Thomas et al., 2008 - Google Patents
A power-efficient impoved-stability 6T SRAM cell in 45nm Multi-Channel FET technologyThomas et al., 2008
- Document ID
- 5555585879542573575
- Author
- Thomas O
- Guillaumot B
- Ernst T
- Cousin B
- Rozeau O
- Publication year
- Publication venue
- ESSDERC 2008-38th European Solid-State Device Research Conference
External Links
Snippet
This paper presents an innovative 3D CMOS 6T SRAM cell design in multi-channel (MC) FET technology by well adapting the number of channels per device. A simulation model for the 45 nm MCFET has been developed based on silicon measurements. The electrical …
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Si] 0 abstract description 31
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
- H01L27/11—Static random access memory structures
- H01L27/1112—Static random access memory structures the load element being a resistor
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Complementary MIS field-effect transistors
- H01L27/0924—Complementary MIS field-effect transistors including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
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