JPH04228503A - Metal-coated powder and its production - Google Patents
Metal-coated powder and its productionInfo
- Publication number
- JPH04228503A JPH04228503A JP3122188A JP12218891A JPH04228503A JP H04228503 A JPH04228503 A JP H04228503A JP 3122188 A JP3122188 A JP 3122188A JP 12218891 A JP12218891 A JP 12218891A JP H04228503 A JPH04228503 A JP H04228503A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- inorganic particles
- powder
- resin powder
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 123
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 68
- 239000002184 metal Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 88
- 238000007772 electroless plating Methods 0.000 claims abstract description 43
- 239000000956 alloy Substances 0.000 claims abstract description 39
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 39
- 206010070834 Sensitisation Diseases 0.000 claims abstract description 14
- 230000004913 activation Effects 0.000 claims abstract description 14
- 230000008313 sensitization Effects 0.000 claims abstract description 14
- 239000010954 inorganic particle Substances 0.000 claims description 80
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 abstract description 48
- 239000002245 particle Substances 0.000 abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 26
- 230000008569 process Effects 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 238000011109 contamination Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 28
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 24
- 239000000243 solution Substances 0.000 description 19
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 18
- 239000000084 colloidal system Substances 0.000 description 17
- 238000001994 activation Methods 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- -1 inkstones Substances 0.000 description 11
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 10
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000001914 filtration Methods 0.000 description 10
- 239000012528 membrane Substances 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- 239000001119 stannous chloride Substances 0.000 description 10
- 235000011150 stannous chloride Nutrition 0.000 description 10
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 9
- 229910018104 Ni-P Inorganic materials 0.000 description 9
- 229910018536 Ni—P Inorganic materials 0.000 description 9
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 9
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 239000004570 mortar (masonry) Substances 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000001509 sodium citrate Substances 0.000 description 5
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 4
- 235000019270 ammonium chloride Nutrition 0.000 description 4
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 4
- 229940074439 potassium sodium tartrate Drugs 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- VILMUCRZVVVJCA-UHFFFAOYSA-M sodium glycolate Chemical compound [Na+].OCC([O-])=O VILMUCRZVVVJCA-UHFFFAOYSA-M 0.000 description 4
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 210000001685 thyroid gland Anatomy 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000001632 sodium acetate Substances 0.000 description 2
- 235000017281 sodium acetate Nutrition 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 101100069231 Caenorhabditis elegans gkow-1 gene Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910020674 Co—B Inorganic materials 0.000 description 1
- 229910019918 CrB2 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910006130 SO4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、塗料用、接着剤用、粉
末冶金用、射出成型用、電磁シールド用および例えば硯
などの分散強化材用、粉体塗装用、化粧料用などに使用
して好適な金属被覆粉体及びその製造方法に関するもの
である。[Industrial Application Fields] The present invention can be used for paints, adhesives, powder metallurgy, injection molding, electromagnetic shielding, dispersion reinforcement materials such as inkstones, powder coatings, cosmetics, etc. The present invention relates to a metal-coated powder suitable for this purpose and a method for producing the same.
【0002】0002
【従来の技術】従来の金属被覆粉体としては、表面を粗
面処理した樹脂粉体上に金属又は合金層を形成したもの
である。又、その製造方法としては、樹脂粉体表面をク
ロム酸などを用いてエッチングして親水化およびポーラ
ス化し、その表面に増感処理および活性化処理を行い、
その後、無電解めっき法により金属又は合金層を形成す
ることにより金属被覆粉体を得ていた。2. Description of the Related Art A conventional metal-coated powder is one in which a metal or alloy layer is formed on a resin powder whose surface has been roughened. In addition, as a manufacturing method, the surface of the resin powder is etched using chromic acid etc. to make it hydrophilic and porous, and the surface is subjected to sensitization treatment and activation treatment.
Thereafter, a metal coated powder was obtained by forming a metal or alloy layer by electroless plating.
【0003】0003
【発明が解決しようとする課題】しかしこれらの方法は
、樹脂の材質において制約がある。即ち、エッチング処
理により、その表面を親水化およびポーラス化すること
ができる樹脂が限られている。従って、目的に応じた樹
脂を選定することができない。又、エッチング処理によ
り樹脂表面を親水化およびポーラス化する際に、エッチ
ング液が樹脂表面に吸着し、この吸着したエッチング液
がめっき液に混入することによりめっき液が不安定とな
る。従って、めっき液の分解或いはめっきが不可能にな
るということがあった。[Problems to be Solved by the Invention] However, these methods have limitations regarding the quality of the resin material. That is, there are a limited number of resins whose surfaces can be made hydrophilic and porous by etching. Therefore, it is not possible to select a resin depending on the purpose. Furthermore, when the resin surface is made hydrophilic and porous by etching treatment, the etching solution is adsorbed to the resin surface, and the adsorbed etching solution is mixed into the plating solution, making the plating solution unstable. Therefore, decomposition of the plating solution or plating may become impossible.
【0004】0004
【課題を解決するための手段】そこで本発明は、前記問
題に鑑みなされたもので、樹脂粉体上に金属又は合金層
を直接形成することなく、少なくとも無機質粒子を介し
て形成するようにしたもので、樹脂粉体上に無機質粒子
を付着・固定し、無機質粒子の外方に金属又は合金層を
形成した金属被覆粉体を第1の要旨とし、樹脂粉体上に
無機質粒子を付着・固定し、無機質粒子を増感処理した
後活性化処理を施すか、増感処理と活性化処理とを同時
に施し、その後無電解めっき法により金属又は合金層を
形成した金属被覆粉体の製造方法を第2の要旨とし、樹
脂粉体上に、予め増感処理と活性化処理を施した無機質
粒子を付着・固定した後、無電解めっき法により金属又
は合金層を形成した金属被覆粉体の製造方法を第3の要
旨とし、樹脂粉体上に無機質粒子を付着・固定し、無機
質粒子をシラン系カップリング剤で処理した後、無機質
粒子に無電解めっきの触媒核を吸着せしめ、更に無電解
めっきを施し金属又は合金層を形成した金属被覆粉体の
製造方法を第4の要旨とし、樹脂粉体上に、予めシラン
系カップリング剤で処理した後無電解めっきの触媒核を
吸着せしめた無機質粒子を付着・固定し、次いで無電解
めっきを施し金属又は合金層を形成した金属被覆粉体の
製造方法を第5の要旨とし、樹脂粉体上に、予めシラン
系カップリング剤で処理した無機質粒子を付着・固定し
た後無電解めっきの触媒核を吸着せしめ、次いで無電解
めっきを施し金属又は合金層を形成した金属被覆粉体の
製造方法を第6の要旨とするものである。[Means for Solving the Problems] Therefore, the present invention has been made in view of the above problem, and it is an object of the present invention to form a metal or alloy layer not directly on resin powder, but at least through inorganic particles. The first gist is metal-coated powder, in which inorganic particles are attached and fixed on resin powder, and a metal or alloy layer is formed on the outside of the inorganic particles; A method for producing a metal-coated powder in which a metal or alloy layer is formed by electroless plating after fixing and sensitizing inorganic particles, followed by activation treatment, or by simultaneously performing sensitization treatment and activation treatment. The second gist is that metal-coated powder is produced by attaching and fixing inorganic particles that have been previously sensitized and activated on resin powder, and then forming a metal or alloy layer by electroless plating. The third aspect is the production method, in which inorganic particles are attached and fixed on resin powder, the inorganic particles are treated with a silane coupling agent, and then the catalyst nuclei for electroless plating are adsorbed onto the inorganic particles. The fourth aspect is a method for producing a metal-coated powder that has been electrolytically plated to form a metal or alloy layer, in which catalyst nuclei for electroless plating are adsorbed onto resin powder after being treated with a silane coupling agent in advance. The fifth gist is a method for producing metal-coated powder in which inorganic particles are attached and fixed, and then electroless plating is applied to form a metal or alloy layer, and the resin powder is pretreated with a silane coupling agent. The sixth aspect is a method for producing a metal-coated powder in which a metal or alloy layer is formed by adsorbing catalyst nuclei for electroless plating after adhering and fixing inorganic particles, and then electroless plating is performed.
