US20060096743A1 - Liquid cooling device - Google Patents

Liquid cooling device Download PDF

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Publication number
US20060096743A1
US20060096743A1 US11/070,550 US7055005A US2006096743A1 US 20060096743 A1 US20060096743 A1 US 20060096743A1 US 7055005 A US7055005 A US 7055005A US 2006096743 A1 US2006096743 A1 US 2006096743A1
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United States
Prior art keywords
liquid
base
container
cooling device
heat
Prior art date
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Abandoned
Application number
US11/070,550
Inventor
Hsieh-Kun Lee
Cheng-Tien Lai
Zhi-Yong Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, CHENG-TIEN, LEE, HSIEH-KUN, ZHOU, ZHI-YONG
Publication of US20060096743A1 publication Critical patent/US20060096743A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.
  • Liquid cooling devices were commonly utilized to cool huge systems such as furnaces.
  • Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.
  • CPUs computer central processing units
  • a liquid cooling device comprises a casing, forming a liquid container made of metal material.
  • the casing comprises a base and a lid covering the base.
  • the base is for contacting a cooled component and comprises an upper surface.
  • the lid comprises a liquid outlet and a liquid inlet.
  • Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank.
  • the liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the cooled component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.
  • the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.
  • an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.
  • the casing comprises a container for accommodating liquid therein and a base.
  • the base comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid. The rough surface is opposing to the heat-absorbing surface.
  • FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention
  • FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1 ;
  • FIG. 3 is a cross-sectional view of FIG. 2 , taken along line III-III;
  • FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention.
  • FIG. 5 is a view of a base of a casing of a liquid cooling device in accordance with an alternative embodiment of the present invention.
  • a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing 10 , and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50 .
  • the casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation.
  • the base 11 and the lid 12 are hermetizated by calk, packing, shim, or seal, for keeping the liquid from leaking out of the container 14 .
  • a pair of tubular connectors, for connecting the pipes 100 , 200 to the casing 10 extends outwardly from the lid 12 .
  • the connectors are respectively named as liquid inlet port 18 and liquid outlet port 19 , according to the directions along which the liquid flows in the connectors.
  • the liquid inlet port 18 is disposed at a middle of the lid 12 .
  • the container 14 , the liquid outlet pipe 100 , the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid.
  • the actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1 .
  • a radiator is arranged on the liquid circulation route.
  • a fin member 30 is an example of the radiator.
  • a portion of the liquid outlet pipe 100 enters into the fin member 30 , so that heat, still contained in the liquid after naturally cooled in the casing 10 , is removed to the fin member 30 and is dissipated to ambient air.
  • the liquid is extremely cooled before entering the container 14 for a subsequent circulation.
  • a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30 .
  • FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention.
  • the base 11 comprises an upper surface 110 .
  • the upper surface 110 defines a plurality of grooves 111 therein.
  • the upper surface 110 is divided into a plurality of blocks by the grooves 111 so as to form a recessed structure.
  • Heat exchange surface between the base 11 and the liquid is increased.
  • the liquid enters into the container 14 from the liquid inlet port 18 .
  • the liquid flows on the upper surface 110 and in the grooves 111 to sufficiently absorb heat from the base 11 , so that heat exchange efficiency between the liquid and the base 11 is improved.
  • FIG. 5 shows another type of a base 41 .
  • the base 41 comprises an upper surface 410 .
  • the upper surface 410 defines a plurality of cavities 411 therein. Depth of each cavity 411 is less than that of the base 41 .
  • the design of the base 41 having the cavities 411 also increases heat exchange surface between the base 41 and the liquid.
  • the casing 10 , the fin member 30 and the actuator 50 are positioned separately, and connected by the 100 , 200 in the preferred embodiment of the present invention.
  • the fin member 30 can be directly positioned on the casing 10
  • the actuator 50 can be positioned within the fin member 30 , without the liquid outlet pipe 100 and the liquid inlet pipe 200 , to thereby save space occupied by the liquid cooling device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a base (11) and a liquid inlet port (18) in communication with the container (14). The base (11) comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid, and the rough surface is opposing to the heat-absorbing surface.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is related to a U.S. patent application entitled “LIQUID COOLING DEVICE”, recently filed with the same assignee as the instant application. The disclosure of the above identified application is incorporated herein by reference.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.
  • 2. Description of Related Art
  • Liquid cooling devices were commonly utilized to cool huge systems such as furnaces. Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.
