CN102024804B - Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness - Google Patents
Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness Download PDFInfo
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- CN102024804B CN102024804B CN2009101703535A CN200910170353A CN102024804B CN 102024804 B CN102024804 B CN 102024804B CN 2009101703535 A CN2009101703535 A CN 2009101703535A CN 200910170353 A CN200910170353 A CN 200910170353A CN 102024804 B CN102024804 B CN 102024804B
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The invention relates to a mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness, comprising a base plate unit, a light emitting unit, a frame unit and a packaging unit, wherein the light emitting unit comprises a first light emitting module and a second light emitting module, wherein the first light emitting module is used for producing first color temperature, and the second light emitting module is used for producing second color temperature; the frame unit comprises two surrounded frame colloids which are surrounded on the upper surface of the base plate unit by a coating mode, and the two surrounded frame colloids respectively surround the first light emitting module and the second light emitting module to respectively form two colloid limiting spaces positioned above the base plate unit; and the packaging unit comprises a first light transmission packaging colloid and a second light transmission packaging colloid which are formed on the upper surface of the base plate unit to respectively cover the first light emitting module and the second light emitting module, and the first light transmission packaging colloid and the second light transmission packaging colloid are respectively limited into the two colloid limiting spaces. In the invention, light emitting diodes capable of generating high color temperature are connected with light emitting diodes capable of generating low color temperature in series or in parallel to form the mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness.
Description
Technical field
The present invention relates to a kind of light-mixed type package structure for LED, refer to a kind of light-mixed type package structure for LED that can improve color rendering and brightness especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
So, today employed on the market lighting apparatus, for example: fluorescent lamp, tungsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover the color rendering of traditional fluorescent lamp is relatively poor, so produce pale light and be out of favour; In addition because principle of luminosity is the flowing of second of fluorescent tube two utmost point electronics 120 times fast, just to open and electric current causes flicker when unstable easily, this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; But this problem can solve by means of the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; Its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again, and when lighting a lamp because of high frequency moment again, the light wave of output is highly stable; Therefore almost flicker free takes place; And when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, this helps the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in; Must connect stabilizer abandons together; Moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of light-mixed type package structure for LED that can improve color rendering and brightness.The present invention can produce the light-emitting diode of high colour temperature and connect or be connected in parallel with the light-emitting diode that can produce low colour temperature, can improve the light-mixed type package structure for LED of color rendering and brightness to produce.
Moreover; The mode of the present invention through coating be shaped one can be arbitrary shape circulating type frame colloid (circulating type white colloid); And with position of limiting to a printing opacity packing colloid (fluorescent colloid) and the surface configuration of adjusting this printing opacity packing colloid, therefore package structure for LED of the present invention can improve the luminous efficiency of LED crystal particle and the rising angle of control LED crystal particle through this circulating type frame colloid.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of light-mixed type package structure for LED that can improve color rendering and brightness is provided, it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.Wherein, this base board unit has at least one substrate body and at least two crystal areas that are arranged at this substrate body upper surface.This luminescence unit has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles on the wherein crystal area that is arranged at this base board unit electrically, and above-mentioned at least one second light emitting module has many second LED crystal particles on the other crystal area that is arranged at this base board unit electrically.This frame unit has at least two circulating type frame colloids that form in this substrate body upper surface through the mode of coating around ground; Wherein above-mentioned at least two circulating type frame colloids are respectively around above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module, to form at least two spacing spaces of colloid that are positioned at this substrate body top respectively.This encapsulation unit has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively, and wherein above-mentioned at least one first printing opacity packing colloid and above-mentioned at least one second printing opacity packing colloid are limited in respectively in the spacing space of above-mentioned two colloids at least.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of light-mixed type package structure for LED that can improve color rendering and brightness is provided, it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.Wherein, this base board unit has at least one substrate body and at least two crystal areas that are arranged at this substrate body upper surface.This luminescence unit has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles on the wherein crystal area that is arranged at this base board unit electrically, and above-mentioned at least one second light emitting module has many second LED crystal particles on the other crystal area that is arranged at this base board unit electrically.This frame unit has at least one first circulating type frame colloid and at least one second circulating type frame colloid that forms in this substrate body upper surface through the mode of coating around ground; Wherein above-mentioned at least one first circulating type frame colloid is around above-mentioned at least one first light emitting module; To form at least one spacing space of first colloid that is positioned at this substrate body top; And above-mentioned at least one second circulating type frame colloid is at least one in above this substrate body and the spacing space of second colloid between above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid to form around above-mentioned at least one second light emitting module and above-mentioned at least one first circulating type frame colloid.This encapsulation unit has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein above-mentioned at least one first printing opacity packing colloid is limited in the spacing space of above-mentioned at least one first colloid, and above-mentioned at least one second printing opacity packing colloid is limited in the spacing space of above-mentioned at least one second colloid.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of light-mixed type package structure for LED that can improve color rendering and brightness is provided, it comprises: a base board unit, a luminescence unit, a frame unit and an encapsulation unit.Wherein, This luminescence unit has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles that are arranged at electrically on this base board unit, and above-mentioned at least one second light emitting module has many second LED crystal particles that are arranged at electrically on this base board unit.This frame unit has at least one first circulating type frame colloid and at least one second circulating type frame colloid that forms in this base board unit upper surface; Wherein above-mentioned at least one first circulating type frame colloid is around above-mentioned at least one first light emitting module; To form at least one spacing space of first colloid that is positioned at this base board unit top; And above-mentioned at least one second circulating type frame colloid is at least one in above this base board unit and the spacing space of second colloid between above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid to form around above-mentioned at least one second light emitting module and above-mentioned at least one first circulating type frame colloid.This encapsulation unit has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this base board unit upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein above-mentioned at least one first printing opacity packing colloid is limited in the spacing space of above-mentioned at least one first colloid, and above-mentioned at least one second printing opacity packing colloid is limited in the spacing space of above-mentioned at least one second colloid.
