JPH11149538A - Composite ic module and composite ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To unnecessitate the wiring connection of a non-contact coupling element to a composite IC module and to improve the reception characteristic of a non-contact transfer mechanism by forming a first coupling coil arranged in an IC module by means of winding a conductor where insulation coating is executed. SOLUTION: The first coupling coil 8 arranged in the IC module is formed by winding the conductor where insulation coating is executed. In the IC card 1, a signal received by the resonance circuit of the antenna coil 4 with a capacitor 15 is transferred to the second coupling coil 3. After that, the signal is transferred to a composite IC chip 6 by the transducer coupling of the second coupling coil 3 and the first coupling coil 8 in tight coupling arrangement where the second coupling coil 3 and the first coupling coil 8 indicate max. transfer efficiency. The max. transfer efficiency of the transformer coupling of the second coupling coil 3 and the first coupling coil 8 is decided by the selection of a circuit constant number.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an information recording medium, and more particularly, to office automation (Office A).
utomation (so-called OA), factory automation (Factor-y Automation, so-called FA), or I used in the field of security
In an information medium typified by a C card or the like, a contact type in which power is received and a signal is transmitted and received via electrical contacts, and power supply and power reception and signal transmission and reception are performed by an electromagnetic coupling method.
The present invention relates to a composite IC card having both functions of a non-contact type in which a C card is provided in a non-contact state without providing electric contacts.

[0002]

2. Description of the Related Art With the advent of an IC card having a built-in semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card or the like. By itself having an arithmetic processing function, it has become possible to impart high security to an information medium.

An IC card is an ISO (International Orga)
In general, IC cards have a built-in IC such as a semiconductor memory in a card body made of plastic or the like, and are connected to an external read / write device on the surface of the card. Is provided with a metal conductive terminal, and the IC card is inserted into a card slot of the external read / write device for data communication between the IC card and the external read / write device. This is advantageous in applications requiring certainty and security of communication such as mass data exchange and settlement business, for example, credit and electronic wallet applications.

On the other hand, in application to gate management such as entry and exit, authentication is the main communication content, and the amount of communication data is often small, so simpler processing is desired. A technology devised to solve this problem is a contactless IC card. This is a DC power source that provides a space for vibration energy such as high-frequency electromagnetic fields, ultrasonic waves, and light in space, absorbs and rectifies the energy, and drives an electronic circuit built in the card. The frequency of the component is used as it is or is multiplied or divided to provide an identification signal, and the identification signal is transmitted to the information processing circuit of the semiconductor element via a coupler such as an antenna coil or a capacitor.

[0005] In particular, most non-contact IC cards for the purpose of authentication and simple counting data processing include a battery and a CPU (Cent
Radio authentication (Radio Frequency IDentifica) of hard logic without ral processing unit (central processing unit)
tion. Hereinafter, this is simply referred to as RF-ID).
With the advent of this non-contact IC card, the security against forgery and tampering is increased as compared with the magnetic card, and when passing through the gate, the card carrier approaches the antenna unit of the read / write device attached to the gate device or carries the card. All that is required is to touch the read / write device antenna portion of the read / write device, and the complexity for data communication of removing the card from the case and inserting the card into the slot of the read / write device has been reduced.

In recent years, a composite card having a contact-type function having an external terminal and a non-contact-type function of exchanging data by wireless communication has been developed for the purpose of supporting a versatile application with one card. Type IC cards have been devised. It combines the advantages of both high security of contact type CPU processing and convenience of non-contact type CPU processing.

[0007] Generally, a composite IC card is manufactured as follows. An antenna coil made of metal foil for non-contact transmission formed by etching is sandwiched between a sheet and a base material in which a fitting hole of an IC module is opened,
The card body is manufactured by being laminated. At this time,
Two antenna terminals for connection between the antenna coil and the IC module are exposed inside the fitting hole of the card body. On one surface of the IC module, a metal terminal electrode for connection to an external device is formed. An IC is mounted on the other surface, and terminals for connection to an antenna are provided. A conductive adhesive is applied to these terminals. After the IC module is installed in the fitting hole of the card body so that the terminal of the IC module with the conductive adhesive applied to the terminal and the antenna terminal of the card overlap, heat and pressure are applied to the terminal of the IC module. And the antenna terminal are combined, and the mounting is completed.

