JPWO2009084392A1 - Mold apparatus and method for manufacturing resin molded product - Google Patents

Abstract

A mold (1) filled with a resin (6), a nozzle (4) for supplying the resin (6), a first electrode and a second electrode, and between the first electrode and the second electrode An insulating layer (1b) provided as a part of the mold (1), a plurality of switches for applying a voltage to both the first and second electrodes, and turning on / off the plurality of switches And a mold apparatus in which the resin (6) is filled in the mold (1) by electrostatic attraction formed by applying a voltage, and resin molding using the mold apparatus This is a product manufacturing method.

Description

  The present invention relates to a mold apparatus using electrostatic attraction and a method for producing a resin molded product using the mold apparatus.

  Nanoimprint technology has attracted attention as a method for producing optical parts and fine shapes such as fine flow paths. For example, as a nanoimprint technique, there is a method of filling a finely shaped mold with a thermosetting resin or an ultraviolet curable resin to obtain a finely shaped resin molded product.

  However, as the mold becomes finer, it becomes difficult to fill the resin. Further, when a fine shape is formed by a mold, a mold release process for releasing from the mold without destroying the shape is important. However, when the mold is subjected to a water-repellent mold release treatment, the influence of the surface tension of the resin is increased, so that the fluidity is hindered.

For example, the following non-patent document discloses a principle using electrostatic attraction (Coulomb force) as a solution to the above problem. FIG. 8 a shows a state in which the resin 33 is in contact with the electrode 32 through the insulating layer 31. Also, as shown in FIG. 8b, by applying a voltage between the resin 33 and the electrode 32, the contact angle of the resin 33 to the insulating layer 31 is reduced by electrostatic attraction via the insulating layer 31, It is known that the resin 33 is easily filled into the mold by applying.

Note that “+” and “−” in FIGS. 8 a and 8 b schematically show that the resin is charged to the plus side through the insulating layer 31.
The title “Electrowetting and electrowetting-on-dielectric for microscale liquid handling” published by Junghoon Lee et al. In 2002 on pages 259-268 of the magazine “Sensors and Actuators” A 95 (2002)

  By the way, when filling a low-viscosity resin (about 200 cp or less) into a mold having a fine shape, if the speed at which the resin spreads is high, bubbles are entrained and voids are generated. However, in the above prior art, the speed at which the resin spreads on the mold can be controlled only by the injection pressure from the nozzle.

  In order to solve the above problems, in the present invention, a mold filled with resin, a nozzle for supplying the resin, a first electrode and a second electrode, and a gap between the first electrode and the second electrode are provided. And an insulating layer constituting a part of the mold, a plurality of switches for applying a voltage to the first and second electrodes, and a control unit for controlling ON / OFF of the plurality of switches. In addition, a mold apparatus in which a mold is filled with resin by electrostatic attraction formed by applying a voltage and a method for manufacturing a resin molded product using the mold apparatus are employed.

  According to the mold apparatus and the method of manufacturing a resin molded product of the present invention, the resin is supplied to the mold from the nozzle, and the switch of the second electrode is sequentially turned on, so that the insulating layer is interposed between the resin and the second electrode. As a result, electrostatic attraction is generated, and the resin is sequentially filled into the mold. At that time, the speed at which the resin spreads to the mold can be controlled, and even when a resin having a low viscosity (about 200 cp or less) is filled into the mold, there is no possibility of entraining bubbles.

1 is a perspective view of a mold apparatus using electrostatic attraction of the present invention. It is a front view of the metal mold apparatus of the present invention. It is AA sectional drawing in FIG. 2 of this invention. It is a figure which shows the middle of filling to the metal mold | die of resin of this invention. It is a figure which shows completion of filling to the metal mold | die of resin of this invention. It is a front view of the metal mold apparatus which is Example 2 of this invention. It is BB sectional drawing in FIG. 6 of this invention. It is a figure which shows the principle of a prior art. It is a figure which shows the principle of a prior art.

