CN102485426A - Grinding pad finisher and grinding pad finishing method - Google Patents
Grinding pad finisher and grinding pad finishing method Download PDFInfo
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- CN102485426A CN102485426A CN2010105736121A CN201010573612A CN102485426A CN 102485426 A CN102485426 A CN 102485426A CN 2010105736121 A CN2010105736121 A CN 2010105736121A CN 201010573612 A CN201010573612 A CN 201010573612A CN 102485426 A CN102485426 A CN 102485426A
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Abstract
The invention provides a grinding pad finisher and a grinding pad finishing method; the grinding pad finisher comprises a finishing head; the finishing head is arranged above a grinding pad and is communicated with a ventilation pipeline; a ventilation hood is arranged on the finishing head; a plurality of air outlet holes are arranged on the ventilation hood, so that high-pressure gas is sprayed to the grinding pad; and the grinding pad finishing method is to spray the high-pressure gas to the surface of the grinding pad, so that the grinding pad is finished. The grinding pad finisher is provided with the air outlet hood which is arranged on the finishing head, the air outlet holes which are arranged on the air outlet hood, and the ventilation pipeline which is connected with the finishing head; because the high-pressure gas is sprayed to the grinding pad, the high-pressure gas has impact and friction with the grinding pad, so that the grinding pad is finished, the problem of the prior art that diamond particles drop on the grinding pad and scratch a wafer when the diamond particles are used for finishing is avoided, and the wafer quality and output are improved; and in addition, because no diamond particle is used, the cost is reduced.
Description
Technical field
The present invention relates to a kind of chemical-mechanical polisher and method for using thereof, relate in particular to a kind of grinding mat trimmer and grinding pad method for trimming.
Background technology
Along with the size of semiconductor element characteristic is contracted to the scope of deep-sub-micrometer gradually, in order to ensure the reliability of original paper, when making integrated circuit or other electronic installations, providing extremely, smooth wafer surface or substrate surface is crucial.
In semiconductor technology, (Chemical Mechanical Polishing CMP) is the technology of the normal comprehensive planarization of using now to chemical mechanical polishing method.Generally speaking; In the process of chemically mechanical polishing; Be to contain under the situation of grinding slurry (Slurry) of chemical assistant (Reagent) and abrasive grains in supply; The wafer surface that is fixed on the grinding pad that rotating speed is controlled, is reached the purpose of planarization through the relative motion between wafer and the grinding pad.In other words, when wafer rotates on grinding pad with the mode of pushing, wafer surface with grind abrasive grains in the slurry and can contact with each other and produce friction, so can make wafer surface produce consume, and make its surface smooth gradually.
Yet polishing pad belongs to consumable accessory (Consumable Parts), after the CMP process that carries out a period of time, and the smoothing (Glazing) that can become of the surface of grinding pad, and have residual particles on the grinding pad easily and pile up and assemble.These particles have plenty of from the abrasive grains that grinds in the slurry, and what have then possibly be the byproduct of being removed from grinding on the wafer surface that thin-film material generated (By-Product).Be in the smoothing state polishing pad can not keep polish abrasive, thereby can significantly reduce polishing speed.Therefore, in order to ensure the quality of CMP process, must use grinding mat trimmer (Conditioner) to make grinding pad reply suitable roughness, to keep the grinding rate and the stability of grinding pad to wafer.Said trimmer comprises the finishing arm, is arranged at the finishing head of repairing the arm below and the freeing wheel (DiSk) that is arranged at the finishing head below; Freeing wheel is under the drive of finishing head; Be pressed on the pad interface; And, cooperate lapping liquid or deionized water simultaneously with the certain speed rotation, accomplish the finishing of polishing pad.
Fig. 1 is the generalized section of grinding mat trimmer finishing grinding pad in the prior art.As shown in Figure 1, be formed with a plurality of grooves 102 in the grinding pad 100, said groove 102 is that the slurry that grinds that is used for interspersing among on the grinding pad 100 is evenly distributed between grinding pad 100 and the wafer to be ground.Through after the long chemically mechanical polishing, many residual particles 120 can be scattered on the grinding pad 100 and groove 102 bottoms.Grinding mat trimmer 110 comprises finishing head 112; Said finishing head is provided with a plurality of diamond particles 114 to be formed, and said diamond particles 114 is fixed in the top layer, bottom surface of said finishing head 112, in order to strike off the surface of grinding pad 100; When using grinding mat trimmer 110 finishing grinding pads 100; Grinding pad 100 rotates along specific direction with grinding mat trimmer 110, and between the two under the certain pressure effect, 114 pairs of grinding pads of the diamond particles of rotation 100 carry out mechanical type friction; Removing on grinding pad 100 surfaces deformed region, and the extracting ability that grinding pad 100 is recovered slurry.Yet diamond particles 114 not only costs an arm and a leg, and often changes; Cost is huge, and grinding pad 100 is after 110 finishings are handled through grinding mat trimmer repeatedly, grinding mat trimmer 100 loss to some extent; The diamond particles 114 of freeing wheel can be sent out into coming off on grinding pad 100; When 100 pairs of wafers of grinding pad ground, the diamond particles 114 that is scattered can be brought between grinding pad 100 and the wafer, then crystal column surface was caused big scratch damage (Macro Scratch Defect); Big scratch damage can cause the large tracts of land damage of wafer, reduces productive rate.
