WO2010121674A3 - Lighting electronic structure - Google Patents

Lighting electronic structure Download PDF

Info

Publication number
WO2010121674A3
WO2010121674A3 PCT/EP2009/065329 EP2009065329W WO2010121674A3 WO 2010121674 A3 WO2010121674 A3 WO 2010121674A3 EP 2009065329 W EP2009065329 W EP 2009065329W WO 2010121674 A3 WO2010121674 A3 WO 2010121674A3
Authority
WO
WIPO (PCT)
Prior art keywords
module
substrate
cover layer
electronic component
thermally conductive
Prior art date
Application number
PCT/EP2009/065329
Other languages
French (fr)
Other versions
WO2010121674A2 (en
Inventor
Antoine Luijckx
Original Assignee
Agc Glass Europe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Glass Europe filed Critical Agc Glass Europe
Priority to EP09755896A priority Critical patent/EP2422589A2/en
Publication of WO2010121674A2 publication Critical patent/WO2010121674A2/en
Publication of WO2010121674A3 publication Critical patent/WO2010121674A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
    • B32B17/10055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet with at least one intermediate air space
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to a lighting electronic structure, comprising ♦ a substrate (7) carrying at least an electrically conductive path (2a, 2b) on a first side, wherein at least a portion of said substrate is transparent or translucent, ♦ at least one module (11) comprising an electronic component (12), said electronic component being electrically connected to one of said electrically conductive path, wherein each of said module has its electronic component facing a transparent or translucent portion of said substrate, wherein at least one of said modules is a light emitting module, ♦ a thermally conductive cover layer for dissipating heat generated by said electronic component, said thermally conductive cover layer facing said first side of said substrate (7), said thermally conductive cover layer being in thermal contact with said electronic components (12) of said module, and ♦ an electrically insulating spacer separating said electrically conductive path from said thermally conductive cover layer; the invention further relates to the use of such an electronic structure, such a module (11), such a panel (1) and methods for producing such an electronic structure, panel (1) and module (11).
PCT/EP2009/065329 2009-04-23 2009-11-17 Lighting electronic structure WO2010121674A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09755896A EP2422589A2 (en) 2009-04-23 2009-11-17 Lighting electronic structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP2009054907 2009-04-23
EPPCT/EP2009/054907 2009-04-23
EPPCT/EP2009/055844 2009-05-14
PCT/EP2009/055844 WO2010121666A2 (en) 2009-04-23 2009-05-14 Electronic structure

Publications (2)

Publication Number Publication Date
WO2010121674A2 WO2010121674A2 (en) 2010-10-28
WO2010121674A3 true WO2010121674A3 (en) 2011-02-24

Family

ID=41171143

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2009/055844 WO2010121666A2 (en) 2009-04-23 2009-05-14 Electronic structure
PCT/EP2009/065329 WO2010121674A2 (en) 2009-04-23 2009-11-17 Lighting electronic structure

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/055844 WO2010121666A2 (en) 2009-04-23 2009-05-14 Electronic structure

Country Status (2)

Country Link
EP (2) EP2422593A2 (en)
WO (2) WO2010121666A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913237A (en) * 2014-03-16 2015-09-16 相阳 Electric lamp
US10562274B1 (en) 2016-02-22 2020-02-18 Apple Inc. Glass fastening and sealing systems
CN106211576A (en) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 A kind of adhesive contact circuit board
CN106163112A (en) * 2016-08-31 2016-11-23 安徽赛福电子有限公司 A kind of adhesive contact-type electronic element corollary apparatus
CN106455319A (en) * 2016-08-31 2017-02-22 安徽赛福电子有限公司 Attracting contact type electronic element pin
EP3717238A1 (en) * 2017-11-30 2020-10-07 Saint-Gobain Glass France Laminated pane with an integrated electrical attachment part
FI20185093A1 (en) * 2018-02-01 2019-08-02 Teknologian Tutkimuskeskus Vtt Oy Electronic circuit
CN210351619U (en) * 2019-08-26 2020-04-17 瑞声科技(新加坡)有限公司 Screen sounding system
CN112788848B (en) * 2021-01-25 2022-05-31 邢台职业技术学院 Fastening soldering tin structure for electronic element on circuit board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
GB1299541A (en) * 1969-01-21 1972-12-13 Western Electric Co Electrical components and mounting thereof
DE19528062A1 (en) * 1995-07-31 1997-02-06 Kohler Gerd Dipl Ing Tu Component to substrate separable electrical connection device for micro electronics - has magnetic layers of mutually opposite magnetic polarity provided on respective separated contact surfaces, magnetic and conductive particles bridging gap between contacts
WO2007074318A1 (en) * 2005-12-29 2007-07-05 Saint-Gobain Glass France Luminous structure comprising at least one light-emitting diode, its manufacture and its applications
EP1886804A1 (en) * 2006-08-02 2008-02-13 AGC Flat Glass Europe SA LED lighting device
WO2008149276A1 (en) * 2007-06-08 2008-12-11 Koninklijke Philips Electronics N.V. Light output device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207367B4 (en) * 2001-03-03 2010-06-24 Langer, Peter Busbar configuration
EP1733653A3 (en) * 2005-06-13 2007-06-20 SARNO S.p.A. Lighting device for display cabinets and/or display areas

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
GB1299541A (en) * 1969-01-21 1972-12-13 Western Electric Co Electrical components and mounting thereof
DE19528062A1 (en) * 1995-07-31 1997-02-06 Kohler Gerd Dipl Ing Tu Component to substrate separable electrical connection device for micro electronics - has magnetic layers of mutually opposite magnetic polarity provided on respective separated contact surfaces, magnetic and conductive particles bridging gap between contacts
WO2007074318A1 (en) * 2005-12-29 2007-07-05 Saint-Gobain Glass France Luminous structure comprising at least one light-emitting diode, its manufacture and its applications
US20090174300A1 (en) * 2005-12-29 2009-07-09 Saint-Gobain Glass France Luminous Structure Comprising at Least One Light-Emitting Diode, Its Manufacture and Its Applications
EP1886804A1 (en) * 2006-08-02 2008-02-13 AGC Flat Glass Europe SA LED lighting device
WO2008149276A1 (en) * 2007-06-08 2008-12-11 Koninklijke Philips Electronics N.V. Light output device

Also Published As

Publication number Publication date
WO2010121666A2 (en) 2010-10-28
EP2422593A2 (en) 2012-02-29
WO2010121666A3 (en) 2010-12-16
EP2422589A2 (en) 2012-02-29
WO2010121674A2 (en) 2010-10-28

Similar Documents

Publication Publication Date Title
WO2010121674A3 (en) Lighting electronic structure
MX354949B (en) Light-up window for a vehicle.
WO2011046695A3 (en) Lamp assemblies and methods of making the same
TW200951359A (en) LED lamp module and its fabricating method
JP2011530788A5 (en)
TW200746449A (en) Illumination assembly with enhanced thermal conductivity
TW200733436A (en) Light emitting diode package structure and fabrication method thereof
WO2011005526A3 (en) Opto-thermal solution for multi-utility solid state lighting device using conic section geometries
WO2012005771A3 (en) Compact optically efficient solid state light source with integrated thermal management
WO2011031417A3 (en) Electronic device submounts with thermally conductive vias and light emitting devices including the same
MX350394B (en) Flat lighting device.
MY147397A (en) Led assembly and module
EP2351112A4 (en) Multi-chip light emitting diode modules
AU2003222266A1 (en) Flexible interconnect structures for electrical devices and light sources incorporating the same
WO2011003997A9 (en) Thermally mounting electronics to a photovoltaic panel
WO2010038179A3 (en) An oled device and an electronic circuit
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
TW200631194A (en) LED module
RU2014153486A (en) INTERNAL SHELL DESIGN FOR ELECTRICAL DEVICES
EP1786042A4 (en) Light-emitting module and light-emitting system
WO2011043625A3 (en) Heat radiating printed circuit board and chassis assembly having the same
WO2013042008A3 (en) Lighting device with a circuit board mounting
WO2013020773A3 (en) An led lighting assembly and an led retrofit lamp having the led lighting assembly
WO2007121198A3 (en) Light-emitting diode with low thermal resistance
WO2010095482A3 (en) Substrate for electronic components, light emitting device, and production method for substrate for electronic components

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09755896

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2009755896

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE