JPH0744275A - Air cooling type information processor - Google Patents

Abstract

PURPOSE:To attain proper forced air cooling by using limited air cooling devices, to suppress the increase of a noise, thermal air, and power consumption, and to suppress a production cost. CONSTITUTION:This device is equipped with an air sucking part 710 and an air discharging part 750 arranged at least one part of a casing body, which fetches and discharges air for cooling, members substantially constituted as partition walls which substantially divide the inside space of the casing body, and forms the cooling air passages of at least two systems, and main fan units 7a and 7b arranged on the cooling air passage of each system at least one by one. Plural equipments among equipments are arranged in parallel to the flow of cooling air in a first passage 730 being one system of the cooling air passages, and the other equipments are serially arranged along the flow of cooling air in a second passage 740 being at least the other one system of the cooling air passages.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information processing apparatus having a function of processing and storing information, such as a computer, a file device, a communication control device, a channel device, etc. TECHNICAL FIELD The present invention relates to an air-cooled information processing device that performs cooling.

[0002]

2. Description of the Related Art Generally, an information processing apparatus is a substrate on which an LSI chip such as a central processing unit (CPU) and a memory is mounted,
It is configured by housing various devices such as a storage device and a power supply device in a housing. These devices generate heat as they operate. On the other hand, the usable temperature range (temperature specification) of these devices is usually determined. Therefore, it is necessary to cool the inside of the housing so that the temperature inside the housing falls within the temperature range determined by the temperature specifications of the devices. In particular,
Regarding the operation of semiconductor integrated circuit elements such as CPUs and memories, and hard disk storage devices, the optimum temperature range is narrow, so it is necessary to consider so that they can be cooled reliably.

By the way, as a method of cooling the information processing apparatus, there are water cooling and air cooling. The former requires water supply and drainage facilities, piping, heat exchangers, pumps, etc. For this reason, it becomes a large-scale device, a large space is required for installing a heat exchanger etc. even in the device to be cooled, an accident such as water leakage occurs and maintenance inspection for it is necessary. That the installation environment is restricted due to water supply and drainage,
For the same reason, there are restrictions such as difficulty in moving the information processing device. On the other hand, in the case of air cooling, there are no such problems. Therefore, in recent years, even an information processing device having a relatively large capacity, for example, a device larger than a workstation, is required to be of an air cooling type.

In the air-cooled type device, generally, an intake port for taking in cooling air and an exhaust port for exhausting air are provided in the housing, and a fan is arranged at at least one of the intake port and the exhaust port. It is configured to. For cooling in this air-cooled device, by rotating the fan, the air from the outside of the housing is sucked into the housing and allowed to flow inside the housing, the internal equipment is cooled, and then discharged to the outside of the housing. It is carried out by

As publicly known documents relating to air cooling of the apparatus, there are JP-A-63-108800, JP-A-2-82693,
There are publications such as Japanese Utility Model Publication No. 62-10495 and Japanese Utility Model Publication No. 1-157492. That is, JP-A-63-108800
Japanese Patent Laid-Open Publication discloses a case where cooling is performed using a housing as one flow path. Japanese Unexamined Patent Application Publication No. 2-82693 discloses a technique of cooling equipment by providing a suction unit for circulating air inside and outside a housing and an exhaust fan, and providing a partition wall to separate the flow of air. To do. Actual exploitation 62-10495
Japanese Utility Model Publication No. 1-157492 discloses a cooling fan provided on the upstream side of a package containing a heat generating substrate.
It is disclosed that the heat generating substrate is cooled.

[0006]

By the way, in recent information processing apparatuses, the variety of functions tends to increase the types of equipment to be mounted. Further, in order to improve the performance without enlarging the housing, circuit elements such as semiconductor integrated circuit elements tend to be densely mounted on the substrate. This will increase the heating value. Furthermore, as the amount of information to be handled increases, a large-capacity storage device is required, and a large number of hard disk devices may be mounted due to the configuration of a disk array or the like. In such a case, the temperature specifications of the hard disk device are set strictly in order to improve reliability.

On the other hand, in the conventional forced air cooling system,
With respect to the above-mentioned problems, merely measures are taken to increase the amount of air blown, such as adding a fan or replacing the fan with a powerful one.

However, such a measure is insufficient and causes another problem in the following point. That is, the increase or increase in the number of fans causes an increase in noise, an increase in power consumption, an increase in product cost, and an increase in exhaust air, which deteriorates the office environment, which is not preferable. In addition, no consideration was given to the relationship between the flow of cooling air in the device and the temperature specifications of the devices to be cooled, and even though more fans were installed than necessary, they could be localized. Is occurring with insufficient cooling. If a fan is added to solve the latter problem, the former problem will be exacerbated.

An object of the present invention is to perform appropriate forced air cooling for each of the mounted devices by using a limited cooling device, and at the same time, suppress increase of noise, exhaust air, and power consumption, Moreover, the product cost can be suppressed,
An object is to provide an air-cooled information processing device.

[0010]

In order to achieve the above object, according to one aspect of the present invention, in an air-cooled information processing apparatus comprising a plurality of types of equipment and a housing for accommodating them, Each of them is arranged in at least one place of the housing, and an air supply portion and an air exhaust portion for taking in and discharging cooling air and an inner space of the housing are substantially divided from the air supply portion. At least 2 between exhausts
At least one of the cooling air flow passages includes a member that forms a cooling air flow passage of the system and that is substantially a partition wall, and a main fan unit that is disposed in each of the cooling air flow passages of each system. A plurality of devices among the above-mentioned devices are arranged in parallel to the flow of cooling air in the first flow path that is a system, and a second flow path that is another at least one system of the cooling air flow paths. In the above, there is provided an air-cooled information processing device, wherein a plurality of other devices of the above devices are arranged in series along the flow of cooling air.

In one aspect of the invention described above, an auxiliary device for increasing the cooling capacity for at least one specific device among a plurality of devices arranged in parallel in the first flow path may be further provided. it can. Here, the auxiliary device may be a sub fan that blows air to the specific device.

The specific device includes at least one processor, a memory element group, a plurality of substrates on which these are mounted, and a support member for arranging and supporting these substrates in a substantially rectangular parallelepiped space. Can be the main processing unit having. In this case, the sub-fan is, for example,
It is arranged at the air supply side end of the main processing unit.

Further, one of the devices arranged in the second flow path can be a storage device unit in which a plurality of storage medium driving devices are arranged. In this case, the storage device unit is arranged, for example, in the upstream part of the second flow path.

The air supply part is a part of the outer wall of the housing, and comprises the first
A double structure having an outer wall portion provided with an intake port and an inner wall portion provided with a second intake port inside the outer wall portion with a space for forming a cooling air flow path formed therebetween. can do. The first intake port and the second intake port are preferably arranged at positions that do not overlap each other when viewed from the normal direction.

The main fan unit of the first passage can be arranged on the exhaust side of the passage.

The main fan unit of the second flow path can be a child arranged on the air supply side of the flow path.

The intake port of the main fan unit of the second flow passage can be located downstream of the second intake port of the air supply unit. And, the intake port of the main fan unit and the second intake port of the air supply unit preferably communicate with each other in a space between them, with a member that obstructs the line of sight of one from the other being arranged. Their positional relationship is determined.

A silencer can be loaded in a part of the space surrounded by the inner wall portion and the outer wall portion of the air supply portion.

Although it is specified that the devices are arranged in parallel in the first flow path, this excludes the presence of another device placed in series with respect to the devices arranged in parallel. Not a thing. That is, a plurality of types of devices may be arranged in parallel, and different devices may be arranged downstream of them so as to be in series with them. Similarly, although it is specified that the devices are arranged in series in the second flow path, it is not excluded that some of the devices connected in series are arranged in parallel. For example, one type of device and two arranged in parallel
It is possible that different types of equipment are arranged in series.

[0020]

The air supply section and the exhaust section are arranged at least at one location in a housing that accommodates a plurality of types of equipment. The air supply unit and the air exhaust unit take in and exhaust the cooling air into the housing. In these parts, the internal space of the housing communicates with the outside of the housing. Therefore, by reducing the air supply and exhaust parts as much as possible,
It is possible to prevent noise from the inside of the housing from being radiated to the outside of the housing through these. Further, by reducing the air supply unit and the exhaust unit as much as possible, the cooling air can be efficiently taken in and discharged by a small number of fans.

The internal space of the housing is substantially divided by the members that are substantially partition walls, and at least two systems of cooling air flow paths are formed between the air supply section and the exhaust section.
Then, at least 1 is provided in each of the cooling air flow paths of each system.
The main fan units are arranged one by one. Thereby, it is possible to secure an appropriate air volume for each flow path.

Further, a plurality of devices among the above-mentioned devices are arranged in parallel with the flow of the cooling air in the first flow path which is at least one system of the cooling air flow path. As a result, it is possible to cool equipment having relatively close cooling temperature specifications and having a relatively small cross-sectional area for passage of cooling air with fresh cooling air having a low temperature.

In the second flow path, which is at least one other system of the cooling air flow path, a plurality of other devices out of the above devices are arranged in series along the flow of the cooling air flow. The devices arranged in this flow path are supplied with the same amount of cooling air. However, in the downstream of the flow path, the temperature of the cooling air is higher than that in the upstream due to the heat radiation from the equipment located upstream. Therefore, in the second flow path, a device having a low upper limit temperature and a device that requires a sufficient amount of cooling air is arranged on the upstream side. On the downstream side, equipment with a high maximum temperature is placed. This allows a plurality of devices to be cooled by the common main fan unit.

By further providing the auxiliary device for at least one specific device among the plurality of devices arranged in parallel in the first flow path, the cooling capacity of the device can be enhanced. By providing, for example, a sub fan as the auxiliary device, it is possible to increase the wind speed of the cooling air supplied to the device, thereby increasing the cooling capacity.

Furthermore, by making the air supply portion have a double structure, it is possible to prevent the noise of the fan or the like generated in the housing from being directly radiated to the outside.

In addition to this, by stacking the devices arranged in parallel in the first flow path and stacking the devices arranged in series in the second flow path, It is possible to efficiently store a large number of devices in the limited space and to allow the cooling air to reach all the devices.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. In describing the embodiments, the overall configuration will be described first, and then the detailed configuration will be described.

1. Overall Configuration The information processing apparatus according to the present embodiment includes a high-speed RISC (Restored Instruction Set Computer) processor with a cache memory, a main memory,
It includes a main processing unit including a system bus and a controller that connect them, a storage device unit having a plurality of hard disk storage devices, a communication device unit, a power supply unit, a cooling device, and the like. Further, the information processing apparatus of this embodiment houses these units and the like in a housing. Therefore, first, as an overall configuration, the system configuration of the present embodiment, the external configuration of the housing, and the mounting structure of each device in the housing will be sequentially described.

1.1 System Configuration FIG. 1 shows a system outline of a computer which is an embodiment of the information processing apparatus of the present invention. The apparatus of this embodiment includes a CPU package (CPU base board) 36 that constitutes a main processing unit, a console 123, and an RS232C.
Basic I / O controller 126 for connecting and controlling the interface 124 / Centronics interface 125 and the like
A storage device unit (sometimes referred to as an HDD unit) 5 in which a plurality of HDD (hard disk drive) devices 108 are arranged in an array, a DAT (digital audio tape recorder) device 31, an MT (magnetic tape recorder) device 130. , The communication control unit MCI
SCSI (Small Computer System Interface) Controller 13 for controlling connection of (Multiple Communication Interface Controller) 131 etc.
2, an Ethernet LAN (local area network) connection adapter ENA (Ethernet adapter) 133, and an FDDI (fiber distributed data interface) connection adapter FAS (FDDI)
Adapter single attachment) 134 and SCSI
An HPS (high performance server) bus 135 for controlling connection between the LAN 132, the ENA 133 and the FAS 134.

The CPU package 36 is a high-speed RISC processor module 15 with a cache memory.
A large-capacity main memory 17 for program and data processing, a system bus 120 connecting the RISC processor and various peripheral controllers, and the system bus 12
0 and MI which is the controller of the main memory 17
(Memory interface) 122, LAN 127 or C
IOBC (I / O bus controller) 129 for controlling connection of A (communication adapter) 128, and HP
BA (bus adapter) 14 that controls connection of the S bus 135
Has 0 and.

FIG. 2 shows a CPU which is a main processing unit.
An outline of the logical configuration of the package 36 is shown. The RISC processor module 15, the MS (main memory) middle card (memory module) 19, the OSC (oscillator) package (OSC module) 16, and the BA package (BA module) 20 are mounted on the CPU package (CPU base board) 36. Each module of is implemented.
In addition, MCU (memory control unit) 121,
An MI (memory interface) 122 that controls the processor bus 136 and the system bus 137 is further mounted.

The RISC processor module 36 comprises a high-speed RISC chip package 13 and a large capacity cache memory 14, and is connected to a processor bus 136 of 8 bytes / 60 MHz. MS Middle Card 1
9 is composed of four blocks. Eight MS packages 18 (memory sub-modules) are mounted in one block and connected to the MCU 121. OS
The C package 16 is mounted with a high-speed transmission circuit and distributes a clock to each module. BA package 20 is 8 bytes / 30 MHz system bus 1
I connected to 37 and controlling connection of the basic IO bus 138
BA1 that controls connection between OBC129 and HPS bus 139
It consists of 40.

1.2 External Structure of the Case FIGS. 3 to 6 are external views of a computer which is an embodiment of the present invention. FIG. 3 is a perspective view of the housing 1 of the computer. FIG. 4 shows a front view thereof, and FIG. 5 shows a rear view thereof. FIG. 6 shows a right side view thereof. FIG. 7 is a perspective view showing a state in which the front panel of the housing is released.

The housing 1 has a main body 83 and a front panel 82 on its front surface. The front panel 82 includes a fixed panel 82a, a main opening / closing panel 82b, and a sub opening / closing panel 82c. An indicator 104 for display is provided on the sub open / close panel 82c, and it is possible to perform display such as power-on and system operation. The main opening / closing panel 82b and the sub opening / closing panel 82c are openable / closable, as shown in FIG. Main opening / closing panel 82
A decorative panel 97 is attached to the front part of b.
As shown in FIG. 6, the decorative panel 97 slightly protrudes forward.

FIG. 7 shows a state in which the main opening / closing panel 82b and the sub opening / closing panel 82c of the front panel 82 are opened. When the sub opening / closing panel 82c is opened, the operation parts of the control panel 106, the DAT 31, and the 8 mm MT (cassette media tape recorder) 143 appear, and these can be operated from here. When the main opening / closing panel 82b is opened, the main breaker 107a of the power switch 107 and the charging breaker 107b appear, and by turning on these, the computer 1000 can be accessed.

At the contact portion of the main body 83 with the peripheral portions of the main opening / closing panel 82b and the sub opening / closing panel 82c, a trapping member 83m having a magnet is provided. As a result, when the main opening / closing panel 82b and the sub opening / closing panel 82c are closed,
Locking is performed by restraining each panel with the capturing member 83m.

The main body 83 of the housing 1 has an air supply panel 28 on its back surface, side plates 95 on both sides, and a top plate 94 on its upper surface.
The bottom surface has a bottom plate 160. A ventilation hole 105 is provided in the air supply panel 28. The ventilation hole 105 of the air supply panel 28 constitutes a part of an air supply unit 710 described later. The air supply panel 28 also serves as the cable cover 10 in this embodiment.

A skirt 26 and casters 25 are provided on the bottom of the housing 1. The skirt 26 is attached to the entire front surface, both side surfaces, and a part of the back surface. Further, on both side portions of the skirt 26, for example, 5
An exhaust port 119 of about mm square is opened. This ensures the exhaust area. Also, as described below,
In the exhaust part 750, the punching material 2 having many small holes is provided.
7 is attached.

Further, in this embodiment, the appearance color of the casing 1 is
The achromatic color is mainly gray, which is in harmony with the installation environment. Further, the paint color of the front panel 82 and the main body 83 and the resin molding portion 86 adjacent to the front panel 82 are made to have different colors. Therefore, from a distance, it matches the achromatic color used on many floors, so that the housing 1 can be fitted to the floor. On the other hand, it is not necessary to consider the color inconsistency due to the material difference when the steel plate and the resin are adjacent to each other, and the color inconsistency due to the difference in the deterioration rate of the material, by making the tints different in part .

As described above, according to the present embodiment, the housing 1 is entirely made of a steel plate, so that the devices housed inside the housing can be magnetically shielded.

On the other hand, the concave portion 85 formed in the decorative panel 97
Further, since the resin molding portion 86 is attached, the distortion of the front panel 82 in the diagonal direction is reduced, so that the weight of the front panel 82 can be reduced and the steel property can be achieved.

Further, since the resin molding portion 86 capable of various design processing can be miniaturized and the mold can be made smaller, various design development can be achieved at low cost.

Further, by projecting the resin molding portion 86, the resin molding portion 86 can have a bumper function. Moreover, the resin-molded portion 86 has a concave-convex pattern 9
By providing 9, the strength of the resin molded portion 86 and the decorative panel 97 can be further increased.

1.3 Mounting Structure FIGS. 8 to 10 show the mounting structure of a computer according to an embodiment of the present invention. FIG. 8 is a perspective view showing the front side of the computer 1000. Further, FIG. 9 shows a computer 100.
It is a perspective view which can see the back side of 0. Further, FIG. 10 is a plan view of the computer 1000.

The computer 1000 has the hardware resources of the system configuration described above. Here, when considering them as devices that can be treated as having a unified form, the computer 1000 according to the present embodiment.
Can be said to be equipped with the following equipment. That is, as shown in FIGS.
Is a main processing unit (CPU unit) 2 that is the heart, a basic I / O (input / output) package unit 3, and a basic DC / D that is an electrical converter.
A C converter 4a and a storage device unit (hereinafter also referred to as an HDD unit) 5 for storing information 5
And an AC that is an electricity supply unit and is composed of a plurality of converters.
/ DC converter 6, cooling fan unit group 7 which is a cooling device, CPU backboard 8 which is an intermediary portion for electricity and signals, HDD backboard 9, and line unit 11
8. Expansion I / O (input / output) package 141, cable cover 10 that is the exterior of the housing,
It is equipped with a battery 11 that is a power storage device. Each HDD 108 of the storage device unit 5 is fixed by the HDD backboard 9.

Here, the cooling fan unit group 7 is composed of a plurality of fan units of main fan units 7a and 7b functioning as main fans and a sub fan unit 7c used for local cooling, as will be described later. Distributed.

The equipment to be mounted can be appropriately changed according to the specifications of the computer. However, the form and size of each device and the mounting position in the housing 1 are determined in advance. As a result, even if the specifications are changed, it is possible to minimize the change in the mounting position in the housing. Also, the cooling system does not require any special changes.

From the viewpoint of mounting, the main processing unit 2 is composed of the following packages.
That is, the LSI package 12 (MI122, MCU in FIG. 2) that mediates the exchange of data between the CPU and the memory.
121), a RISC chip package for the brain, two RISC processor modules 15 equipped with a cache memory (detailed view 12) for temporarily storing data, and an OSC package for controlling the operating frequency of the RISC chip. 16 and four MS middle cards 19 constituting the main memory and a BA (bus adapter) package 20 having a role of mediating different signal lines are mounted. The BA package 20 has a connector for transmitting an electric signal to the expansion I / O package 141.
The RISC processor module 15 is
For example, PA-RISC manufactured by Hewlett-Packard Company is used. The MS middle card 19 is an MS (main storage) package 1 in which a large number of memories are mounted on both sides.
8 can be mounted in 8 stages at the maximum (see FIG. 22).

1.3.1 Overall Structure of Cooling System Next, the overall structure of the cooling system for cooling the devices in this embodiment will be described.

Cooling system 700 applied to this embodiment
As shown in FIGS. 44 and 9, are arranged in the housing 1 at one place each, and an air supply portion 710 and an exhaust portion 750 for taking in and discharging cooling air, and an internal space of the housing 1. Is substantially divided by the partition member 760,
A first flow path 730 and a second flow path 730 that are two systems of cooling air flow paths formed between the air supply unit 710 and the exhaust unit 750.
The flow path 740 includes a main fan unit 7a arranged in the first flow path 730 and a main fan unit 7b arranged in the second flow path 740.

In the present embodiment, each wall member 760 is a plate-shaped member, but is not limited to this. That is, any member may be used as long as it is a member that has a function of separating the flow passages and is substantially a partition wall. For example, the side surface of the device itself, the substrate, or the like may be used as the partition wall. Also, the partition member may be omitted if the channels are substantially separated.

In the first flow path 730, a plurality of devices among the above devices are arranged in parallel with the flow of cooling air. Further, in the second flow path 740, a plurality of other devices of the above devices are arranged in series along the flow of the cooling air. That is, in the first flow path 730, the cooling air that has flowed into the housing 1 from the air supply unit 710 is diverted to each device, and is then discharged from each device and merged, and the main fan unit 7a
After that, it is discharged to the outside of the housing via the exhaust unit 750.
In the second flow path 740, the air supply unit 710 is connected to the housing 1.
The cooling air that has flowed in flows through the main fan unit 7b of the intake port 720 and along each device, and the exhaust unit 75
It is discharged to the outside of the housing via 0.

The allocation of the arrangement of each device to the first and second flow paths is selected according to the temperature specification of each device.
Next, the factors that determine this temperature specification will be described.

First, the HDD unit 5 will be described. In each HDD of the HDD unit 5, a disk is rotated by a motor when the power is turned on. The storage capacity of the HDD is proportional to the product of the rotational speed of the disk and the average byte speed (bytes / sec) of the track. For example, an HDD having a disk rotation speed of 5400 rpm and a track byte average speed of 3.7 megabytes / sec has a storage capacity of 2 gigabytes. From the above, there is a tendency to increase the number of rotations of the disk in order to increase the storage capacity of the HDD. Since the HDD always rotates at high speed as soon as the power is turned on, the bearing of the motor heats up. The thermal deformation of the bearing shortens the life of the HDD. Therefore,
It can be seen that the HDD is particularly severe in temperature.

Further, in the main processing unit 2 and the basic I / O package unit 3, which are logic units, it is necessary to lower the temperature of the semiconductor in order to increase the calculation speed. For example, if the temperature of 10 ° C. is lowered, the calculation speed is doubled. Further, if the temperature distribution of each mounted LSI can be made uniform, the reliability is further improved.

Next, the basic DC / DC converter 4a and the AC / DC converter 6 have a conversion efficiency of 78, respectively.
% And 85%. During conversion, 22 and 15% are generated as heat, respectively. However, the AC / DC converter 6
Since there are almost no semiconductors related to operating temperature, the temperature is not as severe as other devices and packages.

Further, in the case of the line unit 118, since the power consumption is small, the air temperature in the vicinity may rise by about 5 degrees as compared with the main processing unit 2 and the basic I / O package unit 3.

From the above discussion, the upper limit temperature of the air near the HDD unit 5, the main processing unit 2, the basic I
/ O package unit 3 and basic DC / DC converter 4a have a temperature of 50 ° C, and line unit 118 has a temperature of 55 ° C.
The temperature is 60 ° C. in the AC / DC converter 6. In addition, the upper limit temperature of the semiconductor device and device surface is determined by
55 ° C., main processing unit 2, basic I / O package unit 3 85 ° C., basic DC / DC converter 4a 70 ° C., line unit 118 85 ° C., AC
The temperature is 90 ° C. in the / DC converter 6.

