JP6357002B2 - Probes and probe cards - Google Patents

Description

  The present invention relates to a probe and a probe card.

  In the manufacturing process of a semiconductor device, a large number of semiconductor integrated circuits built into a semiconductor wafer are subjected to a test to determine whether they are manufactured according to specifications before being separated into semiconductor chips. It is normal. That is, a semiconductor wafer in which a large number of semiconductor integrated circuits are built becomes an object to be inspected and undergoes inspections such as the above-described tests.

  An electrical connection device for connecting each semiconductor integrated circuit to an electrical circuit of an inspection apparatus is used for an electrical test of a semiconductor wafer as an object to be inspected. As this electrical connection device, for example, a probe card including an electrical test probe connected to an electrode of a semiconductor integrated circuit is used (see, for example, Patent Document 1).

  FIG. 17 is a side view of a conventional probe card.

  FIG. 18 is an enlarged side view showing a part of the probe of the probe card of FIG.

  The probe card 100 shown in FIGS. 17 and 18 is an example of a conventional probe card, and is known as a so-called cantilever type probe card.

  As shown in FIG. 17, the probe card 100 includes a probe support substrate 102 and, for example, a plurality of probes 103 arranged.

  As shown in FIG. 18, the probe 103 has a thin rod-shaped tip portion 108 and a thin rod-shaped main body portion 109 connected to one end of the tip portion 108, and is a connecting portion between the tip portion 108 and the main body portion 109. It is configured to bend. The tip portion 108 of the probe 103 forms a needle tip 107 that contacts (contacts) an electrode portion of an object to be inspected (not shown) such as a semiconductor wafer at a tip portion opposite to the connecting portion with the main body portion 109. doing.

  As shown in FIG. 17, in the probe card 100, the probe 103 is supported in a cantilever shape on the substrate 102 and arranged at a predetermined position.

  The substrate 102 is formed of a printed wiring board made of a resin material such as glass epoxy resin. And the board | substrate 102 can provide the terminal (not shown) for connecting with inspection apparatuses, such as a prober, on the surface on the opposite side to the installation surface of the probe 103, for example. The substrate 102 can electrically connect the terminal and the probe 103 via printed wiring (not shown).

  As shown in FIGS. 17 and 18, the probe card 100 has a fixing member 105 for fixing the probe 103 to a predetermined position of the substrate 102. The fixing member 105 may be referred to as a needle press or the like. That is, in the probe card 100, the probe 103 is fixed to a predetermined position with respect to the substrate 102 by the fixing member 105 for positioning.

  The conventional probe card 100 having the above structure can be used as an electrical connection device including the probe 103 for an electrical test of a semiconductor wafer or the like to be inspected.

  FIG. 19 is a diagram schematically illustrating inspection of an object to be inspected using a conventional probe card.

  As shown in FIG. 19, in the inspection of the semiconductor wafer 110 that is an object to be inspected, the probe 103 of the probe card 100 is brought into contact with each of a large number of electrode pads 111 formed on the semiconductor wafer 110 from the needle tip side. Electrical property tests can be performed. In the conventional inspection, since the semiconductor wafer 110 is inspected many times, the contact between the probe 103 of the probe card 100 and the electrode pad 111 of the semiconductor wafer 110 is repeated.

JP 2012-98198 A

  However, in the inspection of the semiconductor wafer 110 using the conventional probe card 100 shown in FIG. 19, the surface of the electrode pad 111 is placed on the distal end portion 108 of the probe 103 while the contact of the probe 103 is repeated many times. In some cases, the original electrical characteristics cannot be obtained. Therefore, in a conventional inspection, after a certain number of tests, the probe 103 is brought into contact with a cleaning sheet (not shown) containing an abrasive and the attached shavings are removed from the tip portion 108 of the probe 103. It was necessary to carry out work to do.

  In that case, such a cleaning operation of the probe 103 causes the tip portion 108 of the probe 103 to be polished and worn. As a result, the tip portion 108 of the probe 103 is gradually shortened from the needle tip side, causing a problem.

  FIG. 20 is a diagram schematically illustrating inspection of an object to be inspected using a conventional probe card having a shortened tip.

  For example, in the probe 103 of FIG. 19, when the wear of the tip end portion 108 progresses and the length of the tip end portion 108 becomes shorter than a certain length, a probe 103a having a shortened tip end portion 108a as shown in FIG. 20 is formed. The When the probe 103 a is used to contact the electrode tip 111 with the electrode pad 111 on the semiconductor wafer 110, the fixing member 105 fixing the probe 103 a may come into contact with the semiconductor wafer 110. As a result, the fixing member 105 may damage a semiconductor integrated circuit formed on the semiconductor wafer 110 or damage the semiconductor wafer 110 itself.

  In addition, when wear progresses at the distal end portion 108 of the probe 103 in FIG. 19 and gradually decreases, the position of the probe tip of the probe 103 gradually retracts toward the fixing member 105 side. That is, as shown in FIG. 20, in the probe 103a whose tip end portion 108a is shortened, the position of the needle tip varies as compared with the probe 103 in FIG. When the probe 103a is used for the inspection of the semiconductor wafer 110 as it is, there is a risk that the needle tip of the probe 103a contacts the electrode pad 111 formed on the semiconductor wafer 110 and the needle tip is bent or broken. was there.

  Therefore, in the inspection of the semiconductor wafer 110 using the conventional probe card 100, it is necessary to detect the degree of wear of the tip portion 108 of the probe 103. Specifically, it is determined whether or not the distal end portion 108 of the probe 103 in FIG. 18 or the like has reached a length that is a use limit for preventing the above-described problem, that is, whether or not the limit length has been reached. There was a need. Therefore, for example, in the conventional inspection of an object to be inspected, such as the semiconductor wafer 110, the electrical characteristic test is temporarily stopped, the probe card 100 is removed from a probing apparatus (hereinafter referred to as a prober) (not shown), and the tip portion is read by a microscope or the like. Ancillary operations such as measuring the length of 108 have been performed. Such interruption of the test and incidental measurement work have lowered the inspection efficiency of the semiconductor wafer, which in turn has caused a reduction in the production efficiency of the semiconductor.

  Therefore, there is a need for a technique that can easily detect that the tip of the probe of the probe card has worn and has reached the limit length and can omit ancillary operations such as length measurement. There is a need for a technique for improving the inspection efficiency of an object to be inspected, and thus improving the production efficiency of semiconductors.

  An object of the present invention is to provide a probe that easily detects that the tip has reached a limit length and improves inspection efficiency.

  Another object of the present invention is to provide a probe card that easily detects that the tip of the probe has reached the limit length and improves inspection efficiency.

  Other objects and advantages of the present invention will become apparent from the following description.

A first aspect of the present invention is a probe having a distal end portion including a needle tip that comes into contact with an object to be inspected, and a main body portion connected to one end of the distal end portion,
The present invention relates to a probe having a limit mark indicating a wear limit point of a tip portion.

  In the first aspect of the present invention, the limit mark is preferably provided at the tip as a portion having a different cross-sectional shape from the other portions of the tip.

  In the first aspect of the present invention, the limit mark is preferably provided by forming a convex portion on the outer peripheral surface of the tip portion.

  In the first aspect of the present invention, the limit mark is preferably provided by forming a recess in the outer peripheral surface of the tip.

In the first aspect of the present invention, the tip portion is rod-shaped, and is connected to the main body at one end, and the other end forms a needle tip, and gradually narrows from the connecting portion with the main body toward the needle tip. And has a structure
The limit mark is provided at the tip portion, and the diameter of the portion of the tip portion where the limit mark is provided is preferably smaller than the diameter of the connecting portion of the tip portion.

In the first aspect of the present invention, the tip and the main body are both rod-shaped,
It is preferable that one end of the distal end portion is connected to one end of the main body portion, and the other end of the distal end portion constitutes a needle tip, and is bent at a connecting portion between the distal end portion and the main body portion.

In the first aspect of the present invention, the limit mark is provided at the tip,
The cross section of the portion provided with the limit mark at the tip in a plane perpendicular to the direction in which the tip extends is the length in the direction in which the main body extends in a plane view on the plane is perpendicular to that direction. It is preferable to have a shape larger than the length.

According to a second aspect of the present invention, there is provided a probe according to the first aspect of the present invention;
The present invention relates to a probe card comprising a substrate for supporting a probe.

  In the second aspect of the present invention, it is preferable that the substrate has a fixing member for fixing the probe on the substrate.

  In the second aspect of the present invention, the probe and the fixing member are arranged on one surface of the substrate, and the distance from the surface of the substrate to the limit mark of the probe is the anti-substrate of the fixing member from the surface of the substrate. The distance is preferably larger than the distance to the tip on the side.

  According to the first aspect of the present invention, a probe that improves inspection efficiency is provided.

  Moreover, according to the 2nd aspect of this invention, the probe card which improves inspection efficiency is provided.

It is a side view of the probe card of a 1st embodiment of the present invention. It is a side view which expands and shows the principal part of the probe of the probe card of FIG. It is the figure which looked at the front-end | tip part of the probe shown in FIG. 2 from the substantially front side. It is the figure which looked at the front-end | tip part of the probe shown in FIG. 2 from the needle tip side. It is sectional drawing of the formation part of the limit mark of the front-end | tip part of the probe shown in FIG. It is a side view which shows typically the camera imaging | photography of the probe of the probe card of 1st Embodiment of this invention. It is a side view which expands and shows the principal part of the probe of the probe card of 2nd Embodiment of this invention. It is the figure which looked at the front-end | tip part of the probe shown in FIG. 7 from the substantially front side. It is the figure which looked at the front-end | tip part of the probe shown in FIG. 7 from the needle tip side. It is sectional drawing of the formation part of the limit mark of the front-end | tip part of the probe shown in FIG. It is a side view which expands and shows the principal part of the probe of the probe card of 3rd Embodiment of this invention. It is the figure which looked at the front-end | tip part of the probe shown in FIG. 11 from the substantially front side. It is sectional drawing of the formation part of the limit mark of the front-end | tip part of the probe shown in FIG. It is a side view of the probe card of 4th Embodiment of this invention. It is a perspective view of the probe which the probe card of 4th Embodiment of this invention has. It is a side view which expands and shows a part of front-end | tip part of the probe of FIG. It is a side view of the conventional probe card. It is a side view which expands and shows a part of probe of the probe card of FIG. It is a figure which illustrates typically the test | inspection of the to-be-inspected object using the conventional probe card. It is a figure which illustrates typically the test | inspection of the to-be-inspected object using the conventional probe card in which the front-end | tip part became short.

  As described above, the probe card is used for an electrical test of a semiconductor wafer or the like to be inspected as an electrical connection device provided with a probe.

  As described for the conventional probe card 100 with reference to FIG. 17 and the like, the probe card can be configured by arranging, for example, a plurality of probes on a substrate. The probe card is installed in an inspection device called a prober, and the position of the probe tip is adjusted. Thereafter, the probe card makes contact with the probe tips of each of a large number of electrode pads on the semiconductor wafer to realize electrical connection of the semiconductor integrated circuit formed on the semiconductor wafer.

  At this time, the position adjustment of the probe tip of the probe can be performed using the position adjustment system of the prober. The prober position adjustment system is configured using, for example, a camera and a display. Then, at the time of adjusting the position of the probe tip, for example, the probe tip is photographed by a dedicated camera disposed below the probe card, and the image is displayed on the display. Next, the position of the needle tip is recognized based on the image of the needle tip, the position of the object to be inspected is adjusted according to the position of the needle tip, and the position adjustment of the needle tip using the position adjustment system is performed. Done.

  In the inspection of an object to be inspected such as a semiconductor wafer using such a probe card, as described above, the tip of the probe is worn away while the probe contact is repeated and the test is repeated many times. It gradually became shorter and caused problems. That is, as described above, in the probe, there is a case where the tip portion is worn and its length becomes shorter than the limit length. In that case, if the needle tip is brought into contact with the electrode pad on the semiconductor wafer as it is, the fixing member that fixes the probe contacts the semiconductor wafer and damages the semiconductor integrated circuit on the semiconductor wafer, or the semiconductor wafer. It was sometimes damaged.

  Thus, as a result of intensive studies, the present inventor has found that by introducing a new configuration to the probe, the above-described prober position adjustment system can be used, and the above-described problems can be avoided.

  Specifically, the present invention relates to a probe configured with a limit mark indicating a wear limit point, and a probe card having the probe. The probe of the present invention has a limit mark indicating a wear limit point, so that it is prevented that the probe is shortened beyond the limit length due to wear. Prevent it from being used for inspection.

  And the probe of this invention can utilize the position adjustment system of the probe tip of the probe which a prober has by having a limit mark, for example, and it can detect simply that it has reached the limit length.

  Therefore, in the present invention, it is preferable that the limit mark of the probe can be detected by the camera constituting the position adjustment system described above. For example, in the probe, it is preferable that the portion where the limit mark is formed can be easily identified by the camera image as compared with other portions where the limit mark is not formed. In particular, it is preferable that a camera disposed below the probe card can be sufficiently detected in the same manner as the probe tip.

  Such a probe of the present invention having a limit mark and a probe card of the present invention having the limit mark can easily detect that the probe has reached the limit length. Therefore, in that case, the use in the inspection can be stopped, and the inspected object can be prevented from being damaged. In addition, the probe of the present invention and the probe card of the present invention can eliminate unnecessary measurement interruptions and incidental measurement work using a microscope or the like, and can improve inspection efficiency.

  Hereinafter, embodiments of the probe of the present invention and the probe card of the present invention having the same will be described with reference to the drawings. In the description of each drawing, common constituent elements are given the same reference numerals, and duplicate descriptions are omitted.

Embodiment 1 FIG.
FIG. 1 is a side view of the probe card according to the first embodiment of the present invention.

  FIG. 2 is an enlarged side view showing the main part of the probe of the probe card of FIG.

  The probe card 1 according to the first embodiment of the present invention includes a probe supporting substrate 2 and a probe 3 as shown in FIG. As shown in FIGS. 1 and 2, the probe card 1 according to the first embodiment of the present invention is a so-called cantilever type probe card, and can have one or more probes 3.

  And the probe 3 installed on the board | substrate 2 of the probe card 1 is a probe of embodiment of this invention, Comprising: It becomes the 1st example. That is, the probe card 1 according to the first embodiment of the present invention includes the probe 3 that is a first example of the probe according to the embodiment of the present invention.

