US20100147496A1 - Heat dissipation device with heat pipe - Google Patents
Heat dissipation device with heat pipe Download PDFInfo
- Publication number
- US20100147496A1 US20100147496A1 US12/463,348 US46334809A US2010147496A1 US 20100147496 A1 US20100147496 A1 US 20100147496A1 US 46334809 A US46334809 A US 46334809A US 2010147496 A1 US2010147496 A1 US 2010147496A1
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- United States
- Prior art keywords
- heat
- dissipation device
- heat dissipation
- heat pipe
- fins
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat dissipation devices and, particularly, to a heat dissipation device with a heat pipe.
- a conventional heat dissipation device includes a base contacting a heat generating device, a plurality of parallel fins protruding from a top surface of the base and a heat pipe. In operation, the heat generated from the heat generating device is absorbed by the base and transferred by the fins. However, this conventional heat dissipation device has low heat dissipation efficiency.
- a heat pipe is applied to transfer the heat from the heat generating device to the fins.
- an evaporator section of the heat pipe is disposed between the bottom surface of the base and the heat generating device, and a condenser end of the heat pipe extends through the fins.
- the heat is quickly transferred by the heat pipe from the heat generating device to the fins, whereby the heat is dissipated out rapidly.
- the heat pipe plays a critical role during heat dissipation process. However, once the heat pipe is invalid or damaged, a heat dissipation efficiency of the whole heat dissipation device will be greatly degraded.
- FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.
- FIG. 2 is an assembled view of the heat dissipation device of FIG. 1 .
- FIG. 3 is an isometric, exploded view of a heat dissipation device in accordance with a second embodiment of the disclosure, showing an assembly of a heat sink and a plurality of heat pipes.
- FIG. 4 is an isometric, exploded view of a heat dissipation device in accordance with a third embodiment of the disclosure, showing the heat dissipation device assembled on a printed circuit board.
- FIG. 5 is the exploded view of the heat dissipation device of FIG. 4 , viewed from a different angle.
- a heat dissipation device in accordance with a first embodiment includes a heat conducting base 10 , a heat sink 20 , a heat pipe assembly 30 and a fan 40 .
- the heat conducting base 10 is made of heat conducting material, such as copper, aluminum, or the like.
- the heat conducting base 10 includes a top surface 12 thermally connecting with the heat pipe assembly 30 , and a bottom surface 14 thermally contacting a heat generating device (not shown).
- the top surface 12 is curved corresponding to a curve of the heat pipe assembly 30 .
- the heat sink 20 is a unitary structure made from a metal block and includes a hollow cylindrical body 22 , and a plurality of fins 24 extending inwardly from an inner surface of the body 22 toward an axis of the body 22 .
- the fins 24 each have a first end connected to the inner surface of the body 22 and a terminal second end opposite to the first end.
- Each of the fins 24 is a wedge-shaped plate, and has a thickness gradually decreasing from the first end to the second end thereof.
- the first ends of the fins 24 are evenly arranged on a circumference of the inner surface of the body 22 , and the second ends of the fins 24 cooperatively define an aperture 200 .
- the second ends of the fins 24 may be free and spaced from each other or be connected to each other.
- a plurality of air flow paths 240 is defined by adjacent fins 24 .
- the second ends of the fins 24 are spaced from each other, and the air flow paths 240 extend inwardly from the inner surface of the body 22 and communicate with the aperture 200 .
- Each air flow path 240 has a width gradually decreasing along a corresponding radial direction from the inner surface of the body 22 to the aperture 200 .
- the fins 24 Being arranged on the circumference of the inner surface of the body 22 and extending inwardly from the inner surface of the body 22 , the fins 24 simultaneously transfer heat of the whole annular inner surface of the body 22 from the first end to the second end thereof along various directions. Then the heat at the second ends of the fins 24 can be quickly dissipated by air flowing through the air flow paths 240 . Therefore, the illustrated structure of the heat sink 20 can dissipate the heat absorbed thereby quickly and efficiently.