Therefore, with respect to the main components, the flow of the cooling air is as follows. In the first flow path 730,
Air supply unit 710 → (main processing unit 2, basic I / O package unit 3, basic DC / DC converter 4a)
The cooling air flows in the order of the main fan unit 7a and the exhaust unit 350. In the second flow path 740, the air supply unit 710 → (bypass path 711, expansion I / O package 141) → main fan unit 7b → HDD unit 5 → (AC / D
C converter 6, line unit 118) → exhaust section 750
Cooling air flows in the order of. However, the elements are arranged in parallel in the parentheses. This is FIG. 8-10, FIG. 16, FIG.
4, FIG. 45, FIG. 46 and FIG.

In this embodiment, the expanded I / O package 141 is located between the air supply section 710 and the main fan unit 7b in the second flow path 740. But,
Since the bypass paths 711 exist in parallel, the air supply unit 710
The cooling air from the air is sucked into the main fan unit 7b through the bypass passage 711. Therefore, package 1
Even if there is cooling air that has passed through 41, it is hardly affected by a rise in temperature. This package 141 is an expansion package and may not be mounted. However, since the expansion I / O package 141 also functions as a soundproof barrier for noise reduction, as described later, when not mounted, it is preferable to arrange a dummy box or panel of a corresponding shape.

The air supply section 710 is a part of the outer wall of the housing,
The air supply panel 28 provided with the first intake port 714 in which a large number of vent holes 105 are arranged in a rectangular area is provided on the outer wall portion 71.
2, and a box-shaped inner wall portion 713 provided with a second intake port 715 is attached to the inside thereof with a space for forming a flow path of cooling air.
The air supply unit 710 has a double structure including an outer wall portion 712 and an inner wall portion 713. First intake 714 and second
The intake ports 715 of the above are arranged at positions that do not overlap each other when viewed from the normal direction. The air supply unit 710 has such a double structure, and the first intake port 71
The reason why the positions of the No. 4 and the second intake ports 715 are shifted is to prevent the noise from the main fan unit 7b and the like from being directly radiated.

A filter 29 is attached to the second intake port 715 to prevent dust and the like from entering.
Furthermore, a muffling material 152 is attached to a part of the inner wall portion 713. As the sound deadening material 152, for example, a thickness of 15 mm
Some glass wool is used. Installation is, for example,
This can be performed by attaching glass wool to the inner wall portion 713 with a double-sided tape.

On the exhaust side of the first flow path 730, the casing 1
The main fan unit 7a is arranged near the bottom inside the bottom plate 160. Main fan unit 7a
As shown in FIG. 16, has a cross flow fan 30. In the first flow path 730, cooling air is shunted on the air supply side of each device such as the main processing unit 2 and merges on the exhaust side thereof. The main fan unit 7 a sucks the combined cooling air and discharges it from the opening 160 a provided in the bottom plate 160 to the outside of the housing 1 through the exhaust unit 750.

By the way, according to the UL standard, the diameter of the opening located at the bottom of the heat source is about 2 mm so that the fire from the heat source does not fall onto the floor and cause a fire.
The punching material having the following punch holes is used. In addition, a punching material having punch holes of 4Φmm is used for the opening not located under the heat source to prevent invasion of small animals such as insects and mice. In this embodiment, in order to cope with this, the punching holes 27a of 2 to 4Φmm are formed on the exhaust surface.
The punching material 27 having the is arranged. As a result, the wind speed at the exhaust unit 750 can be reduced, and the noise and the like generated when the cooling wind 22 collides with the floor can be extremely reduced.

On the other hand, if the exhaust port of the cooling air 22 is arranged at the lower part of the heat source, the cooling air must be discharged to the outside of the computer 1 through the punching holes 27a of the punching material 27 having a diameter of about 2 mm or less. However, when the cooling air 22 is discharged through such a small hole, the pressure loss increases, and the static pressure of the fan must be increased. Therefore, the load of the cooling fan increases and the noise tends to increase. . In order to improve this, the punching material 27 has a box-shaped (concavo-convex) structure to increase the exhaust area.

A typical form of the punching material 27 is
This is shown in FIGS. 16 and 48. That is, the example of FIG.
This is a box-shaped structure, and in the example of FIG. 48, the convex area 27b is provided in a part of the box-shaped structure to increase the opening area.

As will be described later, on the air supply side of the main fan unit 7a, as shown in FIG.
A duct 33 is provided which divides the intake cross section of 0b.

The main fan unit 7b is arranged at the intake port 720 of the second flow path. As shown in FIG. 42, this unit 7b includes two cross flow fans 30 and
Case 72 that supports these cross flow fans 30
1 and a panel member 722 for forming the intake port 720 at the front of the case. Panel member 722
As shown in FIG. 30, a large number of ventilation holes 723 are provided in the. A punching material can be used as the panel member 722. One of the reasons for using such a panel member 722 is to reduce noise from the cross flow fan 30.

The reason why two crossflow fans 30 are arranged in the main fan unit 7b is that the length of one of the crossflow fans 30 is shorter than the length of the flow path cross section. That is, the cross flow fan 30
By arranging two units with their positions displaced in the longitudinal direction, the shortage of the length is compensated.

Further, the cross flow fan 30 of the main fan units 7a, 7b is constructed so that it can be operated at a variable speed, as will be described later, and the wind speed can be changed as necessary. Therefore, for example, as shown in FIG. 26, one of the packages of the basic I / O package unit 3 is used as a control board, the temperature sensor 34 is attached to the control board, a control circuit is provided, and the output of the control circuit is provided. The number of rotations of the motor can be changed by the signal. As an example, when the supply air temperature is 30 degrees or lower, the drive voltage is 17V, and when the supply air temperature is 30 degrees or higher, the drive voltage is 24V, and the supply amount of the cooling air 22 from the cross flow fan 30 can be changed.

1.3.2 Local Cooling In the present embodiment, in addition to the main cooling in the first flow path and the second flow path described above, the cooling capacity of the specific equipment arranged in the first flow path is increased. It is configured to further include an auxiliary device for strengthening. That is, the sub fan unit 7c that blows air to the specific device is provided as an auxiliary device. Further, the duct 33 is provided as an auxiliary device having a function of ensuring the cooling air volume.

In this embodiment, local silent cooling is performed for cooling the RISC processor module 15, the OSC package 16, and the basic DC / DC converter 4a shown in the overall structural drawings of FIGS. The local silent cooling is to cool the high heat generating portion (heat spot) with a flow rate as small as possible by controlling the flow of air before and after the fan, and as a result, the computer 1000 with a fan having a smaller capacity and less noise. The whole is to be cooled. The HDD in the second flow path 740
Since the unit 5 is immediately after the main fan unit 7b, it is subjected to a cooling effect similar to the local cooling described here.

First, the RISC processor module 15
The cooling will be described. Regarding this, the cooling capacity is being enhanced by the individual forced air cooling method. The RISC processor module 15 is, for example, a PA71000 series board manufactured by Hewlett-Packard Company.
At least one RISC processor module 15 is mounted on the main processing unit 2. In this embodiment,
As shown in FIG. 12, two sheets are mounted.

The structure of the RISC processor module 15 is shown in FIG. On the RISC processor module 15, one RISC chip package 13 and 20 or more cache memories 14 are mounted on both sides, and an electrical signal is transmitted by the male connector 49a. The RISC chip package 13 is provided with a disk-shaped heat radiation fin 62a for better cooling.

FIG. 12 is a top view of the entire main processing unit 2. The main processing unit 2 includes a case 190.
Two RISC processor modules 15 and OSC packages 16 are arranged on one end side (air supply side) of the above, and four MS middle cards 19 are arranged on the other end side. A local cooling fan unit 7c is attached to the outside of the air supply side end of the case 190. An OSC package 16 for controlling the RISC processor module 15 is provided next to the RISC processor module 15.
There is.

In addition, the sub-fan unit 7 for local cooling
c is 80 manufactured by Sanyo Electric Co., Ltd. for supplying the cooling air 22.
An x80 × 25 mm ³ axial fan 23a and a jet port 24 which is a discharge port of the cooling air 22 are provided. An axial fan 23a is provided in the local cooling fan unit 7c.
The axial fan 23a has a size of about 80 mm, a maximum flow rate of about 1 m ³ / min, and a single noise level of about 30 dB. The jet port 24 has a rectangular shape.

From the viewpoint of cooling the RISC processor module 15, the disk-shaped heat radiation fin 62a.
There is a problem in that the cache memory 14 on the downstream side of is difficult to cool. This is because the cooling air from the axial fan 23a is somewhat blocked by the disk-shaped heat radiation fins 62a (particularly the column portion) and is heated considerably while passing through the heat radiation fins 62a.

FIG. 13 shows a specific example of cooling the RISC processor module 15 according to the present invention. In the embodiment shown in FIG. 13, four rectangular jet ports 24 are provided in the local cooling sub-fan unit 7c. Since the RISC processor module 15 is located between the two jet holes 24, it is cooled from both sides. As a result, the flow velocity along the substrate is increased, and the cache memory 14 behind the RISC chip package 13 is cooled well.

In the present embodiment, the RISC chip package 13 and the cache memory 14 are designed so that their temperatures are both below a temperature with a sufficient margin with respect to the upper limit value 110 ° C. The reliability of the RISC chip package 13 and the cache memory 14 is better as the operating temperature is lower. For example, if the maximum temperature of the junction in the wiring layer of the device can be used at 85 ° C. or lower, the upper limit value is around 110 ° C. It is empirically known that the reliability and speed of the operation are significantly improved as compared with the case of using in.

In the embodiment of FIG. 13, the cross flow fan 30 for cooling the entire computer 1000 is used.
When the axial flow fan 23a is operating, the RISC processor module 15 is cooled in the same manner even when is stopped. On the contrary, even when the axial fan 23a is stopped, a parallel flow is formed by the cross flow fan 30,
The RISC processor module 15 has an upper limit value of 110 ° C.
It works with: Therefore, it can be said that the cooling is duplicated.

In the above embodiment, the axial fan 23a is provided on the upstream side of the RISC processor module 15. However, even when the axial fan 23a is not provided, the duct 103 as shown in FIG. Can be done and a fairly good cooling performance can be obtained.

The OSC package 16 adjacent to the RISC processor module 15 is cooled on one side by a jet flow from the axial flow fan 23a and on the other side by a parallel flow by the cross flow fan 30.
Cooling of the elements on the substrate is much better than in the case of cooling with a parallel flow of zero.

Further, this embodiment can be modified and constructed as shown in FIG. That is, the opening 10 of the duct 103 of the local cooling fan unit 7c.
3a may be extended to the position where the OSC package 16 is present. As a result, the cooling air 22 from the axial fan 23a can be supplied to the IC chip on the back surface of the OSC package 16. As a result, the reliability of the OSC package 16 can be improved.

In FIGS. 44 and 45, in the HDD unit 5, the outlet of the crossflow fan 30 is arranged so that the high-speed cooling air 22 discharged from the crossflow fan 30 located immediately upstream of the HDD unit 5 uniformly and directly hits each disk. A duct 741 that extends from the end to the end is provided. For this reason, the cooling of each disk is very good, and it has succeeded in obtaining the same thermal reliability as the disk in a general-purpose large-sized computer.

Further, in the basic DC / DC converter 4a, in particular, a large amount of cooling air has to flow, so as shown in FIG. 16, the air supply port 3 of the cross flow fan 30 is used.
The duct 33 is provided up to 0b. This makes the cooling very good. That is, the duct 33 that divides the intake cross-sectional area of the intake port 30b is provided on the air supply side of the main fan unit 7a. This duct 33
It is provided to secure the cooling air volume for the basic DC / DC converter 4a. Here, the duct 33 is
Since the intake port 30b is arranged along the axial direction of the crossflow fan 30, the intake port 30b of the crossflow fan 30 is divided according to the angle. In this case, the cross flow fan 30 is less likely to be affected by load balance fluctuations. Therefore, the generation of noise in the cross flow fan 30 is suppressed. On the other hand, when the axial direction of the crossflow fan 30 is divided, if the load balance in the axial direction of the crossflow fan 30 is different, the rotating shaft of the crossflow fan 30 vibrates and noise is generated.

