WO2023127490A1

WO2023127490A1 - Inspection device and inspection method

Info

Publication number: WO2023127490A1
Application number: PCT/JP2022/045925
Authority: WO
Inventors: 知基糠信; 朋也遠藤; 顕太朗小西; 大紀鹿川; 裕昭坂本
Original assignee: 東京エレクトロン株式会社
Priority date: 2021-12-27
Filing date: 2022-12-13
Publication date: 2023-07-06
Also published as: KR20240124986A; JP2023097019A; CN118402050A

Abstract

An inspection device for inspecting a substrate is provided, comprising: a mounting member on which a substrate is mounted; a holding unit that holds a probe card having a probe that contacts an electrode on the substrate; a moving mechanism that holds and moves the mounting member; an imaging unit including a first imaging unit that recognizes the substrate mounted on the mounting member, and a second imaging unit that recognizes the probe of the probe card being held by the holding unit, the first imaging unit and the second imaging unit being fixed to a common housing; and an imaging moving mechanism that moves the housing of the imaging unit. The positions of the substrate mounted on the mounting member and the probe of the probe card are aligned on the basis of the result of imaging performed by the first imaging unit and the second imaging unit in a state in which the mounting member with the substrate mounted thereon is positioned under the probe card being held by the holding unit.

Description

Inspection device and inspection method

The present disclosure relates to an inspection device and an inspection method.

Patent Literature 1 discloses an inspection device that moves a wafer placed on an alignment stage to a position where it contacts the probes of a probe card. This inspection apparatus includes a step of acquiring card barycentric coordinates of a probe card with a first acquisition unit on the aligner side, and a step of acquiring reference coordinates in a target coordinate system of a reference target provided on a pogo frame with the first acquisition unit. , and execute the process including. In addition, the inspection apparatus includes a step of acquiring common coordinates between the second acquiring unit and the first acquiring unit on the pogo frame side, a step of acquiring wafer barycentric coordinates in the second acquiring unit, card barycentric coordinates, common coordinates, and moving the aligner with a command including the contact coordinates determined based on the barycentric coordinates of the wafer.

Japanese Patent Application Laid-Open No. 2021-166228

The technology according to the present disclosure more accurately aligns the substrate and the probes of the probe card in an inspection apparatus that inspects the substrate.

One aspect of the present disclosure is an inspection apparatus for inspecting a substrate, comprising: a mounting member on which the substrate is mounted; a holding unit that holds a probe card having probes that contact electrodes on the substrate; a moving mechanism for holding and moving a member, a first imaging unit for recognizing the substrate placed on the placing member, and a second imaging unit for recognizing the probe of the probe card held by the holding part. and an imaging section in which the first imaging unit and the second imaging unit are fixed to a common housing, and an imaging moving mechanism for moving the housing of the imaging section, wherein the holding section includes Based on the results of imaging by the first imaging unit and the second imaging unit in a state in which the mounting member on which the substrate is placed is located below the held probe card, Alignment is performed between the placed substrate and the probes of the probe card.

According to the present disclosure, in an inspection apparatus that inspects a substrate, alignment between the substrate and the probes of the probe card can be performed more accurately.

It is a figure for demonstrating the alignment method concerning a form of comparison. It is a figure for demonstrating the alignment method concerning a form of comparison. It is a cross-sectional view showing the outline of the configuration of the inspection apparatus according to the present embodiment. It is a longitudinal section showing an outline of composition of an inspection device concerning this embodiment. FIG. 4 is a side cross-sectional view of one sub-area of the inspection area; 3 is a perspective view of a housing of an imaging unit; FIG. FIG. 4 is a cross-sectional view of the periphery of the pogo frame; It is a top view of an imaging part. FIG. 5 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;

In the semiconductor manufacturing process, a large number of semiconductor devices with predetermined circuit patterns are formed on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). The semiconductor devices thus formed are inspected for electrical characteristics and the like, and sorted into non-defective products and defective products. Semiconductor devices are inspected, for example, by using an inspection apparatus in a state of a wafer before being divided into semiconductor devices.

