JP2011025220A - Template treatment apparatus, imprint system, template treatment method, program, and computer memory medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly form a coating on a film of a releasing agent formed on the surface of a template. <P>SOLUTION: The template treatment apparatus 1 has a configuration composed by integrally connecting a template carry-in and carry-out station 2 and a treatment station 3. The template carry-in and carry-out station 2 can hold a plurality of templates T and carry-in and carry-out the templates T to the treatment station 3. The treatment station 3 transports the templates T along a transport line A. In the transport line A, a pre-washing unit 21, a releasing agent coating unit 22, a heating unit 23, a temperature adjustment unit 24, a rinsing unit 25, and a resist coating unit 26 for carrying out prescribed treatments for the templates T during the transportation are arranged in the order in the transportation direction of the templates T. In the resist coating unit 26, a resist solution is supplied to the surfaces of the templates T and resist films are formed on the surfaces of the templates T by using a squeezee. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a template processing apparatus in which a transfer pattern is formed on the surface of a template and a coating film is formed on a release agent formed on the surface, an imprint system including the template processing apparatus, and the template processing apparatus The present invention relates to a template method, a program, and a computer storage medium.

  For example, in a semiconductor device manufacturing process, for example, a photolithography process is performed on a semiconductor wafer (hereinafter referred to as “wafer”) to form a predetermined resist pattern on the wafer.

  When the resist pattern described above is formed, the resist pattern is required to be miniaturized in order to achieve higher integration of the semiconductor device. In general, the limit of miniaturization in the photolithography process is about the wavelength of light used for the exposure process. For this reason, it has been advancing to shorten the wavelength of exposure light. However, there are technical and cost limitations to shortening the wavelength of the exposure light source, and it is difficult to form a fine resist pattern on the order of several nanometers, for example, only by the method of advancing the wavelength of light. is there.

  Therefore, in recent years, it has been proposed to form a fine resist pattern on a wafer using a so-called imprint method instead of performing a photolithography process on the wafer (Patent Document 1). In this imprint method, a template T (sometimes called a mold or a mold) in which a fine transfer pattern C is formed on the surface and a release agent S is formed on the surface as shown in FIG. Used.

JP 2009-43998 A

  In the imprint method described above, first, as shown in FIG. 25A, in the resist pattern formed on the wafer W, a portion corresponding to the convex portion (a portion corresponding to the concave portion in the transfer pattern C of the template T). The amount of the resist solution applied to the transfer pattern C is large, and the amount of the resist solution applied to the portion corresponding to the concave portion (the portion corresponding to the convex portion in the transfer pattern C) is reduced, that is, the aperture ratio of the transfer pattern C Accordingly, a resist solution is applied on the wafer W, and a resist film R is formed. Then, as shown in FIG. 25B, the template T on which the release agent S is formed is pressed against the resist film R, the transfer pattern C is transferred, and the resist pattern P is formed. At this time, the resist film R is irradiated with light, and the resist film R is photopolymerized. Thereafter, as shown in FIG. 25C, the template T is raised, and a resist pattern P is formed on the wafer W.

  However, in the method shown in FIG. 25, first, as shown in FIG. 25A, it is necessary to form the resist film R accurately at a predetermined position on the wafer W. For this reason, when applying the resist solution on the wafer W, it is necessary to apply the resist solution, for example, to accurately align the resist solution nozzle and the wafer W. Further, when transferring the transfer pattern C of the template T as shown in FIG. 25B, the resist film R formed by applying a resist solution on the wafer W according to the aperture ratio, and the transfer of the template T. If the alignment with the pattern C is not achieved, the transfer pattern C is not accurately transferred to the resist film R. Therefore, in the above-described imprint method, it is necessary to perform alignment with high accuracy twice during the formation of the resist film R and during pattern transfer. For this reason, it takes time for alignment, which hinders throughput improvement. In addition, since it is necessary to perform the alignment a plurality of times, an error for each alignment is superimposed, resulting in a problem that high-precision alignment becomes difficult.

