JPH11277398A - Brittle material cutting wire tool and its manufacture - Google Patents
Brittle material cutting wire tool and its manufactureInfo
- Publication number
- JPH11277398A JPH11277398A JP9828698A JP9828698A JPH11277398A JP H11277398 A JPH11277398 A JP H11277398A JP 9828698 A JP9828698 A JP 9828698A JP 9828698 A JP9828698 A JP 9828698A JP H11277398 A JPH11277398 A JP H11277398A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- abrasive grains
- strands
- twisted
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、単結晶シリコ
ン、水晶、アモルファスシリコン等の脆性材料の切断加
工に用いるワイヤ工具に関するもので、ピアノ線などの
芯材の表面に電着した砥粒で材料(工作物)を切除して
切断を行うワイヤ工具とその製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire tool used for cutting a brittle material such as single crystal silicon, quartz, amorphous silicon, etc., and uses abrasive grains electrodeposited on the surface of a core material such as a piano wire. The present invention relates to a wire tool for cutting and cutting a (workpiece) and a method for manufacturing the same.
【0002】[0002]
【従来の技術】半導体デバイスには、IC基板に用いら
れる単結晶シリコン、発振子に用いられる水晶、太陽電
池や光センサ等に用いられるアモルファスシリコン等の
脆性材料が使われており、これらの材料を高純度、高精
度かつ低価格で製造する技術は、高度エレクトロニクス
社会を支える技術として極めて重要になっている。半導
体デバイスの製造に必要な脆性材料の加工工程の一つ
に、インゴットから多数枚の薄いウエハを切り出すスラ
イシング加工工程がある。スライシング加工において
は、加工による欠損や加工クラック層をできる限り軽減
化することが要求されており、その要求を満たす加工法
として砥粒加工法が広く用いられている。2. Description of the Related Art Semiconductor devices use brittle materials such as single crystal silicon used for IC substrates, quartz used for oscillators, and amorphous silicon used for solar cells and optical sensors. The technology for producing high-purity, high-precision, and low-cost products is extremely important as a technology that supports the advanced electronics society. One of the processing steps of a brittle material necessary for manufacturing a semiconductor device includes a slicing processing step of cutting a large number of thin wafers from an ingot. In slicing processing, it is required to reduce as much as possible defects and crack layers due to processing, and an abrasive grain processing method is widely used as a processing method satisfying the requirements.
【0003】砥粒加工法には固定砥粒方式と遊離砥粒方
式とがあり、脆性材料の切断加工には固定砥粒方式の内
周刃ブレードソーと遊離砥粒方式のマルチワイヤソーと
が主に用いられている。固定砥粒方式は、工具1個当た
りの切断能率は高いが、砥粒の摩耗や目詰まりにより加
工を繰り返すに従って加工能率が低下すること、加工ク
ラックが大きいこと等の欠点がある。また内周刃ブレー
ドソーは、インゴットの大口径化に対応するブレードの
大型化に限界があり、多数の工具で同時加工を行うマル
チソーを実現することが困難であるという欠点がある。[0003] There are a fixed abrasive method and a free abrasive method as abrasive processing methods, and an inner peripheral blade saw of a fixed abrasive method and a multi-wire saw of a free abrasive method are mainly used for cutting brittle materials. It is used for The fixed abrasive method has a high cutting efficiency per tool, but has disadvantages such as a reduction in processing efficiency as processing is repeated due to wear and clogging of abrasive grains, and a large processing crack. Further, the inner peripheral blade saw has a drawback that there is a limit to increasing the size of the blade corresponding to an increase in the diameter of the ingot, and it is difficult to realize a multi-saw that performs simultaneous machining with a large number of tools.
【0004】一方、ワイヤソーは、長いワイヤを2個の
多溝プーリの間に複数回巻回することにより、マルチソ
ーを容易に実現でき、多数枚のウエハを同時切断するこ
とで加工能率の向上を図れ、またインゴットの大口径化
への対応も容易である。しかし遊離砥粒方式は、ワイヤ
1本当たりの加工能率が悪く、砥粒を含んだ加工液(ス
ラリー)を大量に流出しながら加工を行うので、スラリ
ーにより材料や加工機械が汚損される問題や、使用済ス
ラリーの廃棄という問題が生ずる。On the other hand, a wire saw can easily realize a multi-saw by winding a long wire a plurality of times between two multi-groove pulleys, and can improve the processing efficiency by cutting a large number of wafers simultaneously. It is easy to cope with a large diameter ingot. However, in the loose abrasive method, the processing efficiency per wire is poor, and the processing is performed while a large amount of a working fluid (slurry) containing abrasive grains flows out. In addition, a problem of disposal of the used slurry occurs.