- the heat sink 20 can be an assembled structure of the body 22 and the fins 24 .
- the fins 24 are included in a unitary fin structure.
- a metallic sheet is bent in sequence to form a zigzag or wave configuration including a number of wedge-shaped protrusions. Each protrusion constructs one fin 24 .
- the desired unitary fin structure is obtained.
- the unitary fin structure is assembled on the inner surface of the body 22 by a bolt or a soldering manner, thereby obtaining the assembled heat sink 20 consisting of the body 22 and the fins 24 .
- the outer surface of the body 22 can protrude or be soldered with a number of fins to increase a heat dissipating area of the body 22 .
- a number of fins are formed on the outer surface of the body 22 and located between the turn 311 b of the heat pipe 311 and the heat pipe 313 .
- One or more heat pipe assembly 30 wraps the outer surface of the body 22 of the heat sink 20 to remove the heat from the annular outer surface of the body 22 .
- the heat pipe assembly 30 has a helical structure obtained by curving one or more elongated flat-type heat pipe. A curvature radius of the helical heat pipe assembly 30 is equal to that of the outer surface of the body 22 to assure that the helical heat pipe can tightly combine with the outer surface of the body 22 .
- the helical heat pipe assembly 30 is soldered on the outer surface of the body 22 .
- a thermal interface material is applied between the outer surface of the body 22 and the helical heat pipe assembly 30 . In operation, the whole annular outer surface of the body 22 exchanges heat with the heat pipe assembly 30 and therefore the heat of the body 22 of the heat sink 20 can be quickly removed by the heat pipe assembly 30 .
- the outer surface of the body 22 of the heat sink 20 defines a groove to receive the heat pipe assembly 30 therein.
- the heat pipe assembly 30 can be partially or wholly embedded in the groove of the body 22 .
- the groove facilitates the heat pipe assembly 30 being easily soldered on the body 22 and tightly combining with the body 22 .
- the outer surface of the body 22 can define a helical groove to receive the helical heat pipe assembly 30 therein, or define a number of parallel grooves to receive a number of straight heat pipes therein.
- heat pipe assembly 30 shapes, structures of the heat pipe assembly 30 and the outer surface of the body 22 can be varied, so long as the heat pipe assembly 30 surrounds the outer surface of the body 22 .
- the helical heat pipe assembly 30 is formed by three elongated flat-type heat pipes 311 , 312 , 313 .
- the pipe 311 includes multi-turns wrapping the body 22 of the heat sink 20 .
- Adjacent turns of one of the three heat pipes 311 , 312 , 313 are spaced by the other two of the three heat pipes 311 , 312 , 313 .
- two adjacent turns 311 a , 311 b of the heat pipe 311 are spaced by the heat pipe 312 and the heat pipe 313 . That is, the heat pipe 312 and the heat pipe 313 are sandwiched between the two adjacent turns 311 a , 311 b of the heat pipe 311 .
- a distance between the adjacent turns 311 a , 311 b of the heat pipe 311 is relatively long. That is, a section the heat pipe 311 between the adjacent turns 311 a , 311 b can have a relatively low curving degree, thereby avoiding capillary structures therein to be damaged during forming the heat pipe 311 .
- a length of the helical heat pipe assembly 30 is equal to that of the body 22 of the heat sink 20 , whereby the heat pipe assembly 30 substantially contacts the whole outer surface of the body 22 .
- the fan 40 is mounted on the another side surface of the body 22 to generate an air flow in the axial direction of the body 22 .
- the fan 40 includes a cylindrical frame 41 and a blade module 42 fixed to the frame 41 .
- the blade module 42 includes a shaft 421 and several blades 422 extending outwardly from the shaft 421 .
- the frame 41 is mounted to the body 22 with the shaft 421 of the blade module 42 corresponding to the aperture 200 and the blades 422 corresponding to the air flow paths 240 .
- a portion of air flows generated by the blades 422 flow in the air flow paths 240 along a lengthwise direction of the body 22 , simultaneously, another portion of air flow congregates and flows in the aperture 200 along the axial direction of the body 22 .
