JP5732250B2 - Connector unit and connector device - Google Patents

Connector unit and connector device Download PDF

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Publication number
JP5732250B2
JP5732250B2 JP2010291558A JP2010291558A JP5732250B2 JP 5732250 B2 JP5732250 B2 JP 5732250B2 JP 2010291558 A JP2010291558 A JP 2010291558A JP 2010291558 A JP2010291558 A JP 2010291558A JP 5732250 B2 JP5732250 B2 JP 5732250B2
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connector
substrate
contact
hole
board
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JP2012138320A (en
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丈晴 内藤
丈晴 内藤
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Priority to JP2010291558A priority Critical patent/JP5732250B2/en
Priority to TW100135826A priority patent/TWI446635B/en
Priority to KR1020110119426A priority patent/KR101326395B1/en
Priority to CN201110370710.XA priority patent/CN102570080B/en
Publication of JP2012138320A publication Critical patent/JP2012138320A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

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  • Coupling Device And Connection With Printed Circuit (AREA)

Description

本発明は、コネクタユニット及びコネクタ装置に関する。   The present invention relates to a connector unit and a connector device.

従来、図１２に示すように、第１の基板Ｔ１及び第２の基板（図示しない）を相互に接続するカードコネクタ５００であって、カードコネクタ５００が第１の基板Ｔ１に搭載された状態で、カードコネクタ５００の一部が第１の基板Ｔ１に形成された装着用開口Ｔ１’内に配置されるカードコネクタ５００が知られている（例えば、特許文献１参照。）。   Conventionally, as shown in FIG. 12, a card connector 500 for connecting a first board T1 and a second board (not shown) to each other, with the card connector 500 mounted on the first board T1. A card connector 500 is known in which a part of the card connector 500 is disposed in a mounting opening T1 ′ formed in a first substrate T1 (see, for example, Patent Document 1).

他方、図１３に示すように、第１の配線基板Ｔ１に搭載されるめすコネクタ６１０と、第２の配線基板Ｔ２に搭載されるおすコネクタ６２０とから構成され、コネクタ６１０、６２０間の嵌合状態で、おすコネクタ６２０の一部が第１の配線基板Ｔ１に形成された取付孔Ｔ１’内に挿入されるスタッキングコネクタ６００が知られている（例えば、特許文献２参照。）。   On the other hand, as shown in FIG. 13, a female connector 610 mounted on the first wiring board T1 and a male connector 620 mounted on the second wiring board T2 are configured, and the fitting between the connectors 610 and 620 is performed. In this state, a stacking connector 600 is known in which a part of the male connector 620 is inserted into a mounting hole T1 ′ formed in the first wiring board T1 (see, for example, Patent Document 2).

実開平６−１１２８３号公報Japanese Utility Model Publication No. 6-11283 特開平６−２８３２３８号公報JP-A-6-283238

ところが、特許文献１及び特許文献２に記載の技術では、コネクタ間を嵌合した状態での、コネクタ間の嵌合方向におけるコネクタ装置全体の寸法が大きいという問題があった。   However, the techniques described in Patent Literature 1 and Patent Literature 2 have a problem that the size of the entire connector device in the fitting direction between the connectors in a state where the connectors are fitted is large.

そこで、本発明は、従来の問題を解決するものであって、すなわち、本発明の目的は、コネクタ装置全体の低背化を実現するコネクタユニット及びコネクタ装置を提供することである。   Therefore, the present invention solves the conventional problems, that is, an object of the present invention is to provide a connector unit and a connector device that realize a low profile of the entire connector device.

本発明のコネクタユニットは、第１基板孔を有した第１基板に搭載される第１コネクタと、第２基板に搭載される第２コネクタとを備え、前記第１コネクタ及び前記第２コネクタの間の嵌合方向に直交する平面上に投影した前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成されていることにより、前述した課題を解決したものである。   The connector unit of the present invention includes a first connector mounted on a first board having a first board hole, and a second connector mounted on a second board, and the first connector and the second connector. The outer shape of the second connector projected onto a plane perpendicular to the fitting direction is formed so as to be within the outer shape of the first substrate hole, thereby solving the above-described problems.

本発明のコネクタ装置は、第１基板孔を有した第１基板と、第２基板と、前記第１基板に搭載される第１コネクタと、前記第２基板に搭載される第２コネクタとを備え、前記第１コネクタ及び前記第２コネクタの間の嵌合方向に直交する平面上に投影した前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成されていることにより、前述した課題を解決したものである。   The connector device according to the present invention includes a first substrate having a first substrate hole, a second substrate, a first connector mounted on the first substrate, and a second connector mounted on the second substrate. And the outer shape of the second connector projected onto a plane orthogonal to the fitting direction between the first connector and the second connector is formed so as to be within the outer shape of the first substrate hole. Thus, the above-mentioned problem is solved.

本発明では、第２コネクタの外形を第１基板孔の外形内に収まるように形成することにより、第１コネクタと第２コネクタとの間の嵌合方向におけるコネクタ装置全体の低背化を実現できる。   In the present invention, the overall shape of the second connector is formed so as to fit within the outer shape of the first board hole, thereby realizing a reduction in the overall height of the connector device in the fitting direction between the first connector and the second connector. it can.

本発明の一実施例であるコネクタ装置を示す斜視図である。It is a perspective view which shows the connector apparatus which is one Example of this invention. 図１に示すコネクタ装置を断面視して示す斜視図である。It is a perspective view which shows the connector apparatus shown in FIG. 第１コネクタを示す斜視図である。It is a perspective view which shows a 1st connector. 図３と異なる視点から第１コネクタを見て示す斜視図である。FIG. 4 is a perspective view showing the first connector from a different viewpoint from FIG. 3. 第２コネクタを示す斜視図である。It is a perspective view which shows a 2nd connector. 図５と異なる視点から第２コネクタを見て示す斜視図である。FIG. 6 is a perspective view showing the second connector from a different viewpoint from FIG. 5. 第１コネクタ及び第１基板を示す断面図である。It is sectional drawing which shows a 1st connector and a 1st board | substrate. 第２コネクタ及び第２基板を示す断面図である。It is sectional drawing which shows a 2nd connector and a 2nd board | substrate. 第１コネクタ及び第２コネクタを嵌合させた状態を示すコネクタ装置の断面図である。It is sectional drawing of the connector apparatus which shows the state which fitted the 1st connector and the 2nd connector. ピン部及びピン受容部の近傍部分を示すコネクタ装置の断面図である。It is sectional drawing of the connector apparatus which shows the vicinity part of a pin part and a pin receiving part. 本発明の変形例であるコネクタ装置を示す断面図である。It is sectional drawing which shows the connector apparatus which is a modification of this invention. 従来のカードコネクタを示す断面図である。It is sectional drawing which shows the conventional card connector. 従来のスタッキングコネクタを示す断面図である。It is sectional drawing which shows the conventional stacking connector.

以下、本発明の一実施例であるコネクタ装置を図面に基づいて説明する。   Hereinafter, a connector device according to an embodiment of the present invention will be described with reference to the drawings.