The inspection device is provided with a probe card having a large number of probes that are needle-shaped contact terminals. When inspecting the electrical characteristics, first, the wafer and the probe card are brought close to each other, and the probes of the probe card contact each electrode of the semiconductor device formed on the wafer. In this state, an electrical signal is supplied to the semiconductor device through each probe from a tester provided above the probe card. Based on the electrical signal received by the tester from the semiconductor device via each probe, it is determined whether or not the semiconductor device is defective.

In order to properly perform such electrical property inspection, the inspection apparatus aligns the probes of the probe card and the wafer, more specifically, aligns the probes with the electrodes on the wafer.

As shown in FIG. 1, the inspection apparatus 500 has, for example, a pogo frame 502 that holds a probe card 501, a chuck top 503 on which a wafer W is placed, and an aligner 504 that moves the chuck top 503. Also, the inspection apparatus 500 has an upper camera 510 for wafer recognition provided in a region that does not overlap the probe card 501 in plan view, and a lower camera 511 for probe card recognition is fixed to the aligner 504 . In this inspection apparatus 500, for example, the probes 501a of the probe card 501 and the wafer W on the chuck top 503 are aligned based on the following imaging results.
・Results of imaging of the probe card 501 by the lower camera 511 when the lower camera 511 is moved below the probe card 501 as shown in FIG. 1 ・As shown in FIG. Imaging result of wafer W on chuck top 503 by upper camera 510 in a state where chuck top 503 is moved below upper camera 510 located in an area where

However, the above alignment method has room for improvement in terms of time required for alignment and alignment accuracy.

The technology according to the present disclosure enables a board inspection device to accurately align a board and probes of a probe card in a short time.

The inspection apparatus and inspection method according to this embodiment will be described below with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, thereby omitting redundant description.

<Inspection device>
3 and 4 are a cross-sectional view and a vertical cross-sectional view, respectively, showing the outline of the configuration of the inspection apparatus according to this embodiment.

The inspection apparatus 1 shown in FIGS. 3 and 4 inspects a wafer W as a substrate, and more specifically, inspects the electrical characteristics of semiconductor devices formed on the wafer W as devices to be inspected. be. The inspection apparatus 1 has a housing 10 , and the housing 10 is provided with a loading/unloading area 11 , a transport area 12 and an inspection area 13 . The loading/unloading area 11 is an area where the wafer W is loaded/unloaded to/from the inspection apparatus 1 . The transport area 12 is an area that connects the loading/unloading area 11 and the inspection area 13 . Also, the inspection area 13 is an area where the electrical characteristics of the semiconductor devices formed on the wafer W are inspected.

The loading/unloading area 11 is provided with a port 20 for receiving a cassette C containing a plurality of wafers W, a loader 21 for containing a probe card described later, and a control unit 22 for controlling each component of the inspection apparatus 1. there is The control unit 22 is configured by a computer having a CPU, a memory, etc., and has a storage unit (not shown) that stores various information. The storage unit stores, for example, programs including commands for realizing inspection processing and the like. The program may be recorded in a computer-readable storage medium and installed in the control unit 22 from the storage medium. The storage medium may be temporary or non-temporary. Part or all of the program may be realized by dedicated hardware (circuit board). The storage unit is, for example, a storage device such as an HDD, a memory such as a RAM that temporarily stores necessary information related to program operations, or a combination thereof.

In the transfer area 12, a transfer device 30 that can freely move while holding a wafer W or the like is arranged. The transfer device 30 transfers the wafer W between the cassette C in the port 20 of the loading/unloading area 11 and the inspection area 13 . Further, the transport device 30 transports probe cards fixed to a pogo frame, which will be described later, in the inspection area 13 and requiring maintenance to the loader 21 in the loading/unloading area 11 . Further, the transport device 30 transports new or maintained probe cards from the loader 21 into the inspection area 13 .

