth wiring 3005 becomes V0 (<Vth_L). Therefore, the held information can be read by determining the potential of the second wiring 3002.

When the memory cells are arranged in an array and used, it is necessary to read only the information of the desired memory cell. In the case where data is not read in this manner, a potential such that the transistor 3200 is in an “off state” regardless of the gate state, that is, a potential lower than Vth_H may be applied to the fifth wiring 3005. Alternatively, a potential such that the transistor 3200 is turned on regardless of the gate state, that is, a potential higher than Vth_L may be applied to the fifth wiring 3005.

The semiconductor device in FIG. 31C is different from that in FIG. 31A in that the transistor 3200 is not provided. In this case also, information writing and holding operations can be performed by the same operation as described above.

Next, reading of data from the semiconductor device in FIG. 31C is described. When the transistor 3300 is turned on, the third wiring 3003 which is in a floating state and the capacitor 3400 are brought into conduction, and electric charge is redistributed between the third wiring 3003 and the capacitor 3400. As a result, the potential of the third wiring 3003 changes. The amount of change in the potential of the third wiring 3003 has a different value depending on the potential of one of the electrodes of the capacitor 3400 (or the charge accumulated in the capacitor 3400).

For example, one of the potentials of the electrodes of the capacitor 3400 is V, the capacitance of the capacitor 3400 is C, the capacitance component of the third wiring 3003 is CB, and the potential of the third wiring 3003 before charge is redistributed. When VB0 is set, the potential of the third wiring 3003 after the charge is redistributed is (CB×VB0+C×V)/(CB+C). Therefore, assuming that one of the electrodes of the capacitor 3400 has two states of V1 and V0 (V1>V0) as the state of the memory cell, the potential of the bit line BL (= It can be seen that (CB×VB0+C×V1)/(CB+C)) is higher than the potential (=(CB×VB0+C×V0)/(CB+C)) of the bit line BL when the potential V0 is held.

Information can be read by comparing the potential of the third wiring 3003 with a predetermined potential.

In this case, a transistor to which the first semiconductor material is applied is used for a driver circuit for driving the memory cell, and a transistor to which the second semiconductor material is applied is stacked as the transistor 3300 on the driver circuit. And it is sufficient.

In the semiconductor device described in this embodiment, by using a transistor including an oxide semiconductor and having a very low off-state current in a channel formation region, stored data can be held for an extremely long time. That is, the refresh operation becomes unnecessary or the frequency of the refresh operation can be extremely reduced, so that power consumption can be sufficiently reduced. Further, even when power is not supplied (however, it is desirable that the potential is fixed), the stored content can be held for a long time.

In addition, in the semiconductor device described in this embodiment, high voltage is not required for writing data and there is no problem of element deterioration. For example, unlike the conventional non-volatile memory, it is not necessary to inject electrons into the floating gate or extract electrons from the floating gate, so that the problem of deterioration of the gate insulating film does not occur. That is, in the semiconductor device described in this embodiment, there is no limitation on the number of rewritable times, which is a problem in the conventional nonvolatile memory, and reliability is dramatically improved. Further, since data is written depending on whether the transistor is on or off, high-speed operation can be easily realized.

The above-described storage device can be applied to, for example, a DSP (Digital Signal Processor), a custom LSI, an LSI such as a PLD (Programmable Logic Device), and an RF (Radio Frequency) device, in addition to a CPU (Central Processing Unit). Is.

<CPU>
The CPU including the above storage device will be described below.

FIG. 32 is a block diagram showing the configuration of an example of a CPU including the above storage device.

