JP5994547B2 - Sputtering equipment - Google Patents

Description

  The present invention relates to a sputtering apparatus.

  Various sputtering apparatuses that form a film using a plurality of targets have been proposed (see Patent Documents 1 to 3).

US Pat. No. 6,641,703 U.S. Pat. No. 7,799,179 US Pat. No. 6,800,193

  In a sputtering apparatus that forms a film using a plurality of targets, it is desired that the target holder that holds the plurality of targets can be easily accessed.

  A main object of the present invention is to provide a sputtering apparatus that can easily access a target holding body that holds a plurality of targets.

According to one aspect of the invention,
A vacuum container having a lower housing and an upper housing that can be opened and closed with respect to the lower housing;
A first target holder attached to the upper housing and capable of holding a plurality of targets;
A first magnet assembly provided in the first target holder;
A second target holder attached to the upper housing and capable of holding a plurality of targets;
A second magnet assembly provided in the second target holding body;
A substrate holder provided in the vacuum vessel and for mounting a substrate;
Driving means for rotating the first and second target holders ,
The first target holding body includes first end portions and a first holding surface that holds the plurality of targets between the first both end portions,
One of the first end portions is rotatably attached to the upper housing via a first spindle,
The second target holding body has second end portions and a second holding surface that holds the plurality of targets between the second end portions,
One of the second end portions is rotatably attached to the upper housing via a second spindle,
In the closed state of the upper housing, wherein the first and second target holder is rotatable about a horizontal axis of rotation, and can hold a plurality of targets around the rotary shaft,
Said drive means rotates said first and second target holder around the rotation axis,
Wherein the first and second target holder is frustum is capable of holding the plurality of targets frustum surface of the frustum,
The rotation axis passes through the center of the center and the bottom surface of the upper surface of the frustum, a sputtering apparatus is disposed in the vicinity of the substrate holder is provided than the larger the smaller of the top surface and the bottom surface .

  ADVANTAGE OF THE INVENTION According to this invention, the sputtering device which can access easily the target holding body holding a some target is provided.

FIG. 1 is a schematic longitudinal sectional view for explaining a sputtering apparatus according to a first preferred embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view for explaining the sputtering apparatus according to the first preferred embodiment of the present invention. FIG. 3 is a schematic plan view for explaining the sputtering apparatus according to the first preferred embodiment of the present invention. FIG. 4 is a schematic perspective view for explaining the sputtering apparatus according to the first preferred embodiment of the present invention. FIG. 5 is a schematic longitudinal sectional view for explaining a first modification of the sputtering apparatus according to the first preferred embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view for explaining a second modification of the sputtering apparatus according to the preferred first embodiment of the present invention. FIG. 7 is a schematic longitudinal sectional view for explaining a sputtering apparatus according to a preferred second embodiment of the present invention. FIG. 8 is a schematic longitudinal sectional view for explaining a sputtering apparatus according to a preferred second embodiment of the present invention. FIG. 9 is a schematic longitudinal sectional view for explaining the sputtering apparatus according to the second preferred embodiment of the present invention. FIG. 10 is a schematic plan view for explaining the sputtering apparatus according to the second preferred embodiment of the present invention. FIG. 11 is a schematic perspective view for explaining a sputtering apparatus according to a preferred second embodiment of the present invention. FIG. 12 is a schematic longitudinal sectional view for explaining a sputtering apparatus according to a preferred third embodiment of the present invention.

  Next, a preferred embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
1 to 4, a sputtering apparatus 1 according to a first preferred embodiment of the present invention includes a housing 10, a carousel assembly 70 provided in the housing 10, and a substrate holder that holds the substrate 5. 86, a vacuum pump 80 that exhausts the inside of the housing 10, a process gas supply system 90 that supplies process gas into the housing 10, and a controller 200. FIG. 1 shows a state where the housing 10 is closed, and FIGS. 2 to 4 show a state where the housing 10 is opened. FIG. 1 is a view of the sputtering apparatus 1 viewed from a transfer chamber (not shown) for transporting the substrate 5.

  The housing 10 includes a lower housing 20 and a housing lid 30. The lower housing 20 includes a bottom wall 22 and side walls 23, 24, 28, and 29. An O-ring 18 is provided on the upper surface 25 of the lower housing 20. The turning shaft 19 is provided on the protruding portion 27 protruding outward from the upper portion of the side wall 29. The housing lid 30 is attached to the lower housing 20 via the turning shaft 19. The housing lid 30 is rotated by a motor (not shown) provided inside the turning shaft 19 to open and close the housing lid 30. When the housing lid 30 is closed, a vacuum is created between the space 11 in the housing 10 and the outer environment 12 by the lower surface 31 of the housing lid 30, the upper surface 25 of the lower housing 20, and the O-ring 18. Seal.

  A high vacuum pump 80 is attached to the bottom wall 22 of the lower housing 20 through an opening 21 in the bottom wall 22. The high vacuum pump 80 evacuates the space 11 of the housing 10 and maintains the vacuum, or exhausts the gas used in the sputtering. The valve 82 (see FIG. 2) is provided to open and close the opening 21 of the bottom wall 22 and further control the conductance between the high vacuum pump 80 and the space 11 of the housing 10. The valve 82 is moved up and down in the direction of the arrow 83 by an actuator (not shown).

  The process gas supply system 90 includes a process gas supply source 91 and gas ports 92 and 94. The gas ports 92 and 94 are provided through the side walls 23 and 24 of the lower housing 20, respectively. In order to introduce the process gas, the front ends of the gas ports 92 and 94 are targets located on the lowermost side of the paper among targets 71a to 71d and 72a to 72d described later (in FIG. Provided in the vicinity of the target 72a). The process gas supplied from the process gas supply source 91 is a target located on the lowermost side of the drawing surface among the targets 71a to 71d and 72a to 72d (described later in FIG. 1) via gas ports 92 and 94. , The target 71a and the target 72a).