1.3.3 Cooling Function In this embodiment, as described above, the space inside the housing 1 is
The main fan unit 7 is divided into a flow passage and a second flow passage.
A and 7b respectively perform overall cooling.
In addition, in the present embodiment, the main processing unit 2
Local silent cooling is performed for cooling the RISC processor module 15 and the OSC package 16 and the basic DC / DC converter 4a.

Further, regarding the details of the cooling action of each of the first flow path and the second flow path, FIG. 8, FIG. 9, FIG. 42, and FIG. 16 which is an AA cross section of FIG. 8 and FIG. This will be described with reference to FIG. 44, which is a cross-sectional view taken along line BB of FIG.

First, the cooling action in the first flow path 730 will be described. The cooling air 22 is supplied from the ventilation holes 105 of the air supply unit 710 in the right half of the air supply panel 28 (which is on the front side in FIG. 16 and not directly shown) on the rear surface of the housing shown in FIG. Inflow, passing through the left half surface of the inner cover to which the filter is attached (shown by a broken line), and the housing 1
Flows into the interior of. After that, the cooling air 22 is expanded I / O
Package unit 141 and main processing unit 2
719 between the inner wall of the intake panel 28 and the guide panel 739 that covers the side surfaces of the base I / O package unit 3 and part of the surfaces of the basic DC / DC converter 4a (see FIGS. 42 and 44). Pass through. Then, a part of the cooling air 22 further goes around the right side surface (the left side surface when viewed from the rear side) of the housing 1. Due to the presence of the guide panel 739, the flow of the cooling air that has flowed into the housing 1 is adjusted so that the cooling air flows substantially evenly toward the openings of the devices arranged in parallel. That is, on this panel 739, the basic I / O
By covering the back side of the package unit 3 and the basic DC / DC converter 4a, the cooling air that has flowed into the housing 1 is cooled by the basic I / O package unit 3 and the basic D.
It prevents the chaotic flow into the C / DC converter 4a. As a result, the cooling air can be guided to the opening described later and can be quantitatively distributed according to a predetermined opening cross-sectional area. Therefore, as a fan of limited ability,
It is possible to cool each device without excess or deficiency.

In the vicinity of the main processing unit 2, the cooling air flows into the main processing unit 2 through the punch hole of the opening 733 at the end portion on the right side surface of the housing 1. And
It flows into the inside of the main processing unit 2 from the side of the axial fan 23a, and flows horizontally along each substrate of the main processing unit 2 (see FIG. 12).

Further, the cooling air flowing toward the vicinity of the guide panel 739, the opening 734 provided in the guide panel 739,
Punch holes 735, 736 and 737 and basic DC
From the punch hole of the opening 738 at the end of the / DC converter 4a, the basic I / O package unit 3
It flows into the C converter 4a. Then, it passes between the substrates.

The main processing unit 2 and the basic I / O described above
Package unit 3, basic DC / DC converter 4a
The cooling air 22 that has passed through merges in the cavity 732 above the cross flow fan 30 and is sucked by the cross flow fan 30. Cooling fan unit 7a
After flowing out from the cooling air 22, the cooling air 22 flows into the opening 160 of the floor board 160.
flowing out from the vent hole 27a of the punching material 27 in a,
It passes under the skirt 26 and the casters 25 and is discharged to the outside of the housing 1.

Here, the main processing unit 2, the basic I /
O package unit 3, basic DC / DC converter 4
The flow rate of the cooling air passing through each of a is generally determined by the opening cross-sectional area of each. In this embodiment, the opening 7
33, 734, 735, 736, 737 and 738. In other words, the sizes of these openings are predetermined in order to determine the distribution of the cooling air volume that should flow into the respective devices arranged in parallel.

Therefore, if a higher cooling capacity is required, an auxiliary device is required. Here, the main processing unit 2 is provided with a sub-fan unit 7c to enhance the speed of the cooling air passing through the unit to improve the cooling capacity. Further, regarding the basic DC / DC converter 4a, the duct 33 is provided to secure a constant flow rate of the cooling air.

Next, the cooling action in the second flow path will be described.

As shown in FIG. 44, the cooling air 22 is
It flows in from the right half of the air supply panel 28 that is the same as the flow path, flows out from the left half surface of the inner cover to which the filter 29 is attached (shown by a dashed arrow), and flows into the expansion I / O package unit 141. After flowing out of the expansion I / O package unit 141, it is sucked into the cooling fan unit 7b. Further, after the inflow from the air supply panel 28, the bypass 7
11 (see FIG. 42), the main fan unit 7b
Is sucked into.

In the former case, it is sucked from the openings 141x and 141y of the expansion I / O package unit 141, flows obliquely or horizontally between the expansion I / O package units 141, and is discharged from the opening 141z on the downstream side. In particular, the DC of the expansion I / O package unit 141
In order to flow a large amount of cooling air to the / DC converter 4b, the air supply port of the expansion I / O package unit 141 to the DC / DC converter 4b is widened.

In the latter case, after the air supply panel 28 has flowed out, it is not directly sucked into the main fan unit 7b in which two cross flow fans 30 are arranged, but in the vicinity of the rear portion of the expansion I / O package unit 141. It is supposed to be sucked in. That is, the air supply port 720 of the main fan unit 7b is located only near the back surface of the expansion I / O package unit 141, and is open only in the area corresponding to the expansion I / O package unit 141.

As shown in FIGS. 42 and 16, the extension I
A region 144 related to the / O package unit 141) A silencer 152 is attached to the air supply panel 28 by a double-sided tape in a place other than the region 144.

After the outflow of the cross flow fan 30, the flow path of the cooling air 22 is bent, passes through the duct 741 which spreads toward the end, passes through the HDD unit 5, the AC / DC converter 4, the line unit 118, and the first flow path 730. Similarly, it flows out from the punching material 27 of the floor plate, passes through the exhaust port (small port) of the skirt 26 and the gap between the skirt 26 and the floor, and is discharged to the outside of the housing 1 of the computer 100.

The cross flow fan 30 has a basic I
The rotation speed is controlled by a control signal from the control board of the / O package unit 3. That is, the control circuit of the control board of the basic I / O package unit 3 changes the temperature of the temperature sensor 34 attached to the control circuit,
Change the motor speed.

Further, in FIG. 47, the HDD of the computer 1
Unit 5, AC / DC converter 6, line unit 1
18 channels will be shown. FIG. 47 is a top view of the front half of the computer 1. (Disconnect above HDD unit 5) Cooling air blows between HDDs 108, AC / D
The main AC / DC converter 70, which is a part of the C converter 6, and the INPUT 67 are mounted so as to flow along the long 148 and half 149 packages of the line unit 118.

By adopting such a cooling structure, the following effects can be expected.

First, by providing two cooling flow paths in the computer 1, the temperature level in each heating element can be reduced uniformly as compared with the case of one system, and the temperature distribution between heating elements can be made uniform. it can.

Secondly, by individually providing the cooling fan on the upstream side of the high heat generating element, the cooling air having a high flow rate can be supplied to the high heat generating element, and the heat transfer coefficient with the cooling air increases. The temperature of the high heating element can be reduced. Moreover, since the load on the main fan can be reduced by individually providing the sub-fans, it is not necessary to use a powerful fan as the main fan. Therefore, it is possible to avoid problems such as noise increase, power consumption increase, and cost increase caused by the strengthening of the fan.

Thirdly, by installing the cross flow fan 30 inside the housing 1, noise such as noise generated by the rotation of the fan and collision sound that collides with an object at the fan outlet is reduced. It is effective in reducing noise by preventing it from flowing out.

Fourthly, the provision of the skirt 26 on the bottom of the housing 1 minimizes the noise and the like generated when the cooling air 22 collides with the floor, and prevents dust and dirt from scattering indoors. By providing the exhaust port 119 in the skirt 26, the exhaust passage is provided in addition to the bottom of the skirt 26, and the cross-sectional area of the flow path is increased, so that the pressure loss can be reduced and the cooling air flow can be reduced. Can be increased.

Fifth, since the duct 33 is provided in the exhaust portion of the basic DC / DC converter 4a, a required amount of cooling air 22 can be secured in the basic DC / DC converter 4a.

Sixth, the cooling air supplied to the second flow path is
It flows into the expansion I / O package unit 141, and the expansion I
After flowing out of the / O package unit 141, there are a path for being sucked into the main fan unit 7b and a path for being sucked into the main fan unit 7b in which two cross flow fans 30 are arranged after flowing in from the air supply panel 28.
As a result, wasteful cooling air to the expansion I / O package unit 141 is eliminated, and pressure loss can be reduced and flow passage noise can be reduced as compared with the case where all of the exhaust gas passes through the expansion I / O package unit 141.

Seventh, since the suction port of the main fan unit 7b is open only in the region corresponding to the expansion I / O package unit 141, the distance from the air supply port is long, and the other region is not. Silencer 152
Is attached and has a sound deadening structure.

Eighth, since the duct 106 is provided at the outflow portion of the main fan unit 7b, the pressure after the fan outflow becomes uniform in the duct 106, and each HDD is
Cooling air 22 to 108 can be evenly flowed, and each HD
The temperature distribution of D108 can be made uniform. Cooling air is HDD1
08 gap, main AC / DC converter 70, IN
Long 14 of 118 line units in PUT67
Since it flows along between the 8 and half 149 packages, it is possible to reduce the loss of the cooling air volume.

In order to confirm the effect of this example, the temperature of each place was measured. As a result, when the supply air temperature is 30 ° C, HD
The surface temperature near the bearing of D108 is 45 ~
It becomes 47 ° C., and the temperature distribution becomes uniform. Further, in the main processing unit 2 and the I / O package unit 3 that take in cooling air in parallel, the temperature distribution is 70 to 80 ° C., which is a substantially uniform temperature distribution. Also, the basic DC / DC converter 4a is
It becomes about 65 ° C., which is below the upper limit temperature.

Ninth, the cross-flow fan 30 can supply effective cooling air because the control board of the basic I / O package unit 3 can change the motor rotation speed according to the supply air temperature. That is, when the supply air temperature is high, the difference between the permissible temperature of the semiconductor mounted on the substrate and the temperature of the air is small, so that the flow rate and speed of the cooling air 22 are increased in order to promote heat transfer with the air. There is a need.
Further, when the supply air temperature is low, the temperature difference can be relatively large, so that the air volume and the air velocity of the cooling air 22 can be reduced. As a result, when the supply air temperature is low, it is not necessary to rotate the fan motor at a high speed, so that the life of the motor 35 can be extended, the power consumption of the motor 35 can be reduced, and the power consumption of the computer 1 can be reduced. Also tied to. In addition, it is also useful for reducing wasteful cooling air 22. Furthermore, the computer 10
00 is also effective in reducing noise.

Tenth, the air supply panel 28 on the back is
It has a double structure, and the respective air inlets do not overlap in the projection direction. As a result, the cooling channel is lengthened and a sound deadening structure is adopted. Further, by mounting the sound deadening material 152 in a region other than the air supply panel 28 having the double structure and the air inlet, a further low noise structure can be achieved. The muffling material 152 can be easily removed by attaching it with a double-sided tape.

Now, the silent effect will be described more specifically. Generally, it is known that the level of noise generated by an information processing apparatus equivalent to that of the present embodiment is usually about 60 dB (A). Even with a relatively quiet model, it is about 55 dB (A). When this level of noise is generated in the office, it is quite annoying and is an obstacle to the realization of a quiet office environment. On the other hand, the information processing apparatus of the above-mentioned embodiment was able to reduce noise to a considerable extent. Next, an example of the measurement will be shown.

The measurement was carried out at a height of (housing height + 1 m) / 2, at each of the peripheral surfaces, at a distance of 1 m, and at a point 1 m above the top plate of the housing. In this embodiment, since the height of the housing is 1.4 m, it is 1.
The measurement was performed on the four surrounding surfaces at a height of 2 m. First, when the measurement was performed without the sound deadening material 152 being loaded, the highest noise level was 48 dB (A) at the measurement point facing the air supply panel 28. Therefore, the muffling material 152 was loaded in the position shown in FIG. 42, and the measurement was performed again. According to this, the noise level was highest at the measurement point facing the air supply panel 28, which was 43 dB (A). on the other hand,
At the measurement point on the top, the noise level is the lowest, 40 dB
It was (A). The other measurement points indicated levels between them.