The CPU shown in FIG. 32 includes an ALU 1191 (ALU: Arithmetic logic unit, arithmetic circuit), an ALU controller 1192, an instruction decoder 1193, an interrupt controller 1194, a timing controller 1195, a register 1196, a register controller 1197, and a bus interface 1198 on a substrate 1190. It has a (Bus I/F), a rewritable ROM 1199, and a ROM interface 1189 (ROM I/F). As the substrate 1190, a semiconductor substrate, an SOI substrate, a glass substrate, or the like is used. The ROM 1199 and the ROM interface 1189 may be provided in another chip. Of course, the CPU shown in FIG. 32 is only an example in which the configuration is simplified and shown, and an actual CPU has various configurations depending on its application. For example, the configuration including the CPU or the arithmetic circuit illustrated in FIG. 32 may be one core, a plurality of the cores may be included, and each core may operate in parallel. The number of bits that the CPU can handle in the internal arithmetic circuit or the data bus can be set to 8 bits, 16 bits, 32 bits, 64 bits, or the like.

The instruction input to the CPU via the bus interface 1198 is input to the instruction decoder 1193, decoded, and then input to the ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195.

The ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195 perform various controls based on the decoded instruction. Specifically, the ALU controller 1192 generates a signal for controlling the operation of the ALU 1191. Further, the interrupt controller 1194 determines and processes an interrupt request from an external input/output device or a peripheral circuit based on its priority or mask state during execution of a program of the CPU. The register controller 1197 generates the address of the register 1196 and reads or writes the register 1196 according to the state of the CPU.

The timing controller 1195 also generates signals for controlling the operation timings of the ALU 1191, the ALU controller 1192, the instruction decoder 1193, the interrupt controller 1194, and the register controller 1197. For example, the timing controller 1195 includes an internal clock generation unit that generates an internal clock signal based on the reference clock signal, and supplies the internal clock signal to the various circuits.

In the CPU shown in FIG. 32, the register 1196 is provided with a memory cell.

In the CPU shown in FIG. 32, the register controller 1197 selects a holding operation in the register 1196 according to an instruction from the ALU 1191. That is, in the memory cell included in the register 1196, it is selected whether the data is held by the flip-flop or the capacitor. When data holding by the flip-flop is selected, the power supply voltage is supplied to the memory cell in the register 1196. When data retention is selected in the capacitor, data is rewritten in the capacitor and supply of power supply voltage to the memory cell in the register 1196 can be stopped.

FIG. 33 is an example of a circuit diagram of a memory element that can be used as the register 1196. The storage element 1200 has a circuit 1201 in which stored data is volatilized by power cutoff, a circuit 1202 in which stored data is not volatilized by power cutoff, a switch 1203, a switch 1204, a logic element 1206, a capacitor element 1207, and a selection function. And a circuit 1220 having the same. The circuit 1202 includes a capacitor 1208, a transistor 1209, and a transistor 1210. Note that the memory element 1200 may further include another element such as a diode, a resistance element, or an inductor as needed.

Here, the above memory device can be used for the circuit 1202. When the supply of the power supply voltage to the memory element 1200 is stopped, the ground potential (0 V) or the potential at which the transistor 1209 is turned off is continuously input to the gate of the transistor 1209 in the circuit 1202. For example, the gate of the transistor 1209 is grounded via a load such as a resistor.

The switch 1203 is formed using a transistor 1213 of one conductivity type (for example, n-channel type), and the switch 1204 is formed using a transistor 1214 of a conductivity type (for example, p-channel type) opposite to the one conductivity type. Here is an example. Here, the first terminal of the switch 1203 corresponds to one of the source and the drain of the transistor 1213, the second terminal of the switch 1203 corresponds to the other of the source and the drain of the transistor 1213, and the switch 1203 is the gate of the transistor 1213. The control signal RD input to the terminal selects conduction or non-conduction between the first terminal and the second terminal (that is, the on or off state of the transistor 1213). The first terminal of the switch 1204 corresponds to one of the source and the drain of the transistor 1214, the second terminal of the switch 1204 corresponds to the other of the source and the drain of the transistor 1214, and the switch 1204 is input to the gate of the transistor 1214. Depending on the control signal RD, the conduction or non-conduction between the first terminal and the second terminal (that is, the on or off state of the transistor 1214) is selected.