本発明の一実施例であるコネクタ装置は、図１に示すように、第１基板３００と、第２基板４００と、第１基板３００に搭載される第１コネクタ１００と、第２基板４００に搭載される第２コネクタ２００とから構成されている。第１コネクタ１００と第２コネクタ２００とは、第１基板３００及び第２基板４００の基板面に対して垂直な方向（以下、嵌合方向Ｘ３）に相互に接近して嵌合し第１基板３００と第２基板４００との間を電気的に接続するコネクタユニットを構成している。   As shown in FIG. 1, the connector device according to an embodiment of the present invention includes a first substrate 300, a second substrate 400, a first connector 100 mounted on the first substrate 300, and a second substrate 400. It is comprised from the 2nd connector 200 mounted. The first connector 100 and the second connector 200 are fitted close to each other in a direction perpendicular to the board surfaces of the first board 300 and the second board 400 (hereinafter, fitting direction X3). A connector unit that electrically connects 300 and the second substrate 400 is configured.

以下の説明では、第１コネクタ１００と第２コネクタ２００とを相互に接近させる嵌合方向Ｘ３に直交する方向を第１方向Ｘ１及び第２方向Ｘ２と規定する。第１方向Ｘ１及び第２方向Ｘ２は、相互に直交している。   In the following description, the directions orthogonal to the fitting direction X3 that causes the first connector 100 and the second connector 200 to approach each other are defined as a first direction X1 and a second direction X2. The first direction X1 and the second direction X2 are orthogonal to each other.

第１コネクタ１００は、所謂プラグコネクタであり、図２乃至図４に示すように、複数の第１コンタクト１１０と、第１コンタクト１１０を保持する第１ハウジング１２０とを備えている。第１コンタクト１１０と第１ハウジング１２０とは、インサート成形により一体に成形されている。   The first connector 100 is a so-called plug connector, and includes a plurality of first contacts 110 and a first housing 120 that holds the first contacts 110 as shown in FIGS. The first contact 110 and the first housing 120 are integrally formed by insert molding.

第１コンタクト１１０は、導電性の銅合金から成形され、図２乃至図４に示すように、第２方向Ｘ２における第１ハウジング１２０の両側において、第１方向Ｘ１に所定ピッチで並列した状態でそれぞれ複数配置されている。第２方向Ｘ２における第１ハウジング１２０の一方側に並列配置された複数の第１コンタクト１１０と、第２方向Ｘ２における第１ハウジング１２０の他方側に並列配置された複数の第１コンタクト１１０とは、嵌合方向Ｘ３及び第１方向Ｘ１により規定される平面を基準に面対称に配置されている。   The first contacts 110 are formed of a conductive copper alloy, and are arranged in parallel with each other at a predetermined pitch in the first direction X1 on both sides of the first housing 120 in the second direction X2, as shown in FIGS. A plurality of them are arranged. The plurality of first contacts 110 arranged in parallel on one side of the first housing 120 in the second direction X2 and the plurality of first contacts 110 arranged in parallel on the other side of the first housing 120 in the second direction X2. Further, they are arranged symmetrically with respect to a plane defined by the fitting direction X3 and the first direction X1.

第１コンタクト１１０は、図７に示すように、第１端子部１１１と、第１端子部１１１に連設された第１直線部１１２と、第１直線部１１２に連設された第１接触部１１３と、第１接触部１１３の端部に形成された巻き端部１１４とを一体に有している。   As shown in FIG. 7, the first contact 110 includes a first terminal portion 111, a first straight portion 112 connected to the first terminal portion 111, and a first contact connected to the first straight portion 112. The part 113 and the winding end part 114 formed at the end part of the first contact part 113 are integrally provided.

第１端子部１１１は、第１基板３００の表面３１０に形成されたパッド３１１に半田付けされて接続されている（図２参照）。第１端子部１１１は、第１ハウジング１２０から第２方向Ｘ２に向けて突出し、第１ハウジング１２０の外部に露出している。第１端子部１１１は、第１基板３００の表面３１０上に当接する第１当接面１１１ａと、嵌合方向Ｘ３及び第２方向Ｘ２により規定される平面内で湾曲し第１基板３００の表面３１０から離間する湾曲部１１１ｂとを有している。湾曲部１１１ｂは、第１端子部１１１とパッド３１１との間の半田付け作業時に、湾曲部１１１ｂとパッド３１１との間に形成された間隙内に半田を入り込ませることで、半田フィレットの形成を容易にし、半田付け強度を向上する目的で形成されている。   The first terminal portion 111 is soldered and connected to a pad 311 formed on the surface 310 of the first substrate 300 (see FIG. 2). The first terminal portion 111 protrudes from the first housing 120 in the second direction X2 and is exposed to the outside of the first housing 120. The first terminal portion 111 is curved in a plane defined by the first contact surface 111a that contacts the surface 310 of the first substrate 300 and the fitting direction X3 and the second direction X2, and the surface of the first substrate 300 And a curved portion 111b that is separated from 310. The bending portion 111b forms a solder fillet by causing solder to enter the gap formed between the bending portion 111b and the pad 311 during the soldering operation between the first terminal portion 111 and the pad 311. It is formed for the purpose of facilitating and improving the soldering strength.

第１直線部１１２は、第２方向Ｘ２に沿って延び、その一部が第１ハウジング１２０の第１本体部１２１内に埋設されている。第１直線部１１２は、前述した湾曲部１１１ｂを除いた第１端子部１１１の直線部分と一直線上に形成されている。   The first straight portion 112 extends along the second direction X <b> 2 and a part thereof is embedded in the first main body portion 121 of the first housing 120. The first straight portion 112 is formed on a straight line with the straight portion of the first terminal portion 111 excluding the curved portion 111b described above.

第１接触部１１３は、嵌合方向Ｘ３に沿って延び、第１コネクタ１００と第２コネクタ２００との間の嵌合時に、第２コンタクト２１０の第２接触部２１５に接触し電気的に接続される（図８参照）。本実施例では、図７に示すように、第１コネクタ１００を第１基板３００に搭載した状態で、第１接触部１１３が第１基板孔３３０を超えて第１基板３００の裏面３２０側に突出し、図９に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第１接触部１１３が第２基板孔４３０内に入り込むように、嵌合方向Ｘ３における第１接触部１１３の寸法は設定されている。   The first contact portion 113 extends along the fitting direction X3 and contacts and electrically connects to the second contact portion 215 of the second contact 210 when fitting between the first connector 100 and the second connector 200. (See FIG. 8). In the present embodiment, as shown in FIG. 7, the first contact portion 113 extends beyond the first substrate hole 330 toward the back surface 320 side of the first substrate 300 with the first connector 100 mounted on the first substrate 300. As shown in FIG. 9, in the fitting state between the first connector 100 and the second connector 200, the first contact portion 113 enters the second board hole 430 so that the first contact portion 113 enters the second board hole 430. The dimension of the one contact portion 113 is set.

巻き端部１１４は、その一部が第１ハウジング１２０の第１突出部１２３内に埋設され、第１ハウジング１２０と第１コンタクト１１０との間の固着強度を向上させている。   A part of the winding end portion 114 is embedded in the first projecting portion 123 of the first housing 120 to improve the fixing strength between the first housing 120 and the first contact 110.