  A substrate holder 86 for holding the substrate 5 such as a semiconductor silicon wafer is provided on the bottom wall 22 of the lower housing 20. The substrate holder 86 is rotated in the horizontal direction around the rotation shaft 88 by the rotation raising / lowering mechanism 84 provided outside the bottom wall 22 of the lower housing 20, and is raised and lowered in the direction of the arrow 87. The substrate holder 86 is provided below the frustums 40 and 60 described later and between the frustum 40 and the frustum 60.

  A carousel assembly 70 that can rotate around a rotation shaft 75 is provided inside the housing lid 30. The carousel assembly 70 includes a frustum 40, a frustum 60 provided to face the frustum 40, a spindle 42, a spindle 62, and a central cylindrical spindle 52. The frustum 40 has a bottom surface 41, a top surface 43, and a frustum surface 44 between the bottom surface 41 and the top surface 43. The bottom surface 41 is larger than the top surface 43. The frustum 60 has a bottom surface 61, a top surface 63, and a frustum surface 64 between the bottom surface 61 and the top surface 63. The bottom surface 61 is larger than the top surface 63.

  A spindle 42 is attached to the bottom surface 41 of the frustum 40, and a central cylindrical spindle 52 is attached to the top surface 43. A spindle 62 is attached to the bottom surface 61 of the frustum 60, and a central cylindrical spindle 52 is attached to the top surface 63. The spindle 42 is attached to the side wall 34 of the housing lid 30. The spindle 62 is attached to the side wall 36 of the housing lid 30. A plate 50 is attached to the ceiling wall 32 of the housing lid 30 downward on the paper surface. The central cylindrical spindle 52 is attached to the plate 50 by a bearing 51. The frustum 40 and the frustum 60 are attached to the housing lid 30 by a spindle 42, a spindle 62 and a central cylindrical spindle 52. In this way, the carousel assembly 70 is attached to the housing lid 30.

  The carousel assembly 70, the frustum 40, and the frustum 60 are rotatable about the rotation axis 75. An actuator 54 is attached to the outside of the side wall 34 of the housing lid 30. The spindle 54 is rotated by the actuator 54, whereby the frustum 40 is rotated. An actuator 74 is attached to the outside of the side wall 36 of the housing lid 30. The spindle 74 is rotated by the actuator 74, whereby the frustum 60 is rotated. Since the central cylindrical spindle 52 is attached to the frustum 40 and the frustum 60, the frustum 40 and the frustum 60 rotate together. The rotation shaft 75 passes through the center of the bottom surface 41 of the frustum 40, the center of the top surface 43, the center of the bottom surface 61 of the frustum 60, and the center of the top surface 63, and is perpendicular to these surfaces. In addition, it is desirable that the perpendicular line of the substrate mounting surface 89 of the substrate holder 86 intersects the rotation axis 75 perpendicularly.

  The plate 50 extending downward from the ceiling wall 32 of the housing lid 20 functions as a shield that prevents sputtered particles from accumulating on each part of the carousel assembly 70 or on the wall of the housing lid 20.

  Four cathodes 47 a to 47 d are provided on the frustum surface 44 of the frustum 40 so as to be spaced apart from each other at equal intervals. Four magnet assemblies 46a to 46d are provided inside the frustum 40 on the back side of the four cathodes 47a to 47d. The four magnet assemblies 46a to 46d are rotated by the four rotation mechanisms 48a to 48d, respectively. The rotation mechanisms 48 a to 48 d are provided inside the frustum 40.

  Four circular targets 71a to 71d are mounted on the cathodes 47a to 47d, respectively. The lowermost target (the target 71a in FIG. 1) among the targets 71a to 71d faces the substrate mounting surface 89 of the substrate holder 86. The magnet assemblies 46a to 46d are respectively moved by a magnet assembly moving mechanism (not shown), and the distance between the magnet assemblies 46a to 46d and the cathodes 47a to 47d, that is, the distance between the magnet assemblies 46a to 46d and the targets 71a to 71d. Each distance can be adjusted. By adjusting the distance, the magnetic fields on the surfaces of the targets 71a to 71d can be adjusted.

  Since the targets 71a to 71d are in the space 11 of the housing 10 and in the vacuum region, the frustums 40 and 60 are in the atmospheric region, so the magnet assemblies 46a to 46d and the rotation mechanism 48a. ~ 48d and the magnet assembly moving mechanism (not shown) are in the atmospheric region.

  Four cathodes 67a to 67d are provided on the frustum surface 64 of the frustum 60 so as to be spaced apart from each other at equal intervals. Four magnet assemblies 66a to 66d are provided inside the frustum 60 on the back side of the four cathodes 67a to 67d. The four magnet assemblies 66a to 66d are rotated by the four rotation mechanisms 68a to 68d, respectively. The rotation mechanisms 68 a to 68 d are provided inside the frustum 60.

  Four circular targets 72a to 72d are mounted on the cathodes 67a to 67d, respectively. Of the targets 72a to 72d, the target (the target 72a in FIG. 1) located on the lowermost side of the paper surface faces the substrate mounting surface 89 of the substrate holder 86. The magnet assemblies 66a to 66d are respectively moved by a magnet assembly moving mechanism (not shown), and the distance between the magnet assemblies 66a to 66d and the cathodes 67a to 67d, that is, the distance between the magnet assemblies 66a to 66d and the targets 72a to 72d. Each distance can be adjusted. By adjusting the distance, the magnetic fields on the surfaces of the targets 72a to 72d can be adjusted.

