[White paper] COM-HPC Mini — a game changer in the electronics space
Supplied by Congatec on Wednesday, 20 November, 2024
The COM-HPC specification 1.2 is now ratified, introducing COM-HPC Mini to the market. First modules based on this spec are available. Since modules alone don't provide OEMs with the agility to optimize and expand their solutions, a next-gen COM-HPC ecosystem was created, helping developers of ultra-compact high-performance systems solve the challenge of fitting high performance into a mini footprint.
Learn how the COM-HPD mini module is set to revolutionize electronic manufacturing. Discover how to harness this latest technology to enhance your electronic products.
Related White Papers
Digital printing for electronic enclosures & front panels
Learn about digital printing for electronic...
Deliver next-level capability, speed and performance
Learn how AME enables 3D heterogeneous integration...
High-density, modular PDNs optimise mobile robot performance
High-density, modular PDNs optimise mobile robot...
