JPH0429394A - Soldering method for circuit board - Google Patents
Soldering method for circuit boardInfo
- Publication number
- JPH0429394A JPH0429394A JP2134926A JP13492690A JPH0429394A JP H0429394 A JPH0429394 A JP H0429394A JP 2134926 A JP2134926 A JP 2134926A JP 13492690 A JP13492690 A JP 13492690A JP H0429394 A JPH0429394 A JP H0429394A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- board
- substrate
- electrode
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 49
- 239000006071 cream Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 12
- 239000003990 capacitor Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000007598 dipping method Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、回路基板のハンダ付方法に関するものであ
り、特に、ハンダ付工程を簡素化する回路基板のハンダ
付方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for soldering a circuit board, and particularly to a method for soldering a circuit board that simplifies the soldering process.
［従来の技術］
従来の回路基板のハンダ付方法は、基板の表面及び裏面
にハンダ付を施す際に、先ず基板の表面のハンダ付する
個所にクリームハンダを塗布し、該基板を加熱炉内へ通
過させて該クリームハンダを溶着してハンダリフローを
施す。然る後に、該基板の裏面をデイツプ槽の溶融ハン
ダに浸漬して、基板裏面のハンダ付個所に該溶融ノ１ン
ダを溶着し、ハンダデイツプを施していた。[Prior Art] In the conventional method of soldering a circuit board, when soldering the front and back sides of the board, cream solder is first applied to the parts to be soldered on the front surface of the board, and then the board is placed in a heating furnace. The cream solder is welded by passing through the solder, and solder reflow is performed. Thereafter, the back side of the board was immersed in molten solder in a dip bath, and the molten solder was welded to the soldering locations on the back side of the board, thereby applying a solder dip.
［発明が解決しようとする課題］
上述したように、基板の表裏両面にハンダ付を施して回
路基板を形成する際の従来のハンダ付方法は、ハンダリ
フローとハンダデイツプの工程にてハンダ付しているた
め、回路基板の組立作業が煩雑で生産性を悪化させてい
る。[Problems to be Solved by the Invention] As mentioned above, the conventional soldering method when forming a circuit board by soldering both the front and back sides of a board is to solder in the solder reflow and solder dip processes. This makes assembly of circuit boards complicated and reduces productivity.
更に、基板の熱処理が二工程となるために、基板及び該
基板に装着するマウント部品、チップ部品等の品質や機
能を低下させる原因となっている。Furthermore, since the heat treatment of the board requires two steps, this causes deterioration in the quality and function of the board, mounting parts, chip parts, etc. mounted on the board.
そこで、回路基板のハンダ付工程を簡素化して生産性を
向上すると共に、該回路基板の品質の低下を防止するた
めに解決されるべき技術的課題が生じてくるのであり、
本発明は該課題を解決することを目的とする。Therefore, a technical problem has arisen that must be solved in order to simplify the soldering process of circuit boards, improve productivity, and prevent the quality of the circuit boards from deteriorating.
The present invention aims to solve this problem.
［課題を解決するための手段］
この発明は上記目的を達成するために提案せられたもの
であり、基板の表面及び裏面にハンダ付を施して形成す
る回路基板に於て、基板表面のハンダ付する部分にクリ
ームハンダを塗布し、該基板の裏面にハンダデイツプを
施すことを特徴とする回路基板のハンダ付方法を提供せ
んとするものである。[Means for Solving the Problems] The present invention has been proposed to achieve the above object, and in a circuit board formed by applying solder to the front and back surfaces of the board, it is possible to reduce the amount of solder on the surface of the board. It is an object of the present invention to provide a method for soldering a circuit board, which is characterized by applying cream solder to the part to be soldered and applying a solder dip to the back surface of the board.
［作用１
この発明は基板表面のハンダ付する部分にクリームハン
ダを塗布し、該基板の裏面をデイツプ槽の溶融ハンダに
浸漬してハンダデイツプを施す。[Operation 1] In this invention, cream solder is applied to the part of the surface of the board to be soldered, and the back surface of the board is immersed in molten solder in a dip tank to apply a solder dip.
然るときには、溶融ハンダの熱によりクリームハンダが
基板の表面に溶着し、基板の表裏両面にハンダ付するこ
とができる。In such a case, the cream solder is welded to the surface of the board by the heat of the molten solder, making it possible to solder both the front and back sides of the board.