Although such a mounting method is relatively simple,
It is difficult to check the state of the connection between the IC module and the antenna, and the connection reliability becomes a problem. In addition, the mechanical stress tends to cause deterioration of the connection portion.
Furthermore, since a conductive adhesive application step and a thermocompression bonding step are required to connect the IC module and the antenna,
It is difficult to use a conventional IC card manufacturing apparatus with external terminals, and a new manufacturing line must be installed.

An IC in a card manufacturing process of a composite IC card
As a conventional technique that does not require connection between a module and an antenna, there is a technique disclosed in, for example, JP-A-7-239922. According to this, an IC module for an IC card, the IC module comprising: an IC chip;
A transmission mechanism electrically connected to the IC chip and transmitting information and / or energy to and from an external device;
A non-contact type transmission mechanism comprising a coil or an antenna, and a plurality of terminal electrodes formed by patterning conductors provided on the surface of the support, comprising: a C chip; and a support for supporting the transmission mechanism. And a module capable of supporting both contact and non-contact types, and this IC module is fitted and fixed to a plastic card base.

[0010] Further, as the above-mentioned realizing means, an antenna or a coil for non-contact transmission is provided so as to surround the terminal electrode, or conversely, the antenna is set at the center and the terminal electrode is provided around the antenna. In other words, by storing the non-contact transmitting antenna in the IC module, the connection between the antenna coil and the IC module in the final step of mounting the IC module on the card substrate is eliminated.

However, in the method of providing the antenna coil in a printed pattern around the terminal electrodes of the IC module substrate, the area of a normal IC module is 12 mm ×
Since it is about 12 mm, the size of the antenna coil is not allowed to exceed the above value. Therefore, when the coil is arranged on the outer peripheral portion of the terminal electrode in the IC module, even if a printed coil is formed, only a few turns are taken, and sufficient electric power is affected by the small area of the coil. No signal can be received, and only tight connections with communication distances of a few millimeters or less are allowed. In this case, the effect of adding the non-contact transmission function is small.

The effect of imparting the non-contact transmission mechanism to the contact-type transmission mechanism is obtained by a communication distance of several tens of millimeters to more than one hundred millimeters. In this area, the card is "held" over the antenna of the external read / write device. This makes communication possible. To do so,
It is necessary to increase the area of the coil or increase the number of turns. However, if the number of turns is practical, the embossed area will be applied.

In the latter arrangement of providing the terminal electrodes around the antenna, the intrusion into the embossed area is obvious, and the arrangement largely deviates from ISO7816 which is the standard of an IC card with external terminals. It is unlikely to be done. As a result, other measures must be taken to reduce transmission efficiency and increase transmission efficiency with the printed coil method.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and there is no need to connect an IC module to an antenna coil for non-contact transmission. The present invention provides a composite IC module and a composite IC card which has a receiving sensitivity capable of obtaining a sufficient communication distance, and can maintain a practical operation state of both a contact type and a non-contact type transmission mechanism. Make it an issue.

[0015]

Means provided by the present invention for solving the above-mentioned problems are:
As shown in the figure, the IC module has an IC chip having a built-in contact-type transmission function and a non-contact type transmission function for an IC card, a module substrate having external terminals which are contact-type transmission elements, and a non-contact transmission mechanism. The first coupling coil of the IC module has an antenna element connected to an antenna capable of receiving and transmitting electric power and transmitting / receiving a signal to / from an external reading device and the antenna element. And a second coupling coil of an IC card member prepared to have both functions of a contact type and a non-contact type so as to be tightly coupled to each other. By being provided, the IC module and the antenna can be configured to be connected in a non-contact manner by a transformer coupling, and furthermore, the IC module and the antenna are arranged on the IC module. A first coupling coil, a composite IC module characterized by comprising formed by winding a conductive wire having been subjected to insulating coating.

More preferably, as described in claim 2, the composite IC module according to claim 1 has a basic configuration, and the first coupling coil of the composite IC module is provided around a sealing material of the IC chip. A composite IC module characterized by being wound in a toroidal shape.

