JP5545491B2 - Circuit structure - Google Patents

Description

  The present invention relates to a circuit structure.

  2. Description of the Related Art Conventionally, a circuit component having a case and a module housed in the case and provided with electronic components is disclosed in Patent Document 1. The circuit structure is mounted on a vehicle and is disposed between a power source and an electrical component such as an audio device, and supplies power from the power source to the electrical component.

JP 2003-47235 A

  In the circuit configuration body according to the above configuration, the module is placed on a heat radiating plate constituting the case (see paragraph 0052 of Patent Document 1). For this reason, there is a concern that a gap is formed between the module and the case (heat sink). An air layer is formed in the gap. Since this air has a relatively low thermal conductivity, there is a concern that the heat generated in the module when energized is trapped in the gap and the inside of the circuit structure becomes locally hot. Then, we are anxious about the malfunction arising in the electronic component accommodated in the inside of a circuit structure.

  This invention is completed based on the above situations, Comprising: It aims at providing the circuit structure body by which the inside was suppressed from becoming high temperature locally.

  The present invention is a circuit structure, and includes a case having an opening that opens upward, a cover that closes the opening of the case, and a bus bar that is accommodated in the case and molded with a synthetic resin. A plate-like module having a mold part, wherein the mold part has a first surface and a second surface, and the bus bar extends from a first window part formed on the first surface of the mold part. An electronic component is connected to the bus bar exposed and exposed from the first window, and a mounting table on which the module is mounted is formed on the bottom wall of the case. A case-side inclined surface is formed on the upper surface of the pedestal so as to be inclined downward as it approaches one side wall of the case. A screw hole into which a screw is screwed is formed in the case-side inclined surface in the vertical direction. The mold The first surface is formed with a mounting portion that is attached to the mounting table, and the lower surface of the mounting portion is formed with a module-side inclined surface that aligns with the case-side inclined surface. The insertion portion through which the screw is inserted is formed through the attachment portion at a position corresponding to the screw hole in a state where the attachment portion is placed on the placement table. With the mounting portion placed, the screw inserted through the insertion portion is screwed into the screw hole, so that the second surface of the mold portion is in close contact with the one side wall.

  According to the present invention, the heat generated in the module during energization is transmitted from the mold part to the side wall of the case, and is dissipated from the side wall of the case to the outside. Thereby, it can suppress that the inside of a case becomes high temperature locally.

As embodiments of the present invention, the following embodiments are preferable.
Preferably, the module includes a DC / DC converter circuit that converts a direct current of a predetermined voltage into a direct current of a different voltage.

  Since a relatively large current flows through the DC / DC converter circuit, according to the above aspect, the heat generated in the DC / DC converter circuit when energized can be efficiently dissipated to the outside.

  In the case, it is preferable that a control board provided with a control unit for controlling the electronic component is accommodated in a posture perpendicular to the plate surface of the module.

  According to the above aspect, the control board is arranged perpendicular to the module. As a result, since the area covered with the module is not formed on the surface of the control circuit, the wiring density of the control board can be improved as compared with the case where the module is placed on the control board. As a result, the circuit structure can be reduced in size.

  A through hole is formed in the bus bar exposed from the first window portion of the mold portion, and the bus bar is exposed at a position corresponding to the through hole of the bus bar on the second surface of the mold portion. A second window portion is formed, and the lead of the electronic component is connected to the bus bar in a state of being inserted through the first window portion and the through hole, and an end portion of the lead is connected to the second window. It is preferable to be arranged inside the part.

  According to said aspect, since the edge part of the lead of an electronic component is located in the inside of a 2nd window part, it does not protrude from the back surface of a mold part. Thereby, since it can suppress that the front-end | tip of a lead interferes with the one side wall of a case with an electronic component, the back surface of a mold part and the one side wall of a case can be stuck closely.

  In the case, a pair of modules having the same shape are accommodated in a posture in which the first surfaces face each other, and one of the pair of modules includes one of the electronic components. A large electronic component larger than the other electronic components is mounted, and the one module is mounted on the other module of the pair of modules at a position symmetrical with respect to the left and right direction of the large electronic component. It is preferable that a retreat area that suppresses interference with the large electronic component is formed.