【0005】そこでワイヤソーの長所と固定砥粒方式の
長所とを兼ね備えた工具として、ダイヤモンド電着ワイ
ヤが提案された。これはピアノ線などの芯線の表面にニ
ッケルメッキによりダイヤモンド砥粒を電着した工具
で、固定砥粒方式の工具であるから、遊離砥粒方式のワ
イヤソーに比べてはるかに高い切断能率が得られ、かつ
軽油や水などの流動性の高い加工液を用いて切断を行え
るという長所がある。しかしダイヤモンド電着ワイヤ工
具は、工具自体の製造に手数がかかって高価になるた
め、長尺のワイヤ工具を製造することが困難で、遊離砥
粒方式の場合に比べて短いワイヤを用いて切断加工が行
われ、ワイヤ単位長さ当たりの切断負荷が大きく、加工
を繰り返す間に砥粒の摩耗、脱落、目詰まり等による加
工能率の低下が生ずる問題や、加工負荷の増大に起因す
るワイヤ張力の増大によってワイヤの切断事故が発生す
るという問題が生じている。Therefore, a diamond electrodeposited wire has been proposed as a tool having both the advantages of a wire saw and the advantages of a fixed abrasive system. This is a tool in which diamond abrasive grains are electrodeposited by nickel plating on the surface of a core wire such as a piano wire.Since this is a fixed abrasive type tool, a much higher cutting efficiency can be obtained compared to a free abrasive type wire saw. In addition, there is an advantage that cutting can be performed using a highly fluid working fluid such as light oil or water. However, it is difficult to manufacture a long wire tool because the production of the diamond electrodeposited wire tool is troublesome and expensive, and the cutting is performed using a shorter wire compared to the case of the free abrasive method. Machining is performed, the cutting load per wire unit length is large, and the machining efficiency decreases due to abrasion, falling off, clogging, etc. of the abrasive grains during repetition of machining, and the wire tension caused by the increase in machining load There is a problem that a wire cutting accident occurs due to an increase in the number of wires.
【0006】そこでこの発明の発明者らは、ダイヤモン
ド電着ワイヤ工具の切断能率をさらに向上させ、かつワ
イヤ工具の長寿命化を図ることを目的として、芯線の周
囲にダイヤモンド砥粒をスパイラル状に電着し、かつ砥
粒が電着されていない部分に溝を形成したワイヤ工具を
提案している。このような工具によれば、加工液がワイ
ヤ表面の溝を通って加工部に円滑に供給されるため、切
粉が洗い流されて砥粒の摩耗や目詰まりを低減でき、ダ
イヤモンド電着ワイヤ工具の加工能率の向上と長寿命化
に寄与できる。Therefore, the inventors of the present invention have made diamond abrasive grains spiral around the core wire for the purpose of further improving the cutting efficiency of the electrodeposited diamond wire tool and extending the life of the wire tool. A wire tool has been proposed in which a groove is formed in a portion that is electrodeposited and the abrasive grains are not electrodeposited. According to such a tool, since the machining fluid is smoothly supplied to the machining portion through the groove on the surface of the wire, the chips are washed away, and wear and clogging of the abrasive grains can be reduced, and the diamond electrodeposited wire tool is used. Can contribute to the improvement of the processing efficiency and the extension of the service life.
【0007】[0007]
【発明が解決しようとする課題】しかしワイヤの表面に
砥粒をスパイラル状に電着した工具は、ワイヤ表面にス
パイラル状にマスキングを施す工程や、ワイヤ表面にス
パイラル状の溝を形成する工程など、余分の工程を必要
とし、かつそれらの工程の生産性を上げることが比較的
困難である。そのため製造コストが高くなり、工具を安
価に供給することができないという問題が生じた。また
加工部に加工液を十分に供給しようとすると、ワイヤ表
面の溝を深くしなければならず、そうするとワイヤの断
面積の低下と応力集中により、ワイヤの強度が低下して
ワイヤが折損しやすくなり、これを避けるためにワイヤ
を太くすると、スライシング加工時の材料の切除量の増
加により、加工能率と材料の歩留まりの低下が起こると
いうジレンマがある。However, a tool in which abrasive grains are spirally electrodeposited on the surface of a wire has a step of applying a spiral masking to the surface of the wire or a step of forming a spiral groove on the surface of the wire. Requires extra steps and it is relatively difficult to increase the productivity of those steps. As a result, there has been a problem that the manufacturing cost is increased and the tool cannot be supplied at a low cost. Also, in order to supply the machining fluid to the machining area sufficiently, the groove on the surface of the wire must be deepened, and the strength of the wire is reduced due to the decrease in the cross-sectional area of the wire and the concentration of stress, and the wire is easily broken. In order to avoid this, if the wire is made thicker, there is a dilemma that the processing efficiency and the yield of the material decrease due to an increase in the amount of material cut off during slicing.