A plurality of testers 40 are provided in the inspection area 13 . Specifically, for example, as shown in FIG. 4, the inspection area 13 is divided into three in the vertical direction (the Z direction in the figure) and two in the horizontal direction (the X direction in the figure). is provided with two testers 40 arranged horizontally. Further, an aligner 50 as a moving mechanism is provided for each tester 40 in each divided area 13a. Furthermore, one imaging unit 60 is provided in each divided area 13a. That is, in each divided area 13a, the imaging section 60 is provided so as to be shared by the testers 40 adjacent in the horizontal direction.
The number and arrangement of the testers 40, aligners 50, and imaging units 60 can be arbitrarily selected.

The tester 40 transmits and receives electrical signals to and from the wafer W for electrical characteristic inspection.
The aligner 50 holds a chuck top 70, which will be described later, and moves in the horizontal direction (the X direction and the Y direction in FIG. 4, the θ direction around the Z axis in FIG. 3) and the vertical direction (the Z direction in FIGS. 3 and 4). ). The aligner 50 is also used for alignment between the wafer W placed on the chuck top 70 and probes of a probe card, which will be described later.

The imaging unit 60 images both the probes of the probe card and the wafer W placed on the chuck top 70 .

The chuck top 70 is an example of a mounting member, on which the wafer W is mounted. The chuck top 70 can hold, for example, the mounted wafer W by suction or the like.

In this inspection apparatus 1, while the transfer apparatus 30 is transferring the wafer W toward one tester 40, the other tester 40 tests the electrical characteristics of the electronic devices formed on the other wafer W. be able to.

<Inspection area>
Next, a more detailed configuration of the inspection area 13 will be described with reference to FIGS. 5 to 8. FIG. FIG. 5 is a side sectional view of one divided area 13a of the inspection area 13. As shown in FIG. FIG. 6 is a perspective view of a later-described housing of the imaging unit 60. As shown in FIG. FIG. 7 is a cross-sectional view of the periphery of a pogo frame, which will be described later. FIG. 8 is a top view of the imaging unit 60. FIG.

Each divided area 13a of the inspection area 13 is provided with the aligner 50 and the imaging unit 60 as described above. Further, as shown in FIG. 5, each divided area 13a is provided with a pogo frame 80 and a probe card 90, which will be described later.

The aligner 50 has an X stage 51, a Y stage 52 and a Z stage 53, for example.

The X stage 51 moves along a guide rail 51a extending in the horizontal direction (X direction in the drawing). A drive unit (not shown) for driving the movement is provided for the X stage 51 . The driving section has, for example, a motor as a driving source that generates a driving force for the movement. Further, the X stage 51 is provided with a position detection mechanism (not shown) for detecting the position of the X stage 51 in the X direction, that is, the position of the chuck top 70 in the X direction. The position detection mechanism is, for example, a linear encoder.

The Y stage 52 moves on the X stage 51. Specifically, the Y stage 52 moves along a guide rail 52a extending in the horizontal direction (the Y direction in the drawing). A drive unit (not shown) for driving the movement is provided for the Y stage 52 . The driving section has, for example, a motor as a driving source that generates a driving force for the movement. Further, the Y stage 52 is provided with a position detection mechanism (not shown) for detecting the position of the Y stage 52 in the Y direction, that is, the position of the chuck top 70 in the Y direction. The position detection mechanism is, for example, a linear encoder.

The Z stage 53 moves vertically by means of a telescopic shaft 53a that is telescopic in the vertical direction (the Z direction in the drawing). A drive unit (not shown) for driving the movement is provided for the Z stage 53 . The driving section has, for example, a motor as a driving source that generates a driving force for the movement. Further, the Z stage 53 is provided with a position detection mechanism (not shown) for detecting the position of the Z stage 53 in the Z direction, that is, the position of the chuck top 70 in the Z direction. The position detection mechanism is, for example, a linear encoder.

Also, the chuck top 70 is detachably held by suction on the Z stage 53 . The chuck top 70 is held by the Z stage 53 by vacuum suction or the like by a suction holding mechanism (not shown).