Still preferably, as set forth in claim 3, the composite IC module according to claim 1 has a basic configuration, and a first coupling coil of the composite IC module is provided around the module substrate. The composite IC module according to claim 1, wherein the composite IC module is wound.

Alternatively, a composite IC module having both functions of a contact type and a non-contact type, and an antenna element having no electrical connection with the composite IC module are provided. A complex IC card,
The composite IC module includes an IC chip having a built-in contact-type transfer function and a non-contact-type transfer function, a module substrate having external terminals as contact-type transfer elements, and a first coupling coil of a non-contact transfer mechanism. The antenna element includes an antenna for receiving power and transmitting / receiving a signal to / from an external reading device, and a second coupling coil connected to the antenna element. And the second coupling coil of the non-contact transmitting antenna element are arranged so as to be tightly coupled to each other, and the composite IC module and the antenna are configured to be capable of non-contact coupling by transformer coupling. And a first coupling coil disposed in the composite IC module is formed by winding a conductive wire provided with an insulating film. Is an IC card.

More preferably, as set forth in claim 5, the composite IC card according to claim 4 has a basic configuration, and the first coupling coil of the composite IC module includes:
A composite IC card characterized by being wound in a toroidal shape around a sealing material of an IC chip.

Preferably, as set forth in claim 6,
A composite IC card having a basic configuration of the composite IC card according to claim 4, wherein a first coupling coil of the composite IC module is wound around the module substrate.

According to the structure of the composite IC module of the first aspect or the composite IC card of the fourth aspect, the number of turns of the coupling coil can be increased as compared with the case where a printed coil is used.

Further, the structure of the composite IC module of the second aspect or the composite IC card of the fifth aspect is a more specific means for realizing the composite IC module of the first aspect or the composite IC card of the fourth aspect. The first coil of the composite IC module is wound in a toroidal shape around the sealing material of the IC chip.

Also, the configuration of the composite IC module according to the third aspect or the composite IC card according to the sixth aspect is another specific implementation of the composite IC module according to the first aspect or the composite IC card according to the fourth aspect. This is realized by winding a first coil of the composite IC module around the module substrate.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The basic structure and basic principle of a non-contact transmission mechanism according to the present invention will be described with reference to the drawings.

FIG. 5 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention. In FIG. 5, a transmission / reception circuit 101 of a non-contact type external reading device 100 is connected to a transmission / reception coil 102 which is an electromagnetic coupler for supplying power to the non-contact transmission mechanism of the complex IC card 1 and transmitting / receiving information. . On the other hand, the non-contact transmission mechanism of the complex IC card 1 includes an antenna coil 4 that is directly electromagnetically coupled to the transmission / reception antenna 102 of the external reading device 100 and is involved in receiving power and transmitting / receiving information.
1 connected to both ends of the capacitor and forming a parallel resonance circuit
5, a composite IC chip 6 mounted on the composite IC module 2, a first coupling coil 8 connected to the composite IC chip 6, and a signal received by the antenna coil to the first coupling coil 8 with maximum efficiency. Capacitor 15 of parallel resonance circuit
Of the second coupling coil 3 connected to both ends of the second coupling coil. At this time, the connection of the capacitor 15 is in parallel, but it is also possible to suitably select the connection in series between the antenna coil 4 and the second coupling coil 3. It is also possible to omit the capacitor by increasing the line capacitance.

Here, in the case where power and information are transmitted from the external read / write device 100 to the complex IC card 1, the coupling of each coil will be described below. A high-frequency magnetic field is induced in the transmission / reception coil 102 by a high-frequency signal (not shown) generated by the transmission / reception circuit 101 of the external read / write device 100. This high frequency signal is radiated into space as magnetic energy. At this time, when the composite IC card 1 is positioned in the high-frequency magnetic field, the high-frequency magnetic field generated by the transmission / reception coil 102 of the external read / write device 100 causes
Antenna coil 4 and capacitor 15 of composite IC card 1
A current flows through the parallel resonance circuit composed of At this time, the first coupling coil 8 directly connected to the composite IC chip 6,
A current due to the high-frequency magnetic field is also induced in the second coupling coil 3 that is connected to the resonance circuit of the antenna coil 4 and the capacitor 15 and transmits power to the first coupling coil 8, but is induced in the antenna coil 4. Since it is smaller by one order of magnitude or more than the amount, the receiving sensitivity greatly depends on the characteristics of the antenna coil 4.