第１ハウジング１２０は、絶縁性の樹脂から成形され、図３や図４に示すように、平板状の第１本体部１２１と、第１本体部１２１の外縁に形成された第１フランジ部１２２と、第２方向Ｘ２に相互に離間し対向した状態で第１本体部１２１から嵌合方向Ｘ３に向けてそれぞれ突出形成された一対の第１突出部１２３と、第１方向Ｘ１に相互に離間し対向した状態で第１本体部１２１から嵌合方向Ｘ３に向けてそれぞれ突出形成された一対のピン部１２４と、第１本体部１２１及び一対の第１突出部１２３及び一対のピン部１２４により画定され第２コネクタ２００側に開口した受容部１２５とを有している。   The first housing 120 is molded from an insulating resin. As shown in FIGS. 3 and 4, the first main body 121 having a flat plate shape and the first flange 122 formed at the outer edge of the first main body 121. And a pair of first protrusions 123 formed to protrude from the first main body 121 toward the fitting direction X3 in a state of being opposed to each other in the second direction X2, and separated from each other in the first direction X1. Then, in a state of being opposed to each other, a pair of pin portions 124 respectively projecting from the first main body portion 121 toward the fitting direction X3, a first main body portion 121, a pair of first projecting portions 123, and a pair of pin portions 124. And a receiving portion 125 which is defined and opened on the second connector 200 side.

第１本体部１２１は、平面視した場合に矩形状を呈し、図７に示すように、第１コネクタ１００を第１基板３００に搭載した状態で第１基板孔３３０の上方で第１基板３００の表面３１０側に位置する第１部分１２１ａと、第１コネクタ１００を第１基板３００に搭載した状態で第１基板孔３３０内に位置する第２部分１２１ｂとを有している。第２部分１２１ｂは、第１基板３００に対する第１コネクタ１００の取り付け時に、第１基板３００に第１コネクタ１００を載置した状態（すなわち、第１コンタクト１１０と第１基板３００との間の半田付けが行われていない状態）で、第１基板孔３３０の内側面により第１方向Ｘ１及び第２方向Ｘ２に移動を規制される被規制面１２１ｂ−１を外縁に有している。第１コネクタ１００を第１基板３００に搭載した状態（すなわち、第１コンタクト１１０と第１基板３００との間の半田付けが行われた状態）で、被規制面１２１ｂ−１と第１基板孔３３０の内側面との間には、第１方向Ｘ１及び第２方向Ｘ２において間隙が形成される。図３に示すように、第１本体部１２１（第１部分１２１ａ）の表面には、後述する孔１２６が形成されていない平坦面が存在し、この平坦面が、第１基板３００に対して第１コネクタ１００を載置する際に、第１コネクタ１００を持ち上げて運ぶ運搬装置（図示しない）の吸着部（図示しない）により吸着保持される被吸着部１２７として機能する。   The first main body 121 has a rectangular shape when seen in a plan view, and as shown in FIG. 7, the first board 300 is mounted above the first board hole 330 with the first connector 100 mounted on the first board 300. The first portion 121a located on the front surface 310 side and the second portion 121b located in the first substrate hole 330 in a state where the first connector 100 is mounted on the first substrate 300. The second portion 121b is in a state in which the first connector 100 is placed on the first substrate 300 when the first connector 100 is attached to the first substrate 300 (that is, solder between the first contact 110 and the first substrate 300). In a state where no attachment is performed), the outer edge has a regulated surface 121b-1 whose movement is regulated in the first direction X1 and the second direction X2 by the inner surface of the first substrate hole 330. In a state where the first connector 100 is mounted on the first substrate 300 (that is, a state where soldering is performed between the first contact 110 and the first substrate 300), the regulated surface 121b-1 and the first substrate hole A gap is formed between the inner surface of 330 in the first direction X1 and the second direction X2. As shown in FIG. 3, the surface of the first main body 121 (first portion 121 a) has a flat surface in which holes 126 described later are not formed, and this flat surface is in contact with the first substrate 300. When the first connector 100 is placed, it functions as a suctioned portion 127 that is sucked and held by a suction portion (not shown) of a transporting device (not shown) that lifts and carries the first connector 100.

第１フランジ部１２２は、第１本体部１２１の第１部分１２１ａの外縁（第１部分１２１ａの四辺）に形成されている。嵌合方向Ｘ３における第１フランジ部１２２の厚みは、嵌合方向Ｘ３における第１本体部１２１の第１部分１２１ａの厚みと同じ寸法で設定されている。第１コネクタ１００を第１基板３００に載置した状態で、第１フランジ部１２２と第１基板３００の表面３１０との間に間隔が形成されるように、第１ハウジング１２０は構成されている。このように第１ハウジング１２０を構成することにより、第１ハウジング１２０や第１コンタクト１１０に寸法上や形状上の多少の製造誤差が生じた場合であっても、第１基板３００に第１コネクタ１００を載置した状態で、第１コンタクト１１０の第１端子部１１１の第１当接面１１１ａを第１基板３００のパッド３１１に確実に当接させることができる。しかしながら、第１フランジ部１２２が第１基板３００の表面３１０に対して物理的に接触するように構成してもよい。第１フランジ部１２２は、第１コネクタ１００を第１基板３００に搭載した状態で、第１基板孔３３０を除いた第１基板３００の基板部分に対して嵌合方向Ｘ３に重なる。すなわち、第１基板３００上に投影した第１フランジ部１２２を含む第１ハウジング１２０の外形は、嵌合方向Ｘ３に直交する平面内における第１基板孔３３０の外形内に収まらないように形成されている。このように、第１フランジ部１２２が第１基板孔３３０を除いた第１基板３００の基板部分に対して嵌合方向Ｘ３に重なるように構成することにより、第１コネクタ１００に対して何かしらの荷重や衝撃が加わった場合であっても、第１コンタクト１１０に過剰な変形荷重が加わることを回避し、所謂コネクタ煽り強度を向上できる。なお、本実施例では、第１フランジ部１２２が第１本体部１２１の第１部分１２１ａの四辺に形成されているが、具体的な構成はこれに限定されず、第１コネクタ１００を第１基板３００に搭載した状態で、第１ハウジング１２０の少なくとも一部が、第１基板孔３３０を除いた第１基板３００の基板部分に対して嵌合方向Ｘ３に重なるように構成すればよい。   The first flange portion 122 is formed on the outer edge of the first portion 121a of the first main body portion 121 (four sides of the first portion 121a). The thickness of the first flange portion 122 in the fitting direction X3 is set to the same dimension as the thickness of the first portion 121a of the first main body portion 121 in the fitting direction X3. The first housing 120 is configured such that a gap is formed between the first flange portion 122 and the surface 310 of the first substrate 300 in a state where the first connector 100 is placed on the first substrate 300. . By configuring the first housing 120 in this way, the first connector can be connected to the first substrate 300 even if some manufacturing errors in size or shape occur in the first housing 120 or the first contact 110. With the 100 placed, the first contact surface 111 a of the first terminal portion 111 of the first contact 110 can be reliably brought into contact with the pad 311 of the first substrate 300. However, the first flange portion 122 may be configured to physically contact the surface 310 of the first substrate 300. The first flange portion 122 overlaps with the board portion of the first board 300 excluding the first board hole 330 in the fitting direction X3 in a state where the first connector 100 is mounted on the first board 300. That is, the outer shape of the first housing 120 including the first flange portion 122 projected onto the first substrate 300 is formed so as not to fit within the outer shape of the first substrate hole 330 in a plane orthogonal to the fitting direction X3. ing. As described above, the first flange portion 122 is configured to overlap the board portion of the first board 300 excluding the first board hole 330 in the fitting direction X3, so that something is made with respect to the first connector 100. Even when a load or impact is applied, it is possible to avoid an excessive deformation load from being applied to the first contact 110 and to improve the so-called connector twist strength. In the present embodiment, the first flange portion 122 is formed on the four sides of the first portion 121a of the first body portion 121, but the specific configuration is not limited to this, and the first connector 100 is connected to the first connector 100. What is necessary is just to comprise so that at least one part of the 1st housing 120 may overlap with the fitting direction X3 with respect to the board | substrate part of the 1st board | substrate 300 except the 1st board | substrate hole 330 in the state mounted in the board | substrate 300. FIG.

