JPH0222499A - Plating equipment - Google Patents

Abstract

PURPOSE:To develop a plating equipment which is compact and high in productivity by arranging a plurality of treatment tanks used for plating treatment in an arc shape and also vertically moving the carrier mechanism of a material to be plated while turning this carrier mechanism by keeping the center of the above-mentioned arc as a rotary center. CONSTITUTION:Total nine tanks consisting of an electrolytic degreasing tank 21 of a material 4 to be plated which is necessary for plating treatment, two water washing tanks 22, a pickling tank 23, two water washing tanks 22, a plating tank 24 and two water washing tanks 22 are clockwise arranged in an arc shape. These nine treatment tanks are arranged in respective blocks obtained by equally dividing a circle into twelve. A carrier mechanism 26 for holding and carrying the material 4 to be plated, a feeding mechanism 28 for feeding the material to be plated to this carrier mechanism 26 and a detaching mechanism 29 for detaching the plated material 4 finished in plating treatment from the carrier mechanism 26 are arranged in the residual three blocks in the arc shape. Since all stages of plating are performed while transferring the material 4 to be plated on the same circumference to the final detaching mechanism 29 from the feeding mechanism 28, the equipment is made compact and plating is performed at excellent productivity.

Description

Detailed Description of the Invention "Industrial Application Field" The present invention relates to a plating apparatus particularly suitable for high-speed plating, in which a plurality of processing tanks used for plating are arranged in an arc shape, and the objects to be plated are transported. The plating apparatus can be made more compact by configuring the conveying mechanism to rotate around the center of the circular arc and to move up and down.

``Conventional technology'' A high-speed method that performs plating at high speed by applying relative motion between the plating solution and the object to be plated, destroying the ion diffusion layer on the surface of the object to be plated, and passing a large current at low voltage. A plating method has been proposed.

FIG. 20 shows a conventional plating apparatus that carries out such a high-speed plating method. Reference numeral 1 in FIG. 20 indicates a plating chamber unit. A plating chamber unit 2 and a post-processing chamber unit 3 are provided before and after the plating chamber unit I. These it1 processing chamber unit 2, plating chamber unit 1, and post-processing chamber unit 3 are arranged in a straight line in sequence. Part 1. As shown in FIG. 21, the plated object 4 is iF! The material is inputted from the input port 5 of the processing chamber 1, and is sequentially transferred within each processing tank 7 by a transfer mechanism constituted by a transfer device 6 . Then, the plated material 4 is sent to the megging chamber 1ζ4, and as shown in FIG. Inside the bathroom+i? , two accommodated. By energizing the T1 pole 12 (provided on the inner circumference of the plating bath 11) and the holder 9 or 10+, and flowing the plating solution at high speed into the plating bath 11 as shown by arrow a in the figure, The plating object 4 is plated. Then, the plated object 4 that has been plated in this way is placed in the post-processing chamber unit 3.
The post-processing chamber unit 3 is transported by the conveyor device 6...
After being sequentially transferred to each treatment tank 8 and subjected to post-treatment,
It is taken out from the discharge 013.

[Problems to be Solved by the Invention-j According to this plating apparatus, high-speed plating processing can be performed in synchronization with the pitch time of the production processing line, so there is an advantage that it can be installed within the production processing line.

By the way, the equipment installed in the production processing line is more
A compact layer and improved productivity are required.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a plating apparatus that is more compact and has high productivity.

] - Means for Solving the Problems In the plating apparatus of the present invention, a plurality of processing tanks are arranged in an arc shape, and a transport mechanism for transporting the object to be plated is rotated about the center of the arc. -L7 configured to move downward
The above object was achieved by further providing a supply mechanism for supplying the plated object and a removal mechanism for taking out the plated object from the conveyance mechanism.

If the cross section of the treatment tank is trapezoidal, the treatment tank can be arranged with the least waste.

Further, it is desirable that a processing agent supply device be connected to each of these processing tanks to supply the processing agent.

Furthermore, the circuit that supplies electricity to the object to be plated during plating is 61
1. Through the transport mechanism 1. It is desirable that the

[-Function] In the plating apparatus having such a structure, first, the object to be plated sent from the supply mechanism is held by the conveyance mechanism.