【0008】この発明はこれらの問題を解決した脆性材
料切断用のダイヤモンド電着ワイヤ工具を得ることを目
的としてなされたもので、加工部への加工液の十分な供
給が可能で、工具を能率良くかつ容易に製造することが
可能で、材料切断時の加工能率及び耐久性のより優れた
砥粒電着ワイヤを得ることを課題としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and has an object to obtain a diamond electrodeposited wire tool for cutting brittle materials, which enables a sufficient supply of a working fluid to a working portion and makes the tool more efficient. It is an object of the present invention to obtain an abrasive grain electrodeposited wire that can be manufactured well and easily, and has more excellent processing efficiency and durability when cutting a material.
【0009】[0009]
【課題を解決するための手段】この発明では、複数の素
線1を縒り合わせて芯線2を形成し、その芯線の表面に
砥粒3を一様に電着したワイヤ工具を提供することによ
り、上記課題を解決している。芯線を形成する素線1の
材質には、従来の芯線と同様抗張力の大きな金属線材、
一般的にはピアノ線を用いる。1本の芯線2を形成する
素線1の数は、2または3とするのが好ましい。砥粒3
はダイヤモンド砥粒が適しており、複数の素線1を予め
縒り合わせて形成した芯線2を砥粒3を充填したニッケ
ルメッキ槽35に通して、芯線2の表面に一様に砥粒3
を電着する。According to the present invention, there is provided a wire tool in which a plurality of strands 1 are twisted to form a core wire 2 and abrasive grains 3 are uniformly electrodeposited on the surface of the core wire. The above-mentioned problem has been solved. The material of the element wire 1 forming the core wire includes a metal wire material having a high tensile strength as with the conventional core wire,
Generally, a piano wire is used. The number of the wires 1 forming one core wire 2 is preferably two or three. Abrasive grain 3
Is suitable for diamond abrasive grains. A core wire 2 formed by twisting a plurality of strands 1 in advance is passed through a nickel plating tank 35 filled with abrasive grains 3 so that the surface of the core wire 2 is uniformly coated with the abrasive grains 3.
Electrodeposit.
【0010】得られたワイヤ工具は、図1及び図2に示
すように、縒り合わされた素線1の露出している表面に
砥粒3がニッケルメッキ層4を介して電着された構造と
なる。複数の素線1を縒り合わせることにより、素線相
互の間に形成されるスパイラル状の谷部(チップポケッ
ト)が加工液の通路となる。As shown in FIGS. 1 and 2, the obtained wire tool has a structure in which abrasive grains 3 are electrodeposited on the exposed surface of the twisted strand 1 via a nickel plating layer 4. Become. By twisting the plurality of strands 1, spiral valleys (tip pockets) formed between the strands become passages for the machining liquid.
【0011】スライシング加工に際してのワイヤ工具の
実質的な直径Dを従来の単一素線からなる芯線と同じに
するには、素線の径は2本縒りのもので1/2、3本縒
りのもので1/2.15としなければならない。従って
芯線の断面積はそれぞれ0.5、0.65となり、単一
素線の場合より当然小さくなるが、ピアノ線などは線径
が細くなるほど単位面積当たりの抗張力が大きくなるの
で、芯線の抗張力の低下はわずかで済み、応力集中がな
いので、表面に溝加工をした単一素線に比べれば抗張力
はかえって大きくなる。In order to make the substantial diameter D of the wire tool at the time of slicing work the same as that of a conventional core wire made of a single wire, the diameter of the wire is 1/2, 3 or 2 twists. It must be 1 / 2.15. Accordingly, the cross-sectional area of the core wire is 0.5 and 0.65, respectively, which is naturally smaller than that of a single strand. However, as the wire diameter of a piano wire becomes smaller, the tensile strength per unit area becomes larger. Is small and there is no concentration of stress, so that the tensile strength is rather large as compared with a single strand having a grooved surface.
【0012】またスライシング加工中にワイヤに捩じれ
を生じて剪断応力が発生するが、素線径が細いために捩
じれによって生ずる剪断応力の値は小さく、この点での
耐久性は大きく改善される。複数の素線1を縒り合わせ
るとき、各素線自体に捩じれを与えないで縒り合わせる
ようにすれば、素線内に縒り合わせによる残留応力を生
じないので、より好ましい。Further, the wire is twisted during the slicing process to generate shear stress. However, since the wire diameter is small, the value of the shear stress caused by the twist is small, and the durability at this point is greatly improved. When the plurality of strands 1 are twisted, it is more preferable to twist the strands without giving twists to the strands themselves, because the strands do not generate residual stress in the strands.
【0013】[0013]
【発明の実施の形態】図3はこの発明の脆性材料切断用
ワイヤ工具7(以下縒り線ワイヤ工具という)の製造装
置の概要を示した図である。図示実施態様の装置は、縒
り線装置11、砥粒電着装置31及び巻取装置51の3
つの装置から構成されている。縒り線装置11において
は、芯線となる縒り線ワイヤ6が作製され、次に砥粒電
着装置31でこの縒り線ワイヤにダイヤモンド砥粒がニ
ッケルメッキによって電着される。そして作製された縒
り線ワイヤ工具7が巻取装置51によってボビンに巻き
取られる。縒り線装置11のボビン支持アームの回転数
と、巻取装置51のボビン52の巻取速度を変化させる
ことにより、任意の縒りピッチを有する縒り線ワイヤ工
具を作製することができる。FIG. 3 is a diagram showing an outline of an apparatus for manufacturing a brittle material cutting wire tool 7 (hereinafter referred to as a stranded wire tool) according to the present invention. The apparatus of the illustrated embodiment includes a stranded wire device 11, an abrasive electrodeposition device 31, and a winding device 51.
It consists of two devices. In the stranded wire device 11, the stranded wire 6 serving as a core wire is produced, and diamond abrasive grains are electrodeposited on the stranded wire by nickel plating in an abrasive electrodeposition device 31. Then, the produced stranded wire tool 7 is wound around the bobbin by the winding device 51. By changing the rotation speed of the bobbin support arm of the twisting device 11 and the winding speed of the bobbin 52 of the winding device 51, a twisted wire tool having an arbitrary twist pitch can be manufactured.
【0014】図4は縒り線装置を示す斜視図である。基
台12に装着した軸受13、13で回転自在に軸支され
た主軸14の先端に回転アーム15が取り付けられてお
り、この回転アームの両端の主軸中心から等しい距離の
ところに、主軸14と平行な軸まわりに自由回転可能に
ボビンホルダ16が装着されている。ボビンホルダ16
には、主軸14と直交する軸まわりに素線となるピアノ
線1を巻回したボビン18が回転可能に装着されてい
る。図4ではボビン及びボビンホルダの一方と回転アー
ムの片側部分がその背後の歯車列を示すために想像線で
示されている。FIG. 4 is a perspective view showing the twisting device. A rotating arm 15 is attached to the tip of a main shaft 14 rotatably supported by bearings 13 and 13 mounted on the base 12, and the main shaft 14 and the main shaft 14 are positioned at equal distances from the center of the main shaft at both ends of the rotating arm. A bobbin holder 16 is mounted so as to be freely rotatable about a parallel axis. Bobbin holder 16
, A bobbin 18 around which a piano wire 1 serving as a strand is wound around an axis orthogonal to the main shaft 14 is rotatably mounted. In FIG. 4, one of the bobbin and the bobbin holder and one side of the rotary arm are shown in phantom lines to show the gear train behind them.
【0015】回転アーム15の背後には、主軸14と同
軸にして太陽歯車19が基台12に固定して設けられて
おり、回転アーム15に自由回転可能に軸着した中間歯
車20が太陽歯車19に噛合し、この中間歯車にボビン
ホルダ16に固定した遊星歯車21が噛合している。主
軸14の後端にはプーリ22が装着されており、ベルト
23を介してモータ24が連結されている。Behind the rotating arm 15, a sun gear 19 is fixedly mounted on the base 12 so as to be coaxial with the main shaft 14, and an intermediate gear 20 rotatably mounted on the rotating arm 15 is provided with a sun gear 19. The planetary gear 21 fixed to the bobbin holder 16 meshes with the intermediate gear. A pulley 22 is mounted on the rear end of the main shaft 14, and a motor 24 is connected via a belt 23.
【0016】モータ24で主軸14を回転しながら2個
のボビン18からピアノ線1を引き出すと、2個のボビ
ンの公転運動により、引き出された2本のピアノ線は縒
り合わされる。一方太陽歯車19、中間歯車20及び遊
星歯車21の作用により、各ボビン18は回転アーム1
5に対して主軸14の回転方向と逆方向に同一速度で回
転駆動させられ、ボビン18は自転しない。すなわちボ
ビン18は常に等しい方向を保ち、従ってボビンから引
き出された2本のワイヤはそれぞれのワイヤ自体には縒
りがかかっていない状態で縒り合わされる。When the piano wire 1 is drawn from the two bobbins 18 while rotating the main shaft 14 with the motor 24, the two piano wires are twisted by the revolving motion of the two bobbins. On the other hand, by the action of the sun gear 19, the intermediate gear 20, and the planetary gear 21, each bobbin 18 is
5, the bobbin 18 does not rotate on its own in the direction opposite to the rotation direction of the main shaft 14 at the same speed. That is, the bobbin 18 always keeps the same direction, so that the two wires pulled out of the bobbin are twisted without twisting each wire itself.
【0017】このようにして製作された縒り線ワイヤ6
は、陰極電極32に接触し、アセトン槽33を通ってワ
イヤ表面が脱脂され、さらに10%塩酸槽34を通って
表面の活性化が図られ、電着メッキ槽35に送られる。The stranded wire 6 thus manufactured
Is contacted with the cathode electrode 32, the surface of the wire is degreased through an acetone tank 33, the surface is activated through a 10% hydrochloric acid tank 34, and is sent to an electrodeposition plating tank 35.
【0018】表面を脱脂、活性化された縒り線ワイヤ6
は、電着メッキ槽35の両側に配置したニッケル板37
を陽極、縒り線ワイヤ6自身を陰極としてニッケルメッ
キされる。第1槽35aでは縒り線ワイヤ6にニッケル
のみが予備メッキされ、メッキ層4とピアノ線表面との
付着力を確実にする。Activated twisted wire 6 whose surface is degreased and activated
Are nickel plates 37 arranged on both sides of the electrodeposition plating tank 35.
With nickel as the anode and the stranded wire 6 itself as the cathode. In the first tank 35a, only the nickel is pre-plated on the stranded wire 6 to ensure the adhesion between the plating layer 4 and the piano wire surface.
【0019】次に縒り線ワイヤ6は(図6は電着メッキ
槽の第2槽35bの要部を示した図である。)第2槽3
5bに設けた砥粒槽35gに導かれる。メッキ液中に設
けた砥粒槽35g内の空間には、ダイヤモンド砥粒3が
充填されている。砥粒槽35gの壁板40には、直径1
0mm程度の孔41が明けられており、そこにテフロン
膜42が張られ、ダイヤモンド砥粒3の流出を防ぐと共
にメッキ液の流入を可能にしている。また、メッキ液の
砥粒槽内への流入を促進するために、メッキ液吸入用パ
イプ43が砥粒槽下部に設けられており、図示しない液
送ポンプで常時吸引されている。砥粒槽35gの上部に
は、縒り線ワイヤ6への砥粒の着床に伴うダイヤモンド
砥粒の減少によって砥粒槽35g内に空洞が生じないよ
う、板状の錘38を挿入して荷重を加えている。Next, the stranded wire 6 (FIG. 6 shows a main part of the second tank 35b of the electrodeposition plating tank).
It is led to 35 g of an abrasive grain tank provided in 5b. The diamond abrasive grains 3 are filled in the space in the abrasive grain tank 35 g provided in the plating solution. The wall plate 40 of the abrasive tank 35g has a diameter of 1
A hole 41 having a diameter of about 0 mm is formed, and a Teflon film 42 is formed on the hole 41 to prevent outflow of the diamond abrasive grains 3 and allow inflow of a plating solution. Further, in order to promote the inflow of the plating solution into the abrasive tank, a plating liquid suction pipe 43 is provided at a lower portion of the abrasive tank, and is constantly sucked by a liquid feed pump (not shown). A plate-shaped weight 38 is inserted into the upper portion of the abrasive grain tank 35g so that a cavity is not formed in the abrasive grain tank 35g due to the decrease in diamond abrasive grains caused by the implantation of the abrasive grains on the stranded wire 6. Is added.