One of a source and a drain of the transistor 1209 is electrically connected to one of a pair of electrodes of the capacitor 1208 and a gate of the transistor 1210. Here, the connection portion is the node N2. One of a source and a drain of the transistor 1210 is electrically connected to a wiring that can supply a low power supply potential (eg, a GND line), and the other is a first terminal of the switch 1203 (a source and a drain of the transistor 1213). On the other hand). A second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is electrically connected to a first terminal of the switch 1204 (one of the source and the drain of the transistor 1214). The second terminal of the switch 1204 (the other of the source and the drain of the transistor 1214) is electrically connected to a wiring which can supply the power supply potential VDD. The second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213), the first terminal of the switch 1204 (one of the source and the drain of the transistor 1214), the input terminal of the logic element 1206, and the capacitor 1207. One of the pair of electrodes is electrically connected. Here, the connection portion is the node N1. The other of the pair of electrodes of the capacitor 1207 can have a structure in which a constant potential is input. For example, a low power supply potential (GND or the like) or a high power supply potential (VDD or the like) can be input. The other of the pair of electrodes of the capacitor 1207 is electrically connected to a wiring capable of supplying a low power supply potential (eg, a GND line). The other of the pair of electrodes of the capacitor 1208 can have a structure in which a constant potential is input. For example, a low power supply potential (GND or the like) or a high power supply potential (VDD or the like) can be input. The other of the pair of electrodes of the capacitor 1208 is electrically connected to a wiring that can supply a low power supply potential (eg, a GND line).

Note that the capacitor 1207 and the capacitor 1208 can be omitted by positively utilizing parasitic capacitance of a transistor or a wiring.

The control signal WE is input to the first gate (first gate electrode) of the transistor 1209. The switch 1203 and the switch 1204 are selected between a conductive state and a non-conductive state between the first terminal and the second terminal by a control signal RD different from the control signal WE, and the first terminal and the second terminal of one switch are selected. When the terminals of the other switch are in the conductive state, the first switch and the second terminal of the other switch are in the non-conductive state.

A signal corresponding to the data held in the circuit 1201 is input to the other of the source and the drain of the transistor 1209. In the example shown in FIG. 33, the signal output from the circuit 1201 is input to the other of the source and the drain of the transistor 1209. The signal output from the second terminal (the other of the source and the drain of the transistor 1213) of the switch 1203 is an inverted signal whose logical value is inverted by the logic element 1206 and is input to the circuit 1201 through the circuit 1220. ..

Note that FIG. 33 illustrates an example in which the signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is input to the circuit 1201 through the logic element 1206 and the circuit 1220. Not limited to. A signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) may be input to the circuit 1201 without being inverted in logical value. For example, in the case where a node in which a signal in which the logic value of a signal input from an input terminal is inverted is held in the circuit 1201 is output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213). The output signal can be input to the node.

In FIG. 33, among the transistors used for the memory element 1200, the transistors other than the transistor 1209 can be transistors in which a channel is formed in a layer formed using a semiconductor other than an oxide semiconductor or the substrate 1190. For example, it can be a transistor in which a channel is formed in a silicon layer or a silicon substrate. Further, all the transistors used in the memory element 1200 can be transistors whose channels are formed using an oxide semiconductor film. Alternatively, the memory element 1200 may include a transistor whose channel is formed using an oxide semiconductor film in addition to the transistor 1209, and the remaining transistor has a channel formed in a layer formed of a semiconductor other than an oxide semiconductor or the substrate 1190. It can also be a formed transistor.

A flip-flop circuit can be used for the circuit 1201 in FIG. Further, as the logic element 1206, for example, an inverter or a clocked inverter can be used.

In the semiconductor device described in this embodiment, the data stored in the circuit 1201 can be held by the capacitor 1208 provided in the circuit 1202 while the power supply voltage is not supplied to the memory element 1200.