  Since the targets 72a to 72d are in the space 11 of the housing 10 and in the vacuum region, the frustums 40 and 60 are in the atmospheric region, so that the magnet assemblies 66a to 66d and the rotation mechanism 68a. ~ 68d and the magnet assembly moving mechanism (not shown) are in the atmospheric region.

  The targets 71 a to 71 d are attached in parallel to the frustum surface 44 of the frustum 40. The targets 72 a to 72 d are attached in parallel to the frustum surface 64 of the frustum 60. By rotating the carousel assembly 70 around the rotation shaft 75 and rotating the frustum 40 and the frustum 60 around the rotation shaft 75, a desired target (see FIG. 1) among the targets 71a to 71d and the targets 72a to 72d. Then, the target 71 a and the target 72 a can be brought close to the substrate holder 86.

  A line connecting the center of the target 71a of the frustum 40 and the center of the target 72a of the frustum 60 is preferably parallel to the rotation shaft 75 so that cosputtering is possible.

  A shutter 53 is provided to be rotatable around a rotation shaft 75. The shutter 53 is provided in the vicinity of the frustum 40 and can rotate around the frustum 40. By the actuator 54, the shutter 53 and the spindle 42 and the frustum 40 are rotated independently.

  The shutter 53 has an opening 53a (see FIG. 2) larger than the targets 71a to 71d. When the shutter 53 is rotated around the rotation shaft 75 to expose the target (the target 71a in FIG. 1) in which the opening 53a of the shutter 53 is located on the lowermost side of the paper surface among the targets 71a to 71d, the target is exposed. (In FIG. 1, the target 71a) enables sputtering. The shutter 53 is disposed in the vicinity of the targets 71a to 71d.

  A shutter 73 is provided to be rotatable around a rotation shaft 75. The shutter 73 is provided in the vicinity of the frustum 60 and is rotatable around the frustum 60. The actuator 74 rotates the shutter 73 and the spindle 62 and the frustum 60 independently.

  The shutter 73 has an opening 73a (see FIG. 2) larger than the targets 72a to 72d. When the shutter 73 is rotated about the rotation shaft 75 and the target (the target 72a in FIG. 1) in which the opening 73a of the shutter 73 is located on the lowermost side of the paper surface among the targets 72a to 72d is exposed. Sputtering is enabled by the target 72a in FIG. The shutter 73 is disposed in the vicinity of the targets 72a to 72d.

  The shutter 53 is provided to block the sputtered particles flowing from the targets 72a to 72d on the opposing frustum 60. Accordingly, the shutter 53 prevents the sputtered particles from the target 72a from adhering to the target 71a.

  The shutter 73 is provided to block the sputtered particles flowing from the targets 71a to 71d on the opposing frustum 40. Accordingly, the shutter 73 prevents sputtered particles from the target 71a from adhering to the target 72a.

  The targets 71 a to 71 d on the surface of the frustum 40 rotate the frustum 40 (carousel assembly 70) so that a predetermined target among the targets 71 a to 71 d is close to the substrate 5 mounted on the substrate holder 86. Is arranged at a position for sputtering. In FIG. 1, the target 71 a is disposed at a position for sputtering the substrate 5 mounted on the substrate holder 86.

  The targets 72 a to 72 d on the surface of the frustum 60 rotate the frustum 40 (carousel assembly 70) so that a predetermined target among the targets 72 a to 72 d is close to the substrate 5 mounted on the substrate holder 86. Is arranged at a position for sputtering. In FIG. 1, the target 72 a is disposed at a position for sputtering the substrate 5 mounted on the substrate holder 86.

  Sputtering introduces an inert gas into the housing 10, and at least one of the cathode located at the lowermost side among the cathodes 47a to 47d or the cathode located at the lowermost side among the cathodes 67a to 67d. This is done by applying a negative voltage to the cathode.

  In FIG. 1, the target 71 a is not shielded by the shutter 53, but the target 72 a is shielded by the shutter 73. Sputtering by the target 71a is performed by applying a predetermined power to the cathode 47a (see FIG. 2) on which the target 71a is mounted.

  Further, the target 71a is not shielded by the shutter 53, and the target 72a is not shielded by the shutter 73, and a predetermined power is applied to the cathode 47a (see FIG. 2) on which the target 71a is mounted, and the target 72a is mounted. By applying a predetermined power to the cathode 67a (see FIG. 2), co-sputtering using the target 71a and the target 72a can be performed.

  Since the frustum 40 holds four targets 71a to 71d and the frustum 60 holds four targets 72a to 72d, 16 co-sputtering combinations are possible.

  The frustum 40 holds the four targets 71 a to 71 d on the frustum surface 44 between the top surface 43 and the bottom surface 41 arranged vertically, and rotates the frustum 40 around the rotation axis 75 to thereby target 71 a. It is a structure which selects the target to sputter | spatter from -71d. The frustum 60 holds the four targets 72 a to 72 d on the frustum surface 64 between the vertically arranged upper surface 63 and the bottom surface 61, and rotates the frustum 60 around the rotation axis 75 to thereby target 72 a It is a structure which selects the target to sputter | spatter from -72d. Accordingly, the occupied floor area can be reduced.

  The perpendicular 45 extending from the center of the surface of the target 71a is directed toward the substrate mounting surface 89 of the substrate holder 86, or slightly outward. Similarly, the perpendicular 75 extending from the center of the surface of the target 72a is directed to the substrate mounting surface 89 of the substrate holder 86, or slightly outward.