  According to the above aspect, the large electronic component mounted on the other module is positioned in the retreat area of one module while the pair of modules is housed in the case. For this reason, large electronic components mounted on other modules are prevented from interfering with one module. On the other hand, large electronic components mounted on one module are prevented from interfering with other modules by the retreat area of the other modules. Thereby, the circuit structure can be reduced in height. Relays are particularly effective because they are relatively large electronic components.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the inside of a circuit structure becomes high temperature locally.

1 is an exploded perspective view showing a circuit structure according to an embodiment of the present invention. Front view showing the circuit structure Plan view showing the circuit structure Side view showing the circuit structure VV line sectional view in FIG. Sectional view taken along line VI-VI in FIG. Bottom view showing circuit components A perspective view showing the first module Front view showing the first module Bottom view showing the first module Rear view showing the first module Sectional view showing the first module Sectional view showing the first module Plan view showing the case The top view which shows the state which accommodated the 1st module and the 2nd module in the case

<Embodiment>
An embodiment of the present invention will be described with reference to FIGS. The circuit structure 10 according to the present embodiment is accommodated in a case 12 made of a synthetic resin having an opening 11 that opens upward, a cover 13 made of a synthetic resin that closes the opening 11 of the case 12, and the case 12. The first module 14 and the second module 114 are provided. The first module 14 and the second module 114 are mounted on a vehicle (not shown), and are arranged between a power source (not shown) and an electrical component (not shown) such as an audio device, and are supplied from the power source. A DC / DC converter circuit that converts a direct current of a voltage into a direct current of a different voltage is provided. In the following description, the upper side in FIG. 1 is described as the upper side, and the lower side is described as the lower side.

(Case 12 and cover 13)
The case 12 is made of a synthetic resin and has a substantially rectangular shape when viewed from above. The case 12 is not limited to being made of synthetic resin, but may be made of metal. As shown in FIG. 7, a connector housing 15 that opens downward is formed on the lower side of the case 12. A mating connector (not shown) is fitted into the connector housing 15. The mating connector is electrically connected to a power source, electrical components, etc. via a wire harness (not shown).

  As shown in FIG. 1, a lock protrusion 16 that protrudes outward is formed on the side surface of the case 12. In a state where the opening 11 of the case 12 is closed by the cover 13, a lock receiving portion 17 that elastically engages with the lock protrusion 16 is provided on the side wall of the cover 13 at a position corresponding to the lock protrusion 16. Is formed. The cover 13 is assembled to the case 12 integrally by elastically engaging the lock protrusion 16 and the lock receiving portion 17.

  As shown in FIG. 5, a pair of first module 14 and second module 114 are accommodated in case 12. In the present embodiment, the first module 14 and the second module 114 have the same shape. A first mounting table 18 and a second mounting table 118 on which the first module 14 and the second module 114 are mounted are formed on the bottom wall of the case 12. As shown in FIG. 6, a terminal insertion hole 19 that connects the inside of the case 12 and the connector housing 15 is formed in the bottom wall of the case 12.

(First module 14)
As shown in FIG. 5, the first module 14 includes a mold portion 21 formed by molding a bus bar 20 formed by pressing a metal plate material into a predetermined shape with a synthetic resin. The mold part 21 has a flat plate shape. The mold part 21 has a first surface 23 on which the electronic component 22 is mounted and a second surface 24 that is in close contact with the side wall 25 of the case 12.

  As shown in FIG. 13, a first window portion 26 is formed on the first surface 23 of the mold portion 21, and the bus bar 20 is exposed from the first window portion 26. The inner surface of the first window portion 26 is a tapered surface that increases in diameter as the distance from the bus bar 20 increases. A through hole 27 is formed in the bus bar 20 exposed from the first window portion 26. A second window portion 28 is formed on the second surface 24 of the mold portion 21 at a position corresponding to the through hole 27 of the bus bar 20. The bus bar 20 is exposed from the second window portion 28. The inner surface of the second window portion 28 is a tapered surface that increases in diameter as the distance from the bus bar 20 increases.

  The lead 29 of the electronic component 22 disposed on the first surface 23 side of the mold part 21 is inserted from the first window part 26 into the through hole 27. The leading end of the lead 29 is disposed in the second window portion 28. In other words, the tip of the lead 29 does not protrude outward from the second surface 24 of the mold part 21. The lead 29 is connected to the bus bar 20 by known flow soldering while being inserted into the through hole 27 of the bus bar 20.

  The electronic component 22 includes a relay 30 that is larger than the other electronic components 22. As shown in FIG. 10, the relay 30 is mounted on the first module 14 and protrudes from the other electronic components 22 in the plate pressure direction (vertical direction in FIG. 10) of the module portion. . In the present embodiment, the relay 30 corresponds to the large electronic component described in the claims.

  A jumper wire 31 is disposed on the first surface 23 of the mold part 21. The end of the jumper wire 31 is inserted from the first window portion 26 into the through hole 27 of the bus bar 20. The tip of the jumper wire 31 is also arranged in the second window portion 28 so as not to protrude outward from the second surface 24 of the mold portion 21.

  The first module 14 is formed with a DC / DC converter circuit that converts a direct current of a predetermined voltage into a direct current of a different voltage.

  From the upper edge of the mold part 21, a board connecting part 33 connected to a control board 32 described later is formed so as to protrude upward.

  Further, from the lower edge of the mold part 21, in a state where the first module 14 part is accommodated in the case 12, the connector terminal 34 arranged in the connector housing 15 inserted through the terminal insertion hole 19 is downward. Protrusively formed. In the present embodiment, three connector terminals 34 are formed. Of the three connector terminals 34, the connector terminal 34A located at the center in FIG. 9 and formed wider than the other two is an input terminal electrically connected to the power source. Of the other two connector terminals 34B, 34B, one connector terminal 34B is an output terminal electrically connected to the electrical component, and the other connector terminal 34B is a ground terminal.

  As shown in FIG. 5, the first module 14 has a posture in which the first surface 23 side of the mold portion 21 faces the inside of the case 12 and the second surface 24 side of the mold portion 21 faces the side wall 25 of the case 12. Thus, it is accommodated in the case 12. The mold part 21 of the first module 14 is formed with an attachment part 35 that protrudes to the side opposite to the side wall 25 of the case 12 while being accommodated in the case 12. The mounting portion 35 is placed on the first mounting table 18 formed on the bottom wall of the case 12 in a state where the first relay 30 module is accommodated in the case 12. As shown in FIG. 14, two first mounting tables 18 are formed in the case 12. Correspondingly, two attachment portions 35 are formed in the first relay 30 module.

  As shown in FIG. 5, a case-side inclined surface 36 that is inclined downward as it approaches the side wall 25 of the case 12 is formed on the upper surface of the first mounting table 18. A screw hole 38 into which the screw 37 is screwed is formed in the case side inclined surface 36 in the vertical direction.

  An insertion part 39 through which the screw 37 is inserted is formed in the attachment part 35 of the first module 14 so as to penetrate the attachment part 35. In the present embodiment, the insertion portion 39 is formed by cutting out the protruding end portion of the attachment portion 35. Thereby, the insertion part 39 has comprised the U shape seeing from upper direction.

  A module-side inclined surface 40 that is aligned with the case-side inclined surface 36 is formed on the lower surface of the attachment portion 35. The module-side inclined surface 40 is inclined downward as it approaches the side wall 25 of the case 12. The upper surface of the attachment portion 35 is formed substantially horizontally, and the head portion of the screw 37 comes into contact with the upper portion.

  With the mounting portion 35 placed on the first mounting base 18, the screw 37 inserted through the insertion portion 39 is screwed into the screw hole 38, so that the mold portion 21 of the first module 14 is attached to the case 12. The first module 14 is attached to the case 12 in close contact with the inner surface of the side wall 25.

(Second module 114)
As described above, since the second module 114 has the same shape as the first module 14, the description of the overlapping configuration is omitted. The second module 114 is formed with a DC / DC converter circuit that converts a direct current of a predetermined voltage into a direct current of a different voltage. In the following description, the reference numeral indicating the structure of the second module 114 is obtained by adding 100 to the reference numeral indicating the structure of the first module 14.

  As shown in FIG. 5, the second module 114 has the first surface 123 side of the mold part 121 facing the inside of the case 12, and the second surface 124 side of the mold part 121 faces the side walls 25 and 125 of the case 12. It is accommodated in the case 12 in a different posture. Accordingly, the first module 14 and the second module 114 are accommodated in the case 12 in a posture in which the first surfaces 23 and 123 are opposed to each other.

