JPS6454740A - Integrated circuit and manufacture thereof - Google Patents

Integrated circuit and manufacture thereof

Info

Publication number
JPS6454740A
JPS6454740A JP62212267A JP21226787A JPS6454740A JP S6454740 A JPS6454740 A JP S6454740A JP 62212267 A JP62212267 A JP 62212267A JP 21226787 A JP21226787 A JP 21226787A JP S6454740 A JPS6454740 A JP S6454740A
Authority
JP
Japan
Prior art keywords
substrate
section
wiring
sections
oxide superconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62212267A
Other languages
Japanese (ja)
Inventor
Takao Shioda
Takeru Fukuda
Koichi Inada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP62212267A priority Critical patent/JPS6454740A/en
Publication of JPS6454740A publication Critical patent/JPS6454740A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Abstract

PURPOSE:To inhibit the damage of an element, and to maintain excellent characteristics by joining a connecting section consisting of an oxide superconductor mounted to a lead section in the element and a wiring section composed of an oxide superconductor set up to a wiring substrate by using a condensing heating means. CONSTITUTION:A circuit substrate 2 is placed onto the top face 3a of a wiring substrate 3. Each connecting section 7... for lead sections 5... formed onto the underside 2a of the substrate 2 is brought into contact respectively with a wiring section 8 shaped to the top face 3a of the substrate 3 at that time. Each connecting section is heated by a condensing heating means through the substrate 3 from the lower section of the substrate 3 composed of a transparent material. Each connecting section is heated by condensing beams to a specified spot diameter by passing beams through a lens 11 from a light source 10, and the connecting sections 7 in the contact sections and the wiring section 8 can be joined firmly without damaging an element 4 on the substrate 2. The connecting sections 7 and the wiring section 8 are shaped from an oxide superconductor, and the substrate 3 is cooled properly, thus maximally putting characteristics such as the high-speed arithmetic operating properties of the element 4 to practical use.
JP62212267A 1987-08-26 1987-08-26 Integrated circuit and manufacture thereof Pending JPS6454740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62212267A JPS6454740A (en) 1987-08-26 1987-08-26 Integrated circuit and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62212267A JPS6454740A (en) 1987-08-26 1987-08-26 Integrated circuit and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6454740A true JPS6454740A (en) 1989-03-02

Family

ID=16619753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62212267A Pending JPS6454740A (en) 1987-08-26 1987-08-26 Integrated circuit and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6454740A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992006518A1 (en) * 1990-09-21 1992-04-16 The Regents Of The University Of California Devices using high-temperature superconductors
US5215959A (en) * 1990-09-21 1993-06-01 University Of California, Berkeley Devices comprised of discrete high-temperature superconductor chips disposed on a surface
US6393309B1 (en) * 1997-11-12 2002-05-21 Com Dev Ltd. Microwave switch and method of operation thereof
JP2020536397A (en) * 2017-10-05 2020-12-10 グーグル エルエルシー Flip chip shaped low footprint resonator

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992006518A1 (en) * 1990-09-21 1992-04-16 The Regents Of The University Of California Devices using high-temperature superconductors
US5215959A (en) * 1990-09-21 1993-06-01 University Of California, Berkeley Devices comprised of discrete high-temperature superconductor chips disposed on a surface
US6393309B1 (en) * 1997-11-12 2002-05-21 Com Dev Ltd. Microwave switch and method of operation thereof
JP2020536397A (en) * 2017-10-05 2020-12-10 グーグル エルエルシー Flip chip shaped low footprint resonator
US11527696B2 (en) 2017-10-05 2022-12-13 Google Llc Low footprint resonator in flip chip geometry
US12120966B2 (en) 2017-10-05 2024-10-15 Google Llc Low footprint resonator in flip chip geometry

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