JP4735941B2 - Wiring board for light emitting device - Google Patents

Description

  The present invention provides a chip component type light emitting device in which a light emitting element is mounted inside a non-through hole of a wiring board and can be used as a light source for various display panels, backlights of liquid crystal display devices, illumination devices, and the like. The present invention relates to a wiring board for a light emitting element.

  2. Description of the Related Art Conventionally, chip component type light emitting devices represented by chip component type LEDs are used as light sources for display panels, backlights of liquid crystal display devices, illumination devices, and the like. Such chip component type light emitting devices have been further expanded in application with the expansion of the use of flat panels in recent years. With the expansion of such applications, chip component-type light emitting devices are required to increase the amount of light emitted from the element itself, increase the amount of emitted light relative to power consumption, in other words, improve the conversion efficiency to light, and Furthermore, there is a need for a wiring board that is particularly suitable for mass production, and thus is a chip component type light emitting device that can be manufactured at a relatively low cost.

In addition, such a conventional chip component type light emitting device generally has a through hole or a hole with a tapered surface formed in a part of an insulating substrate, as shown in Patent Document 1 below, for example. LED chip parts are mounted on a thin metal plate attached to the bottom surface of the through hole, and the thin metal plate on the bottom surface is connected to one wiring pattern on the upper surface of the wiring board, so that electrical connection is required.
That is, one LED chip component such as an LED chip component is mounted on the upper surface of the metal thin plate on the bottom surface and electrically connected to complete the chip component type light emitting device.

Japanese Patent No. 3137823

  However, the mounting structure of the above-described chip component type light emitting device is a structure in which, for example, only one LED chip component is mounted on each wiring board. Corresponding to the increase in the amount of light emitted from the light emitting element of the chip component, the generated heat capacity is increased and the structure is not suitable for heat dissipation.

That is, in the structure known from Patent Document 1, a metal thin plate attached to the back surface of the through hole is connected to the wiring pattern on the upper surface, and one electrode of the LED chip component mounted therein is connected to the metal thin plate on the back surface of the insulating substrate. The other electrode is connected to another connection wiring pattern also formed on a part of the wiring substrate by, for example, wire bonding or the like.
However, electrical connection with a conductive material such as Ag paste, and a resist layer is formed on the back surface of the wiring board to ensure insulation during soldering, which is suitable for heat dissipation with a large generated heat capacity. It is not a structure.
Further, the structure is not suitable when a plurality of LED chip components are mounted on a thin metal plate attached to the back surface of the through hole.

Further, in the structure known from Patent Document 1, the other electrode of the LED chip component mounted inside is connected to a connection wiring pattern formed on the upper part of the wiring substrate by wire bonding or the like, and this connection wiring pattern is a metal on the surface. The thin plate is formed to extend so as to connect the thin metal plate on the back surface.
However, the plating layer on the side surface of the insulating substrate is formed flat on the side surface of the individual wiring substrate, and when a plurality of LED chip components are mounted in the non-through holes, electrodes for electrical connection to the outside It is difficult to form a large number of layers, and the production efficiency is also deteriorated.

  Therefore, the present invention has been made in view of the above-described problems in the prior art, and in particular, a wiring board for a chip component type light emitting device in which a plurality of light emitting elements are mounted, Furthermore, a light emitting element is repeatedly mounted on the inner bottom of a non-through hole of a small individual wiring board arranged on a large-size wiring board, and the electrical connection is formed on the upper part of the wiring board by wire bonding or the like. Connect to the land and use a thick metal conductor on the bottom of the non-through hole as a heat sink for heat dissipation of the generated heat capacity. Further, a structure capable of mass-producing a chip component type light emitting device having multiple pairs of end face electrodes by molding the upper part of the non-through hole on which the light emitting element is mounted with a sealing resin and then dividing it by a cutting line An object of the present invention is to provide a wiring board that is relatively inexpensive and has high production efficiency.