  The mold part 121 of the second module 114 is formed with an attachment part 135 that protrudes to the side opposite to the side wall 125 of the case 12 while being accommodated in the case 12. The attachment portion 135 is placed on the second placement table 118 formed on the bottom wall of the case 12 in a state where the second module 114 is accommodated in the case 12. As shown in FIG. 14, two second mounting tables 118 are formed in the case 12. Correspondingly, two attachment portions 135 are formed in the second module.

  As shown in FIG. 5, a case-side inclined surface 136 that is inclined downward as it approaches the side wall 125 of the case 12 is formed on the upper surface of the second mounting table 118. A screw hole 138 into which the screw 137 is screwed is formed in the case-side inclined surface 136 in the vertical direction.

  An insertion portion 139 through which the screw 137 is inserted is formed in the attachment portion 135 of the second module 114 so as to penetrate the attachment portion 135. In the present embodiment, the insertion portion 139 is formed by cutting out the protruding end portion of the attachment portion 135. Accordingly, the insertion portion 139 has a U shape when viewed from above.

  A module-side inclined surface 140 that is aligned with the case-side inclined surface 136 is formed on the lower surface of the attachment portion 135. The module-side inclined surface 140 is inclined downward as it approaches the side wall 125 of the case 12. The upper surface of the attachment portion 135 is formed substantially horizontally, and the head portion of the screw 137 comes into contact with the upper portion.

  In a state where the mounting portion 135 is placed on the second mounting table 118, the screw 137 inserted through the insertion portion 139 is screwed into the screw hole 138, whereby the mold portion 121 of the second module 114 is attached to the case 12. The second module 114 is attached to the case 12 while being in close contact with the inner surface of the side wall 125.

(Evacuation areas 41 and 141)
As shown in FIG. 9, the first module 14 is provided with a relay 30 on the right side in FIG. 9 with respect to the center position in the left-right direction indicated by the two-dot chain line 100 in FIG. 9. That is, in the first module 14, the relay 30 is disposed at an asymmetric position in the left-right direction. As a result, a retreat area 41 is formed in the first module 14 at a position symmetrical with the relay 30 with respect to the two-dot chain line 100. In the evacuation area 41, the electronic component 22 and the relay 30 are not mounted.

  Similar to the first module 14, the second module 114 also has a retreat area 141 in which the relay 130 and the electronic component 122 are not mounted.

  In the retreat area 41, the relay 130 disposed in the second module 114 is located in a state where the first module 14 and the second module 114 are accommodated in the case 12. Thereby, it is possible to suppress the relay 130 of the second module 114 from interfering with the first module 14. Similarly, the relay 30 disposed in the first module 14 is positioned in the retreat area 141 in a state where the first module 14 and the second module 114 are accommodated in the case 12. Thereby, it is possible to suppress the relay 30 of the first module 14 from interfering with the second module 114.

(Control board 32)
As shown in FIG. 5, in the case 12, a microcomputer that controls the electronic components 22 and 122 arranged in the first module 14 and the second module 114 at a position above the first module 14 and the second module 114. A control board 32 on which 42 (corresponding to a control unit described in claims) is mounted is accommodated. The control board 32 is accommodated in a posture substantially perpendicular to the plate surfaces of the first module 14 and the second module 114. The microcomputer 42 is mounted on the lower surface of the control board 32.

  As shown in FIG. 1, the control board 32 has a rectangular shape when viewed from above. The control board 32 has conductive paths (not shown) formed on both the front and back surfaces of the insulating board by a printed wiring technique. A screw insertion hole 52 through which the screw 50 is inserted is formed in the control board 32. The case 12 is formed with a screw hole 51 into which the screw 50 inserted through the screw insertion hole 52 is screwed. The control board 32 is attached to the case 12 by screwing the screw 50 into the screw hole 51.

  As shown in FIG. 1, a plurality of through holes 43 are formed in the control board 32. In this through hole 43, board connection portions 33 and 133 formed so as to protrude from the first module 14 and the second module 114 toward the control board 32 are inserted, and a conductive path of the control board 32 is formed by known flow soldering. Connected with.

  One end of a rod-shaped metal terminal fitting 44 is inserted into the through hole 43 of the control board 32 and flow soldered. The other end of the terminal fitting 44 protrudes downward from the lower surface of the control board 32 and is bent at a right angle, and is disposed in the control connector 45. The control connector 45 is screwed to the control board 32. The control connector 45 is exposed to the outside from a notch 46 formed in the side wall 25 of the case 12. A mating connector (not shown) is fitted to the control connector 45.