［実施例」
以下、この発明の一実施例を別紙添付図面の第１図乃至
第３図に従って詳述する。尚、本実施例では回路基板に
コンデンサ、ジャンパーリード線、ＩＣをハンダ付する
方法について例示的に説明する。[Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 of the attached drawings. In this embodiment, a method for soldering a capacitor, a jumper lead wire, and an IC to a circuit board will be exemplified.
図に於て（１）は回路基板であり、第１図に示すように
、該回路基板（１）にはコンデンサ（２）、ＩＣ（３）
、ジャンパーリード線（４）が装着されている。コンデ
ンサ（２）は樹脂性の基板（５）の孔（６）（６）に端
子ピン（７）（７）を押通し、且つ、基板（５）の裏面
に設けた回路パターン（図示せず）の電極（８）（８）
に該端子ピン（η（乃をハンダ（Ｑ）（９）にて接続し
て裏面の回路パターンと導通されている。前記ＩＣ（３
）は基板（５）の表面に設けた回路パターン（図示せず
）の電極θ０）（１０）・・・に端子（１１）０１）・
・・をハンダ（９ａ）（９ｉ）・・・にて接続して該表
面の回路パターンと導通されている。In the figure, (1) is a circuit board, and as shown in Figure 1, the circuit board (1) has a capacitor (2), an IC (3)
, jumper lead wire (4) is attached. The capacitor (2) is made by pushing the terminal pins (7) (7) through the holes (6) (6) of the resin board (5), and by using a circuit pattern (not shown) provided on the back side of the board (5). ) electrode (8) (8)
The terminal pin (η) is connected to the circuit pattern on the back side by soldering (Q) (9).
) are terminals (11)01) and 10) of the circuit pattern (not shown) provided on the surface of the substrate (5).
. . are connected with solder (9a), (9i), . . . to be electrically connected to the circuit pattern on the surface.
ジャンパーリード線（４）は両側部（ユ（鴫が折曲され
、該側部（＋、＞（２）を基板（５）の孔０→（！→に
押通している。そして、このジャンパーリード線（４）
は基板（５）の表面で表面の回路パターンの電極（ゆに
ハンダ（９ａ）にて接続され、基板（５）の裏面で裏面
の回路パターンの電極θつにハンダ（９）にて接続され
て基板（５）の表面の回路パターンと裏面の回路パター
ンとを導通している。基板（５）の回路パターンはハン
ダレジスト（図示せず）に被覆され、前記電極（８Ｘ８
）、 （ＩＯＸＩＯ）・・・Ｈ，（＋’ｆｌのみを露出
している。The jumper lead wire (4) is bent at both sides (+, > (2) and pushed through the hole 0 → (! →) of the board (5). Lead wire (4)
are connected to the electrodes of the circuit pattern on the front side of the board (5) with solder (9a), and are connected to the electrodes θ of the circuit pattern on the back side of the board (5) with solder (9). The circuit pattern on the front side of the board (5) and the circuit pattern on the back side are electrically connected.The circuit pattern on the board (5) is covered with a solder resist (not shown), and the circuit pattern on the front side of the board (5) is covered with solder resist (not shown).
), (IOXIO)...H, (+'fl only is exposed.
一方、コンデンサ（２）、ＩＣ（３）、ジャンパーリー
ド線（４）の装着は第２図に示すように、先ず、基板（
５）の所定の位置にコンデンサ（２）、Ｉ Ｃ（３）、
ジャンパーリード線（４）を搭載し、次に第３図に示す
ように、基板（５）の表面にハンダ付する個所、即ち電
極（１０）（１０）・・・及び（ゆ上面にクリームハン
ダ（９ａ）（９ａ）・・・を塗布する。然る後、該基板
（５）の裏面をデイツプ槽（図示せず）の溶融ハンダに
浸漬してハンダデイツプを施せば、基板（５）裏面の電
極（８）（８）、 （Ｆ９にハンダ（９）（９）・・・
が溶着して電極（８）（８）にコンデンサ（２）の端子
ピン（η（ηが、電極θつにジャンパーリード線（４）
の−側部（Ｉ、１が夫々接続固定される。このときは、
基板（５）の表面のクリームハンダ（９！）（９１）・
・・がハンダデイツプ槽の溶融ハンダの熱により溶解し
て硬化し、夫々電極（ロ）とジャンパーリード線（４）
の他側部（ロ）及び電極０ΦＯｎ）・・・とＩＣ（３）
の端子Ｑ ９ Ｑ Ｑ・・・とに該クリームハンダ（９
ａ）（９ｓ）・・・が溶着して接続固定する。On the other hand, as shown in Figure 2, the capacitor (2), IC (3), and jumper lead wire (4) are first attached to the board (
5) At the predetermined positions of the capacitor (2), IC (3),
Mount the jumper lead wire (4), and then apply cream solder to the top surface of the board (5) where it will be soldered, namely the electrodes (10), (10), etc., as shown in Figure 3. (9a) (9a)... After that, the back side of the board (5) is immersed in molten solder in a dip tank (not shown) and a solder dip is applied. Electrodes (8) (8), (Solder to F9 (9) (9)...