In order to achieve the above object, according to the present invention, there is provided a wiring board for a chip component type light emitting device in which a light emitting element is mounted on an inner bottom portion of a non-through hole of an insulating board, and a part of the wiring board. A non-through hole for mounting the light emitting element is formed to open upward, and the upper end surface diameter (L1) is larger than the bottom surface diameter (L2) of the non-through hole and opens in a tapered shape. A reflective film made of a metal thin film is formed on the inner peripheral wall surface of the tapered hole, and a connection land for electrically connecting the light emitting element is formed on the upper peripheral surface of the tapered hole of the wiring board. is formed, and the bottom surface of said tapered hole by mounting the light emitting element, the heat dissipation plate for the purpose of heat dissipation by a thick metal conductor in thickness 70μm~300μm that contacting the housing case directly on the back surface, the non Dew on bottom and back of through hole The heat sink provides a wiring board for a chip component type light emitting device that is not electrically connected to the light emitting element and the connection land.

  According to the present invention, there is a non-through hole for mounting a plurality of light emitting elements on the bottom surface of the tapered hole which is one non-through hole of the wiring board described above, and the inner peripheral wall surface of the tapered hole. Is formed with a reflective film made of a metal thin film with good reflection efficiency, and in the periphery of the upper end of the non-through hole, a plurality of connection lands for electrically connecting a plurality of light emitting elements are formed, It is preferable that a wiring board having a thick metal conductor suitable for heat dissipation of the generated heat capacity as a heat sink is formed on the bottom surface of the non-through hole. In other words, the thick metal conductor on the bottom surface of the non-through hole does not require electrical connection, and is intended for heat dissipation of the generated heat capacity, and is formed on the case case of the chip component type light emitting device and the back surface of the wiring board. The exposed heat sink can be directly contacted to efficiently dissipate heat to the housing of the chip component type light emitting device.

Further, according to the present invention, also for accomplishing the above object, the connection lands formed on an upper end peripheral portion of the Te supermarkets shaped hole in the wiring substrate is formed in the vicinity of this connection land, the upper surface after the unit was closed with a metal conductor and a second non-through hole is exposed thin metal film at the cavity, the are electrically connected to each other on the wiring board, mounting the light emitting element to te supermarkets shape hole, A wiring board is provided that is cut along substantially the center of the second non-through hole to form a terminal electrode on a side surface (end face) of the wiring board.

As described above, according to the present invention, the thick metal conductor on the bottom surface of the non-through hole on which a plurality of light emitting elements are mounted is not electrically connected, and is intended for heat dissipation of the generated heat capacity. It is possible to efficiently dissipate heat to the housing of the chip part type light emitting device by directly contacting the housing case and the heat sink exposed on the back surface of the wiring board.
Furthermore, for the purpose of spreading and opening a taper shape whose upper end surface diameter (L1) is larger than the bottom surface diameter (L2) of the non-through hole, and dissipating a large amount of light to the upper surface of the non-through hole, the inner circumference of this tapered hole Excellent effect of providing a wiring board that can obtain a high light output with a higher conversion efficiency with a reflection film made of a metal thin film having a high reflection efficiency for the light source of the light emitting element itself on the wall surface. To do.

  Further, according to the present invention, a plurality of light emitting elements are repeatedly mounted on the bottom surface of one non-through hole of a large-sized wiring board, and are divided into cutting lines and have a plurality of pairs of end face electrodes. Since it is suitable for mass production of high-density chip component type light emitting devices, it can be manufactured at a relatively low cost.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First, FIG. 1 is a cross-sectional view showing a wiring board for mounting a light emitting device according to an embodiment of the present invention.
As is clear from the drawing, the wiring board for this purpose is formed in a substantially square plate shape. Basically, the non-through hole 11 formed in the wiring board 10 is replaced with the non-through hole 11. The upper end surface diameter (L1) is wider than the bottom surface diameter (L2) of the taper shape and opens, and the inner peripheral wall surface of the tapered hole has a metal having good reflection efficiency such as gold, silver, Al, Ni, etc. A reflective film 13 made of a thin film is formed.