From the above measurement results, as in this example,
The intake part 710 of the air supply panel 28 has a double structure, the positions of the openings are shifted so as to avoid direct radiation of noise, and the number of fans as noise sources is reduced as much as possible to reduce noise. It was found that the level can be reduced as compared with the conventional one. Further, it was confirmed that the noise level can be further reduced by loading the sound deadening material.

2. Configuration of Each Part Next, the configuration of each part will be described with reference to the drawings.
Regarding the points mentioned in the above description,
Description may be omitted.

2.1 Main Processing Unit FIGS. 17 and 18 are perspective views showing the assembled state of the main processing unit 2 of the computer 1000 according to the embodiment of the present invention. FIG. 12 shows the upper surface of the entire main processing unit 2.

The main processing unit 2 includes a CPU package 36 which is a main board, a RISC processor module 15 (two in this embodiment), and an OSC package 1.
6, 4 MS middle cards 19, BA package 2
0, main case 37, front bracket 38, upper cover 39, slide rail 40, guide pin 41, setting guide 42, reinforcing plate 43, guide rail 44,
It has a lever 45.

The main case 37 constitutes a back surface portion 37c and both end portions 37a and 37b. By mounting the main CPU package 36, the front bracket 38, and the upper cover 39 on the main case 37, a rectangular parallelepiped case 2a is formed. That is,
The main CPU package 36 and the main case 37 are screwed together. Further, the front bracket 38 is screwed to the main case 37, and after mounting each package, the upper cover 39 is screwed to the front bracket 38 and the main case 37.

Ends 37a and 37 of the main case 37
b is configured to be ventilated. As a result, this case 2
A has a structure in which cooling air can be ventilated at both ends thereof, and functions as a duct as a whole. Also,
A local cooling fan unit 7b is provided at an end portion 37a of the main case 37, that is, a portion on the upstream side of the RISC processor module 15 outside the processing unit 2.

The main processing unit 2 is provided with a number of guide rails 44 for facilitating the insertion of the RISC processor module 15, the OSC package 16 and the MS middle card 19 onto the main CPU package 36. Further, as shown in FIG. 12, inside the main case 37, the RISC processor module 1
5, the OSC package 16, and a rack member 37d for mounting the MS middle card 19 are arranged. Guide rails 44 are provided on the ends 37a and 37b of the main case 37 and the rack member 37d.
The guide rail 44 is fixed by, for example, inserting the protrusions of the guide rail 44 into the small holes provided at the end portions 37a, 37b of the main case 37 and the corresponding rack member 37d.

A guide pin 41 is provided on the back surface portion 37c of the main case 37, as shown in FIGS. The guide pins 41 are screwed in two places at the same horizontal position on the back surface portion 37c.

As shown in FIG. 19, the CPU package 36 is provided with a setting guide 42. The setting guide 42 is the main CPU package 3
The protrusion 47b is inserted into and fixed to the small hole 46b provided in the No.6.

In addition, the CPU package 36 has a structure shown in FIG.
As shown in, a lever 45 is provided. Lever 4
5 are rotatably attached to both ends of the main CPU package 36 on the front bracket 38 side.

As shown in FIGS. 17 and 20, a reinforcing plate 43 is attached to the back surface of the CPU package 36. The reinforcing plate 43 is attached to the CPU package 36 with screws 43.
It is fixed at a. In this embodiment, the screw 43a is configured to stop the main CPU package 36 and the main case 37 together, as shown in FIG.

FIG. 21 shows a mounting diagram of the CPU package 36. On the CPU package 36, the LSI package 12 and the like that mediate the exchange of data between the CPU and the memory are mounted. Also, the RISC processor module 1
5, OSC package 16, MS middle card 19, B
Female socket connectors 48a for connecting the respective A packages 20 are pin-fixed. The board thickness of the CPU package 36 is 2.7 mm, which is 12 layers. In addition, lever 4
There are two male terminals 5e on the opposite side of the lever 45 to the CPU backboard 8.
The structure of the connector is that a large number of electric signal pins are provided on the female mouth 48e side, and the pins are inserted on the male mouth 49e side.
It is joined.

11A and 11B are mounting diagrams of the RISC processor module 15. On the RISC processor module 15, one RISC chip package 13 of the brain of the computer 1 and 13 cache memories 14 for temporarily storing data are mounted on both sides. Above the RISC chip package 13,
A disk-shaped fin 62a for expanding the heat radiation area is attached via grease. In addition, the main CP mentioned above
Male connector 49a for mounting on U package 30
There is. In this embodiment, the RISC processor module 15 is, for example, PA-R manufactured by Hewlett-Packard Company.
ISC is used.

FIG. 22 shows a mounting structure of the MS package 18 and the MS middle card 19. MS Middle Card 1
9 has eight female connectors 48f, two LSI chips 51, and one male connector 49c, so that a 5 mm square prism 81 for attachment / detachment is aligned with the upper surface of the MS middle card 19. It is screwed. The MS package 18 has about 10 memory elements 18a on each side.
The male connector of the MS package 18 is inserted and attached to the female connector 48f of the above-mentioned MS middle card 19. This serves as a data storage and can be mounted on the MS middle card 19 in a maximum of 8 steps. By mounting in this way, high-density mounting is possible, and three-dimensional mounting is achieved, and the cooling air 22 flows between the MS packages. Therefore, the cooling air can be used effectively, and efficient cooling is possible.

FIG. 23 shows a mounting diagram of the BA package 20. The BA package 20 has four LSI chips 53.
Are mounted, and there are four male connectors 49d and two female connectors 48. Of the male connectors, 3 are the main CP
It is for mounting on the U package 36, and the remaining one and two female connector are for external control. This BA package 2
The role of 0 is to mediate different signal lines. In order to transmit a high-speed signal to another package at that speed, the middle male connector 49d among the male connectors 49d for mounting to the three main CPU packages 36 serves as an input terminal, and has a function of an input terminal. The two male connectors 49d serve as output terminals. Further, the input signal is separately transmitted to the above four LSI chips 53. Since the signal transmission is not delayed, the LSI chips 53 are mounted 180 degrees opposite to each other with the center as a boundary. Also, BA package 2
The attachment / detachment method of 0 is the small hole 4 opened in the BA package 20.
6i has a protrusion 47c on the hand lever 54 (detailed view 24).
Insert and use the principle of leverage.

Next, a method of mounting the RISC processor module 15, the OSC package 16, the MS middle card 19, and the BA package 20 on the main CPU package 36 will be described. In FIG. 17, each package is inserted into the guide rail 44 attached to the main case 37. After the insertion, the male connectors 48 attached to the bottoms of the respective packages are inserted into the female connectors 48 on the main CPU package 36 at the bottom of the CPU unit 2 and connected. The connector has a large number of electric signal pins on the female side, and the male side inserts and joins the pins. The RISC processor module 15 and the OSC package 16 are the guide rails 4
It is held by 9, female connector 48, male connector 49 and setting guide 42. The MS middle card 19 and the BA package 20 are held by the guide rail 44, the female connector 48, and the male connector 49.

FIG. 24 shows the structure of the hand lever 54. The hand levers 54 are attached to the small holes provided at the upper ends of each package, and the package is attached and detached by the principle of leverage. Further, when the CPU package 36 is attached or detached, a considerable stress is applied to the CPU package 36.
This stress is relieved by the reinforcing plate 43 provided on the back surface of
The warp of the main CPU package 36 is eliminated, and the reliability and maintainability are improved.

FIG. 25A shows a detailed view of the slide rail 40 shown in FIG. The slide rail 40 is the male mouth 4
0a and female mouth 40b. The male mouth 40a is equipped with a stopper 55 in order to make it safe and secure when attaching and detaching. The female mouth 40b also has a hinge 56 to ensure the insertion safely and securely when inserting the male mouth 40a.

FIG. 25B shows an embodiment in which the main processing unit 2 is mounted on the housing 1. The female opening 40b of the slide rail 40 is horizontally attached to the sheet metal in the housing 1.
Individually provided and fixed with screws 781. Also, male mouth 40
Two slide rails 40 a are horizontally provided on the upper part of the main processing unit 2, and the main case 3 is fixed by the decorative screw 57.
It is attached to 7. First, install two male mouths 40a.
Insert the slide rail of No. 2 into the two female slide rails 40. Until the male mouth 40a side is inserted into the female mouth 40b,
The hinge 56 works so as not to push the slide rail 40 of the female mouth 40b back into the housing 1. Further, after insertion, the stopper 55 on the male mouth 40a side works near the middle of mounting,
By pushing the stopper 55, the main processing unit 2 is inserted up to the CPU backboard 8.

Further, as shown in FIGS. 17 and 18,
In addition to the slide rail 40, two taper guide pins 41 are provided at the same horizontal position in the main case 37 of the main processing unit 2 in order to ensure safe and reliable attachment, removal, and pull-out during maintenance. On the housing 1 side, a small hole 46 larger than the pin diameter by 4 or 5 mm is provided at a position corresponding to the small hole 46.
There is c. The guide pin 41 is inserted into the small hole 46c to hold the main processing unit 2. Further, there is a lever 45 for completely mounting the main processing unit 2 on the CPU backboard 8. The lever 45 is rotatable in small holes 46d provided at both ends of one side of the main CPU package 36 opposite to the side having the male connector 49e. According to the lever principle, this lever 45 is turned to a position where it is stopped by the metal plate in the computer 1, and the CP of the male connector 49e of the main processing unit 2 and CP
The female connector 48e of the U backboard 8 can be completely coupled. On the contrary, when removing the main processing unit 2 from the housing 1, first, the lever 45 is turned to disconnect the male mouth connector 49e from the female mouth connector 48e. Further, the main processing unit 2 is pulled out. Near the middle of removal, the stopper 55 of the male mouth 40a slide rail 40 is pushed to remove the main processing unit 2 from the housing 1.

Through the above process, the main processing unit 2
Make the maintenance of the product safe and reliable. Also, the male mouth 40a
Since the slide rail 40 is attached with the decorative screw 57, the slide rail 40 can be displaced by about 2 to 3 mm, which facilitates the insertion of the main processing unit 2.

Further, the main processing unit 2 has a duct structure, and all packages are oriented in the same direction so that the cooling air 22 can easily pass therethrough. The CPU package 36 is responsible for part of this duct. At the air supply / exhaust ports of this duct, there are the above-mentioned guide rails 44 for holding the package and the sheet metal. Main case 37
The a, 37b, and the rack member 37d have a rectangular opening 58a adapted to each package. This is because the heat generation amount of each package is different, so that the cooling air 22 corresponding to the heat generation amount of each package is supplied.
Further, by narrowing the air supply port, the unnecessary cooling air 22 is eliminated, the air velocity of the cooling air 22 is increased, the heat transfer coefficient with the air is increased, and the element temperature of the semiconductor on each package can be lowered. Reliability and calculation performance can be improved.

2.2 I / O Package FIG. 26 shows a detailed view of the basic I / O package unit 3 shown in FIGS. 8 and 9, which is an embodiment of the present invention.

The computer 1000 of this embodiment is equipped with a total of 12 basic I / O packages 3a. The breakdown is 7 packages for controlling input / output devices.
There are 5 packages that can be applied to the bus specification. An RPC (remote power on control) package is optionally installed. This package has a function of externally turning on and off the power through communication. In addition, one power control package 3b and one package 3c having a function of a service processor are mounted below the basic I / O package 3a. The package 3c is provided with a temperature sensor 34 and a control circuit (not shown). This board functions as a control circuit for the motor 35 of the cross flow fan 30. That is, the package 3c constitutes a control board. The sub fan unit 7c also has
You may make it control by this sensor and a control circuit.

The four substrates below the package 3c are the DC / DC converter 4a described later.