(Operation and effect of the embodiment)
Then, the effect | action and effect of this embodiment are demonstrated. First, the first surface 23 of the first module 14 and the first surface 123 of the second module 114 are held so as to face each other. The first module 14 and the second module 114 are accommodated in the case 12 from above while maintaining this posture.

  When the first module 14 and the second module 114 are accommodated in the case 12, the connector terminals 34 and 134 of the first module 14 and the second module 114 are inserted into the terminal insertion holes 19 and protrude into the connector housing 15. Is done.

  The attachment portion 35 of the first module 14 is placed on the upper surface of the first placement table 18. The module-side inclined surface 40 of the first module 14 abuts from above in a state of being aligned with the case-side inclined surface 36 of the first mounting table 18.

  The screw 37 is inserted from above into the insertion part 39 formed in the attachment part 35 of the first module 14. Thereafter, the screw 37 is screwed into the screw hole 38 formed in the case-side inclined surface 36 of the first mounting table 18.

  Then, the attachment part 35 of the first module 14 is pressed against the first mounting table 18 from above. Thus, the first module 14 slides along the case-side inclined surface 36 of the first mounting table 18 so as to approach the side wall 25 of the case 12. At this time, since the insertion part 39 of the attachment part 35 has a substantially U shape with the opposite side of the side wall 25 of the case 12 cut away, interference between the screw 37 and the insertion part 39 can be suppressed. As a result, the first module 14 can approach the side wall 25 of the case 12.

  By sliding the first module 14 so as to approach the side wall 25 of the case 12, the second surface 24 of the mold portion 21 of the first module 14 is pressed against the inner surface of the side wall 25 of the case 12. As a result, the second surface 24 of the mold part 21 is in close contact with the side wall 25 of the case 12. As described above, the first module 14 is fixed to the case 12.

  On the other hand, the attachment portion 135 of the second module 114 is mounted on the upper surface of the second mounting table 118. The module-side inclined surface 140 of the second module 114 abuts from above in a state of being aligned with the case-side inclined surface 136 of the second mounting table 118.

  The screw 137 is inserted from above into the insertion part 139 formed in the attachment part 135 of the second module 114. Thereafter, the screw 137 is screwed into the screw hole 138 formed in the case side inclined surface 136 of the second mounting table 118.

  Then, the attachment part 135 of the second module 114 is pressed against the second mounting table 118 from above. Accordingly, the second module 114 slides along the case-side inclined surface 136 of the second mounting table 118 so as to approach the side wall 125 of the case 12. At this time, since the insertion portion 139 of the attachment portion 135 has a substantially U shape with the opposite side of the side wall 125 of the case 12 being cut away, interference between the screw 137 and the insertion portion 139 can be suppressed. As a result, the second module 114 can approach the side wall 125 of the case 12.

  By sliding the second module 114 so as to approach the side wall 125 of the case 12, the second surface 124 of the mold part 121 of the second module 114 is pressed against the inner surface of the side wall 125 of the case 12. Thus, the second surface 124 of the mold part 121 is in close contact with the side wall 125 of the case 12. As described above, the second module 114 is fixed to the case 12.

  Subsequently, the control board 32 is accommodated in the case 12 from above the first module 14 and the second module 114. The control board 32 is moved downward while aligning the board connecting portions 33 and 133 protruding upward from the upper edges of the first module 14 and the second module 114 and the through holes 43 formed in the control board 32.

  After the control board 32 is arranged at a predetermined position in the case 12, the screw 50 is inserted into the screw insertion hole 52 of the control board 32 and screwed into the screw hole 51 of the case 12. As a result, the control board 32 is fixed to the case 12. Thereafter, the board connecting portions 33 and 133 and the through holes 43 are flow soldered. At this time, since the microcomputer 42 is connected to the lower surface of the control board 32, the microcomputer 42 can be protected from the heat of the flow soldering process.

  Subsequently, the cover 13 is assembled from above the case 12. The cover 13 and the case 12 are assembled together by the lock receiving portion 17 of the cover 13 being elastically engaged with the lock protrusion 16 of the case 12. Thereby, the circuit structure 10 is completed. In the present embodiment, the configuration of the circuit configuration body 10 has been described with reference to the vertical direction of FIG. 1, but the circuit configuration body 10 can be arranged in any posture in the vehicle.