The transport mechanism moves downward while holding the object to be plated, and immerses the object in the first processing tank. When the processing of the plated object in the first processing tank is completed, the conveyance mechanism moves -1 to pull the plated object out of the first processing tank. After this, the transport mechanism rotates by a predetermined angle. Then, the object to be plated is moved to the second processing tank. The transport mechanism then moves downward to immerse the object to be plated into the second treatment tank. When the processing in the second processing tank is completed, the transport mechanism moves upward again to pull up the object to be plated from the second processing tank.

While repeating the above operations, the plating object is transported by the transport mechanism, and when the processing in each processing tank arranged in an arc is completed, the plating object is taken out from the transport mechanism by the removal mechanism, and the plating process is completed. r.

I-1 Example 1 (Example 1) An embodiment of the plating apparatus of the present invention will be described below.

FIG. 1 is a plan view showing this plating apparatus.

This plating equipment has 9 required for plating.
Processing tanks of the stand, namely electrolytic degreasing tank 2+, washing tank 22...
・The pickling 11F 23 and the plating tank 24, the transport mechanism 26 that holds (7) and transports the plating object 4, and the transport mechanism 2
a supply mechanism 28 that supplies the object 4 to be plated to 6; and a removal mechanism 12 that takes out the plated object 4 that has been plated from the conveyance mechanism.
It is roughly configured by a mechanism 29.

This plating equipment has nine processing tanks 21, 22...,
23 and 24 are electrolytic degreasing tank 21, washing tanks 22, 22, pickling tank 23, washing tanks 22, 22, plating tank 24, washing 122
．． They are arranged clockwise in the order of 22 in an arc shape. These processing tanks 21, 2223, and 24 have a trapezoidal horizontal cross section so as to fit into each block obtained by dividing an arc into 12 equal parts, and are arranged so that the hypotenuses of the trapezoid are in contact with each other.

1-2, among the blocks obtained by dividing the arc into 12 equal parts, nine consecutive blocks are filled with the processing tanks 21, 22...,
23 and 24 are arranged in the above order, and the remaining three blocks are provided with a supply mechanism 28 and a removal 1° mechanism 29, which will be described later. Also, these tanks 2I22..., 23.2
4 is installed on a support stand 26'2, as shown in FIG.

The electrolytic degreasing tank 21 is a processing tank that performs electrolytic degreasing treatment as a pretreatment on the plated material 4, and as shown in FIGS. It is roughly structured by. The outer box: U0 is formed in the shape of a hollow rectangular parallelepiped with a substantially trapezoidal horizontal cross section. The cover plate 33 of this outer box 30 has an insertion opening 34 for inserting the object to be plated 4.
is drilled. Also, on the bottom plate 35 of this outer box 30,
A drainage rl 36 is drilled. This drain port 36 is
It is connected to a degreasing liquid storage tank 37, which will be described later, via a recovery pipe. Furthermore, the vibrator 31 is provided on the bottom plate 35 of the outer box 30.
are set up. The vibrator 31 is arranged such that its hollow portion is located directly below the insertion opening 34 of the outer box 30. The upper end of this vibrator 31 and the top plate 33 of the outer box 30 are spaced apart from each other. The electrode 32 is accommodated in the J2 portion of the hollow portion of the vibrator 31. This '113
2 is made of stainless steel. Further, a connecting portion 38 is provided at the lower part of the vibrator 31 for connecting a processing liquid supply pipe from a degreasing liquid storage liquid $IF57, which will be described later.

The water washing 122 is a tank that performs water washing as a pre-treatment or a post-treatment. Further, the pickling tank 23 is a tank that performs pickling as a pretreatment. These 11722.2
3 has the same structure, and is constructed as shown in FIGS. 6, 7, and 8.

(The structure of these washing tank 22 and pickling tank 23 is
Since it has a similar structure to the degreasing tank 21, the same components are given the same reference numerals to simplify the explanation.)

This washing tank 22 (pickling tank 23) includes an outer box 30 and a vibrator 4.
0. The vibrator 40 has a hollow part formed with a large diameter, and an escape hole 4 in the lower peripheral wall.
1.41 is drilled.

Further, a connecting portion 38 is connected to the lower end of the vibrator 40. In the case of the flush tank 22, this connection 38 is connected to a water pipe. Further, the drain port 36 of the outer box 30 is connected to a drainage channel. On the other hand, in the case of the pickling tank 23, a processing liquid supply pipe from a pickling chemical storage tank 43, which will be described later, is connected to the connection part 38, and a recovery pipe from the pickling chemical storage tank 43 is connected to the drain port 36 of the outer box 30. Connected.

+iii The plating tank 24 contains the pretreated object 4 to be plated.
This is a processing tank that performs electrolytic plating. This plating W! 24
has the structure shown in FIG. 9, FIG. 1O, and FIG. 11. (The structure of this plating tank 24 is similar to that of the electrolytic degreasing tank 21, so the same components are given the same reference numerals to simplify the explanation.)

The plating tank 24 is roughly composed of an outer box 30, a plating bath section 45, a -L section electrode 46, and a lower electrode 47.

The plating bath section 45 is formed from a lower pipe member 49 and a lower pipe member 50. These vibe members 49.5
0 are arranged upright on the bottom plate 35 of the outer box 30 in a continuous state. An upper electrode 46 is fitted into the inner periphery of the upper tape member 49. Further, a lower electrode 47 is fitted into the upper inner periphery of the lower pipe member 50 at a slight distance from the upper electrode 46 . The space surrounded by the electrodes 46 and 47 is a plating bath 51. These electrodes 46 and 47 are made of titanium cylinders, and their surfaces are plated with platinum, which has low electrical resistance, to prevent corrosion from the plating solution and to improve current conduction. The inner diameters of these electrodes 46 and 47 are set so that the gap between them and the object to be plated 4 inserted into the plating bath 51 is 5.0 mm or less. This gap is 5. If it exceeds O1, there is a disadvantage that the flow rate of the plating solution decreases and the plating speed decreases. These electrodes 46,47 are connected to the anode of the power source via leads 52,53, respectively.

A connecting part 38 is connected to the lower part of the lower pipe member 50, and this connecting part 38 has a plating liquid storage F, which will be described later.
A processing liquid supply pipe from f155 is connected. Further, drain ports 36 and 36 provided in the bottom plate 35 are connected to the plating liquid storage 55 via a recovery pipe.

As shown in FIGS. 1 and 2, the transport mechanism 26 includes a drive device 60, a rotary plate 61, a holding unit 62, and so on.
It is roughly composed of:

The drive device 60 of the transport mechanism 26 rotates the rotary plate 61 by a predetermined angle (30 degrees in this example) and moves it up and down, and drives the processing tanks 21, 22, 23, 24.
The driving fIII 63 is located at the center of the circular arc in which the driving fIII 63 is located.

Further, the rotary disk 61 supports the holding unit 62 and is attached to a drive shaft 63 of the drive device 60. Moreover, this rotary plate 61 is connected to the processing tanks 21, 22, . . . ,
23.24” located in Niga.

The holding units 62 are for holding the plated object 4, and twelve holding units 62 are provided at 30 degree intervals on the outer circumferential side of the rotary plate 6I. Further, the distance from the center of rotation of these holding units 62... is such that the circle formed by connecting these two holding units 62...
It is set to coincide with the circular arc connecting the insertion ports 34 . . .

As shown in FIG. 12, this holding unit 62 includes a brass collet 65 that is tightly inserted into one end of the object to be plated 4, a brass connecting rod 66 to which this collet 65 is screwed, and a brass collet 65 that is tightly inserted into one end of the object to be plated. A brass shaft 67 to which the connecting rod 66 is attached, a brass power receiving block 68 provided at the upper end of the shaft 67, and a resin-made power receiving block 68 that covers the lower end of the connecting rod 66 to prevent it from being plated. and a cover 69. The lower end of the shaft portion 67 is formed into a burr shape, and the processing tanks 21, 22, 23, 23, 22, 22, 22, 22, 22, 22, 23, 22, 23, 23, 23, 23, 23, 23, 23, 23 3 3 c , 23 , 23 , 23, 23 .
It is a seal placement part 70 that closes the insertion opening 34 of 24. This holding unit 62 is attached to the rotary disk 61 via a resin insulating cylinder 7I attached to a shaft portion 67 so as to be slidable up and down. Also, this holding unit 62
The seal lid portion 70 and the insulating cylinder 7! is urged downward by a spring 73 disposed between the flange and the flange.

The supply mechanism 28 supplies the plated object 4 to the conveyance mechanism 26.
As shown in FIG. 1, it is arranged near the electrolytic degreasing tank 21. Further, the removal mechanism 29 described in 11j is used to remove the plated object 4 from the conveyance mechanism 26, and removes the plated object 4 from the transfer mechanism 26.
1.22..., 23.24 are provided near the washing tank 22 at the end.