  In this regard, the inventors diligently studied to shorten the time required for alignment, and found, for example, the following method.

  As shown in FIG. 26A, first, a resist solution is applied on a template T on which a release agent S is formed to form a resist film R. Next, as shown in FIG. 26B, the template T on which the resist film R is formed is raised and pressed against the wafer W, and the resist film R is irradiated with light to photopolymerize the resist film R. Thereafter, the template T is lowered to form a resist pattern P on the wafer W, as shown in FIG.

However, in the method shown in FIG. 26, the resist solution is applied to the template T in a state where the release agent S is formed and the liquid repellency is increased. that resist solution R ₁ does not enter into the recess portion U of the transfer pattern C as shown, a new problem arises. In this case, it will remain in the interior of the resist solution R ₁ is recess U in the form of droplets, the shape of the droplet from being directly transferred to the resist pattern P on the wafer W, the predetermined on the wafer W The resist pattern P cannot be formed properly.

  The present invention has been made in view of the above points, and an object of the present invention is to appropriately form a coating film on a release agent formed on the surface of a template and to eliminate alignment during pattern transfer.

  In order to achieve the above object, the present invention provides a template processing apparatus in which a transfer pattern is formed on the surface of a template, and a coating film is formed on a release agent formed on the surface. And a template loading / unloading station capable of holding a plurality of the templates and loading / unloading the templates to / from the processing station. And a coating liquid supply section that pushes the coating liquid applied onto the mold release agent into the recess of the template transfer pattern.

  According to the present invention, in the processing station, the coating liquid coated on the template release agent can be pushed into the depression of the template transfer pattern by the coating liquid filling section. That is, the coating liquid can be filled in the depressions of the template transfer pattern without gaps. Therefore, when forming a predetermined pattern on the substrate using the template on which the coating liquid is formed in this way, it is possible to form the predetermined pattern on which the transfer pattern of the template is appropriately transferred on the substrate.

  Further, when a pattern is formed on a substrate using a template on which a coating solution is formed, alignment adjustment between the coating film on the substrate and the transfer pattern of the template, which has been conventionally performed, becomes unnecessary. Therefore, throughput can be improved.

  The processing station may further include a release agent film formation block that forms a release agent film on the surface of the template.

  The coating liquid filling unit may be a squeegee.

  Further, the coating liquid filling unit may be a roller or a brush.

  The surface of the coating liquid filling portion that comes into contact with the coating liquid may be subjected to a liquid repellent treatment.

  A filter may be disposed on the upper surface of the coating liquid applied on the mold release agent, and the coating liquid filling unit may push the coating liquid into the recess through the filter.

  In addition, a filter capable of penetrating the coating liquid is disposed on the release agent, the coating liquid is supplied onto the filter, and the coating liquid filling unit passes the coating liquid through the filter. You may push into a hollow part.

  The processing station has a stamp supplied with a coating liquid on its surface instead of the coating liquid supply section and the coating liquid filling section, and the pushing of the coating liquid into the depression of the transfer pattern is performed by You may carry out by pressing a stamp on the said transfer pattern. In such a case, the surface of the stamp may be subjected to a liquid repellent treatment.

  The plurality of templates may be held by one holder.

  Another aspect of the present invention is an imprint system including the template processing apparatus, wherein the transfer pattern is transferred to a coating film formed on a substrate using the template processed in the processing station. And an imprint unit that forms a predetermined pattern on the coating film, and a substrate carry-in / out station that can hold a plurality of the substrates and carries the substrate into and out of the imprint unit.

  Another aspect of the present invention is a template processing method in which a transfer pattern is formed on the surface of a template using a template processing apparatus, and a coating film is formed on a release agent formed on the surface. A coating liquid is applied on the mold release agent, and the coating liquid applied on the mold release agent is pushed into a recess portion of the transfer pattern of the template.

  In the template processing apparatus, a release agent may be formed on the surface of the template.