These packages have guide rails 44
It can be mounted by inserting the guide plate 59 of the package into. The guide rail 44 is fixed by inserting the protrusion into a small hole on the sheet metal inside the housing 1. Guide plate 59 is on the side of the package. After the insertion, the hand lever 54 described above is used, and the hand lever 54 is attached to the small holes 46f provided at both upper ends of each package, and the lever principle is used. After mounting, both ends of each package are screwed to the sheet metal of the housing 1. A male connector on one side of each package and a female connector 48 on the backboard are combined to supply an electrical signal. Package guide plate 59
On the side, a GP-IB for taking in a signal from the outside,
A female connector 48g for RS232C is equipped.

On the surfaces of the basic I / O package unit 3 and the basic DC / DC converter 4a, which are shown on the front side in FIG. 26, a guide panel 739 (see FIG. 9) is arranged to cover these parts during mounting. .

After flowing out of the basic I / O package unit 3, the cooling air 22 passes through a portion where a constant chamber is formed until it is sucked into the cross flow fan 30. That is, this basic I / O package unit 3
Form a duct.

There are many semiconductor chips on each package. The cooling air 22 is supplied from the outside of one side surface of each package, and thereafter, the I / O cover is attached to the housing 1 so as to pass through the inside of each package. Each package exhaust has a guide rail 44
At locations other than b, there are rectangular openings 58b having the same package widths. This eliminates the wasteful cooling air 22 and can supply all the cooling air 22 between the packages. That is, the element temperature of the semiconductor mounted on each package can be reduced, and the reliability can be improved.

2.3 DC / DC Converter The basic DC / DC converter 4a used in the embodiment of the present invention is composed of a plurality of packages. Regarding these structures, the first and second packages are shown in FIG.
27B and 27C, the third and fourth sheets are shown in FIGS. 28A, 28B and 28C. The conversion efficiency of the basic DC / DC converter 4a is 78%. Further, converter boards 63 are mounted from the first package of the basic DC / DC converter 4a to two, two, one, and two, respectively. The upper three packages are made of an aluminum plate 64 to improve heat dissipation. Further, the upper two sheets have the heat radiation fins 62a in the sense that the area is expanded from the heat radiation amount of the converter substrate 63. This radiation fin 6
2a is an extrudable plate fin having a width of 280 mm, which is equivalent to the length of the basic DC / DC converter 4a, a width of 48 mm, a fin height of 23 mm (inner base thickness of 8 mm), a fin plate thickness of 3 mm, and a fin number of 7 is there. This radiation fin 6
2a and the aluminum plate 64a, the converter substrate 63 and the aluminum plate 64a, and between the aluminum plate 64a and the aluminum plate 64b attached to the metal plate in the housing 1 have high thermal conductivity in order to reduce contact thermal resistance. Grease 65 is applied. Further, the converter board 63, both aluminum plates 64a, 6
4b and the radiation fin 62a are joined by the screw 64c.

FIG. 29 shows a basic DC / DC converter 4a.
2 shows a detailed view of an embodiment in which the housing 1 is mounted on the housing 1. Basic D
The C / DC converter 4a is inserted by the guide rail 44 and connects the male connector 49 on one side of the basic DC / DC converter 4a and the female connector 48 on the CPU backboard 8. This basic DC / DC converter 4a can be attached / detached in the same manner as the respective packages of the main processing unit 2 and the basic I / O package unit 3 by using separate jigs in small holes 46h provided at both ends on the side opposite to the connector side. This is done by attaching the hand lever 54 of. After installation,
Both ends of each package are screwed to the sheet metal of the computer 1.

Further, in order to allow the cooling air 22 to the basic DC / DC converter 4a to flow effectively and in large quantities, the basic DC / DC converter 4a
From the exhaust port of the DC converter 4a to the cross flow fan 3
The duct 33 is provided up to the 0 air supply port. Further, since the plate direction of the heat radiation fins 62a is the flow direction of the cooling air 22, the high-speed cooling air 22 can be effectively utilized, and the temperatures of the semiconductors and the coils on the converter substrates 63a and 63b can be reduced. Furthermore, by making the material of the converter part aluminum, good thermal conductivity and improved cooling performance,
The weight of the computer 1000 can also be reduced.

2.4 Extended I / O Package Next, FIG. 30 shows a mounting structure of the extended I / O package 141. The extended I / O package 141 has a basic I / O
Twelve I / Os as in the case of O package unit 3
The package and the DC / DC converter 4b for feeding the expansion I / O package 141 are mounted. Cooling air 22
Of the expansion I / O package 141 is taken in from the left front side and sucked by the main fan unit 7b from the right back side. Further, as a mounting structure, the DC / DC converter 4b for power supply is mounted from the upper stage and mounted on the uppermost part. The DC / DC converter 4b for power supply has a radiation fin on the back surface. In order to increase the cooling air flow 22 to the DC / DC converter 4b for power supply, an air supply port is also provided on the left side surface, and the air supply area is large.

With the above, the cooling air 22 is expanded I /
By taking in from the front left side of the O package 141 and sucking in from the rear right side by the cooling fan unit 7b, it works effectively for cooling the expansion I / O package 141 having connectors and the like on both sides. In addition, as a mounting configuration, it is mounted from the upper stage and is a DC / D for power supply.
Since the C converter 4b is mounted on the top,
The cooling air 22 from the cooling fan unit 7b attached to the upper part of the housing can be effectively and maximally utilized. The DC / DC converter 4b for power supply is provided with a radiation fin on the back surface to improve the radiation performance and minimize the temperature rise of this converter.

2.5 Storage Device Unit (HDD Unit) FIGS. 31 and 32 are detailed diagrams of the HDD unit 5 of the computer 1000 according to the present embodiment shown in FIGS. FIG. 31 shows a mounted state of the HDD. HDD 108 is HD
It is screwed to the D sheet metal 109, and control signals and power are supplied to the cable 109 between the HDD 108 and the sheet metal 109.
Is connected to the HDD backboard 9 through. HD
The male connector 49 fixed to the D sheet metal 109 is fixed with a screw, and has a floating structure that moves about several mm so that it can be easily connected to the HDD backboard 9. With this floating structure, the HDD 108
Can be prevented from being damaged by the vibration. The male connector 49 is the female connector 4 of the HDD backboard 9.
8 Guide pin 41 guides and inserts. Also, HD
The D unit 5 is fixed to the housing with screws.

As described above, the HDD 108 can be mounted smoothly, and the vibration of the HDD 108 is hard to be transmitted to the HDD backboard 9 side, so that the reliability of the male connector 49 soldered portion on the HDD 108 side is also improved.

FIG. 32 shows a plan view of the HDD unit 5 as seen from above. As shown in the figure, it can be seen that the clearance 100 between the HDDs 108 is almost the same. As a result, even cooling air can be made to flow through the HDD 5 by providing a duct that widens toward the air outlet of the HDD unit 5, that is, the outlet of the cooling fan unit. Further, by providing the HDD backboard 9, it is not necessary to provide a cable for transmitting an electric signal, and the structure is simplified. Also, because it is unitized, this disc can be replaced with a smaller one according to the user's specifications. For example, 5 inches can be 3.5 inches. That is, it is also effective as enhance. In addition, even when the computer 1000 is in operation, a connection that can be hot-swapped is made.

2.6 AC / DC Converter The AC / DC converter 6 includes one INPUT section 67.
And three main AC / DC converters 70 and one auxiliary AC / DC converter. AC / D
The C converter 70 is arranged in the upper stage toward the front of FIG.
There is one at the bottom. The power efficiency is 85%. The auxiliary AC / DC converter 74 is located at the center of the lower stage toward the front of FIG.

33A to 35A and FIG. 8B showing the present embodiment.
INPUT section 67 used in the computer 1000 of
2 shows a configuration diagram of the AC / DC converter 6.

33A, 33B and 33C, I
The block diagram of NPUT section 67 is shown. The INPUT section 67 is
It is located in the lower part of the front center of FIG. Further, the INPUT section 67 is supplied with an AC voltage of 200 V through a three-layer power cable connector. Further, the breaker 68a is provided above the INPUT section 67 for the time of electric leakage and the time of non-use.
Further, a high voltage prevention circuit 112 due to lightning and a noise filter circuit 111 are also incorporated. Further, since a high voltage and a large current are applied, a large number of slits 145 of about 4 × 20 mm ² are formed to prevent small objects from entering the INPUT section 67.

34A, 34B and 34C are block diagrams of the main AC / DC converter 70. There is a DC power supply terminal 75a on the front side. Also, on the back side, there is an aluminum radiating fin 62b for the main AC.
It is screwed to the heat dissipation plate 72a of the / DC converter 70.
The grease 6 having high thermal conductivity is provided between the heat radiation fin 62b and the heat radiation plate 72a of the main AC / DC converter 70.
5 is filled. Both of these are made of aluminum. Further, the shape of the heat radiation fin 62b has a length of 235 mm, a width of 85 mm, a fin height of 20 mm (4 mm), a fin plate thickness of 3 mm,
This is an extrudable plate fin having 12 fins. The cooling air 22 flows in the plate direction of the heat radiation fins 62b.

In addition, the main AC / DC converter 70
There is a light emitting diode 73a on the front side. This main AC
When the light emitting diode 73a on the front of the / DC converter 70 is turned on, the breaker 68a of the INPUT section 67 described above is used.
Indicates that the computer 1000 is supplied with power, and the maintenance of the computer 1000 can be performed safely and reliably. In this main AC / DC converter 70, two epoxy type substrates are arranged so that their component mounting surfaces face each other. Some of the mounted parts have a large shape such as the coil 113.

Next, FIG. 35 shows a block diagram of the auxiliary AC / DC converter 74. There is a breaker 68b for storing electricity in the upper part on the front side. When this breaker 68b is on, electricity is supplied to this auxiliary AC / DC converter 74 even when the breaker 68a of the INPUT section 67 is off. Then, electricity is stored in the battery 11 from the terminal 75b on the front side. Auxiliary AC / DC at the end of storage
The electricity supply to converter 74 is significantly reduced. The purpose of the auxiliary AC / DC converter 74 is to supply electricity to the main processing unit 2, the I / O package 3, the HDD unit 5, and the like during a power failure or when the power is inadvertently turned off. , For backup.

Further, on the back surface, similar to the main AC / DC converter 70, there is a radiation fin 62c. This heat radiation fin 62c is used as an auxiliary AC / DC converter 74.
It is attached to the heat radiating plate 72b with a screw.

Further, the auxiliary AC / DC converter 7
In No. 4, since the electricity is supplied even when the breaker 68a of the INPUT section 67 is off, it is necessary to cool the auxiliary AC / DC converter 74 uniquely. Therefore, the axial fan 23b is mounted on the upper portion of the rear surface of the auxiliary AC / DC converter 74, and is fixed to the auxiliary AC / DC converter 74 with a screw. The axial fan 23b has an outer size of 60 × 60 × 25 mm ³ manufactured by Sanyo Electric Co., Ltd., and has a motor rotation speed of full speed. The direction of the cooling air 22 is shown in FIG.
As described above, the heat flows along the heat radiation fins 62c.

The main AC / DC converter 70
Similarly to the above, when electricity is turned on, the light emitting diode 73b near the center of the auxiliary AC / DC converter is turned on, which is safe and secure in maintenance such as maintenance.

The AC / DC converter 6 described above is the case 1
It is fixed to the sheet metal inside with screws. In particular, the main AC / DC converter 70 shown in FIG. 34 is mounted with a shift of about 50 mm rearward in order to share the flow of cooling air in the upstream part and the mounting bracket.

2.7 Main Fan Unit FIG. 36 shows the main processing unit 2 and the HDD unit 5 of the computer 1000 shown in FIGS. 8 and 9, which is an embodiment of the present invention.
The structure of the main fan unit 7a arrange | positioned between these is shown. The fan used in the main fan unit 7a is a cross-flow fan 30 made by Oriental Motor Co., Ltd., whose motor rotation speed is variable. Rated DC voltage 24V
It is a drive. The shape of the motor is 76Φ x 60m
m ³ and wings are 90 × 90 × 340 mm ³ . An anti-vibration rubber 77a is attached between the support plate 76a and the cross flow fan 30. As shown in FIG. 16, a duct 33 is provided in the intake section.

