WO2006087558A3 - Apparatus and method for the application of a material layer to display devices - Google Patents

Apparatus and method for the application of a material layer to display devices Download PDF

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Publication number
WO2006087558A3
WO2006087558A3 PCT/GB2006/000550 GB2006000550W WO2006087558A3 WO 2006087558 A3 WO2006087558 A3 WO 2006087558A3 GB 2006000550 W GB2006000550 W GB 2006000550W WO 2006087558 A3 WO2006087558 A3 WO 2006087558A3
Authority
WO
WIPO (PCT)
Prior art keywords
application
magnetrons
material layer
display devices
deposited
Prior art date
Application number
PCT/GB2006/000550
Other languages
French (fr)
Other versions
WO2006087558A2 (en
Inventor
Michael John Walls
Desmond Gibson
William Young
Nalinkumar Patel
Nicoletta Anathassopoulou
Original Assignee
Applied Multilayers Ltd
Cambridge Display Tech Ltd
Michael John Walls
Desmond Gibson
William Young
Nalinkumar Patel
Nicoletta Anathassopoulou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Multilayers Ltd, Cambridge Display Tech Ltd, Michael John Walls, Desmond Gibson, William Young, Nalinkumar Patel, Nicoletta Anathassopoulou filed Critical Applied Multilayers Ltd
Priority to US11/816,494 priority Critical patent/US8206562B2/en
Publication of WO2006087558A2 publication Critical patent/WO2006087558A2/en
Publication of WO2006087558A3 publication Critical patent/WO2006087558A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10—Transparent electrodes, e.g. using graphene
    • H10K2102/101—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • H10K2102/103—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising indium oxides, e.g. ITO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a method and apparatus for the application of material to form a layer of an organic electroluminescent device. The material is sputter deposited typically from at least one target of material held in respect to a magnetron in a coating chamber. The magnetrons used can be unbalanced magnetrons and/or are provided with other magnetrons and/or magnet arrays in a closed field configuration. The material is found to be deposited in a manner which prevents or minimises damage to the device and hence reduces or removes the need for a barrier layer to be applied.
PCT/GB2006/000550 2005-02-18 2006-02-16 Apparatus and method for the application of a material layer to display devices WO2006087558A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/816,494 US8206562B2 (en) 2005-02-18 2006-02-16 Apparatus and method for the application of a material layer to display devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0503401.2A GB0503401D0 (en) 2005-02-18 2005-02-18 Apparatus and method for the application of material layer to display devices
GB0503401.2 2005-02-18

Publications (2)

Publication Number Publication Date
WO2006087558A2 WO2006087558A2 (en) 2006-08-24
WO2006087558A3 true WO2006087558A3 (en) 2006-10-19

Family

ID=34400957

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2006/000550 WO2006087558A2 (en) 2005-02-18 2006-02-16 Apparatus and method for the application of a material layer to display devices

Country Status (3)

Country Link
US (1) US8206562B2 (en)
GB (1) GB0503401D0 (en)
WO (1) WO2006087558A2 (en)

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DE102006003847B4 (en) * 2006-01-26 2011-08-18 Siemens AG, 80333 Method and apparatus for producing a polycrystalline ceramic film on a substrate
EP1892317A1 (en) * 2006-08-24 2008-02-27 Applied Materials GmbH & Co. KG Method and apparatus for sputtering .
DE102006058078A1 (en) * 2006-12-07 2008-06-19 Systec System- Und Anlagentechnik Gmbh & Co. Kg Vacuum coating system for homogenous PVD coating
KR20090126863A (en) * 2008-06-05 2009-12-09 삼성전자주식회사 Method for fabricating multilayered encapsulation thin film having optical funtionality and multilayered encapsulation thin film fabicated by the same
WO2010021539A1 (en) 2008-08-20 2010-02-25 Vision Dynamics Holding B.V. Device for generating a plasma discharge for patterning the surface of a substrate
CN201614406U (en) * 2008-08-27 2010-10-27 梯尔涂层有限公司 Equipment for forming cladding layer of deposition material
DE102008050499B4 (en) 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD coating method, apparatus for carrying out the method and substrates coated by the method
GB2465597A (en) * 2008-11-24 2010-05-26 Merck Patent Gmbh Magnetron sputter ion plating
KR101084185B1 (en) * 2010-01-12 2011-11-17 삼성모바일디스플레이주식회사 Method for forming pattern and manufacturing method for organic light emitting device
EP2718959B1 (en) 2011-06-07 2018-10-31 Vision Ease LP Improvements to the application of coating materials
EP2549521A1 (en) * 2011-07-21 2013-01-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for producing low-particle layers on substrates
WO2014005617A1 (en) * 2012-07-02 2014-01-09 Applied Materials, Inc. Apparatus for coating a layer of sputtered material on a substrate and deposition system
US10363537B2 (en) 2013-02-14 2019-07-30 Universiteit Gent Deposition tool for combinatorial thin film material libraries
KR102120896B1 (en) 2013-07-25 2020-06-10 삼성디스플레이 주식회사 Organic light emitting device display apparatus by using the facing targets sputtering apparatus and method for manufacturing the organic light emitting device display apparatus
DE202016009004U1 (en) 2015-04-15 2021-06-11 Vision Ease, Lp Ophthalmic lens with graduated microlenses
US10268050B2 (en) 2015-11-06 2019-04-23 Hoya Lens Thailand Ltd. Spectacle lens
US11378818B2 (en) 2018-03-01 2022-07-05 Essilor International Lens element
RU2757349C1 (en) 2018-03-01 2021-10-13 Эссилор Энтернасьональ Lens-shaped element
CN114921764B (en) * 2022-06-28 2023-09-22 松山湖材料实验室 Device and method for high-power pulse magnetron sputtering