Summary of the invention
The technical problem that the present invention will solve is, a kind of grinding mat trimmer that adopts gases at high pressure is provided, and avoids prior art to adopt the trimmer of diamond particles, and then avoids in process of lapping the scuffing of wafer is improved the output of wafer, and reduces cost.
For addressing the above problem; The present invention provides a kind of grinding mat trimmer, comprises finishing head and vent line, and said finishing head is positioned at the grinding pad top; Said finishing head is communicated with vent line; Said finishing head is provided with vent hood, and said vent hood is provided with a plurality of ventholes, with to grinding pad inject high pressure gas.
Preferably, to said grinding mat trimmer, the distance of said finishing head and said grinding pad is 1.2～3cm.
Further, to said grinding mat trimmer, the gases at high pressure that said finishing head ejects are compressed air.
Further, to said grinding mat trimmer, the pressure of the gases at high pressure that said finishing head ejects on said grinding pad is 4.85～5.15PSI.
Preferable, to said grinding mat trimmer, the diameter of said vent hood is 5～15cm.
Preferable, to said grinding mat trimmer, the material of said vent hood is a hard metal.
Preferable, to said grinding mat trimmer, said vent line is provided with pressure regulator valve.
Further, said grinding mat trimmer also comprises the finishing arm, and said finishing head is fixed on an end of finishing arm, and said vent line is fixed on the said finishing arm, and said finishing arm can drive said finishing head and swing in said grinding pad upper horizontal.
A kind of grinding pad method for trimming utilizes spraying high-pressure gas grinding pad surface, so that grinding pad is repaired.
Further, to described grinding pad method for trimming, said gases at high pressure are compressed air.
Further, to described grinding pad method for trimming, the pressure of said gases at high pressure on said grinding pad is 4.85～5.15PSI.
In sum; The advantage of grinding mat trimmer described in the present invention and grinding pad method for trimming is; Utilize inject high pressure gas to replace in the prior art diamond particles that grinding pad is repaired, avoid diamond particles to fall into the polished wafer of wearing and tearing on the grinding pad, influence productive rate; And do not use diamond particles to reduce cost greatly.
Description of drawings
Fig. 1 is the generalized section of grinding mat trimmer finishing grinding pad in the prior art.
Fig. 2 is the structural representation of grinding mat trimmer in one embodiment of the invention.
Fig. 3 is the structural representation of the finishing head of grinding mat trimmer in one embodiment of the invention.
The specific embodiment
For making content of the present invention clear more understandable,, content of the present invention is described further below in conjunction with Figure of description.Certainly the present invention is not limited to this specific embodiment, and the general replacement that those skilled in the art knew also is encompassed in protection scope of the present invention.
Secondly, the present invention utilizes sketch map to carry out detailed statement, and when instance of the present invention was detailed, for the ease of explanation, sketch map did not amplify according to general ratio is local, should be with this as to qualification of the present invention.
Core concept of the present invention is with the finishing grinding pad to said grinding pad inject high pressure gas; Replace on finishing head, being provided with in the prior art diamond particles finishing grinding pad; Scratch wafer on the grinding pad thereby avoid diamond to drop on; Simultaneously need not use and change diamond, greatly reduce cost.
Fig. 2 is the structural representation of grinding mat trimmer in one embodiment of the invention.As shown in Figure 2, the present invention provides a kind of grinding mat trimmer, and said trimmer comprises finishing head 12 and vent line 18; Said finishing head 12 is positioned at grinding pad 10 tops, and said finishing head 12 is communicated with vent line 18, and Fig. 3 is the structural representation of the finishing head of grinding mat trimmer in one embodiment of the invention; As shown in Figure 3; Said finishing head 12 is provided with vent hood 12a, and said vent hood 12a is provided with a plurality of venthole 12b, with to grinding pad inject high pressure gas 30.