第１突出部１２３は、第１コンタクト１１０の第１接触部１１３を支持している。本実施例では、図７に示すように、第１コネクタ１００を第１基板３００に搭載した状態で、第１突出部１２３が第１基板３００の裏面３２０側に突出し、図９に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第１突出部１２３が第２基板孔４３０内に入り込むように、嵌合方向Ｘ３における第１突出部１２３の寸法は設定されている。   The first protrusion 123 supports the first contact portion 113 of the first contact 110. In the present embodiment, as shown in FIG. 7, with the first connector 100 mounted on the first substrate 300, the first protrusion 123 protrudes toward the back surface 320 side of the first substrate 300, as shown in FIG. The dimension of the first protrusion 123 in the fitting direction X3 is set so that the first protrusion 123 enters the second substrate hole 430 in the fitted state between the first connector 100 and the second connector 200. Has been.

ピン部１２４は、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第２コネクタ２００の第２ハウジング２２０に形成されたピン受容部２２３内（図５参照）に入り込み、ピン受容部２２３の内側面により第１方向Ｘ１及び第２方向Ｘ２に移動を規制されるように形成されている。本実施例では、図７に示すように、第１コネクタ１００を第１基板３００に搭載した状態で、ピン部１２４が第１基板３００の裏面３２０側に突出し、図１０に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、ピン部１２４が第２基板孔４３０内に入り込むように、嵌合方向Ｘ３におけるピン部１２４の寸法は設定されている。   The pin portion 124 enters the pin receiving portion 223 (see FIG. 5) formed in the second housing 220 of the second connector 200 in a fitted state between the first connector 100 and the second connector 200, and The inner surface of the receiving portion 223 is formed so as to be restricted in movement in the first direction X1 and the second direction X2. In the present embodiment, as shown in FIG. 7, with the first connector 100 mounted on the first substrate 300, the pin portion 124 protrudes toward the back surface 320 side of the first substrate 300, and as shown in FIG. The dimensions of the pin portion 124 in the fitting direction X3 are set so that the pin portion 124 enters the second board hole 430 in the fitted state between the first connector 100 and the second connector 200.

受容部１２５は、第２コネクタ２００側に開口し、第１コネクタ１００と第２コネクタ２００との間の嵌合時に、第２ハウジング２２０及び第２コンタクト２１０の一部を受容するように構成されている。   The receiving portion 125 opens to the second connector 200 side, and is configured to receive a part of the second housing 220 and the second contact 210 when fitting between the first connector 100 and the second connector 200. ing.

図２や図７に示す符号１２６は、第１ハウジング１２０に形成された孔であり、第１コンタクト１１０と第１ハウジング１２０とのインサート成形時には、金型の突起等で第１コンタクト１１０の動きを抑える必要があり、その結果として形成された孔である。   Reference numeral 126 shown in FIG. 2 and FIG. 7 is a hole formed in the first housing 120, and when the first contact 110 and the first housing 120 are insert-molded, the movement of the first contact 110 due to a protrusion of the mold or the like. As a result, it is a hole formed.

第２コネクタ２００は、所謂レセプタクルコネクタであり、図２、図５、図６に示すように、複数の第２コンタクト２１０と、第２コンタクト２１０を保持する第２ハウジング２２０とを備えている。第２コンタクト２１０は、第２ハウジング２２０に嵌め込まれている。   The second connector 200 is a so-called receptacle connector, and includes a plurality of second contacts 210 and a second housing 220 that holds the second contacts 210, as shown in FIGS. 2, 5, and 6. The second contact 210 is fitted in the second housing 220.

第２コンタクト２１０は、導電性の銅合金から成形され、図２、図５、図６に示すように、第２方向Ｘ２における第２ハウジング２２０の両側において、第１方向Ｘ１に所定ピッチで並列した状態でそれぞれ複数配置されている。第２方向Ｘ２における第２ハウジング２２０の一方側に並列配置された複数の第２コンタクト２１０と、第２方向Ｘ２における第２ハウジング２２０の他方側に並列配置された複数の第２コンタクト２１０とは、嵌合方向Ｘ３及び第１方向Ｘ１により規定される平面を基準に面対称に配置されている。   The second contact 210 is formed of a conductive copper alloy, and is parallel to the first direction X1 at a predetermined pitch on both sides of the second housing 220 in the second direction X2, as shown in FIGS. A plurality of each is arranged in the state. The plurality of second contacts 210 arranged in parallel on one side of the second housing 220 in the second direction X2 and the plurality of second contacts 210 arranged in parallel on the other side of the second housing 220 in the second direction X2. Further, they are arranged symmetrically with respect to a plane defined by the fitting direction X3 and the first direction X1.

第２コンタクト２１０は、図８に示すように、第２端子部２１１と、第２端子部２１１に連設された第２直線部２１２と、第２直線部２１２から嵌合方向Ｘ３に向けて突出形成された被保持部２１３と、第２直線部２１２に連設されたバネ部２１４と、バネ部２１４に膨出形成された第２接触部２１５を一体に有している。   As shown in FIG. 8, the second contact 210 includes a second terminal portion 211, a second straight portion 212 connected to the second terminal portion 211, and a fitting direction X <b> 3 from the second straight portion 212. The holding portion 213 protruding and formed, the spring portion 214 connected to the second linear portion 212, and the second contact portion 215 bulging and formed on the spring portion 214 are integrally provided.

第２端子部２１１は、第２基板４００の表面４１０に形成されたパッド４１１に半田付けされて接続されている（図２参照）。第２端子部２１１は、第２ハウジング２２０から第２方向Ｘ２に向けて突出し、第２ハウジング２２０の外部に露出している。第２端子部２１１は、第２基板４００の表面４１０上に当接する第２当接面２１１ａを有している。嵌合方向Ｘ３に直交する平面上（第１基板３００）に投影した第２端子部２１１を含む第２コネクタ２００の外形は、第１基板孔３３０の外形内に収まるように形成されている。また、本実施例では、図９に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第２コンタクト２１０及び第２ハウジング２２０の一部に加えて第２端子部２１１の一部も、第１基板孔３３０内に入り込むように、嵌合方向Ｘ３における第２端子部２１１の寸法は設定されている。   The second terminal portion 211 is soldered and connected to a pad 411 formed on the surface 410 of the second substrate 400 (see FIG. 2). The second terminal portion 211 protrudes from the second housing 220 in the second direction X2 and is exposed to the outside of the second housing 220. The second terminal portion 211 has a second contact surface 211 a that contacts the surface 410 of the second substrate 400. The outer shape of the second connector 200 including the second terminal portion 211 projected onto a plane (first substrate 300) orthogonal to the fitting direction X3 is formed so as to be within the outer shape of the first substrate hole 330. In the present embodiment, as shown in FIG. 9, the second terminal in addition to a part of the second contact 210 and the second housing 220 in the fitted state between the first connector 100 and the second connector 200. The dimension of the second terminal portion 211 in the fitting direction X3 is set so that a part of the portion 211 also enters the first substrate hole 330.

第２直線部２１２は、第２方向Ｘ２に沿って延びている。   The second straight portion 212 extends along the second direction X2.

被保持部２１３は、第２直線部２１２から嵌合方向Ｘ３に向けて突出形成され、第２ハウジング２２０に形成された保持部２２５に圧入され固定状態で保持されている。   The held portion 213 protrudes from the second straight portion 212 in the fitting direction X3, and is press-fitted into a holding portion 225 formed in the second housing 220 and is held in a fixed state.

バネ部２１４は、第２直線部２１２に連設され嵌合方向Ｘ３に沿って延びる第１部分２１４ａと、第１部分２１４ａに連設され第２方向Ｘ２に沿って延びる第２部分２１４ｂと、第２部分２１４ｂに連設され嵌合方向Ｘ３に向けて延びる第３部分２１４ｃとから構成され、全体形状でコ字状を呈している。本実施例では、図８に示すように、第２コネクタ２００を第２基板４００に搭載した状態で、第３部分２１４ｃの一部が第２基板孔４３０内に位置するとともに、第３部分２１４ｃの他の一部が第２基板孔４３０の上方で第２基板４００の表面４１０側に位置し、図１０に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第３部分２１４ｃの一部が第１基板孔３３０内に位置するように、嵌合方向Ｘ３における第３部分２１４ｃの寸法は設定されている（図９参照）。   The spring portion 214 is provided with a first portion 214a that is provided continuously with the second straight portion 212 and extends along the fitting direction X3, and a second portion 214b that is provided continuously with the first portion 214a and extends along the second direction X2. The third portion 214c is provided continuously with the second portion 214b and extends in the fitting direction X3, and has an overall U shape. In the present embodiment, as shown in FIG. 8, with the second connector 200 mounted on the second substrate 400, a part of the third portion 214c is located in the second substrate hole 430, and the third portion 214c. The other part is located on the surface 410 side of the second substrate 400 above the second substrate hole 430 and is in a fitted state between the first connector 100 and the second connector 200 as shown in FIG. The dimension of the third portion 214c in the fitting direction X3 is set so that a part of the third portion 214c is located in the first substrate hole 330 (see FIG. 9).

第２接触部２１５は、第１コネクタ１００側に位置する第３部分２１４ｃの先端部に膨出形成されている。第１コネクタ１００と第２コネクタ２００との間の嵌合時には、バネ部２１４が弾性変形し、第２接触部２１５が第１コンタクト１１０の第１接触部１１３に接触し電気的に接続される。   The second contact portion 215 is formed to bulge out at the tip of the third portion 214c located on the first connector 100 side. At the time of fitting between the first connector 100 and the second connector 200, the spring portion 214 is elastically deformed, and the second contact portion 215 contacts and is electrically connected to the first contact portion 113 of the first contact 110. .

第２ハウジング２２０は、絶縁性の樹脂から成形され、図５、６、８に示すように、第２本体部２２１と、第２本体部２２１の外縁に形成された第２フランジ部２２２と、第１方向Ｘ１に相互に離れた位置で第２本体部２２１にそれぞれ形成された一対のピン受容部２２３と、第２方向Ｘ２に相互に離れた位置で第２本体部２２１に凹設された一対の収容凹部２２４と、第２方向Ｘ２における収容凹部２２４の両外側に形成された一対の保持部２２５とを有している。   The second housing 220 is molded from an insulating resin, and as shown in FIGS. 5, 6, and 8, a second main body part 221, a second flange part 222 formed on the outer edge of the second main body part 221, A pair of pin receiving portions 223 respectively formed on the second body portion 221 at positions separated from each other in the first direction X1, and recessed at the second body portion 221 at positions separated from each other in the second direction X2. It has a pair of accommodation recessed part 224 and a pair of holding | maintenance part 225 formed in the both outer sides of the accommodation recessed part 224 in the 2nd direction X2.

第２本体部２２１は、図８に示すように、第２コネクタ２００を第２基板４００に搭載した状態で第２基板孔４３０の上方で第２基板４００の表面４１０側に位置する第１部分２２１ａと、第２コネクタ２００を第２基板４００に搭載した状態で第２基板孔４３０内に位置する第２部分２２１ｂとを有している。第２部分２２１ｂは、第２基板４００に対する第２コネクタ２００の取り付け時に、第２基板４００に対して第２コネクタ２００を載置した状態（すなわち、第２コンタクト２１０と第２基板４００との間の半田付けが行われていない状態）で、第２基板孔４３０の内側面により第１方向Ｘ１及び第２方向Ｘ２に移動を規制される被規制面２２１ｂ−１を外縁に有している。第２コネクタ２００を第２基板４００に搭載した状態（すなわち、第２コンタクト２１０と第２基板４００との間の半田付けが行われた状態）で、被規制面２２１ｂ−１と第２基板孔４３０の内側面との間には、第１方向Ｘ１及び第２方向Ｘ２において間隙が形成される。図５に示すように、一対のピン受容部２２３及び一対の収容凹部２２４に囲まれた位置の第２本体部２２１（第１部分２２１ａ）の表面は、第２基板４００に対して第２コネクタ２００を載置する際に、第２コネクタ２００を持ち上げて運ぶ運搬装置（図示しない）の吸着部（図示しない）により吸着保持される平坦状の被吸着部２２６として機能する。   As shown in FIG. 8, the second main body portion 221 is a first portion located on the surface 410 side of the second substrate 400 above the second substrate hole 430 in a state where the second connector 200 is mounted on the second substrate 400. 221a and a second portion 221b positioned in the second substrate hole 430 in a state where the second connector 200 is mounted on the second substrate 400. The second portion 221b is in a state in which the second connector 200 is placed on the second substrate 400 when the second connector 200 is attached to the second substrate 400 (that is, between the second contact 210 and the second substrate 400). In the state where the soldering is not performed), the outer surface has a regulated surface 221b-1 whose movement is regulated in the first direction X1 and the second direction X2 by the inner surface of the second substrate hole 430. In a state where the second connector 200 is mounted on the second substrate 400 (that is, a state where soldering is performed between the second contact 210 and the second substrate 400), the regulated surface 221b-1 and the second substrate hole A gap is formed between the inner surface of 430 in the first direction X1 and the second direction X2. As shown in FIG. 5, the surface of the second body portion 221 (first portion 221 a) at a position surrounded by the pair of pin receiving portions 223 and the pair of receiving recesses 224 is connected to the second substrate 400 by the second connector. When mounting 200, it functions as a flat attracted portion 226 that is attracted and held by an attracting portion (not shown) of a transport device (not shown) that lifts and carries the second connector 200.