Therefore; Beneficial effect of the present invention is: the present invention connects or is connected in parallel with the light-emitting diode that can produce low colour temperature through the light-emitting diode that can produce high colour temperature, can improve the light-mixed type package structure for LED of color rendering and brightness to produce.
In addition, by means of the use of this circulating type frame colloid, so that this printing opacity packing colloid is limited in the spacing space of this colloid, and then the use amount and the position of this printing opacity packing colloid of may command; Moreover,, and then control the rising angle of the white light beam that those LED crystal particles produce with the surface configuration of adjusting this printing opacity packing colloid and height by means of the use amount and the position of this printing opacity packing colloid of control; In addition; The present invention also can be by means of the use of this circulating type frame colloid; So that the light beam that those LED crystal particles produced projects the inwall of this circulating type frame colloid and produces reflection, and then can increase the luminous efficiency of package structure for LED of the present invention.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Go deep into and concrete understanding when getting one thus, yet appended accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Figure 1A can improve the schematic top plan view of first embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Figure 1B can improve the side-looking generalized section of first embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 1 C can improve the xy chromaticity coordinate figure of first embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 2 A can improve the schematic top plan view of second embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 2 B can improve the side-looking generalized section of second embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 2 C can improve the xy chromaticity coordinate figure of second embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 2 D can improve the schematic top plan view of other one second embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 2 E can improve the side-looking generalized section of other one second embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 A can improve the schematic top plan view of first kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 B can improve the schematic top plan view of second kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 C can improve for the present invention color rendering and brightness the light-mixed type package structure for LED the 3rd embodiment the third the serial connection mode schematic top plan view;
Fig. 3 D can improve the schematic top plan view of the 4th kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 E can improve the schematic top plan view of the 5th kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 F can improve the xy chromaticity coordinate figure of first kind to the 5th kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 3 G can improve the schematic top plan view of the 6th kind of the 3rd embodiment serial connection mode of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 4 A can improve the schematic top plan view of the 4th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 4 B can improve the side-looking generalized section of the 4th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 4 C can improve the xy chromaticity coordinate figure of the 4th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 5 can improve the schematic top plan view of the 5th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention
Fig. 6 A can improve the schematic top plan view of the 6th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention;
Fig. 6 B can improve the side-looking generalized section of the 6th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention; And
Fig. 7 can improve the side-looking generalized section of the 7th embodiment of the light-mixed type package structure for LED of color rendering and brightness for the present invention.
[main element description of reference numerals]
Package structure for LED M, M1 to M5
First group of ray structure N1
Second group of ray structure N2
Heat dissipating layer 101
Crystal area 11
The first light emitting module 2a, the first LED crystal particle 20a
The second light emitting module 2b, the second LED crystal particle 20b
The first circulating type frame colloid 30a
The second circulating type frame colloid 30b
The spacing space 300 of colloid
The spacing space 300a of first colloid
The spacing space 300b of second colloid
Circular arc tangential line T
Angle θ
Height h
The second printing opacity packing colloid 40b
Embodiment
See also shown in Figure 1A and Figure 1B, first embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.