The off-state current of a transistor in which a channel is formed in an oxide semiconductor film is extremely low. For example, the off-state current of a transistor whose channel is formed in an oxide semiconductor film is significantly lower than the off-state current of a transistor whose channel is formed in crystalline silicon. Therefore, by using a transistor in which a channel is formed in the oxide semiconductor film as the transistor 1209, the signal held in the capacitor 1208 can be kept for a long period even when the power supply voltage is not supplied to the memory element 1200. In this way, the memory element 1200 can retain the memory content (data) even while the supply of the power supply voltage is stopped.

In addition, since the memory element is characterized in that a precharge operation is performed by providing the switch 1203 and the switch 1204, the time until the circuit 1201 holds the original data again after the supply of power supply voltage is restarted is shortened. be able to.

In the circuit 1202, the signal held by the capacitor 1208 is input to the gate of the transistor 1210. Therefore, after the supply of the power supply voltage to the memory element 1200 is restarted, the signal held by the capacitor 1208 can be converted into the state of the transistor 1210 (on state or off state) and read from the circuit 1202. it can. Therefore, the original signal can be accurately read even when the potential corresponding to the signal held in the capacitor 1208 slightly changes.

By using such a memory element 1200 for a memory device such as a register or a cache memory included in a processor, data loss in the memory device due to supply of power supply voltage can be prevented. Moreover, after the supply of the power supply voltage is restarted, the state before the power supply is stopped can be restored in a short time. Therefore, power supply can be stopped for a short time in the entire processor or one or a plurality of logic circuits included in the processor, so that power consumption can be suppressed.

In this embodiment, the storage element 1200 is used as an example of the CPU. However, the storage element 1200 can be applied to a DSP, a custom LSI, an LSI such as a PLD, or an RF device.

At least part of this embodiment can be implemented in appropriate combination with any of the other embodiments described in this specification.

(Embodiment 8)
In this embodiment, a display module and an electronic device each including the display panel of one embodiment of the present invention will be described with reference to FIGS.

34A to 34G are diagrams illustrating electronic devices. These electronic devices include a housing 5000, a display portion 5001, a speaker 5003, an LED lamp 5004, operation keys 5005 (including a power switch or an operation switch), a connection terminal 5006, a sensor 5007 (force, displacement, position, speed, Acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared (Including a function), a microphone 5008, and the like.

FIG. 34A illustrates a mobile computer, which can include a switch 5009, an infrared port 5010, and the like in addition to the above components. FIG. 34B shows a portable image reproducing device (for example, a DVD reproducing device) provided with a recording medium, which may include a second display portion 5002, a recording medium reading portion 5011, and the like in addition to the above components. it can. FIG. 34C illustrates a goggle type display, which can include a second display portion 5002, a supporting portion 5012, earphones 5013, and the like in addition to the above components. FIG. 34D illustrates a portable game machine which can include a recording medium reading portion 5011 and the like in addition to the above objects. FIG. 34E illustrates a digital camera with a television image receiving function, which can include an antenna 5014, a shutter button 5015, an image receiving portion 5016, and the like in addition to the above objects. FIG. 34F illustrates a portable game machine, which can include the second display portion 5002, the recording medium reading portion 5011, and the like in addition to the above objects. FIG. 34G illustrates a portable television receiver, which can include a charger 5017 and the like capable of transmitting and receiving signals in addition to the above components.