  The application liquid may be pushed into the depression of the template transfer pattern using a squeegee.

  Also, the application liquid may be pushed into the depression of the template transfer pattern using a roller or a brush.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to the present invention, the coating film can be appropriately formed on the release agent formed on the template surface.

It is a top view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a perspective view of a template. It is a side view which shows the outline of a structure of a transition unit. It is a longitudinal cross-sectional view which shows the outline of a structure of each processing unit of a conveyance line. It is a longitudinal cross-sectional view which shows the outline of a structure of each processing unit of a conveyance line. It is a cross-sectional view which shows the outline of a structure of a resist application unit. It is explanatory drawing which showed typically the state of the template in the formation process of a resist film, (a) shows a mode that the resist solution was supplied to the surface of a template, (b) is a resist solution in a hollow part with a squeegee. FIG. 3C shows a state where the resist film is formed on the surface of the template. It is the flowchart which showed each process of the template process. It is explanatory drawing which showed typically the state of the template in each process of mold release agent processing and resist film film formation, (a) shows a mode that the surface of the template was wash | cleaned, (b) is the surface of a template. (C) shows a state in which the release agent on the template is baked, (d) shows a state in which the release agent is formed on the template, (e) ) Shows how the resist solution is supplied onto the template, (f) shows how the resist solution is pushed into the recess by the squeegee, and (g) shows how the resist film is formed on the template. . It is explanatory drawing which showed typically a mode that a resist liquid was pushed in the hollow part with the roller. It is explanatory drawing which showed typically a mode that a resist liquid was pushed into the hollow part with the brush. It is explanatory drawing which showed typically a mode that a filter was arrange | positioned on the upper surface of a resist liquid, and a resist liquid was pushed in into a hollow part. It is explanatory drawing which showed typically the state by which the resist liquid was supplied to the filter arrange | positioned on the template. It is a top view which shows the outline of a structure of the template processing apparatus concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of a stamp unit. It is explanatory drawing which showed typically the state of the template and stamp in each process of resist film formation, (a) shows a mode that a resist liquid is apply | coated to the surface of a stamp, (b) shows a stamp on a template. FIG. 2C shows a state where the resist film is formed on the template. It is a top view of a holder. It is a longitudinal cross-sectional view of a holder. It is a top view which shows the outline of a structure of the imprint system concerning this Embodiment. It is a cross-sectional view which shows the outline of a structure of an imprint unit. It is a longitudinal cross-sectional view which shows the outline of a structure of the imprint unit. It is the flowchart which showed each process of the imprint process. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) shows a mode that the template was pressed on the wafer, (b) photopolymerized the resist film on a wafer. (C) shows a state where a resist pattern is formed on the wafer, and (d) shows a state where a remaining film on the wafer is removed. It is a top view which shows the outline of a structure of the imprint system concerning other embodiment. It is explanatory drawing which showed typically the state of the template and wafer in each process of the conventional imprint process, (a) shows a mode that the resist liquid was apply | coated on the wafer, (b) is the resist on a wafer. A state in which the film is photopolymerized is shown, and (c) shows a state in which a resist pattern is formed on the wafer. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) shows a mode that the resist film was formed into a film, (b) shows the resist film on a wafer. A state in which photopolymerization is performed is shown, and (c) shows a state in which a resist pattern is formed on the wafer. It is explanatory drawing which shows typically a mode that the resist liquid was supplied to the surface of the template.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view schematically showing the configuration of the template processing apparatus 1 according to the present embodiment.

In the template processing apparatus 1 of the present embodiment, a template T having a rectangular parallelepiped shape and having a predetermined transfer pattern C formed on the surface is used as shown in FIG. Hereinafter, the transfer pattern C means the side of the template T which is formed with the surface T _1, the surface T ₁ opposite to the surface of the backside T _2. For the template T, a transparent material that can transmit visible light, near ultraviolet light, ultraviolet light, or the like, such as glass, is used.