  • Generally, a liquid cooling device comprises a casing, forming a liquid container made of metal material. The casing comprises a base and a lid covering the base. The base is for contacting a cooled component and comprises an upper surface. The lid comprises a liquid outlet and a liquid inlet. Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank. The liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the cooled component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.
  • However, the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.
  • In order to achieve the object set out above, a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing, a liquid inlet port and a liquid outlet port in communication with the container. The casing comprises a container for accommodating liquid therein and a base. The base comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid. The rough surface is opposing to the heat-absorbing surface.
  • Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention;
  • FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1;
  • FIG. 3 is a cross-sectional view of FIG. 2, taken along line III-III;
  • FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention; and
  • FIG. 5 is a view of a base of a casing of a liquid cooling device in accordance with an alternative embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1-3, a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing 10, and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50.
  • The casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation. The base 11 and the lid 12 are hermetizated by calk, packing, shim, or seal, for keeping the liquid from leaking out of the container 14. A pair of tubular connectors, for connecting the pipes 100, 200 to the casing 10, extends outwardly from the lid 12. The connectors are respectively named as liquid inlet port 18 and liquid outlet port 19, according to the directions along which the liquid flows in the connectors. The liquid inlet port 18 is disposed at a middle of the lid 12.
  • The container 14, the liquid outlet pipe 100, the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid. The actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1.
  • For promoting the cooling efficiency of the device, a radiator is arranged on the liquid circulation route. A fin member 30 is an example of the radiator. In the preferred embodiment of the present invention, a portion of the liquid outlet pipe 100 enters into the fin member 30, so that heat, still contained in the liquid after naturally cooled in the casing 10, is removed to the fin member 30 and is dissipated to ambient air. Thus, the liquid is extremely cooled before entering the container 14 for a subsequent circulation. Understandably, a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30.
  • FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention. The base 11 comprises an upper surface 110. The upper surface 110 defines a plurality of grooves 111 therein. The upper surface 110 is divided into a plurality of blocks by the grooves 111 so as to form a recessed structure. Heat exchange surface between the base 11 and the liquid is increased. The liquid enters into the container 14 from the liquid inlet port 18. The liquid flows on the upper surface 110 and in the grooves 111 to sufficiently absorb heat from the base 11, so that heat exchange efficiency between the liquid and the base 11 is improved.
  • FIG. 5 shows another type of a base 41. The base 41 comprises an upper surface 410. The upper surface 410 defines a plurality of cavities 411 therein. Depth of each cavity 411 is less than that of the base 41. The design of the base 41 having the cavities 411, also increases heat exchange surface between the base 41 and the liquid.
  • Moreover, it is understood that other rough surfaces, such as a wave-like surface, can be competent to increase heat exchange surface between the base and the liquid.
  • For showing clearly, the casing 10, the fin member 30 and the actuator 50 are positioned separately, and connected by the 100, 200 in the preferred embodiment of the present invention. However, it is also understood that the fin member 30 can be directly positioned on the casing 10, and the actuator 50 can be positioned within the fin member 30, without the liquid outlet pipe 100 and the liquid inlet pipe 200, to thereby save space occupied by the liquid cooling device.
  • It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims (13)

1. A liquid cooling device comprising:
a casing for accommodating liquid therein, comprising a base and a lid on the base, the base comprising a heat-absorbing surface and a rough surface for exchanging heat with liquid, the rough surface opposing to the heat-absorbing surface; and
a liquid inlet port positioned on the lid and in communication with an inner space of the casing and perpendicularly directing to the rough surface.
2. The liquid cooling device of claim 1, wherein the rough surface defines as a plurality of grooves therein.
3. The liquid cooling device of claim 2, wherein the rough surface is divided into a plurality of blocks by the grooves.
4. The liquid cooling device of claim 1, wherein the rough surface defines a plurality of cavities therein.
5. The liquid cooling device of claim 1, further comprising a liquid outlet port provided on the lid and communicating with the inner space of the casing.
6. A liquid cooling device comprising:
a container comprising a heat-absorbing base and a lid, the base comprising a surface interior of the container, the surface defining a plurality of indents therein;
liquid accommodated in the container;
an actuator;
pipes connecting the container and the actuator;
a liquid inlet port disposed on the lid and is oriented perpendicularly to the base of the container, the liquid inlet port rendering the liquid to enter the container; and
a liquid outlet port which allows the liquid to leave the container when actuated by the actuator.