Said trimmer also comprises finishing arm 16, and said finishing head 12 is fixed on an end of finishing arm 16, and said vent line 18 is fixed on the said finishing arm 16, and said finishing arm 16 can drive said finishing head 12 and swing in said grinding pad 10 upper horizontal.One end of said finishing arm 16 links to each other with the controller of grinding, and when grinding pad rotated, under the control of controller, finishing arm 16 drove finishing head 12 horizontal hunting on grinding pad 10, to accomplish comprehensive finishing of 12 pairs of grinding pads 10 of finishing head.
Preferably, said finishing head 12 is 1.2～3cm with the distance of said grinding pad 10.Further, the gases at high pressure that eject of said finishing head 12 30 are compressed air.
Further; It is 4.85～5.15PSI that said finishing head 12 ejects the pressure of gases at high pressure 30 on said grinding pad 10; The pressure of gases at high pressure 30 is equivalent to the pressure that the diamond particles on the grinding head in the prior art is pressed in crystal column surface, and the pressure of gases at high pressure 30 and grinding pad 10 carry out impact friction, thereby removes on grinding pad 10 surfaces deformed region; And the extracting ability that grinding pad 10 is recovered slurry, the grinding efficiency and the Grinding Quality of recovery grinding pad 10.
Further, said vent line 18 is provided with pressure regulator valve 20.Pressure regulator valve 20 is set can regulates the pressure of gases at high pressure 30 according to the situation of the different wearing and tearing of grinding pad 10, thus the finishing that grinding pad 10 is carried out in various degree.
Preferable, the diameter of said vent hood 12a is 5～15cm, the material of said vent hood 12a is a hard metal, for example stainless steel, converted steel.The diameter of said vent hood 12a can fully be repaired grinding pad 10 and not influence and grind wafer on the grinding pad 10 simultaneously, all within thought range of the present invention.
A kind of grinding pad method for trimming utilizes spraying high-pressure gas grinding pad surface, so that grinding pad is repaired.Said gases at high pressure are compressed air, and the pressure of said gases at high pressure on said grinding pad is 4.85～5.15PSI.
In the present embodiment, said grinding pad modification method combines grinding pad finishing structure, and said finishing head 12 is positioned at said grinding pad 10 tops, to said grinding pad 10 inject high pressure gases 30, so that grinding pad 10 is repaired.Said finishing head 12 is 1.2～3cm with the distance of said grinding pad 10.The gases at high pressure 30 that said finishing head 12 ejects are compressed air.The pressure of the gases at high pressure 30 that said finishing head 12 ejects on said grinding pad 10 is 4.85～5.15PSI.In addition, utilize other structures or device inject high pressure gas to repair the structure of grinding pad, method all in thought range of the present invention.
In sum; Grinding mat trimmer setting according to the invention is included in air leaving cover 12a and a plurality of venthole 12b on the air leaving cover 12a on the finishing head 12; And the vent line 18 that is connected with finishing head 12; Through to grinding pad 10 inject high pressure gases 30, impact frictions take place with grinding pad 10 in gases at high pressure 30, thereby grinding pad 10 is repaired; Avoid in the prior art using in the diamond particles dressing process diamond particles to drop on the grinding pad 10 and scratch wafer, influence wafer quality and output thereby improved; And do not use diamond particles, thereby but reduce cost greatly.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (11)
1. a grinding mat trimmer is characterized in that, comprises finishing head and vent line; Said finishing head is positioned at the grinding pad top, and said finishing head is communicated with vent line, and said finishing head is provided with vent hood; Said vent hood is provided with a plurality of ventholes, with to grinding pad inject high pressure gas.
2. grinding mat trimmer as claimed in claim 1 is characterized in that, the distance of said finishing head and said grinding pad is 1.2～3cm.
3. grinding mat trimmer as claimed in claim 1 is characterized in that, the gases at high pressure that said finishing head ejects are compressed air.
4. grinding mat trimmer as claimed in claim 1 is characterized in that, the pressure of the gases at high pressure that said finishing head ejects on said grinding pad is 4.85～5.15PSI.
5. grinding mat trimmer as claimed in claim 1 is characterized in that, the diameter of said vent hood is 5～15cm.
6. grinding mat trimmer as claimed in claim 1 is characterized in that, the material of said vent hood is a hard metal.
7. grinding mat trimmer as claimed in claim 1 is characterized in that said vent line is provided with pressure regulator valve.