  The targets 71 a to 71 d are held on the frustum surface 44 of the frustum 40, and the targets 72 a to 72 d are held on the frustum surface 64 of the frustum 60. On the other hand, the substrate holder 86 is disposed in the horizontal direction, and the substrate 5 mounted thereon is also disposed horizontally. Therefore, sputtering is performed in an oblique direction with respect to the substrate 5 mounted on the substrate holder 86 by the target (the target 71a in FIG. 1) located on the lowermost side of the drawing among the targets 71a to 71d. Become. Sputtering is performed in an oblique direction with respect to the substrate 5 mounted on the substrate holder 86 by the target (the target 72a in FIG. 1) located on the lowermost side of the drawing among the targets 72a to 72d. Become. And by rotating on the substrate holder 86 during sputtering, the film thickness distribution of the film formed on the substrate 5 by sputtering can be made uniform.

  Next, maintenance of the sputtering apparatus 1 will be described.

  With reference to FIGS. 2-4, during maintenance, the device is opened like a clam shell. The housing lid 30 is rotated by a motor (not shown) provided inside the turning shaft 19 to open the housing lid 30. By opening the housing lid 30, the targets 71a to 71d held on the frustum 40 and the targets 72a to 72d held on the frustum 60 are exposed for inspection and replacement. 2 to 4, since the target 71a held by the frustum 40 and the target 72a held by the frustum 60 are located at the uppermost part, the target 71a and the target 72a can be easily accessed. Depending on the position of the shutter 53, the target 71 a held by the frustum 40 is exposed by rotating the shutter 53. Depending on the position of the shutter 73, the target 72 a held by the frustum 60 by rotating the shutter 73. To expose. Other targets can be easily accessed by rotating the frustum 40 and the frustum 60. Therefore, the targets 71a to 71d and the targets 72a to 72d can be replaced more easily.

  When the targets 71a to 71d and the targets 72a to 72d are removed, each cathode assembly can be removed from the carousel. Each cathode assembly is integrally configured with a cathode magnet assembly and a rotation mechanism. That is, removing the cathode assembly gives access to the cathode, magnet assembly, and rotating mechanism.

  The spindles 42 and 62 have a hollow structure, and the water cooling system and the electric cable can be accessed through the opening at the end.

(First modification)
In the first embodiment described above, since the central cylindrical spindle 52 is attached to the frustum 40 and the frustum 60, the frustum 40 and the frustum 60 rotate together. On the other hand, as shown in FIG. 5, the spindle 101 is attached to the upper surface 43 of the frustum 40, the spindle 102 different from the spindle 101 is attached to the upper surface 63 of the frustum 60, and the spindle 101 is attached to the plate 50 by the bearing 103. By attaching the spindle 102 to the plate 50 with the bearing 104 different from the bearing 103, the frustum 40 and the frustum 60 can be rotated independently. The frustum 40 is rotated by the actuator 54, and the frustum 60 is rotated by the actuator 54.

(Second modification)
In the first modification described above, the spindle 101 is attached to the plate 50 by the bearing 103, and the spindle 102 is attached to the plate 50 by the bearing 104. However, in this modification (see FIG. 6), coaxial spindles having different diameters are used. By providing the bearing 110 between 105 and 106, the plate 50 is unnecessary. A spindle 105 is attached to the upper surface 43 of the frustum 40, and a spindle 106 different from the spindle 105 is attached to the upper surface 63 of the frustum 60. The spindle 105 has a hollow structure. The diameter of the inner surface 107 of the spindle 105 is larger than the diameter of the outer surface 109 of the tip portion 108 of the spindle 106, and the tip portion 108 of the spindle 106 is inserted into the spindle 105. Yes. A bearing 110 is provided between the inner surface 107 of the spindle 105 and the outer surface 109 of the tip portion 108 of the spindle 106. Also in this case, the frustum 40 and the frustum 60 can be rotated independently. The frustum 40 is rotated by the actuator 54, and the frustum 60 is rotated by the actuator 54.

  Since there is no plate 50, the frustum 40 is supported only on the bottom surface 41, and the frustum 60 is supported only on the bottom surface 61. Therefore, the bottom surface 41 side of the frustum 40 and the bottom surface 61 of the frustum 60 are provided. A stronger structure is required on the side. On the other hand, in the first embodiment, a central cylindrical spindle 52 that is commonly attached to the frustum 40 and the frustum 60 is used, and the central cylindrical spindle 52 is further provided with a bearing 51 on the plate 50. The load on the horizontal axis is reduced. Also in the first modification, the spindle 101 is attached to the upper surface 43 of the frustum 40, the spindle 102 is attached to the upper surface 63 of the frustum 60, the spindle 101 is attached to the plate 50 by the bearing 103, and the spindle 102 is attached to the plate 50. Therefore, the load on the horizontal axis is reduced as compared with the second modification.

(Second Embodiment)
Referring to FIGS. 7 to 11, the sputtering apparatus 2 according to the second preferred embodiment of the present invention holds the casing 100, carousel assemblies 240 and 260 provided in the casing 100, and the substrate 5. A substrate holder 86, a vacuum pump 80 that exhausts the inside of the housing 10, a process gas supply system 90 that supplies process gas into the housing 100, and a controller 200 are provided. FIG. 7 is a view of the sputtering apparatus 2 as seen from a transfer chamber (not shown) for transporting the substrate 5.

  The housing 100 includes a lower housing 20, a housing lid 110, and a housing lid 120. 7 and 8 show a state where the housing lid 110 and the housing lid 120 are closed, and FIGS. 9 and 11 show a state where the housing lid 110 is closed and the housing lid 120 is opened. FIG. 10 shows a state in which the housing lid 110 and the housing lid 120 are opened.