Template processing unit 1 includes a plurality as shown in FIG. 1, for example, five of the template T or transferring, between the outside and the template processing apparatus 1 with the cassette unit, carrying out a template T the template cassette C _T The template loading / unloading station 2 and the processing station 3 including a plurality of processing units for performing predetermined processing on the template T are integrally connected.

The template loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 can mount a plurality of template cassettes _{CT in a line} in the X direction (vertical direction in FIG. 1). That is, the template carry-in / out station 2 is configured to be capable of holding a plurality of templates T.

The template carry-in / out station 2 is provided with a template carrier 12 that can move on a conveyance path 11 extending in the X direction. The template transport body 12 is also movable in the vertical direction and the vertical direction (θ direction), and can transport the template T between the template cassette _CT and the processing station 3.

  The processing station 3 includes a transport line A for the template T. In the processing station 3, the transfer line A is arranged on the front side (X direction negative direction side in FIG. 1) and extends in the Y direction, and a line extending in the X direction at the end opposite to the template loading / unloading station 2. A2 and a line A3 extending in the Y direction on the back side (X direction positive direction side in FIG. 1) are connected in this order. A plurality of transfer rollers 30 to be described later are arranged side by side on the transfer line A, and the template T can be transferred by roller transfer. That is, the template T transferred from the template loading / unloading station 2 to the processing station 3 is sequentially transferred along the lines A1, A2, and A3.

The line A1, in order from the template carry-out station 2 side, the transition unit 20 for passing the template T, the pre-cleaning unit release agent on the template T is to clean the surface T ₁ of the before the deposition 21 A mold release agent coating unit 22 for applying a liquid mold release agent to the template T and a heating unit 23 for heating the template T are arranged in a row.

  A temperature adjustment unit 24 for adjusting the temperature of the template T is disposed in the line A2.

  In line A3, in order toward the template loading / unloading station 2 side, a rinsing unit 25 for rinsing the release agent on the template T, a resist application unit 26 for applying a resist solution on the release agent of the template T, and a transition unit 27 are arranged in a line. In the present embodiment, the processing units 21 to 25 form a release agent film forming line (release agent film forming block).

  Next, the transport mechanism for the template T in the transport line A described above will be described. In the transport line A, as shown in FIGS. 3 to 5, a plurality of transport rollers 30 are arranged in the direction along the transport line A. Each conveyance roller 30 is configured to be rotatable about a central axis extending in a direction perpendicular to the direction along the conveyance line A as a rotation axis. In addition, among the plurality of transfer rollers 30, at least one transfer roller 30 is provided with a drive mechanism (not shown) including a motor, for example. The template T is transported between the transition units 20 and 27 on the transport rollers 30.

  Next, the structure of the transition units 20 and 27 of the conveyance line A described above will be described. As shown in FIG. 3, the transition unit 20 of the transport line A has lifting pins 40 for supporting and lifting the template T from below. The raising / lowering pin 40 can be moved up and down by the raising / lowering drive part 41 provided under the conveyance roller 30. Further, the elevating pins 40 are arranged so as to be inserted between the plurality of conveying rollers 30 arranged side by side along the conveying line A. With the elevating pins 40, the template T is placed on the transfer roller 30 from the template transfer body 12.

  Note that the configuration of the transition unit 27 is the same as the configuration of the transition unit 20 described above, and a description thereof will be omitted.

  Next, the structure of each processing unit 21-26 of the conveyance line A mentioned above is demonstrated based on FIG.4 and FIG.5. The transport line A is bent in the direction perpendicular to the line A2 as shown in FIG. 1, but is shown in a straight line in FIG. 4 in order to give priority to the understanding of the configuration. .

  As shown in FIGS. 4 and 5, the conveyance line A is provided with a casing 50. The inside of the casing 50 is partitioned by a plurality of partition walls 51, and the partitioned spaces constitute processing units 21 to 26, respectively. On the side surfaces of the partition wall 51 and the casing 50 on the side of the transition units 20 and 27, a loading / unloading port 52 for the template T is formed at a height corresponding to the transfer roller 30. Each loading / unloading port 52 may be provided with an open / close shutter (not shown) so that the inside of each processing unit 21 to 26 can be sealed.