8. grinding mat trimmer as claimed in claim 1; It is characterized in that, also comprise the finishing arm, said finishing head is fixed on an end of finishing arm; Said vent line is fixed on the said finishing arm, and said finishing arm can drive said finishing head and swing in said grinding pad upper horizontal.
9. a method of repairing grinding pad is characterized in that, utilizes spraying high-pressure gas grinding pad surface, so that grinding pad is repaired.
10. the method for finishing grinding pad as claimed in claim 9 is characterized in that, said gases at high pressure are compressed air.
11. the method for finishing grinding pad as claimed in claim 9 is characterized in that, the pressure of said gases at high pressure on said grinding pad is 4.85～5.15PSI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105736121A CN102485426A (en) | 2010-12-03 | 2010-12-03 | Grinding pad finisher and grinding pad finishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105736121A CN102485426A (en) | 2010-12-03 | 2010-12-03 | Grinding pad finisher and grinding pad finishing method |
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| CN102485426A true CN102485426A (en) | 2012-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105736121A Pending CN102485426A (en) | 2010-12-03 | 2010-12-03 | Grinding pad finisher and grinding pad finishing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104175224A (en) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | Cleaning device of chemical mechanical polishing pad and cleaning method thereof |
| CN105234823A (en) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | Grinding liquid supply and grinding pad trimming device and grinding drilling crew |
| CN106041741A (en) * | 2016-06-21 | 2016-10-26 | 大连理工大学 | CMP polishing pad finisher with porous structure |
| CN106078516A (en) * | 2016-06-21 | 2016-11-09 | 大连理工大学 | A kind of novel C MP polishing pad trimmer |
| CN108500843A (en) * | 2018-04-04 | 2018-09-07 | 河南科技学院 | A kind of adaptive dressing method of abradant jet for concretion abrasive polishing pad |
| WO2020062581A1 (en) * | 2018-09-25 | 2020-04-02 | 重庆陈氏清洁服务有限公司 | High-pressure gas-liquid grinding device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5679063A (en) * | 1995-01-24 | 1997-10-21 | Ebara Corporation | Polishing apparatus |
| US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
| CN1402313A (en) * | 2001-08-02 | 2003-03-12 | 联华电子股份有限公司 | Grinding pad recovery device structure and use |
| CN1947945A (en) * | 2005-10-14 | 2007-04-18 | 联华电子股份有限公司 | Equipment for chemical-mechanical polishing, method for washing its polishing pad and flattening method |
| US20080032609A1 (en) * | 2006-03-08 | 2008-02-07 | Benedict Jeffrey H | Apparatus for reducing contaminants from a chemical mechanical polishing pad |
-
2010
- 2010-12-03 CN CN2010105736121A patent/CN102485426A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5679063A (en) * | 1995-01-24 | 1997-10-21 | Ebara Corporation | Polishing apparatus |
| US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
| CN1402313A (en) * | 2001-08-02 | 2003-03-12 | 联华电子股份有限公司 | Grinding pad recovery device structure and use |
| CN1947945A (en) * | 2005-10-14 | 2007-04-18 | 联华电子股份有限公司 | Equipment for chemical-mechanical polishing, method for washing its polishing pad and flattening method |
| US20080032609A1 (en) * | 2006-03-08 | 2008-02-07 | Benedict Jeffrey H | Apparatus for reducing contaminants from a chemical mechanical polishing pad |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104175224A (en) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | Cleaning device of chemical mechanical polishing pad and cleaning method thereof |
| CN105234823A (en) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | Grinding liquid supply and grinding pad trimming device and grinding drilling crew |
| CN105234823B (en) * | 2015-10-27 | 2017-09-29 | 上海华力微电子有限公司 | Lapping liquid is supplied and grinding pad collating unit, grinder station |
| CN106041741A (en) * | 2016-06-21 | 2016-10-26 | 大连理工大学 | CMP polishing pad finisher with porous structure |
| CN106078516A (en) * | 2016-06-21 | 2016-11-09 | 大连理工大学 | A kind of novel C MP polishing pad trimmer |
| CN108500843A (en) * | 2018-04-04 | 2018-09-07 | 河南科技学院 | A kind of adaptive dressing method of abradant jet for concretion abrasive polishing pad |
| WO2020062581A1 (en) * | 2018-09-25 | 2020-04-02 | 重庆陈氏清洁服务有限公司 | High-pressure gas-liquid grinding device |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130619 Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Effective date: 20130619 |
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Effective date of registration: 20130619 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20120606 |