JP2008214669A - Plating apparatus and plating method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating apparatus with which electronic components can be uniformly plated and prevented from being flawed. <P>SOLUTION: The plating apparatus is provided with a holding body 13 holding a plating tool 12 and having an electrode in a plating tank and a jet forming device for forming a jet 46 of a plating liquid 45, flowing from a lower part of the holding body 13 toward an upper part, and the holding body 13 is provided so as to be freely swung in the right and left direction A against the jet forming device. The plating tool 12 is provided with a pair of upper and lower outer plates 26, 27, a pair of conductive meshes 28, 29 each provided on the opposing surface side of the respective outer plates 26, 27, a plurality of housing spaces 30 formed between the pair of conductive meshes 28, 29, and partition plates 31 which partition adjacent housing spaces 30. Jet flow passages are formed so as to reach respective housing spaces 30 through a lower conductive mesh 29 from a plurality of jet inflow holes 34 formed in the lower outer plate 27. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plating apparatus and a plating method for electroplating an electronic component.

  In general, electronic parts such as semiconductor elements are subjected to metal plating on leads as materials in order to maintain semiconductor element mountability and solderability. As a typical plating method of metal plating, barrel plating is generally adopted. This is because a predetermined amount of electronic components and power supply stirring auxiliary media are put into the barrel, immersed in a plating solution, and the barrel is rotated to supply power to the electronic components with the negative electrode provided inside the barrel. It is a method of performing. However, the barrel plating method has a problem in that scratches and chipping defects due to contact between electronic components occur chronically and deteriorate the manufacturing yield.

  As a countermeasure for such a problem, there is a plating apparatus using a jet (see Patent Document 1 below). That is, as shown in FIGS. 5 and 6, a mesh cage 62 is provided in the plating tank 61 so as to be able to swing left and right. An electrode 63 is provided on the cage 62. In the plating tank 61, below the cage 62, there is provided a nozzle 64 that forms a jet of plating solution upward.

According to this, a plurality of electronic components are put in the cage 62, and the cage 62 is swung left and right. At this time, since the electronic component located at the bottom of the cage 62 and the electronic component located at the top have different frequencies of contact with the plating solution, the plating solution cannot be uniformly plated. A jet of plating solution is formed upward from below. As a result, the position of the electronic component is switched up and down in the cage 62, and the electronic component is plated while being stirred.
JP 2001-247993 A

  However, in the prior art shown in FIG. 5 and FIG. 6, since it is an opportunity plating in which the electronic component is brought into contact with the electrode 63 by the jet of the plating solution, in order to uniformly apply plating to a plurality of electronic components, It is necessary to review the shape of the electrode 63, adjust the plating time, or adjust the number of electronic components. Moreover, since electronic parts contacted with the jet of a plating solution, there existed a problem that a damage | wound would generate | occur | produce in an electronic part.

  An object of the present invention is to provide a plating apparatus and a plating method for an electronic component capable of uniformly plating an electronic component and preventing the electronic component from being damaged.

In order to achieve the above object, the first invention is a plating apparatus for plating an electronic component having leads on both upper and lower surfaces and electrically connected to an upper lead and a lower lead.
A plating tank, a holding body that holds a plating jig in the plating tank and has an electrode, and a jet forming device that forms a jet of a plating solution upward from below the holding body,
Either one of the holding body and the jet forming device is swingable in the lateral direction with respect to the other,
The plating jig is formed between a pair of upper and lower outer plate members, a pair of upper and lower conductive members provided on opposite surfaces of the pair of outer plate members, and a pair of conductive members. It has a plurality of storage spaces that are detachably stored and a partition member that partitions adjacent storage spaces,
A jet flow path that reaches each storage space from the plurality of jet inflow holes formed in the lower outer plate through the lower conductive member is formed,
The conductive member contacts the electrode of the holder,
The storage space is formed in such a size that the stored electronic component can move up and down.

  According to this, the electronic component is stored in each storage space of the plating jig, the plating jig is held by the holding body, and is immersed in the plating solution in the plating tank. Then, either one of the holding body and the jet forming device is swung laterally with respect to the other, and a jet of the plating solution is formed upward from below the holding body by the jet forming device.

  At this time, when the jet of the plating solution hits the jet inflow hole of the plating jig due to the swinging, the jet flows from the jet inflow hole through the jet flow path into the storage space, pushes up the electronic component and lifts the upper lead. Contact the upper conductive member. As a result, the lower lead of the electronic component is reliably energized to the electrode via the upper lead and the upper conductive member while being spaced apart above the lower conductive member, so that the lower lead is plated.

  Further, when the jet of the plating solution moves laterally away from the jet inflow hole of the plating jig due to the swinging, the jet does not flow into the storage space, the electronic component descends due to its own weight, and the lower lead has a lower conductive property. Contact the member. As a result, the upper lead of the electronic component is reliably energized to the electrode through the lower lead and the lower conductive member while being spaced apart from the upper conductive member, so that the upper lead is plated.

