WO2006055363A3 - Modular tool unit for processing microelectronic workpieces - Google Patents

Modular tool unit for processing microelectronic workpieces Download PDF

Info

Publication number
WO2006055363A3
WO2006055363A3 PCT/US2005/040553 US2005040553W WO2006055363A3 WO 2006055363 A3 WO2006055363 A3 WO 2006055363A3 US 2005040553 W US2005040553 W US 2005040553W WO 2006055363 A3 WO2006055363 A3 WO 2006055363A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing
workpiece
tool
modular
carousel assembly
Prior art date
Application number
PCT/US2005/040553
Other languages
French (fr)
Other versions
WO2006055363A2 (en
Inventor
Paul Z Wirth
Jeffry Alan Davis
Randy A Harris
Original Assignee
Semitool Inc
Paul Z Wirth
Jeffry Alan Davis
Randy A Harris
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/987,049 external-priority patent/US7144813B2/en
Priority claimed from US11/056,704 external-priority patent/US20060009047A1/en
Priority claimed from US11/178,241 external-priority patent/US20060045666A1/en
Application filed by Semitool Inc, Paul Z Wirth, Jeffry Alan Davis, Randy A Harris filed Critical Semitool Inc
Publication of WO2006055363A2 publication Critical patent/WO2006055363A2/en
Publication of WO2006055363A3 publication Critical patent/WO2006055363A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A modular apparatus for thermally processing a microelectronic workpiece is provided. The modular apparatus comprises a mounting module having a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The thermal processing modular apparatus has a front docking unit for removeably connecting it to a load/unload module and a rear docking unit for removeably connecting it to a wet chemical processing tool, or another tool for otherwise processing a workpiece. A transport system (i.e., robot) services the modular tool units that can be automatically calibrated to work with individual processing components of the tool units.
PCT/US2005/040553 2004-11-12 2005-11-10 Modular tool unit for processing microelectronic workpieces WO2006055363A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US10/987,049 2004-11-12
US10/987,049 US7144813B2 (en) 2004-11-12 2004-11-12 Method and apparatus for thermally processing microelectronic workpieces
US11/056,704 2005-02-11
US11/056,704 US20060009047A1 (en) 2004-07-09 2005-02-11 Modular tool unit for processing microelectronic workpieces
US11/178,241 2005-07-07
US11/178,241 US20060045666A1 (en) 2004-07-09 2005-07-07 Modular tool unit for processing of microfeature workpieces

Publications (2)

Publication Number Publication Date
WO2006055363A2 WO2006055363A2 (en) 2006-05-26
WO2006055363A3 true WO2006055363A3 (en) 2006-08-17

Family

ID=36407628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/040553 WO2006055363A2 (en) 2004-11-12 2005-11-10 Modular tool unit for processing microelectronic workpieces

Country Status (2)

Country Link
TW (1) TW200633057A (en)
WO (1) WO2006055363A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109227289A (en) * 2018-09-29 2019-01-18 嘉善浩辰机械密封有限公司 A kind of sealing element grinding device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480822A (en) * 1981-02-13 1984-11-06 Luigi Mauratelli Annealing furnace system
US20010055934A1 (en) * 2000-06-22 2001-12-27 Applied Materials, Inc. Method and apparatus for treating a substrate
US20020084052A1 (en) * 1999-07-29 2002-07-04 Consolidated Engineering Company, Inc. Methods and apparatus for heat treatment and sand removal for castings
US20040016637A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Multi-chemistry plating system
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480822A (en) * 1981-02-13 1984-11-06 Luigi Mauratelli Annealing furnace system
US20020084052A1 (en) * 1999-07-29 2002-07-04 Consolidated Engineering Company, Inc. Methods and apparatus for heat treatment and sand removal for castings
US20010055934A1 (en) * 2000-06-22 2001-12-27 Applied Materials, Inc. Method and apparatus for treating a substrate
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US20040016637A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Multi-chemistry plating system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109227289A (en) * 2018-09-29 2019-01-18 嘉善浩辰机械密封有限公司 A kind of sealing element grinding device

Also Published As

Publication number Publication date
TW200633057A (en) 2006-09-16
WO2006055363A2 (en) 2006-05-26

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