These supply mechanism 28 and removal mechanism 29, as shown in FIGS. 13, 14, and 15, include a rotation unit 80 that rotates in the horizontal direction, and a lifting unit 8I mounted on this rotation unit 80. This lifting unit 8I
The advancing/retracting unit 82 provided in the
2 and a clamp arm 83 for gripping the object 4 to be plated.

In Yota's plating apparatus, as shown in FIG. 1, a conveyor 85 is arranged on the side of the supply mechanism 28.

- An upright setting device 86 is provided at the end of the support conveyor 85 near the supply mechanism 28 for uprighting the plated object 4 sent from the conveyor 85.

On the other hand, on the side of the removal mechanism 29, a collection box 88 is arranged to accommodate the plated object 4 that has been subjected to the plating process.

As shown in FIG. 1, power supply units 90 and 90 are provided in the electrolytic deselecting tank 21 and the plating tank 24. As shown in FIG. As shown in FIG. 2, this power supply unit 90 is roughly composed of an air cylinder 91 that can move up and down by 4 degrees, and a copper power supply block 93 that is attached to a piston rod 92 of this air cylinder 91 via an insulating material. has been done. The power supply block 93 is electrically connected to a power source (not shown).

As shown in Fig. 1, the nine processing tanks 21, 22...
A water pipe and a drainage channel are connected to the washing tank 22 of 23 and 24. Further, a processing agent supply device consisting of a degreasing liquid storage tank 37 and a pump 97 is connected to the electrolytic descaling tank 2I. This degreasing liquid storage tank 37 is made of W4m reinforced plastic (FRP) and has a capacity of 20 ρ, and contains a processing agent necessary for electrolytic degreasing. Also, this degreasing liquid storage tank 3
7 is equipped with an electric heater and a thermometer, and the processing agent contained therein is maintained at approximately 55±5°C.

Further, a processing agent supply device consisting of a pickling chemical storage tIF43 and a pump 98 is connected to the pickling tank 23. The pickling chemical storage tank 43 is a tank made of FRP and has a capacity of 20Q, and contains a processing agent used for pickling. Further, an electric heater and a thermometer are attached to this pickling chemical storage tank 43, and the processing agent contained therein is maintained at about 55±5°C.

A processing agent supply device consisting of a plating liquid storage tank 55 and a pump 99 is connected to the Aij mesoki tank 24 . The plating liquid storage tank 55 is made of FRP and has a capacity of 40a, and contains a processing agent used for plating. Further, a boiler and a thermometer are attached to this plating liquid storage tank 55, and the contained plating liquid is maintained at about 80±5°C. In addition, this plating storage tank 55 has first, second, and third chemical solution management II01.102. +03 is connected. The first chemical management tank 101 contains nickel sulfate (N iS O
), nickel chloride (NiC(L) and boric acid (HsB)
A mixed liquid of O3) is stored. Second chemical management tank 10
2 contains nickel carbonate (NiCO3) used for pH8 adjustment.
is accommodated. A brightener is stored in the third chemical management tank 103. And these first to third chemical solution management! 101, 102. The chemical solution stored in the plating solution storage 155 is measured by an integrating ammeter and a P H meter provided in the plating solution storage 155.
When it is detected by a level meter or the like that the composition or amount of the plating solution in the plating solution storage tank 55 deviates from predetermined control values, the plating solution is injected into the plating solution storage tank 55 as necessary.

Surface degreasing liquid storage 137, pickling chemical liquid storage 143, plating liquid storage t*55, and first to third chemical liquid management tanks 101°102.
103 is arranged so as to surround the base 105 of this plating apparatus, as shown in FIGS. 1 and 2.

Next, the operation of this plating apparatus will be explained using an example in which a substantially cylindrical object 4 to be plated is plated.

As shown in FIG. 1, the object to be plated 4 sent from the previous process of the production processing line is placed on a conveyor 85. The plated objects 4 conveyed by the conveyor 85 are transferred to an upright setter 86 installed at the curved end of the conveyor 85.
erected by.

The erected plated object 4 is gripped by the clamp arm 83 of the supply mechanism 28. The supply mechanism 28 that has gripped the object 4 to be plated rotates as shown by the dotted chain line 4 in FIG. move. After that, when the clamp arm 83 of the supply mechanism 28 is raised, as shown in FIG. is retained. The conveyance mechanism 26 with the object to be plated 1 first rotates 30 degrees and then descends to move the object 1 to be plated as shown in FIG. : Insert the object 4 to be plated into the electrolytic degreasing tank 21. At this time, the object to be plated 4 is the outer box 3.
0 into the pipe 31 through the insertion port 34. The insertion opening 34 of the outer box 30 is connected to the seal M of the holding unit 62.
It is closed by section 70.

Electrolytic degreasing 1'l' with object 4 inserted in this way
! Degreasing liquid is supplied to 21 from an electrolytic degreasing liquid storage $w37. The supplied degreasing liquid is passed through the pipe 31 of the electrolytic degreasing tank 21.
The liquid rises inside in a jet state, then flows down into the outer box 30 from the upper end opening of the pipe 31, and is returned to the electrolytic degreasing liquid storage WI37 through the drain port 36.

After supplying the degreasing liquid to the electrolytic degreasing tank 21 in this manner, electricity is applied to the electrode 32 of the electrolytic degreaser 1121 and the object to be plated 4. The object to be plated 4 is energized via the holding unit 62 of the transport mechanism 26 . In other words, as shown in FIG.
The power feeding block 93 is lowered and comes into contact with the power receiving block 68 of the holding unit 62 as shown in FIG. Then, since the holding unit 62 is made of brass, the plated object 4 can be energized.

After the electrolytic degreasing treatment of the plated object 4 is completed as described above, the rotary plate 61 of the transport mechanism 26 is moved -L. Then, the plated material 4 is pulled out of the electrolytic degreasing tank 21. Next, rotate the rotary plate 61 of the transport mechanism 26 by 30 degrees. Then, the object to be plated 4 that is being held is moved onto a washing tank 22 adjacent to the electrolytic desaturation tank 21. After that, the rotary plate 61 of the transport mechanism 26 is moved down again. Then, as shown in FIG. 6, the object 4 to be plated is inserted into the vibrator 40 of the washing tank 22. is inserted,
Washing water is supplied to the vibrator 40 of the washing tank 22 from a water pipe in a jet state. The supplied cleaning water flows down from the upper end of the vibrator 40 into the outer box 30. Drainage L13
6 is discharged into the drain.

When the washing process is completed, the supply of washing water to the vibrator 40 in the washing tank 22 is stopped. Then, the water in the pipe 40 flows out from the relief hole 41 formed in the F section of the vibrator 40, the water level in the pipe 40 is lowered, and the plating material 4 is drained.

The object to be plated 1 thus drained is transferred to the washing tank by moving the rotary plate 61 of the transport mechanism 26 upward.
drawn from 2. After this, the rotary plate 6 of the conveyor tank 26
By rotating the plate 1 by 30 degrees again and then moving it downward, the object 4 to be plated is sent to a second washing tank 22 adjacent to the washing tank 22, where it is subjected to a more complete washing process. .

When the treatment in the second washing tank 22 is completed, the plated material 4 is sent to the adjacent pickling 123 by the transport mechanism 26.

In the pickling tank 23, a pickling process is performed using a processing agent supplied to the vibrator 40 from a pickling chemical storage tank 43.

This step is performed in the same manner as the washing process in the surface washing tank 22, so the explanation will be omitted.

When the treatment in the pickling tank 23 is completed, the object 4 to be plated is sequentially sent to the adjacent third washing tank 22 and fourth washing tank 22 by the transport mechanism 26.

The object 4 to be plated which has been washed with water in the fourth washing tank 22 is moved up, turned 30 degrees, and moved down by the rotary plate 6I of the conveying device 26, as shown in FIG. It is accommodated in the plating bath 5I of the plating tank 24. When the plating object 4 is accommodated in the plating bath 51, the insertion opening 34 of the outer box 3o is closed by the seal lid part 70 of the shaft part 67 of the holding unit 62.

Next, the plating bath 51 of the plating lff 24 into which the plating object 4 has been inserted is supplied with plating liquid from the plating liquid storage tank 55 in a jet state. The supplied plating solution overflows from the upper part of the plating bath section 45 and reaches the outer box 3.
Then, the plating liquid is returned to the plating liquid storage tank 55 through the drain port 36. The plating liquid injected into the plating end 211 is
It is desirable that it be heated to a predetermined temperature (70° C. or higher).