  As described above, each electronic component repeats vertical movement in the storage space by the lateral swing of either the holding body or the jet forming device, thereby uniformly plating each electronic component in a short time. can do. Further, since the adjacent storage spaces are partitioned by the partition members, the electronic components stored in the respective storage spaces do not contact each other, and the electronic components can be prevented from being damaged.

The second invention is a plating method for plating an electronic component having leads on both upper and lower surfaces and electrically connecting the upper lead and the lower lead using a plating jig,
The plating jig is formed between a pair of upper and lower outer plate members, a pair of upper and lower conductive members provided on opposite surfaces of the pair of outer plate members, and a pair of conductive members. It has a plurality of storage spaces that are detachably stored and a partition member that partitions adjacent storage spaces,
A jet flow path that reaches each storage space from the plurality of jet inflow holes formed in the lower outer plate through the lower conductive member is formed,
Store electronic components in the storage space,
Immerse the plating jig in the plating solution by bringing the conductive member into contact with the electrode,
A plating solution jet is formed upward from below the plating jig,
Either one of the plating jig and the jet of plating solution is swung laterally with respect to the other,
When the jet hits the jet inflow hole of the plating jig, the jet flows from the jet inflow hole through the jet flow path into the storage space, pushes up the electronic component, and contacts the upper lead with the upper conductive member. When it is removed laterally from the jet inlet hole, the electronic component descends due to its own weight and the lower lead comes into contact with the lower conductive member.

  According to this, when the jet of the plating solution hits the jet inflow hole of the plating jig due to the swinging, the jet flows from the jet inflow hole through the jet flow path into the storage space, and pushes up the electronic component to raise the upper lead. Is brought into contact with the upper conductive member. As a result, the lower lead of the electronic component is reliably energized to the electrode via the upper lead and the upper conductive member while being spaced apart above the lower conductive member, so that the lower lead is plated.

  Further, when the jet of the plating solution moves laterally away from the jet inflow hole of the plating jig due to the swinging, the jet does not flow into the storage space, the electronic component descends due to its own weight, and the lower lead has a lower conductive property. Contact the member. As a result, the upper lead of the electronic component is reliably energized to the electrode through the lower lead and the lower conductive member while being spaced apart from the upper conductive member, so that the upper lead is plated.

  In this way, each electronic component repeats vertical movement in the storage space by the lateral swing of either the plating jig or the plating solution jet, so that the individual electronic components can be made uniform in a short time. Can be plated on. Further, since the adjacent storage spaces are partitioned by the partition members, the electronic components stored in the respective storage spaces do not contact each other, and the electronic components can be prevented from being damaged.

  As described above, in the present invention, individual electronic components can be uniformly plated in a short time. Moreover, the electronic components accommodated in each accommodation space do not contact each other, and it is possible to prevent the electronic components from being damaged.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, reference numeral 10 denotes a plating apparatus for electroplating an electronic component 1 such as a semiconductor element. As shown in FIG. 2, the electronic component 1 has leads 2 and 3 on both upper and lower surfaces, and the upper lead 2 and the lower lead 3 are electrically connected inside the electronic component 1 via vias or the like. Yes.

  The plating apparatus 10 includes a plating tank 11, a holding body 13 that holds the plating jig 12 in the plating tank 11, a jet forming apparatus 14 that forms a jet 46 of the plating solution 45 upward from below the holding body 13, And a rocking device 15 that rocks the holding body 13 in the left-right direction A (an example of the horizontal direction). The holding body 13 is formed in a cage shape having a rectangular frame-like lower and upper frame frames 16 and 17 and a plurality of vertical frames 18 provided between the upper and lower frame frames 16 and 17. The holding body 13 is used as an electrode (cathode) by passing an electric current through the holding body 13. An anode (not shown) is separately provided outside the holding body 13.

  A square frame-like swing frame 19 is provided on the upper portion of the holding body 13 via a connecting shaft 20. The swing frame 19 is slidably supported in the left-right direction A by a support member 21 provided on the upper part of the plating tank 11.

  The jet forming device 14 includes a jet nozzle 23 installed below the holding body 13 and a pump 24 that supplies the plating solution 45 in the plating tank 11 to the jet nozzle 23. The ejection nozzle 23 has a plurality of linear slits 23a. By ejecting the plating solution 45 from these slits 23a, a jet 46 of the plating solution 45 is formed upward.

  The swing device 15 includes an electric motor 41 and a crank mechanism 42 connected between the electric motor 41 and the swing frame 19. The crank mechanism 42 includes a disk 42 a provided on the rotating shaft of the electric motor 41, and a link 42 b connected between the disk 42 a and the swing frame 19.