The electronic devices illustrated in FIGS. 34A to 34G can have various functions. For example, a function of displaying various information (still image, moving image, text image, etc.) on the display unit, a touch panel function, a function of displaying a calendar, date or time, a function of controlling processing by various software (programs), Wireless communication function, function of connecting to various computer networks using the wireless communication function, function of transmitting or receiving various data using the wireless communication function, reading and displaying a program or data recorded in a recording medium It can have a function of displaying on a part, and the like. Further, in an electronic device having a plurality of display units, one display unit mainly displays image information and another one display mainly character information, or a parallax is considered in the plurality of display units. It is possible to have a function of displaying a stereoscopic image by displaying the displayed image. Further, in an electronic device having an image receiving unit, a function of capturing a still image, a function of capturing a moving image, a function of automatically or manually correcting a captured image, a captured image as a recording medium (external or built in a camera) It can have a function of saving, a function of displaying a captured image on a display portion, and the like. Note that the functions that the electronic devices in FIGS. 34A to 34G can have are not limited to these and can have various functions.

FIG. 34H illustrates a smart watch, which includes a housing 7302, a display panel 7304, operation buttons 7311 and 7312, a connection terminal 7313, a band 7321, a clasp 7322, and the like.

The display panel 7304 mounted on the housing 7302 which also serves as a bezel portion has a non-rectangular display region. Note that the display panel 7304 may be a rectangular display area. The display panel 7304 can display an icon 7305 indicating time, other icons 7306, and the like.

Note that the smart watch illustrated in FIG. 34H can have various functions. For example, a function of displaying various information (still image, moving image, text image, etc.) on the display unit, a touch panel function, a function of displaying a calendar, date or time, a function of controlling processing by various software (programs), Wireless communication function, function of connecting to various computer networks using the wireless communication function, function of transmitting or receiving various data using the wireless communication function, reading and displaying a program or data recorded in a recording medium It can have a function of displaying on a part, and the like.

In addition, a speaker, a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, electric current is provided inside the housing 7302. , A function of measuring voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared ray), a microphone, and the like. Note that the smart watch can be manufactured by using a light-emitting element for the display panel 7304.

Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.

For example, in this specification and the like, when it is explicitly described that X and Y are connected, the case where X and Y are electrically connected and the case where X and Y function The case where they are connected to each other and the case where X and Y are directly connected are disclosed in this specification and the like. Therefore, it is not limited to a predetermined connection relation, for example, the connection relation shown in the drawing or the text, and other than the connection relation shown in the drawing or the text is also described in the drawing or the text.

Here, X and Y are objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).

As an example of the case where X and Y are directly connected, an element (for example, a switch, a transistor, a capacitance element, an inductor, a resistance element, a diode, a display, etc.) that enables electrical connection between X and Y is given. Elements, light-emitting elements, loads, etc.) are not connected between X and Y, and elements that enable electrical connection between X and Y (for example, switches, transistors, capacitive elements, inductors) , Resistor element, diode, display element, light emitting element, load, etc.) and X and Y are connected.

As an example of the case where X and Y are electrically connected, an element (for example, a switch, a transistor, a capacitance element, an inductor, a resistance element, a diode, a display, etc.) that enables the X and Y to be electrically connected. Element, light emitting element, load, etc.) may be connected between X and Y. The switch has a function of controlling on/off. That is, the switch is in a conducting state (on state) or a non-conducting state (off state), and has a function of controlling whether or not to pass a current. Alternatively, the switch has a function of selecting and switching a path through which current flows. Note that the case where X and Y are electrically connected includes the case where X and Y are directly connected.

Examples of the case where X and Y are functionally connected include a circuit (for example, a logic circuit (inverter, NAND circuit, NOR circuit, etc.)) that enables functional connection between X and Y, and signal conversion. Circuits (DA conversion circuit, AD conversion circuit, gamma correction circuit, etc.), potential level conversion circuit (power supply circuit (step-up circuit, step-down circuit, etc.), level shifter circuit for changing signal potential level, etc.), voltage source, current source, switching Circuits, amplifier circuits (circuits that can increase signal amplitude or current amount, operational amplifiers, differential amplifier circuits, source follower circuits, buffer circuits, etc.), signal generation circuits, memory circuits, control circuits, etc. It is possible to connect more than one in between. As an example, even if another circuit is sandwiched between X and Y, if the signal output from X is transmitted to Y, it is assumed that X and Y are functionally connected. To do. In addition, when X and Y are functionally connected, the case where X and Y are directly connected and the case where X and Y are electrically connected are included.