【0020】砥粒槽35gにおいて、縒り線ワイヤ6の
表面に接触しているダイヤモンド砥粒がメッキ層4と共
に縒り線ワイヤ6の表面に着床する。そのあと縒り線ワ
イヤ6は第3槽35cに導かれ、ワイヤ表面の着床の浅
いダイヤモンド砥粒をさらに埋めて固定するために、ニ
ッケルメッキのみが行われる。In the abrasive tank 35 g, the diamond abrasive grains in contact with the surface of the stranded wire 6 land on the surface of the stranded wire 6 together with the plating layer 4. After that, the stranded wire 6 is guided to the third tank 35c, and only nickel plating is performed to further bury and fix the diamond abrasive grains with shallow landing on the wire surface.
【0021】こうして表面にダイヤモンド砥粒を電着さ
れた縒り線ワイヤ工具7は、洗浄槽36を通って洗浄さ
れた後、巻取装置51でボビン52に巻き取られる。The stranded wire tool 7 having the diamond abrasive grains electrodeposited on the surface in this way is washed through a washing tank 36 and then wound up on a bobbin 52 by a winding device 51.
【0022】図5は巻取装置の斜視図である。巻取ボビ
ン52は、タイミングベルト35及びタイミングプーリ
54を介してモータ55によって駆動されている。ま
た、巻取ボビン52の回転力は、クランク機構を有する
継手を介してラチェット爪56に伝達され、ラチェット
爪56を往復運動させてラチェットホイール57を間歇
回転させる。ラチェットホイール57は、巻き取りボビ
ン52が1回転するごとに1ピッチ回転するようになっ
ている。この回転運動は歯車58、59を介して円筒カ
ム60に伝達されている。巻き取りボビン52の手前に
は、縒り線ワイヤ工具7を案内するガイドプーリ61、
61を取り付けたスライダ62がボビン軸と平行に摺動
自在に設けられており、その下方に突出したピン63が
円筒カム60にコイルバネ64の復元力によって押しつ
けられている。巻取ボビン52の回転に伴ってスライダ
62が往復運動し、砥粒を電着されたワイヤ工具は、巻
取ボビン52に整列巻き付けされる。FIG. 5 is a perspective view of the winding device. The winding bobbin 52 is driven by a motor 55 via a timing belt 35 and a timing pulley 54. Further, the rotational force of the winding bobbin 52 is transmitted to the ratchet pawl 56 via a joint having a crank mechanism, and causes the ratchet pawl 56 to reciprocate to rotate the ratchet wheel 57 intermittently. The ratchet wheel 57 rotates by one pitch every time the winding bobbin 52 makes one rotation. This rotational motion is transmitted to the cylindrical cam 60 via the gears 58 and 59. In front of the winding bobbin 52, a guide pulley 61 for guiding the stranded wire tool 7,
A slider 62 to which 61 is attached is slidably provided in parallel with the bobbin axis, and a pin 63 protruding downward is pressed against the cylindrical cam 60 by the restoring force of a coil spring 64. The slider 62 reciprocates with the rotation of the take-up bobbin 52, and the wire tool on which the abrasive grains are electrodeposited is aligned and wound around the take-up bobbin 52.
【0023】次にこのようにして製作した縒り線ワイヤ
工具の切断試験の結果を述べる。切断試験に供した装置
は、図7に概略機構を示す往復動型切断加工装置で、縒
り線ワイヤ工具7の巻取り及び送出し部71、切断加工
部72及びワイヤ張力調整部73を備えている。縒り線
ワイヤ工具7の一端は二連ドラム74の片側に巻回され
ており、ガイドプーリ75を介して張力調整部73及び
切断加工部72を通り、他端が二連ドラム74の反対の
側に巻回されている。二連ドラム74は18度の傾斜を
つけて設置されており、縒り線ワイヤ工具7が送出し及
び巻取りされる際に隣合う縒り線ワイヤ工具相互が重な
り合って、縒り線ワイヤ工具が損傷するのを防止してい
る。Next, the results of a cutting test of the stranded wire tool manufactured as described above will be described. The apparatus subjected to the cutting test is a reciprocating type cutting apparatus schematically shown in FIG. 7 and includes a winding and feeding section 71 of the stranded wire tool 7, a cutting section 72, and a wire tension adjusting section 73. I have. One end of the stranded wire tool 7 is wound around one side of the double drum 74, passes through the tension adjusting section 73 and the cutting section 72 via the guide pulley 75, and the other end is on the opposite side of the double drum 74. It is wound around. The duplex drum 74 is installed at an inclination of 18 degrees, so that when the stranded wire tool 7 is sent out and wound up, the adjacent stranded wire tools overlap each other, and the stranded wire tool is damaged. Is prevented.