第２フランジ部２２２は、第２本体部２２１の第１部分２２１ａの外縁（具体的には、第２方向Ｘ２における第１部分２２１ａの二辺）に形成されている。第２コネクタ２００を第２基板４００に載置した状態で、第２フランジ部２２２と第２基板４００の表面４１０との間に間隔が形成されるように、第２ハウジング２２０は構成されている。このように第２ハウジング２２０を構成することにより、第２フランジ部２２２や第２コンタクト２１０に寸法上や形状上の多少の製造誤差が生じた場合であっても、第２基板４００に第２コネクタ２００を載置した状態で、第２コンタクト２１０の第２端子部２１１の第２当接面２１１ａを第２基板４００のパッド４１１に確実に当接させることができる。しかしながら、第２フランジ部２２２が第２基板４００の表面４１０に対して物理的に接触するように構成してもよい。第２フランジ部２２２は、第２コネクタ２００を第２基板４００に搭載した状態で、第２基板孔４３０を除いた第２基板４００の基板部分に対して嵌合方向Ｘ３に重なる。すなわち、第２基板４００上に投影した第２フランジ部２２２を含む第２ハウジング２２０の外形は、嵌合方向Ｘ３に直交する平面内における第２基板孔４３０の外形内に収まらないように形成されている。このように、第２フランジ部２２２が第２基板孔４３０を除いた第２基板４００の基板部分に対して嵌合方向Ｘ３に重なるように構成することにより、第２コネクタ２００に対して何かしらの荷重や衝撃が加わった場合であっても、第２コンタクト２１０に過剰な変形荷重が加わることを回避し、所謂コネクタ煽り強度を向上できる。なお、本実施例では、第２フランジ部２２２が第２本体部２２１の第１部分２２１ａのニ辺に形成されているが、具体的な構成はこれに限定されることなく、第２ハウジング２２０の少なくとも一部が、第２コネクタ２００を第２基板４００に搭載した状態で、第２基板孔４３０を除いた第２基板４００の基板部分に対して嵌合方向Ｘ３に重なるように構成すればよい。   The second flange portion 222 is formed on the outer edge of the first portion 221a of the second main body portion 221 (specifically, two sides of the first portion 221a in the second direction X2). The second housing 220 is configured such that a gap is formed between the second flange portion 222 and the surface 410 of the second substrate 400 in a state where the second connector 200 is placed on the second substrate 400. . By configuring the second housing 220 in this manner, even if some manufacturing errors in size or shape occur in the second flange portion 222 or the second contact 210, the second substrate 400 is not subjected to the second. With the connector 200 placed, the second contact surface 211 a of the second terminal portion 211 of the second contact 210 can be reliably brought into contact with the pad 411 of the second substrate 400. However, the second flange portion 222 may be configured to physically contact the surface 410 of the second substrate 400. The second flange portion 222 overlaps with the boarding portion of the second board 400 excluding the second board hole 430 in the fitting direction X3 in a state where the second connector 200 is mounted on the second board 400. That is, the outer shape of the second housing 220 including the second flange portion 222 projected onto the second substrate 400 is formed so as not to fit within the outer shape of the second substrate hole 430 in a plane orthogonal to the fitting direction X3. ing. As described above, the second flange portion 222 is configured to overlap with the board portion of the second board 400 excluding the second board hole 430 in the fitting direction X3. Even when a load or impact is applied, it is possible to avoid an excessive deformation load from being applied to the second contact 210 and to improve the so-called connector twist strength. In the present embodiment, the second flange portion 222 is formed on the two sides of the first portion 221a of the second main body portion 221, but the specific configuration is not limited thereto, and the second housing 220 is not limited thereto. When the second connector 200 is mounted on the second board 400, at least a part of the board overlaps with the board portion of the second board 400 excluding the second board hole 430 in the fitting direction X3. Good.

ピン受容部２２３は、第１方向Ｘ１における第２本体部２２１の両側において、第２本体部２２１を嵌合方向Ｘ３に貫通した状態で形成され、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第１ハウジング１２０に形成されたピン部１２４を受容し、第１方向Ｘ１及び第２方向Ｘ２におけるピン部１２４の移動を規制するように構成されている。本実施例では、図８に示すように、第２コネクタ２００を第２基板４００に搭載した状態で、図１０に示すように、ピン受容部２２３の一部が第２基板孔４３０内に位置するとともに、ピン受容部２２３の他の一部が第２基板孔４３０の上方で第２基板４００の表面４１０側に位置し、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、ピン受容部２２３の一部が第１基板孔３３０内に位置するように、嵌合方向Ｘ３におけるピン受容部２２３の寸法は設定されている。   The pin receiving portion 223 is formed on both sides of the second main body portion 221 in the first direction X1 so as to penetrate the second main body portion 221 in the fitting direction X3, and between the first connector 100 and the second connector 200. In the fitted state, the pin portion 124 formed in the first housing 120 is received, and the movement of the pin portion 124 in the first direction X1 and the second direction X2 is restricted. In the present embodiment, as shown in FIG. 8, with the second connector 200 mounted on the second substrate 400, a part of the pin receiving portion 223 is located in the second substrate hole 430 as shown in FIG. In addition, the other part of the pin receiving portion 223 is positioned on the surface 410 side of the second substrate 400 above the second substrate hole 430 and is in a fitted state between the first connector 100 and the second connector 200. The dimensions of the pin receiving portion 223 in the fitting direction X3 are set so that a part of the pin receiving portion 223 is located in the first substrate hole 330.

収容凹部２２４は、第１コネクタ１００側に向けて開口し、第２コンタクト２１０のバネ部２１４を収容している。本実施例では、図８に示すように、第２コネクタ２００を第２基板４００に搭載した状態で、収容凹部２２４の一部が第２基板孔４３０内に位置するとともに、収容凹部２２４の他の一部が第２基板孔４３０の上方で第２基板４００の表面４１０側に位置し、図１０に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、収容凹部２２４の一部が第１基板孔３３０内に位置するように、嵌合方向Ｘ３における収容凹部２２４の寸法は設定されている。   The housing recess 224 opens toward the first connector 100 side and houses the spring portion 214 of the second contact 210. In the present embodiment, as shown in FIG. 8, in a state where the second connector 200 is mounted on the second substrate 400, a part of the accommodation recess 224 is located in the second substrate hole 430 and the other of the accommodation recess 224. Is located on the surface 410 side of the second substrate 400 above the second substrate hole 430 and accommodated in a fitted state between the first connector 100 and the second connector 200 as shown in FIG. The dimensions of the accommodation recess 224 in the fitting direction X3 are set so that a part of the recess 224 is located in the first substrate hole 330.

保持部２２５は、図８に示すように、嵌合方向Ｘ３に貫通した状態で第２本体部２２１に形成され、第２コンタクト２１０の被保持部２１３を固定状態で保持している。   As shown in FIG. 8, the holding portion 225 is formed in the second main body portion 221 in a state of penetrating in the fitting direction X3, and holds the held portion 213 of the second contact 210 in a fixed state.

図２に示すように、第１基板３００は、パッド３１１が形成された表面３１０と、裏面３２０と、表裏を嵌合方向Ｘ３に貫通する矩形状の第１基板孔３３０とを有している。   As shown in FIG. 2, the first substrate 300 has a front surface 310 on which a pad 311 is formed, a back surface 320, and a rectangular first substrate hole 330 penetrating the front and back surfaces in the fitting direction X3. .

図２に示すように、第２基板４００は、パッド４１１が形成された表面４１０と、裏面４２０と、表裏を嵌合方向Ｘ３に貫通する矩形状の第２基板孔４３０とを有している。   As shown in FIG. 2, the second substrate 400 has a front surface 410 on which pads 411 are formed, a back surface 420, and a rectangular second substrate hole 430 that penetrates the front and back surfaces in the fitting direction X3. .

第１コネクタ１００と第２コネクタ２００とは、第１基板３００の裏面３２０と第２基板４００の表面４１０とを相互に対向させた状態で、相互に嵌合される。   The first connector 100 and the second connector 200 are fitted to each other with the back surface 320 of the first substrate 300 and the front surface 410 of the second substrate 400 facing each other.

