TWM618947U - Full abnormality positioning analysis platform using artificial intelligence - Google Patents

Abstract

This application proposes a total anomaly location analysis platform using artificial intelligence. The total anomaly location analysis platform includes a huge data storage device and a total anomaly location analysis system, and the huge data storage device is used to store multiple manufacturing primitives. Data, and the manufacturing raw data comes from multiple manufacturing equipment, the full anomaly location analysis system is used to generate multiple different graphical analysis results and a graphical interface, and make the graphical interface selectively include the multiple At least one of the graphical analysis results. In this way, the convenience and efficiency of the analysis of full abnormality positioning are improved, so as to quickly eliminate the abnormality of the manufacturing process and optimize the overall manufacturing process of the product.

Description

Fully anomaly location analysis platform using artificial intelligence

This application relates to a data analysis platform, especially a full anomaly location analysis platform using artificial intelligence.

Generally speaking, the production of semiconductor components requires more than a thousand manufacturing and testing procedures, and the yield of the final product is maintained by sophisticated manufacturing equipment and process design. Therefore, in order to effectively control the manufacturing process of semiconductor components, the manufacturing process All information and data in the process must be collected and analyzed in real time.

With the advancement of the manufacturing process, multiple manufacturing equipment on the production line will generate tens of thousands of real-time monitoring data, nearly 10,000 on-line sampling and inspection measurements (metrology), and hundreds of electrical tests measured at different positions on semiconductor components At the same time, coupled with various integrated circuit production modes, the production line can generate more than billions of huge amounts of data in one month.

Therefore, in order to analyze the huge amount of data generated on the production line, commercial statistical analysis methods are often used in order to quickly find out the cause of process abnormalities. However, the statistical correlation analysis method can only show possible correlation problems, and cannot accurately locate the cause of the abnormality of the process. Also, because the production line generates huge amounts of data at any time, the statistical correlation analysis method cannot complete the corresponding analysis in real time, and the user needs to spend extra Time to find related problems in the results of statistical correlation analysis, and analyze the causes of abnormal processes on their own. As a result, the current statistical analysis methods cannot quickly eliminate process abnormalities.

Based on the above-mentioned problems in the prior art, it is indeed necessary to propose a better solution.

In view of the above-mentioned shortcomings of the prior art, the main purpose of this application is to provide a full anomaly location analysis platform using artificial intelligence, which uses artificial intelligence to analyze huge amounts of data on the production line and generate multiple graphical analysis results with selectivity Provides one of multiple graphical analysis results for viewing. Users can quickly obtain prediction results corresponding to different manufacturing equipment, manufacturing processes, and semiconductor component products through the graphical analysis results, thereby improving the overall abnormal location analysis Convenience and efficiency to quickly eliminate process abnormalities and optimize the overall product process.

In order to achieve the above objective, this application proposes a total anomaly location analysis platform using artificial intelligence, which includes a huge data storage device and a total anomaly location analysis system, wherein the huge data storage device is used to store multiple manufacturing primitives. Data, and the manufacturing raw data comes from multiple manufacturing equipment, the full anomaly location analysis system includes multiple data analysis engines and an interface generation system, and each data analysis engine is used to base at least one part of the manufacturing raw data Different graphical analysis results are generated, and the multiple data analysis engines include a product process anomaly analysis engine, a process time anomaly analysis engine, a process event anomaly analysis engine, a manufacturing equipment signal anomaly analysis engine, and a manufacturing equipment Anomaly analysis engine for generating a plurality of different graphical analysis results, the interface generation system for generating a graphical interface, and selectively making the graphical interface include at least one of the plurality of graphical analysis results .