Wherein, this base board unit 1 has at least one substrate body 10 and at least two crystal areas 11 that are arranged at these substrate body 10 upper surfaces.In addition, this substrate body 10 has a circuit substrate 100, and is arranged at the heat dissipating layer 101 of these circuit substrate 100 bottoms, a plurality of conductive welding pad 102 that is arranged at these circuit substrate 100 upper surfaces, and one is arranged at these circuit substrate 100 upper surfaces and is used to expose the insulating barrier 103 of conductive welding pads 102.Therefore, this heat dissipating layer 101 can be used for increasing the heat dissipation of this circuit substrate 100, and those insulating barriers 103 can be used for only letting conductive welding pads 102 expose out and reach the welding resisting layer of limitation welding region for a kind of.Yet above-mentioned is not that the substrate of all any patterns is all the applicable category of the present invention in order to qualification the present invention for defining of substrate body 10.For example: this substrate body 10 can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Moreover; This luminescence unit has at least one first light emitting module 2a and at least one second light emitting module 2b that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module 2a has many first LED crystal particle 20a on the wherein crystal area 11 that is arranged at this base board unit 1 electrically, and above-mentioned at least one second light emitting module 2b has many second LED crystal particle 20b on the other crystal area 11 that is arranged at this base board unit 1 electrically.In other words; The designer can cook up at least two predetermined crystal areas 11 in advance on this base board unit 1, so that those first LED crystal particle 20a and those second LED crystal particles 20b can be placed on respectively at least two crystal areas 11 of this base board unit 1 electrically.The example of being takeed with first embodiment of the invention; Those first LED crystal particle 20a and those second LED crystal particles 20b all pass through the mode of routing (wire-bonding), on two crystal areas 11 that are arranged at this base board unit 1 respectively electrically.
In addition; This frame unit 3 has at least two circulating type frame colloids 30 that form in these substrate body 10 upper surfaces through the mode of coating around ground; Wherein above-mentioned at least two circulating type frame colloids 30 are respectively around above-mentioned at least one first light emitting module 2a and above-mentioned at least one second light emitting module 2b, to form at least two spacing spaces 300 of colloid that are positioned at these substrate body 10 tops respectively.In addition, according to different design requirement, above-mentioned at least two circulating type frame colloids 30 are optionally separated from one another or link together, and above-mentioned at least two circulating type frame colloids 30 can be one another in series or parallel connection.With the example that the present invention's first enforcement is takeed, above-mentioned at least two circulating type frame colloids 30 preset distances separated from one another, and above-mentioned at least two circulating type frame colloids 30 are arranged on this substrate body 10 with being connected in parallel to each other.
Wherein, The upper surface of each circulating type frame colloid 30 can be a circular arc; This circulating type frame colloid 30 with respect to the angle θ of the circular arc tangential line T of these substrate body 10 upper surfaces between 40 to 50 degree; The end face of each circulating type frame colloid 30 with respect to the height h of these substrate body 10 upper surfaces between 0.3 to 0.7mm; The width of each circulating type frame colloid 30 bottom between 1.5 to 3mm, the thixotropic index of each circulating type frame colloid 30 (thixotropic index) between 4 to 6, and each circulating type frame colloid 30 can be one be mixed with inorganic additive white hot sclerosis frame colloid (light tight colloid).
In addition; The production method of above-mentioned each circulating type frame colloid 30 comprises at least: at first; Be coated with liquid glue material (figure do not show) around ground and (wherein should liquid state glue material can be optionally surrounded into a predetermined shape in these substrate body 10 upper surfaces; Be coated with this liquid state glue material in the pressure of these substrate body 10 upper surfaces between 350 to 450kpa; Be coated with this liquid state glue material in the speed of these substrate body 10 upper surfaces between 5 to 15mm/s, and be identical position in the starting point of these substrate body 10 upper surfaces with terminating point around ground this liquid state glue material of coating); At last; Solidify again should liquid state glue material to form a circulating type frame colloid 30; And this circulating type frame colloid 30 is arranged at the LED crystal particle (20a or 20b) on this crystal area 11 around those, with form one be positioned at these substrate body 10 tops the spacing space 300 of colloid, wherein should harden through the mode of baking by liquid state glue material; The temperature of baking is between 120 to 140 degree, and the time of baking is between 20 to 40 minutes.
Moreover; This encapsulation unit 4 has and forms at least one first printing opacity packing colloid 40a and at least one second printing opacity packing colloid 40b of these substrate body 10 upper surfaces to cover above-mentioned at least one first light emitting module 2a and above-mentioned at least one second light emitting module 2b respectively; Wherein above-mentioned at least one first printing opacity packing colloid 40a and above-mentioned at least one second printing opacity packing colloid 40b are limited in respectively in the spacing space 300 of above-mentioned two colloids at least, and the upper surface of above-mentioned at least one first printing opacity packing colloid 40a and above-mentioned at least one second printing opacity packing colloid 40b is all convex surface.
With the example that first embodiment of the invention is takeed, optical wavelength circle that those first LED crystal particle 20a and those second LED crystal particles 20b are produced is between the 400nm to 500nm.
In addition; Each first LED crystal particle 20a is a blue LED crystal grain; Above-mentioned at least one first printing opacity packing colloid 40a one has the fluorescent colloid of one first color; And the light beam that those first LED crystal particles 20a is produced passes above-mentioned at least one first printing opacity packing colloid 40a to produce the yellow light beam that colour temperature is about 3500K, the synthetic one first group of ray structure N1 of therefore above-mentioned structural group.This first group of ray structure N1 comprises: this substrate body 10, those first LED crystal particles 20a, this circulating type frame colloid 30 and this first printing opacity packing colloid 40a.
