CN106041741A - CMP polishing pad finisher with porous structure - Google Patents
CMP polishing pad finisher with porous structure Download PDFInfo
- Publication number
- CN106041741A CN106041741A CN201610451507.8A CN201610451507A CN106041741A CN 106041741 A CN106041741 A CN 106041741A CN 201610451507 A CN201610451507 A CN 201610451507A CN 106041741 A CN106041741 A CN 106041741A
- Authority
- CN
- China
- Prior art keywords
- loose structure
- polishing pad
- porous structure
- cmp pad
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention discloses a CMP polishing pad finisher with a porous structure. The CMP polishing pad finisher is characterized by comprising a disc-shaped base body and the porous structure located on the disc-shaped base body, a plurality of micro protruding cutting blades extending outwards are arranged on the upper surface of the porous structure, or a plurality of diamond cutting protrusions are bonded to the upper surface of the porous structure, and in the work state, finishing liquid can flow out through the porous structure. The porous structure included in the CMP polishing pad finisher with the porous structure can solve the problem of blockage in the finishing process and reduce damage of scraps to a polishing pad. The micro protruding cutting blades with a certain taper and the diamond cutting protrusions with a certain taper are provided, the structure can be used for containing the scraps generated in the finishing process, and low-damage finishing on the polishing pad can be achieved.
Description
Technical field
The present invention relates to a kind of CMP (chemically mechanical polishing) polishing pad trimmer containing loose structure, it is possible to achieve right
The damage finishing efficient, low of polishing pad, improves the quality of finish of chemically mechanical polishing.
Background technology
Chemically mechanical polishing (chemical mechanical polishing is called for short CMP) technology is almost the most unique
The Surface Finishing technology that leveling can be provided, can be widely used for IC chip, computer hard disc, miniature
The planarizing on the surfaces such as mechanical system (MEMS), optical glass.Along with the development of science and technology, ultra-smooth, smooth, scarce without microcosmic
The high-precision surface fallen into has become the key factor being related to these high-tech product performances.
The ultimate principle of CMP be by polished workpiece at certain downforce and polishing fluid (by ultra-fine grain, chemistry
Oxidant and liquid medium composition mixed liquor) in the presence of rotate relative to a polishing pad, by the machine of abrasive particle
The corrosiveness of tool grinding and chemical oxidizing agent completes the material to surface of the work and removes, and obtains smooth finish surface.It utilizes
" buffing is hard " principle in abrasion, i.e. is polished realizing high-quality surface finish with softer material.It is different from
The finishing method of traditional purely mechanic or pure chemistry, CMP is by chemistry and mechanical comprehensive function, thus avoids by merely
The surface damage that mechanical polishing causes is slow with the polishing velocity easily caused by pure chemistry polishing, surface smoothness is consistent with polishing
Property difference etc. shortcoming.
Polishing pad is the critical component in CMP, and its surface is one layer has the macromolecular material of cellular structure.Polishing pad
Polyurethane (PU) that the macromolecular material on surface generally growth method obtains, Merlon (PC) etc., polishing pad plays storage and throws
Light liquid and the abrasive particles in polishing fluid is sent into surface of the work remove those micro-protuberance parts on wafer.
The mechanical performance of polishing pad, such as hardness, elasticity and modulus of shearing, the size of pore and distribution, compressibility, viscoelastic
Property, polishing velocity and final flatness play an important role by the different times that uses of surface roughness and polishing pad.True
On, the structure of pad interface, chemistry and mechanical performance can change along with the use time lengthening of polishing pad.Substantial amounts of reality
Testing research to show, physically changed (such as pore size, the roughness etc.) of the polishing pad after using are bigger than chemical modification, and think
These change the CMP performance to polishing pad and have a major impact.Meanwhile, during polishing pad uses, surface can gradually flatten, and occurs
" glazing " phenomenon, makes removal speed decline, causes polishing speed uneven.Accordingly, it would be desirable to polishing pad is carried out reality with dresser
Time finishing, recover polishing pad matsurface, improve its accommodate slurry ability so that remove speed maintained and can be prolonged
The life-span of long polishing pad.
Dresser is directly to contact with polishing pad, and it has direct shadow to surface configuration, the physical characteristic of polishing pad
Ring, so it is necessary that dresser surface configuration and structure are optimized the surface quality to raising wafer.