In addition, when it is explicitly described that X and Y are electrically connected, when X and Y are electrically connected (that is, when X and Y are separately connected, Element or another circuit is sandwiched between them and X and Y are functionally connected (that is, another circuit is sandwiched between X and Y and functionally connected). And the case where X and Y are directly connected (that is, the case where another element or another circuit is connected between X and Y is not sandwiched). It is assumed to be disclosed in a written document. That is, when explicitly described as being electrically connected, the same content as the case where only explicitly described as being connected is disclosed in this specification and the like. It has been done.

Note that, for example, the source (or the first terminal or the like) of the transistor is electrically connected to X through (or not) Z1, and the drain of the transistor (or the second terminal or the like) is connected to Z2. Via (or without) electrically connected to Y, or the source of the transistor (or the first terminal, etc.) is directly connected to part of Z1 and another part of Z1 Is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to part of Z2, and another part of Z2 is directly connected to Y. Then, it can be expressed as follows.

For example, “X and Y, the source (or the first terminal or the like) of the transistor, and the drain (or the second terminal or the like) are electrically connected to each other, and X, the source of the transistor (or the first terminal, or the like). Terminal, etc.), the drain of the transistor (or the second terminal, etc.), and Y are electrically connected in this order.” Alternatively, “the source of the transistor (or the first terminal or the like) is electrically connected to X, the drain of the transistor (or the second terminal or the like) is electrically connected to Y, and X, the source of the transistor (or the like). Alternatively, the first terminal or the like), the drain of the transistor (or the second terminal, or the like), and Y are electrically connected in this order”. Alternatively, “X is electrically connected to Y through a source (or a first terminal or the like) and a drain (or a second terminal or the like) of the transistor, and X, a source (or a first terminal) of the transistor, or the like. Terminal, etc.), the drain of the transistor (or the second terminal, etc.), and Y are provided in this connection order”. The source (or the first terminal or the like) of the transistor and the drain (or the second terminal or the like) are separated from each other by defining the order of connection in the circuit structure using the expression method similar to these examples. Apart from this, the technical scope can be determined.

Alternatively, as another expression method, for example, “the source of the transistor (or the first terminal or the like) is electrically connected to X via at least the first connection path, and the first connection path is The second connection path does not have a second connection path, and the second connection path is provided between the source (or the first terminal or the like) of the transistor and the drain (or the second terminal or the like) of the transistor through the transistor. The first connection path is a path via Z1, and the drain (or the second terminal or the like) of the transistor is electrically connected to Y via at least the third connection path. Connected, the third connection path does not have the second connection path, and the third connection path is a path via Z2.” Alternatively, "the source (or the first terminal or the like) of the transistor is electrically connected to X through at least the first connection path via Z1, and the first connection path is the second connection path. And the second connection path has a connection path through a transistor, and the drain (or the second terminal or the like) of the transistor has at least a third connection path through Z2. , Y, and the third connection path does not have the second connection path.” Or “the source of the transistor (or the first terminal or the like) is electrically connected to X via at least a first electrical path via Z1, and the first electrical path is a second electrical path; The second electrical path is an electrical path from a source (or a first terminal or the like) of the transistor to a drain (or a second terminal or the like) of the transistor, which has no electrical path; A drain (or a second terminal or the like) of the transistor is electrically connected to Y through at least a third electrical path via Z2, and the third electrical path is a fourth electrical path. And the fourth electrical path is an electrical path from the drain of the transistor (or the second terminal or the like) to the source of the transistor (or the first terminal or the like).” can do. By defining the connection path in the circuit configuration using the expression method similar to these examples, the source (or the first terminal or the like) of the transistor and the drain (or the second terminal or the like) can be distinguished. , The technical scope can be determined.

