WO2008021460A3 - Catch-cup to diverter alignment leveling jig - Google Patents

Catch-cup to diverter alignment leveling jig Download PDF

Info

Publication number
WO2008021460A3
WO2008021460A3 PCT/US2007/018195 US2007018195W WO2008021460A3 WO 2008021460 A3 WO2008021460 A3 WO 2008021460A3 US 2007018195 W US2007018195 W US 2007018195W WO 2008021460 A3 WO2008021460 A3 WO 2008021460A3
Authority
WO
WIPO (PCT)
Prior art keywords
catch
diverter
cup
leveling jig
alignment leveling
Prior art date
Application number
PCT/US2007/018195
Other languages
French (fr)
Other versions
WO2008021460A2 (en
Inventor
Kent Riley Child
Glen Egami
Alexander Sou-Kang Ko
Original Assignee
Applied Materials Inc
Kent Riley Child
Glen Egami
Alexander Sou-Kang Ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Kent Riley Child, Glen Egami, Alexander Sou-Kang Ko filed Critical Applied Materials Inc
Publication of WO2008021460A2 publication Critical patent/WO2008021460A2/en
Publication of WO2008021460A3 publication Critical patent/WO2008021460A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)

Abstract

An apparatus for leveling and centering a catch-cup chamber to a diverter chamber of a semiconductor processing chamber is described, hi one embodiment, the apparatus has a frame with branches. A coupler is mounted to the end of each branch. A measuring device is mounted to each branch. The apparatus is placed in the diverter. The measuring device measures a distance from a branch to a top surface of the catch-cup chamber.
PCT/US2007/018195 2006-08-15 2007-08-15 Catch-cup to diverter alignment leveling jig WO2008021460A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83801206P 2006-08-15 2006-08-15
US60/838,012 2006-08-15
US11/893,183 2007-08-14
US11/893,183 US20080268651A1 (en) 2006-08-15 2007-08-14 Catch-cup to diverter alignment leveling jig

Publications (2)

Publication Number Publication Date
WO2008021460A2 WO2008021460A2 (en) 2008-02-21
WO2008021460A3 true WO2008021460A3 (en) 2008-11-27

Family

ID=39082750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/018195 WO2008021460A2 (en) 2006-08-15 2007-08-15 Catch-cup to diverter alignment leveling jig

Country Status (3)

Country Link
US (1) US20080268651A1 (en)
TW (1) TW200818375A (en)
WO (1) WO2008021460A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144925A (en) * 1991-11-18 1993-06-11 Nec Corp Wafer carrier arm
US6366830B2 (en) * 1995-07-10 2002-04-02 Newport Corporation Self-teaching robot arm position method to compensate for support structure component alignment offset
US20040060186A1 (en) * 2002-09-30 2004-04-01 August Technology Corp. Laser alignment tool
US20050013332A1 (en) * 2001-10-09 2005-01-20 Infinera Corporation Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)
US20060011300A1 (en) * 2004-07-19 2006-01-19 Kim Jong-Bok Device for treating semiconductor substrate
US20060090848A1 (en) * 2004-10-29 2006-05-04 Norihisa Koga Laser processing apparatus and laser processing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
US20030053904A1 (en) * 2001-09-14 2003-03-20 Naofumi Kirihata Wafer aligner
US20050094505A1 (en) * 2003-09-04 2005-05-05 Sony Corporation Optical pickup apparatus, optical disk apparatus and optical pickup adjustment method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144925A (en) * 1991-11-18 1993-06-11 Nec Corp Wafer carrier arm
US6366830B2 (en) * 1995-07-10 2002-04-02 Newport Corporation Self-teaching robot arm position method to compensate for support structure component alignment offset
US20050013332A1 (en) * 2001-10-09 2005-01-20 Infinera Corporation Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)
US20040060186A1 (en) * 2002-09-30 2004-04-01 August Technology Corp. Laser alignment tool
US20060011300A1 (en) * 2004-07-19 2006-01-19 Kim Jong-Bok Device for treating semiconductor substrate
US20060090848A1 (en) * 2004-10-29 2006-05-04 Norihisa Koga Laser processing apparatus and laser processing method

Also Published As

Publication number Publication date
US20080268651A1 (en) 2008-10-30
TW200818375A (en) 2008-04-16
WO2008021460A2 (en) 2008-02-21

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