SG145540A1 - Semiconductor package singulating system and method - Google Patents
Semiconductor package singulating system and methodInfo
- Publication number
- SG145540A1 SG145540A1 SG200401337-1A SG2004013371A SG145540A1 SG 145540 A1 SG145540 A1 SG 145540A1 SG 2004013371 A SG2004013371 A SG 2004013371A SG 145540 A1 SG145540 A1 SG 145540A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor package
- singulating system
- package singulating
- semiconductor
- singulating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200401337-1A SG145540A1 (en) | 2004-03-12 | 2004-03-12 | Semiconductor package singulating system and method |
KR1020040031334A KR100693334B1 (en) | 2004-03-12 | 2004-05-04 | Semiconductor package singulating system and method |
PCT/SG2004/000157 WO2005087471A1 (en) | 2004-03-12 | 2004-05-31 | Semiconductor package singulating system and method |
MYPI20042234A MY143145A (en) | 2004-03-12 | 2004-06-10 | Semiconductor package singulating system and method |
TW093127237A TWI250621B (en) | 2004-03-12 | 2004-09-08 | Semiconductor package singulating system and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200401337-1A SG145540A1 (en) | 2004-03-12 | 2004-03-12 | Semiconductor package singulating system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG145540A1 true SG145540A1 (en) | 2008-09-29 |
Family
ID=34957445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200401337-1A SG145540A1 (en) | 2004-03-12 | 2004-03-12 | Semiconductor package singulating system and method |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100693334B1 (en) |
MY (1) | MY143145A (en) |
SG (1) | SG145540A1 (en) |
TW (1) | TWI250621B (en) |
WO (1) | WO2005087471A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI410329B (en) * | 2009-03-09 | 2013-10-01 | Ind Tech Res Inst | Apparatus for releasing a flexible device and method thereof |
CN102658394B (en) * | 2012-04-25 | 2014-03-26 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
CN102903679B (en) * | 2012-11-09 | 2014-11-05 | 日月光半导体制造股份有限公司 | Incision fixing fixture |
US9618653B2 (en) | 2013-03-29 | 2017-04-11 | Stmicroelectronics Pte Ltd. | Microelectronic environmental sensing module |
US9082681B2 (en) | 2013-03-29 | 2015-07-14 | Stmicroelectronics Pte Ltd. | Adhesive bonding technique for use with capacitive micro-sensors |
US10429330B2 (en) | 2016-07-18 | 2019-10-01 | Stmicroelectronics Pte Ltd | Gas analyzer that detects gases, humidity, and temperature |
US10254261B2 (en) | 2016-07-18 | 2019-04-09 | Stmicroelectronics Pte Ltd | Integrated air quality sensor that detects multiple gas species |
US10557812B2 (en) | 2016-12-01 | 2020-02-11 | Stmicroelectronics Pte Ltd | Gas sensors |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3976288A (en) * | 1975-11-24 | 1976-08-24 | Ibm Corporation | Semiconductor wafer dicing fixture |
EP1193738A2 (en) * | 2000-09-22 | 2002-04-03 | Ishii Tool & Engineering Corporation | Method and apparatus for manufacturing chips |
US20020083938A1 (en) * | 1999-04-08 | 2002-07-04 | Alois Tieber | Techniques for dicing substrates during integrated circuit fabrication |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6165232A (en) * | 1998-03-13 | 2000-12-26 | Towa Corporation | Method and apparatus for securely holding a substrate during dicing |
US6150240A (en) * | 1998-07-27 | 2000-11-21 | Motorola, Inc. | Method and apparatus for singulating semiconductor devices |
TW423113B (en) * | 1998-09-18 | 2001-02-21 | Towa Corp | Arrangement configured to support substrate during dicing process, and apparatus and method for cutting tapeless substrate using the arrangement |
US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
-
2004
- 2004-03-12 SG SG200401337-1A patent/SG145540A1/en unknown
- 2004-05-04 KR KR1020040031334A patent/KR100693334B1/en active IP Right Grant
- 2004-05-31 WO PCT/SG2004/000157 patent/WO2005087471A1/en active Application Filing
- 2004-06-10 MY MYPI20042234A patent/MY143145A/en unknown
- 2004-09-08 TW TW093127237A patent/TWI250621B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3976288A (en) * | 1975-11-24 | 1976-08-24 | Ibm Corporation | Semiconductor wafer dicing fixture |
US20020083938A1 (en) * | 1999-04-08 | 2002-07-04 | Alois Tieber | Techniques for dicing substrates during integrated circuit fabrication |
EP1193738A2 (en) * | 2000-09-22 | 2002-04-03 | Ishii Tool & Engineering Corporation | Method and apparatus for manufacturing chips |
Also Published As
Publication number | Publication date |
---|---|
TW200531224A (en) | 2005-09-16 |
MY143145A (en) | 2011-03-15 |
WO2005087471A1 (en) | 2005-09-22 |
TWI250621B (en) | 2006-03-01 |
KR20050091614A (en) | 2005-09-15 |
KR100693334B1 (en) | 2007-03-09 |
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