【0024】二連ドラム74はステッピングモータ76
に連結されて正転及び逆転することにより、縒り線ワイ
ヤ工具7は往復運動して切断加工部72において工作物
(脆性材料)77を切断する。ワイヤ工具7の張力はト
ルクモータ78により構成された張力調整部73におい
て一定に保持される。The double drum 74 includes a stepping motor 76
When the wire tool 7 is rotated forward and backward, the stranded wire tool 7 reciprocates and cuts the workpiece (brittle material) 77 in the cutting portion 72. The tension of the wire tool 7 is kept constant in a tension adjusting section 73 constituted by a torque motor 78.
【0025】図10に素線径0.1mmφ、縒りピッチ
2、5及び10mmと三段階に設定して作製された縒り
線ワイヤ工具を用いて、切断回数が30回に達するまで
切断加工を行った際に得られた切断能率の挙動を従来の
単一素線のワイヤ工具の切断能率と比較して示した。同
図の黒丸は縒りピッチ2mmの縒り線ワイヤ工具、黒三
角は縒りピッチ5mmの縒り線ワイヤ工具、黒四角は縒
りピッチ10mmの縒り線ワイヤ工具、白丸は素線径
0.2mmφの単一素線ワイヤ工具である。縒り線ワイ
ヤ工具はいずれのピッチにおいても単一素線ワイヤ工具
より高い切断能率を示し、特にピッチが小さくなるにつ
れて切断能率は向上した。FIG. 10 shows a cutting process performed by using a stranded wire tool prepared in three stages of a wire diameter of 0.1 mmφ and a twist pitch of 2, 5, and 10 mm until the number of cuts reaches 30 times. The behavior of the cutting efficiency obtained at this time was shown in comparison with the cutting efficiency of a conventional single-strand wire tool. In the figure, a black circle is a stranded wire tool with a twist pitch of 2 mm, a black triangle is a stranded wire tool with a twist pitch of 5 mm, a black square is a stranded wire tool with a twist pitch of 10 mm, and a white circle is a single wire with a strand diameter of 0.2 mmφ. A wire tool. The stranded wire tool showed higher cutting efficiency than the single strand wire tool at any pitch, especially as the pitch became smaller.
【0026】この理由を図8及び9に示す加工モデル図
によって説明する。図8の単一素線ワイヤ工具の場合、
加工部に供給される加工液はワイヤ工具表面の砥粒間か
らのみ流入可能であり、加工部にまで供給される加工液
量は実際に供給されている量に比べて極度に少ないと考
えられる。このことから研削熱の放熱が行われ難いのみ
ならず、切屑の排出性が低いことに起因して切屑が砥粒
のまわりに残留しやすく、砥粒の目詰まりを引き起こ
し、ワイヤ工具の切削性能を劣化させる。The reason will be described with reference to machining model diagrams shown in FIGS. In the case of the single strand wire tool of FIG.
The working fluid supplied to the working part can flow only from between the abrasive grains on the surface of the wire tool, and the amount of working fluid supplied to the working part is considered to be extremely small compared to the amount actually supplied. . As a result, not only is it difficult to dissipate the grinding heat, but also because the chips are poorly discharged, the chips tend to remain around the abrasive grains, causing the abrasive grains to be clogged and cutting performance of the wire tool. Deteriorates.
【0027】一方、図9の縒り線ワイヤ工具の場合は、
芯線として縒り線を用いることから、ワイヤ工具表面に
チップポケットとなる谷部が形成されており、加工部へ
の加工液の流入が助長され、切屑の排出が速やかに行わ
れるため、砥粒の目詰まりによる切断性能の劣化を防止
できる。縒りピッチが小さくなるにつれて高い切断能率
を示すことから、チップポケットの作用はピッチが小さ
くなるほど向上し、切屑の排出効果が顕著になるものと
考えられる。このことから、縒り線ワイヤ工具を用いる
ことにより、従来の単一素線ワイヤ工具に比べて切削性
能を大幅に向上させることができるのみならず、長寿命
化が可能であることが明らかになった。On the other hand, in the case of the stranded wire tool shown in FIG.