Based on the above structure, the total anomaly location analysis platform using artificial intelligence can use the huge amount of data collected by it to provide the required analysis results simply and clearly with graphical analysis results, and users do not need to analyze the results by themselves. Or search, you can quickly obtain the required process-related information. In addition, by providing the graphical interface of the operation information of the multiple manufacturing equipment, the user can quickly grasp the overall status of the production line, thereby improving the overall abnormal location analysis Convenience and efficiency.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of the implementation environment of the full anomaly location analysis platform using artificial intelligence in this application. It includes a full anomaly location analysis platform 100, a production line system 200, and an input and output module 300. The abnormal location analysis platform 100 is in communication connection with the production line system 200 and the input and output module 300. The production line system 200 is used to monitor multiple manufacturing equipment on the production line, and collect the manufacturing raw data related to the production line and the multiple manufacturing equipment in real time, and the manufacturing raw data has a time series relationship before and after, so as to control the production line in real time. All states on the production line. The full anomaly location analysis platform 100 is in communication connection with the production line system 200 to receive raw manufacturing data and analyze and predict the raw manufacturing data to generate multiple graphical analysis results and a graphical interface. The graphical interface optionally includes at least one graphical analysis result. In other words, the graphical interface may not include all graphical analysis results at the same time. For example, the graphical analysis result included in the graphical interface is a graphical analysis result corresponding to an abnormal state or a graphical analysis result corresponding to user-selected information. The input and output module 300 is used for receiving and displaying the graphical interface, and for receiving user selection information input by the user.

In this way, a user can quickly confirm the abnormal state or related information of the production line through the graphical analysis results of the graphical interface displayed by the input and output module 300, without having to search for required information among the numerous analysis results. And quickly understand the causes of abnormal conditions in a graphical way of data, thereby improving the convenience and efficiency of massive data analysis.

In one embodiment, the full anomaly location analysis platform 100 is a yield quality engineering analysis decision system.

In an embodiment, the production line system 200 is, for example, a production execution platform, an equipment engineering platform, or a precision manufacturing engineering platform, and the application is not limited thereto.

In one embodiment, the input and output module 300 is, for example, a touch display screen or a display with an input device, such as a keyboard and a mouse, and the application is not limited thereto.

In one embodiment, the production line is a semiconductor device production line, and this application is not limited thereto.

Please refer to FIG. 2, the total anomaly location analysis platform 100 at least includes a central control system 110, a massive data storage device 130, a total anomaly location analysis system 150, a data input interface 170, and an input/output interface 190. Among them, The central control system 110 is electrically connected to the massive data storage device 130, the total abnormal location analysis system 150, the data input interface 170, and the input/output interface 190.

The central control system 110 is used to manage the total anomaly location analysis system 150, and monitor the data exchange among the massive data storage device 130, the total anomaly location analysis system 150, the data input interface 170, and the input/output interface 190 , And dispatch the overall computing, storage, and network resources of the full anomaly location analysis platform 100, thereby improving the resource usage efficiency and operation performance of the full anomaly location analysis platform 100.

In one embodiment, the central control system 110 is, for example, a Composer module, and the application is not limited thereto.

The data input interface 170 is used to communicate with the production line system 200 to receive the multiple pieces of manufacturing raw data.

In one embodiment, the data input interface 170 can be a serial data (RS232) communication interface, a universal serial bus (USB) standard connection port, and this application is not limited thereto.

The massive data storage device 130 is used to store multiple pieces of manufacturing raw data and their corresponding time. The manufacturing raw data are provided by the production line system 200 and come from multiple manufacturing equipment, where each manufacturing equipment is The production line generates corresponding manufacturing raw data over time and process.

In one embodiment, the massive data storage device 130 can be implemented by multiple hard disk storage devices, and the application is not limited thereto.

The total anomaly location analysis system 150 is used for reading at least a part of the multiple manufacturing raw data from the huge data storage device 130, and analyzing at least a part of the multiple manufacturing raw data to Generate the plurality of graphical analysis results and the graphical interface, wherein the graphical interface may selectively include at least one of the plurality of graphical analysis results, in other words, the graphical interface may not include all graphics at the same time Analyze the results.

The I/O interface 190 is in communication with the I/O module 300 to provide the graphical interface to the I/O module 300 and receive user selection information input by the user.

In one embodiment, the I/O interface 190 includes ports that comply with Universal Serial Bus (USB), High-Definition Multimedia Interface (HDMI), and Video Graphics Array (VGA) specifications, and the application is not limited thereto.

In one embodiment, the full anomaly location analysis platform 100 can be implemented by a blade server, and this application is not limited thereto.

In one embodiment, the multiple pieces of manufacturing source data may include product yield (for example, maximum value, intermediate value, minimum value), electrical parameters (WAT), inline metrology, and defects. (defects), production time (time) (for example: on-machine time, off-machine time, waiting time), recipe (for example: prescription type, prescription quantity, formula parameter, etc.), event (for example: formula parameter change, Earthquake events, etc.), types of manufacturing equipment (Model), equipment (such as manufacturing equipment signals), chamber (such as temperature, humidity, and no wind), unit measurement values, etc. , And this application is not limited by this.

Further, the total anomaly location analysis system 150 further includes a plurality of data analysis engines 151 and an interface generation system 153, as shown in FIG. 3, and the plurality of data analysis engines 151 are in communication connection with the interface generation system 153. Each data analysis engine 151 is used to generate a corresponding graphical analysis result according to the received manufacturing raw data, that is, multiple data analysis engines 151 can be mutually used to provide different graphical analysis results. The interface generation system 153 is used to receive the graphical analysis results generated by each data analysis engine 151, and to generate the graphical interface, and selectively make the graphical interface include only the graphical analysis results One of them, for example, only includes the graphical analysis result of the abnormal state, or only the graphical analysis result corresponding to the information selected by the user.

In this embodiment, the multiple data analysis engines 151 include at least a product process anomaly analysis engine 151a, a process time anomaly analysis engine 151b, a process event anomaly analysis engine 151c, a manufacturing equipment signal anomaly analysis engine 151d, and a manufacturing equipment The anomaly analysis engine 151e is shown in FIG. 4, and this application is not limited thereto.

The product process abnormality analysis engine 151a generates a graphical analysis result corresponding to the prescription data based on the manufacturing raw data of the prescription data. Therefore, the user can use the graphical analysis result corresponding to the prescription data (selection of prescription type, number of prescriptions) Adjustments, changes in formula parameters, etc.) Quickly identify abnormal prescription data to eliminate abnormalities in process steps or process parameters.

The process time anomaly analysis engine 151b generates a graphical analysis result corresponding to the prescription data based on the manufacturing raw data of the production time. Therefore, the user can use the graphical analysis result corresponding to the production time to change the production time of each step. Quickly identify abnormal process steps to eliminate abnormal process steps.

The process event abnormality analysis engine 151c generates graphical analysis results corresponding to the prescription data based on the manufacturing raw data of the event data. Therefore, the user can correspond to the event data (such as a machine maintenance event information, a replacement material event information). , An external environmental event information and an adjustment formula event information, etc.) graphical analysis results, to quickly identify abnormal conditions based on the occurrence of events, in order to eliminate process abnormalities.

The manufacturing equipment signal abnormality analysis engine 151d generates graphical analysis results corresponding to the manufacturing equipment based on the manufacturing raw data of the manufacturing equipment signals (for example, the switch of the reaction chamber, the frequency of the motor, etc.). Therefore, the user can correspond to the manufacturing equipment Graphical analysis results of equipment signals are used to quickly identify abnormal conditions based on the status of manufacturing equipment to eliminate process abnormalities.

The manufacturing equipment abnormality analysis engine 151e generates manufacturing raw data corresponding to the process steps based on product yield, electrical parameters, online measurement parameters, defects, production time, prescriptions, types of manufacturing equipment, reaction chambers, unit measurement values, etc. Graphical analysis results. Therefore, users can quickly identify abnormal conditions based on the status of the manufacturing equipment by using the graphical analysis results corresponding to the process steps to eliminate process abnormalities.

In one embodiment, the abnormal state may be a state in which process steps/manufacturing equipment/product components are determined to be abnormal based on the analysis and prediction result of the data analysis engine 151, and this application is not limited thereto. For example, according to a graphical analysis result, the analysis and prediction result shows that the production time is higher than a threshold value, the interface generation system 153 determines that it is an abnormal state and makes the graphical interface include the graphical analysis result, thereby real-time Prompt the user.

In one embodiment, the user-selected information is the information that the user wants to actively view, which includes the graphical analysis result of the full anomaly location analysis platform 100 from the manufacturing raw data obtained by the production line system 200. For example: the user selection information is selection information corresponding to the number of prescriptions, and the interface generation system 153 makes the graphical interface include the graphical analysis result corresponding to the number of prescriptions according to the user selection information, thereby providing the user for viewing .