As shown in FIG. 4, the pre-cleaning unit 21 has an ultraviolet irradiation unit 60 that irradiates the template T with ultraviolet rays. The ultraviolet irradiation unit 60 is disposed above the transport roller 30 and extends in the width direction of the template T (longitudinal direction of the transport roller 30). Then, the entire surface T ₁ of the template T is irradiated with ultraviolet rays by irradiating the surface T ₁ of the template T being conveyed on the conveyance roller 30 with ultraviolet rays.

The release agent application unit 22 has a release agent nozzle 61 as a release agent supply unit that supplies the release agent onto the template T. The release agent nozzle 61 is disposed above the conveying roller 30. The release agent nozzle 61 extends in the width direction of the template T, and a slit-like supply port (not shown) is formed on the lower surface thereof. Then, by supplying a release agent to the surface T ₁ from the release agent nozzle 61 of the template T being conveyed to conveying roller 30 above, the release agent is applied to the entire surface of the surface T _1. The release agent application unit 22 is connected to a discharge pipe (not shown) for collecting and discharging the release agent dropped from the template T and an exhaust pipe (not shown) for exhausting the internal atmosphere. Yes. Note that a material having a liquid repellency with respect to a resist film on the wafer, which will be described later, such as a fluororesin, is used as the material of the release agent.

The heating unit 23 has a hot plate 62 disposed above the transfer roller 30. For example, a heater that generates heat by power feeding is provided inside the hot plate 62, and the hot plate 62 can be adjusted to a predetermined set temperature. The heat plate 62 extends in the width direction of the template T, can be heated template T being conveyed to conveying roller 30 above the surface T ₁ side (transfer pattern C side). The heating unit 23 is connected to an exhaust pipe (not shown) that exhausts the internal atmosphere. In the example shown, the heating plate 62 is heated template T from the surface T ₁ side, may be heated to template T from the back T ₂ side. That is, the hot plate may be arranged at the same height as the conveying roller 30 or may be arranged below the conveying roller 30. Furthermore, by both placing these hot plate, the template T may be heated from the both surfaces T ₁ and back T _2.

In the temperature adjustment unit 24, a part of the conveyance roller 30 constitutes a temperature adjustment roller 30a. Cooling water for cooling the template T circulates inside the temperature adjusting roller 30a. Further, a gas supply unit 63 that blows an inert gas such as nitrogen or a gas gas such as dry air downward is disposed above the transfer roller 30. Gas supply unit 63 extends in the width direction of the template T, it is possible to blow air gas on the surface T ₁ entire template T being conveyed. The template T is adjusted to a predetermined temperature by the temperature adjusting roller 30a and the gas supply unit 63. The temperature control unit 24 is connected to an exhaust pipe (not shown) that exhausts the internal atmosphere.

As shown in FIG. 5, the rinsing unit 25 includes a rinsing liquid nozzle 64 for supplying an organic solvent as a rinsing liquid for the release agent onto the template T, and an inert gas such as nitrogen or dry air on the template T. A gas nozzle 65 for blowing a gas gas. The rinsing liquid nozzle 64 and the gas nozzle 65 are arranged above the conveying roller 30 in this order from the temperature adjustment unit 24 side. Moreover, the rinse liquid nozzle 64 and the gas nozzle 65 are each extended | stretched in the width direction of the template T, and the slit-shaped supply port (not shown) is formed in the lower surface, respectively. Then, the release agent on the template T being conveyed on the conveyance roller 30 can be rinsed by the rinsing liquid nozzle 64, and then the surface T ₁ of the rinsed template T can be dried by the gas nozzle 65. The rinse unit 25 is connected to a discharge pipe (not shown) for collecting and discharging the organic solvent dropped from the template T and an exhaust pipe (not shown) for exhausting the internal atmosphere.