  The board 2 of the probe card 1 is formed of a printed wiring board made of a resin material such as glass epoxy resin. And the board | substrate 2 can provide the terminal (not shown) for connecting with inspection apparatuses, such as a prober, on the surface on the opposite side to the installation surface of the probe 3, for example. The substrate 2 can electrically connect the terminal and the probe 3 via printed wiring (not shown).

  Further, the probe card 1 has a fixing member 5 for fixing the probe 3 to a predetermined position of the substrate 2 as shown in FIGS. 1 and 2. The fixing member 5 is a member that is configured by using, for example, an insulating resin material and is also referred to as a needle presser or the like. That is, in the probe card 1, the probe 3 is fixed to a predetermined position with respect to the substrate 2 by the fixing member 5 for positioning.

  As shown in FIG. 1, in the probe card 1, the probe 3 is supported in a cantilever shape on the substrate 2 and arranged at a predetermined position. Therefore, in the probe card 1, as shown in FIG. 1, when the probe installation surface of the substrate 2 is directed downward, the probe tip 7 of the probe 3 held by the fixing member 5 is directed downward or obliquely downward. It is configured.

  The conventional probe card 1 having the above structure can be used as an electrical connection device including the probe 3 for an electrical test of a semiconductor wafer or the like as an object to be inspected. The probe card 1 according to the first embodiment of the present invention includes the probe 3 which is the first example of the probe according to the embodiment of the present invention, so that the probe 3 is worn so as to become shorter than the limit length. It can be easily detected and the inspection efficiency of the object to be inspected can be improved. Hereinafter, the probe 3 which is the first example of the probe according to the embodiment of the present invention will be described in more detail.

  The probe 3 that is the first example of the probe according to the embodiment of the present invention can be formed using a metal such as tungsten, for example. As shown in FIG. 2, the probe 3 includes a distal end portion 8 and a main body portion 9 connected to one end of the distal end portion 8. The tip 8 includes a needle tip 7 that contacts (contacts) an electrode portion of an object to be inspected (not shown in FIG. 2) such as a semiconductor wafer.

  In the probe 3, both the tip 8 and the main body 9 are thin rods having a circular cross section perpendicular to the direction in which they extend. One end of the tip 8 of the probe 3 is connected to one end of the main body 9 as described above, and the other end of the tip 8 constitutes the needle tip 7. For example, the tip 8 of the probe 3 can have a structure that gradually decreases from the connecting portion 10 to the main body 9 toward the needle tip 7 as shown in FIG. The probe 3 is configured to bend at a connecting portion 10 between the distal end portion 8 and the main body portion 9. That is, the probe 3 is composed of a rod-shaped tip end portion 8 and a rod-shaped main body portion 9 which are connected at their ends so as to be bent and both have a circular cross section. The distal end portion 8 of the probe 3 on the body portion side constitutes the needle tip 7 and has a thin line-like structure that is bent as a whole. In the probe 3 which is a first example of the probe according to the embodiment of the present invention, the main body 9 is fixed by a fixing member 5 and fixed at a predetermined position on the substrate 2.

  The probe 3, which is a first example of the probe according to the embodiment of the present invention, further includes a limit mark 11 that indicates a limit point of wear of the tip 8. The limit mark 11 indicates whether or not the distal end portion 8 of the probe 3 has reached a length that is a use limit for preventing the above-described problem such as breakage of the object to be inspected. It becomes a mark for judging whether it has reached. Since the probe 3 has the limit mark 11, when the tip 8 is worn and reaches the limit length, the probe 3 can be easily detected and ancillary operations such as length measurement can be omitted. And

  If the probe card 1 according to the first embodiment of the present invention has a plurality of probes, one or more of the plurality of probes may be the probe 3 as the first example of the probe according to the embodiment of the present invention. Good. More specifically, when the probe card 1 according to the first embodiment of the present invention includes one or more probes serving as a reference for adjusting the position of the probe tip by the prober, only the reference probe is limited. The probe 3 having the mark 11 may be used.

  In the probe 3 which is the first example of the probe according to the embodiment of the present invention, the limit mark 11 is desirably provided at the tip 8 as shown in FIG. In that case, in the probe card 1 of the first embodiment of the present invention, the probe 3 and the fixing member 5 are arranged on one surface of the substrate 2 as shown in FIG. Therefore, the distance from the surface of the substrate 2 on which the probe 3 or the like is provided to the limit mark 11 of the probe 3 is larger than the distance from that surface of the substrate 2 to the tip of the fixing member 5 on the side opposite to the substrate. That is, when the probe card 1 is arranged with the installation surface of the probe 3 or the like facing downward, the limit mark 11 of the probe 3 is a tip portion on the lower side of the fixing member 5 on the substrate 2 as shown in FIG. Specifically, it is installed at a position lower than the lower surface of the fixing member 5.

  FIG. 3 is a view of the distal end portion of the probe shown in FIG. 2 as viewed from a substantially front side.

  FIG. 4 is a view of the distal end portion of the probe shown in FIG. 2 as viewed from the needle tip side.

  In the probe 3, the limit mark 11 at the distal end portion 8 is provided as a portion having a different cross-sectional shape as compared with other portions of the distal end portion 8 where the limit mark 11 is not formed. That is, in the tip 8 of the probe 3, the portion where the limit mark 11 is provided has a different cross-sectional shape from the portion where the limit mark 11 is not provided. In particular, in the distal end portion 8 of the probe 3, the portion where the limit mark 11 is provided has a different cross-sectional shape from the portion where the limit mark 11 is not provided, which is closer to the needle tip than that portion.

  As shown in FIGS. 3 and 4, the limit mark 11 of the probe 3 can be provided by forming a convex portion on the outer peripheral surface of the rod-shaped tip portion 8. For example, as shown in FIGS. 3 and 4, the convex portion forming the limit mark 11 is composed of two portions that are spaced apart from each other, and is opposed to cover a part of the outer peripheral surface of the rod-shaped tip 8. It can be provided in the form of a band that is interrupted at a point.

  Such a limit mark 11 can be formed by using a plating technique or the like before the probe 3 is assembled on the substrate 2 when the probe card 1 is manufactured. And as a result of providing the above-mentioned convex part and setting it as the limit mark 11, in the front-end | tip part 8 of the probe 3, the part in which the limit mark 11 was provided has a different cross-sectional shape from the other part in which the limit mark 11 is not provided. Can have.

  As described above, the tip 8 of the probe 3 can have a structure that gradually decreases from the connecting portion 10 to the main body 9 toward the needle tip 7 as shown in FIG. Therefore, it is desirable that the diameter of the portion where the limit mark 11 is provided as the convex portion on the outer peripheral surface of the distal end portion 8 of the probe 3 is smaller than the diameter of the connecting portion 10. By doing so, when the probe card 1 has many probes 3, it can prevent that adjacent probes 3 contact in the part of a limit mark.

  FIG. 5 is a cross-sectional view of the limit mark forming portion at the tip of the probe shown in FIG.

  As shown in FIG. 5, the portion of the tip 8 of the probe 3 where the limit mark 11 is provided has a circular cross-sectional shape with a portion near the circumference missing. More specifically, the portion of the tip 3 of the probe 3 where the limit mark 11 is provided has a circular cross-sectional shape in which a part of the vicinity of the periphery is missing at two locations, and faces each other across the center. It forms a circular shape in which cutout portions are provided at two locations on the outer peripheral portion. On the other hand, the other portion of the tip 8 where the limit mark 11 is not provided has a circular shape with no cross section. In particular, the needle tip 7 has a circular shape, and the cross section is also circular in a portion between the needle tip 7 and the portion where the limit mark 11 of the distal end portion 8 is provided.