is welded to the terminal pin (η) of the capacitor (2) to the electrode (8) (8), and the jumper lead wire (4) is welded to the electrode (θ).
- side (I, 1 are connected and fixed respectively. At this time,
Cream solder (9!) (91) on the surface of the board (5)
... are melted and hardened by the heat of the molten solder in the solder dip tank, and the electrodes (b) and jumper lead wires (4) are bonded to each other.
Other side part (b) and electrode 0ΦOn)... and IC (3)
Terminal Q 9 Q Q... and the cream solder (9
a) (9s)... are welded and connected and fixed.
尚、この発明は、この発明の精神を逸脱しない限り種々
の改変を為す事ができ、そして、この発明が該改変せら
れたものに及ぶことは当然である。Note that this invention can be modified in various ways without departing from the spirit of the invention, and it goes without saying that this invention extends to such modifications.
［発明の効果］
この発明は１記−実施例に詳述したように、基板裏面に
ハンダデイツプを施すと同時に、該ハンダデイツプの熱
を利用して基板表面に塗布したクリームハンダを溶着す
るため、従来の基板を加熱炉内を通過させる工程を削減
できる。[Effects of the Invention] As described in detail in Section 1-Examples, the present invention applies a solder dip to the back surface of the substrate and at the same time uses the heat of the solder dip to weld the cream solder applied to the surface of the substrate. The process of passing the substrate through a heating furnace can be reduced.
従って、回路基板のハンダ付工程が簡素化し、生産性の
向上及びコストダウンに寄与できる。Therefore, the process of soldering the circuit board is simplified, contributing to improved productivity and cost reduction.
更に、基板の熱処理が従来の二回から一回になったため
、基板及び装着部品の品質や機能の低下を防止すること
ができる等著しい効果を奏する発明である。Furthermore, since the board is heat-treated once instead of twice in the past, this invention has significant effects, such as being able to prevent deterioration in the quality and functionality of the board and mounted parts.
図は本発明の一実施例を示し、第１図は回路基板の縦断
面図、第２図は基板に部品を搭載した状態を示す縦断面
図、第３図は基板にクリームハンダを塗布した状態を示
す縦断面図である。The figures show one embodiment of the present invention, in which Fig. 1 is a vertical cross-sectional view of a circuit board, Fig. 2 is a longitudinal cross-sectional view showing a state in which components are mounted on the board, and Fig. 3 is a vertical cross-sectional view showing a state in which components are mounted on the board. It is a longitudinal cross-sectional view showing a state.
Claims (1)
基板に於て、基板表面のハンダ付する部分にクリームハ
ンダを塗布し、該基板の裏面にハンダデイツプを施すこ
とを特徴とする回路基板のハンダ付方法。Soldering of a circuit board, which is formed by applying soldering to the front and back sides of the board, characterized in that cream solder is applied to the part to be soldered on the front side of the board, and a solder dip is applied to the back side of the board. Attachment method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134926A JPH0429394A (en) | 1990-05-24 | 1990-05-24 | Soldering method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134926A JPH0429394A (en) | 1990-05-24 | 1990-05-24 | Soldering method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0429394A true JPH0429394A (en) | 1992-01-31 |
Family
ID=15139777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2134926A Pending JPH0429394A (en) | 1990-05-24 | 1990-05-24 | Soldering method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6542428B2 (en) | 1998-12-24 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device allowing increase in capacity and operation speed with a suppressed layout area |
-
1990
- 1990-05-24 JP JP2134926A patent/JPH0429394A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6542428B2 (en) | 1998-12-24 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device allowing increase in capacity and operation speed with a suppressed layout area |
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