In addition; Each second LED crystal particle 20b is a blue LED crystal grain; Above-mentioned at least one second printing opacity packing colloid 40b one has the fluorescent colloid of one second color; And the light beam that those second LED crystal particles 20b is produced passes above-mentioned at least one second printing opacity packing colloid 40b to produce the white light beam that colour temperature is about 6500K, the synthetic one second group of ray structure N2 of therefore above-mentioned structural group.This second group of ray structure N2 comprises: this substrate body 10, those second LED crystal particles 20b, this circulating type frame colloid 30 and this second printing opacity packing colloid 40b.
Moreover; According to different design requirements; Second group of ray structure N2 of this first group of ray structure N1 and this can share same base board unit 1 (example of being takeed like first embodiment) or use different base board units respectively, and this first group of ray structure N1 and this second group of ray structure N2 are combined into light-mixed type package structure for LED M of the present invention.
Following table is first group of ray structure N1 (3500K), second group of ray structure N2 (6500K), and the Correlated Case with ARMA Measurement data of the light source that produced of light-mixed type package structure for LED M (3500K+6500K) after first embodiment of the invention imports 200 milliamperes (mA):
| Group | N1 | N2 | M |
| Luminous flux | 110.457 | 184.166 | 156.138 |
| Luminous efficiency | 46.01 | 77.1 | 69.24 |
| CIEx | 0.3799 | 0.3118 | 0.3407 |
| CIEy | 0.3137 | 0.3388 | 0.3345 |
| Relative colour temperature | 3390.4 | 6478.9 | 5125.2 |
| Color rendering | 82.543 | 75.893 | 83.142 |
Wherein, (Correlated Color Temperature, unit CCT) are K (kelvin) to relative colour temperature; The unit of luminous flux (Luminous Flux) is lumen (Lumen); CIEx and CIE y are x and the y coordinate of CIE (International Commission on Illumination, Commission Internationale De L'Eclairage) xy chromaticity coordinate figure (xy chromaticity diagram); The unit of luminous efficiency is lumens/watt (Lumen/W); The unit of color rendering (color render index) is Ra (Rendering average).
Please cooperate Fig. 1 C to reach shown in the Correlated Case with ARMA Measurement data that goes up in the table; Second kind of colour temperature that first kind of colour temperature that above-mentioned at least one first light emitting module 2a is produced produced less than above-mentioned at least one second light emitting module 2b (that is the yellow light beam of the 3500K that produced of this first group of ray structure N1 is less than this second group of 6500K white light beam that ray structure N2 is produced); And after the 6500K white light beam that the yellow light beam of 3500K that this first group of ray structure N1 produced and this second group of ray structure N2 are produced was carried out mixed light, this light-mixed type package structure for LED M (3500K+6500K) then produced the mixed light effect in as above showing.
See also shown in Fig. 2 A and Fig. 2 B; Second embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness; It comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4, wherein this luminescence unit has at least one first light emitting module 2a and at least one second light emitting module 2b that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature.The maximum difference of second embodiment of the invention and first embodiment is: in a second embodiment, above-mentioned at least two circulating type frame colloids 30 can be connected in parallel to each other and arrange and link together.
In second embodiment of the invention; Import 4 groups of different electric currents respectively in first group of ray structure N1 (3500K) and second group of ray structure N2 (6500K); To produce 4 groups of (A organizes the group to D) light-mixed type package structure for LED M (3500K+6500K), the Correlated Case with ARMA Measurement data of the light source that it produced are as shown in the table:
| The light-mixed type package structure for LED | The A group | The B group | The C group | The D group |
| Import the electric current of first group of ray structure | 100mA | 200mA | 200mA | 300mA |
| Import the electric current of first group of ray structure | 200mA | 100mA | 200mA | 200mA |
| CIE?x | 0.311 | 0.348 | 0.338 | 0.343 |
| CIE?y | 0.320 | 0.319 | 0.322 | 0.317 |
| Relative colour temperature | 6677.2 | 4707.76 | 5195.9 | 4962.1 |
| Color rendering | 74.3 | 84.4 | 81.4 | 83.6 |
Please cooperate Fig. 2 C to reach shown in the Correlated Case with ARMA Measurement data that go up in the table; After the 6500K white light beam that the yellow light beam of 3500K that this first group of ray structure N1 produced and this second group of ray structure N2 are produced was carried out mixed light, this light-mixed type package structure for LED M then produced 4 groups of (A, B, C, D) mixed light effects in as above showing.
See also shown in Fig. 2 D and Fig. 2 E, according to different design requirements, each circulating type frame colloid 30 all can be fluorescent colloid.In other words; The present invention can optionally add fluorescent material along with different demands in each circulating type frame colloid 30, and then reduces at least one first printing opacity packing colloid 40a of this encapsulation unit 4 and the blanking bar situation between at least one second printing opacity packing colloid 40b.
See also shown in Fig. 3 A to Fig. 3 E; Third embodiment of the invention provides five groups of light-mixed type package structure for LED (M1 to M5) that can improve color rendering and brightness, and each group light-mixed type package structure for LED (M1 to M5) is made up of at least one first group of ray structure N1 and at least one second group of ray structure N2.
For example: first group of light-mixed type package structure for LED M1 is made up of one first group of ray structure N1 and one second group of ray structure N2 serial connection.Second group of light-mixed type package structure for LED M2 alternately is connected in series institute by two first group of ray structure N1 and two second group of ray structure N2 and forms.The 3rd group of light-mixed type package structure for LED M3 alternately is connected in series institute by two first group of ray structure N1 and two second group of ray structure N2 and forms.The 4th group of light-mixed type package structure for LED M4 is made up of two first group of ray structure N1 and second group of ray structure N2 serial connection, and this second group of ray structure N2 is between above-mentioned two first group of ray structure N1.The 5th group of light-mixed type package structure for LED M5 is made up of first group of ray structure N1 and two second group of ray structure N2 serial connections, and this first group of ray structure N1 is between above-mentioned two second group of ray structure N2.
Following table is first group of ray structure N1 (3500K), second group of ray structure (6500K) N2, and the Correlated Case with ARMA Measurement data of the light source that (3500K+6500K) produced of five groups of light-mixed type package structure for LED (M1 to M5) after third embodiment of the invention imports 200 milliamperes (mA):
| Group | N1 | N2 | M1 | M2 | M3 | M4 | M5 |
| Luminous flux | 105.68 | 146.44 | 124.10 | 122.60 | 130.72 | 143.25 | 112.60 |
| Luminous efficiency | 43.745 | 60.544 | 51.316 | 49.884 | 53.496 | 59.199 | 46.686 |
| CIE?x | 0.381 | 0.311 | 0.367 | 0.367 | 0.362 | 0.351 | 0.343 |
| CIE?y | 0.338 | 0.344 | 0.381 | 0.374 | 0.374 | 0.374 | 0.323 |
| Relative colour temperature | 3644.7 | 6509.9 | 4418.1 | 4379.9 | 4528.8 | 4887.3 | 4987.1 |
| Color rendering | 81.206 | 77.290 | 78.559 | 78.606 | 78.639 | 76.730 | 84.692 |
Please cooperate Fig. 3 F to reach shown in the Correlated Case with ARMA Measurement data that go up in the table; After the 6500K white light beam that the yellow light beam of 3500K that this first group of ray structure N1 produced and this second group of ray structure N2 are produced was carried out mixed light, above-mentioned five groups of light-mixed type package structure for LED (M1 to M5) then produced 5 groups of (M1, M2, M3, M4, M5) mixed light effects in as above showing.
See also shown in Fig. 3 G, according to different design requirements, each circulating type frame colloid 30 all can be fluorescent colloid.In other words; The present invention can optionally add fluorescent material along with different demands in each circulating type frame colloid 30, and then reduces at least one first printing opacity packing colloid 40a of this encapsulation unit 4 and the blanking bar situation between at least one second printing opacity packing colloid 40b.
See also shown in Fig. 4 A to Fig. 4 B, fourth embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.
Fourth embodiment of the invention and maximum different being of first embodiment: in the 4th embodiment; This frame unit 3 has at least one first circulating type frame colloid 30a and at least one second circulating type frame colloid 30b that forms in these substrate body 10 upper surfaces through the mode of coating around ground; Wherein above-mentioned at least one first circulating type frame colloid 30a is around above-mentioned at least one first light emitting module 2a; To form at least one spacing space 300a of first colloid that is positioned at these substrate body 10 tops; And above-mentioned at least one second circulating type frame colloid 30b is around above-mentioned at least one second light emitting module 2b and above-mentioned at least one first circulating type frame colloid 30a, and is at least one above this substrate body 10 and the spacing space 300b of second colloid between above-mentioned at least one first circulating type frame colloid 30a and above-mentioned at least one second circulating type frame colloid 30b to form.
In addition; This encapsulation unit 4 has and forms at least one first printing opacity packing colloid 40a and at least one second printing opacity packing colloid 40b of these substrate body 10 upper surfaces to cover above-mentioned at least one first light emitting module 2a and above-mentioned at least one second light emitting module 2b respectively; Wherein above-mentioned at least one first printing opacity packing colloid 40a is limited in the spacing space 300a of above-mentioned at least one first colloid, and above-mentioned at least one second printing opacity packing colloid 40b is limited in the spacing space 300b of above-mentioned at least one second colloid.In addition; Above-mentioned at least one first circulating type frame colloid 30a and above-mentioned at least one second circulating type frame colloid 30b are arranged in a concentric circles, and above-mentioned at least one second light emitting module 2b is arranged between above-mentioned at least one first circulating type frame colloid 30a and the above-mentioned at least one second circulating type frame colloid 30b.