【0005】本発明の金属被覆粉体は、図1に模式的に
示したように、基本的には、樹脂粉体1と、該樹脂粉体
1上に形成した無機質粒子2と、該無機質粒子2の外方
に形成した金属又は金属層3とよりなっている。先ず、
基材となる樹脂粉体1としては、天然繊維、天然樹脂、
ポリエチレン、ポリプロピレン、ポリアミド樹脂、ポリ
アセタール樹脂、ポリカーボネート、酢酸繊維素樹脂、
ABS、SAN、AS、スチロール樹脂、塩化ビニル樹
脂、ポリアクリル酸樹脂、ポリアセタール、ポリアクリ
ロニトリル、ポリエステル等の熱可塑性樹脂、フェノー
ル樹脂、尿素樹脂、ユリア樹脂、アルキッド樹脂、メラ
ミン樹脂などの熱硬化性樹脂などが挙げられる。これら
樹脂粉体の外面形状は、球状、無定形繊維状、コイル状
などが、又、その内面形状は、中実状、中空状、多孔質
状など種々のものが採用可能である。As schematically shown in FIG. 1, the metal-coated powder of the present invention basically consists of a resin powder 1, inorganic particles 2 formed on the resin powder 1, and the inorganic powder. It consists of a metal or a metal layer 3 formed on the outside of the particles 2. First of all,
As the resin powder 1 serving as the base material, natural fibers, natural resins,
Polyethylene, polypropylene, polyamide resin, polyacetal resin, polycarbonate, cellulose acetate resin,
Thermoplastic resins such as ABS, SAN, AS, styrene resin, vinyl chloride resin, polyacrylic acid resin, polyacetal, polyacrylonitrile, polyester, etc., thermosetting resins such as phenol resin, urea resin, urea resin, alkyd resin, melamine resin, etc. Examples include. The outer shape of these resin powders can be spherical, amorphous fiber, coiled, etc., and the inner shape can be various, such as solid, hollow, porous, etc.
【0006】次に無機質粒子2としては、アルミノ珪酸
塩を含む金属珪酸塩、金属炭化物、金属酸化物、金属チ
ッ化物、金属炭酸塩、金属ハロゲン化物などが一種もし
くは二種以上混合して使用される。この無機質粒子の形
状は前記樹脂粉体と同様に種々採用でき、又、大きさは
、その使用目的に応じ種々選定される。尚、無機質粒子
としては、金属及びその酸化物などの無機質コロイド粒
子を一種もしくは二種以上使用してもよい。Next, as the inorganic particles 2, metal silicates including aluminosilicates, metal carbides, metal oxides, metal nitrides, metal carbonates, metal halides, etc. are used singly or in combination of two or more. Ru. The shape of the inorganic particles can be varied in the same way as the resin powder, and the size can be selected depending on the purpose of use. As the inorganic particles, one or more types of inorganic colloid particles such as metals and oxides thereof may be used.
【0007】更に、金属又は合金層3としては、Ni−
P、Ni−B、Co−B、Co−P、Ni、Co、Fe
、Ag、Au、Pd、Cr、Rh、Ru、Cd、Pb、
Sn、Zn、Zn−Cu、Ni−Co−P、Ni−W−
P、Ni−Fe−P、Co−Fe−P、Co−W−P等
が挙げられる。又、これら金属又は合金層は2層、3層
などに形成してもよいし、金属又は合金にAl 2O
3、ZrO 2、SiO 2、TiO 2、TiN、T
iC、SiC、C、MoS 2、WS 2、BN、Ba
SO 4、CrB 2、ZrB 2等の酸化物、炭化物
、窒化物、ホウ化物、硫化物などの無機物、PTFF、
ABS、PP、PE、ポリカーボネート、ラテックス等
の有機物などを含んだ複合層としてもよい。尚、本発明
における金属又は合金層3としては、図2に模式的に示
すように、樹脂粉体1上に不連続に付着・固定した無機
質粒子2の外方に膜を形成したものをも包含する。Furthermore, as the metal or alloy layer 3, Ni-
P, Ni-B, Co-B, Co-P, Ni, Co, Fe
, Ag, Au, Pd, Cr, Rh, Ru, Cd, Pb,
Sn, Zn, Zn-Cu, Ni-Co-P, Ni-W-
Examples include P, Ni-Fe-P, Co-Fe-P, Co-W-P, and the like. Moreover, these metal or alloy layers may be formed into two or three layers, or the metal or alloy may be formed with Al 2O
3, ZrO2, SiO2, TiO2, TiN, T
iC, SiC, C, MoS 2, WS 2, BN, Ba
Oxides such as SO4, CrB2, ZrB2, inorganic substances such as carbides, nitrides, borides, sulfides, PTFF,
It may also be a composite layer containing organic substances such as ABS, PP, PE, polycarbonate, and latex. The metal or alloy layer 3 in the present invention may also include a layer formed on the outside of inorganic particles 2 discontinuously adhered and fixed on the resin powder 1, as schematically shown in FIG. include.
【0008】次に、製造方法について述べると、製造方
法としては、大別して以下の5つの方法が挙げられる。
第1の方法は、樹脂粉体上に無機質粒子を付着・固定し
、無機質粒子を増感処理した後活性化処理を施すか、増
感処理と活性化処理とを同時に施し、その後無電解めっ
き法により金属又は合金層を形成する方法である。即ち
、先ず、樹脂粉体と無機質粒子を自動乳鉢、ボールミル
、ジェットミル、アトマイザー、ハイブリダイザー等を
用い処理することにより、樹脂粉体上に、無機質粒子を
機械的に付着・固定する。次いで、公知の増感処理、即
ち、無機質粒子を塩化第1スズ等の還元性を有する物質
の水溶液中で分散処理し、濾過、水洗後、公知の活性化
処理、即ち、パラジウム、銅、銀、金、白金などの塩化
物、硫酸塩などの水溶液に分散させることにより無機質
粒子に塩化パラジウムなどを吸着させ、無機質粒子を処
理する。尚、増感処理と活性化処理は同時(一般にキャ
タライジングという)に行なってもよい。最後に、公知
の無電解めっき法を用いて無機質粒子の外方に金属又は
合金層を形成する。[0008] Next, the manufacturing method can be roughly classified into the following five methods. The first method is to attach and fix inorganic particles onto resin powder, sensitize the inorganic particles, then perform activation treatment, or perform sensitization treatment and activation treatment simultaneously, and then electroless plating. This is a method of forming a metal or alloy layer by a method. That is, first, the inorganic particles are mechanically attached and fixed onto the resin powder by processing the resin powder and the inorganic particles using an automatic mortar, ball mill, jet mill, atomizer, hybridizer, etc. Next, the inorganic particles are dispersed in an aqueous solution of a reducing substance such as stannous chloride using a known sensitization process, filtered and washed with water, and then subjected to a known activation process such as palladium, copper, silver, etc. The inorganic particles are treated by adsorbing palladium chloride or the like onto the inorganic particles by dispersing them in an aqueous solution of chlorides, sulfates, etc. of gold, platinum, etc. Incidentally, the sensitization treatment and the activation treatment may be performed at the same time (generally referred to as catalyzing). Finally, a metal or alloy layer is formed on the outside of the inorganic particles using a known electroless plating method.