As shown in FIGS. 38A and 38B, the cross flow fan 30 includes a blade portion 30a and the blade portion 30a.
It is composed of a casing 115 for accommodating a, a motor 35, and a nose 114.

As described above, since the cooling air 22 can be sucked from near the bottom of the main processing unit 2, the CPU
The wind speed of the cooling air 22 to the LSI package 12 and the IC chip mounted on the package 36 and the substrate can be increased, and the unnecessary cooling air 22 can be eliminated.

Further, the motor 3 of the cross flow fan 30
Since the number of 5 rotations is variable, the wasteful cooling air 22 can be reduced, and the reliability of the bearings, grease, etc. of the motor 35 can be improved. For example, as shown in FIG. 26, a temperature sensor 34 and a control circuit (not shown) are provided on the control board 3c of the basic I / O package unit 3, and the rotation speed of this cooling fan is controlled here. If the air supply temperature is below 30 degrees,
When the driving voltage is 17V and 30 degrees or more, the driving voltage is 24V, and the amount of air supplied from the cross flow fan 30 can be varied. That is, when the supply air temperature is high, the difference between the allowable temperature of the semiconductor mounted on the substrate and the temperature of the air becomes small, and in order to promote the heat transfer with the air,
The wind speed needs to be increased. Further, when the supply air temperature is low, the temperature difference can be relatively large, so that the cooling air 22
The wind volume and speed can be lowered. Note that this is also commonly controlled for the crossflow fans 30, 30 of the main fan unit 7b described later.

Furthermore, since the vibration isolating rubber 77a is provided between the support plate 76 and the cross flow fan 30, the vibration of the cross flow fan 30 is not transmitted to the computer 1000, and noise is reduced. Further, by providing the duct in the air supply unit, the cooling air can be effectively and maximally flown to the basic DC / DC converter 4a, and the temperature rise can be reduced.

Next, FIG. 37 shows the structure of a main fan unit 7b upstream of the HDD unit 5, which is different from the main fan unit 7a. In the unit 7b, the two cross flow fans 30, 30 are alternately arranged in parallel, and a duct 741 (see FIG. 9) forming a chamber is provided in the exhaust section. Further, the support plate 76b and the cross flow fan 30
An anti-vibration rubber 77b is attached between and.

Similar to the main fan unit 7a described above,
Since the rotation speed of the motor 35 of the cross flow fan 30 is variable, wasteful cooling air 22 can be reduced, and the reliability of the bearing, lease, etc. of the motor 35 can be improved. Further, since the vibration isolating rubber 77b is provided between the support plate 76b and the cross flow fan 30, the vibration of the cross flow fan 30 is not transmitted to the computer 1000, which leads to a reduction in noise. In addition, two cross flow fans 3
By staggering 0 and 30, the interference of the fans can be reduced, and the maximum air volume and sound deadening structure can be achieved. Further, the duct 741 forming the chamber is provided in the exhaust unit, so that the cooling air to the HDDs 108 on the downstream side can be made uniform.

As shown in FIGS. 38A and 38B, the flow velocity near the outlet of the cross flow fan 30 is as shown in FIGS. 38A and 38B.
0a is almost uniform in the longitudinal direction, but is offset in the radial direction of the fan. This becomes even as it leaves the fan. Since the pressure loss of the fan due to the air resistance of the object is determined by the velocity of the flow, it is desirable to reduce the velocity in order to reduce the pressure loss. Therefore, it is necessary to adjust the velocity of the cooling air to the minimum necessary for cooling the heat source placed downstream of the fan outlet so that the air resistance is small and the cooling can be sufficiently performed.
To adjust the outflow speed, it is necessary to adjust the distance from the fan outlet to the heat source. The duct 741 performs this adjusting function.

2.8 Backboard In this embodiment, a backboard is used to connect each unit.

2.8.1 Back Board for Main Processing Unit FIG. 39 shows a mounting view of the CPU back board 8 of the computer 1000 shown in FIGS. 8 and 9, which is an embodiment of the present invention. C
On the PU backboard 8, there are 35 female connectors 48
There are a power supply, a signal supply terminal 75c, and a ground terminal 80. This supplies power and signals from the female connector 48 to the main processing unit 2, the basic I / O package unit 3 and the DC / DC converter 4, and from the terminal 75c to the HDD unit 5 and the AC / DC converter 6. The mounting on the housing 1 is fixed by screws. CPU backboard 8
By providing the cable, it is possible to achieve cableless and suitable for high-density mounting.

2.8.2 HDD Backboard FIG. 40 shows a block diagram of the storage device unit backboard (HDD backboard) 9 of the computer 1000 shown in FIGS. 8 and 9, which is an embodiment of the present invention. HDD backboard 9
There are eight female connectors 48 with pins on the top. The left one is for DC / DC converter power supply. Further, among the other seven female connectors 48, the first, third, fifth, and seventh from the right can mount the 5-inch HDD 108, and the first to sixth from the right can mount the 3.5-inch HDD 108. ing. That is, two types of HDD 10
Corresponds to 8. The pitch of the female connector 48 is almost the same. This is because each HDD is provided with a duct 741 that configures a chamber in order to support various types of HDDs 108 and a HDD air supply unit.
This is because the cooling air 22 uniformly flows between D108. In addition, this HDD can be connected to and removed from the HDD 108
The D backboard 9 has a sufficiently strong structure (package thickness, etc.).

2.9 Line Unit FIG. 41 is a structural diagram of the line unit 118 of the computer 1000 shown in FIGS. 8 and 9, which is an embodiment of the present invention. Line packages include long 148 and half 149
In addition, the unit further includes a DC / DC converter 4d for power supply. On the front side, four male connectors 48 are provided on the long 148 and eight male connectors 48 are provided on the half 149. The package is mounted in the flow direction of the cooling air 22. As a result, it can be cooled efficiently, and since it is unitized, it can be attached and detached according to the user's specifications. Furthermore, the unit is closed to prevent emission of jamming radio waves.

2.10 Cover FIG. 42 shows a computer 1000 according to an embodiment of the present invention.
3 is a sectional view of the cover 10 of FIG.
FIG. 42 shows the cover 10 used as the air supply panel 28. In order to prevent noise from directly coming out of the casing from the air supply port of the cooling air 22, the air supply unit 710 is provided with the cover 1
0 has a double structure of an outer wall portion 712 and an inner wall portion 713. First inlet 714 for cooling air 22 of cover 10
Is to the right of the cover. The second intake port 715 of the cooling wind 22 of the inner sheet metal is located at a position opposite to the first intake port 714. The clearance between the outer wall cover and the inner cover is narrowed until the reduction of the cooling air 22 is minimized. Further, a filter 29 is provided at the inlet of the cooling air 22 inside. In this way, by increasing the cooling air passage distance between the outside air and the inside of the housing, the clearance between the outer wall cover and the inner cover is reduced until the cooling air is reduced to the minimum.
By making it narrower, it is possible to reduce noise leakage. Further, by providing a filter at the cooling air inflow port on the inner side, maintenance such as clogging can be facilitated. Further, in this embodiment, as described above, the inner wall portion 71
No. 3 is loaded with a silencer.

2.11 Battery FIGS. 43A and 43B are perspective views showing how the battery 11 of the computer 1000 according to the embodiment of the present invention is attached.
The battery 11 is used as a backup when the external power supply is cut off. The battery 11 is isolated from other components by the battery cover 61, and cooling air does not flow. Four batteries 11 are arranged in the battery cover 61, and in consideration of the center of gravity of the computer 1000, the batteries 11 are arranged in the computer 1000.
Install on the floor of. The battery 11 has a considerable weight, and in order to make maintenance safe and reliable, the battery cover 61 has a handle 146 and a rail 147. When the battery 11 is inserted into the computer 1000, the battery is automatically charged. It is designed to enter the inside of the cover 61.

The structure of the embodiment of the present invention and its function and effect will be described below.

In the above-described embodiment, the space in the housing has two or more channels. In the first channel 710, the main processing unit 2, the basic I / O package unit 3, the basic DC /
The DC converters 4 are arranged in parallel and the outside air is supplied to each. Thereby, each can be cooled with the cooling air having a relatively low temperature. Further, in the second flow path which is the flow path of the other system, the HDD unit 5 is set as the most upstream and other devices are arranged downstream of the HDD unit 5. As a result, a necessary and sufficient amount of cooling air can be supplied to these devices, and the HDD unit 5 can be supplied with a necessary and sufficient amount of outside air having a low temperature.
As a result, the HDD 108 having severe temperature characteristics can be operated with high performance.

Further, in the first flow path 710, the sub-fan unit is individually attached as needed like the main processing unit 2 to improve the cooling capacity and stop the main cooling. However, the minimum cooling can be performed.

Furthermore, by providing the duct 33 on the intake side of the main fan unit 7a to secure the cooling air volume, it is possible to perform the required cooling regardless of the opening cross-sectional area. As a result, the reliability of the main processing unit and the like is improved.

By thus constructing the flow path,
Each device in the housing 1 can be cooled according to the optimum temperature specifications. Moreover, for that reason, it is not necessary to mount many fans or install a powerful fan. Therefore, according to this embodiment, the fan power can be reduced and the noise generated in the entire housing can be reduced. As a result, the product cost can be suppressed and the power consumption can be reduced.

Further, by making the main processing unit, which is a high heating element, have a duct structure and three-dimensionally mounted, the cooling air can be effectively used and the housing can be miniaturized.

Furthermore, a plurality of HDDs are unitized to realize a large capacity storage. A slide rail is provided on a part of the configuration of the unit and on the side of the housing to facilitate the attachment / detachment of the unit. The same applies to the main processing unit. Moreover, it is easy to put on and take off by equipping with a jig for putting on and taking off. Therefore, it is possible to improve work efficiency during maintenance and enhancement.

Further, in the present embodiment, in the air supply section 710, the panel has a double structure and the openings are provided so as to be shifted, so that direct emission of the sound generated in the housing is prevented, and The radiation path is lengthened to reduce noise radiation to the outside of the housing.

Further, in the exhaust part 750, by using a punching material having a large number of punch holes, the exhaust wind velocity is reduced and the collision of the exhaust with the floor is alleviated.
It suppresses noise generation.

Besides, in consideration of the weight of the battery, the battery is arranged at the bottom of the housing to stabilize the computer.

Further, since the resin molded product is attached to the concave portion formed in the center of the front panel, distortion in the diagonal direction is reduced, so that the front panel can be made lighter and steely. In addition, resin molds that can be processed in a variety of designs can be made smaller and the mold can be made smaller,
It is possible to develop various designs at low cost.

As described above, in this embodiment, by reducing the number of fans, the cooling air discharged from the casing can be reduced,
In addition to reducing noise, it can maintain an excellent office environment in combination with aesthetics.

In the above embodiments, the case where the inside of the housing is divided into two channels is shown. However, the present invention is not limited to this. For example, it can be divided into three or more systems. Further, in the flow path in which the devices are arranged in series, it is possible to provide a bypass flow path for bypassing the upstream devices in parallel. As a result, the temperature of the cooling air sent to the equipment on the downstream side can be lowered.

[0190]

As described above, according to the present invention,
With the limited cooling device, there is an effect that appropriate forced air cooling can be performed for each of the mounted devices. Further, at that time, it is possible to suppress an increase in noise, hot exhaust air, and power consumption, and also to suppress a product cost.

[Brief description of drawings]

FIG. 1 is a block diagram showing an outline of a computer system that is an embodiment of an information processing apparatus of the present invention.

FIG. 2 is a CPU of a computer showing an embodiment of the present invention.
FIG.

FIG. 3 is an external perspective view of a computer showing an embodiment of the present invention.