The aligner 50 is controlled by the control unit 22. Specifically, the drive units of the X stage 51 , Y stage 52 and Z stage 53 of the aligner 50 are controlled by the control unit 22 . Position detection results obtained by the above-described position detection mechanisms provided on the X stage 51 , Y stage 52 and Z stage 53 are output to the control unit 22 .

The imaging unit 60 images both the probes 91 of the probe card 90 and the wafer W placed on the chuck top 70 as described above. The imaging unit 60 has a housing 60a. As shown in FIG. 6, both the first imaging unit 61 and the second imaging unit 62 are fixed to the housing 60a. In other words, in the imaging section 60, the first imaging unit 61 and the second imaging unit 62 are fixed to the common housing 60a. The first imaging unit 61 is provided in the lower part of the housing 60a, and the second imaging unit 62 is provided in the upper part of the housing 60a.

The first imaging unit 61 recognizes the wafer W placed on the chuck top 70 . Specifically, the first imaging unit 61 images the wafer W placed on the chuck top 70 in order to recognize the wafer W. As shown in FIG. The first imaging unit 61 has a macro view camera 61a for capturing images at low resolution and a micro view camera 61b for capturing images at high resolution.

The second imaging unit 62 recognizes the probes 91 of the probe card 90 . Specifically, the second imaging unit 62 images the probe 91 of the probe card 90 in order to recognize the probe 91 . The second imaging unit 62 has a macro-view camera 62a for imaging at low resolution and a micro-view camera 62b for imaging at high resolution.

In the imaging section 60, the first imaging unit 61 and the second imaging unit 62 are provided coaxially. Specifically, as shown in the figure, the optical axes P1a and P2a of the

macro-viewing cameras

61a and 62a are coaxial, and the optical axes P1b and P2b of the

micro-viewing cameras

61b and 62b are also coaxial.

Note that the imaging unit 60 is controlled by the control unit 22 . Also, the imaging result of the imaging unit 60 is output to the control unit 22 .

Furthermore, the imaging unit 60 is configured to be movable in the horizontal direction (XY direction in FIG. 5 etc.) and vertical direction (Z direction in FIG. 5 etc.) by the imaging movement mechanism 100 (see FIG. 8). Specifically, the housing 60 a of the imaging unit 60 is configured to be movable in the horizontal direction and the vertical direction by the imaging movement mechanism 100 . The imaging movement mechanism 100 will be described later.

The tester 40 has a tester motherboard 41 at its bottom, as shown in FIG. A plurality of inspection circuit boards (not shown) are mounted on the tester motherboard 41 in an upright state. A plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41 .
Furthermore, a pogo frame 80 is provided below the tester 40 .

The pogo frame 80 is an example of a holding section and holds the probe card 90 . Also, the pogo frame 80 electrically connects the probe card 90 and the tester 40 . This pogo frame 80 has pogo pins 81 for the electrical connection described above, and more specifically, has a pogo block 82 that holds a large number of pogo pins 81 .
A probe card 90 is fixed to the lower surface of the pogo frame 80 while being aligned at a predetermined position.

The tester motherboard 41 is vacuum-sucked to the pogo frame 80 by an exhaust mechanism (not shown), and the probe card 90 is vacuum-sucked to the pogo frame 80 . The lower end of each pogo pin 81 of the pogo frame 80 contacts the corresponding electrode on the upper surface of the card body 92 of the probe card 90, and the upper end of each pogo pin 81 It is pressed against the corresponding electrodes on the underside of the tester motherboard 41 .

The probe card 90 has a disk-shaped card body 92 with a plurality of electrodes provided on its upper surface. A plurality of probes 91, which are needle-like contact terminals extending downward, are provided on the lower surface of the card body 92. As shown in FIG.
The plurality of electrodes provided on the upper surface of the card body 92 are electrically connected to corresponding probes 91 respectively. During inspection, the probes 91 are brought into contact with electrodes (not shown) of semiconductor devices formed on the wafer W, respectively. Therefore, during the electrical characteristic inspection, electrical signals for inspection are transmitted and received between the tester mother board 41 and the semiconductor devices on the wafer W via the pogo pins 81, the electrodes provided on the upper surface of the card body 92, and the probes 91. be done.