In one embodiment, each data analysis engine 151 can be implemented by a single board computer executing a corresponding analysis and prediction program, and this application is not limited thereto.

In one embodiment, the interface generation system 153 can be implemented by a single-board computer executing a corresponding interface generation program, and this application is not limited thereto.

In one embodiment, the aforementioned program is used to store a computer-readable memory device of the single-board computer, such as a hard disk device, and this application is not limited thereto.

Please refer to FIG. 5, which is a platform architecture diagram of the data analysis engine 151. The data analysis engine 151 includes at least a pre-processor 1511, an artificial intelligence analyzer 1513, and a post-processor 1515.

The pre-processor 1511 is used for reading the required manufacturing raw data from the massive data storage device 130 according to the analysis and prediction to be performed by the artificial intelligence analyzer 1513. Furthermore, since the artificial intelligence analyzer 1512 of each data analysis engine 151 can be used to execute the same or different analysis and prediction programs, the preprocessor 1511 is based on the analysis and prediction programs executed by the artificial intelligence analyzer 1512. The massive data storage device 130 reads the required manufacturing raw data. For example, the artificial intelligence analyzer 1513 can be used to analyze and predict product yield according to the type of manufacturing equipment. Therefore, in this embodiment, the pre-processor 1511 is used to read the massive data storage device 130 The required manufacturing raw data (type information of manufacturing equipment) for analysis and prediction.

Further, the pre-processor 1511 is used for pre-processing the received manufacturing raw data, that is, screening, cleaning (Clean), unified format (Format), missing value (Missing value) processing, and transforming (Transform) the manufacturing raw data. ) And so on to remove abnormal data and ensure data quality and high prediction accuracy to generate processed data to be provided to the artificial intelligence analyzer 1512.

In one embodiment, the pre-processor 1511 can be implemented in a structured query language (SQL), a data warehouse (Hive), an R language, or a Python language, and this application is not limited thereto. .

The artificial intelligence analyzer 1513 is used to receive processed data, and use its analysis and prediction model to perform second-level operations to calculate and predict the corresponding prediction value (Conjecture value), confidence index (Reliance Index), and overall similarity index of process parameters ( Global Similarity Index) and other analysis results.

Further, the confidence index indicates the credibility of the accuracy of the predicted value. The purpose of the confidence index is to calculate a confidence value between 0 and 1 by analyzing the process parameter data of the manufacturing equipment to determine whether the analysis result can be trusted. And use the maximum tolerable error upper limit (EL) to correspond to the confidence index to obtain the confidence index threshold (RIT). When the confidence indicator value is greater than the confidence indicator threshold, it means that the analysis result can be trusted; on the contrary, when the confidence indicator value is lower than the confidence indicator threshold, a warning is issued. Therefore, users as equipment engineers can use this to inspect manufacturing equipment, or users as process engineers can adjust parameters to confirm whether the process is stable.

The artificial intelligence analyzer 1513 is also used to calculate a similarity index. The main purpose of the similarity index is to compare the degree of similarity between the process parameter data of the prediction section and the modeling section. The similarity index includes two parts, one is the overall similarity index of the process parameters, and the second is the individual process parameter similarity index (ISI). The overall similarity index of the process parameters is the degree of similarity between the process parameters in the prediction section and all the parameters in the modeling section. The individual similarity index of the process parameter is the standardized absolute similarity between any process parameter in the prediction section and all samples of the parameter in the modeling section. The similarity index is also used as an auxiliary confidence index for judgment. Therefore, a user as a process engineer can determine whether to perform parameter adjustment based on the analysis and prediction result of the similarity index to confirm whether the process is stable.

For example, if the confidence index of the prediction point is higher than the confidence index threshold, and the overall similarity index of the process parameter at the prediction point is higher than the overall similarity index threshold of the process parameter, check the individual similarity index display of the process parameter Whether the process parameters are abnormal.