The signal received by the resonance circuit of the antenna coil 4 and the capacitor 15 is transmitted to the second coupling coil 3. Then, the second coupling coil 3 and the first coupling coil 8
The signal is transmitted to the composite IC chip 6 by the transformer coupling between the second coupling coil 3 and the first coupling coil 8 in a tightly coupled arrangement in which the maximum transmission efficiency is shown. The maximum transfer efficiency of the transformer coupling between the second coupling coil 3 and the first coupling coil 8 is determined by selecting a circuit constant. As described above, the improvement of the reception characteristics is achieved.

Further, by increasing the number of turns of the first coupling coil 8, the coupling coefficient with the second coupling coil 3 increases, and the energy transmitted to the composite IC chip 6 further increases. However, with the current printed wiring board manufacturing technology, the pattern width of 0.1 mm is the limit, and it is difficult for a printed coil to wind several tens of turns in the module base surface of the IC card.

On the other hand, it is possible to form a coil with a conductive wire provided with an insulating film to a diameter of several tens of microns due to the progress of magnetic head technology. Paying attention to the technique, the inventors have devised a means for forming a coupling coil between the composite IC module and the antenna of the present invention by a conductive wire provided with an insulating film.

[0030]

FIG. 1 is a schematic configuration diagram of a composite IC card according to the present invention. A composite IC card 1 according to the present invention is a card in which an antenna substrate 5 having a composite IC module 2 of the present invention, a second coupling coil 3 formed by a printed coil on the surface of a sheet-like resin, and an antenna coil 4 is resin-encapsulated. It consists of a substrate 10.

The composite IC module 2 includes a patterned terminal electrode 7 serving as a contact type transmission section, a composite IC chip 6 having a built-in contact type interface and a non-contact type interface (not shown), and a periphery of the composite IC chip 6, or A first coupling coil 8 of a non-contact type transmission unit formed by a conductive wire provided with an insulating film around a module substrate 9;
And it consists of a module substrate 9. The composite IC chip 6 is mounted on the surface of the module substrate 9 opposite to the surface on which the terminal electrodes 7 are formed. The composite IC chip 6 and the terminal electrodes 7 of the module substrate 9 are connected by through holes. The circuit is formed by thermally welding the composite IC chip 6 and the circuit pattern of the first coupling coil 8 using solder or a conductive adhesive.
This connection can also be realized by wire bonding the circuit formation surface of the composite IC chip 6 and the module substrate 9.

After the composite IC chip 6 is mounted on the module substrate 9 and connected to the circuit, the composite IC chip 6 is sealed with a resin 16 and then an insulating film is formed around the composite IC chip 6 or around the module substrate 9. The composite IC module 2 is completed by winding the conducting wire subjected to the above and connecting the circuit pattern of the module substrate 9 and the terminal of the first coupling coil 8. FIG. 2B shows that the first coupling coil 8 is a composite IC.
The case where the winding coil is formed around the resin sealing 16 of the chip 6 is shown.

Subsequently, the composite IC card 1 according to the present invention is manufactured as follows. First, the second coupling coil 3 and the antenna coil 4 are printed on a resin substrate by using a printed coil.
And a flexible antenna substrate 5 having the capacitor 15 formed thereon. Here, the second coupling coil 3 and the antenna coil 4 may be formed by winding a conductive wire coated with insulation. Vinyl chloride was used as the resin for the antenna substrate 5, but polyimide, polycarbonate, P
ET and the like can be applied, and the material is not fixed to one kind.

Next, the antenna substrate 5 is sealed by injection molding to form the card substrate 10. During molding, the second coupling coil 3 is positioned and arranged so as to overlap the mounting position of the composite IC module 2. The fitting hole 11 of the composite IC module 2 is formed simultaneously with the production of the card substrate 10 by injection molding. Finally, the composite IC module 1 is completed by bonding the composite IC module 2 to the fitting hole 11 of the composite IC module 2 of the card substrate 10. Although vinyl chloride was used as the card base material, any other material such as polycarbonate that can provide sufficient card characteristics can be applied to the present invention.