本実施例では、第１基板３００及び第２基板４００は、硬質プリント基板として構成されている。しかしながら、第１基板３００及び第２基板４００の具体的態様は硬質プリント基板に限定されず、例えば、ＦＰＣ等のフレキシブル基板であってもよい。   In the present embodiment, the first substrate 300 and the second substrate 400 are configured as hard printed boards. However, specific modes of the first substrate 300 and the second substrate 400 are not limited to the hard printed circuit board, and may be a flexible circuit board such as an FPC, for example.

本実施例においては、第１基板３００と第２基板４００との間には、スペーサ（図示しない）が設けられており、図９に示すように、第１コネクタ１００と第２コネクタ２００との間の嵌合時には、第１基板３００と第２基板４００との間に所定の間隔Ｓが形成される。しかしながら、第１基板３００と第２基板４００との間にスペーサを設けることなく、第１基板３００と第２基板４００とが相互に物理的に接触するように構成してもよい。   In this embodiment, a spacer (not shown) is provided between the first substrate 300 and the second substrate 400, and as shown in FIG. 9, the first connector 100 and the second connector 200 are connected to each other. A predetermined interval S is formed between the first substrate 300 and the second substrate 400 during the fitting. However, the first substrate 300 and the second substrate 400 may be configured to physically contact each other without providing a spacer between the first substrate 300 and the second substrate 400.

このようにして得られた本実施例のコネクタ装置では、嵌合方向Ｘ３に直交する平面上に投影した第２端子部２１１を含む第２コネクタ２００の外形が、第１基板孔３３０の外形内に収まるように形成されていることにより、第１コネクタ１００と第２コネクタ２００との間の嵌合時に、第２コンタクト２１０及び第２ハウジング２２０の一部に加えて第２端子部２１１の一部も第１基板孔３３０内に入り込むため、嵌合方向Ｘ３におけるコネクタ装置全体の低背化を実現できる。   In the connector device of the present embodiment thus obtained, the outer shape of the second connector 200 including the second terminal portion 211 projected on the plane orthogonal to the fitting direction X3 is the outer shape of the first substrate hole 330. In addition to the second contact 210 and a part of the second housing 220, when the first connector 100 and the second connector 200 are fitted together, one of the second terminal portions 211 is formed. Since the portion also enters the first board hole 330, the overall height of the connector device in the fitting direction X3 can be reduced.

また、第１コンタクト１１０及び第１ハウジング１２０の一部が第１基板孔３３０内に配置されているとともに、第２コンタクト２１０及び第２ハウジング２２０の一部が第２基板孔４３０内に配置されていることにより、嵌合方向Ｘ３におけるコネクタ装置全体の低背化を実現できる。   A part of the first contact 110 and the first housing 120 is disposed in the first substrate hole 330, and a part of the second contact 210 and the second housing 220 is disposed in the second substrate hole 430. As a result, the overall height of the connector device in the fitting direction X3 can be reduced.

第１ハウジング１２０のピン部１２４と第２ハウジング２２０のピン受容部２２３とが、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第１基板孔３３０内及び第２基板孔４３０内の両方に跨って延在するように構成されていることにより、コネクタ装置全体の低背化を阻害することなく、嵌合方向Ｘ３におけるピン部１２４及びピン受容部２２３の長さを充分に確保することが可能であるため、第１コネクタ１００と第２コネクタ２００との間の円滑な嵌合、及び、第１方向Ｘ１及び第２方向Ｘ２における第１コネクタ１００と第２コネクタ２００との間の確実な移動規制を実現できる。   When the pin portion 124 of the first housing 120 and the pin receiving portion 223 of the second housing 220 are fitted between the first connector 100 and the second connector 200, the first substrate hole 330 and the second substrate hole By being configured so as to extend over both in 430, the length of the pin portion 124 and the pin receiving portion 223 in the fitting direction X3 is sufficiently long without hindering the reduction of the overall height of the connector device. Therefore, the smooth fitting between the first connector 100 and the second connector 200, and the first connector 100 and the second connector 200 in the first direction X1 and the second direction X2, It is possible to achieve reliable movement control between the two.

第１コンタクト１１０の第１接触部１１３と第２コンタクト２１０のバネ部２１４の第３部分２１４ｃとが、第１コネクタ１００と第２コネクタ２００との間の嵌合状態で、第１基板孔３３０及び第２基板孔４３０の両方に跨って延在するとともに、第２コンタクト２１０の第２接触部２１５が第３部分２１４ｃの第１コネクタ１００側の先端部に形成されていることにより、コネクタ装置全体の低背化を阻害することなく、第１コンタクト１１０と第２コンタクト２１０との間の接触有効長を充分に確保できる。   When the first contact portion 113 of the first contact 110 and the third portion 214c of the spring portion 214 of the second contact 210 are fitted between the first connector 100 and the second connector 200, the first substrate hole 330 is provided. And the second contact hole 215 of the second contact 210 is formed at the distal end of the third portion 214c on the first connector 100 side, thereby extending the connector device. A sufficient effective contact length between the first contact 110 and the second contact 210 can be ensured without hindering the overall reduction in height.

次に、本実施例のコネクタ装置の変形例について、図１１に基づいて説明する。ここで、第１コンタクト１１０の第１端子部１１１’の構成及び第１基板３００の配置状態以外の構成は、前述したコネクタ装置と全く同じであるため、第１コンタクト１１０の第１端子部１１１’の構成及び第１基板３００の配置状態以外の構成については説明を省略する。   Next, a modification of the connector device of the present embodiment will be described with reference to FIG. Here, since the configuration of the first terminal portion 111 ′ of the first contact 110 and the configuration other than the arrangement state of the first substrate 300 are the same as those of the connector device described above, the first terminal portion 111 of the first contact 110. The description of the configuration other than the configuration of 'and the arrangement state of the first substrate 300 is omitted.

まず、本変形例では、図１１に示すように、第１基板３００の表裏が、図１乃至図１０に示した前述の実施例とは逆になっている。すなわち、本変形例では、パッド（図１１では図示しない）が形成された表面３１０を第２基板４００に対向させた状態で、第１基板３００が配置されている。   First, in this modified example, as shown in FIG. 11, the front and back of the first substrate 300 are opposite to those of the above-described embodiments shown in FIGS. In other words, in the present modification, the first substrate 300 is disposed in a state where the surface 310 on which the pads (not shown in FIG. 11) are formed faces the second substrate 400.

そして、本変形例では、第１コンタクト１１０の第１端子部１１１’が、第２方向Ｘ２における第１直線部１１２の端部から第１基板孔３３０内を通して第１基板３００の表面３１０側まで延ばされ、第２基板４００に対向する第１基板３００の表面３１０に形成されたパッド（図１１では図示しない）に半田付けされて接続されている。   In this modification, the first terminal portion 111 ′ of the first contact 110 extends from the end of the first straight portion 112 in the second direction X2 to the surface 310 side of the first substrate 300 through the first substrate hole 330. It is extended and soldered and connected to a pad (not shown in FIG. 11) formed on the surface 310 of the first substrate 300 facing the second substrate 400.

１００ ・・・ 第１コネクタ
１１０ ・・・ 第１コンタクト
１１１、１１１’ ・・・ 第１端子部
１１１ａ ・・・ 第１当接面
１１１ｂ ・・・ 湾曲部
１１２ ・・・ 第１直線部
１１３ ・・・ 第１接触部
１１４ ・・・ 巻き端部
１２０ ・・・ 第１ハウジング
１２１ ・・・ 第１本体部
１２１ａ ・・・ 第１部分
１２１ｂ ・・・ 第２部分
１２１ｂ−１ ・・・ 被規制面
１２２ ・・・ 第１フランジ部
１２３ ・・・ 第１突出部
１２４ ・・・ ピン部
１２５ ・・・ 受容部
１２６ ・・・ 孔
１２７ ・・・ 被吸着部
２００ ・・・ 第２コネクタ
２１０ ・・・ 第２コンタクト
２１１ ・・・ 第２端子部
２１１ａ ・・・ 第２当接面
２１２ ・・・ 第２直線部
２１３ ・・・ 被保持部
２１４ ・・・ バネ部
２１４ａ ・・・ 第１部分
２１４ｂ ・・・ 第２部分
２１４ｃ ・・・ 第３部分
２１５ ・・・ 第２接触部
２２０ ・・・ 第２ハウジング
２２１ ・・・ 第２本体部
２２１ａ ・・・ 第１部分
２２１ｂ ・・・ 第２部分
２２１ｂ−１ ・・・ 被規制面
２２２ ・・・ 第２フランジ部
２２３ ・・・ ピン受容部
２２４ ・・・ 収容凹部
２２５ ・・・ 保持部
２２６ ・・・ 被吸着部
３００ ・・・ 第１基板
３１０ ・・・ 表面
３１１ ・・・ パッド
３２０ ・・・ 裏面
３３０ ・・・ 第１基板孔
４００ ・・・ 第２基板
４１０ ・・・ 表面
４１１ ・・・ パッド
４２０ ・・・ 裏面
４３０ ・・・ 第２基板孔
Ｘ１ ・・・ 第１方向
Ｘ２ ・・・ 第２方向
Ｘ３ ・・・ 嵌合方向 DESCRIPTION OF SYMBOLS 100 ... 1st connector 110 ... 1st contact 111, 111 '... 1st terminal part 111a ... 1st contact surface 111b ... curved part 112 ... 1st linear part 113. .. First contact part 114 ... winding end part 120 ... first housing 121 ... first main body part 121a ... first part 121b ... second part 121b-1 ... regulated Surface 122 ... First flange part 123 ... First protrusion 124 ... Pin part 125 ... Receiving part 126 ... Hole 127 ... Adsorbed part 200 ... Second connector 210 ··· Second contact 211 ··· second terminal portion 211a ··· second contact surface 212 ··· second linear portion 213 ··· held portion 214 ··· spring portion 214a ··· first portion 214b 2nd part 214c ... 3rd part 215 ... 2nd contact part 220 ... 2nd housing 221 ... 2nd main body part 221a ... 1st part 221b ... 2nd part 221b -1 ... regulated surface 222 ... second flange part 223 ... pin receiving part 224 ... accommodation recess 225 ... holding part 226 ... attracted part 300 ... first substrate 310・ ・ ・ Front surface 311 ・ ・ ・ pad 320 ・ ・ ・ back surface 330 ・ ・ ・ first substrate hole 400 ・ ・ ・ second substrate 410 ・ ・ ・ front surface 411 ・ ・ ・ pad 420 ・ ・ ・ back surface 430 ・ ・ ・ second Board hole X1 ... 1st direction X2 ... 2nd direction X3 ... Fitting direction

Claims (4)

第１基板孔を有した第１基板に搭載される第１コネクタと、第２基板孔を有した第２基板に搭載される第２コネクタとを備え、
前記第１コネクタを前記第１基板に搭載したとき、前記第１コネクタの一部は前記第１基板孔に収まり、
前記第２コネクタを前記第２基板に搭載したとき、前記第２コネクタの一部は前記第２基板孔に収まり、
前記第１コネクタ及び前記第２コネクタの間の嵌合方向に直交する平面上に投影した前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成され、嵌合状態において、前記第１コネクタの一部が前記第２基板孔に収まると同時に、前記第２コネクタの一部が前記第１基板孔に収まることを特徴とするコネクタユニット。 A first connector mounted on a first substrate having a first substrate hole; and a second connector mounted on a second substrate having a second substrate hole;
When the first connector is mounted on the first board, a part of the first connector is accommodated in the first board hole,
When the second connector is mounted on the second substrate, a part of the second connector is accommodated in the second substrate hole,
The outer shape of the second connector projected on a plane orthogonal to the fitting direction between the first connector and the second connector is formed so as to be within the outer shape of the first board hole, and in the fitted state The connector unit is characterized in that a part of the first connector fits in the second board hole and a part of the second connector fits in the first board hole . 前記第２コネクタは、第２コンタクトと、前記第２コンタクトを保持する第２ハウジングとを有し、
前記第２コンタクトは、前記嵌合方向に直交する方向に前記第２ハウジングから突出する第２端子部を有し、
前記嵌合方向に直交する平面上に投影した前記第２端子部を含む前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成されていることを特徴とする請求項１に記載のコネクタユニット。 The second connector includes a second contact and a second housing that holds the second contact;
The second contact has a second terminal portion protruding from the second housing in a direction orthogonal to the fitting direction,
The outer shape of the second connector including the second terminal portion projected onto a plane orthogonal to the fitting direction is formed so as to be within the outer shape of the first substrate hole. The connector unit according to 1. 第１基板孔を有した第１基板と、第２基板孔を有した第２基板と、前記第１基板に搭載される第１コネクタと、前記第２基板に搭載される第２コネクタとを備え、
前記第１コネクタを前記第１基板に搭載したとき、前記第１コネクタの一部は前記第１基板孔に収まり、
前記第２コネクタを前記第２基板に搭載したとき、前記第２コネクタの一部は前記第２基板孔に収まり、
前記第１コネクタ及び前記第２コネクタの間の嵌合方向に直交する平面上に投影した前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成され、嵌合状態において、前記第１コネクタの一部が前記第２基板孔に収まると同時に、前記第２コネクタの一部が前記第１基板孔に収まることを特徴とするコネクタ装置。 A first substrate having a first substrate hole; a second substrate having a second substrate hole; a first connector mounted on the first substrate; and a second connector mounted on the second substrate. Prepared,
When the first connector is mounted on the first board, a part of the first connector is accommodated in the first board hole,
When the second connector is mounted on the second substrate, a part of the second connector is accommodated in the second substrate hole,
The outer shape of the second connector projected on a plane orthogonal to the fitting direction between the first connector and the second connector is formed so as to be within the outer shape of the first board hole, and in the fitted state The connector device is characterized in that a part of the first connector fits in the second board hole and a part of the second connector fits in the first board hole . 前記第２コネクタは、第２コンタクトと、前記第２コンタクトを保持する第２ハウジングとを有し、
前記第２コンタクトは、前記嵌合方向に直交する方向に前記第２ハウジングから突出する第２端子部を有し、
前記嵌合方向に直交する平面上に投影した前記第２端子部を含む前記第２コネクタの外形は、前記第１基板孔の外形内に収まるように形成されていることを特徴とする請求項３に記載のコネクタ装置。 The second connector includes a second contact and a second housing that holds the second contact;
The second contact has a second terminal portion protruding from the second housing in a direction orthogonal to the fitting direction,
The outer shape of the second connector including the second terminal portion projected onto a plane orthogonal to the fitting direction is formed so as to be within the outer shape of the first substrate hole. 3. The connector device according to 3.
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