Further, conduction is made from the entire bottom surface of the tapered non-through hole 11 on which the light emitting element is mounted to the back surface of the wiring board 10, that is, heat is radiated by a copper foil and a plating conductor thicker than a normal copper foil (18 to 35 μm). A plate 12 is formed.
That is, the thick metal conductor having a conductor thickness of 70 μm to 300 μm is a heat radiating plate 12 for the purpose of dissipating heat generated from the light emitting element as well as mounting the light emitting element, and electrically connects the light emitting element to the bottom surface of the non-through hole 11. There is no need, and the heat sink 12 exposed on the back surface of the wiring substrate 10 can be easily brought into contact with the housing of the chip component light emitting device. (Not the anode and cathode electrodes of LED chip components).
A wiring pattern 14 such as a connection land for electrically connecting the light emitting elements is formed on the surface of the upper peripheral portion of the wiring board 10 by a metal thin film using a normal copper foil and copper plating.
As will be described in detail later, a reflective film 13 made of a metal thin film such as gold, silver, Al, or Ni is integrally formed on the surface of the thick metal conductor heat sink 12. .

As is apparent from FIG. 1, the wiring pattern 14 includes a connection land for electrically connecting the light emitting element on the surface of the upper peripheral portion of the tapered hole on the upper surface of the wiring substrate 10. , 14 are formed.
The wiring patterns 14 and 14 do not necessarily have to be electrically connected to the reflective film 13 made of a metal thin film or the heat sink 12. That is, the reflective film 13 made of a metal thin film such as gold, silver, Al, or Ni is formed only on the inner peripheral wall surface of the tapered hole of the wiring board. That is, it is preferable that the light emitting elements are electrically connected only to the connection lands and not electrically connected to the heat sink 12.
Further, the inclination angle of the tapered hole that opens from the bottom surface of the non-through hole 11 to the upper end surface is 40 ° to 75 °, and is appropriately selected depending on the depth of the tapered hole, the diameter, the light emitting position of the light emitting element, and the like. Is desirable.

  The upper end surface formed in the vicinity of the non-through hole 11 of the tapered hole is closed with a metal conductor, and the second non-through hole 41 and the connection land in which the inside of the non-through hole 11 is hollow and the metal thin film is exposed. Are connected to each other on the wiring board 10 and the light emitting element is mounted in the non-through hole 11, and then the alternate long and short dash line (X , Y), and individual wiring substrates 10 that form terminal electrodes on the side surfaces (end surfaces) of the wiring substrate by cutting along Y).

  Next, description will be given with reference to FIG. FIG. 2 shows a method for manufacturing the wiring board 10 described above, and this figure shows a cross-sectional structure at each stage of the manufacturing process of the wiring board 10.

First, for example, an insulating base 300 made of an insulating material such as an epoxy resin and having a thickness of about 0.15 mm is prepared, and adhesives (sheets) 310 and 310 having a thickness of about 25 μm are attached to both surfaces thereof. (See FIG. 2 (a)).
Thereafter, for example, a through hole 11A (for example, about φ5.0 mm) is drilled in a predetermined portion of the base material by using an NC drilling machine (see FIG. 2B).

Further, a thick copper foil 330 (100 μm) is attached to the lower surface of the adhesive 310 of the insulating base 300, and the copper foil 330 is heated to perform the main bonding, thereby lowering the lower end surface. A non-through hole 11 closed with a thick copper foil 330 is formed (see FIG. 2C).
The copper foil 330 is not electrically connected to the thick metal conductor of the bottom surface of the non-through hole, and for the purpose of heat dissipation of the generated heat capacity, the case of the chip component type light emitting device and the wiring board A relatively thick copper foil having a thickness of about 70 to 300 [mu] m is preferable.