In FIG. 1A, the card substrate 10 is drawn separately on the front surface and the back surface, but is originally integrated, and in the figure, the card substrate 10 is fitted with the coupling coil in the antenna substrate 5 enclosed in the card substrate. It is modified to clearly explain the relationship with the hole 11.

In the present invention, the card is manufactured by injection molding. However, any method that maintains card characteristics can be applied to the present invention.
An adhesive filling method may be used. The present invention also includes a method of forming the fitting hole 11 of the IC module by hollowing out after the card is formed.

FIG. 2 shows an embodiment in which the first coupling coil 8 is wound around the composite IC chip 6. As preparation for forming the first coupling coil 8, the periphery of the resin seal 16 of the composite IC module 2 manufactured up to the step of resin seal 16 is processed by a cutting means or the like so as to be easily wound. Thereafter, the resin sealing 1 of the composite IC module 2 is performed by a winding machine.
6 is wound directly around. After the winding operation of the predetermined number of turns is completed, the insulating film of the connection terminal of the first coupling coil 8 (not shown) is removed, and the module is connected to a predetermined circuit pattern (not shown) of the module substrate 9.

At this time, the cutting of the resin seal 16 can be omitted by sealing the resin with a mold or the like so as to facilitate the winding when applying the resin seal 16. Instead of winding the winding directly around the composite IC chip 6, a planar coil may be manufactured in a separate process using a coil winding machine and adhered to the module substrate 9 to form the first coupling coil 8. In the present embodiment, the cross-sectional shape of the manufactured coil is a rounded rectangle, but may be an elliptical shape, a circular shape, or another shape, and the present invention does not particularly limit the shape. Absent.

FIG. 3 shows the resin sealing 16 of the composite IC chip 6.
This is an embodiment in which the first coupling coil 8 wound around the coil frame 17 is mounted around the periphery. The first coupling coil 8 is aligned and wound around a groove (not shown) of the coil frame 17. Coil frame 17
The first coupling coil 8 wound around the coil frame 17
And the module substrate 9. Then the first
(Not shown) of the coupling coil 8 is connected to a predetermined circuit pattern (not shown) of the module substrate 9. At this time, by providing terminals for connecting the coils to the coil frame 17, the connection between the module substrate 9 and the first coil 8 can be simplified. Although the cross-sectional shape of the coil frame 17 in this embodiment is a rectangle with rounded corners, it may be circular or another shape as described above.

FIG. 4 shows an embodiment in which the first coupling coil 8 is wound around the end face of the module substrate 9. The first coupling coil 8 can also be formed by applying a winding around the module substrate 9 (thickness direction) of the rounded composite IC module 2. The winding around the module substrate 9 is a composite I
This is executed prior to the mounting of the C chip 6. This may be performed at the end of the manufacturing process of the composite IC module 2 and does not limit the order of the processes. Compound I with rounded corners
Around the module substrate 9 of the C module 2 (in the thickness direction)
Assuming that the thickness of the module substrate 9 is 0.3 mm by applying a winding to the coil, it is possible to wind a coil with a width of 1 mm from the outer shape of the module substrate 9 even in consideration of emboss formation. If the diameter is 0.1 mm, 3 × 10 =
It is possible to wind 30 times. This is five times or more the case where the winding is formed by the print pattern.

[0041]

As is apparent from the above description, the composite IC module according to the present invention is compatible with both the contact type having an external terminal and the non-contact type having a non-contact coupling element such as an antenna coil. Has a possible function, and this complex I
A composite IC card incorporating a C module is provided with a transformer coupling circuit element between the IC module and the antenna coil to receive and transmit power and signals without electrically connecting the IC module and the antenna coil. It was configured to do so.

Then, the transformer coupling element of the IC module is realized by a winding coil, and is directly wound around the resin sealing portion of the IC chip, or is directly bonded to a pre-manufactured flat coil and a module board without a coil. By winding a coil around the frame and bonding this coil frame to the module board, or winding it around the end face of the module board,
By increasing the number of turns of the coupling coil of the module substrate as much as possible within the allowable range, the composite IC card incorporating the composite IC module can convert the electromagnetic energy received by the antenna coil with a high coupling coefficient. It can be combined and transmitted to an IC chip.