After supplying the plating solution to the plating tank 24 in this way,
After a second delay, as in the case of the electrolytic degreasing tank 21, as shown in FIG. Electricity is applied to the plated object 4. At this time, both the upper electrode 46 and the lower electrode 47 of the plating tank 24 are energized, but whether only the upper electrode 46 is energized is determined depending on the length of the object 4 to be plated. In other words, when the object 4 to be plated is short, only the upper electrode 46 is energized, and the object 1 to be plated is energized.
1 is long and reaches below the upper electrode 46, the lower electrode 47 is also energized.

When the plating process is completed in this way, the power supply block 93 of the power supply unit 90 is raised for a moment, and then the rotary plate 61 of the transport mechanism 26 is raised to pull the plated object 4 out of the plating tank 24. Geru.

After the object 4 to be plated is pulled up, the rotating plate 61 of the transport mechanism 26 is rotated 30 degrees again and then moved down, so that the object 4 to be plated is transferred to the fifth washing tank 22 adjacent to the plating tank 24. It is sent and washed with water, and then sent to the sixth washing tank 22 and washed with water again to complete the plating process.

The plated object 4 pulled up from the sixth washing tank 22 is
The rotary plate 61 of the transport mechanism 26 is rotated by 30 degrees to move to the removal position.

At the removal position, the object to be plated 4 is gripped by the clamp arm 83 of the removal mechanism 29.

Then, as shown in FIG. 16, when the clamp arm 83 is moved down by the lifting unit 81, the object to be plated 4 is removed from the collet 65 of the holding unit 62. The removed plated object 4 is stored in a collection box 88.

In the above description, the processing performed on the object to be plated 4 held in one holding unit 62 will be explained in order. However, in this plating apparatus, the objects to be plated 1j are sequentially attached to each holding unit 62, and a large number of objects to be plated 4 are processed at the same time.

In this plating equipment, a plurality of processing tanks 21, 22,
..., 23, 24 are arranged in an arc shape, a large number of tanks can be arranged in a narrow space, and the apparatus can be made compact. Especially with this plating equipment,
Since the processing tanks 21, 22..., 23.24 are formed almost trapezoidally, the processing tanks 21, 22..., 23.2
4 could be arranged without waste, and a significant downsizing could be achieved.

Further, in this plating apparatus, the rotary plate 61 of the transport mechanism 26 is configured to rotate around the center of the circular arc and move up and down, so that the plurality of processing tanks 2+, 22, . . .・, 23, 24, etc. Since it was decided to transport the plated products 4 sequentially, the processing tanks 21, 22, . . .
, 23 and 24, the transport mechanism 26 can be housed, thereby making it possible to make the apparatus more compact as shown in FIG.

The plating apparatus of the soil octopus includes a conveying mechanism 26 for transporting the object 4 to be plated.
A supply mechanism 28 for supplying the plated material 4 to the conveyor mechanism 26 and a removal mechanism 29 for taking out the plated material 4 that has been plated from the transport mechanism 26 are provided. Be able to do that.

In addition, in this plating apparatus, each processing tank 21°, 23.
Since a processing agent supply device consisting of storage tanks 37, 43.55, etc. is connected to 24 to supply processing agents as necessary, processing tanks 2+ and 23.24 can be made more compact.

In addition, in this plating apparatus, the pipe 31 of the electrolytic degreasing tank 21
, the vibrator 40 of the pickling tank 23, the vibrator member 49.50 of the plating l1iv24, and each storage tank 37, 43.55 are connected, and the storage tank 37, 43.55 is connected to each pipe member 31, 40°49.50. Since the object to be plated 4 is processed while the processing agent is supplied from L'7C and overflowed from the processing agent 55, each treatment can be performed with a small amount of processing agent. Therefore, in this plating apparatus, the storage tanks 37, 43, and 55 can be made smaller, and a significant reduction in size can be achieved. In addition, it was possible to significantly reduce the amount of processing chemicals required (9), thereby reducing plating processing costs.

Furthermore, in this plating apparatus, since the object 4 to be plated is energized via the holding unit 62 of the transport mechanism 26 during plating processing, there is an advantage that the energizing circuit has a simple structure.