Then, a through hole 4A (for example, about 0.6 mm) is formed by NC (hole drilling machine) in the vicinity of the non-through hole 11 of the wiring board in order to form the terminal electrode 40 at a predetermined portion of the base material. Then, a copper foil 320 having a normal thickness (18 to 35 μm) to be a connection land or a wiring pattern is heated and pressure-bonded on the surface of the insulating base material 300 on the adhesive 310. In other words, a non-through hole whose upper end surface is closed by the copper foil 320 is formed.
In addition, when the insulating base material 300 in which the copper foil 320 is laminated on the upper surface is used and the insulating material is thin, laser drilling is performed from a predetermined lower surface side of the base material, and the upper end surface is made of the copper foil 320. A closed non-through hole 41 may be formed.
For example, the insulating base 300 has a thickness of about 0.15 mm (150 μm), the adhesive (sheet) 310 on both sides has a thickness of about 25 μm × 2 (see FIG. 2A), and the heat sink copper on the lower end surface. If the thickness of the foil 330 is 250 μm, 50% of the total thickness of the wiring board including the metal conductor on the lower end surface becomes the heat sink on the lower end surface.

  Next, a copper plating layer 340 having a thickness of about 20 μm is applied to the entire insulating base 300 prepared above (see FIG. 2E). Thereafter, necessary metal conductor circuits (wiring patterns 14 and 14) are formed on both surfaces of the insulating base 300 by exposure, development, etching, and the like, and the upper end surface is closed with a copper foil or a copper plating layer. A through hole 41 is formed. (Refer to FIG. 2 (f)), and further, gold plating with a thickness of about 0.3 μm is applied on the Ni (about 5 μm) as a base (not shown).

The terminal electrode 40 is formed by cutting the upper end surface at substantially the center of the non-through hole 41 closed with a copper foil or a copper plating layer. After the light emitting element is mounted in the non-through hole 11, the mold resin is used. The top surface of the light emitting element or the wiring board is resin-sealed and cut at the approximate center of the through-conduction hole to obtain a chip component type light emitting device including the terminal electrode 40. The non-through hole 41 is preferably formed as a second non-through hole whose upper end surface is closed with a metal conductor such as a copper foil or a copper plating layer so that the sealing resin does not enter from above.
The second non-through hole is desirably formed in the vicinity of the non-through hole 11 for mounting the light emitting element and the wiring pattern 14 such as a connection land for electrically connecting the light emitting element.

As shown also in FIG. 3 attached, a highly heat-conductive solder paste is interposed on the heat sink 12 provided on the bottom surface of the non-through hole 11 formed in the substantially central portion of the wiring substrate 10 constituting the substrate. The plurality of light emitting diodes 30 are fixed at predetermined positions. In other words, the adhesive material such as paste for mounting the light emitting diodes 30 and 30 is not necessarily a conductive material, but an adhesive material containing Al, Cu, Zn, Ni or the like having a high thermal conductivity and a high heat resistance is selected. do it.
Thereafter, for example, wiring is performed by wire bonding. At that time, a large number of wiring patterns 14 and 14 for wiring with the light emitting diodes are arranged in the periphery of the non-through hole 11 whose upper surface is opened in the wiring substrate 10, and a plurality of light emitting diodes 30, Each of the electrodes 30... Is wired by wire bonding between these wiring patterns (connection lands) 14, 14. In FIG. 3 as well, the wired wires are indicated by reference numeral 15.

  As described above, according to the configuration of the wiring board, a plurality of light emitting diodes 30, 30... Can be mounted in the non-through hole 11 formed at a substantially central portion of the wiring board 10. The chip component type light-emitting device can be used as a light source for, for example, a mobile phone, a display panel, a backlight of a liquid crystal display device, and a lighting device.

  Further, as shown in FIG. 3, the bottom surface of the non-through hole 11 opened on the top surface of the wiring substrate 10 constituting the wiring substrate and the inner peripheral surface thereof, as described above, over the entire surface. A noble metal plating layer composed of a nickel (Ni) layer and a gold (Au) layer is applied, and a reflective film 13 composed of a silver (Ag) layer (thickness of about 1 μm) is formed on the surface. Therefore, the light emitted from the plurality of light emitting diodes 30, 30... Provided inside the non-through hole 11 of the wiring board 10 is reflected by the reflective film 13 and does not leak unnecessarily. The light emission is led out from the upper part of the non-through hole 11 that is open to the top. That is, if the tapered non-through hole 11 is used, a high light output from the plurality of light emitting elements can be obtained with high conversion efficiency.