Note that the inspection apparatus 1 is provided with a large number of probes 91 so as to cover substantially the entire lower surface of the card body 92 in order to collectively inspect the electrical characteristics of a plurality of semiconductor devices formed on the wafer W.

A bellows 83 is attached to the lower surface of the pogo frame 80 . The bellows 83 is a tubular extendable member that hangs down so as to surround the probe card 90 . Further, the bellows 83 sucks and holds the chuck top 70 at a position below the probe card 90 as indicated by the dotted line in FIG.

The bellows 83 sucks and holds the chuck top 70 to form a sealed space S surrounded by the pogo frame 80 including the probe card 90 , the bellows 83 and the chuck top 70 . The contact state between the wafer W and the probes 91 can be maintained by decompressing the sealed space S by a decompression mechanism (not shown).

As described above, the housing 60a of the imaging unit 60 is configured to be movable in the horizontal direction and the vertical direction by the imaging movement mechanism 100 of FIG.

The imaging movement mechanism 100 has a pair of guide rails 101 and a pair of movement rails 102 .

Each of the guide rails 101 is provided so as to extend along the horizontal direction (the X direction in the drawing). In one embodiment, the guide rail 101 is provided so as to connect the partition wall 10a separating the divided regions 13a having the same height and the side wall of the housing 10 of the inspection device 1 . Also, the pair of guide rails 101 are separated from each other so that the chuck top 70 can pass between the guide rails 101 .

A pair of moving rails 102 are provided so as to extend in a horizontal direction (the Y direction in the figure) orthogonal to the guide rails 101, and support the housing 60a of the image pickup unit 60 so as to extend along the guide rails 102. It is configured to be movable along rails 101 . A drive unit (not shown) for driving the movement is provided for the pair of moving rails 102 . The driving section has, for example, a motor as a driving source that generates a driving force for the movement. A position detection mechanism (not shown) detects the position of the pair of moving rails 102 in the X direction, that is, the position of the housing 60a of the imaging unit 60 in the X direction. is provided. The position detection mechanism is, for example, a linear encoder.

Further, the pair of moving rails 102 supports the housing 60a of the imaging unit 60 so as to be movable along the extending direction of the moving rails 102 (the Y direction in the drawing) and the vertical direction (the Z direction in the drawing). Between the housing 60a of the imaging unit 60 and the pair of moving rails 102, a driving unit (not shown) for driving the moving rails 102 in the extending direction and the vertical direction is provided. . The driving section has, for example, a motor as a driving source that generates a driving force for the movement. Further, a position detection mechanism (not shown) for detecting the position of the housing 60a in the direction in which the moving rail 102 extends and in the vertical direction is provided for the housing 60a of the imaging unit 60. FIG. The position detection mechanism is, for example, a linear encoder.

Note that the imaging movement mechanism 100 is controlled by the control unit 22 . Specifically, the control unit 22 controls the driving unit for the moving rail 102 and the housing 60a. Further, the position detection result by the above-described position detection mechanism provided on the moving rail 102 and the housing 60 a is output to the control section 22 .

<Inspection processing using inspection device 1>
Next, inspection processing involving contact position determination processing using the inspection apparatus 1 will be described with reference to FIG. 9 . The contact position is a position in the horizontal direction (X direction and Y direction in FIG. 5 etc.) of the chuck top 70 when the wafer W supported by the chuck top 70 and the probe 91 are brought into contact with each other.

(Step S1: Transport)
First, the wafer W to be inspected is transferred to the desired tester 40 .
Specifically, the transfer device 30 and the like are controlled by the control unit 22, and the wafer W is taken out from the cassette C in the port 20 of the loading/unloading area 11, loaded into the upper divided area 13a, for example, and sent to a desired tester. 40 is placed on the chuck top 70 sucked and held by the aligner 50 corresponding to 40 .

(Step S2: Movement of chuck top 70)
Next, as shown in FIG. 9, the chuck top 70 with the wafer W mounted thereon is moved below the probe card 90 .
Specifically, the controller 22 controls the aligner 50 to move the chuck top 70 on which the wafer W is placed to a predetermined temporary contact position.

(Step S3: Movement of imaging section 60)
Also, the imaging unit 60 is moved to a position between the probe card 90 and the chuck top 70 below the probe card 90 .
Specifically, the imaging moving mechanism 100 is controlled by the control unit 22, and the housing 60a of the imaging unit 60 is moved to the above position.
Steps S2 and S3 may be performed at the same time, regardless of the order of steps S2 and S3.

(Step S4: Imaging)
After that, images are captured by the first imaging unit 61 and the second imaging unit 62 from between the probe card 90 and the chuck top 70 . In other words, the control unit 22 acquires the representative position of the wafer W using the first imaging unit 61 positioned between the probe card 90 and the chuck top 70, and A representative position of the probe 91 is obtained using the second imaging unit 62 positioned in between.

Specifically, the representative position of the wafer W is acquired based on the imaging result of the first imaging unit 61 and the detection result of the position detection mechanism of the imaging movement mechanism 100 .
Further, the representative position of the wafer W is, for example, the center-of-gravity position of the electrodes at a plurality of predetermined positions on the wafer W. As shown in FIG. The approximate position of each electrode is obtained based on the images obtained by the macro-view camera 61a. Also, the exact position of each electrode is obtained based on the image obtained by the micro-field camera 61b. For example, the accurate position (specifically, the position coordinates) of each electrode can be obtained from the position detection mechanism of the imaging movement mechanism 100 when the center of the electrode is positioned at the center of the image obtained by the micro-view camera 61b. Based on the output, it can be obtained.

Specifically, the representative position of the probe 91 is acquired based on the imaging result of the second imaging unit 62 and the detection result of the position detection mechanism of the imaging movement mechanism 100 .
Further, the representative position of the probes 91 is, for example, the center-of-gravity positions of the probes 91 at a plurality of predetermined locations on the probe card 90 . The approximate position of each probe 91 is obtained based on the images obtained by the macro-view camera 62a. Also, the exact position of each probe 91 is obtained based on the image obtained by the micro-field camera 62b. For example, the exact position (specifically, the position coordinates) of each probe 91 can be determined by the position detection mechanism of the imaging movement mechanism 100 when the tip of the probe 91 is positioned at the center of the image obtained by the micro-view camera 62b. can be obtained based on the output from

(Step S5: alignment)
Next, the wafer W placed on the chuck top 70 and the probes 91 of the probe card 90 are aligned based on the imaging results of the first imaging unit 61 and the second imaging unit 62 . Specifically, the control unit 22 corrects the temporary contact position based on the imaging results of the first imaging unit 61 and the second imaging unit 62, and determines the corrected temporary contact position as the contact position. be. Then, the controller 22 controls the aligner 50 to move the chuck top 70 to the determined contact position.

Correction of the temporary contact positions is performed based on, for example, the representative positions of the wafer W and the representative positions of the probes 91 acquired in step S4. More specifically, the temporary contact position is corrected so that the positional deviation of the representative position of the wafer W from the representative position of the probe 91 is canceled.

(Step S6: Retreat of imaging section 60)
Further, the housing 60a of the imaging unit 60 is retracted to a region that does not overlap the chuck top 70 in plan view. Specifically, the imaging movement mechanism 100 is controlled by the control unit 22, and portions that can interfere with the casing 60a of the imaging unit 60 and the chuck tops 70 of the imaging movement mechanism 100 are adjacent chuck tops in the same divided area 13a. The area between 70 is saved.
Steps S5 and S6 may be performed at the same time, regardless of the order of steps S5 and S6.

(Step S7: Ascent of chuck top 70)
After that, the controller 22 controls the aligner 50 to raise the chuck top 70 . Lifting is performed until the wafer W and the probes 91 come into contact with each other.