  As shown in FIGS. 2 and 3, the plating jig 12 includes a pair of upper and lower outer plate bodies 26 and 27 and a pair of upper and lower conductive plates provided on opposite sides of the pair of outer plate bodies 26 and 27 facing each other. The conductive meshes 28 and 29 (an example of a conductive member) and a plurality of storage spaces 30 that are formed between the pair of conductive meshes 28 and 29 and in which the electronic component 1 is stored in and out are separated from adjacent storage spaces 30. And a partition plate 31 (an example of a partition member).

  The outer plates 26 and 27 and the partition plate 31 are made of resin or the like, and the conductive meshes 28 and 29 are made of a conductive wire mesh. The storage space 30 is formed by a plurality of holes 32 formed in the partition plate 31. The upper outer plate body 26 is formed with a plurality of circular relief holes 33 penetrating both front and back surfaces. Each escape hole 33 is located above each storage space 30. The lower outer plate 27 is formed with a plurality of circular jet inflow holes 34 penetrating both front and back surfaces. Each of these jet inflow holes 34 is located below each storage space 30.

  As a result, as shown in FIG. 4, jet flow paths 35 that reach the storage spaces 30 through the mesh of the lower conductive mesh 29 from the respective jet inflow holes 34 are formed. Similarly, escape passages 36 that reach the respective escape holes 33 from the respective storage spaces 30 through the mesh of the upper conductive mesh 28 are formed.

  Each storage space 30 is formed larger than the electronic component 1, and gaps of about 1 to 2 mm are formed between the stored electronic component 1 and the storage space 30 in the front-rear direction, the left-right direction, and the vertical direction, respectively. Is done. Thereby, the electronic component 1 is stored in the storage space 30 so as to be movable up and down.

  The outer plate bodies 26, 27, the conductive meshes 28, 29 and the partition plate 31 are integrally fastened by a plurality of bolts 37 and nuts 38. By removing the bolt 37 and the nut 38, the plating jig 12 can be disassembled into the outer plate bodies 26, 27, the conductive meshes 28, 29, and the partition plate 31, and the electronic component 1 is stored in each storage space. 30.

  As shown in FIG. 2, the plating jig 12 is detachably held by the lower frame 16 of the holding body 13 with the jet inflow hole 34 facing downward, and is connected and fixed by a fixing bolt (not shown) or the like. Has been. In this state, the conductive meshes 28 and 29 of the plating jig 12 are in contact with the vertical frame 18 of the holding body 13 which is an electrode.

Hereinafter, the operation of the above configuration will be described.
When plating a plurality of electronic components 1, first, the bolts 37 and nuts 38 are removed to disassemble the plating jig 12, and the electronic components 1 are stored one by one in each storage space 30 with the upper lead 2 facing upward, Thereafter, the bolt 37 and the nut 38 are attached to assemble the plating jig 12.

  Next, the plating jig 12 is mounted on the holder 13 and immersed in the plating solution 45 of the plating tank 11. Thereby, as shown in FIG. 2, the conductive meshes 28 and 29 of the plating jig 12 come into contact with the vertical frame 18 of the holding body 13 as electrodes.

  Then, the pump 24 of the jet flow forming device 14 is operated to eject the plating solution 45 from the ejection nozzle 23, thereby forming a jet 46 of the plating solution 45 upward from below the holding body 13. Further, the holder 13 is swung in the left-right direction A by operating the electric motor 41 of the swinging device 15 and sliding the swing frame 19 in the left-right direction A.

  The plating jig 12 also swings in the left-right direction A together with the holding body 13, and at this time, as shown in FIG. 4A, the jet 46 of the plating solution 45 hits the jet inflow hole 34 of the plating jig 12 from below. Then, the jet 46 flows from the jet inflow hole 34 through the jet flow path 35 into the storage space 30 and pushes up the electronic component 1 to bring the upper lead 2 into contact with the upper conductive mesh 28. As a result, the lower lead 3 of the electronic component 1 is reliably spaced above the lower conductive mesh 29 and the vertical frame 18 of the holding body 13 (via the upper lead 2 and the upper conductive mesh 28). In order to energize the electrode), the lower lead 3 is plated. The jet 46 flowing into the storage space 30 from the jet inflow hole 34 and the bubbles in the storage space 30 escape from the escape hole 33 to the upper side of the plating jig 12 through the escape passage 36.

  4B, when the jet 46 of the plating solution 45 moves away from the jet inflow hole 34 in the left / right direction A by swinging in the left / right direction A, the jet 46 is stored from the jet inflow hole 34. Without flowing into the space 30, the electronic component 1 descends due to its own weight, and the lower lead 3 comes into contact with the lower conductive mesh 29. As a result, the upper lead 2 of the electronic component 1 is reliably separated from the lower portion of the upper conductive mesh 28 and the vertical frame 18 of the holding body 13 (via the lower lead 3 and the lower conductive mesh 29). In order to energize the electrode), the upper lead 2 is plated.