For example, if the confidence index of the prediction point is lower than the threshold value of the confidence index, and the overall similarity index of the process parameters of the prediction point is lower than the overall similarity index threshold of the process parameters, the predicted value may be inaccurate, but due to the prediction The overall similarity index of the process parameters of the point is low, indicating that the new component (such as wafer) has a high similarity with the modeling parameter data. At this time, there may be a situation where the prediction value of the analysis and prediction model is not good.

For example, if the confidence index of the prediction point is lower than the confidence index threshold, and the overall similarity index of the process parameters of the prediction point is higher than the overall similarity index threshold of the process parameters, it means that the prediction value of the analysis and prediction model is not good, and Since the overall similarity index value of the process parameters at the predicted point is high, it means that the new component and the modeling process parameter data are low in similarity, so it can be considered that the predicted value is inaccurate.

For example, when the overall similarity index of the process parameters at each prediction point is higher than the threshold value of the overall similarity index of the process parameters, it indicates that the process parameters may be abnormal.

In addition, since all the manufacturing raw data have a time series relationship before and after, the artificial intelligence analyzer 1513 can accurately and effectively locate the problem. For example, when the time points of abnormal occurrence are denser, the problem can be located.

In one embodiment, the artificial intelligence analyzer 1513 can be implemented by Simple Recurrent Neural Networks (SRNN) and Multiple Regression Analysis (MRA), and this application is not limited thereto .

In one embodiment, the manufacturing raw data received in time by the production line system 200 is further used to update and adjust or retrain the analysis and prediction model, so that the artificial intelligence analyzer 1513 can accurately grasp the operating status of the production line to improve The artificial intelligence analyzer 1513 analyzes and predicts accuracy.

The post-processor 1515 is used to receive the analysis result of the artificial intelligence analyzer 1513, and perform data graphic based on it, to generate the corresponding graphic analysis result, for example, to generate charts, graphs, and distribution diagrams. Graphical analysis results. For example, use a graph to show the yield of multiple manufacturing equipment on the production line. In this way, the user can quickly understand the state or trend of the analysis result of the artificial intelligence analyzer 1513 through the graphical analysis result.

In an embodiment, the post-processor 1515 can be implemented by a data statistical analysis program, and this application is not limited thereto.

According to the above-mentioned embodiments and application methods of this application, the operation method of a full abnormal location analysis platform can be summarized, as shown in Fig. 6, the steps include:

Step S100: Collect multiple pieces of manufacturing original data. A total anomaly location analysis platform 100 is used to receive multiple pieces of manufacturing raw data sent by a production line system 200 and store them in the massive data storage device 130 of the total anomaly location analysis platform 100.

Step S200: perform data analysis. The all anomaly location analysis system 150 of the all anomaly location analysis platform 100 generates a plurality of graphical analysis results according to at least a part of the multiple pieces of manufacturing raw data.

Step S300: Generate a graphical interface, the graphical interface including at least one graphical analysis result. The full abnormal location analysis system 150 is used to generate the graphical interface, and selectively make the graphical interface include at least one of the graphical analysis results, and the graphical interface is used to display the information of the multiple manufacturing equipment Operational information.

Further, step 200 further includes the following steps, as shown in FIG. 7:

Step S210: Obtain the required manufacturing original data. The total anomaly location analysis system 150 includes a plurality of data analysis engines 151, and the preprocessor 1511 of each data analysis engine 151 is used to read the massive data storage device 130 according to the analysis and prediction to be performed by an artificial intelligence analyzer 1513 The manufacturing raw materials required.

Step S230: Perform pre-processing on multiple pieces of manufacturing original data. The pre-processor 1511 further performs pre-processing on the received multiple pieces of manufacturing raw data, and generates corresponding processed data.

Step S250: Perform data analysis on the processed data. The artificial intelligence analyzer 1513 performs analysis and prediction on the processed data and generates corresponding analysis results.

Step S270: Perform post-processing on the analysis result. The post-processor 1515 of the data analysis engine 151 performs post-processing on the analysis result to generate a corresponding graphical analysis result.

In summary, the full anomaly location analysis platform embodiment using artificial intelligence of this application can use the huge amount of data collected by it to use artificial intelligence to provide the required analysis and prediction results simply and clearly with graphical analysis results. Users do not need to analyze or search among the many analysis results to quickly obtain the required process-related information. In addition, by providing the graphical interface of the operation information of the multiple manufacturing equipment, the user can quickly grasp the overall production line Status, thereby improving the convenience and efficiency of full abnormal location analysis.

100: Full anomaly location analysis platform 110: Central Control System 130: Massive data storage device 150: Full anomaly location analysis system 151: Data Analysis Engine 151a: Product process anomaly analysis engine 151b: Process time anomaly analysis engine 151c: Process event anomaly analysis engine 151d: Manufacturing equipment signal anomaly analysis engine 151e: Manufacturing equipment anomaly analysis engine 1511: preprocessor 1513: Artificial Intelligence Analyzer 1515: post processor 153: Interface Generation System 170: data input interface 190: I/O interface 200: Production line system 300: Input and output modules S100, S200, S210, S230, S250, S270, S300: steps

FIG. 1 is a schematic diagram of the implementation environment of an embodiment of a fully abnormal location analysis platform using artificial intelligence according to the present application; Figure 2 is a schematic diagram of the platform architecture of an embodiment of a fully abnormal location analysis platform using artificial intelligence according to the present application; FIG. 3 is a schematic diagram of the platform architecture of an embodiment of a fully abnormal location analysis system using artificial intelligence according to the present application; FIG. 4 is another schematic diagram of the platform architecture of the embodiment of the full anomaly location analysis system using artificial intelligence according to the present application; Figure 5 is a platform architecture diagram of an embodiment of the data analysis engine according to the present application; Fig. 6 is a schematic diagram of a step flow diagram of an embodiment of an operating method according to the present application; and FIG. 7 is a schematic flowchart of another step according to an embodiment of the operating method of the present application.

150: Full anomaly location analysis system

151: Data Analysis Engine

153: Interface Generation System

Claims (10)

A full anomaly location analysis platform using artificial intelligence, which includes: A huge data storage device for storing multiple pieces of manufacturing raw data, which are derived from multiple manufacturing equipment; A full abnormal location analysis system, which is electrically connected to the massive data storage device, includes: A plurality of data analysis engines, each of the data analysis engines is used to generate different graphical analysis results based on at least a part of the manufacturing raw data, and the plurality of data analysis engines include a product process anomaly analysis engine and a Process time anomaly analysis engine, a process event anomaly analysis engine, a manufacturing equipment signal anomaly analysis engine, and a manufacturing equipment anomaly analysis engine; and An interface generation system receives a plurality of graphical analysis results from the plurality of data analysis engines, and is used to generate a graphical interface, and selectively make the graphical interface include at least one of the plurality of graphical analysis results . The full anomaly location analysis platform described in claim 1, wherein each data analysis engine includes: A pre-processor that obtains at least a part of the multiple manufacturing raw data from the huge data storage device, and converts at least a part of the multiple manufacturing raw data into multiple processed data; An artificial intelligence analyzer for receiving and analyzing the multiple processed data and generating corresponding analysis result data; and A post-processor receives the analysis result data and generates at least one of the multiple graphical analysis results. The total anomaly location analysis platform according to claim 1, wherein the total anomaly location analysis platform further includes a central control system, which is in communication connection with the total anomaly location analysis system and the massive data storage device. The full anomaly location analysis platform according to claim 1, wherein the graphical interface only includes the graphical analysis result of the abnormal state. The full anomaly location analysis platform according to claim 1, wherein the preprocessor is a structured query language, a data warehouse, an R language or a Python language. The full anomaly location analysis platform according to claim 1, wherein the artificial intelligence analyzer includes a simple loop-like neural network and a multiple regression analysis. The full abnormal location analysis platform according to claim 1, wherein the multiple pieces of manufacturing raw data include a product yield, an electrical parameter, an online measurement parameter, a defect, a production time, a prescription, and a manufacturing The type of equipment, the signal of a manufacturing equipment, a reaction chamber, and the measured value of a unit. The full abnormal location analysis platform according to claim 1, wherein the multiple manufacturing equipment is used in a semiconductor component production line. The full anomaly location analysis platform according to claim 1, wherein the graphical interface only includes the graphical analysis result of the abnormal state. The full anomaly location analysis platform according to claim 1, wherein the full anomaly location analysis platform is a blade server.

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