  The resist coating unit 26 is pressed against a resist solution nozzle 70 serving as a coating solution supply unit that supplies a resist solution as a coating solution onto the mold release agent of the template T, and the resist solution coated on the release agent, A squeegee 71 is provided as a coating solution filling portion for pushing the resist solution into the depression of the transfer pattern C of the template T. The resist solution nozzle 70 and the squeegee 71 are disposed above the transfer roller 30. As shown in FIG. 6, a rail 72 extending along the X direction (vertical direction in FIG. 6) is provided on the Y direction positive direction (right direction in FIG. 6) side in the casing 50. An arm 73 is attached to the rail 72, and the resist coating nozzle 70 is supported by the arm 73.

  For example, an inkjet type nozzle is used as the resist solution nozzle 70, and a plurality of supply ports (not shown) formed in a line along the longitudinal direction are formed below the resist solution nozzle 70. The resist solution nozzle 70 can strictly control the resist solution supply timing, the resist solution supply amount, and the like.

  The arm 73 is movable on the rail 72 by an arm driving unit 74. As a result, the resist solution nozzle 70 can move from the standby portion 75 installed outside the casing 50, for example, on the positive side in the X direction, to above the template T on the transfer roller 30. Can move in the X direction on the surface. The arm 73 can be moved up and down by a nozzle driving unit 74 and the height of the resist solution nozzle 70 can be adjusted.

  Further, a rail 76 extending in the X direction (up and down direction in FIG. 6) is similarly provided on the Y direction negative direction (left direction in FIG. 6) side in the casing 50. An arm 77 is attached to the rail 76, and the squeegee 71 is supported by the arm 77. The arm 77 is movable on the rail 76 by an arm driving unit 78. A standby unit 79 is installed outside the casing 50 on the X direction negative direction side. Since the operation of the arm 77 and the like is the same as that of the above-described arm 71 and the like, description thereof will be omitted.

  The surface of the squeegee 71 that comes into contact with the resist solution is subjected to a liquid repellent treatment with a material having liquid repellency with respect to the resist solution, such as a fluororesin. As the liquid repellent treatment, the surface of the squeegee 71 is not coated with a liquid repellent material, but the squeegee 71 itself may be formed of a material having liquid repellency, such as polyurethane.

In the resist coating unit 26, the resist solution R ₁ is supplied from the resist solution nozzle 70 onto the release agent S formed on the surface T _{1 of the} template T. At this time, as shown in FIG. 7A, the resist solution R ₁ does not completely enter the recess U of the transfer pattern C of the template T due to the water repellency of the release agent S, Stay in the state of. Then, pressing the squeegee 71 in the resist solution R _1, is moved in the positive direction in the X-direction of FIG. 6 in a state of pressing the squeegee 71 to resist liquid as shown in FIG. 7 (b), the squeegee 71 of the template T By pushing the resist solution R ₁ into the recess U of the transfer pattern C, the recess R is filled with the resist solution R ₁ without a gap. Thus, a resist film R is formed on the release agent S as shown in FIG. In FIG. 7, had been pushing the resist solution R ₁ while moving the squeegee 71 moves, for example, by carrying rollers 30 a template T in the positive direction in the X-direction of FIG. 6 (upward direction in FIG. 6) By doing so, the template T can be moved relative to the squeegee 71 even when the position of the squeegee 71 is fixed. Therefore, the squeegee 71 is not necessarily configured to be movable. . In this case, the rail 76 becomes unnecessary. In addition, as with the squeegee 71, the rail 72 is not necessarily required for the resist solution nozzle 70 as well.

  The template processing apparatus 1 is provided with a control unit 100 as shown in FIG. The control unit 100 is, for example, a computer and has a program storage unit (not shown). The program storage unit controls the transfer of the template T between the template loading / unloading station 2 and the processing station 3, the operation of the drive system in the processing station 3, and the like. The program that executes is stored. This program is recorded in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), memory card, or the like. Or installed in the control unit 100 from the storage medium.