As a result, the advantage of the non-contact transmission function, that is, the effect that the communication sensitivity characteristic can be further improved by "holding" the card near the antenna of the external read / write device. Further, by increasing the receiving sensitivity of the card, the communication distance can be increased and / or the transmission output of the external read / write device can be suppressed. This is advantageous for such an IC card because the transmission output for a non-contact type IC card (for a composite IC card) is regulated by the Radio Law. In addition, IC
Since the connection between the module and the antenna circuit built in the card board is unnecessary, the IC card manufacturing process related to the conventional technology of bonding and mounting the IC module in the fitting hole provided in the card board is directly used. It can be used, and even if mechanical stress such as bending stress is applied to the card, there is no danger of failure due to lack of connection points between them.

In summary, according to the present invention, there is no need to connect the IC module to the antenna coil for non-contact transmission, the reception sensitivity is sufficient to obtain a sufficient communication distance, and the contact type and the non-contact type Thus, a composite IC module and a composite IC card can be provided with a technology capable of maintaining both transmission mechanisms in a practical operation state.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an IC module according to the present invention.

FIG. 2 is an explanatory diagram of mounting of a coupling coil of the IC module according to the first embodiment of the present invention.

FIG. 3 is an explanatory view of mounting a coupling coil of an IC module according to a second embodiment of the present invention.

FIG. 4 is an explanatory view of mounting a coupling coil of an IC module according to a third embodiment of the present invention.

FIG. 5 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention.

[Explanation of symbols]

 1 Composite IC card 2 IC module 3 Second coupling coil 4 Antenna coil 5 Antenna substrate 6 Composite IC chip 7 Terminal electrode 8 First coupling coil 9 Joule board 10 Card board 11 Fitting hole 15 Capacitor 16 Resin sealing 17 Coil frame 100 External read / write device 101 Transmitter / receiver circuit 102 Transmitter / receiver antenna

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuo Kobayashi Letterpress Printing Co., Ltd., 1-1-1, Taito, Taito-ku, Tokyo

Claims (6)

[Claims] An IC chip in which an IC module has a contact-type transfer function and a non-contact-type transfer function for an IC card.
The IC module comprises a module substrate having an external terminal as a contact-type transmission element, and a first coupling coil of a non-contact transmission mechanism. Equipped with an antenna capable of transmitting and receiving signals and transmitting and receiving signals, and a second coupling coil connected to the antenna element, and prepared to have both functions of a contact type and a non-contact type. The IC module and the antenna can be configured to be connected in a non-contact manner by a transformer coupling by being disposed so as to be tightly coupled to the second coupling coil of the provided IC card member. In addition, the first coupling coil disposed in the IC module is formed by winding a conductive wire provided with an insulating film. Yuru. 2. The composite IC according to claim 1, wherein the first coupling coil of the composite IC module is wound in a toroidal shape around a sealing material of the IC chip.
module. 3. The composite IC module according to claim 1, wherein the first coupling coil of the composite IC module is wound around the module substrate. 4. A composite IC card comprising a composite IC module having both functions of a contact type and a non-contact type, and an antenna element having no electrical connection with the composite IC module. The composite IC module includes an IC chip having a built-in contact-type transmission function and a non-contact type transmission function, a module substrate having an external terminal serving as a contact-type transmission element, and a first coupling coil of a non-contact transmission mechanism. The antenna element includes an antenna for receiving power and transmitting / receiving a signal from / to an external reading device, and a second coupling coil connected to the antenna element.
The first coupling coil of the module and the second coupling coil of the antenna element for non-contact transmission are arranged so as to be tightly coupled to each other, and the non-contact coupling between the composite IC module and the antenna is possible by transformer coupling. And a first coupling coil disposed in the composite IC module is formed by winding a conductive wire provided with an insulating film. 5. The composite IC card according to claim 1, wherein the first coupling coil of the composite IC module is wound in a toroidal shape around a sealing material of the IC chip. 6. The composite IC card according to claim 1, wherein the first coupling coil of the composite IC module is wound around the module substrate.