  Therefore, in a state where the tip portion 8 is not worn at the initial stage of use of the probe 3, the shape of the needle tip 7 is circular. If the tip 8 of the probe 3 is worn away from the needle tip 7 side by repeated use in the inspection, the shape of the needle tip 7 is circular or substantially circular with no chip around the circumference until a certain stage. Show shape. However, the wear of the tip 8 further progresses and becomes shorter from the needle tip 7 side. As a result, the position of the needle tip 7 may reach the portion where the limit mark 11 is formed. In this case, the shape of the needle tip 7 is the same or similar to that shown in FIG. That is, the shape is completely different from the initial use of the probe 3 and the shape of the needle tip 7 before reaching the limit length. Such a significant change in the shape of the needle tip 7 can be easily detected by, for example, the above-described prober position adjustment system that recognizes the image of the needle tip 7 for position adjustment of the needle tip 7.

  FIG. 6 is a side view schematically showing camera photography of the probe of the probe card according to the first embodiment of the present invention.

  The probe card 1 according to the first embodiment of the present invention can be installed in a prober (not shown), and after adjusting the position of the probe tip 7 of the probe 3, it is used for inspecting an object to be inspected such as a semiconductor wafer. be able to. The prober preferably has a camera 13 for photographing the needle tip 7 of the probe 3 shown in FIG. 6 and a display (not shown) for displaying an image by the camera 13.

  At this time, the prober camera 13 is preferably arranged at a position facing the needle tip 7 of the tip 8 of the probe 3. For example, when the probe 3 of the probe card 1 contacts the electrode portion on the semiconductor wafer from above, the surface of the substrate 2 on which the probe 3 is disposed is directed to the lower side of the semiconductor wafer. The probe 3 of the probe card 1 is fixed on the substrate 2 by a fixing member 5 and is arranged so that the needle tip 7 faces the lower side where the semiconductor wafer is located. Therefore, the prober camera 13 is arranged on the lower side of the probe card 1 and the needle tip 7 of the probe 3 is photographed from the lower side, so that the image recognition of the needle tip 7 can be performed with sufficient accuracy. Then, the position of the needle tip 7 can be adjusted by recognizing the position of the needle tip 7 based on the image of the needle tip 7 and aligning the semiconductor wafer in accordance with the position of the needle tip 7.

  Here, the prober camera 13 is used for image recognition of the probe tip 7 of the probe 3 of the probe card 1 according to the first embodiment of the present invention, and is used for recognizing its position. It can also be used for shape recognition.

  The liquid probe card 1 according to the present invention is used for many semiconductor inspections, and each time image recognition and position adjustment of the probe tip 7 of the probe 3 are performed using the prober camera 13.

  On the other hand, the tip portion 8 of the probe 3 is gradually worn away from the needle tip 7 side and becomes shorter, and the position of the needle tip 7 at the tip portion 8 gradually moves to the main body portion 9 side. In that case, the shape of the needle tip 7 projected on the display by the camera 13 does not change or the diameter gradually increases until the position of the needle tip 7 reaches the portion where the limit mark 11 is formed from the initial use position. It shows only a small change that increases. However, when the wear of the tip 8 further progresses and the position of the needle tip 7 reaches the portion where the limit mark 11 of the tip 8 is formed, the shape of the needle tip 7 displayed on the display by the camera 13 changes dramatically. .

  In other words, as described above, the shape of the probe tip 7 of the probe 3 that can be recognized by the camera 13 has changed dramatically from a circular shape with no chipping at the initial stage of use, and a part of the circumference as shown in FIG. It becomes a chipped circular shape.

  Therefore, the shape of the probe 3 is completely different from the initial shape of the probe 3 and the shape of the needle tip 7 before reaching the limit length. Such a significant change in the shape can be easily detected by using the above-described prober position adjustment system that recognizes the image of the needle tip 7 for adjusting the position of the needle tip 7, for example. That is, the limit mark 11 can be recognized by detecting the difference in the shape of the needle tip 7 by shape recognition or pattern matching using a position adjustment system of a prober.

  As a result, when inspecting the object to be inspected, it is possible to easily detect that the tip 8 of the probe 3 has reached the limit length by using the position adjustment system of the probe tip 7 of the probe 3 possessed by the prober. it can.

  The probe 3 having the limit mark 11 and the probe card 1 according to the first embodiment of the present invention having the limit mark 11 can easily detect that the probe 3 has reached the limit length, and can be used for inspection. It can be stopped and damage to the object to be inspected can be prevented. The probe 3 as the first example of the probe according to the embodiment of the present invention and the probe card 1 according to the first embodiment of the present invention do not require unnecessary inspection interruption or incidental measurement work using a microscope or the like. Inspection efficiency can be improved.

Embodiment 2. FIG.
Similar to the probe card 1 of the first embodiment of the present invention shown in FIG. 1, the probe card of the second embodiment of the present invention fixes the probe supporting substrate, the probe, and the probe to a predetermined position on the substrate. It is what is called a cantilever type probe card comprised with the fixing member for this.

  The probe of the probe card according to the second embodiment of the present invention is the probe according to the embodiment of the present invention, and is a second example thereof. That is, the probe card of the second embodiment of the present invention is configured to have the second example of the probe of the embodiment of the present invention. The probe card of the second embodiment of the present invention has the same structure as that of the probe card 1 of the first embodiment of the present invention shown in FIG. 1 except that the structure of the probe is different.

  Further, the probe of the probe card according to the second embodiment of the present invention is provided at the distal end compared to the probe 3 of FIGS. 1 and 2, which is a first example of the probe according to the embodiment of the present invention. The structure is the same except that the structure of the limit mark is different.

  Therefore, for the probe card of the second embodiment of the present invention, the description of the parts common to the probe card 1 of the first embodiment of the present invention is omitted, and the second example of the probe of the embodiment of the present invention that it has The structure of the limit mark provided at the front end portion will be described in detail.

  FIG. 7 is an enlarged side view showing the main part of the probe of the probe card according to the second embodiment of the present invention.

  The probe 23 as the second example of the probe according to the embodiment of the present invention can be formed using a metal such as tungsten, for example. As shown in FIG. 7, the probe 23 includes a distal end portion 28 and a main body portion 29 connected to one end of the distal end portion 28. The distal end portion 28 includes a needle tip 27 that contacts (contacts) an electrode portion of an inspection target such as a semiconductor wafer (not shown in FIG. 7).

  In the probe 23, both the tip portion 28 and the main body portion 29 are thin rods having a circular cross section perpendicular to the direction in which they extend. One end of the distal end portion 28 of the probe 23 is connected to one end of the main body portion 29 as described above, and the other end of the distal end portion 28 constitutes the needle tip 27. For example, the distal end portion 28 of the probe 23 can have a structure that gradually decreases from the connecting portion 30 with the main body portion 29 toward the needle tip 27 as shown in FIG. The probe 23 is configured to bend at a connecting portion 30 between the distal end portion 28 and the main body portion 29. In other words, the probe 23 is connected at its ends so as to be bent, and each includes a rod-shaped tip portion 28 and a rod-shaped main body portion 29 having a circular cross section. The tip of the tip portion 28 of the probe 23 on the main body side constitutes the needle tip 27 and has a thin line-like structure as a whole. The probe 23, which is the second probe of the embodiment of the present invention, has a main body 29 fixed by a fixing member 25 on the probe card substrate, and is fixed at a predetermined position on the substrate.