  The lower housing 20 includes a bottom wall 22, side walls 23, 24, 28, 29 and a ceiling wall 26 that bridges between the side walls 28, 29. O-rings 181 are provided on the side walls 23, 28, 29 and the upper surface 25 of the ceiling wall 26. O-rings 182 are provided on the side walls 24, 28, 29 and the upper surface 25 of the ceiling wall 26. Rotating shafts 119 and 129 are provided on the protruding portion 27 protruding outward at the upper portion of the side wall 29. The case lid 110 is attached to the lower case 20 via a turning shaft 119. The housing lid 120 is attached to the lower housing 20 via a turning shaft 129. The housing lid 110 is rotated by a motor (not shown) provided inside the turning shaft 119 to open and close the housing lid 110. The housing lid 120 is rotated by a motor (not shown) provided inside the turning shaft 129 to open and close the housing lid 120. When the housing lid 110 and the housing lid 120 are closed, the lower surface 131 of the housing lid 110, the upper surface 25 and the O-ring 181 of the lower housing 20, and the lower surface 131 of the housing lid 110 and the lower housing 20 The upper surface 25 and the O-ring 182 provide a vacuum seal between the space 11 in the housing 100 and the outer environment 12.

  A high vacuum pump 80 is attached to the bottom wall 22 of the lower housing 20 through an opening 21 in the bottom wall 22. The high vacuum pump 80 evacuates the space 11 of the housing 100 and maintains the vacuum, or exhausts the gas used in the sputtering. The valve 82 (see FIGS. 8 and 9) is provided to open and close the opening 21 of the bottom wall 22 and to control the conductance between the high vacuum pump 80 and the space 11 of the housing 100. The valve 82 is moved up and down in the direction of the arrow 83 by an actuator (not shown).

  The process gas supply system 90 includes a process gas supply source 91 and gas ports 92 and 94. The gas ports 92 and 94 are provided through the side walls 23 and 24 of the lower housing 20, respectively. In order to introduce the process gas, the front ends of the gas ports 92 and 94 are targets located on the lowermost side of the paper among targets 171a to 171d and 172a to 172d described later (in FIG. 7, in the target 171a, Each of them is provided near the target 172a). The process gas supplied from the process gas supply source 91 passes through gas ports 92 and 94, and targets (171, 171d, 172a to 172d, which will be described later) are respectively located on the lowermost side of the drawing (in FIG. 1). , Target 171a, target 172a) and the vicinity thereof.

  A substrate holder 86 for mounting the substrate 5 such as a semiconductor silicon wafer is provided on the bottom wall 22 of the lower housing 20. The substrate holder 86 is rotated in the horizontal direction around the rotation shaft 88 by the rotation raising / lowering mechanism 84 provided outside the bottom wall 22 of the lower housing 20, and is raised and lowered in the direction of the arrow 87. A shutter 98 is provided so as to cover the substrate holder 86 on which the substrate 5 is mounted. The shutter 98 is rotatable around an axis 99 and rotates to expose the substrate 5 mounted on the substrate holder 86. The shutter 98 is provided so that the targets 171a to 171d and 172a to 172d can be pre-sputtered without contaminating the substrate placement surface 89 of the substrate holder 86. The substrate holder 86 is provided below the frustums 140 and 160, which will be described later, and between the one frustum 40 and the frustum 160.

  A carousel assembly 240 that can rotate around a rotation shaft 175 is provided inside the housing lid 110. The carousel assembly 240 includes a frustum 140, a spindle 142, and a spindle 144. The frustum 140 has a bottom surface 141, a top surface 143, and a frustum surface 145 between the bottom surface 141 and the top surface 143. The bottom surface 141 is larger than the top surface 143. A spindle 142 is attached to the bottom surface 141 of the frustum 140, and a spindle 144 is attached to the top surface 143. The spindle 142 is attached to the side wall 114 of the housing lid 110. The spindle 144 is attached to the side wall 116 of the housing lid 110.

  The frustum 140 can rotate around the rotation shaft 175. An actuator 154 is attached to the outside of the side wall 114 of the housing lid 110. Actuator 154 causes spindle 142 to rotate, thereby causing frustum 140 to rotate. The rotation shaft 175 passes through the center of the bottom surface 141 and the center of the top surface 143 of the frustum 140 and is perpendicular to these surfaces.

  A carousel assembly 260 that can rotate around a rotation shaft 176 is provided inside the housing lid 120. The carousel assembly 260 includes a frustum 160, a spindle 162, and a spindle 164. The frustum 160 has a bottom surface 161, a top surface 163, and a frustum surface 164 between the bottom surface 161 and the top surface 163. The bottom surface 161 is larger than the top surface 163. A spindle 162 is attached to the bottom surface 161 of the frustum 160, and a spindle 164 is attached to the top surface 163. The spindle 162 is attached to the side wall 124 of the housing lid 120. The spindle 164 is attached to the side wall 126 of the housing lid 120.

  The frustum 160 can rotate around the rotation axis 176. An actuator 174 is attached to the outside of the side wall 124 of the housing lid 120. Actuator 174 rotates spindle 162 and thereby frustum 160 rotates. The rotation shaft 176 passes through the center of the bottom surface 161 and the center of the top surface 163 of the frustum 160 and is perpendicular to these surfaces.

  When the housing lid 110 and the housing lid 120 are closed, the rotation shaft 175 and the rotation shaft 176 are preferably coaxial.

  It is desirable that the perpendicular line of the substrate mounting surface 89 of the substrate holder 86 intersects the rotation axes 175 and 176 perpendicularly.

  On the frustum surface 145 of the frustum 140, four cathodes 147a to 147d are provided spaced apart from each other at equal intervals (see FIG. 8). Four magnet assemblies 146a to 146d are provided inside the frustum 140 on the back side of the four cathodes 147a to 147d, respectively. The four magnet assemblies 146a to 146d are rotated by the four rotation mechanisms 148a to 148d, respectively. The rotation mechanisms 148a to 148d are provided inside the frustum 140.