  In this way, each electronic component 1 is uniformly plated in a short time by repeatedly moving the electronic component 1 up and down in the storage space 30 by the swing of the plating jig 12 in the left-right direction A. Can do. Further, since the adjacent storage spaces 30 are partitioned by the partition plate 31, the electronic components 1 stored in the storage spaces 30 do not contact each other, and the electronic components 1 are prevented from being damaged. Can do.

In the above-described embodiment, the escape hole 33 and the jet inflow hole 34 are circular, but may be square or the like.
In the above-described embodiment, the wire mesh conductive meshes 28 and 29 are used as an example of the conductive member, but a conductive plate may be used. In this case, the lower conductive plate is formed with a communication hole communicating with the jet inflow hole 34 and the storage space 30, and the upper conductive plate is communicated with the escape hole 33 and the storage space 30. A communication hole is formed.

In the embodiment, as an example of the horizontal direction, the plating jig 12 is swung in the left-right direction A, but may be swung in the front-rear direction.
In the above embodiment, the ejection nozzle 23 of the jet flow forming device 14 is fixed and the holding body 13 is swung in the lateral direction (left and right direction or front and rear direction). However, the holding body 13 is fixed and the ejection nozzle 23 is It may swing in the lateral direction.

In the embodiment described above, the electric motor 41 and the crank mechanism 42 are used as the swing device 15, but a cylinder or the like may be used.
In the above embodiment, the outer plate bodies 26 and 27 of the plating jig 12, the conductive meshes 28 and 29, and the partition plate 31 are integrally fastened by the bolts 37 and nuts 38, but instead of the bolts 37 and nuts 38. The outer plate bodies 26 and 27, the conductive meshes 28 and 29, and the partition plate 31 may be sandwiched by using clips or the like.

  As described above, according to the electronic component plating apparatus of the present invention, plating can be performed uniformly in a short time, stable plating can be performed without scratching the electronic component, and the plating process can be performed automatically. .

Diagram of plating apparatus in an embodiment of the present invention Same as above, vertical section of plating jig installed in plating equipment The exploded perspective view of the plating jig provided in the plating equipment The figure which shows the plating method using the same plating equipment Diagram of conventional plating equipment Figure of basket provided in plating equipment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Upper lead 3 Lower lead 10 Plating apparatus 11 Plating tank 12 Plating jig 13 Holding body 14 Jet formation apparatus 26, 27 Outer plate bodies 28, 29 Conductive mesh (conductive member)
30 Storage space 31 Partition plate (partition member)
34 Jet inflow hole 35 Jet flow path 45 Plating solution 46 Jet A Left and right direction (lateral direction)

Claims (2)

A plating apparatus for plating an electronic component having leads on both upper and lower surfaces and electrically connecting an upper lead and a lower lead,
A plating tank, a holding body that holds a plating jig in the plating tank and has an electrode, and a jet forming device that forms a jet of a plating solution upward from below the holding body,
Either one of the holding body and the jet forming device is swingable in the lateral direction with respect to the other,
The plating jig is formed between a pair of upper and lower outer plate members, a pair of upper and lower conductive members provided on opposite surfaces of the pair of outer plate members, and a pair of conductive members. It has a plurality of storage spaces that are detachably stored and a partition member that partitions adjacent storage spaces,
A jet flow path that reaches each storage space from the plurality of jet inflow holes formed in the lower outer plate through the lower conductive member is formed,
The conductive member contacts the electrode of the holder,
An electronic component plating apparatus, wherein the storage space is formed in a size that allows the stored electronic component to move up and down. A plating method for plating an electronic component having leads on both upper and lower surfaces and electrically connecting an upper lead and a lower lead using a plating jig,
The plating jig is formed between a pair of upper and lower outer plate members, a pair of upper and lower conductive members provided on opposite surfaces of the pair of outer plate members, and a pair of conductive members. It has a plurality of storage spaces that are detachably stored and a partition member that partitions adjacent storage spaces,
A jet flow path that reaches each storage space from the plurality of jet inflow holes formed in the lower outer plate through the lower conductive member is formed,
Store electronic components in the storage space,
Immerse the plating jig in the plating solution by bringing the conductive member into contact with the electrode,
A plating solution jet is formed upward from below the plating jig,
Either one of the plating jig and the jet of plating solution is swung laterally with respect to the other,
When the jet hits the jet inflow hole of the plating jig, the jet flows from the jet inflow hole through the jet flow path into the storage space, pushes up the electronic component, and contacts the upper lead with the upper conductive member. The electronic component is lowered by its own weight when the nozzle is laterally removed from the jet inflow hole, and the lower lead comes into contact with the lower conductive member.

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