- the air flow exchanges heat with the fins 24 and the inner surface of the body 22 of the heat sink 20 to take away the heat.
- the heat pipe assembly 30 is soldered to the outer surface of the body 22 of the heat sink 20 .
- An assembly of the heat sink 20 and the heat pipe assembly 30 is mounted on the base 10 by soldering the heat pipe assembly 30 to the top surface 12 of the base 10 .
- the fan 40 is mounted to the side of the body 22 of the heat sink 20 by a number of bolts.
- the heat dissipation device of the second embodiment has a structure similar to the heat dissipation device of the first embodiment, differing only in that configuration of a heat pipe is different from that of the heat pipe assembly 30 .
- the heat pipe includes a number of parallel straight heat pipes 300 disposed on the outer surface of the body 22 and surround the body 22 .
- the straight heat pipes 300 are parallel to the axis of the body 22 . Adjacent heat pipes 300 can be spaced from or adjoin each other.
- the heat dissipation device has a structure similar to the heat dissipation device of the first embodiment, differing only in that the heat conducting base 10 is omitted.
- the body 22 (shown in FIG. 1 ) of the heat sink 20 includes a first side surface thermally contacting a heat generating device 120 and a second side surface opposite to the first side surface.
- Each of the fins 24 (shown in FIG. 1 ) has a flat surface coplanar with the second side surface of the body 22 .
- the body 22 is directly mounted to a printed circuit board 110 supporting a heat generating device 120 thereon by a plurality of blots 130 .
- the body 22 defines a plurality of threaded holes 221
- the printed circuit board 110 defines a plurality of through holes 111 corresponding to the threaded holes 221
- the blots 130 extend through the second threaded holes 111 of the printed circuit board 110 and are threaded in the first threaded holes 221 of the body 22 to fasten the body 22 to the printed circuit board 110 , thereby the flat surface of the fins 24 thermally contacting the heat generating device 120 .
- the flat surface cooperatively formed by all of the fins 24 can be concave or convex relative to the first side surface of the body 22 , so long as the flat surface of the fins 24 easily and tightly thermally combines with the heat generating device 120 .
- the fan 40 is fixed to the second first side surface of the body 22 .
- the helical heat pipe assembly 30 surrounds the outer surface of the body 22 of the heat sink 20 and thermally contact the heat conducting base 10 .
- a large contacting area is obtained between the helical heat pipe assembly 30 and the body 22 of the heat sink 20 , thereby a large heat exchange area between the heat pipe assembly 30 and the body 22 of the heat sink 20 being obtained.
- the fins 24 positioned in side of the body 22 define a number of air flow paths 240 to allow the air flow generated by the fan 40 flowing therethrough and takes away the heat of the heat sink 20 .
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- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
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Abstract
A heat dissipation device includes a heat sink and a helical heat pipe assembly. The heat sink includes a hollow cylindrical body and a number of fins extending inwardly from an inner surface of the body to an axis of the body. The helical heat pipe assembly is wrapped on an outer surface of the body and helically extends along an axial direction of the body.
Description
- 1. Technical Field
- The disclosure relates to heat dissipation devices and, particularly, to a heat dissipation device with a heat pipe.
- 2. Description of Related Art
- Heat dissipation devices are increasingly used in electronic products. A conventional heat dissipation device includes a base contacting a heat generating device, a plurality of parallel fins protruding from a top surface of the base and a heat pipe. In operation, the heat generated from the heat generating device is absorbed by the base and transferred by the fins. However, this conventional heat dissipation device has low heat dissipation efficiency.
- In order to improve the heat dissipation efficiency of the heat dissipation device mentioned above, a heat pipe is applied to transfer the heat from the heat generating device to the fins. In detail, an evaporator section of the heat pipe is disposed between the bottom surface of the base and the heat generating device, and a condenser end of the heat pipe extends through the fins. In operation, the heat is quickly transferred by the heat pipe from the heat generating device to the fins, whereby the heat is dissipated out rapidly. Thus, the heat pipe plays a critical role during heat dissipation process. However, once the heat pipe is invalid or damaged, a heat dissipation efficiency of the whole heat dissipation device will be greatly degraded.