FIG. 4 is an external front view of a computer showing an embodiment of the present invention.

FIG. 5 is an external rear view of a computer showing an embodiment of the present invention.

FIG. 6 is a right side view showing the outer appearance of a computer according to an embodiment of the present invention.

FIG. 7 is a perspective view of the computer according to the embodiment of the present invention with the front panel opened.

FIG. 8 is a front-side mounting perspective view schematically showing a mounting state of devices of a computer showing an embodiment of the present invention.

FIG. 9 is a rear side mounting perspective view schematically showing the mounting state of the devices of the computer showing the embodiment of the present invention.

FIG. 10 is a rear view showing a mounted state of devices of a computer showing an embodiment of the present invention.

FIG. 11A is a front view showing a mounted state of the RISC processor module used in the computer according to the embodiment of the present invention. 11B is a top view thereof.

FIG. 12 is a mounting top view showing the configuration of the main processing unit used in the configuration of the embodiment of the present invention.

FIG. 13A is a top view showing an example of a mounted state of a local cooling sub-fan unit and a RISC processor module used in one embodiment of the present invention. 13B
Is a front view of the sub fan unit.

FIG. 14A is a top view showing an example of a mounted state of the cooling structure of the RISC processor module used in the embodiment of the present invention. 13B is a front view showing an example of a duct used therein.

FIG. 15A is a top view showing another example of the mounted state of the local cooling sub-fan unit and the RISC processor module used in the embodiment of the present invention. 15B
Is a front view of the sub fan unit.

16 is a cross-sectional view taken along the line AA of FIG. 8 showing the flow of cooling air in the computer according to the embodiment of the present invention.

FIG. 17 is an assembled perspective view of a main processing unit used in an embodiment of the present invention.

FIG. 18 is a mounting perspective view of the main processing unit showing the embodiment of the present invention.

FIG. 19 is a perspective view of mounting a cutting guide according to an embodiment of the present invention.

FIG. 20 is a mounting plan view of a reinforcing plate showing an embodiment of the present invention.

FIG. 21 is a mounting plan view of a CPU package of a main processing unit used in an embodiment of the present invention.

FIG. 22 is a mounting perspective view of an MS middle card used in an embodiment of the present invention.

FIG. 23 is a mounting plan view of a BA package used in an embodiment of the present invention.

FIG. 24 is a plan view of a package attaching / detaching hand lever used in an embodiment of the present invention.

FIG. 25A is a perspective view showing the structure of a slide rail used in one embodiment of the present invention. 25B is a sectional view thereof.

FIG. 26 is a mounting perspective view of an I / O package unit that constitutes an embodiment of the present invention.

FIG. 27A is a D used in an embodiment of the present invention.
The mounting top view of the package which comprises a part of C / DC converter. 27B is a side view thereof. 27C is the front view.

FIG. 28A is a D used in one embodiment of the present invention.
The mounting top view of the package which comprises a part of C / DC converter. 28B is a side view thereof. 28C is a front view thereof.

FIG. 29 is a mounting perspective view of a DC / DC converter used in an embodiment of the present invention.

FIG. 30 is a mounting perspective view of an expansion I / O package unit used in an embodiment of the present invention.

FIG. 31 is a perspective view showing a mounted state of an HDD used in one embodiment of the present invention.

FIG. 32 is a mounting top view showing a mounted state of an HDD unit used in one embodiment of the present invention.

FIG. 33A is an INP used in an embodiment of the present invention.
The top view of UT. 33B is the front view. 33C is a side view thereof.

34A is a top view of a main AC / DC converter used in an embodiment of the present invention. FIG. 34B is the front view. 43C is a side view thereof.

FIG. 35 is an auxiliary AC / used in one embodiment of the present invention.
The mounting top view of a DC converter.

FIG. 36 is a side view of the main fan unit used in the embodiment of the present invention.

FIG. 37 is a side view of a main fan unit used in an embodiment of the present invention.

FIG. 38A is a cross-sectional view showing the structure and speed distribution of a cross flow fan used in an embodiment of the present invention.
38B is the top view.

FIG. 39 is a plan view of a CPU backboard mounting used in an embodiment of the present invention.

FIG. 40 is a plan view of the HDD backboard mounting showing the embodiment of the present invention.

FIG. 41 is a mounting diagram of a line unit used in an embodiment of the present invention.

FIG. 42 is a sectional view showing the structure of the air supply panel and the structure of the intake port of the second flow path used in one embodiment of the present invention.

FIG. 43A is a perspective view showing a state in which the battery used in the embodiment of the present invention is mounted in the housing. 43B is a perspective view showing the external appearance of the battery.

FIG. 44 is a cross-sectional view taken along the line BB of FIG. 8, showing a computer that is an embodiment of the present invention.

FIG. 45 is a left side view of the computer according to the embodiment of the present invention with the panel removed.

FIG. 46 is a front view of the computer according to the embodiment of the present invention with the panel removed.

FIG. 47 is a computer HD showing an embodiment of the present invention.
The top view which shows the part of D unit.

FIG. 48 is a cross-sectional view showing another example of the cooling air discharge unit in the computer according to the embodiment of the present invention.

[Explanation of symbols]

1 ... Housing, 2 ... Main processing unit (CPU unit), 3 ... Basic I / O package unit, 4a, 4b
... DC / DC converter, 5 ... Storage unit (HD
D unit), 6 ... AC / DC converter, 7a ... Main fan unit, 7b ... Main fan unit, 7c
… Sub fan unit, 8… CPU backboard, 9…
HDD backboard, 10 ... Cable cover, 11 ... Battery, 12 ... LSI package, 13 ... RISC chip package, 14 ... Cache memory, 15 ... RI
SC processor module, 16 ... OSC package,
17 ... Main memory, 18 ... MS package, 19 ... M
S middle card, 20 ... BA package, 22 ... Cooling air, 23a ... Axial fan, 23b ... Axial fan, 24 ...
Jet port, 25 ... Casters, 26 ... Skirt, 27 ... Punching material, 28 ... Air supply panel, 29 ... Filter, 30
… Cross flow fan, 31… DAT, 33… Duct,
34 ... Temperature sensor, 35 ... Motor, 36 ... Main CP
U package, 37 ... Main case, 38 ... Front bracket, 39 ... Top cover, 40 ... Slide rail, 4
DESCRIPTION OF SYMBOLS 1 ... Guide pin, 42 ... Setting guide, 43 ... Reinforcing plate, 44 ... Guide rail, 45 ... Lever, 46 ... Small hole, 47 ... Projection, 48 ... Female connector, 49 ... Male connector, 51 ... LSI chip , 53 ... LSI chips, 5
4 ... Hand lever, 55 ... Stopper, 56 ... Butterfly hinge,
57 ... Decorative screw, 58 ... Rectangular mouth, 59 ... Guide plate, 6
1 ... Battery cover, 62a ... Radiating fins, 62b ...
Radiating fins, 62c ... Radiating fins, 63 ... Converter board, 64a ... Aluminum plate, 64b ... Aluminum plate, 65 ... Grease, 67 ... INPUT, 68a ... Breaker, 68b ...
Breaker, 70 ... Main AC / DC converter, 72
... heat sink, 73a ... light emitting diode, 73b ... light emitting diode, 74 ... auxiliary AC / DC converter, 75 ... terminal part, 76 ... support plate, 77 ... rubber, 80 ... ground terminal,
81 ... Prism, 82 ... Front cover, 83 ... Main body box,
85 ... Recessed part, 86 ... Resin molded part, 94 ... Top plate, 95 ... Both side plates, 96 ... Rear plate, 97 ... Decorative panel, 98 ... Mounting part, 99 ... Uneven part, 100 ... Clearance, 101 ... Reinforcing member, 102 ... through hole, 103 ... duct, 104 ... indicator, 105 ... vent hole, 106 ... control panel, 107 ... power switch, 108 ... HDD, 109 ...
HDD sheet metal, 111 ... Noise filter circuit, 112 ... High voltage prevention circuit, 113 ... Coil, 114 ... Nose, 11
5 ... Casing, 116 ... Chamber, 117 ... Intake port, 118 ... Line unit, 119 ... Exhaust port, 120 ...
System bus, 121 ... MCU, 122 ... MI, 123
... Console, 124 ... RS232C, 125 ... Centronics, 126 ... Basic I / O controller, 127 ...
LAN, 128 ... CA, 129 ... IOBC, 130 ... M
T, 131 ... MCI, 132 ... SCSI controller,
133 ... ENA, 134 ... FAS, 135 ... HPS bus, 136 ... Processor bus, 137 ... System bus,
138 ... Basic I / O bus, 139 ... HPS bus, 140
... MBA, 141 ... Expansion I / O package unit, 1
43 ... Cassette magnetic tape recorder (CMT),
144 ... Area related to expansion I / O package, 145 ...
Small mouth, 146 ... Handle, 147 ... Rail, 152 ... Silencer, 160 ... Bottom plate, 710 ... Air supply section, 730 ... First flow path, 740 ... Second flow path, 750 ... Exhaust section, 1000 ... Computer.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Yamada 810 Shimoimaizumi, Ebina City, Kanagawa Prefecture Office Systems Department, Hitachi, Ltd. (72) Kazuo Morita, 810 Shimoimaizumi, Ebina City, Kanagawa Stock Company (72) Inventor, Toshio Hatada, 502, Kamidate-cho, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho Co., Ltd.

Claims (10)

[Claims] 1. An air-cooled information processing apparatus comprising a plurality of types of equipment and a housing for accommodating the equipment, each of which is arranged in at least one location of the housing, and takes in and exhausts cooling air. The air supply unit and the air exhaust unit for performing the above are substantially divided into the internal space of the housing, and at least two cooling air flow paths are formed between the air supply unit and the air exhaust unit. A member serving as a partition wall, and a main fan unit arranged at least one in each of the cooling air flow passages of each system. The first flow passage, which is at least one system of the cooling air flow passages, has the above A plurality of devices among the devices are arranged in parallel to the flow of the cooling air, and the second flow path, which is at least one other system of the cooling air flow paths, has another device among the above devices. Multiple devices follow the flow of cooling air Air-cooled data processing apparatus characterized by being arranged in series. 2. The air-cooled type apparatus according to claim 1, further comprising an auxiliary device for increasing a cooling capacity of at least one specific device among a plurality of devices arranged in parallel in the first flow path. Information processing equipment. 3. The air-cooled information processing device according to claim 2, wherein the auxiliary device is a sub fan that blows air to the specific device. 4. The specific device according to claim 3, wherein at least one processor, a memory element group, a plurality of boards on which these are mounted, and these boards are arranged in a substantially rectangular parallelepiped space. An air-cooled information processing device having a sub-fan at a supply-side end thereof, which is a main processing unit having a supporting member for supporting the same. 5. The apparatus according to claim 1, wherein one of the devices arranged in the second flow path is a storage device unit in which a plurality of storage medium driving devices are arranged, and the storage device unit is the second device.
An air-cooled information processing device arranged upstream of a flow path. 6. The air supply unit according to claim 1, wherein the air supply unit is a part of an outer wall of the housing, and an outer wall unit provided with a first intake port and a cooling air flow path formed inside the outer wall unit. Has an inner wall portion provided with a second intake port, and the first intake port and the second intake port are overlapped with each other when viewed in the normal direction. An air-cooled information processing device placed in a non-existing position. 7. The air-cooled information processing apparatus according to claim 6, wherein the main fan unit of the first flow path is arranged on the exhaust side of the flow path. 8. The air-cooled information processing device according to claim 6, wherein the main fan unit of the second flow passage is arranged on the air supply side of the flow passage. 9. The intake port of the main fan unit of the second flow path according to claim 8, is located downstream of the second intake port of the air supply unit, and they are located in the space between them. ,
An air-cooled information processing device that communicates with a member that blocks the line of sight from one side to the other side. 10. The air-cooled information processing apparatus according to claim 6, wherein a silencer is loaded in a part of a space surrounded by an inner wall portion and an outer wall portion of the air supply unit.