Note that these expression methods are examples and are not limited to these expression methods. Here, X, Y, Z1, and Z2 are objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).

In addition, even when independent components are illustrated as electrically connected to each other in the circuit diagram, when one component also has the functions of a plurality of components. There is also. For example, in the case where part of the wiring also functions as an electrode, one conductive film has both functions of a wiring and a function of an electrode. Therefore, the term “electrically connected” in this specification includes in its category such a case where one conductive film also has functions of a plurality of components.

ACF1 anisotropic conductive connection layer AF1 alignment film AF2 alignment film ANO wiring C1 capacitance element C2 capacitance element CF1 colored film CSCOM wiring FPC1 flexible printed board G1 scan line G2 scan line GD drive circuit GDA drive circuit GDB drive circuit KB1 structure M transistor MA transistor MB transistor MC transistor MD transistor MDA transistor MDB transistor MDC transistor N1 node N2 node P1 position information P2 information PIC1 image information PIC2 image information PIC3 image information PIC4 image information S1 signal line S2 signal line SD drive circuit SW1 switch SW1A switch SW1B switch SW1C switch SW2 switch T1 time T2 time T3 time T4 time T5 time T6 time V0 potential V1 potential VCOM1 wiring VCOM2 wiring VDD power supply potential 100 transistor 102 substrate 104 conductive film 106 insulating film 107 insulating film 108 oxide semiconductor film 108a oxide semiconductor film 108b oxide semiconductor film 108c oxide semiconductor film 112a conductive film 112b conductive film 114 insulating film 116 insulating film 118 insulating film 120a conductive film 120b conductive film 150 transistor 200 information processing device 210 arithmetic device 211 arithmetic unit 212 memory unit 214 transmission line 215 Input/output interface 220 Input/output device 230 Display section 230B Display section 231 Display area 232 Pixel 235EL Display element 235LC Display element 240 Input section 250 Detection section 290 Communication section 501A Insulating film 501C Insulating film 504 Conductive film 505 Bonding layer 506 Insulating film 508 Semiconductor Film 508A region 508B region 508C region 509 insulating film 510 substrate 511B conductive film 511C conductive film 512A conductive film 512B conductive film 516 insulating film 518 insulating film 519B terminal 519C terminal 520 functional layer 521 insulating film 524 conductive film 528 insulating film 529 insulating film 530 Pixel circuit 550 Display element 551 Electrode 552 Electrode 553 Layer containing a light-emitting organic compound 570 Substrate 571 Electrode 591 Connection part 591A Connection part 591B Connection part 591C Connection part 592 Connection part 593 Connection part 593B Connection part 593C Connection part 594B Opening part 594C Opening 595 Opening 596B Opening 700 Display panel 700A Display Panel 700B Display panel 700C Display panel 700D Display panel 700E Display panel 702 Pixel 705 Sealing material 750 Display element 751 Electrode 751A Electrode 751H Opening 752 Electrode 753 Layer containing liquid crystal material 770 Substrate 770P Functional film 771 Insulation film 800 Input/output device 801 Upper cover 802 Lower cover 803 FPC
804 Touch sensor 805 FPC
806 Display panel 809 Frame 810 Drive circuit 811 Battery 1189 ROM interface 1190 Substrate 1191 ALU
1192 ALU Controller 1193 Instruction Decoder 1194 Interrupt Controller 1195 Timing Controller 1196 Register 1197 Register Controller 1198 Bus Interface 1199 ROM
1200 memory element 1201 circuit 1202 circuit 1203 switch 1204 switch 1206 logic element 1207 capacitance element 1208 capacitance element 1209 transistor 1210 transistor 1213 transistor 1214 transistor 1220 circuit 3001 wiring 3002 wiring 3003 wiring 3004 wiring 3005 wiring 3200 transistor 3300 transistor 3400 capacitance element 5000 housing 5001 display portion 5002 display portion 5003 speaker 5004 LED lamp 5005 operation key 5006 connection terminal 5007 sensor 5008 microphone 5009 switch 5010 infrared port 5011 recording medium reading portion 5012 support portion 5013 earphone 5014 antenna 5015 shutter button 5016 image receiving portion 5017 charger 7302 housing 7304 display panel 7305 icon 7306 icon 7311 operation button 7312 operation button 7313 connection terminal 7321 band 7322 clasp