- What is needed, therefore, is a heat dissipation device with a heat pipe overcoming the described limitations.
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure. -
FIG. 2 is an assembled view of the heat dissipation device ofFIG. 1 . -
FIG. 3 is an isometric, exploded view of a heat dissipation device in accordance with a second embodiment of the disclosure, showing an assembly of a heat sink and a plurality of heat pipes. -
FIG. 4 is an isometric, exploded view of a heat dissipation device in accordance with a third embodiment of the disclosure, showing the heat dissipation device assembled on a printed circuit board. -
FIG. 5 is the exploded view of the heat dissipation device ofFIG. 4 , viewed from a different angle. - Referring to
FIG. 1 andFIG. 2 , a heat dissipation device in accordance with a first embodiment includes a heat conductingbase 10, aheat sink 20, aheat pipe assembly 30 and afan 40. The heat conductingbase 10 is made of heat conducting material, such as copper, aluminum, or the like. The heat conductingbase 10 includes atop surface 12 thermally connecting with theheat pipe assembly 30, and abottom surface 14 thermally contacting a heat generating device (not shown). Thetop surface 12 is curved corresponding to a curve of theheat pipe assembly 30. - The
heat sink 20 is a unitary structure made from a metal block and includes a hollowcylindrical body 22, and a plurality offins 24 extending inwardly from an inner surface of thebody 22 toward an axis of thebody 22. Thefins 24 each have a first end connected to the inner surface of thebody 22 and a terminal second end opposite to the first end. Each of thefins 24 is a wedge-shaped plate, and has a thickness gradually decreasing from the first end to the second end thereof. The first ends of thefins 24 are evenly arranged on a circumference of the inner surface of thebody 22, and the second ends of thefins 24 cooperatively define anaperture 200. The second ends of thefins 24 may be free and spaced from each other or be connected to each other. A plurality ofair flow paths 240 is defined byadjacent fins 24. In the illustrated embodiment, the second ends of thefins 24 are spaced from each other, and theair flow paths 240 extend inwardly from the inner surface of thebody 22 and communicate with theaperture 200. Eachair flow path 240 has a width gradually decreasing along a corresponding radial direction from the inner surface of thebody 22 to theaperture 200. - Being arranged on the circumference of the inner surface of the
body 22 and extending inwardly from the inner surface of thebody 22, thefins 24 simultaneously transfer heat of the whole annular inner surface of thebody 22 from the first end to the second end thereof along various directions. Then the heat at the second ends of thefins 24 can be quickly dissipated by air flowing through theair flow paths 240. Therefore, the illustrated structure of theheat sink 20 can dissipate the heat absorbed thereby quickly and efficiently. - Alternatively, the
heat sink 20 can be an assembled structure of thebody 22 and thefins 24. For example, thefins 24 are included in a unitary fin structure. In detail, a metallic sheet is bent in sequence to form a zigzag or wave configuration including a number of wedge-shaped protrusions. Each protrusion constructs onefin 24. Thus, the desired unitary fin structure is obtained. Then the unitary fin structure is assembled on the inner surface of thebody 22 by a bolt or a soldering manner, thereby obtaining the assembledheat sink 20 consisting of thebody 22 and thefins 24. - Alternatively, the outer surface of the
body 22 can protrude or be soldered with a number of fins to increase a heat dissipating area of thebody 22. For example, a number of fins are formed on the outer surface of thebody 22 and located between the turn 311 b of theheat pipe 311 and theheat pipe 313. - One or more