At this time, the reference height of the chuck top 70, which serves as a reference for how far the chuck top 70 should be raised, is determined, for example, as follows.
That is, for example, when the representative position of the wafer W and the like are acquired in step S4, the height of the wafer W placed on the chuck top 70 (specifically, the height of the electrodes) and the height of the probes 91 are also The control unit 22 determines the reference height of the chuck top 70 from these heights.
The height of the wafer W placed on the chuck top 70 is acquired based on the imaging result of the first imaging unit 61 and the detection result of the position detection mechanism regarding the vertical position of the imaging moving mechanism 100. be.
Also, the height of the probe 91 is acquired based on the image pickup result of the second image pickup unit 62 and the detection result of the position detection mechanism regarding the vertical position of the image pickup movement mechanism 100 .

(Step S8: Adsorption of chuck top 70)
After that, the chuck top 70 is attracted to the pogo frame 80 under the control of the controller 22 .
Specifically, while the wafer W and the probes 91 are in contact with each other, a decompression mechanism (not shown) or the like is controlled and the Z stage 53 of the aligner 50 is lowered, whereby the chuck top 70 is It is separated from the aligner 50 and attached to the pogo frame 80 .

(Step S9: inspection)
After the chuck top 70 and the aligner 50 are separated, the electrical characteristics of the electronic devices formed on the wafer W are inspected.
An electrical signal for electrical characteristic inspection is input from the tester 40 to the electronic device via the pogo pins 81, the probes 91, and the like.

(Step S10: Unloading)
Thereafter, the wafer W after inspection is unloaded.
Specifically, the chuck top 70 sucked to the pogo frame 80 is delivered to and held by the aligner 50 . Also, the inspected wafer W on the chuck top 70 held by the aligner 50 is unloaded from the inspection area 13 by the transport device 30 and returned to the cassette C in the port 20 of the loading/unloading area 11 .
During the inspection by one tester 40 , the aligner 50 or the like transports the wafer W to be inspected to another tester 40 and recovers the wafer W after the inspection from the other tester 40 .

<Main effects of the present embodiment>
1 and 2 (hereinafter referred to as a comparative embodiment), the wafer W on the chuck top 503 in the inspection apparatus 500 and the probes 501a of the probe card 501 are aligned with each other in this embodiment. Similar to , the imaging result of the wafer W is used. However, in the comparative form, unlike the present embodiment, the chuck top 503 is positioned in a region that does not overlap the probe card 501 in plan view when the wafer W is imaged, and the contact position below the probe card 501 is a distance away. be. Therefore, if the frame in which the aligner 504 is installed is distorted, it may not be possible to accurately align the wafer W and the probes 501a in the comparison mode. In contrast, in this embodiment, the chuck top 70 is positioned at the contact position below the probe card 90 when the wafer W on the chuck top 70 is imaged. Therefore, even if the housing 10 in which the aligner 50 is installed is distorted, the wafer W and the probes 91 can be brought into contact more appropriately than in the comparative embodiment. That is, according to the present embodiment, alignment between the wafer W and the probes 91 of the probe card 90 can be performed more accurately. Note that the above-described distortion of the housing 10 and the like may occur on the order of μm due to, for example, expansion or contraction of the housing 10 due to temperature changes, changes in the center of gravity of the plurality of aligners 50 within the housing 10, and the like.

Also, in this embodiment, it is not necessary to move the chuck top 70 significantly between the imaging of the wafer W on the chuck top 70 and the imaging of the probe 91, as compared with the comparative embodiment. Therefore, according to this embodiment, it is possible to shorten the time required for alignment between the wafer W and the probes 91 . Also, in the comparison mode, it may be necessary to image a common target with the upper camera 510 and the lower camera 511 . In the present embodiment, such imaging is not necessary, so from this point of view as well, the time required for alignment can be shortened.

Furthermore, in the present embodiment, the imaging unit 60 is provided so as to be shared among the plurality of testers 40 arranged in the horizontal direction, that is, among the pogo frames 80 . Specifically, the imaging unit 60 is provided so as to be shared between the horizontally adjacent testers 40 , that is, between the pogo frames 80 . Therefore, the cost can be reduced and the footprint of the inspection apparatus 1 can be reduced compared to the case where the imaging unit 60 is provided for each tester 40 , that is, for each pogo frame 80 .