Existing dresser is based on diamond truer, generally according to carcass type in manufacturing at diamond truer
Difference, is divided into four kinds: electrodeposition-type, soldering type, metal sintering type and chemical gaseous phase deposition (CVD) diamond-type, its performance good
The bad surface appearance being directly connected to polishing pad, thus affect the qualities of finish such as the clearance of wafer, heterogeneity.But it is existing
Dresser also exists many deficiencies, as diamond particles easily comes off, thus can scratch polishing pad；Detritus easily blocks dresser
Cutting surface, reduces its stock-removing efficiency；Bulky grain detritus is difficult to get rid of in time, scratches machined pad interface；Diamond
The exposed amount of grain is little, and cutting point is few, and the working durability is not enough.
At present, the application of CMP pad dresser is more.Wherein, patent " cmp pad conditioners and related side
Method " to propose a kind of angle containing surface in (Patent No. CN 101557904A) be 90 degree or less superhard cutting elements
Adjustor, although the invention of this patent can reduce, and polishing pad pierces through disruptiveness, but this structure is unfavorable in the course of processing
The appearance bits effect of detritus, sometimes detritus pad interface is abraded consequence can than cutting element to the damaging consequences of polishing pad more
Add serious.Additionally, propose in patent " CMP pad conditioner " (Patent No. CN 103688344A) one have substrate and
Relating to a kind of CMP pad conditioner with cutting tip figure, cutting tip therein is prominent to have identical or different height
The polygon cylinder of degree, between each cylinder by pit separately, and at its surface gold-plating diamond thin film.Although this invention can
To reduce the size of the fragment produced during adjustment processes, but easily blocked by detritus between each cutting tip, can weaken polishing
The finishing effect of pad.
Summary of the invention
For solving the problem that current CMP pad dresser exists, the present invention provides a kind of CMP containing loose structure to throw
Light dresser.
The technological means that the present invention uses is as follows:
A kind of CMP pad dresser containing loose structure, it is characterised in that: include dish-type matrix and be positioned at described dish
Loose structure on mold base, the upper surface of described loose structure has outward extending multiple microprotrusion cutting edge or is bonded with
Multiple Diamond Cuttings are protruding, are provided with the cavity matched with described loose structure lower surface in described dish-type matrix,
Under duty, finishing liquid can be flowed out by described loose structure.
Described loose structure is dish-type loose structure or annular porous structure etc..
The material of described dish-type matrix is the metal material such as aluminium alloy, 40Cr, or such as the resistant material of rustless steel etc..
The material of described loose structure is the internal material containing a large amount of Minute pores, such as micropore ceramics vacuum cup material
Material.
Being distributed on described loose structure of the plurality of microprotrusion cutting edge matrix form.
The outer surface of described microprotrusion cutting edge is provided with diamond coatings.Described microprotrusion is cut by described diamond coatings
Sword plays firm effect, improves the stability of dressing process, and undertakes polishing pad together with described microprotrusion cutting edge
Finishing effect.
Described microprotrusion cutting edge is rectangular pyramid shape, cone or polygon pyramid.
The plurality of Diamond Cutting projection distributes as net shape on the upper surface of described loose structure.
Described Diamond Cutting projection includes the hard particles bondd with described loose structure and is positioned at described hard particles
The diamond coatings of outer surface.Described hard particles is played firm effect by described diamond coatings, improves dressing process
Stability, and undertake the finishing effect to polishing pad together with described hard particles.
The bottom of described cavity is provided with seal cover board, is provided with sealing ring between described seal cover board and described cavity, described
At least provided with a runner connected with described cavity on seal cover board, under a certain pressure, finishing liquid is entered by described runner
Enter described cavity, then flowed out by described loose structure, capable of washing be blocked between described microprotrusion cutting edge or described Buddha's warrior attendant
Detritus between stone cutting projection and on described loose structure surface, reduces the detritus damage to polishing pad.
The loose structure that a kind of CMP pad dresser containing loose structure of the present invention is comprised can solve finishing
During blockage problem, reduce the detritus damage to polishing pad；The present invention proposes the microprotrusion cutting with certain taper
Sword and Diamond Cutting are protruding, and this structure can play the appearance bits effect of the detritus to dressing process, and can realize polishing pad is low
Damage finishing.