heat pipe assembly 30 wraps the outer surface of thebody 22 of theheat sink 20 to remove the heat from the annular outer surface of thebody 22. Theheat pipe assembly 30 has a helical structure obtained by curving one or more elongated flat-type heat pipe. A curvature radius of the helicalheat pipe assembly 30 is equal to that of the outer surface of thebody 22 to assure that the helical heat pipe can tightly combine with the outer surface of thebody 22. In this embodiment, the helicalheat pipe assembly 30 is soldered on the outer surface of thebody 22. In order to improve heat exchange efficiency between theheat sink 20 and the helicalheat pipe assembly 30, a thermal interface material is applied between the outer surface of thebody 22 and the helicalheat pipe assembly 30. In operation, the whole annular outer surface of thebody 22 exchanges heat with theheat pipe assembly 30 and therefore the heat of thebody 22 of theheat sink 20 can be quickly removed by theheat pipe assembly 30. - Alternatively, the outer surface of the
body 22 of theheat sink 20 defines a groove to receive theheat pipe assembly 30 therein. Theheat pipe assembly 30 can be partially or wholly embedded in the groove of thebody 22. The groove facilitates theheat pipe assembly 30 being easily soldered on thebody 22 and tightly combining with thebody 22. The outer surface of thebody 22 can define a helical groove to receive the helicalheat pipe assembly 30 therein, or define a number of parallel grooves to receive a number of straight heat pipes therein. - It is understood that shapes, structures of the
heat pipe assembly 30 and the outer surface of thebody 22 can be varied, so long as theheat pipe assembly 30 surrounds the outer surface of thebody 22. - In the illustrated embodiment, the helical
heat pipe assembly 30 is formed by three elongated flat-type heat pipes pipe 311 includes multi-turns wrapping thebody 22 of theheat sink 20. Adjacent turns of one of the threeheat pipes heat pipes heat pipe 311 are spaced by theheat pipe 312 and theheat pipe 313. That is, theheat pipe 312 and theheat pipe 313 are sandwiched between the twoadjacent turns 311 a, 311 b of theheat pipe 311. In this structure, a distance between the adjacent turns 311 a, 311 b of theheat pipe 311 is relatively long. That is, a section theheat pipe 311 between the adjacent turns 311 a, 311 b can have a relatively low curving degree, thereby avoiding capillary structures therein to be damaged during forming theheat pipe 311. In order to obtain a relatively high heat exchange efficiency, a length of the helicalheat pipe assembly 30 is equal to that of thebody 22 of theheat sink 20, whereby theheat pipe assembly 30 substantially contacts the whole outer surface of thebody 22. - The
fan 40 is mounted on the another side surface of thebody 22 to generate an air flow in the axial direction of thebody 22. Thefan 40 includes a cylindrical frame 41 and a blade module 42 fixed to the frame 41. The blade module 42 includes a shaft 421 and several blades 422 extending outwardly from the shaft 421. The frame 41 is mounted to thebody 22 with the shaft 421 of the blade module 42 corresponding to theaperture 200 and the blades 422 corresponding to theair flow paths 240. In heat exchanging process, a portion of air flows generated by the blades 422 flow in theair flow paths 240 along a lengthwise direction of thebody 22, simultaneously, another portion of air flow congregates and flows in theaperture 200 along the axial direction of thebody 22. By the two approaches, the air flow exchanges heat with thefins 24 and the inner surface of thebody 22 of theheat sink 20 to take away the heat. - In assembly, the
heat pipe assembly 30 is soldered to the outer surface of thebody 22 of theheat sink 20. An assembly of theheat sink 20 and theheat pipe assembly 30 is mounted on thebase 10 by soldering theheat pipe assembly 30 to thetop surface 12 of thebase 10. Thefan 40 is mounted to the side of thebody 22 of theheat sink 20 by a number of bolts. - Referring to
FIG. 3 , a heat dissipation device in accordance with a second embodiment is illustrated. The heat dissipation device of the second embodiment has a structure similar to the heat dissipation device of the first embodiment, differing only in that configuration of a heat pipe is different from that of theheat pipe assembly 30. The heat pipe includes a number of parallelstraight heat pipes 300 disposed on the outer surface of thebody 22 and surround thebody 22. Thestraight heat pipes 300 are parallel to the axis of thebody 22.Adjacent heat pipes 300 can be spaced from or adjoin each other. - Referring to