  The probe 23 which is the second example of the probe according to the embodiment of the present invention further sets the limit point of wear of the tip portion 28 in the same manner as the probe 3 which is the first example of the probe according to the embodiment of the present invention shown in FIG. The limit mark 31 is shown.

  In addition, when the probe card of the second embodiment of the present invention has a plurality of probes, one or more of the plurality of probes are implemented in the present invention in the same manner as the probe card 1 of the first embodiment of the present invention. What is necessary is just to set it as the probe 23 which is the 2nd example of the probe of a form.

  In the probe 23 which is the second example of the probe according to the embodiment of the present invention, it is desirable that the limit mark 31 is provided at the tip portion 28 as shown in FIG. In that case, in the probe card according to the second embodiment of the present invention, as in the probe card 1 according to the first embodiment of the present invention shown in FIG. Is arranged. Therefore, the distance from the surface of the substrate on which the probe 23 and the like are provided to the limit mark 31 of the probe 23 is larger than the distance from the substrate surface to the tip of the fixing member 25 on the side opposite to the substrate. That is, when the probe card according to the second embodiment of the present invention is arranged with the installation surface of the probe 23 or the like facing downward, the limit mark 31 of the probe 23 is below the fixing member 25 as shown in FIG. This is installed at a position lower than the lower end surface of the fixing member 25, specifically, the lower surface of the fixing member 25.

  FIG. 8 is a view of the distal end portion of the probe shown in FIG. 7 viewed from a substantially front side.

  FIG. 9 is a view of the distal end portion of the probe shown in FIG. 7 as viewed from the needle tip side.

  In the probe 23, the limit mark 31 at the distal end portion 28 is provided as a portion having a different cross-sectional shape as compared with other portions of the distal end portion 28 where the limit mark 31 is not formed. That is, in the distal end portion 28 of the probe 23, the portion where the limit mark 31 is provided has a different cross-sectional shape from the portion where the limit mark 31 is not provided. In particular, in the distal end portion 28 of the probe 23, the portion where the limit mark 31 is provided has a different cross-sectional shape from the portion where the limit mark 31 is not provided on the needle tip side from that portion.

  As shown in FIGS. 8 and 9, the limit mark 31 of the probe 23 can be provided by forming a convex portion on the outer peripheral surface of the rod-shaped tip portion 28. As shown in FIGS. 8 and 9, for example, two convex portions forming the limit mark 31 can be provided. Each of the two convex portions has a small plate-like shape that is rectangular in plan view, and is opposed to each other with a center line extending in the direction in which the tip portion 28 extends, and is formed on the outer peripheral surface of the rod-like tip portion 28. It can be provided so as to cover a part.

  Such a limit mark 31 can be formed by using a plating technique or the like before the probe 23 is incorporated on the substrate at the time of manufacturing the probe card. And as a result of providing the above-mentioned convex part and setting it as the limit mark 31, in the front-end | tip part 28 of the probe 23, the part in which the limit mark 31 was provided has a different cross-sectional shape from the other part in which the limit mark 31 is not provided. Can have.

  At this time, with respect to the arrangement structure of the two convex portions constituting the limit mark 31, when viewed in a plane in a plane perpendicular to the extending direction of the tip portion 28, the two convex portions are arranged in the extending direction of the main body portion 29. Thus, it is preferable to arrange on the outer peripheral surface of the rod-shaped tip portion 28. That is, the two convex portions formed on the outer peripheral surface of the distal end portion 28 are arranged in a direction parallel to the operating direction of the probe tip 27 of the probe 23 when the probe 23 contacts the object to be inspected at the time of inspection. It is preferable to be provided. By arranging the convex portions constituting the limit mark 31 in such a manner, the limit mark 31 can exhibit an effect of reinforcing the probe 23 when the probe 23 contacts the object to be inspected.

  FIG. 10 is a cross-sectional view of the limit mark forming portion at the tip of the probe shown in FIG.

  As shown in FIG. 10, the cross-sectional shape of the portion provided with the limit mark 31 at the distal end portion 28 of the probe 23 has a circular shape with a part of the circumference protruding. More specifically, the portion provided with the limit mark 31 at the tip portion 28 of the probe 23 has a circular cross-sectional shape in which a part of the circumference protrudes at two places and faces each other across the center. It has a circular shape with convex portions at two locations on the outer peripheral portion. On the other hand, the other part of the tip part 28 where the limit mark 31 is not provided has a circular shape with no cross section. In particular, the needle tip 27 has a circular shape, and the cross section of the tip portion 28 is also circular in a portion between the portion where the limit mark 31 is provided and the needle tip 27.

  Therefore, in a state where the tip portion 28 is not worn at the initial use of the probe 23, the shape of the needle tip 27 is circular. When the wear of the tip portion 28 of the probe 23 progresses from the side of the needle tip 27 due to repeated use in the inspection, the shape of the needle tip 27 is a circular shape or a substantially circular shape with no chipping in the vicinity of the circumference until a certain stage. Show shape. However, the wear of the tip 28 further progresses and becomes shorter from the needle tip 27 side. As a result, the position of the needle tip 27 may reach the portion where the limit mark 31 is formed. In that case, the shape of the needle tip 27 is the same as or similar to that shown in FIG. That is, the shape is completely different from the initial use of the probe 23 and the shape of the needle tip 27 before reaching the limit length. Such a significant change in the shape of the needle tip 27 can be easily detected by, for example, the above-described prober position adjustment system that recognizes an image of the needle tip 27 for adjusting the position of the needle tip 27.

  The probe 23 having the limit mark 31 and the probe card according to the second embodiment having the limit mark 31 can easily detect that the probe 23 has reached the limit length, and can be used for inspection. Can be stopped and damage to the object to be inspected can be prevented. And the probe 23 which is the second example of the probe according to the embodiment of the present invention and the probe card according to the second embodiment of the present invention eliminates unnecessary inspection interruption and incidental measurement work using a microscope, Inspection efficiency can be improved.

Embodiment 3 FIG.
The probe card according to the third embodiment of the present invention, like the probe card 1 according to the first embodiment of the present invention shown in FIG. 1, fixes the probe supporting substrate, the probe, and the probe at a predetermined position on the substrate. It is what is called a cantilever type probe card comprised with the fixing member for this.

  The probe of the probe card according to the third embodiment of the present invention is the probe according to the embodiment of the present invention, and is a third example thereof. That is, the probe card of the third embodiment of the present invention is configured to have the third example of the probe of the embodiment of the present invention. The probe card of the third embodiment of the present invention has the same structure as that of the probe card 1 of the first embodiment of the present invention shown in FIG. 1 except that the structure of the probe is different.

  Further, the probe of the probe card according to the third embodiment of the present invention is provided at the distal end compared to the probe 3 of FIGS. 1 and 2, which is a first example of the probe according to the embodiment of the present invention. The structure is the same except that the structure of the limit mark is different.