The present invention can be widely popularized in fields such as polishings for the foregoing reasons.
Accompanying drawing explanation
The present invention is further detailed explanation with detailed description of the invention below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of a kind of CMP pad dresser containing loose structure in embodiments of the invention 1.
Fig. 2 be in Fig. 1 A-A to schematic diagram.
Fig. 3 is I portion enlarged diagram (partial enlarged drawing of principal contact surfaces) in Fig. 1.
Fig. 4 is II portion enlarged diagram in Fig. 2 (loose structure and the enlarged cross-sectional view of microprotrusion cutting edge).
Fig. 5 is the principal contact surfaces of a kind of CMP pad dresser containing loose structure in embodiments of the invention 2
Partial enlarged drawing.
Fig. 6 is loose structure and the Buddha's warrior attendant of a kind of CMP pad dresser containing loose structure in the embodiment of the present invention 2
The enlarged cross-sectional view that stone cutting is protruding.
Fig. 7 is the partial enlarged drawing of Fig. 6.
Detailed description of the invention
A kind of CMP pad dresser containing loose structure, including dish-type matrix and being positioned on described dish-type matrix
Loose structure, the upper surface of described loose structure has outward extending multiple microprotrusion cutting edge or is bonded with multiple diamond
Cutting projection,
Under duty, finishing liquid can be flowed out by described loose structure.
The material of described loose structure is the internal material containing a large amount of Minute pores, such as micropore ceramics vacuum cup material
Material.
Being distributed on described loose structure of the plurality of microprotrusion cutting edge matrix form.
The outer surface of described microprotrusion cutting edge is provided with diamond coatings.
Described microprotrusion cutting edge is rectangular pyramid shape, cone or polygon pyramid.
The plurality of Diamond Cutting projection distributes as net shape on the upper surface of described loose structure.
Described Diamond Cutting projection includes the hard particles bondd with described loose structure and is positioned at described hard particles
The diamond coatings of outer surface.
Embodiment 1
As Figure 1-Figure 4, a kind of CMP pad dresser containing loose structure, including dish-type matrix 1 be positioned at institute
Stating the loose structure on dish-type matrix 1, described loose structure is annular porous structure 2, the upper surface of described annular porous structure 2
There is outward extending multiple microprotrusion cutting edge 3, be provided with in described dish-type matrix 1 and described annular porous structure 2 lower surface
The cavity matched, i.e. annular housing 4,
Under duty, finishing liquid can be flowed out by described annular housing 4 and described annular porous structure 2.
The material of described annular porous structure 2 is micropore ceramics vacuum cup material.
Being distributed in described annular porous structure 2 of the plurality of microprotrusion cutting edge 3 matrix form.
The outer surface of described microprotrusion cutting edge 3 is provided with diamond coatings 5, and the thickness of described diamond coatings 5 is tens
Micron.
Described microprotrusion cutting edge 3 is rectangular pyramid shape, its bottom side length 1mm, and its height is 1mm, every four described microprotrusion
There is between cutting edge 3 plane domain less than 1mm × 1mm.
The bottom of described annular housing 4 is provided with seal cover board 6, is provided with between described seal cover board 6 and described annular housing 4
Sealing ring 7, at least provided with a runner 8 connected with described annular housing 4 on described seal cover board 6, under a certain pressure, repaiies
Whole liquid enters described annular housing 4 by described runner 8, then is flowed out by described annular porous structure 2, capable of washing is blocked in institute
State the detritus between microprotrusion cutting edge 3 and on described annular porous structure 2 surface, reduce the detritus damage to polishing pad.
It is provided with sleeve 9 between described annular housing 4 and described dish-type matrix 1.
Described seal cover board 6 is connected by screw 10 is fixing with described dish-type matrix 1.
Described dresser can be fixed on buffing machine by the hole 11 on described dish-type matrix 1.
Described microprotrusion cutting edge 3 can be beaten by Laser Processing, micro-fabrication technology, mould molding, chemical etching and 3D
The methods such as print technology realize.Described diamond coatings 5 can be coated by chemical vapour deposition technique and masking method etc..