FIG. 4 andFIG. 5 , a heat dissipation device in accordance with a third embodiment is illustrated. The heat dissipation device has a structure similar to the heat dissipation device of the first embodiment, differing only in that theheat conducting base 10 is omitted. The body 22 (shown inFIG. 1 ) of theheat sink 20 includes a first side surface thermally contacting aheat generating device 120 and a second side surface opposite to the first side surface. Each of the fins 24 (shown inFIG. 1 ) has a flat surface coplanar with the second side surface of thebody 22. Thebody 22 is directly mounted to a printedcircuit board 110 supporting aheat generating device 120 thereon by a plurality ofblots 130. Thebody 22 defines a plurality of threadedholes 221, and the printedcircuit board 110 defines a plurality of throughholes 111 corresponding to the threaded holes 221. Theblots 130 extend through the second threadedholes 111 of the printedcircuit board 110 and are threaded in the first threadedholes 221 of thebody 22 to fasten thebody 22 to the printedcircuit board 110, thereby the flat surface of thefins 24 thermally contacting theheat generating device 120. It is understood that the flat surface cooperatively formed by all of thefins 24 can be concave or convex relative to the first side surface of thebody 22, so long as the flat surface of thefins 24 easily and tightly thermally combines with theheat generating device 120. Thefan 40 is fixed to the second first side surface of thebody 22. - Regarding the heat dissipation device of the illustrated embodiment, the helical
heat pipe assembly 30 surrounds the outer surface of thebody 22 of theheat sink 20 and thermally contact theheat conducting base 10. Thus a large contacting area is obtained between the helicalheat pipe assembly 30 and thebody 22 of theheat sink 20, thereby a large heat exchange area between theheat pipe assembly 30 and thebody 22 of theheat sink 20 being obtained. Thefins 24 positioned in side of thebody 22 define a number ofair flow paths 240 to allow the air flow generated by thefan 40 flowing therethrough and takes away the heat of theheat sink 20. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the apparatus and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (17)
1. A heat dissipation device comprising:
a heat sink comprising a hollow cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body; and
a helical heat pipe assembly wrapped on an outer surface of the body and helically extending along the axial direction of the body.
2. The heat dissipation device of claim 1 , wherein the fins each have a first end connected to the inner surface of the body and a terminal second end opposite to the first end, and wherein the second ends of the fins cooperatively define an aperture.
3. The heat dissipation device of claim 2 , wherein the second ends of the fins are spaced from each other.
4. The heat dissipation device of claim 3 , wherein the fins define a plurality of air flow path communicating with the aperture.
5. The heat dissipation device of claim 4 , wherein the helical heat pipe assembly is obtained by curving at least one heat pipe.
6. The heat dissipation device of claim 5 , wherein the helical heat pipe assembly comprises multi-turns wrapping the outer surface of the body of the heat sink, and wherein the multi-turns are spaced from each other.
7. The heat dissipation device of claim 6 , wherein the helical heat pipe assembly is formed by curving a first, second and third heat pipes, and adjacent turns of the first heat pipe are spaced by the second heat pipe and the third heat pipe.
8. The heat dissipation device of claim 7 , wherein the outer surface of the body of the heat sink defines a helical groove to receive the helical heat pipe assembly therein.
9. The heat dissipation device of claim 8 , wherein the helical heat pipe assembly is partially or wholly embedded in the groove of the body of the heat sink.
10. The heat dissipation device of claim 4 , wherein the heat dissipation device further comprises a fan comprising a frame and a blade module fixed to the frame, the blade module comprises a shaft and several blades extending outwardly from the shaft, the frame is mounted to a first side surface of the body with the shaft corresponding to the aperture and the blades corresponding to the air flow paths.
11. The heat dissipation device of claim 10 , wherein the body of the heat sink comprises a second side surface opposite to the first side surface, the second side surface is configured for thermally contacting a heat generating device.
12. The heat dissipation device of claim 10 , wherein the heat dissipation device further comprises a heat conducting base having a bottom surface for thermally contacting a heat generating device and a top surface thermally connecting with the helical heat pipe assembly.
13. A heat dissipation device comprising:
a heat sink comprising a tubular, cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body, the fins each having a free end unconnected to the inner surface of the body, the free ends of the fins cooperatively defining an aperture communicating with two side surfaces of the body;
a plurality heat pipes disposed on an outer surface of the body and surrounding the outer surface of the body;
a fan mounted to one of the two side surfaces of the body.
14. The heat dissipation device of claim 13 , wherein the fins define a plurality of air flow paths communicating with the aperture.
15. The heat dissipation device of claim 14 , wherein the plurality heat pipes constructs a helical structure wrapping the outer surface of the body and helically extending a long an axial direction of the body.
16. The heat dissipation device of claim 15 , wherein the helical structure is formed by curving a first, second and third heat pipes and comprises a plurality of spaced turns wrapping the outer surface of the body, and wherein adjacent turns of the first heat pipe are spaced by the second heat pipe and the third heat pipe.
17. The heat dissipation device of claim 14 , wherein the heat pipes are parallel straight heat pipes disposed on a circumference of the outer surface of the body and extend along an axial direction of the body.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN2008103061834A CN101754658B (en) | 2008-12-11 | 2008-12-11 | Radiating device |
CN200810306183.4 | 2008-12-11 |
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US20100147496A1 true US20100147496A1 (en) | 2010-06-17 |
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US12/463,348 Abandoned US20100147496A1 (en) | 2008-12-11 | 2009-05-08 | Heat dissipation device with heat pipe |
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CN (1) | CN101754658B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20140055418A (en) * | 2012-10-31 | 2014-05-09 | 코웨이 주식회사 | Cooling device and cold water storage of water treatment apparatus |
US20160290689A1 (en) * | 2015-04-01 | 2016-10-06 | Samsung Electronics Co., Ltd. | Refrigerator and heat exchanger used therein |
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US9939859B2 (en) | 2016-03-17 | 2018-04-10 | Google Llc | Electronic device with a cooling structure |
WO2018113374A1 (en) * | 2016-12-20 | 2018-06-28 | 刘龙芳 | Helical line-shaped heat dissipation device |
US20210210290A1 (en) * | 2018-07-13 | 2021-07-08 | Abb Schweiz Ag | Heat sink for a high voltage switchgear |
KR102595307B1 (en) * | 2023-04-03 | 2023-10-30 | 주식회사 삼정이엔씨 | Heat exchanger for hydrogen liquefied |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140055418A (en) * | 2012-10-31 | 2014-05-09 | 코웨이 주식회사 | Cooling device and cold water storage of water treatment apparatus |
KR102037682B1 (en) | 2012-10-31 | 2019-10-29 | 웅진코웨이 주식회사 | Cooling device and cold water storage of water treatment apparatus |
US20160290689A1 (en) * | 2015-04-01 | 2016-10-06 | Samsung Electronics Co., Ltd. | Refrigerator and heat exchanger used therein |
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WO2018113374A1 (en) * | 2016-12-20 | 2018-06-28 | 刘龙芳 | Helical line-shaped heat dissipation device |
CN107062730A (en) * | 2017-01-13 | 2017-08-18 | 北京热刺激光技术有限责任公司 | Air-cooled water cooling machine |
US20210210290A1 (en) * | 2018-07-13 | 2021-07-08 | Abb Schweiz Ag | Heat sink for a high voltage switchgear |
US11521807B2 (en) * | 2018-07-13 | 2022-12-06 | Abb Schweiz Ag | Heat sink for a high voltage switchgear |
KR102595307B1 (en) * | 2023-04-03 | 2023-10-30 | 주식회사 삼정이엔씨 | Heat exchanger for hydrogen liquefied |
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CN101754658A (en) | 2010-06-23 |
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