Moreover; The upper surface of above-mentioned at least one first circulating type frame colloid 30a is a circular arc; Above-mentioned at least one first circulating type frame colloid 30a with respect to the angle of the circular arc tangential line of these substrate body 10 upper surfaces between 40 to 50 degree; The end face of above-mentioned at least one first circulating type frame colloid 30a with respect to the height of these substrate body 10 upper surfaces between 0.3 to 0.7mm; The width of above-mentioned at least one first circulating type frame colloid 30a bottom is between 1.5 to 3mm; The thixotropic index (thixotropic index) of above-mentioned at least one first circulating type frame colloid 30a is between 4 to 6, and above-mentioned at least one first circulating type frame colloid 30a one is mixed with the white hot sclerosis frame colloid of inorganic additive.
In addition; The upper surface of above-mentioned at least one second circulating type frame colloid 30b is a circular arc; Above-mentioned at least one second circulating type frame colloid 30b with respect to the angle of the circular arc tangential line of these substrate body 10 upper surfaces between 40 to 50 degree; The end face of above-mentioned at least one second circulating type frame colloid 30b with respect to the height of these substrate body 10 upper surfaces between 0.3 to 0.7mm; The width of above-mentioned at least one second circulating type frame colloid 30b bottom is between 1.5 to 3mm; The thixotropic index (thixotropic index) of above-mentioned at least one second circulating type frame colloid 30b is between 4 to 6, and above-mentioned at least one second circulating type frame colloid 30b one is mixed with the white hot sclerosis frame colloid of inorganic additive.
Following table is first group of ray structure N1 (3500K), second group of ray structure (6500K) N2, and the Correlated Case with ARMA Measurement data (wherein the radius (r) of the first circulating type frame colloid 30a of first group of ray structure N1 be 11mm in the A group, and the radius of the first circulating type frame colloid 30a of first group of ray structure N1 was 14mm during B organized) of the light source that produced of two groups of (A, B) light-mixed type package structure for LED M (3500K+6500K) after fourth embodiment of the invention imports 700 milliamperes (mA):
| Group | N1 | N2 | A(r＝11) | B(r＝14) |
| Luminous flux | 340.803 | 520.119 | 506.553 | 421.540 |
| Luminous efficiency | 40.357 | 62.039 | 60.540 | 50.257 |
| CIE?x | 0.3656 | 0.3126 | 0.3198 | 0.3381 |
| CIE?y | 0.3116 | 0.3530 | 0.3104 | 0.3119 |
| Relative colour temperature | 3882.6 | 6355.9 | 6226.5 | 5180.5 |
| Color rendering | 82.575 | 75.726 | 83.940 | 85.516 |
Please cooperate Fig. 4 C to reach shown in the Correlated Case with ARMA Measurement data that go up in the table; After the 6500K white light beam that the yellow light beam of 3500K that this first group of ray structure N1 produced and this second group of ray structure N2 are produced was carried out mixed light, this light-mixed type package structure for LED M then produced 2 groups of (A, B) mixed light effects in as above showing.
See also shown in Figure 5ly, fifth embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness, and it is made up of first group of ray structure N1 and second group of ray structure N2.In addition, the maximum difference of fifth embodiment of the invention and the 4th embodiment is: in the 5th embodiment, put upside down each other the position of this first group of ray structure N1 and this second group of ray structure N2.Therefore; The present invention can be along with designer's demand, is arranged at inner ring and second group of ray structure N2 of high colour temperature is arranged at outer ring (shown in the 4th embodiment) and maybe will hang down first group of ray structure N1 of colour temperature and be arranged at the outer ring and second group of ray structure N2 of high colour temperature is arranged at inner ring (shown in the 5th embodiment) and will hang down first group of ray structure N1 of colour temperature.
See also shown in Fig. 6 A to Fig. 6 B, sixth embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Sixth embodiment of the invention and maximum different being of the 4th embodiment: in the 6th embodiment, according to different design requirements, above-mentioned at least one first circulating type frame colloid 30a and above-mentioned at least one second circulating type frame colloid 30b all can be fluorescent colloid.In other words; The present invention can optionally add fluorescent material along with different demands in above-mentioned at least one first circulating type frame colloid 30a and above-mentioned at least one second circulating type frame colloid 30b; So that light source can be led between above-mentioned at least one first printing opacity packing colloid 40a and the above-mentioned at least one second printing opacity packing colloid 40b, and then reduce the blanking bar situation between above-mentioned at least one first printing opacity packing colloid 40a and the above-mentioned at least one second printing opacity packing colloid 40b.
See also shown in Figure 7ly, seventh embodiment of the invention provides a kind of light-mixed type package structure for LED M that can improve color rendering and brightness, and it comprises: a base board unit 1, a luminescence unit, a frame unit 3 and an encapsulation unit 4.Seventh embodiment of the invention and maximum different being of the 4th embodiment: in the 7th embodiment; According to different design requirements; Above-mentioned at least one first circulating type frame colloid 30a is a fluorescent colloid, and above-mentioned at least one second circulating type frame colloid 30b is reflective colloid.In other words, the present invention can optionally add fluorescent material along with different demands in above-mentioned at least one first circulating type frame colloid 30
A; So that light source can be led between above-mentioned at least one first printing opacity packing colloid 40a and the above-mentioned at least one second printing opacity packing colloid 40b, and then reduce the blanking bar situation between above-mentioned at least one first printing opacity packing colloid 40a and the above-mentioned at least one second printing opacity packing colloid 40b.In addition, be the technology of reflective colloid through above-mentioned at least one second circulating type frame colloid 30b, so that the light source that this light-mixed type package structure for LED M is launched can obtain the effect of optically focused.
In sum, the present invention connects or is connected in parallel with the light-emitting diode that can produce low colour temperature through the light-emitting diode that can produce high colour temperature, can improve the light-mixed type package structure for LED of color rendering and brightness to produce.
In addition; The mode of the present invention through coating be shaped one can be arbitrary shape circulating type frame colloid (circulating type white colloid); And with position of limiting to a printing opacity packing colloid (fluorescent colloid) and the surface configuration of adjusting this printing opacity packing colloid, therefore package structure for LED of the present invention can improve the luminous efficiency of LED crystal particle and the rising angle of control LED crystal particle through this circulating type frame colloid.In other words, by means of the use of this circulating type frame colloid, so that this printing opacity packing colloid is limited in the spacing space of this colloid, and then the use amount and the position of this printing opacity packing colloid of may command; Moreover,, and then control the rising angle of the white light beam that those LED crystal particles produce with the surface configuration of adjusting this printing opacity packing colloid and height by means of the use amount and the position of this printing opacity packing colloid of control; In addition; The present invention also can be by means of the use of this circulating type frame colloid; So that the light beam that those LED crystal particles produced projects the inwall of this circulating type frame colloid and produces reflection, and then can increase the luminous efficiency of package structure for LED of the present invention.
But; All scopes of the present invention should with claim be as the criterion; All closing in the embodiment of the spirit variation similar of claim of the present invention with it; All should be contained in the category of the present invention, any those of ordinary skills can think easily and variation or revise the claim scope all can be encompassed in this case.
Claims (10)
1. the light-mixed type package structure for LED that can improve color rendering and brightness is characterized in that, comprising:
One base board unit, it has at least one substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles on the wherein crystal area that is arranged at this base board unit electrically, and above-mentioned at least one second light emitting module has many second LED crystal particles on the other crystal area that is arranged at this base board unit electrically;
One frame unit; It has at least two circulating type frame colloids that form in this substrate body upper surface through the mode of coating around ground; Wherein above-mentioned at least two circulating type frame colloids are respectively around above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module, to form at least two spacing spaces of colloid that are positioned at this substrate body top respectively; And
One encapsulation unit; It has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively, and wherein above-mentioned at least one first printing opacity packing colloid and above-mentioned at least one second printing opacity packing colloid are limited in respectively in the spacing space of above-mentioned two colloids at least.
2. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 1; It is characterized in that: each first LED crystal particle is a blue LED crystal grain; Above-mentioned at least one first printing opacity packing colloid is one to have the fluorescent colloid of one first color, and the light beam that those first LED crystal particles are produced passes above-mentioned at least one first printing opacity packing colloid to produce the yellow light beam that colour temperature is about 3500K; Each second LED crystal particle is a blue LED crystal grain; Above-mentioned at least one second printing opacity packing colloid is one to have the fluorescent colloid of one second color, and the light beam that those second LED crystal particles are produced passes above-mentioned at least one second printing opacity packing colloid to produce the white light beam that colour temperature is about 6500K.
3. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 1 is characterized in that: second kind of colour temperature that first kind of colour temperature that above-mentioned at least one first light emitting module is produced produced less than above-mentioned at least one second light emitting module; Above-mentioned at least two circulating type frame colloids are all fluorescent colloid; Above-mentioned at least two circulating type frame colloids are separated from one another or link together, and above-mentioned at least two circulating type frame colloids are one another in series or parallel connection.
4. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 1; It is characterized in that: the upper surface of each circulating type frame colloid is a circular arc; Each circulating type frame colloid with respect to the angle of the circular arc tangential line of this substrate body upper surface between 40 to 50 degree; The end face of each circulating type frame colloid with respect to the height of this substrate body upper surface between 0.3 to 0.7mm; The width of each circulating type frame colloid bottom is between 1.5 to 3mm; The thixotropic index of each circulating type frame colloid is between 4 to 6, and each circulating type frame colloid is one to be mixed with the white hot sclerosis frame colloid of inorganic additive.