  Four circular targets 171a to 171d are mounted on the cathodes 147a to 147d, respectively. The lowermost target (the target 171a in FIG. 7) among the targets 171a to 171d faces the substrate mounting surface 89 of the substrate holder 86. The magnet assemblies 146a to 146d are respectively moved by a magnet assembly moving mechanism (not shown), and the distance between the magnet assemblies 146a to 146d and the cathodes 147a to 147d, and accordingly, between the magnet assemblies 146a to 146d and the targets 171a to 171d. Each distance can be adjusted. By adjusting the distance, the magnetic fields on the surfaces of the targets 171a to 171d can be adjusted.

  The targets 171a to 171d are in the space 11 of the housing 100 and in the vacuum region, whereas the frustum 140 is in the atmospheric region, so that the magnet assemblies 146a to 146d and the rotation mechanisms 148a to 148d are included. The magnet assembly moving mechanism (not shown) is in the atmospheric region.

  On the frustum surface 165 of the frustum 160, four cathodes 167a to 167d are spaced apart from each other at equal intervals (see FIGS. 8 and 9). Four magnet assemblies 166a to 166d are provided inside the frustum 160 on the back side of the four cathodes 167a to 167d, respectively. The four magnet assemblies 166a to 166d are rotated by the four rotation mechanisms 168a to 168d, respectively. The rotation mechanisms 168 a to 168 d are provided inside the frustum 160.

  Four circular targets 172a to 172d are mounted on the cathodes 167a to 167d, respectively. Of the targets 172a to 172d, the target (the target 172a in FIG. 7) located on the lowermost side of the paper surface faces the substrate mounting surface 89 of the substrate holder 86. The magnet assemblies 166a to 166d are respectively moved by a magnet assembly moving mechanism (not shown), and the distance between the magnet assemblies 166a to 166d and the cathodes 167a to 167d, and accordingly, between the magnet assemblies 166a to 166d and the targets 172a to 172d. Each distance can be adjusted. By adjusting the distance, the magnetic fields on the surfaces of the targets 172a to 172d can be adjusted.

  The targets 172a to 172d are in the space 11 of the casing 100 and in the vacuum region, whereas the frustum 160 is in the atmospheric region, so that the magnet assemblies 166a to 166d and the rotation mechanisms 168a to 168d are in the air region. The magnet assembly moving mechanism (not shown) is in the atmospheric region.

  The targets 171 a to 171 d are attached in parallel to the frustum surface 145 of the frustum 140. By rotating the carousel assembly 240 around the rotation axis 175 and rotating the frustum 140 around the rotation axis 175, a desired target (the target 171a in FIGS. 7 and 8) is selected from the targets 171a to 171d. It can be brought close to the holder 86.

  The targets 172a to 172d are attached in parallel to the frustum surface 165 of the frustum 160. By rotating the carousel assembly 240 around the rotation axis 176 and rotating the frustum 160 around the rotation axis 176, a desired target (the target 172a in FIGS. 7 and 8) is selected from the targets 172a to 172d. It can be brought close to the holder 86.

  A line connecting the center of the target 171a of the frustum 140 and the center of the target 172a of the frustum 160 is preferably parallel to the rotation shafts 175 and 176 so that cosputtering is possible.

  A shutter 153 is provided so as to be rotatable around a rotation shaft 175. The shutter 153 is provided in the vicinity of the frustum 140 and can rotate around the frustum 140. The shutter 153 is rotated independently of the spindle 142 and the frustum 40 by the actuator 156. The actuator 156 is provided in the vicinity of the spindle 144.

  The shutter 153 has an opening 153a (see FIG. 8) larger than the targets 171a to 171d. When the shutter 153 is rotated around the rotation axis 175 to expose the target (the target 171a in FIGS. 7 and 8) in which the opening 153a of the shutter 153 is located on the lowermost side of the paper surface among the targets 171a to 171d, Sputtering can be performed by the target (the target 171a in FIGS. 7 and 8). The shutter 153 is disposed in the vicinity of the targets 171a to 171d.

  A shutter 173 is provided so as to be rotatable around a rotation shaft 176. The shutter 173 is provided in the vicinity of the frustum 160 and is rotatable around the frustum 160. An actuator 176 rotates the shutter 173 independently of the spindle 162 and the frustum 160. The actuator 176 is provided in the vicinity of the spindle 164.

  The shutter 173 has an opening 173a (see FIG. 8) larger than the targets 172a to 172d. When the shutter 173 is rotated around the rotation axis 176 to expose the target (the target 172a in FIGS. 7 and 8) in which the opening 173a of the shutter 173 is located on the lowermost side of the paper surface among the targets 172a to 172d, Sputtering is enabled by the target (the target 172a in FIGS. 7 and 8). The shutter 173 is disposed in the vicinity of the targets 172a to 172d.

  The shutter 153 is provided to block the sputtered particles flowing from the targets 172a to 172d on the opposing frustum 160. Accordingly, the shutter 153 prevents the sputtered particles from the target 172a from adhering to the target 171a.

  The shutter 173 is provided to block sputtered particles flowing from the targets 171a to 171d on the opposing frustum 140. Accordingly, the shutter 173 prevents the sputtered particles from the target 171a from adhering to the target 172a.

  The targets 171 a to 171 d on the surface of the frustum 140 rotate the frustum 140 (carousel assembly 240) so that a predetermined target among the targets 171 a to 171 d is close to the substrate 5 mounted on the substrate holder 86. Is arranged at a position for sputtering. 7 and 8, the target 171 a is disposed at a position for sputtering the substrate 5 mounted on the substrate holder 86.

  The targets 172a to 172d on the surface of the frustum 160 rotate the frustum 160 (carousel assembly 260) so that a predetermined target among the targets 172a to 172d is close to the substrate 5 mounted on the substrate holder 86. Is arranged at a position for sputtering. 7 and 8, the target 172 a is disposed at a position for sputtering the substrate 5 mounted on the substrate holder 86.

