JPWO2022097481A1 - - Google Patents

Info

Publication number
JPWO2022097481A1
JPWO2022097481A1 JP2022527760A JP2022527760A JPWO2022097481A1 JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1 JP 2022527760 A JP2022527760 A JP 2022527760A JP 2022527760 A JP2022527760 A JP 2022527760A JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022527760A
Other versions
JPWO2022097481A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097481A1 publication Critical patent/JPWO2022097481A1/ja
Publication of JPWO2022097481A5 publication Critical patent/JPWO2022097481A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022527760A 2020-11-05 2021-10-21 Pending JPWO2022097481A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184974 2020-11-05
PCT/JP2021/038869 WO2022097481A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022097481A1 true JPWO2022097481A1 (ja) 2022-05-12
JPWO2022097481A5 JPWO2022097481A5 (ja) 2022-10-17

Family

ID=81457260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527760A Pending JPWO2022097481A1 (ja) 2020-11-05 2021-10-21

Country Status (3)

Country Link
JP (1) JPWO2022097481A1 (ja)
TW (1) TW202233414A (ja)
WO (1) WO2022097481A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067341A (ja) * 2005-09-02 2007-03-15 Nippon Mektron Ltd 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
WO2019217388A1 (en) * 2018-05-08 2019-11-14 Macdermid Enthone Inc. Carbon-based direct plating process
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067341A (ja) * 2005-09-02 2007-03-15 Nippon Mektron Ltd 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
WO2019217388A1 (en) * 2018-05-08 2019-11-14 Macdermid Enthone Inc. Carbon-based direct plating process
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Also Published As

Publication number Publication date
TW202233414A (zh) 2022-09-01
WO2022097481A1 (ja) 2022-05-12

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