Claims (5)

A scanning line, a signal line, a group of a plurality of pixels electrically connected to the scanning line and arranged in a row direction, and a column direction electrically connected to the signal line and intersecting the row direction. And a group of a plurality of pixels arranged in
Pixels that are arranged in regions where the scanning lines and the signal lines intersect and that are electrically connected to the scanning lines and the signal lines include a first display element, a first conductive film, and a second display element. A conductive film, a first insulating film, a second insulating film, a pixel circuit, and a second display element,
The first display element has at least a reflective film having a first opening and a layer containing a liquid crystal material,
The first conductive film is electrically connected to the first display element,
The second conductive film has a region overlapping with the first conductive film,
The first insulating film has a region sandwiched between the first conductive film and a layer containing the liquid crystal material,
The first insulating film has a second opening in a region that does not overlap with the layer containing the liquid crystal material,
The second insulating film has a region sandwiched between the second conductive film and the first conductive film, and the second insulating film has a third opening.
The second conductive film is electrically connected to the first conductive film in the third opening,
The pixel circuit is electrically connected to the second conductive film,
The pixel circuit is electrically connected to the signal line,
The second display element is electrically connected to the pixel circuit,
The light emitted from the second display element is extracted from the first opening,
Another pixel adjacent to the pixel in the row direction has a fourth opening from which light emitted from the third display element included in the other pixel is extracted.
The display panel, wherein the other pixel includes the fourth opening so as to be different from the position of the first opening in the pixel . A scanning line, a signal line, a group of a plurality of pixels electrically connected to the scanning line and arranged in a row direction, and a column direction electrically connected to the signal line and intersecting the row direction. And a group of a plurality of pixels arranged in
The pixel, which is disposed in a region where the scanning line and the signal line intersect and is electrically connected to the scanning line and the signal line, includes a first display element, a first conductive film, and a second display element. A conductive film, a first insulating film, a second insulating film, a pixel circuit, and a second display element,
The first display element has at least a reflective film having a first opening and a layer containing a liquid crystal material,
The first conductive film is electrically connected to the first display element,
The second conductive film has a region overlapping with the first conductive film,
The first insulating film has a region sandwiched between the first conductive film and a layer containing the liquid crystal material,
The first insulating film has a second opening in a region that does not overlap with the layer containing the liquid crystal material,
The second insulating film has a region sandwiched between the second conductive film and the first conductive film.
The second insulating film has a third opening,
The second conductive film is electrically connected to the first conductive film in the third opening,
The pixel circuit is electrically connected to the second conductive film,
The pixel circuit is electrically connected to the signal line,
The second display element is electrically connected to the pixel circuit,
The light emitted from the second display element is extracted from the first opening,
Another pixel adjacent to the pixel in the column direction has a fourth opening from which light emitted from the third display element included in the other pixel is extracted.
The display panel, wherein the other pixel includes the fourth opening so as to be different from the position of the first opening in the pixel. In claim 1 or 2 ,
The pixel circuit includes a switch,
The switch includes a transistor,
The display panel, wherein the transistor includes an oxide semiconductor. In any one of Claim 1 thru|or 3 ,
The second display element is a display panel having a function of displaying in the same direction as the display direction of the first display element. In any one of Claim 1 thru|or 4 ,
The said 2nd display element is a display panel provided with the function to display in the area|region surrounded by the area|region where the said 1st display element displays.

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