Since the stranded wire is used as the core wire, valleys that become chip pockets are formed on the surface of the wire tool, which facilitates the flow of machining fluid into the machining area and discharges chips quickly, so that the abrasive grains Deterioration of cutting performance due to clogging can be prevented. Since the cutting efficiency becomes higher as the twist pitch becomes smaller, it is considered that the action of the chip pocket improves as the pitch becomes smaller, and the chip discharging effect becomes more remarkable. From this, it is clear that the use of a stranded wire tool not only can significantly improve the cutting performance than the conventional single-strand wire tool, but also can extend the life. Was.
【図1】本発明の縒り線ワイヤ工具の平面図FIG. 1 is a plan view of a stranded wire tool of the present invention.
【図2】図1のA−A断面図FIG. 2 is a sectional view taken along line AA of FIG. 1;
【図3】ワイヤ工具の製造装置の概要図FIG. 3 is a schematic diagram of an apparatus for manufacturing a wire tool.
【図4】製造装置における縒り線装置の斜視図FIG. 4 is a perspective view of a twisted wire device in a manufacturing apparatus.
【図5】製造装置における巻取装置の斜視図FIG. 5 is a perspective view of a winding device in the manufacturing apparatus.
【図6】製造装置における電着メッキ槽の第2槽の要部
斜視図FIG. 6 is a perspective view of a main part of a second tank of an electrodeposition plating tank in the manufacturing apparatus.
【図7】切断加工装置の斜視図FIG. 7 is a perspective view of a cutting apparatus.
【図8】従来のワイヤ工具を用いて加工したときの模式
図FIG. 8 is a schematic diagram when processing is performed using a conventional wire tool.
【図9】縒り線ワイヤ工具を用いて加工したときの模式
図FIG. 9 is a schematic diagram when processing is performed using a stranded wire tool.
【図10】切断回数と切断能率のグラフFIG. 10 is a graph of the number of cuts and cutting efficiency.
1 素線 2 芯線 3 砥粒 4 ニッケルメッキ層 DESCRIPTION OF SYMBOLS 1 Element wire 2 Core wire 3 Abrasive grain 4 Nickel plating layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大多 健太郎 石川県石川郡野々市町扇が丘7の1 金沢 工業大学内 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kentaro Ota 7-1 Ogigaoka, Nonoichi-machi, Ishikawa-gun, Ishikawa Prefecture Inside Kanazawa Institute of Technology
Claims (4)
の表面に砥粒を一様に電着してなる脆性材料切断用ワイ
ヤ工具。1. A wire tool for cutting brittle material, wherein abrasive grains are uniformly electrodeposited on a surface of a core wire formed by twisting a plurality of strands.
あり、砥粒がダイヤモンド砥粒であり、電着メッキ層が
ニッケルメッキ層である、請求項1記載の脆性材料切断
用ワイヤ工具。2. The brittle material cutting wire according to claim 1, wherein the number of the wires forming the core wire is 2 or 3, the abrasive grains are diamond abrasive grains, and the electrodeposition plating layer is a nickel plating layer. tool.
線を形成する工程と、縒り合わせた素線の表面を洗浄し
てその露出した表面に砥粒を電着メッキする工程と、砥
粒を電着した芯線を巻き取る工程とを含んでなる、脆性
材料切断用ワイヤ工具の製造方法。3. A step of twisting two or three strands to form a core, a step of cleaning the surface of the twisted strand and electrodepositing abrasive grains on the exposed surface, Winding a core wire on which abrasive grains have been electrodeposited, the method comprising the steps of:
りに公転しかつ自転しない複数のワイヤボビンから供給
されて縒り合わされることを特徴とする、請求項3記載
の脆性材料切断用ワイヤ工具の製造方法。4. A wire tool for cutting brittle material according to claim 3, wherein a plurality of strands forming a core wire are supplied from a plurality of wire bobbins which revolve around the same axis and do not rotate and are twisted. Manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9828698A JPH11277398A (en) | 1998-03-25 | 1998-03-25 | Brittle material cutting wire tool and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9828698A JPH11277398A (en) | 1998-03-25 | 1998-03-25 | Brittle material cutting wire tool and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11277398A true JPH11277398A (en) | 1999-10-12 |
Family
ID=14215698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9828698A Pending JPH11277398A (en) | 1998-03-25 | 1998-03-25 | Brittle material cutting wire tool and its manufacture |
Country Status (1)
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JP (1) | JPH11277398A (en) |
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JP2007021677A (en) * | 2005-07-19 | 2007-02-01 | Asahi Diamond Industrial Co Ltd | Electrodeposition wire tool |
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