  Sputtering introduces an inert gas into the housing 100, and at least one of the cathode located at the lowermost of the cathodes 147a to 147d or the cathode located at the lowermost of the cathodes 167a to 167d. This is done by applying a negative voltage to the cathode.

  In FIG. 7, the target 171 a is not shielded by the shutter 153, but the target 172 a is shielded by the shutter 173. Sputtering by the target 171a is performed by applying a predetermined power to the cathode 147a (see FIG. 8) on which the target 171a is mounted.

  In addition, the target 171a is not shielded by the shutter 153, the target 172a is not shielded by the shutter 173, a predetermined power is applied to the cathode 147a (see FIG. 8) on which the target 171a is mounted, and the target 172a is mounted. By applying a predetermined power to the cathode 167a (see FIG. 8), co-sputtering with the target 171a and the target 172a can be performed.

  Since the frustum 140 holds four targets 171a to 171d and the frustum 160 holds four targets 172a to 172d, 16 co-sputtering combinations are possible.

  The frustum 140 holds the four targets 171a to 171d on the frustum surface 145 between the upper surface 143 and the bottom surface 141 arranged vertically, and the target 171a is rotated by rotating the frustum 140 around the rotation axis 175. It is a structure which selects the target to sputter | spatter from -171d. The frustum 160 holds the four targets 172a to 172d on the frustum surface 165 between the upper surface 163 and the bottom surface 161 arranged vertically, and the target 172a is rotated by rotating the frustum 160 around the rotation axis 176. It is a structure which selects the target to sputter | spatter from -172d. Accordingly, the occupied floor area can be reduced.

  A perpendicular line 145 extending from the center of the surface of the target 171a is directed to the substrate mounting surface 89 of the substrate holder 86, or is directed slightly outward. Similarly, the perpendicular 175 extending from the center of the surface of the target 172a is directed to the substrate mounting surface 89 of the substrate holder 86 or slightly outward.

  The targets 171a to 171d are held on the frustum surface 145 of the frustum 140, and the targets 172a to 172d are held on the frustum surface 165 of the frustum 160. On the other hand, the substrate holder 86 is disposed in the horizontal direction, and the substrate 5 mounted thereon is also disposed horizontally. Accordingly, sputtering is performed in an oblique direction with respect to the substrate 5 mounted on the substrate holder 86 by the target (the target 171a in FIGS. 7 and 8) located on the lowermost side of the paper among the targets 171a to 171d. It will be. Further, sputtering is performed in an oblique direction with respect to the substrate 5 mounted on the substrate holder 86 by the target (the target 172a in FIGS. 7 and 8) located on the lowermost side of the paper among the targets 172a to 172d. It will be. And by rotating on the substrate holder 86 during sputtering, the film thickness distribution of the film formed on the substrate 5 by sputtering can be made uniform.

  Next, maintenance of the sputtering apparatus 2 will be described.

  9 and 11, the housing lid 110 is closed and the housing lid 120 is opened. The casing lid 120 is opened by rotating the casing lid 120 by a motor (not shown) provided inside the turning shaft 129. Opening the housing lid 120 not only allows access to the spindle 164 and the actuator 176 attached to the inner side wall 126 of the housing lid 120, but also exposes the inner side wall 116 of the housing lid 110. Therefore, the spindle 144 and the actuator 156 attached to the inner side wall 116 of the housing lid 110 can also be accessed. Similarly, opening the housing lid 110 not only allows access to the spindle 144 and actuator 156 attached to the inner side wall 116 of the housing lid 110, but also the inner side wall 126 of the housing lid 120. Is also exposed, so that the spindle 164 and the actuator 176 attached to the inner side wall 126 of the housing lid 120 can also be accessed. The housing lid 110 is opened by rotating the housing lid 110 by a motor (not shown) provided inside the turning shaft 119. In the maintenance that does not require access to the inner side wall 116 and the side wall 126, the two casing lids 110 and 120 may be opened simultaneously as shown in FIG.

  9 to 11, by opening the housing lid 120, the targets 172 a to 172 d held on the frustum 160 are exposed for inspection and replacement. 9 to 11, since the target 172a held by the frustum 160 is located at the top, the target 172a can be easily accessed. Depending on the position of the shutter 173, the shutter 173 is rotated to expose the target 172a held on the frustum 160. Other targets can be easily accessed by rotating the frustum 160. Accordingly, the targets 172a to 172d can be replaced more easily.

  When the targets 172a-172d are removed, each cathode assembly can be removed from the carousel. Each cathode assembly is configured integrally with a cathode, a magnet assembly, and a rotation mechanism. That is, removing the cathode assembly allows access to the cathode, magnet assembly, and rotating mechanism.

  Similarly, by opening the housing lid 110, the targets 171a to 171d held on the frustum 140 are exposed for inspection and replacement. Of the targets 171a to 171d held on the frustum 160, the target located at the top can be easily accessed. Note that, depending on the position of the shutter 153, the shutter 153 is rotated and held by the frustum 140, and the target 172a located at the top is exposed. Other targets can be easily accessed by rotating the frustum 140. Accordingly, the targets 171a to 171d can be replaced more easily.

  When the targets 171a to 171d are removed, the cathodes 147a to 147d can be accessed. Removing the cathodes 147a-147d allows access to the magnet assemblies 146a-146d. When the magnet assemblies 146a to 146d are removed, the rotation mechanisms 148a to 148d can be accessed.

  The spindles 142 and 144 and the spindles 162 and 164 have a hollow structure, and the power system and the drive mechanism are assembled through them.