7. The liquid cooling device of claim 6, wherein the liquid inlet port is located at a middle of the lid and the indents comprise a plurality of grooves.
8. The liquid cooling device of claim 6, wherein the liquid inlet port is located at a middle of the lid and the indents comprise a plurality of cavities therein and depth of the cavities is less than that of the base.
9. The liquid cooling device of claim 6, further comprising a liquid circulation located outside of said container, the liquid circulation having opposite ends thereof connecting with said inlet and outlet ports respectively wherein the liquid inlet port is located at a middle of the lid.
10. The liquid cooling device of claim 9, further comprising a heat sink connected to the liquid circulation.
11. A liquid cooling device for dissipating heat from a heat-generating component, comprising:
a casing disposed next to said component, said casing comprising a container used to receive cooling liquid therein and a base disposed next to said container for thermally contacting with said component to acquire said heat from said component and thermally contacting with said cooling liquid received in said container to transmit said heat to said received cooling liquid via a recessed surface of said base facing said received cooling liquid, and said thermally contacting of said base with said received cooling liquid in said container being achievable by means of receiving portions of said received cooling liquid inside said base via said recessed surface; and
a cooling liquid circulation system connected to said casing and in communication with said container for passage of said cooling liquid so as to urge said cooling liquid moving into said container for acquiring said heat from said base and out of said container for heat dissipation said cooling liquid circulation system comprising a liquid inlet port disposed on said casing and perpendicularly directing to said recessed surface of said base, said liquid inlet port enabling said cooling liquid to enter said container.
12. The liquid cooling device of claim 11, wherein a plurality of grooves is defined on said recessed surface of said base so as to form said recessed surface and divide said recessed surface into a plurality of blocks.
13. The liquid cooling device of claim 11, wherein a plurality of cavities is defined on said recessed surface of said base so as to form said recessed surface.
US11/070,550 2004-06-11 2005-03-02 Liquid cooling device Abandoned US20060096743A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA2004100276624A CN1707785A (en) 2004-06-11 2004-06-11 Liquid-cooled radiator
CN200410027662.4 2004-11-06

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US20060249278A1 (en) * 2005-05-07 2006-11-09 Tay-Jian Liu Liquid cooling system suitable for removing heat from electronic components
US20060290893A1 (en) * 2005-04-21 2006-12-28 Seon-Woo Lim Image projection apparatus and method of cooling an image projection apparatus
US20070024814A1 (en) * 2005-07-26 2007-02-01 Samsung Electronics Co., Ltd. Image projecting apparatus
US20080024988A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080023178A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024989A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080024987A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
DE102007038911A1 (en) * 2007-08-17 2009-02-19 Osram Gesellschaft mit beschränkter Haftung Cooling device and lighting device
US20140027100A1 (en) * 2011-04-03 2014-01-30 Nec Corporation Piping structure of cooling device, method for making the same, and method for connecting pipes
US20140076523A1 (en) * 2012-09-19 2014-03-20 Aaron Ray Batker Pritzker Devices, systems, and methods for cooling electronic device heat spreaders
US20140158326A1 (en) * 2007-08-09 2014-06-12 Coolit Systems Inc. Fluid heat exchange systems
CN104124218A (en) * 2014-08-04 2014-10-29 华进半导体封装先导技术研发中心有限公司 Heat dissipation structure for 2.5D/3DTSV high-power chip package
US20160124474A1 (en) * 2014-11-04 2016-05-05 Fujitsu Limited Evaporator, cooling device, and electronic apparatus
US20160273842A1 (en) * 2015-03-16 2016-09-22 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
US20190174653A1 (en) * 2017-12-06 2019-06-06 Auras Technology Co., Ltd. Liquid-cooling heat dissipating module
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12101906B2 (en) 2007-08-09 2024-09-24 Coolit Systems, Inc. Fluid heat exchanger
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US20060290893A1 (en) * 2005-04-21 2006-12-28 Seon-Woo Lim Image projection apparatus and method of cooling an image projection apparatus
US8256901B2 (en) * 2005-04-21 2012-09-04 Samsung Electronics Co., Ltd. Image projection apparatus and method of cooling an image projection apparatus
US7472743B2 (en) * 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
US20060249278A1 (en) * 2005-05-07 2006-11-09 Tay-Jian Liu Liquid cooling system suitable for removing heat from electronic components
US20070024814A1 (en) * 2005-07-26 2007-02-01 Samsung Electronics Co., Ltd. Image projecting apparatus
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