5. the light-mixed type package structure for LED that can improve color rendering and brightness is characterized in that, comprising:
One base board unit, it has at least one substrate body and at least two crystal areas that are arranged at this substrate body upper surface;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles on the wherein crystal area that is arranged at this base board unit electrically, and above-mentioned at least one second light emitting module has many second LED crystal particles on the other crystal area that is arranged at this base board unit electrically;
One frame unit; It has at least one first circulating type frame colloid and at least one second circulating type frame colloid that forms in this substrate body upper surface through the mode of coating around ground; Wherein above-mentioned at least one first circulating type frame colloid is around above-mentioned at least one first light emitting module; To form at least one spacing space of first colloid that is positioned at this substrate body top; And above-mentioned at least one second circulating type frame colloid is at least one in above this substrate body and the spacing space of second colloid between above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid to form around above-mentioned at least one second light emitting module and above-mentioned at least one first circulating type frame colloid; And
One encapsulation unit; It has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this substrate body upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein above-mentioned at least one first printing opacity packing colloid is limited in the spacing space of above-mentioned at least one first colloid, and above-mentioned at least one second printing opacity packing colloid is limited in the spacing space of above-mentioned at least one second colloid.
6. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 5 is characterized in that: first kind of colour temperature that above-mentioned at least one first light emitting module is produced less than or second kind of colour temperature being produced greater than above-mentioned at least one second light emitting module; Above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid are arranged in a concentric circles, and above-mentioned at least one second light emitting module is arranged between above-mentioned at least one first circulating type frame colloid and the above-mentioned at least one second circulating type frame colloid.
7. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 5; It is characterized in that: above-mentioned at least one first circulating type frame colloid is a fluorescent colloid, and above-mentioned at least one second circulating type frame colloid is fluorescent colloid or reflective colloid.
8. the light-mixed type package structure for LED that can improve color rendering and brightness is characterized in that, comprising:
One base board unit;
One luminescence unit; It has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature; Wherein above-mentioned at least one first light emitting module has many first LED crystal particles that are arranged at electrically on this base board unit, and above-mentioned at least one second light emitting module has many second LED crystal particles that are arranged at electrically on this base board unit;
One frame unit; It has at least one first circulating type frame colloid and at least one second circulating type frame colloid that forms in this base board unit upper surface; Wherein above-mentioned at least one first circulating type frame colloid is around above-mentioned at least one first light emitting module; To form at least one spacing space of first colloid that is positioned at this base board unit top; And above-mentioned at least one second circulating type frame colloid is at least one in above this base board unit and the spacing space of second colloid between above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid to form around above-mentioned at least one second light emitting module and above-mentioned at least one first circulating type frame colloid; And
One encapsulation unit; It has and forms at least one first printing opacity packing colloid and at least one second printing opacity packing colloid of this base board unit upper surface to cover above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively; Wherein above-mentioned at least one first printing opacity packing colloid is limited in the spacing space of above-mentioned at least one first colloid, and above-mentioned at least one second printing opacity packing colloid is limited in the spacing space of above-mentioned at least one second colloid.
9. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 8; It is characterized in that: above-mentioned at least one first circulating type frame colloid and above-mentioned at least one second circulating type frame colloid are arranged in a concentric circles, and above-mentioned at least one second light emitting module is arranged between above-mentioned at least one first circulating type frame colloid and the above-mentioned at least one second circulating type frame colloid.
10. the light-mixed type package structure for LED that can improve color rendering and brightness as claimed in claim 8; It is characterized in that: above-mentioned at least one first circulating type frame colloid is a fluorescent colloid, and above-mentioned at least one second circulating type frame colloid is fluorescent colloid or reflective colloid.
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| CN102157509B (en) * | 2010-02-12 | 2012-11-28 | 柏友照明科技股份有限公司 | Light mixing type light-emitting diode encapsulation structure capable of improving color rendering |
| CN103165589A (en) * | 2011-12-08 | 2013-06-19 | 东莞柏泽光电科技有限公司 | Mixed light type polycrystal packaging structure |
| JP2013229492A (en) * | 2012-04-26 | 2013-11-07 | Panasonic Corp | Light emitting module, lamp unit, and lighting device |
| CN102720967A (en) * | 2012-06-08 | 2012-10-10 | 佛山市中昊光电科技有限公司 | Color-temperature-adjustable high-color-rendering light source module |
| CN103715186A (en) * | 2013-04-12 | 2014-04-09 | 弘凯光电(深圳)有限公司 | Multi-chip packaging structure for generating symmetrical uniform mixed light source |
| CN103715187A (en) * | 2013-04-12 | 2014-04-09 | 弘凯光电(深圳)有限公司 | Multi-chip packaging structure for generating symmetrical uniform mixed light source |
| CN103928594A (en) | 2014-03-21 | 2014-07-16 | 京东方科技集团股份有限公司 | Light-emitting device |
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