  According to this embodiment, when the screw 37 is screwed into the screw hole 38, the first module 14 and the second module 114 are pressed against the side walls 25 and 125 of the case 12, respectively. As a result, the mold parts 21 and 121 of the first module 14 and the second module 114 are securely attached to the side walls 25 and 125 of the case 12. Thereby, the heat generated in the first module 14 and the second module 114 during energization is reliably transmitted from the mold parts 21 and 121 to the case 12. Thereby, it can suppress that the inside of the case 12 of the circuit structure 10 becomes high temperature locally.

  Further, according to the present embodiment, the first module 14 and the second module 114 include a DC / DC converter circuit that converts a direct current of a predetermined voltage into a direct current of a different voltage. Since a relatively large current flows through the DC / DC converter circuit, according to the present embodiment, heat generated in the DC / DC converter circuit when energized can be efficiently dissipated to the outside.

  Further, according to the present embodiment, the control board 32 including the microcomputer 42 that controls the electronic component 22 is accommodated in the case 12 in a posture perpendicular to the plate surfaces of the first module 14 and the second module 114. Has been. Thereby, since the area | region covered with the 1st module 14 and the 2nd module 114 is not formed in the surface of the control board 32, compared with the case where the 1st module 14 or the 2nd module 114 is overlaid on the control board 32, and is arrange | positioned. The wiring density of the control board 32 can be improved. As a result, the circuit structure 10 can be reduced in size.

  According to the present embodiment, the through holes 27 and 127 are formed in the bus bars 20 and 120 exposed from the first window portions 26 and 126 of the mold portions 21 and 121, and the second surface 24 of the mold portion 21 is formed. Are formed with second window portions 28 and 128 through which the bus bars 20 and 120 are exposed at positions corresponding to the through holes 27 and 127 of the bus bars 20 and 120, and the leads 29 and 129 of the electronic components 22 and 122 are the first ones. It is connected to the bus bars 20 and 120 while being inserted into the window portions 26 and 126 and the through holes 27 and 127, and the ends of the leads 29 and 129 are arranged inside the second window portions 28 and 128. . As a result, the end portions of the leads 29 and 129 of the electronic components 22 and 122 do not protrude from the second surfaces 24 and 124 of the mold portions 21 and 121. As a result, it is possible to suppress the tips of the leads 29 and 129 from interfering with the side walls 25 and 125 of the case 12 on the electronic components 22 and 122, so that the second surfaces 24 and 124 of the mold parts 21 and 121 and the case 12 The side wall 25 can be reliably adhered.

  Further, according to the present embodiment, the relay 130 mounted on the second module 114 is positioned in the retreat area 41 of the first module 14 in a state of being accommodated in the case 12. Thereby, it is possible to suppress the relay 130 mounted on the second module 114 from interfering with the first module 14. On the other hand, the relay 30 mounted on the first module 14 is positioned in the retreat area 141 of the second module 114. Thereby, it can suppress that the relay 30 mounted in the 1st module 14 interferes with the 2nd module 114, and can suppress that the relay 130 mounted in the 2nd module 114 interferes with the 1st module 14. As a result, the circuit structure 10 can be reduced in height. Since the relays 30 and 130 are larger than the other electronic components 22 and 122, the present embodiment is particularly effective in the circuit structure 10 on which the relays 30 and 130 are mounted.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the present embodiment, the circuit structure 10 is a DC / DC converter. However, the circuit structure 10 is not limited to this, and the circuit structure 10 is arranged between the power source and the electrical components to supply power from the power source. It may be an electrical junction box supplied to the product.
(2) In the present embodiment, the case 12 is configured to accommodate two modules. However, the present invention is not limited to this, and the case 12 may be configured to accommodate one module. Moreover, it is good also as a structure in which three or more modules are accommodated.
(3) In the present embodiment, both the first window portion 26 and the second window portion 28 are formed in the mold portion 21. However, the present invention is not limited to this, and the mold portion 21 has the first window portion. 26 may be formed, and the lead 29 of the electronic component 22 may be reflow soldered to the bus bar 20 exposed from the first window portion 26.
(4) In the present embodiment, the tip of the lead 29 of the electronic component 22 is configured to be located in the second window portion 28. However, the present invention is not limited to this, and the tip of the lead 29 of the electronic component 22 is the second window. It is good also as a structure which protrudes and arrange | positions from the part 28 to the 2nd surface 24 side of a module, and the recessed part for letting the front-end | tip of the lead 29 escape is formed in the inner surface of the side wall 25 of the case 12.
(5) In the present embodiment, the lead 29 of the electronic component 22 is flow soldered to the bus bar 20. However, the present invention is not limited to this, and the lead 29 of the electronic component 22 is press-fitted into the through hole 27 of the bus bar 20. It is good also as a structure connected with the bus-bar 20 by doing.
(6) Although the control board 32 is accommodated in the case 12 in the present embodiment, the control board 32 may be omitted.
(7) In the present embodiment, the first module 14 and the second module 114 have the same shape. However, the present invention is not limited to this, and the first module 14 and the second module 114 may have different shapes.
(8) In the present embodiment, the relays 30 and 130 are used as large electronic components. However, the present invention is not limited to this, and any electronic component such as a transistor, a capacitor, or a coil is used as the large electronic component. be able to.