(Third embodiment)
Referring to FIG. 12, in the sputtering apparatus 2 of the second embodiment, two housing lids 110 and a housing lid 120 are provided, and a carousel assembly 240 and a carousel assembly 260 are provided on the housing lid 110 and the housing lid 120. The casing lid 110 and the casing lid 120 are rotatable around the pivot axes 119 and 129, respectively. However, in the sputtering apparatus 3 of the present embodiment, only one casing lid 110 is provided, Although the carousel assembly 240 is provided in the body lid 110 and the case lid 110 is movable in the up and down direction 300, it is different from the sputtering apparatus 2 of the second embodiment, but the other points are the same. Also in the present embodiment, since the structure holds the targets 171a to 171d held by the frustum 140, the occupied floor area can be reduced. Further, since the carousel assembly 260 can be exposed by lifting the housing lid 110 upward, its maintenance is easy.

  As other aspects of the first embodiment, the second embodiment, and the third embodiment, four appropriately large targets 71a to 71d, 72a to 72d, 171a to 171d, and 172a to 172d (> 160 mm) are respectively arranged on the frustums 40, 60, 140, 160 having large end faces of 700 mm or less.

  Also, inside the frustums 40, 60, 140, 160, sufficient to accommodate the four cathodes 47a-47d, 67a-67d, 147a-147d, 167a-167d, respectively, each having a magnet assembly motor drive. Space is available.

  Also in the sputtering apparatus 2 having the two casing lids 110 and 120, the offset distance between the targets 171a to 171d and the substrate 5 and the offset distance between the targets 172a to 172d and the substrate 5 are kept at 300 mm or less. The offset distance indicates a distance between a normal line passing through the center of the circular substrate and a vertical line passing through the center of the target.

  Further, in an apparatus in which the carousel is attached to the lid, opening the lid facilitates access to the substrate holder and facilitates maintenance related to rotation and vertical movement of the substrate holder.

  Furthermore, in the second and third embodiments, one carousel assembly can be accessed from both sides, and the magnet assembly on the back side of the target is rotated (uniform erosion of the target) or vertically moved (target and magnet). (Distance adjustment) and maintenance related to the power introduction system to the cathode are facilitated.

  As described above, the sputtering apparatus 1 according to the first embodiment, the sputtering apparatus 2 according to the second embodiment, and the sputtering apparatus 3 according to the third embodiment have a compact occupied floor area. Therefore, according to the embodiment of the present invention, by arranging a plurality of targets obliquely on two coaxial carousels, enabling the substrate to rotate, and opening and closing the carousel housing lid 1) The requirements of multiple targets for offset oblique deposition with higher uniformity, 2) easy access to the cathode assembly, and 3) a small footprint are realized.

  Modifications to the aspects of the sputtering apparatus described above may be made by those skilled in the art, but that do not necessarily depart from the embodiments.

  For example, the frustum may be cylindrical, and the target may be arranged such that the vertical axis of the target surface is perpendicular to the rotation axis of the carousel assembly. Moreover, you may form a hollow in a cylindrical shape so that a target may be arrange | positioned diagonally with respect to a substrate mounting surface.

  Further, the frustums 40, 60, 140, 160 may be provided with targets of different sizes and numbers. Further, an optimum offset or angle can be adopted depending on the target material.

  While various typical embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Accordingly, the scope of the invention is limited only by the following claims.

10 housing 20 lower housing 30 housing lid 40, 60 frustum 5 substrate 86 substrate holder

Claims (7)

A vacuum container having a lower housing and an upper housing that can be opened and closed with respect to the lower housing;
A first target holder attached to the upper housing and capable of holding a plurality of targets;
A first magnet assembly provided in the first target holder;
A second target holder attached to the upper housing and capable of holding a plurality of targets;
A second magnet assembly provided in the second target holding body;
A substrate holder provided in the vacuum vessel and for mounting a substrate;
Driving means for rotating the first and second target holders ,
The first target holding body includes first end portions and a first holding surface that holds the plurality of targets between the first both end portions,
One of the first end portions is rotatably attached to the upper housing via a first spindle,
The second target holding body has second end portions and a second holding surface that holds the plurality of targets between the second end portions,
One of the second end portions is rotatably attached to the upper housing via a second spindle,
In the closed state of the upper housing, wherein the first and second target holder is rotatable about a horizontal axis of rotation, and can hold a plurality of targets around the rotary shaft,
Said drive means rotates said first and second target holder around the rotation axis,
Wherein the first and second target holder is frustum is capable of holding the plurality of targets frustum surface of the frustum,
The rotary shaft, the frustum through the centers of and the bottom surface of the upper surface of a sputtering apparatus which is disposed close to the substrate holder than the person who is large or small of the top surface and the bottom surface. The first and the other of said first end portions of the target holder, on the other of the second end portions of the second target holding body, wherein the third spindle is commonly attached Item 2. The sputtering apparatus according to Item 1 . The other of said first end portions of the front Symbol first data Getto holder is attached to the upper housing through a first bearing and the other of the second end portions of said second target holder sputtering device according to claim 2, wherein are attach to the upper housing via the second bearing. And the other of said first end portions of said first target holder, mounted for rotation independently of one another via a common bearing and the other of the second end portions of said second target holder The sputtering apparatus according to claim 2 . The upper housing has said lower portion relative to the housing independent to open the first and second upper housing,
The first target holding body is attached to the first upper housing,
The sputtering apparatus according to claim 1 , wherein the second target holding body is attached to the second upper casing . The driving means closed the first upper housing and the first driving means for rotating the first target holding body around the rotation axis with the first upper housing closed. The sputtering apparatus according to claim 5 , further comprising: a second driving unit that rotates the second target holding body around the rotation shaft in a state . The first upper casing is attached to the lower casing via a first pivot axis, and the second upper casing is attached to the lower casing via a second pivot axis. sputtering apparatus according to claim 5 or 6 are.

Images