Citations (13)

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Publication number Priority date Publication date Assignee Title
WO1991014797A1 (en) * 1990-03-17 1991-10-03 D.G. Teer Coating Services Limited Magnetron sputter ion plating
US5247190A (en) * 1989-04-20 1993-09-21 Cambridge Research And Innovation Limited Electroluminescent devices
US5723873A (en) * 1994-03-03 1998-03-03 Yang; Yang Bilayer composite electrodes for diodes
US5798170A (en) * 1996-02-29 1998-08-25 Uniax Corporation Long operating life for polymer light-emitting diodes
US6255774B1 (en) * 1996-09-04 2001-07-03 Cambridge Display Technology, Ltd. Multilayer cathode for organic light-emitting device
US6353083B1 (en) * 1999-02-04 2002-03-05 The Dow Chemical Company Fluorene copolymers and devices made therefrom
US6423419B1 (en) * 1995-07-19 2002-07-23 Teer Coatings Limited Molybdenum-sulphur coatings
US6452218B1 (en) * 1997-06-10 2002-09-17 Uniax Corporation Ultra-thin alkaline earth metals as stable electron-injecting electrodes for polymer light emitting diodes
US20020179900A1 (en) * 2001-04-17 2002-12-05 Koninklijke Philips Electronics N.V. Led comprising a conductive transparent polymer layer with low sulfate and high metal ion content
US20030129407A1 (en) * 1997-12-02 2003-07-10 Dennis Gerald Teer Carbon coatings, method and apparatus for applying them, and articles bearing such coatings
US6605823B1 (en) * 1996-07-29 2003-08-12 Cambridge Display Technology Ltd. Electroluminescent devices with electrode protection
GB2385062A (en) * 2002-02-07 2003-08-13 Teer Coatings Ltd Method of Applying Hard Coatings
WO2005110698A2 (en) * 2004-05-14 2005-11-24 Teer Coatings Limited Coating with hard wear and non-stick characteristics

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247190A (en) * 1989-04-20 1993-09-21 Cambridge Research And Innovation Limited Electroluminescent devices
WO1991014797A1 (en) * 1990-03-17 1991-10-03 D.G. Teer Coating Services Limited Magnetron sputter ion plating
US5723873A (en) * 1994-03-03 1998-03-03 Yang; Yang Bilayer composite electrodes for diodes
US6423419B1 (en) * 1995-07-19 2002-07-23 Teer Coatings Limited Molybdenum-sulphur coatings
US5798170A (en) * 1996-02-29 1998-08-25 Uniax Corporation Long operating life for polymer light-emitting diodes
US6605823B1 (en) * 1996-07-29 2003-08-12 Cambridge Display Technology Ltd. Electroluminescent devices with electrode protection
US6255774B1 (en) * 1996-09-04 2001-07-03 Cambridge Display Technology, Ltd. Multilayer cathode for organic light-emitting device
US6452218B1 (en) * 1997-06-10 2002-09-17 Uniax Corporation Ultra-thin alkaline earth metals as stable electron-injecting electrodes for polymer light emitting diodes
US20030129407A1 (en) * 1997-12-02 2003-07-10 Dennis Gerald Teer Carbon coatings, method and apparatus for applying them, and articles bearing such coatings
US6353083B1 (en) * 1999-02-04 2002-03-05 The Dow Chemical Company Fluorene copolymers and devices made therefrom
US20020179900A1 (en) * 2001-04-17 2002-12-05 Koninklijke Philips Electronics N.V. Led comprising a conductive transparent polymer layer with low sulfate and high metal ion content
GB2385062A (en) * 2002-02-07 2003-08-13 Teer Coatings Ltd Method of Applying Hard Coatings
WO2005110698A2 (en) * 2004-05-14 2005-11-24 Teer Coatings Limited Coating with hard wear and non-stick characteristics

Also Published As

Publication number Publication date
US8206562B2 (en) 2012-06-26
GB0503401D0 (en) 2005-03-30
WO2006087558A2 (en) 2006-08-24
US20090065741A1 (en) 2009-03-12

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