Also, as shown in FIG. 4 above, in order to simultaneously manufacture a large number of chip component type light emitting devices, a large-sized wiring board 1 in which a large number of wiring boards 10 are integrally connected is created using a substrate having a large surface area. To do. 4 are cutting lines that divide a large number of individual wiring boards 10 from the large-sized wiring board 1.
In particular, the alternate long and short dash lines X and Y indicate that after the light emitting element is mounted in the non-through hole 11, the terminal electrode is divided and cut along substantially the center of the second non-through hole 41 to separate the terminal electrodes from the side surfaces ( (End face). (This figure shows the case where terminal electrodes are formed on four sides.)

The connection land for wire bonding with the metal thin film on the upper end surface of the second non-through hole 41 in which the upper end surface formed in the vicinity of the non-through hole 11 is closed with a metal thin film is wired by a wiring pattern. And the wiring board 10 which cut | disconnects along the approximate center of the said 2nd non-through-hole 41 and forms the terminal electrode 40 in each end surface of a wiring board is provided.
In this figure, only four second non-through holes 41 are shown for one wiring board 10, but when a plurality of light emitting elements are mounted in one non-through hole 11, a plurality of second non-through holes 41 are displayed. These non-through holes 41 are arranged in many pairs on many faces to form a multiple pairs of terminal electrodes 40.

  In the various embodiments described above, the non-through hole 11 or the second non-through hole 41 opened in the wiring board 10 has been described as being circular. However, the present invention is limited only to this. However, it may be formed into an oval, an ellipse, or a rectangle, for example. In this case, it is obvious that the same effect as described above can be obtained. Further, in the above embodiment, when the through hole 11A is formed in the base material of the wiring board 10 (see FIG. 2B), for example, by using a taper drill or the like, the inner peripheral surface thereof is changed. It is also possible to form it with an inclination.

It is sectional drawing which shows the wiring board for mounting the light emitting element of this invention. It is process drawing for showing the manufacturing method of the said wiring board, and shows the cross-sectional structure in each step of the manufacturing process. It is sectional drawing which shows the structure of the chip component type light-emitting device which mounts a several light emitting element on the board | substrate obtained by the above. It is a top view which divides many wiring boards from a wiring board of a large board version.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Wiring board, 11 ... Non-through-hole, 12 ... Heat sink, 13 ... Reflection film, 14 ... Wiring pattern, 30 ... Light emitting diode, 40 ... End surface electrode, 41 ... Non-through-hole.

Claims (2)

A wiring board for a chip component type light emitting device in which a light emitting element is mounted on an inner bottom portion of a non-through hole of an insulating substrate, and a non-through hole for mounting the light emitting element on a part of the wiring board is located upward In addition to being formed open, the upper end face diameter (L1) is larger than the bottom face diameter (L2) of this non-through hole and opens in a tapered shape, and the inner peripheral wall surface of this tapered hole is a reflection made of a metal thin film. A film is formed, a connection land for electrically connecting the light emitting element is formed on the surface of the upper peripheral portion of the tapered hole of the wiring board, and a light emitting element is formed on the bottom surface of the tapered hole. mounted, the back-surface heat-dissipating plate of the metal conductor of the chip-type light emitting device in thickness 70μm~300μm that directly contact the housing case is formed by exposing the bottom surface and the back surface of the non-through hole, wherein The heat sink is the light emitting element and A wiring board for a chip-part light emitting device, which is not electrically connected to a connection land. 2. The connection land formed in the periphery of the upper end of the tapered hole of the wiring board, and the upper end surface formed in the vicinity of the connection land is closed with a metal conductor, the inside is hollow, and the metal thin film is exposed. The second non-through holes are electrically connected to each other on the wiring board, and after mounting the light emitting element in the tapered hole, the terminals are cut along substantially the center of the second non-through holes. An electrode is formed on a side surface of a wiring board. A wiring board for a chip component type light emitting device .

Images