In addition, in this plating apparatus, an escape hole 41 is provided at the bottom of the vibrator 40 that constitutes the washing tank 22 (pickling tank 23), so if the supply of treated water to the vibrator 40 is stopped, the pipe 40 The treated water inside flows out from the escape hole 4 of the vibrator 40, and the water level inside the vibrator 40 immediately drops.

Therefore, in this plating apparatus, the water washing process (pickling process) can be completed and water can be drained without raising the object 4 to be plated. Therefore, can water be drained more completely by stopping the supply of treated water early? ), it is possible to reduce the amount of processing liquid taken out. Furthermore, the time for water washing (pickling) can be shortened without affecting the plating time, making it easier to control the operation of the apparatus.

Furthermore, in this plating apparatus, the upper electrode 4 is placed in the plating tank 24.
6 and the lower electrode 47 are provided, so that the range of energization can be changed depending on the length of the object 4 to be plated. Therefore, this plating apparatus has the flexibility to process objects 4 of different lengths.

Furthermore, in this plating apparatus, one end of the object 4 to be plated is fitted into the collet 65 of the holding unit 62 to hold the object 4, so that the entire outer peripheral surface of the object 4 to be plated is also brought into contact with the plating solution. can be done. Therefore,
According to this plating apparatus, the entire outer surface of the object 4 to be plated can be plated.

In addition, in the plating apparatus of this example, after the supply of the plating solution to the plating bath 5I of the plating tank 24 is started, the power supply unit 90 is lowered with a slight delay to energize the plating object 4, so that the flow state of the plating solution is Once stable, plating can be started. Therefore, this plating apparatus can perform good plating.

(Embodiment 2) FIGS. 17 to 19 show other examples of the plating device 124 installed in the plating apparatus of the present invention.

This plating bath 24 differs from the apparatus used in the first embodiment in the structure of the plating bath section 45. This plating f! 24
The plating bath section 45 is composed of a foreign body 1150, a mesh tube electrode 15+, and a large number of metal particles 152...
The inside of the mesh tube electrode 151 is a plating bath 5I.

The outer container +50 has a cylindrical shape with a large inner diameter and is made of titanium. The mesh cylinder electrode 151 has a cylindrical shape and is made of a titanium mesh. This mesh tube electrode 151 is arranged so that its central axis overlaps the extension of the central axis of the lower pipe member 50.
j 150. The metal particles 15 are located between the mesh tube electrode 151 and the outer container 150.
2... is filled. This metal particle 152 has
Those made of plated metal are used.

For example, when applying nickel plating to the plated object 4,
Metal particles +52 made of pure nickel are used. This metal particle 152... has a diameter of 5 mm-1
A material of about 0 nus is preferably used. The mesh tube electrode 151 and the metal particles 152 constitute an anode during plating work.

This plating I! A mask plate I54 is arranged at the bottom of the plating bath 51 No. 24 so as to cover the lower end of the mesh tube electrode 151. This mask plate 154 is used when the object 4 to be plated is short, and is removed when the object 4 to be plated is long.

Next, the function of this plating bath 24 will be explained.

First, in the plating tank 24, when the object to be plated 4 held by the holding unit 62 of the transport mechanism 26 is accommodated in the plating bath 51 of the plating tank 24, a plating solution is supplied from the plating solution storage tank 55.

Then, the plating solution flows between the metal particles 152. In this state, when electricity is applied to the mesh tube electrode +51, metal particles 15
2... itself becomes an anode.

Next, when the power supply block "93" of the power supply unit 90 connected to the cathode of the power source is lowered and electricity is applied to the plated object 4 via the holding unit 62, the metal particles +52 constituting the anode become metal ions. It melts, passes through the mesh cylinder electrode 151, reaches the object to be plated 71, and is plated on the surface of the object to be plated 4.

In the plating bath 24 of this example, the outer periphery of the mesh tube type TFI 151 is filled with metal particles +52, so that damage to the anode, which needs to be provided close to the plating object 4, can be prevented. In the plating tank 2 and 1 of Zunaicchiko's example,
Even if the object 4 to be plated shifts and hits the mesh cylinder electrode +51 during insertion, the metal particles 152... will float and touch the mesh cylinder electrode 15+.
absorbs the deformation of As a result, damage to the anode consisting of the mesh tube electrode 151 and the metal particles +52 . . . is prevented. Therefore, according to this plating bath 24, it is possible to stabilize the plating quality, reduce troubles and require less maintenance, and ultimately reduce plating costs.

In addition, in this plating tank 24, metal particles 152 serving as an anode are used.
Since plating metal is used in ..., the plating metal that is gradually consumed is automatically supplied into the plating solution. Therefore, management of the plating solution becomes easy.

Furthermore, in the plating method of this example, when the object 4 to be plated is short, the mask plate 154 is housed in the plating bath 51, and when the object 4 to be plated is long, the mask plate 154 is taken out and plated. Different plated objects 4 can be processed using the same plating apparatus.

"Effects of the Invention" As explained above, in the plating apparatus of the present invention, a plurality of treatment tanks for performing plating treatment are arranged in an arc shape, and a transport mechanism for transporting the object to be plated rotates around the center of the arc. It is configured to rotate around the center and move downward, and also has a supply mechanism for supplying the plating material, and a removal mechanism (7 mechanisms) for taking out the plated material from the conveyance mechanism. A large number of processing tanks can be arranged in a narrow space, and the transport mechanism can be housed in the space surrounded by the processing tanks.Therefore, the plating apparatus of the present invention can be extremely compact.

Furthermore, since the plating apparatus of the present invention is provided with a supply mechanism and a removal mechanism, it can be installed in the production line by docking it with the front process of the production line. Therefore, the plating apparatus of the present invention has extremely high productivity.

In addition, in plating equipment in which the horizontal cross-sectional shape of the processing tank is trapezoidal, the processing tank can be arranged in an arc shape with the least waste.
Significant downsizing can be achieved.

Furthermore, in a plating apparatus in which a processing agent supply device is connected to a processing tank, the processing tank can be made smaller and the entire apparatus can be made more compact.

Furthermore, in a plating apparatus that includes a circuit for supplying current to the plated object via a conveyance mechanism, there are 11 points that can be made to simplify the structure of the conduction circuit during plating processing.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an embodiment of the plating apparatus of the present invention, Fig. 2 is a front view showing the same embodiment, and Figs. 3 to 5 show an electrolytic degreasing tank of the same embodiment. Fig. 3 is a longitudinal sectional view along the depth direction, Fig. 4 is a horizontal sectional view, Fig. 5 is a longitudinal sectional view along the width direction, and Figs. 6 to 8 are the washing tank and pickling tank of the same embodiment. Fig. 6 is a vertical cross-sectional view along the depth direction, and Fig. 7 is a longitudinal sectional view along the depth direction.
The figure is a horizontal sectional view, Figure 8 is a side view, Figures 9 to 11
The figures show the plating bath of the same example, so Fig. 9 is a longitudinal sectional view along the depth direction, Fig. 1O is a horizontal sectional view, Fig. 11 is a longitudinal sectional view along the width direction, and Fig. 12 is a longitudinal sectional view along the width direction. 2 is an enlarged sectional view of part A in Figure 2. Figures 13 to 15 show the supply mechanism and removal mechanism of the same embodiment, so Figure 13 is a front view and Figure 14 is a top plan view. , FIG. 15 is a side view, and FIG. 16 is a side view showing the main parts of the same embodiment. Figure 19 shows the plating bath of the same example, so Figure 17 is a vertical cross-sectional view along the depth direction, Figure 18 is a horizontal cross-sectional view, Figure 19 is a vertical cross-sectional view along the width direction, and Figure 20 is a vertical cross-sectional view along the width direction. 20 to 22 show conventional plating equipment, so FIG. 20 is a perspective view showing the whole, and FIG. 21 is a configuration diagram showing the general structure of a plating chamber unit, a surface treatment chamber unit, and a post-treatment chamber unit. FIG. 22 is a sectional view showing the main parts of the plating chamber unit.

Claims (2)

[Claims] (1) Equipped with a plurality of processing tanks, a transport mechanism that holds the objects to be plated, a supply mechanism that supplies the objects to be plated to the transport mechanism, and a removal mechanism that takes out the plated objects from the transport mechanism. The plating apparatus is characterized in that the plurality of processing tanks are arranged in an arc shape, and the transport mechanism is configured to rotate around the center of the arc and move up and down. Device. (2) The horizontal cross-sectional shape of the processing tank is approximately trapezoidal, and each processing tank is connected with a processing agent supply device, and a circuit for energizing the object to be plated during plating is configured via the transport mechanism. The plating apparatus according to claim 1, characterized in that: