WO2014058641A3 - Led package with multiple element light source and encapsulant having planar surfaces - Google Patents

Led package with multiple element light source and encapsulant having planar surfaces Download PDF

Info

Publication number
WO2014058641A3
WO2014058641A3 PCT/US2013/062640 US2013062640W WO2014058641A3 WO 2014058641 A3 WO2014058641 A3 WO 2014058641A3 US 2013062640 W US2013062640 W US 2013062640W WO 2014058641 A3 WO2014058641 A3 WO 2014058641A3
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulant
light
planar surfaces
leds
packages
Prior art date
Application number
PCT/US2013/062640
Other languages
French (fr)
Other versions
WO2014058641A2 (en
Inventor
Theodore Lowes
Eric Tarsa
Sten Heikman
Bernd Keller
Jesse Reiherzer
Hormoz BENJAMIN
Original Assignee
Cree, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/649,052 external-priority patent/US9048396B2/en
Priority claimed from US13/770,389 external-priority patent/US20130328074A1/en
Application filed by Cree, Inc. filed Critical Cree, Inc.
Priority to EP13774900.8A priority Critical patent/EP2907169A2/en
Priority to CN201380053182.2A priority patent/CN104737313A/en
Publication of WO2014058641A2 publication Critical patent/WO2014058641A2/en
Publication of WO2014058641A3 publication Critical patent/WO2014058641A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.
PCT/US2013/062640 2012-10-10 2013-09-30 Led package with multiple element light source and encapsulant having planar surfaces WO2014058641A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP13774900.8A EP2907169A2 (en) 2012-10-10 2013-09-30 Led package with multiple element light source and encapsulant having planar surfaces
CN201380053182.2A CN104737313A (en) 2012-10-10 2013-09-30 LED package with multiple element light source and encapsulant having planar surfaces

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US13/649,052 US9048396B2 (en) 2012-06-11 2012-10-10 LED package with encapsulant having planar surfaces
US13/649,052 2012-10-10
US13/649,067 US9818919B2 (en) 2012-06-11 2012-10-10 LED package with multiple element light source and encapsulant having planar surfaces
US13/649,067 2012-10-10
US13/770,389 2013-02-19
US13/770,389 US20130328074A1 (en) 2012-06-11 2013-02-19 Led package with multiple element light source and encapsulant having planar surfaces

Publications (2)

Publication Number Publication Date
WO2014058641A2 WO2014058641A2 (en) 2014-04-17
WO2014058641A3 true WO2014058641A3 (en) 2014-07-10

Family

ID=50478040

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/062640 WO2014058641A2 (en) 2012-10-10 2013-09-30 Led package with multiple element light source and encapsulant having planar surfaces

Country Status (3)

Country Link
EP (1) EP2907169A2 (en)
CN (1) CN104737313A (en)
WO (1) WO2014058641A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110870064B (en) * 2017-07-07 2024-02-02 科锐Led公司 RGB LED package with BSY emitter
TWI710128B (en) * 2020-01-08 2020-11-11 劉台徽 Miniature light emitting diode and its packaging method
JP7431110B2 (en) * 2020-06-11 2024-02-14 新光電気工業株式会社 light emitting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278886A1 (en) * 2005-06-10 2006-12-14 Sony Corporation Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus
US20090057699A1 (en) * 2007-09-04 2009-03-05 Philips Lumileds Lighting Company, Llc LED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color
EP2149920A1 (en) * 2007-05-17 2010-02-03 Showa Denko K.K. Semiconductor light-emitting device
US20110156061A1 (en) * 2009-12-30 2011-06-30 Harvatek Corporation Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
US20110221330A1 (en) * 2010-03-09 2011-09-15 Cree, Inc. High cri lighting device with added long-wavelength blue color

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6350041B1 (en) 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
KR100658700B1 (en) * 2004-05-13 2006-12-15 서울옵토디바이스주식회사 Light emitting device with RGB diodes and phosphor converter
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
EP1969633B1 (en) 2005-12-22 2018-08-29 Cree, Inc. Lighting device
US8940561B2 (en) 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
WO2009157999A1 (en) * 2008-06-25 2009-12-30 Cree, Inc. Solid state lighting devices including light mixtures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278886A1 (en) * 2005-06-10 2006-12-14 Sony Corporation Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus
EP2149920A1 (en) * 2007-05-17 2010-02-03 Showa Denko K.K. Semiconductor light-emitting device
US20090057699A1 (en) * 2007-09-04 2009-03-05 Philips Lumileds Lighting Company, Llc LED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color
US20110156061A1 (en) * 2009-12-30 2011-06-30 Harvatek Corporation Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
US20110221330A1 (en) * 2010-03-09 2011-09-15 Cree, Inc. High cri lighting device with added long-wavelength blue color

Also Published As

Publication number Publication date
EP2907169A2 (en) 2015-08-19
WO2014058641A2 (en) 2014-04-17
CN104737313A (en) 2015-06-24

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