【0009】第2の方法は、樹脂粉体上に、予め増感処
理と活性化処理を施した(増感処理の後に活性化処理を
施しても、増感処理と活性化処理を同時に施し(キャタ
ライジング)てもよいが、キャタライジングの方が工程
が簡単になるという利点がある。尚、無機質粒子として
無機質コロイド粒子を用いる場合はキャタライジングを
施す。)無機質粒子を付着・固定した後、無電解めっき
法により金属又は合金層を形成する方法である。第2の
方法と第1の方法との相違点は、第2の方法は、樹脂粉
体上に無機質粒子を機械的に付着・固定する前に、無機
質粒子に予め、前記第1の方法と同じような増感処理、
活性化処理を施した点である。即ち、第2の方法は、予
め増感処理、活性化処理を施した無機質粒子を樹脂粉体
と共に、自動乳鉢、ボールミル、ジェットミル、アトマ
イザー、ハイブリダイザー等を用い処理することにより
、樹脂粉体上に無機質粒子を機械的に付着・固定させた
後、公知の無電解めっき法を用いて無機質粒子の外方に
金属又は合金層を形成したものである。本方法において
は、第1の方法に比し、工程の管理が容易であるという
効果を有する。The second method is to perform sensitization and activation treatment on the resin powder in advance (even if activation treatment is performed after sensitization treatment, sensitization treatment and activation treatment are not performed at the same time). (Catalyzing) may be used, but catalyzing has the advantage of simplifying the process. Catalyzing is performed when inorganic colloid particles are used as the inorganic particles.) After attaching and fixing the inorganic particles , a method of forming a metal or alloy layer by electroless plating. The difference between the second method and the first method is that, in the second method, before the inorganic particles are mechanically attached and fixed onto the resin powder, the inorganic particles are preliminarily coated with the inorganic particles as described in the first method. Similar sensitization treatment,
This is due to activation treatment. That is, the second method is to process inorganic particles that have been previously sensitized and activated together with resin powder using an automatic mortar, ball mill, jet mill, atomizer, hybridizer, etc. After mechanically adhering and fixing inorganic particles thereon, a metal or alloy layer is formed on the outside of the inorganic particles using a known electroless plating method. This method has the advantage that process management is easier than in the first method.
【0010】第3の方法は、樹脂粉体上に無機質粒子を
付着・固定し、無機質粒子をシラン系カップリング剤で
処理した後、無機質粒子に無電解めっきの触媒核を吸着
せしめ、更に無電解めっきを施し金属又は合金層を形成
する方法である。即ち、先ず、樹脂粉体と無機質粒子を
自動乳鉢、ボールミル、ジェットミル、アトマイザー、
ハイブリダイザー等を用い処理することにより、樹脂粉
体上に、無機質粒子を機械的に付着・固定する。次いで
、シラン系カップリング剤にて無機質粒子を処理する。
具体的には、シラン系カップリング剤としてアミノ系シ
ランカップリング剤、エポキシ系シランカップリング剤
、チオール系シランカップリング剤などを使用し、処理
方法としては、水を主とし必要に応じメタノール、エチ
ルアルコール、プロピルアルコール等の低級アルコール
を混合し、これにシラン系カップリング剤を0.1〜5
vol/vol%程度添加し、これに前記樹脂粉体に付
着・固定した無機質粒子を分散することにより処理する
。更に、無電解めっきの触媒核を吸着させるものである
が、このような触媒核となる金属としては、Pd、Ag
、Au、Rh、Cu等の塩化物、硫酸塩、硝酸塩などが
0.1〜10%程度の水溶液として使用される。
又、その処理方法としては、前記水溶液中に、前記カッ
プリング処理した樹脂粉体に付着・固定した無機質粒子
を分散処理すればよい。最後に、公知の無電解めっき法
を用いて無機質粒子の外方に金属又は合金層を形成する
。The third method is to attach and fix inorganic particles onto resin powder, treat the inorganic particles with a silane coupling agent, and then allow the inorganic particles to adsorb catalyst nuclei for electroless plating. This is a method of forming a metal or alloy layer by electrolytic plating. That is, first, resin powder and inorganic particles are processed in an automatic mortar, ball mill, jet mill, atomizer,
Inorganic particles are mechanically attached and fixed onto the resin powder by treatment using a hybridizer or the like. Next, the inorganic particles are treated with a silane coupling agent. Specifically, an amino-based silane coupling agent, an epoxy-based silane coupling agent, a thiol-based silane coupling agent, etc. are used as the silane-based coupling agent, and the treatment method is mainly water, but if necessary, methanol, Mix lower alcohols such as ethyl alcohol and propyl alcohol, and add 0.1 to 5 % of a silane coupling agent to this.
It is treated by adding about vol/vol% and dispersing the inorganic particles attached and fixed to the resin powder. Furthermore, it adsorbs catalyst nuclei for electroless plating, and examples of metals that serve as catalyst nuclei include Pd and Ag.
, Au, Rh, Cu, etc. chloride, sulfate, nitrate, etc. are used as an aqueous solution of about 0.1 to 10%. As a treatment method, the inorganic particles attached and fixed to the coupled resin powder may be dispersed in the aqueous solution. Finally, a metal or alloy layer is formed on the outside of the inorganic particles using a known electroless plating method.
【0011】第4の方法は、樹脂粉体上に、予めシラン
系カップリング剤で処理した後無電解めっきの触媒核を
吸着せしめた無機質粒子を付着・固定し、次いで無電解
めっきを施し金属又は合金層を形成する方法である。第
4の方法と第3の方法との相違点は、第4の方法は、樹
脂粉体上に無機質粒子を機械的に付着・固定する前に、
無機質粒子に予め、前記第1の方法と同じようなシラン
系カップリング剤処理と無電解めっきの触媒核を吸着さ
せる処理を施した点である。即ち、第4の方法は、予め
シラン系カップリング剤処理と無電解めっきの触媒核を
吸着させる処理を施した無機質粒子を樹脂粉体と共に、
自動乳鉢、ボールミル、ジェットミル、アトマイザー、
ハイブリダイザー等を用い処理することにより、樹脂粉
体上に無機質粒子を機械的に付着・固定させた後、公知
の無電解めっき法を用いて無機質粒子の外方に金属又は
合金層を形成したものである。本方法においては、第3
の方法に比し、工程の管理が容易であるという効果を有
する。[0011] The fourth method is to attach and fix inorganic particles, which have been previously treated with a silane coupling agent and adsorbed with catalyst nuclei for electroless plating, on resin powder, and then electroless plate is applied to the metal. Alternatively, it is a method of forming an alloy layer. The difference between the fourth method and the third method is that in the fourth method, before mechanically attaching and fixing the inorganic particles onto the resin powder,
The point is that the inorganic particles were previously treated with a silane coupling agent and a treatment to adsorb catalyst nuclei for electroless plating, similar to the first method. That is, the fourth method uses inorganic particles that have been previously treated with a silane coupling agent and treated to adsorb catalyst nuclei for electroless plating together with resin powder.
automatic mortar, ball mill, jet mill, atomizer,
After mechanically adhering and fixing the inorganic particles onto the resin powder by processing with a hybridizer etc., a metal or alloy layer is formed on the outside of the inorganic particles using a known electroless plating method. It is something. In this method, the third
Compared to the above method, this method has the advantage that the process can be easily controlled.