Embodiment 2
As shown in Figure 5-Figure 7, a kind of CMP pad dresser containing loose structure, itself and disclosed in embodiment 1
The distinguishing characteristics planting the CMP pad dresser containing loose structure is: the upper surface of described annular porous structure 2 is bonded with
Multiple Diamond Cutting projections 12, the plurality of Diamond Cutting projection 12 distributes as net shape in described annular porous structure 2
Upper surface on.
Described Diamond Cutting projection 12 includes the hard particles 13 bondd with described annular porous structure 2 and is positioned at described
The diamond coatings 14 of hard particles 13 outer surface.Described hard particles 13 is by tack coat 15 and described annular porous structure 2
Bonding.The sizableness of the described microprotrusion cutting edge 3 in the size of described hard particles 13 and embodiment 1, described hard
Grain 13 is the granule of diamond particles or other hard.
The plurality of Diamond Cutting protruding 12 can use mask with the coating of the bonding of loose structure 2 and diamond coatings 14
Methods etc. are implemented.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, according to technical scheme and
Inventive concept equivalent or change in addition, all should contain within protection scope of the present invention.
Claims (7)
1. the CMP pad dresser containing loose structure, it is characterised in that: include dish-type matrix and be positioned at described dish-type
Loose structure on matrix, the upper surface of described loose structure has outward extending multiple microprotrusion cutting edge or is bonded with many
Individual Diamond Cutting is protruding,
Under duty, finishing liquid can be flowed out by described loose structure.
A kind of CMP pad dresser containing loose structure the most according to claim 1, it is characterised in that: described many
Pore structure is the internal material containing a large amount of Minute pores.
A kind of CMP pad dresser containing loose structure the most according to claim 1, it is characterised in that: described many
Being distributed on described loose structure of individual microprotrusion cutting edge matrix form.
A kind of CMP pad dresser containing loose structure the most according to claim 3, it is characterised in that: described micro-
The outer surface of protruding cutting edge is provided with diamond coatings.
A kind of CMP pad dresser containing loose structure the most according to claim 3, it is characterised in that: described micro-
Protruding cutting edge is rectangular pyramid shape, cone or polygon pyramid.
A kind of CMP pad dresser containing loose structure the most according to claim 1, it is characterised in that: described many
Individual Diamond Cutting projection distributes as net shape on the upper surface of described loose structure.
A kind of CMP pad dresser containing loose structure the most according to claim 6, it is characterised in that: described gold
Hard rock cutting projection includes the hard particles bondd with described loose structure and is positioned at the diamond of described hard particles outer surface
Coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451507.8A CN106041741B (en) | 2016-06-21 | 2016-06-21 | A kind of CMP pad trimmer containing porous structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451507.8A CN106041741B (en) | 2016-06-21 | 2016-06-21 | A kind of CMP pad trimmer containing porous structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106041741A true CN106041741A (en) | 2016-10-26 |
| CN106041741B CN106041741B (en) | 2018-09-04 |
Family
ID=57168742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610451507.8A Active CN106041741B (en) | 2016-06-21 | 2016-06-21 | A kind of CMP pad trimmer containing porous structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106041741B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| CN108857866A (en) * | 2017-05-12 | 2018-11-23 | 中国砂轮企业股份有限公司 | Dresser for chemical mechanical polishing pad and manufacturing method thereof |
| TWI686266B (en) * | 2018-05-29 | 2020-03-01 | 中國砂輪企業股份有限公司 | Dresser with porous structure |
| CN116652825A (en) * | 2023-07-24 | 2023-08-29 | 北京寰宇晶科科技有限公司 | Diamond CMP polishing pad trimmer and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200207B1 (en) * | 1999-03-23 | 2001-03-13 | Vanguard International Semiconductor Corp. | Dressing apparatus for chemical mechanical polishing pad |
| JP2010052080A (en) * | 2008-08-27 | 2010-03-11 | Mitsubishi Materials Corp | Cmp conditioner |
| JP2010135707A (en) * | 2008-12-08 | 2010-06-17 | Mitsubishi Materials Corp | Conditioner for semiconductor polishing cloth, method of manufacturing conditioner for semiconductor polishing cloth, and semiconductor polishing device |
| JP2010182813A (en) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmp pad conditioner |
| CN102485426A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | Grinding pad finisher and grinding pad finishing method |
| CN103100966A (en) * | 2011-11-11 | 2013-05-15 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical lapping device and system |
| US8550878B2 (en) * | 2006-04-06 | 2013-10-08 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
| CN105234823A (en) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | Grinding liquid supply and grinding pad trimming device and grinding drilling crew |
-
2016
- 2016-06-21 CN CN201610451507.8A patent/CN106041741B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200207B1 (en) * | 1999-03-23 | 2001-03-13 | Vanguard International Semiconductor Corp. | Dressing apparatus for chemical mechanical polishing pad |
| US8550878B2 (en) * | 2006-04-06 | 2013-10-08 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
| JP2010052080A (en) * | 2008-08-27 | 2010-03-11 | Mitsubishi Materials Corp | Cmp conditioner |
| JP2010135707A (en) * | 2008-12-08 | 2010-06-17 | Mitsubishi Materials Corp | Conditioner for semiconductor polishing cloth, method of manufacturing conditioner for semiconductor polishing cloth, and semiconductor polishing device |
| JP2010182813A (en) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmp pad conditioner |
| CN102485426A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | Grinding pad finisher and grinding pad finishing method |
| CN103100966A (en) * | 2011-11-11 | 2013-05-15 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical lapping device and system |
| CN105234823A (en) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | Grinding liquid supply and grinding pad trimming device and grinding drilling crew |
Non-Patent Citations (1)
| Title |
|---|
| 宋月清 等: "《人造金刚石工具手册》", 31 January 2014, 冶金工业出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| CN108857866A (en) * | 2017-05-12 | 2018-11-23 | 中国砂轮企业股份有限公司 | Dresser for chemical mechanical polishing pad and manufacturing method thereof |
| TWI686266B (en) * | 2018-05-29 | 2020-03-01 | 中國砂輪企業股份有限公司 | Dresser with porous structure |
| CN116652825A (en) * | 2023-07-24 | 2023-08-29 | 北京寰宇晶科科技有限公司 | Diamond CMP polishing pad trimmer and preparation method thereof |
| CN116652825B (en) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | Diamond CMP polishing pad trimmer and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106041741B (en) | 2018-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liu et al. | Grinding wheels for manufacturing of silicon wafers: a literature review | |
| KR100359401B1 (en) | Abrasive Tools | |
| KR100416330B1 (en) | Abrasive tools for grinding electronic components | |
| KR100789620B1 (en) | Super abrasive grain tool and method for manufacturing the same | |
| US20060073774A1 (en) | CMP pad dresser with oriented particles and associated methods | |
| KR100486429B1 (en) | Ultra abrasive grain wheel f0r mirror finish | |
| CN106041741B (en) | A kind of CMP pad trimmer containing porous structure | |
| GB2421508A (en) | Porous abasive segments and tools incorporating the same | |
| KR20070100904A (en) | Method and device for grinding ceramic spheres | |
| CN104620356A (en) | Cmp conditioner pads with superabrasive grit enhancement | |
| WO2007022016A2 (en) | Abrasive tool | |
| CN104736300B (en) | Grinding tool and the grinding-polishing device for having used the grinding tool | |
| CN112677061B (en) | Brazing diamond grinding disc for steel grinding and preparation method thereof | |
| CN1951636A (en) | Coating sharpener and method for the production thereof | |
| JP2001300856A (en) | Super abrasive grain tool | |
| KR200175263Y1 (en) | The structure of the conditioner for CMP(Chemical Mechanical Polishing) Pad in CMP process | |
| JPH1058331A (en) | Super abrasive grain wheel for lapping | |
| JP2005161449A (en) | Cup type super-abrasive grain wheel for processing mirror surface | |
| JPH10134316A (en) | Method for working magnetic head | |
| CN106078516B (en) | A kind of CMP pad trimmer | |
| JP2015199138A (en) | Grindstone, polishing device, polishing method and method for producing ceramic member | |
| US20060068691A1 (en) | Abrading tools with individually controllable grit and method of making the same | |
| JP2000084856A (en) | Super abrasive grinding wheel for mirror finishing provided with super abrasive layer through elastic body | |
| JP2001334469A (en) | Diamond wheel for glass substrate work and working method of glass substrate | |
| JP2007090444A (en) | Wheel for mirror finishing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |