Kim et al., 2008 - Google Patents
Novel optical transmitter using organic substrate for optical interconnectionKim et al., 2008
- Document ID
- 7076935096288006680
- Author
- Kim H
- Im Y
- Publication year
- Publication venue
- 2008 Asia Optical Fiber Communication & Optoelectronic Exposition & Conference
External Links
Snippet
Novel Optical Transmitter Using Organic Substrate for Optical Interconnection Page 1 © 2008
OSA / AOE 2008 SaK21.pdf Novel Optical Transmitter Using Organic Substrate for Optical
Interconnection Hwekyung Kim and Young-Min 1m Korea Electronics Technology Institute, #68 …
- 230000003287 optical 0 title abstract description 30
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections ; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/10—Light guides of the optical waveguide type
- G02B6/12—Light guides of the optical waveguide type of the integrated circuit kind
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting lasers (SE-lasers)
- H01S5/183—Surface-emitting lasers (SE-lasers) having a vertical cavity (VCSE-lasers)
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5777355B2 (en) | System and method | |
CN102692685B (en) | Optoelectronic module | |
US8641299B2 (en) | Optical connector | |
Rho et al. | PCB-compatible optical interconnection using 45-ended connection rods and via-holed waveguides | |
US7306378B2 (en) | Method and apparatus providing an electrical-optical coupler | |
JP5439080B2 (en) | Optical I / O array module | |
US20060045418A1 (en) | Optical printed circuit board and optical interconnection block using optical fiber bundle | |
US11764878B2 (en) | LED chip-to-chip vertically launched optical communications with optical fiber | |
US20030108300A1 (en) | Method and system for releasing a pluggable module | |
Ishii et al. | SMT-compatible large-tolerance" OptoBump" interface for interchip optical interconnections | |
EP1975659A1 (en) | Photoelectric conversion module for direct optical interconnection and method of manufacturing the same | |
US8348522B2 (en) | Attachable components for providing an optical interconnect between/through printed wiring boards | |
US8644712B2 (en) | Opto-electronic transceiver module with housing having thermally conductive protrusion | |
Hwang et al. | Two-dimensional optical interconnection based on two-layered optical printed circuit board | |
US10928599B2 (en) | Optical sub-assembly for a module communicating over optical fiber, with a device for optical coupling aligned in a passive manner | |
US20220003944A1 (en) | Optical module | |
Lau et al. | Embedded 3D hybrid IC integration system-in-package (SiP) for opto-electronic interconnects in organic substrates | |
Kim et al. | Novel optical transmitter using organic substrate for optical interconnection | |
Chou et al. | Modeling, design, and demonstration of ultra-miniaturized and high efficiency 3D glass photonic modules | |
US9395503B2 (en) | Optical-electric coupling element and optical connector using same | |
JP2009069186A (en) | Optoelectronic circuit board | |
Suzuki et al. | Low-cost optical subassembly using VCSEL pre-self-aligned with optical fiber for optical interconnect applications | |
Bockstaele et al. | A parallel optical interconnect link with on-chip optical access | |
JP2021067851A (en) | Optical transceiver | |
US20230129104A1 (en) | Visible led-based flex waveguide interconnects |