【0012】第5の方法は、第3の方法と第4の方法の
中間的な方法であって、樹脂粉体上に、予めシラン系カ
ップリング剤で処理した無機質粒子を付着・固定した後
無電解めっきの触媒核を吸着せしめ、次いで無電解めっ
きを施し金属又は合金層を形成する方法である。尚、シ
ラン系カップリング剤での処理、触媒核を吸着させる処
理、樹脂粉体への無機質粒子の固定方法は、第3の方法
、第4の方法と同じである。The fifth method is an intermediate method between the third method and the fourth method, in which inorganic particles, which have been treated with a silane coupling agent in advance, are attached and fixed onto the resin powder. This is a method in which catalyst nuclei for electroless plating are adsorbed, and then electroless plating is performed to form a metal or alloy layer. Incidentally, the treatment with a silane coupling agent, the treatment to adsorb catalyst nuclei, and the method of fixing inorganic particles to resin powder are the same as in the third method and the fourth method.
【0013】[0013]
【作用】本発明は、樹脂粉体上に無機質粒子を固定させ
ることにより、水に対するぬれ性の改善及び無機質粒子
に容易に無電解めっきを施すことができるので、従来の
樹脂のエッチングによるめっき液の汚染がなくなり、安
定に金属又は合金層を形成することが可能であると共に
種々の樹脂への処理が可能となるものである。[Function] By fixing inorganic particles on resin powder, the present invention improves water wettability and makes it possible to easily apply electroless plating to inorganic particles. This eliminates contamination and allows stable formation of metal or alloy layers, as well as processing of various resins.
【0014】[0014]
【実施例】(実施例1)樹脂粉体として住友化学工業(
株)製ファインパールポリスチレン3000SP(平均
粒子径6μm)を用い、無機質粒子として西ドイツ国メ
ルク社製アルミニウムオキサイド60(タイプE)を用
い、ボールミルに3000SPを100部、アルミニウ
ムオキサイド60を20部入れ、6時間処理を行ない球
状の樹脂表面に機械的にアルミニウムオキサイド60を
付着させた粉体を得た。次に、塩化第1スズ40g/l
、塩酸(35%)40ml/lの水溶液に、無機質粒子
の付着した樹脂粉体を入れ40℃にて5分間強制撹拌し
ながら分散処理した(増感処理)。その後、メンブラン
フィルターにて濾過し十分水洗した後、塩化パラジウム
0.1g/l、塩酸(35%)1ml/l中に室温にて
強制撹拌しながら分散し5分間処理することにより、無
機質粒子の表面に金属パラジウムを析出させた(活性化
処理)。これをメンブランフィルターにて濾過し十分水
洗後、無電解めっき液の硫酸ニッケル40g/l、クエ
ン酸ナトリウム25g/l、次亜リン酸ナトリウム20
g/l、酢酸ナトリウム15g/l、塩化アンモニウム
5g/l、pH5.5、60℃に5分間処理することに
よりNi−Pの合金層が形成された粉体を得た。[Example] (Example 1) As resin powder, Sumitomo Chemical (
Fine Pearl Polystyrene 3000SP (average particle size 6 μm) manufactured by Co., Ltd. was used, aluminum oxide 60 (type E) manufactured by Merck & Co., West Germany was used as the inorganic particle, and 100 parts of 3000SP and 20 parts of aluminum oxide 60 were placed in a ball mill. A time treatment was performed to obtain powder in which aluminum oxide 60 was mechanically adhered to the spherical resin surface. Next, stannous chloride 40g/l
The resin powder with inorganic particles attached was added to a 40 ml/l aqueous solution of hydrochloric acid (35%) and dispersed at 40° C. for 5 minutes with forced stirring (sensitization treatment). Thereafter, after filtration with a membrane filter and thorough washing with water, the inorganic particles were dispersed in 0.1 g/l of palladium chloride and 1 ml/l of hydrochloric acid (35%) at room temperature with forced stirring and treated for 5 minutes. Metallic palladium was deposited on the surface (activation treatment). After filtering this with a membrane filter and washing thoroughly with water, electroless plating solution containing 40 g/l of nickel sulfate, 25 g/l of sodium citrate, and 20 g/l of sodium hypophosphite
g/l, sodium acetate 15 g/l, ammonium chloride 5 g/l, pH 5.5, and treated at 60° C. for 5 minutes to obtain a powder in which a Ni-P alloy layer was formed.
【0015】(実施例2)樹脂粉体として東芝シリコー
ン(株)製XC99−301(シリコーン樹脂、平均粒
子径4μm)を用い、無機質粒子として大明化学工業(
株)製タイミクロンAG(アルミナ、粒子径0.2μm
)を用い、ハイブリダイザー((株)奈良機械製作所製
)にて5分間処理することにより樹脂粉体上にアルミナ
の粒子を付着させた粉体を得た。次に、塩化第1スズ2
0g/l、塩化パラジウム0.2g/l、塩酸(35%
)20ml/l中に分散し、5分間処理を行なった(キ
ャタライジング)。その後、メンブランフィルターにて
濾過し十分水洗した後、無電解めっき液の硫酸銅7g/
l、酒石酸カリウムナトリウム75g/l、トリエタノ
ールアミン10ml/l、ホルマリン(37%)25m
l/l、水酸化ナトリウム20g/l、炭酸ナトリウム
10g/l、シアン化ナトリウム0.125g/l、p
H8.0、52℃に15分間分散処理することにより無
機質粒子表面に銅を析出させ金属被覆された粉体を得た
。(Example 2) XC99-301 (silicone resin, average particle size 4 μm) manufactured by Toshiba Silicone Co., Ltd. was used as the resin powder, and Daimei Chemical Co., Ltd. (Silicone resin, average particle size 4 μm) was used as the inorganic particle.
Taimicron AG manufactured by Co., Ltd. (alumina, particle size 0.2 μm)
) and treated with a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.) for 5 minutes to obtain powder in which alumina particles were adhered to resin powder. Next, stannous chloride 2
0g/l, palladium chloride 0.2g/l, hydrochloric acid (35%
) 20 ml/l and treated for 5 minutes (catalyzing). After that, after filtering with a membrane filter and washing thoroughly with water, electroless plating solution containing 7g of copper sulfate/
l, potassium sodium tartrate 75g/l, triethanolamine 10ml/l, formalin (37%) 25m
l/l, sodium hydroxide 20g/l, sodium carbonate 10g/l, sodium cyanide 0.125g/l, p
By performing a dispersion treatment at H8.0 and 52° C. for 15 minutes, copper was precipitated on the surface of the inorganic particles to obtain metal-coated powder.
【0016】(実施例3)樹脂粉体としてダイキン工業
(株)製ルブロンL−5(フッ素樹脂、平均粒子径7μ
m)を用い、無機質粒子として富士デヴィソン(株)製
サイロイド150(シリカ、粒子径1.4μm)を用い
、ハイブリダイザー((株)奈良機械製作所製)にて5
分間処理することにより樹脂粉体上にシリカの粒子を付
着させた粉体を得た。次に、塩化第1スズ20g/l、
塩化パラジウム0.2g/l、塩酸(35%)20ml
/l中に分散し、5分間処理した(キャタライジング)
。その後、メンブランフィルターにて濾過し十分水洗し
た後、無電解めっき液の塩化ニッケル30g/l、次亜
リン酸ナトリウム10g/l、ヒドロキシ酢酸ナトリウ
ム50g/l、pH4.5、90℃に10分間分散処理
することによりNi−Pで被覆された粉体を得た。
これを濾過し十分水洗した後、シアン化金カリウム2g
/l、塩化アンモニウム75g/l、クエン酸ナトリウ
ム50g/l、次亜リン酸ナトリウム10g/l、pH
7.5、90℃にて分散処理しNi−P上にAuを被覆
した粉体を得た。(Example 3) As a resin powder, Lubron L-5 (fluororesin, average particle size 7μ) manufactured by Daikin Industries, Ltd.
5 m) using a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.) using Thyroid 150 (silica, particle size 1.4 μm) manufactured by Fuji Davison Co., Ltd. as an inorganic particle.
By processing for a minute, a powder with silica particles adhered to the resin powder was obtained. Next, 20 g/l of stannous chloride,
Palladium chloride 0.2g/l, hydrochloric acid (35%) 20ml
/l and treated for 5 minutes (catalyzing)
. After that, it was filtered with a membrane filter and thoroughly washed with water, and then dispersed in an electroless plating solution of 30 g/l of nickel chloride, 10 g/l of sodium hypophosphite, 50 g/l of sodium hydroxyacetate, pH 4.5, and 90°C for 10 minutes. A powder coated with Ni-P was obtained by the treatment. After filtering this and washing thoroughly with water, 2 g of potassium gold cyanide
/l, ammonium chloride 75g/l, sodium citrate 50g/l, sodium hypophosphite 10g/l, pH
7.5, and was subjected to a dispersion treatment at 90°C to obtain a powder in which Au was coated on Ni-P.
【0017】(実施例4)樹脂粉体として伊藤製油(株
)製LANCO−WAX−PP1362D(ポリプロピ
レン、平均粒子径12μm)を用い、無機質粒子として
西ドイツ国メルク社製キーゼルグールG(ケイソウ土)
を用い、自動乳鉢にて3時間処理することによりポリプ
ロピレン粉体表面にケイソウ土の微粒子を付着させた粉
体を得た。次に、塩化第1スズ20g/l、塩化パラジ
ウム0.2g/l、塩酸(35%)20ml/l中に分
散し、5分間処理を行なった(キャタライジング)。そ
の後、メンブランフィルターにて濾過し十分水洗した後
、無電解めっき液の硫酸ニッケル7g/l、タングステ
ン酸ナトリウム35g/l、クエン酸ナトリウム15g
/l、次亜リン酸ナトリウム10g/l、pH9.8、
95℃に15分間分散処理することによりNi−W−P
合金層を被覆した粉体を得た。(Example 4) LANCO-WAX-PP1362D (polypropylene, average particle size 12 μm) manufactured by Ito Oil Co., Ltd. was used as the resin powder, and Kieselguhr G (diatomaceous earth) manufactured by Merck & Co., West Germany was used as the inorganic particle.
The powder was treated in an automatic mortar for 3 hours to obtain a powder in which fine particles of diatomaceous earth were adhered to the surface of the polypropylene powder. Next, it was dispersed in 20 g/l of stannous chloride, 0.2 g/l of palladium chloride, and 20 ml/l of hydrochloric acid (35%), and treated for 5 minutes (catalyzing). After that, after filtering with a membrane filter and washing thoroughly with water, the electroless plating solution was 7 g/l of nickel sulfate, 35 g/l of sodium tungstate, and 15 g of sodium citrate.
/l, sodium hypophosphite 10g/l, pH 9.8,
Ni-W-P was dispersed at 95°C for 15 minutes.
A powder coated with an alloy layer was obtained.
【0018】(実施例5)無機質粒子として西ドイツ国
メルク社製アルミニウムオキサイド60(タイプE)を
用い、これを塩化パラジウム0.2g/l、塩化第1ス
ズ20g/l、塩酸(35%)20ml中に分散し、撹
拌しながら10分間処理を行った(キャタライジング)
。その後、メンブランフィルターにて濾過し十分に水洗
後60〜70℃にて乾燥した。次に、樹脂粉体として(
株)メタルカラー製SNP−638(スポンジ状ナイロ
ンパウダー、平均粒子径17.0μm)を用い、前記処
理した無機質粒子と共に自動乳鉢にて4時間処理するこ
とにより無機質粒子を樹脂粉体に付着・固定した。
その後、無電解めっき液の硫酸ニッケル40g/l、ク
エン酸ナトリウム25g/l、次亜リン酸ナトリウム2
0g/l、酢酸ナトリウム15g/l、塩化アンモニウ
ム5g/l、pH5.5、60℃に分散、撹拌しながら
10分間処理することによりNi−Pの合金層を被覆し
た粉体を得た。(Example 5) Aluminum oxide 60 (type E) manufactured by Merck & Co., West Germany was used as the inorganic particles, and this was mixed with 0.2 g/l of palladium chloride, 20 g/l of stannous chloride, and 20 ml of hydrochloric acid (35%). Dispersed in the liquid and treated for 10 minutes while stirring (catalyzing)
. Thereafter, it was filtered using a membrane filter, thoroughly washed with water, and then dried at 60 to 70°C. Next, as resin powder (
Using SNP-638 (sponge-like nylon powder, average particle diameter 17.0 μm) manufactured by Metal Color Co., Ltd., the inorganic particles were attached and fixed to the resin powder by treating them together with the treated inorganic particles in an automatic mortar for 4 hours. did. After that, electroless plating solution of nickel sulfate 40g/l, sodium citrate 25g/l, sodium hypophosphite 2
0g/l, sodium acetate 15g/l, ammonium chloride 5g/l, pH 5.5, and treated at 60°C for 10 minutes with stirring to obtain a powder coated with a Ni-P alloy layer.
【0019】(実施例6)無機質粒子として富士デヴィ
ソン(株)製サイロイド150(シリカ、粒子径1.4
μm)を用い、これを塩化第1スズ40g/l、塩酸(
35%)40ml/lの水溶液に分散し、5分間処理し
た(増感処理)。その後、濾過し水洗後塩化パラジウム
0.1g/l、塩酸(35%)1ml/l中に室温で分
散し無機質粒子の表面に金属パラジウムを析出させた(
活性化処理)。これをメンブランフィルターにて濾過し
十分水洗した後乾燥した。次に樹脂粉体として住友化学
工業(株)製ファインパールポリスチレン3000SP
(平均粒子径6μm)を用い、前記表面に金属パラジウ
ムを析出させた無機質粒子と共にハイブリダイザー((
株)奈良機械製作所製)にて5分間処理することにより
樹脂粉体上にシリカの粒子を付着させた粉体を得た。次
に無電解めっき液の日本カニゼン(株)製ブルーシュー
マを5倍に希釈し液に分散させて60℃にて10分間処
理することによりNi−Pの合金層を被覆した粉体を得
た。(Example 6) Thyroid 150 (silica, particle size 1.4, manufactured by Fuji Davison Co., Ltd.) was used as an inorganic particle.
μm), and mixed it with 40 g/l of stannous chloride and hydrochloric acid (
35%) in a 40 ml/l aqueous solution and treated for 5 minutes (sensitization treatment). Thereafter, it was filtered, washed with water, and dispersed at room temperature in 0.1 g/l of palladium chloride and 1 ml/l of hydrochloric acid (35%) to precipitate metal palladium on the surface of the inorganic particles (
activation process). This was filtered with a membrane filter, thoroughly washed with water, and then dried. Next, as a resin powder, Fine Pearl Polystyrene 3000SP manufactured by Sumitomo Chemical Industries, Ltd.
(average particle diameter 6 μm) was used together with inorganic particles on which metallic palladium was precipitated using a hybridizer ((
(manufactured by Nara Kikai Seisakusho Co., Ltd.) for 5 minutes to obtain powder in which silica particles were adhered to resin powder. Next, an electroless plating solution, Nippon Kanigen Co., Ltd.'s Blue Shuma, was diluted 5 times, dispersed in the solution, and treated at 60°C for 10 minutes to obtain a powder coated with a Ni-P alloy layer. .
【0020】(実施例7)樹脂粉体として住友化学工業
(株)製ファインパールポリスチレン3000SP(平
均粒子径6μm)を用い、無機質コロイドとしてアルミ
ナコロイド(日産化学(株)製、アルミナゾル300、
平均粒子径300nm)を用い、アルミナコロイド10
%水溶液中に上記樹脂粉体を分散させ強制撹拌すること
によりコロイド粒子を樹脂上に付着させた。その後濾過
、乾燥し、更にハイブリダイザー((株)奈良機械製作
所製)にて2分間処理することにより樹脂粉体上にアル
ミナコロイドを固定させ粉体を得た。次に、塩化第1ス
ズ20g/l、塩化パラジウム(平均粒子径5nm)0
.2g/l、塩酸(35%)20ml/l中に分散し1
0分間処理した(キャタライジング)。その後メンブラ
ンフィルターにて濾過し十分水洗後、無電解めっき液の
塩化ニッケル30g/l、次亜リン酸ナトリウム10g
/l、ヒドロキシ酢酸ナトリウム50g/l、pH4.
5、90℃に10分間処理することによりNi−Pの合
金層で被覆された粉体を得た。これを濾過し十分水洗し
た後、シアン化金カリウム2g/l、塩化アンモニウム
75g/l、クエン酸ナトリウム50g/l、次亜リン
酸ナトリウム10g/l、pH7.5、90℃に5分間
処理し、Ni−P上にAuを被覆した粉体を得た。(Example 7) Fine pearl polystyrene 3000SP (average particle size 6 μm) manufactured by Sumitomo Chemical Co., Ltd. was used as the resin powder, and alumina colloid (manufactured by Nissan Chemical Co., Ltd., Alumina Sol 300,
Alumina colloid 10
The resin powder was dispersed in a % aqueous solution and forcedly stirred to adhere colloidal particles onto the resin. Thereafter, it was filtered, dried, and further treated for 2 minutes with a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.) to fix the alumina colloid on the resin powder to obtain a powder. Next, stannous chloride 20g/l, palladium chloride (average particle size 5nm) 0
.. 2 g/l, dispersed in 20 ml/l of hydrochloric acid (35%) and 1
Processed for 0 minutes (catalyzing). After that, it is filtered with a membrane filter and washed thoroughly with water, and the electroless plating solution is nickel chloride 30g/l and sodium hypophosphite 10g.
/l, sodium hydroxyacetate 50g/l, pH 4.
5. A powder coated with a Ni-P alloy layer was obtained by processing at 90° C. for 10 minutes. After filtering and thoroughly washing with water, it was treated with potassium gold cyanide 2g/l, ammonium chloride 75g/l, sodium citrate 50g/l, sodium hypophosphite 10g/l, pH 7.5, and at 90°C for 5 minutes. , a powder in which Au was coated on Ni-P was obtained.
【0021】(実施例8)無機質コロイド粒子として触
媒化成工業(株)製Cataloid Sl−80P
(シリカコロイド、平均粒子径70〜90nm)の10
%水溶液を用い、これに塩化パラジウム(平均粒子径5
nm)0.2g/l、塩化第1スズ20g/l、塩酸(
35%)20ml/lを添加し、その後、強制撹拌しな
がら均一に分散処理した(シリカコロイドにパラジウム
コロイドが吸着した複合コロイド、キャタライジング)
。次に、樹脂粉体として伊藤製油(株)製LANCO−
WAX−PP1362D(ポリプロピレン、平均粒子径
12μm)を用い、前記処理した複合コロイドと共に自
動乳鉢にて10分間処理することにより複合コロイド粒
子を固定化させた樹脂粉体を得た。次に、無電解めっき
液の硫酸銅7g/l、酒石酸カリウムナトリウム75g
/l、トリエタノールアミン10ml/l、ホルマリン
(37%)25ml/l、水酸化ナトリウム20g/l
、炭酸ナトリウム10g/l、シアン化ナトリウム0.
125g/l、pH8.0、52℃に分散し15分間処
理することにより樹脂粉体上に銅を被覆した粉体を得た
。(Example 8) Cataloid Sl-80P manufactured by Catalysts & Chemicals Co., Ltd. as inorganic colloid particles
(Silica colloid, average particle size 70-90 nm)
% aqueous solution, palladium chloride (average particle size 5
nm) 0.2 g/l, stannous chloride 20 g/l, hydrochloric acid (
35%) 20 ml/l was added and then uniformly dispersed with forced stirring (composite colloid in which palladium colloid was adsorbed to silica colloid, catalyzing)
. Next, as a resin powder, LANCO-
WAX-PP1362D (polypropylene, average particle size 12 μm) was used and treated with the treated composite colloid for 10 minutes in an automatic mortar to obtain a resin powder in which composite colloid particles were immobilized. Next, electroless plating solution of copper sulfate 7g/l and potassium sodium tartrate 75g
/l, triethanolamine 10ml/l, formalin (37%) 25ml/l, sodium hydroxide 20g/l
, sodium carbonate 10g/l, sodium cyanide 0.
A resin powder coated with copper was obtained by dispersing the powder at 125 g/l, pH 8.0, and treating at 52° C. for 15 minutes.
【0022】(実施例9)樹脂粉体として住友化学工業
(株)製ファインパールポリスチレン3000SP(平
均粒子径6μm)を用い、無機質コロイド粒子として日
産化学(株)製スノーテックスZL(シリカコロイド、
平均粒子径300nm)を用い、これを水にて10倍に
希釈し前記樹脂粉体と共に強制撹拌することにより分散
させ、シリカコロイドを樹脂上に付着させた。その後メ
ンブランフィルターにて濾過、水洗、乾燥し、更にハイ
ブリダイザー((株)奈良機械製作所製)にて2分間処
理することにより樹脂粉体上にシリカコロイドを固定さ
せ樹脂粉体を得た。次に、塩化第1スズ40g/l、塩
酸(35%)40ml/l水溶液中に5分間分散処理し
た(増感処理)。濾過し水洗後塩化パラジウム(平均粒
子径5nm)0.1g/l、塩酸(35%)1ml/l
中に室温で5分間分散処理した(活性化処理)。その後
メンブランフィルターにて濾過し十分水洗した。次に、
無電解めっき液の硫酸銅7g/l、酒石酸カリウムナト
リウム75g/l、トリエタノールアミン10ml/l
、ホルマリン(37%)25ml/l、水酸化ナトリウ
ム20g/l、炭酸ナトリウム10g/l、シアン化ナ
トリウム0.125g/l、pH8.0、50℃に分散
し15分間処理することにより銅を被覆した粉体を得た
。(Example 9) Fine pearl polystyrene 3000SP (average particle size 6 μm) manufactured by Sumitomo Chemical Co., Ltd. was used as the resin powder, and Snowtex ZL (silica colloid, manufactured by Nissan Chemical Co., Ltd.) was used as the inorganic colloid particles.
The silica colloid was diluted 10 times with water and forcefully stirred together with the resin powder to disperse it, and the silica colloid was deposited on the resin. Thereafter, it was filtered with a membrane filter, washed with water, dried, and further treated with a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.) for 2 minutes to fix the silica colloid on the resin powder to obtain a resin powder. Next, a dispersion treatment was carried out for 5 minutes in an aqueous solution of 40 g/l of stannous chloride and 40 ml/l of hydrochloric acid (35%) (sensitization treatment). After filtering and washing with water, palladium chloride (average particle size 5 nm) 0.1 g/l, hydrochloric acid (35%) 1 ml/l
A dispersion treatment was carried out for 5 minutes at room temperature (activation treatment). Thereafter, it was filtered with a membrane filter and thoroughly washed with water. next,
Electroless plating solution: copper sulfate 7g/l, potassium sodium tartrate 75g/l, triethanolamine 10ml/l
, formalin (37%) 25 ml/l, sodium hydroxide 20 g/l, sodium carbonate 10 g/l, sodium cyanide 0.125 g/l, pH 8.0, dispersed at 50°C and treated for 15 minutes to coat copper. A powder was obtained.
【0023】(実施例10)樹脂粉体として住友化学工
業(株)製ファインパールポリスチレン3000SP(
平均粒子径6μm)を用い、無機質粒子として富士デヴ
ィソン(株)製サイロイド150(シリカ、粒子径1.
4μm)を用い、これらをハイブリダイザー((株)奈
良機械製作所製)にて5分間処理することにより樹脂粉
体上にシリカの粒子を付着・固定した粉体を得た。次に
、日本ユニカー(株)製アミノシランカップリング剤1
100を水:メチルアルコール=9:1に0.2vol
/vol%添加し、これに前記粉体を分散させ室温にて
1時間処理することによりアミノシランカップリング剤
をシリカ粒子上に形成した。濾過後、塩化パラジウム1
.0mMの水溶液に分散し室温にて1時間処理し塩化パ
ラジウムを吸着させた。その後濾過し、十分水洗後、無
電解めっき液の硫酸銅7g/l、酒石酸カリウムナトリ
ウム75g/l、トリエタノールアミン10ml/l、
ホルマリン(37%)25ml/l、水酸化ナトリウム
10g/l、シアン化ナトリウム0.125g/l、p
H8.0、52℃に分散し15分間処理することにより
銅で被覆された粉体を得た。(Example 10) Fine Pearl Polystyrene 3000SP (manufactured by Sumitomo Chemical Co., Ltd.) was used as the resin powder.
Thyroid 150 (silica, particle size 1.5 μm) manufactured by Fuji Davison Co., Ltd. was used as the inorganic particle.
4 μm) and treated with a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.) for 5 minutes to obtain powder in which silica particles were adhered and fixed onto resin powder. Next, aminosilane coupling agent 1 manufactured by Nippon Unicar Co., Ltd.
0.2 vol of 100 in water:methyl alcohol = 9:1
The aminosilane coupling agent was formed on the silica particles by dispersing the powder therein and treating it at room temperature for 1 hour. After filtration, palladium chloride 1
.. It was dispersed in a 0 mM aqueous solution and treated at room temperature for 1 hour to adsorb palladium chloride. After that, it was filtered, and after thorough washing with water, electroless plating solution containing copper sulfate 7 g/l, potassium sodium tartrate 75 g/l, triethanolamine 10 ml/l,
Formalin (37%) 25ml/l, sodium hydroxide 10g/l, sodium cyanide 0.125g/l, p
A copper-coated powder was obtained by dispersing at 52° C. and treating for 15 minutes.
【0024】(実施例11)無機質粒子として大明化学
工業(株)製タイミクロンAG(アルミナ、粒子径0.
2μm)を用い、これに日本ユニカー(株)製アミノシ
ランカップリング剤1100を水:メチルアルコール=
9:1に0.2vol/vol%添加し室温にて1時間
分散処理した。濾過後、塩化パラジウム1.0mMの水
溶液に分散し室温にて1時間処理し塩化パラジウムを吸
着させた。その後濾過し、十分水洗後乾燥した。樹脂粉
体として伊藤製油(株)製LANCO−WAX−PP1
362D(ポリプロピレン、平均粒子径12μm)を用
い、前記無機質粒子と共にハイブリダイザー((株)奈
良機械製作所製)にて5分間処理することにより樹脂粉
体上にアルミナの粒子を付着・固定した粉体を得た。そ
の後、無電解めっき液の塩化ニッケル30g/l、次亜
リン酸ナトリウム10g/l、ヒドロキシ酢酸ナトリウ
ム50g/l、pH4.5、60℃に分散し3分間処理
することによりNi−Pで被覆された粉体を得た。(Example 11) Inorganic particles were Taimicron AG (alumina, particle size 0.
2 μm), and added aminosilane coupling agent 1100 (manufactured by Nippon Unicar Co., Ltd.) to it in a mixture of water: methyl alcohol.
0.2 vol/vol% was added to 9:1 and dispersed for 1 hour at room temperature. After filtration, it was dispersed in an aqueous solution of 1.0 mM palladium chloride and treated at room temperature for 1 hour to adsorb palladium chloride. Thereafter, it was filtered, thoroughly washed with water, and then dried. LANCO-WAX-PP1 manufactured by Ito Oil Co., Ltd. as resin powder
362D (polypropylene, average particle size 12 μm) is used, and alumina particles are attached and fixed on the resin powder by treating it with the inorganic particles for 5 minutes in a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.). I got it. After that, Ni-P was coated by dispersing it in an electroless plating solution of 30 g/l of nickel chloride, 10 g/l of sodium hypophosphite, and 50 g/l of sodium hydroxyacetate, pH 4.5, at 60°C and treating for 3 minutes. A powder was obtained.
【0025】(実施例12)無機質粒子として大明化学
工業(株)製タイミクロンAG(アルミナ、粒子径0.
2μm)を用い、これに日本ユニカー(株)製アミノシ
ランカップリング剤1100を水:メチルアルコール=
9:1に0.2vol/vol%添加し室温にて1時間
分散処理した。濾過後、塩化パラジウム1.0mMの水
溶液に分散し室温にて1時間処理し塩化パラジウムを吸
着させた。その後濾過し、十分水洗後乾燥した。樹脂粉
体として住友化学工業(株)製ファインパールポリスチ
レン3000SP(平均粒子径6μm)を用い、前記無
機質粒子と共にハイブリダイザー((株)奈良機械製作
所製)にて5分間処理することにより樹脂粉体上にアル
ミナの粒子を付着・固定した粉体を得た。その後、塩化
パラジウム1.0mMの水溶液に分散し室温にて1時間
処理し塩化パラジウムを吸着させた。その後濾過し、十
分水洗した。次に無電解めっき液の塩化ニッケル30g
/l、次亜リン酸ナトリウム10g/l、ヒドロキシ酢
酸ナトリウム50g/l、pH4.5、60℃に分散し
10分間処理することによりNi−Pで被覆された粉体
を得た。(Example 12) As inorganic particles, Taimicron AG (alumina, particle size 0.