<Modification>
In the above example, the first imaging unit 61 and the second imaging unit 62 are provided coaxially, but the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62 may be shifted. In this case, the contact position is determined, for example, as follows. That is, the temporary contact position after being corrected based on the imaging results of the first imaging unit 61 and the second imaging unit 62 is the positional relationship between the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62. and the corrected and calibrated provisional contact position is determined as the contact position.
However, it is difficult to accurately grasp the positional relationship between the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62 when they are misaligned. Change. Therefore, if the first imaging unit 61 and the second imaging unit 62 are provided coaxially, the calibration as described above is unnecessary, and the appropriate contact position can be obtained more reliably. alignment can be performed more reliably.

The embodiments disclosed this time should be considered illustrative in all respects and not restrictive. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

1 inspection device 50 aligner 60 imaging unit 60a housing 61 first imaging unit 62 second imaging unit 70 chuck top 80 pogo frame 90 probe card 91 probe 100 imaging movement mechanism W wafer

Claims

An inspection device for inspecting a substrate,
a mounting member on which the substrate is mounted;
a holder that holds a probe card having probes that contact electrodes on the substrate;
a moving mechanism that holds and moves the placement member;
a first imaging unit for recognizing the substrate placed on the mounting member; and a second imaging unit for recognizing the probe of the probe card held by the holding part, wherein the first imaging unit and an imaging unit in which the second imaging unit is fixed to a common housing;
an imaging movement mechanism for moving the housing of the imaging unit,
Based on the imaging result by the first imaging unit and the second imaging unit in a state where the mounting member on which the substrate is mounted is positioned below the probe card held by the holding part, An inspection apparatus that aligns a substrate placed on a placement member and the probes of the probe card.
2. The inspection apparatus according to claim 1, wherein said first imaging unit and said second imaging unit are provided coaxially.
A plurality of the holding portions are arranged in a horizontal direction,
3. The inspection apparatus according to claim 1, wherein said imaging section is provided so as to be shared among a plurality of said holding sections arranged in the horizontal direction.
4. The inspection apparatus according to any one of claims 1 to 3, wherein said imaging movement mechanism moves said housing of said imaging unit in horizontal and vertical directions.
5. The inspection apparatus according to any one of claims 1 to 4, wherein said first imaging unit has a camera for imaging at low resolution and a camera for imaging at high resolution.
6. The inspection apparatus according to any one of claims 1 to 5, wherein said second imaging unit has a camera for imaging at low resolution and a camera for imaging at high resolution.
An inspection method for inspecting a substrate with an inspection device,
The inspection device
a mounting member on which the substrate is mounted;
a holder that holds a probe card having probes that contact electrodes on the substrate;
a first imaging unit for recognizing the substrate placed on the mounting member; and a second imaging unit for recognizing the probe of the probe card held by the holding part, wherein the first imaging unit and an imaging unit in which the second imaging unit is fixed to a common housing,
a step of moving the mounting member on which the substrate is mounted below the probe card held by the holding portion;
Thereafter, a step of performing imaging by the first imaging unit and the second imaging unit from between the probe card and the mounting member;
and then performing alignment between the substrate placed on the placement member and the probes of the probe card based on the results of imaging by the first imaging unit and the second imaging unit. Method.
In the step of aligning, the position of the mounting member when the substrate mounted on the mounting member and the probe are brought into contact with each other based on the imaging results of the first imaging unit and the second imaging unit. 8. The inspection method according to claim 7, comprising the step of correcting the contact position, which is the position.
9. The inspection method according to claim 7, further comprising the step of raising said mounting member after said alignment.
10. The method according to claim 9, further comprising, between the step of taking the image and the step of raising the mounting member, the step of retracting the housing of the imaging unit to a region that does not overlap with the mounting member in plan view. inspection method.