  Hereinafter, the form of Example 1 of this invention is shown in FIG. 1 thru | or FIG. 1 is a perspective view of a mold apparatus using electrostatic attraction, FIG. 2 is a front view of the mold, FIGS. 3, 4, and 5 are cross-sectional views taken along line AA of FIG. 2, and FIG. FIG. 4 is a diagram showing the completion of filling of the resin into the mold, and FIG. 5 is a diagram showing completion of filling of the resin into the mold.

  In these drawings, a mold apparatus includes a mold 1 for filling a resin into a predetermined shape, a second electrode 2 for generating electrostatic attraction and filling the mold with the resin, and a second electrode 2. A switch 3 for turning on and off the voltage, a nozzle 4 for supplying resin to the mold 1, and the like are used. The nozzle 4 also serves as the first electrode. The nozzle 4 may be configured not to serve as the first electrode.

The mold 1 is composed of, for example, three layers: a Si substrate 1a, an insulating layer 1b formed of an insulating material such as SiO ₂ or an epoxy resin, and a Si substrate 1c. The Si substrate 1a is formed with a concavo-convex pattern of tens of nanometers to several hundreds of micrometers by a method such as photolithography according to the resin product to be molded. Further, a water-repellent release layer (not shown) that can sufficiently withstand the release is formed on the Si substrate 1a.

  Second electrodes 2a to 2e are embedded in the insulating layer 1b. Five second electrodes 2a to 2e are arranged in the extending direction of the groove portion of the Si substrate 1a. Note that the second electrode is made of a conductive material such as aluminum, and the second electrode and the insulating layer are formed using a sputtering apparatus. At that time, the insulating layer is formed to a thickness of 2000 to 4000 mm, and the second electrode is formed to a thickness of 1000 to 1800 mm. The number of second electrodes is not limited to five and can be determined as appropriate according to the spreading speed of the resin. Thereafter, the die 1 is completed by bonding the Si substrate 1a, the insulating layer 1b, and the Si substrate 1c with an insulating adhesive or the like.

  The mold apparatus includes a plurality of switches 3a to 3e that can turn on / off the plurality of second electrodes 2a to 2e. Moreover, it has the control part which is not shown in figure which performs ON / OFF control of switch 3a-3e.

  The nozzle 4 is also formed as a first electrode by being formed of a conductive material. The nozzle 4 and the second electrodes 2a to 2e (hereinafter referred to as “electrodes 2a to 2e” in the first embodiment) inside the insulating layer 1b. Are electrically connected. Further, the first electrode and the second electrode have a power source 5 for supplying a voltage.

  Next, a method for producing a resin molded product using a mold apparatus will be described. A required amount of resin 6 that is cured by ultraviolet rays is discharged from the nozzle 4 to the mold 1. The resin 6 discharged from the nozzle 4 is filled from the vicinity of the upper portion of the electrode 2a shown in FIGS. 3 to 5 toward the electrode 2e.

  Here, as shown in FIGS. 4 to 5, the switches 3 a to 3 e are turned on in order from 3 a, whereby a voltage of 100 to 500 V is applied between the electrodes 2 a to 2 e and the nozzle 4 by the power source 5. Thereby, electrostatic attraction is formed between the electrodes 2a to 2e and the resin 6, and the resin 6 can be sequentially filled from the vicinity of the upper part of the electrode 2a of the mold 1 in the direction of the electrode 2e. Moreover, the timing which turns ON each switch 3a-3e senses the speed which resin 6 spreads with an image camera, inputs the signal into a control part, and turns ON each switch automatically. More specifically, as a first step, when the supply of resin to the mold is started, the switch 3a is turned on and a voltage is applied between the electrode 2a and the nozzle 4. As the next step, after sensing with the image camera that the resin has sufficiently spread in the vicinity of the electrode 2a, the switch 3b is turned on using the control unit. Then, as the next step, after sensing with the image camera that the resin has sufficiently spread in the vicinity of the electrode 2b, the switch 3c is turned on using the control unit. Similarly, the switches 3d to 3e are turned on. Since the timing for turning on each of the switches 3a to 3e can be easily changed by the control unit, the speed of spreading on the resin mold can be increased or decreased. At that time, the speed at which the resin spreads to the mold is determined by the viscosity of the resin, but if the viscosity of the resin is low, there is no risk of entrainment of bubbles by slowing down the spreading speed, which is effective in preventing voids. It is.

  As described above, in the present invention, the speed at which the resin spreads to the mold can be controlled, and a low viscosity resin (several hundred cp or less) is filled into a mold having a fine structure of several tens of nanometers to several hundreds of micrometers. Even in this case, there is no risk of entrainment of bubbles, and generation of voids can be prevented.

  Although the nozzle 4 is a positive electrode and the electrode 2 is a negative electrode, the nozzle 4 may be a negative electrode and the electrode 2 may be a positive electrode.

  Thereafter, the resin 6 is cured by irradiating the mold 1 with ultraviolet rays. Then, the resin 6 is peeled from the mold 1 to complete the production of the resin molded product.

  Here, the results of filling the resin by changing the material and viscosity are shown in Table 1. Acrylic resin and epoxy resin are prepared as materials, and the viscosities are as shown in Table 1. In addition, the experimental results were evaluated by observing resin molded products molded using an electron microscope (SEM) and confirming the presence or absence of voids. As a result, it was confirmed that no void was generated.

  Hereinafter, the form of Example 2 of the present invention is shown in FIGS. 6 is a front view of the mold, and FIG. 7 is a cross-sectional view taken along the line BB of FIG.

  In the second embodiment, the mold 11 is composed of two layers, an Si substrate 11a and an insulating layer 11b formed of an insulating material such as SiO2 or epoxy resin. The Si substrate 11a and the insulating layer 11b are bonded with an insulating adhesive. Combined. The Si substrate 11a has a concavo-convex pattern of several tens of nanometers to several hundreds of micrometers formed by a method such as etching according to the resin product to be molded. Further, a water-repellent release layer (not shown) that can sufficiently withstand the release is formed on the surface of the mold.

  Second electrodes 12a to 12e are embedded in the insulating layer 11b. Further, five second electrodes 12a to 12e are arranged in the extending direction of the groove portion of the Si substrate 11a. The number of second electrodes is not limited to five, and can be determined as appropriate according to the spreading speed of the resin. Each of the second electrodes has switches 13a to 13e capable of turning on / off the voltage. Furthermore, a control unit (not shown) that automatically controls ON / OFF of the electrode switch is provided.

  Here, since the nozzle 14 is made conductive, it can also be used as the first electrode, and the nozzle 14 and the second electrodes 12a to 12e inside the insulating layer 11b are electrically connected. Other configurations are the same as those of the first embodiment. In the second embodiment, the mold apparatus has a simple configuration as compared with the first embodiment, and the mold apparatus can be manufactured relatively easily.

  In addition, when it experimented on the same conditions as Table 1 of Example 1, it was confirmed that there is no generation | occurrence | production of a void about the completed resin molded product.

Claims (6)

A mold filled with resin;
A nozzle for supplying the resin;
A first electrode and a plurality of second electrodes;
An insulating layer provided between the first electrode and the second electrode and constituting a part of the mold;
A plurality of switches for applying a voltage between the first electrode and the second electrode;
A control unit for ON / OFF control of the plurality of switches,
A mold apparatus, wherein a mold is filled with resin by electrostatic attraction formed by applying a voltage.   The mold apparatus according to claim 1, wherein the second electrode constitutes a part of a mold.   The mold apparatus according to claim 1, wherein the second electrode is embedded in the insulating layer.   The mold apparatus according to claim 1, wherein the nozzle also serves as the first electrode.   2. The mold apparatus according to claim 1, wherein the control unit performs control so that a switch is sequentially turned on from an electrode near the nozzle among the plurality of second electrodes provided.   A method for producing a resin molded product, wherein the mold apparatus according to claim 1 is used.

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