DESCRIPTION OF SYMBOLS 10 ... Circuit structure 11 ... Opening part 12 ... Case 13 ... Cover 14 ... 1st module 18 ... 1st mounting base 20 ... Bus-bar 21, 121 ... Mold part 22, 122 ... Electronic component 25, 125 ... Side wall 26, 126 ... 1st window part 27, 127 ... Through-hole 28, 128 ... 2nd window part 29, 129 ... Lead 30, 130 ... Relay (large electronic component)
35, 135 ... Mounting portion 36, 136 ... Case side inclined surface 37, 137 ... Screw 38, 138 ... Screw hole 39, 139 ... Insertion portion 40, 140 ... Module side inclined surface 41, 141 ... Retraction area 114 ... Second module 118 ... Second mounting table

Claims (6)

A case having an opening that opens upward; a cover that closes the opening of the case; a plate-like module having a mold part that is housed in the case and molded by molding a bus bar with a synthetic resin; With
The mold part has a first surface and a second surface, the bus bar is exposed from a first window part formed on the first surface of the mold part, and the bus bar is exposed from the first window part. Electronic components are connected to the bus bar,
A mounting table on which the module is mounted is formed on the bottom wall of the case, and a case-side inclined surface is formed on the upper surface of the mounting table. A screw hole into which the screw is screwed is formed in the case-side inclined surface in the vertical direction,
A mounting portion that is attached to the mounting table is formed on the first surface of the mold portion, and a module-side inclined surface that is aligned with the case-side inclined surface is formed on the lower surface of the mounting portion, In the attachment portion, an insertion portion through which the screw is inserted at a position corresponding to the screw hole in a state where the attachment portion is placed on the mounting table is formed through the attachment portion,
In the state where the mounting portion is placed on the mounting table, the screw inserted through the insertion portion is screwed into the screw hole, whereby the second surface of the mold portion is brought into contact with the one side wall. Circuit structure to be in close contact. The circuit structure according to claim 1, wherein the module includes a DC / DC converter circuit that converts a direct current of a predetermined voltage into a direct current of a different voltage. The circuit configuration body according to claim 1 or 2, wherein a control board including a control unit that controls the electronic component is accommodated in the case in a posture perpendicular to a plate surface of the module. . A through hole is formed in the bus bar exposed from the first window portion of the mold portion, and the bus bar is exposed at a position corresponding to the through hole of the bus bar on the second surface of the mold portion. A second window is formed,
The lead of the electronic component is connected to the bus bar in a state of being inserted through the first window and the through hole,
4. The circuit structure according to claim 1, wherein an end portion of the lead is disposed inside the second window portion. 5. In the case, a pair of the modules having the same shape is accommodated in a posture in which the first surfaces face each other,
One of the pair of modules is mounted with a large electronic component larger than the other electronic components among the electronic components, and the one module has a line with the large electronic component in the left-right direction. The retraction area | region which suppresses interference with the said large sized electronic component mounted in the other module among the said pair of modules is formed in the symmetrical position. Circuit construct. The circuit structure according to claim 5, wherein the large electronic component is a relay.

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