  Therefore, for the probe card of the third embodiment of the present invention, the description of the parts common to the probe card 1 of the first embodiment of the present invention is omitted, and the third example of the probe of the embodiment of the present invention that it has The structure of the limit mark provided at the front end portion will be described in detail.

  FIG. 11 is an enlarged side view showing the main part of the probe of the probe card according to the third embodiment of the present invention.

  The probe 43, which is a third example of the probe according to the embodiment of the present invention, can be formed using a metal such as tungsten, for example. As shown in FIG. 11, the probe 43 includes a distal end portion 48 and a main body portion 49 connected to one end of the distal end portion 48. The tip portion 48 includes a needle tip 47 that contacts (contacts) an electrode portion of an object to be inspected (not shown in FIG. 11) such as a semiconductor wafer.

  In the probe 43, both the distal end portion 48 and the main body portion 49 are thin rods having a circular cross section perpendicular to the direction in which they extend. One end of the distal end portion 48 of the probe 43 is connected to one end of the main body portion 49 as described above, and the other end of the distal end portion 48 constitutes the needle tip 47. For example, as shown in FIG. 11, the tip portion 48 of the probe 43 can have a structure that gradually decreases from the connecting portion 50 to the main body portion 49 toward the needle tip 47. The probe 43 is configured to bend at the connecting portion 50 between the distal end portion 48 and the main body portion 49. That is, the probe 43 is composed of a rod-shaped distal end portion 48 and a rod-shaped main body portion 49 which are connected at their ends so as to be bent and both have a circular cross section. The tip of the tip portion 48 of the probe 43 on the main body side constitutes the needle tip 47, and has a thin line-like structure as a whole. The probe 43 which is the third of the probes according to the embodiment of the present invention has a main body 49 fixed by a fixing member 45 on the substrate of the probe card, and is fixed at a predetermined position on the substrate.

  The probe 43, which is the third example of the probe according to the embodiment of the present invention, further sets the limit point of wear of the tip portion 48 in the same manner as the probe 3 which is the first example of the probe according to the embodiment of the present invention in FIG. It has a limit mark 51 shown.

  In addition, when the probe card of the third embodiment of the present invention has a plurality of probes, one or more of the plurality of probes are implemented as in the case of the probe card 1 of the first embodiment of the present invention. What is necessary is just to set it as the probe 43 which is the 3rd example of the probe of a form.

  In the probe 43 which is the third example of the probe according to the embodiment of the present invention, the limit mark 51 is desirably provided at the tip 48 as shown in FIG. 11, for example. In that case, in the probe card according to the third embodiment of the present invention, as in the probe card 1 according to the first embodiment of the present invention shown in FIG. Is arranged. Therefore, the distance from the surface of the substrate on which the probe 43 or the like is provided to the limit mark 51 of the probe 43 is larger than the distance from the substrate surface to the tip of the fixing member 45 on the side opposite to the substrate. That is, when the probe card of the third embodiment of the present invention is arranged with the installation surface of the probe 43 or the like facing downward, the limit mark 51 of the probe 43 is below the fixing member 45 as shown in FIG. This is installed at a position lower than the lower end surface of the fixing member 45, specifically, the lower end surface of the fixing member 45.

  FIG. 12 is a view of the distal end portion of the probe shown in FIG. 11 viewed from a substantially front side.

  FIG. 13 is a cross-sectional view of the limit mark forming portion at the tip of the probe shown in FIG.

  In the probe 43, the limit mark 51 at the tip portion 48 is provided as a portion having a different cross-sectional shape as compared with other portions of the tip portion 48 where the limit mark 51 is not formed. That is, in the tip portion 48 of the probe 43, the portion where the limit mark 51 is provided has a different cross-sectional shape from the portion where the limit mark 51 is not provided. In particular, in the tip 48 of the probe 43, the portion where the limit mark 51 is provided has a different cross-sectional shape from the portion where the limit mark 51 is not provided on the needle tip side from that portion.

  As shown in FIGS. 12 and 13, the limit mark 51 of the probe 43 can be provided by forming a recess in the outer peripheral surface of the rod-shaped tip 48 so as to make a cut. As shown in FIGS. 12 and 13, for example, two recesses forming the limit mark 51 can be provided. The two recesses can be provided so as to face each other across the center line in the direction in which the tip 48 extends.

  And as a result of providing the above-mentioned recessed part and setting it as the limit mark 51, in the front-end | tip part 48 of the probe 43, the part in which the limit mark 51 was provided has a different cross-sectional shape from the other part in which the limit mark 51 is not provided. be able to.

  At this time, with respect to the arrangement structure of the two concave portions constituting the limit mark 51, when viewed in a plane perpendicular to the direction in which the tip portion 48 extends, two concave portions are formed in a direction perpendicular to the direction in which the main body portion 49 extends. It is preferably formed on the outer peripheral surface of the rod-shaped tip 48 so as to be aligned. That is, the two recesses formed on the outer peripheral surface of the tip 48 are aligned in a direction orthogonal to the operating direction of the probe tip 47 of the probe 43 when the probe 43 contacts the object to be inspected. It is preferable to be provided. By arranging the recesses constituting the limit mark 51 in this way, it is possible to prevent the formation of the limit mark 51 from reducing the strength of the probe 43 when the probe 43 contacts the object to be inspected during inspection. Can do.

  As shown in FIG. 13, the portion of the tip end portion 48 of the probe 43 provided with the limit mark 51 has a cross-sectional shape that is cut out at both end portions of a circle and has a substantially bowl shape. More specifically, the cross section of the portion of the probe 43 where the limit mark 51 is provided in the plane perpendicular to the direction in which the tip 48 extends is the direction in which the main body 49 extends in plan view on that plane. Becomes a substantially bowl-like shape larger than the length in the direction orthogonal to the direction.

  In the probe 43, the portion where the limit mark 51 of the tip 48 is formed has such a structure, so that the formation of the limit mark 51 increases the strength of the probe 43 when the probe 43 contacts the object to be inspected. It is possible to suppress the reduction.

  On the other hand, the other part of the tip 48 where the limit mark 51 is not provided has a circular shape with no chip. In particular, the needle tip 47 has a circular shape, and the cross section of the tip portion 48 is also circular in a portion between the portion where the limit mark 51 is provided and the needle tip 47.

  Therefore, in a state where the tip portion 48 is not worn at the initial stage of use of the probe 43, the shape of the needle tip 47 is circular. If the wear of the tip portion 48 of the probe 43 progresses from the side of the needle tip 47 due to repeated use in the inspection, the shape of the needle tip 47 is a circular shape or a substantially circular shape with no chipping in the vicinity of the circumference until a certain stage. Show shape. However, the wear of the tip 48 further progresses and becomes shorter from the needle tip 47 side, and as a result, the position of the needle tip 47 may reach the portion where the limit mark 51 is formed. In that case, the shape of the needle tip 47 is a substantially bowl-like shape similar to or similar to that shown in FIG. That is, the shape is completely different from the initial stage of use of the probe 43 and the shape of the needle tip 47 before reaching the limit length. Such a significant change in the shape of the needle tip 47 can be easily detected by, for example, the above-described prober position adjustment system that recognizes an image of the needle tip 47 for adjusting the position of the needle tip 47.