2 μm), and added aminosilane coupling agent 1100 (manufactured by Nippon Unicar Co., Ltd.) to it in a mixture of water: methyl alcohol.
0.2 vol/vol% was added to 9:1 and dispersed for 1 hour at room temperature. After filtration, it was dispersed in an aqueous solution of 1.0 mM palladium chloride and treated at room temperature for 1 hour to adsorb palladium chloride. Thereafter, it was filtered, thoroughly washed with water, and then dried. Using Fine Pearl Polystyrene 3000SP (average particle size 6 μm) manufactured by Sumitomo Chemical Co., Ltd. as the resin powder, the resin powder was obtained by processing it together with the inorganic particles for 5 minutes in a hybridizer (manufactured by Nara Kikai Seisakusho Co., Ltd.). A powder with alumina particles attached and fixed thereon was obtained. Thereafter, it was dispersed in an aqueous solution of 1.0 mM palladium chloride and treated at room temperature for 1 hour to adsorb palladium chloride. Thereafter, it was filtered and thoroughly washed with water. Next, 30g of nickel chloride of electroless plating solution
/l, sodium hypophosphite 10g/l, sodium hydroxyacetate 50g/l, pH 4.5, dispersed at 60°C and treated for 10 minutes to obtain a powder coated with Ni-P.
【0026】以上、本発明について、その概略を述べた
が、本発明は、前記説明に限定されるものではない。例
えば、その使用目的に応じ樹脂粉体上に形成した無機質
粒子と金属又は合金層との間に他の層を介在させたり、
その利用分野においても、本発明の金属被覆粉体を、例
えば、圧延して片状、フィルム状、シート状物となすこ
とによって、その使用用途を拡大したり、更には、金属
被覆粉体を化学的に発色させることにより、新たな着色
剤とする等である。Although an outline of the present invention has been described above, the present invention is not limited to the above description. For example, depending on the purpose of use, another layer may be interposed between the inorganic particles formed on the resin powder and the metal or alloy layer, or
In the field of application, the metal-coated powder of the present invention can be rolled into flakes, films, or sheets to expand its uses, and furthermore, the metal-coated powder of the present invention can be rolled into flakes, films, or sheets. By chemically developing color, it can be used as a new coloring agent.
【0027】[0027]
【発明の効果】以上の実施例1〜12で得られた金属被
覆粉体について、金属の被覆性を確認したところ、完全
に被覆されていることが確認できた。又、工程中におけ
るめっき液の安定性についてみたところ、全て安定であ
った。Effects of the Invention When the metal coating powders obtained in Examples 1 to 12 were checked for metal coverage, it was confirmed that they were completely coated. Furthermore, when we looked at the stability of the plating solutions during the process, they were all stable.
【図1】本発明の金属被覆粉体の一実施例を模式的に示
した図である。FIG. 1 is a diagram schematically showing an example of the metal-coated powder of the present invention.
【図2】本発明の金属被覆粉体の他の実施例を模式的に
示した図である。FIG. 2 is a diagram schematically showing another example of the metal-coated powder of the present invention.
1 樹脂粉体 2 無機質粒子 3 金属又は合金層 1 Resin powder 2 Inorganic particles 3 Metal or alloy layer
Claims (6)
し、無機質粒子の外方に金属又は合金層を形成した金属
被覆粉体。1. A metal-coated powder in which inorganic particles are adhered and fixed onto resin powder, and a metal or alloy layer is formed on the outside of the inorganic particles.
し、無機質粒子を増感処理した後活性化処理を施すか、
増感処理と活性化処理とを同時に施し、その後無電解め
っき法により金属又は合金層を形成した金属被覆粉体の
製造方法。[Claim 2] Inorganic particles are attached and fixed onto the resin powder, and the inorganic particles are sensitized and then activated, or
A method for producing a metal-coated powder in which a sensitization treatment and an activation treatment are performed simultaneously, and then a metal or alloy layer is formed by electroless plating.
処理を施した無機質粒子を付着・固定した後、無電解め
っき法により金属又は合金層を形成した金属被覆粉体の
製造方法。[Claim 3] A method for producing metal-coated powder, in which inorganic particles that have been previously sensitized and activated are adhered and fixed onto resin powder, and then a metal or alloy layer is formed by electroless plating. .
し、無機質粒子をシラン系カップリング剤で処理した後
、無機質粒子に無電解めっきの触媒核を吸着せしめ、更
に無電解めっきを施し金属又は合金層を形成した金属被
覆粉体の製造方法。[Claim 4] After adhering and fixing inorganic particles onto resin powder and treating the inorganic particles with a silane coupling agent, catalyst nuclei for electroless plating are adsorbed onto the inorganic particles, and further electroless plating is performed. A method for producing metal-coated powder with a metal or alloy layer formed thereon.
ング剤で処理した後無電解めっきの触媒核を吸着せしめ
た無機質粒子を付着・固定し、次いで無電解めっきを施
し金属又は合金層を形成した金属被覆粉体の製造方法。5. On the resin powder, inorganic particles that have been treated with a silane coupling agent and adsorbed with catalyst nuclei for electroless plating are attached and fixed, and then electroless plating is performed to form a metal or alloy layer. A method for producing the formed metal-coated powder.
ング剤で処理した無機質粒子を付着・固定した後無電解
めっきの触媒核を吸着せしめ、次いで無電解めっきを施
し金属又は合金層を形成した金属被覆粉体の製造方法。6. After adhering and fixing inorganic particles previously treated with a silane coupling agent onto the resin powder, adsorbing catalyst nuclei for electroless plating, and then performing electroless plating to form a metal or alloy layer. A method for producing metal-coated powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3122188A JPH04228503A (en) | 1990-04-27 | 1991-04-24 | Metal-coated powder and its production |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11235190 | 1990-04-27 | ||
JP2-112351 | 1990-04-27 | ||
JP2-196674 | 1990-07-25 | ||
JP19667490 | 1990-07-25 | ||
JP33276390 | 1990-11-28 | ||
JP2-332763 | 1990-11-28 | ||
JP3122188A JPH04228503A (en) | 1990-04-27 | 1991-04-24 | Metal-coated powder and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04228503A true JPH04228503A (en) | 1992-08-18 |
Family
ID=27469988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3122188A Pending JPH04228503A (en) | 1990-04-27 | 1991-04-24 | Metal-coated powder and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04228503A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005013983A (en) * | 2003-06-24 | 2005-01-20 | Rohm & Haas Electronic Materials Llc | Catalyst composition and deposition method |
WO2009048998A1 (en) * | 2007-10-10 | 2009-04-16 | Ppg Industries Ohio, Inc. | Powder coating compositions, methods for their preparation and related coated substrates |
JP2011140677A (en) * | 2010-01-05 | 2011-07-21 | Fujikura Rubber Ltd | Method for fixing metal on surface of silicone rubber |
-
1991
- 1991-04-24 JP JP3122188A patent/JPH04228503A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005013983A (en) * | 2003-06-24 | 2005-01-20 | Rohm & Haas Electronic Materials Llc | Catalyst composition and deposition method |
WO2009048998A1 (en) * | 2007-10-10 | 2009-04-16 | Ppg Industries Ohio, Inc. | Powder coating compositions, methods for their preparation and related coated substrates |
JP2011140677A (en) * | 2010-01-05 | 2011-07-21 | Fujikura Rubber Ltd | Method for fixing metal on surface of silicone rubber |
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