USD446525S1 - IC memory card - Google Patents

IC memory card Download PDF

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Publication number
USD446525S1
USD446525S1 US29/119,086 US11908600F USD446525S US D446525 S1 USD446525 S1 US D446525S1 US 11908600 F US11908600 F US 11908600F US D446525 S USD446525 S US D446525S
Authority
US
United States
Prior art keywords
memory card
view
ornamental design
elevational view
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/119,086
Inventor
Kosei Okamoto
Takashi Torii
Yosi Pinto
Dan Auclair
Yoram Cedar
Bob Wallace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SD-3C LLC
Original Assignee
Toshiba Corp
Matsushita Electric Industrial Co Ltd
SanDisk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Matsushita Electric Industrial Co Ltd, SanDisk Corp filed Critical Toshiba Corp
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TORRI, TAKASHI
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMOTO, KOSEI
Assigned to SANDISK CORPORATION reassignment SANDISK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AUCLAIR, DAN, CEDAR, YORAM, WALLACE, BOB, PINTO, YOSHI
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Publication of USD446525S1 publication Critical patent/USD446525S1/en
Assigned to SD-3C, LLC reassignment SD-3C, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SANDISK CORPORATION, TOSHIBA CORPORATION, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top, front and right side perspective view of IC memory card showing our new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a right side elevational view thereof,
FIG. 4 is a left side elevational view thereof,
FIG. 5 is a top plan view thereof,
FIG. 6 is a bottom plan view thereof,
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a top, rear and right side perspective view thereof.

Claims (1)

  1. The ornamental design for IC memory card, as shown and described.
US29/119,086 1999-08-24 2000-02-23 IC memory card Expired - Lifetime USD446525S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2260999 1999-08-24
JP11-22609 1999-08-24

Publications (1)

Publication Number Publication Date
USD446525S1 true USD446525S1 (en) 2001-08-14

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US29/119,086 Expired - Lifetime USD446525S1 (en) 1999-08-24 2000-02-23 IC memory card

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US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
US7185426B1 (en) 2002-05-01 2007-03-06 Amkor Technology, Inc. Method of manufacturing a semiconductor package
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US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
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US7501338B1 (en) 2001-06-19 2009-03-10 Amkor Technology, Inc. Semiconductor package substrate fabrication method
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
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US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7710736B2 (en) 2005-08-02 2010-05-04 Sandisk Corporation Memory card with latching mechanism for hinged cover
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
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USD628202S1 (en) * 2009-10-20 2010-11-30 Sandisk Corporation MicroSD memory card with different color surfaces
US7864540B2 (en) 2003-07-17 2011-01-04 Sandisk Corporation Peripheral card with sloped edges
USD638431S1 (en) * 2009-10-20 2011-05-24 Sandisk Corporation MicroSD memory card with a semi-transparent color surface
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USD643432S1 (en) * 2010-05-17 2011-08-16 Panasonic Corporation Memory card
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Cited By (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US7501338B1 (en) 2001-06-19 2009-03-10 Amkor Technology, Inc. Semiconductor package substrate fabrication method
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
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US8341835B1 (en) 2002-05-01 2013-01-01 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
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US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7399661B2 (en) 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US7185426B1 (en) 2002-05-01 2007-03-06 Amkor Technology, Inc. Method of manufacturing a semiconductor package
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US7297562B1 (en) 2002-05-01 2007-11-20 Amkor Technology, Inc. Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
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US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
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