  The probe 43 having the limit mark 51 and the probe card according to the third embodiment of the present invention having the limit mark 51 can easily detect that the probe 43 has reached the limit length, and can be used for inspection. Can be stopped and damage to the object to be inspected can be prevented. And the probe 43 which is the third example of the probe according to the embodiment of the present invention and the probe card according to the third embodiment of the present invention do not require unnecessary inspection interruption or incidental measurement work using a microscope, Inspection efficiency can be improved.

Embodiment 4 FIG.
The probe card 1 according to the first embodiment of the present invention and the probe cards according to the second embodiment and the third embodiment described above are so-called cantilever type probe cards, but the probe card according to the embodiment of the present invention is a cantilever type. However, the present invention is not limited to this, and other configurations are possible. Below, the example of the probe card of embodiment of this invention other than a cantilever type is demonstrated.

  FIG. 14 is a side view of a probe card according to the fourth embodiment of the present invention.

  FIG. 15 is a perspective view of a probe included in the probe card according to the fourth embodiment of the present invention.

  As shown in FIG. 14, the probe card 61 according to the fourth embodiment of the present invention includes a probe support substrate 62, an interposer substrate 64, and a probe 63. In the probe card 61 according to the fourth embodiment of the present invention, for example, one or more probes 63 are provided on the surface of the interposer substrate 64 facing the object to be inspected 76 such as a semiconductor wafer.

  In the probe card 61 of the fourth embodiment of the present invention, the probe 63 installed on the interposer substrate 64 on the substrate 62 is the probe of the embodiment of the present invention, and is a fourth example thereof. The probe card 61 according to the fourth embodiment of the present invention includes a probe 63 that is a fourth example of the probe according to the embodiment of the present invention.

  As shown in FIGS. 14 and 15, the probe card 61 according to the fourth embodiment of the present invention is a probe card of a type different from the so-called cantilever type.

  As shown in FIG. 14, in the substrate 62 of the probe card 61 according to the fourth embodiment of the present invention, a plurality of conductive portions (not shown) are provided on the opposite side to the side facing the device under test 76 in the vertical direction in the figure. Is formed. Each of the conductive parts is connected to an inspection device (not shown) such as a prober. Further, the above-described interposer substrate 64 is disposed on the substrate 62 on the side facing the object to be inspected 76 in the vertical direction of FIG. A plurality of probes 63 are arranged on the interposer substrate 64 so as to face the object to be inspected 76. Further, a plurality of internal wirings (not shown) are provided inside the interposer substrate 64 to electrically connect each probe 63 and the conductive portion of the substrate 62.

  A probe 63, which is a fourth example of the probe according to the embodiment of the present invention, has an end portion of a main body 69 described later connected to the interposer substrate 64 and fixed. The main body 69 is connected to a tip 68 described later at the other tip, and the tip 68 has a needle tip 67 described later at the tip opposite to the main body 69 side. In the probe 63, the tip 67 of the tip 68 contacts the electrode pad 78 of the object to be inspected 76, and an inspection device such as a prober and the electrode pad 78 are electrically connected via the substrate 62 and the interposer substrate 64. Connecting.

  And in the probe card 61 of 4th Embodiment of this invention, after the needle point 67 of the probe 63 contacts the electrode pad 78 of the to-be-inspected body 76, the to-be-inspected body 76 is slightly displaced upwards in FIG. The probe 63 is pressed against the electrode pad 78 of the device under test 76. For this reason, the tip 63 of the probe 63 swings with the needle tip 67 as a fulcrum, and the electrode pad 78 and the probe 63 can be in an excellent electrical connection state. Hereinafter, the probe 63 which is the fourth example of the probe according to the embodiment of the present invention will be described in more detail.

  The probe 63, which is the fourth example of the probe according to the embodiment of the present invention, is made of, for example, a conductive material such as iron, copper, or nickel, more specifically, a low-resistance metal, such as nickel cobalt or nickel copper. Made of nickel alloy. The probe 63 is formed by a technique such as electroforming, plating, punching (pressing), photolithography, or the like.

  As shown in FIG. 15, the probe 63 contacts (contacts) the main body 69 connected at one end to the interposer substrate 64 of FIG. 14 and the electrode pad 78 of the device under test 76 of FIG. ) Having a tip 68 provided at the tip. In the probe 63, the other end of the main body 69, the end opposite to the interposer substrate 64, and the end opposite to the needle tip 67 side of the tip 68. The parts are connected to each other.

  As shown in FIGS. 14 and 15, the main body 69 of the probe 63 includes a bow-shaped elastically deforming portion protruding in the horizontal direction perpendicular to the vertical direction. As shown in FIG. 15, the tip portion 68 of the probe 63 can have a structure that gradually narrows from the connecting portion with the main body portion 69 toward the needle tip 67. A probe 63, which is a fourth example of the probe according to the embodiment of the present invention, includes an electrode pad 78 of the device under test 76 as shown in FIG. When the probe 63 is pressed, a good electrical connection between the electrode pad 78 and the probe 63 can be realized.

  Furthermore, as shown in FIG. 15, the probe 63 which is the fourth example of the probe according to the embodiment of the present invention has a limit mark 71 indicating the limit point of wear of the tip portion 68. The limit mark 71 is a mark for determining whether or not the distal end portion 68 of the probe 63 has reached the length that is the use limit, that is, whether or not the distal end portion 68 has reached the limit length. The probe 63 has the limit mark 71, so that it can be easily detected when the tip portion 68 is worn and has reached the limit length due to many uses in the inspection. This makes it possible to omit unnecessary work.

  In addition, when the probe card 61 of the fourth embodiment of the present invention has a plurality of probes, one or more of the plurality of probes is a probe 63 which is a fourth example of the probe of the embodiment of the present invention. Good. More specifically, in the case where the probe card 61 of the fourth embodiment of the present invention includes one or more probes serving as a reference for adjusting the position of the probe needle tip by an inspection device such as a prober, the reference probe Only the probe 63 having the limit mark 71 may be used.

  In the probe 63, the limit mark 71 of the tip portion 68 is provided as a portion having a different cross-sectional shape as compared with other portions of the tip portion 68 where the limit mark 71 is not formed. That is, in the tip portion 68 of the probe 63, the portion where the limit mark 71 is provided has a different cross-sectional shape from the portion where the limit mark 71 is not provided. In particular, in the distal end portion 68 of the probe 63, the portion where the limit mark 71 is provided has a different cross-sectional shape from the portion where the limit mark 71 is not provided on the needle tip side from that portion.

  16 is an enlarged side view showing a part of the tip of the probe shown in FIG.

  In the probe 63, the limit mark 71 at the tip portion 68 is provided as a portion having a different cross-sectional shape as compared with other portions of the tip portion 68 where the limit mark 71 is not formed. That is, in the tip portion 68 of the probe 63, the portion where the limit mark 71 is provided has a different cross-sectional shape from the portion where the limit mark 71 is not provided. In particular, in the distal end portion 68 of the probe 63, the portion where the limit mark 71 is provided has a different cross-sectional shape from the portion where the limit mark 71 is not provided on the needle tip side from that portion.

  For example, the limit mark 71 of the probe 63 can have the same structure as the probe 23 of the probe card of the second embodiment of the present invention described above. That is, as shown in FIGS. 15 and 16, it can be provided by forming a convex portion on the outer peripheral surface of the tip portion 68. For example, as shown in FIG. 16, two convex portions forming the limit mark 71 can be provided. Each of the two convex portions has a plate shape, is opposed to the center line in the direction in which the distal end portion 68 extends, and is provided so as to cover a part of the outer peripheral surface of the rod-shaped distal end portion 68. it can.

  Such a limit mark 71 can be formed by using a plating technique or the like before the probe 63 is incorporated into the substrate 62 when the probe card 61 is manufactured. And as a result of providing the above-mentioned convex part and setting it as the limit mark 71, in the front-end | tip part 68 of the probe 63, the part in which the limit mark 71 was provided has a different cross-sectional shape from the other part in which the limit mark 71 is not provided. Can have.

  In the probe card 61 of this embodiment, the limit mark 71 provided on the tip 68 of the probe 63 has a convex portion similar to the probe 23 of the probe card of the second embodiment of the present invention described above. It is not necessarily limited to what is formed on the outer peripheral surface of the. The structure of the limit mark 71 provided at the distal end portion 68 of the probe 63 is, in addition to the above-described one, for example, interrupted at two opposing positions similar to the probe 3 of the probe card 1 of the first embodiment of the present invention described above. It is also possible to use a belt-like convex structure or a structure in which a concave portion similar to the probe 23 of the probe card of the third embodiment of the present invention described above is provided.

  The probe 63, which is the fourth example of the probe according to the embodiment of the present invention having the above-described structure, may be worn out from the needle tip 67 side at the distal end portion 68 due to repeated use in inspection. In that case, up to a certain stage, the needle tip 67 exhibits a shape such as a rectangular shape similar to that at the beginning of use, for example, according to the cross-sectional shape of the tip portion 68. However, the wear of the tip 68 further progresses and becomes shorter from the needle tip 67 side, and as a result, the position of the needle tip 67 may reach the portion where the limit mark 71 is formed. In this case, the shape of the needle tip 67 is completely different from the initial use of the probe 63 and the shape before reaching the limit length according to the cross-sectional shape of the tip portion 68. For example, the shape of the needle tip 67 is a shape in which convex portions are formed on each of two opposite sides of the rectangle. Such a significant change in the shape of the needle tip 67 is detected in the same manner as the probes 3, 23, and 43 provided in the probe card 1 of the first embodiment of the present invention and the probe cards of the second and third embodiments described above. Is possible.

  That is, a change in the shape of the needle tip 67 of the probe 63 can be easily detected by a position adjustment system of an inspection device such as a prober that recognizes the image of the needle tip 67 for adjusting the position of the needle tip 67 of the probe 63, for example. Can do. More specifically, when the prober has a camera that photographs the needle tip 67 from the lower side for position adjustment, a change in the shape of the needle tip 67 can be detected from an image by the camera.

  The probe 63 having such a limit mark 71 and the probe card 61 according to the fourth embodiment of the present invention having the limit mark 71 can easily detect that the probe 63 has reached the limit length. It is possible to prevent the probe 63 reaching the length from being used in the inspection. As a result, in the inspection of the inspection object 76 using the probe card 61 according to the fourth embodiment of the present invention, good contact can always be realized between the probe 63 and the electrode pad 78 of the inspection object 76. . The probe 63, which is the fourth example of the probe according to the embodiment of the present invention, and the probe card 61 according to the fourth embodiment of the present invention do not require useless inspection interruption or incidental measurement work using a microscope or the like. Inspection efficiency can be improved.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, the limit mark of the probe of the present invention is provided at the tip of the probe as a portion having a different cross-sectional shape from other portions where the limit mark of the tip is not formed. At this time, in the probe of the present invention, the cross-sectional shape of the portion where the limit mark at the tip is formed may be a circular shape with a part of the periphery missing, a circular shape with a part of the periphery protruding, The shape of the shape was exemplified. However, in the present invention, the cross-sectional shape of the portion where the limit mark is formed at the tip of the probe is not limited thereto. Other shapes can also be selected.

  That is, in the probe of the present invention, the cross-sectional shape of the portion where the limit mark is formed at the tip has a different cross-sectional shape from the other portion where the limit mark is not formed. Anything can be recognized. Therefore, various shapes different from those described above can be selected. More specifically, when the cross-sectional shape of the tip of the probe is circular, the cross-sectional shape of the portion where the limit mark is formed can be a triangular shape, a rectangular shape, or other polygonal shape, A more complicated shape such as a star shape is also possible.

  And when selecting the cross-sectional shape of the portion where the limit mark is formed at the tip of the probe, considering the contact with the object to be inspected at the time of inspection, the probe strength does not decrease or the decrease is slight It is preferable to select one.

  According to the probe and the probe card of the present invention, the inspection object can be inspected under the optimum conditions, and the inspection object can be accurately inspected.

  In addition, the probe and probe card of the present invention are semiconductor wafers for use in consumer electronic devices such as liquid crystal TVs and liquid crystal display devices of portable electronic devices, which are strongly required to improve the efficiency of the inspection process and thus the productivity. It is particularly effective for inspection.

1, 61, 100 Probe card 2, 62, 102 Substrate 3, 23, 43, 63, 103, 103a Probe 5, 25, 45, 105 Fixing member 7, 27, 47, 67, 107 Needle tip 8, 28, 48 , 68, 108, 108a Tip portion 9, 29, 49, 69, 109 Main body portion 10, 30, 50 Connection portion 11, 31, 51, 71 Limit mark 13 Camera 64 Interposer substrate 76 Inspected object 78, 111 Electrode pad 110 Semiconductor wafer

Claims (8)

A probe having a tip including a needle tip that contacts the object to be inspected, and a main body connected to one end of the tip,
Have a limit mark indicating the limit point of the wear of the tip,
The tip and the main body are both rod-shaped,
The one end of the tip portion is connected to one end of the main body portion and the other end of the tip portion constitutes the needle tip, and is configured to bend at a connecting portion between the tip portion and the main body portion,
The limit mark is provided at the tip,
The cross section of the portion of the tip portion where the limit mark is provided in a plane perpendicular to the direction in which the tip portion extends is such that the length in the direction in which the body portion extends in a plane view on the plane is orthogonal to the direction. A probe having a shape that is larger than the length in the direction of movement .   The probe according to claim 1, wherein the limit mark is provided at the tip as a portion having a different cross-sectional shape from other portions of the tip.   The probe according to claim 1, wherein the limit mark is provided by forming a convex portion on an outer peripheral surface of the tip portion.   The probe according to any one of claims 1 to 3, wherein the limit mark is provided by forming a concave portion on an outer peripheral surface of the tip portion. The tip has a rod-like shape and is connected to the main body at the one end and the other end constitutes the needle tip, and has a structure that gradually decreases from the connecting portion with the main body toward the needle tip. And
2. The limit mark is provided at the tip portion, and a diameter of a portion of the tip portion where the limit mark is provided is smaller than a diameter of the connection portion of the tip portion. The probe of any one of -4. The probe according to any one of claims 1 to 5 ,
A probe card comprising a substrate for supporting the probe. The probe card according to claim 6 , further comprising: a fixing member that fixes the probe on the substrate. The probe and the fixing member are arranged on one surface of the substrate, and the distance from the surface of the substrate to the limit mark of the probe is from the surface of the substrate to the tip of the fixing member on the side opposite to the substrate The probe card according to claim 7 , wherein the probe card is larger than the distance.

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