  The template processing apparatus 1 according to the present embodiment is configured as described above. Next, in the template processing apparatus 1, the release agent S is formed on the template T, and the formation of the resist film R on the release agent S will be described. FIG. 8 shows the main processing flow of this template processing, and FIG. 9 shows the state of the template T in each step.

First, the template carrier 12, the template T is taken from the template cassette C _T on the cassette mounting table 10, (step G1 of Fig. 8) to be conveyed to the transition unit 20 in the processing station 3. At this time, in the template cassette C _T, the template T, the surface T ₁ of the transfer pattern C is formed is accommodated so as to face upward, the template T in this state is conveyed to the transition unit 20.

  The template T transported into the transition unit 20 is placed on the transport roller 30 by the lifting pins 40 and transported along the transport line A by roller transport at a predetermined speed. In the transfer line A, the transfer unit A, the pre-cleaning unit 21, the release agent application unit 22, the heating unit 23, the temperature adjustment unit 24, the rinse unit 25, the resist application unit 26, and the transition unit 27 are sequentially transferred to each processing unit. In 21 to 26, a predetermined process is performed on the template T being conveyed.

That is, in the transport line A, first, in the pre-cleaning unit 21, ultraviolet rays are irradiated from the ultraviolet irradiation unit 60 on the template T, the surface T ₁ of the template T is cleaned as shown in FIG. 9 (a) (FIG. Step 8 G2). Subsequently, the release agent coating unit 22 supplies the release agent S on the template T from the release agent nozzle 61, a release agent to the surface T ₁ the entire surface of the template T as shown in FIG. 9 (b) S Is applied (step G3 in FIG. 8). Thereafter, in the heating unit 23, the template T is heated to, for example, 200 ° C. by the hot plate 62, and the release agent S on the template T is baked as shown in FIG. 9C (step G4 in FIG. 8). Thereafter, in the temperature adjustment unit 24, the template T is adjusted to a predetermined temperature by the temperature adjustment roller 30 a and the gas supply unit 63. Thereafter, in the rinsing unit 25, an organic solvent is supplied to the template T from the rinsing liquid nozzle 64, and only the unreacted portion of the release agent S on the template T is peeled off. Thus, as shown in FIG. 9D, the release agent S along the transfer pattern C is formed on the template T (step G5 in FIG. 8). Subsequently, in the rinsing unit 25 blows air gas on the template T from the gas nozzle 65, the surface T ₁ is is dried. The unreacted part of the release agent S means a part other than the part where the release agent S chemically reacts with the surface T _{1 of the} template T and adsorbs to the surface T ₁ .

Thereafter, when the template T is transported to the resist coating unit 26, the resist solution nozzle 70 is moved in the X direction of FIG. 6, and the release agent S on which the template T is formed is applied as shown in FIG. supplying a resist solution _{R 1} (step G6 in FIG. 8). At this time, the control unit 100 controls the supply timing, supply amount, and the like of the resist solution R ₁ supplied from the resist solution nozzle 70. That is, in the transfer pattern C of the template T, the amount of the resist solution R ₁ applied to a portion formed on the convex portion (portion corresponding to the recess in the resist pattern formed on the wafer W) is small, the recessed portion U the amount of the resist solution R ₁ applied to the corresponding portion (portion corresponding to the convex portion of the resist pattern) in is controlled to be larger. Thus, the resist solution R ₁ is applied on the wafer W in accordance with the aperture ratio of the transfer pattern C.

When the resist solution R ₁ is applied onto the template T, the squeegee 71 is moved in the X direction in FIG. 6 with the squeegee 71 pressed against the resist solution R ₁ as shown in FIG. pushing the resist solution R ₁ of the recess portion U of the transfer pattern C. As a result, as shown in FIG. 9G, a resist film R is formed on the release agent S on the template T (step G7 in FIG. 8).

Thereafter, the template T carried to the transit unit 27 is delivered to the template carrier 12 by the lifting pins 40, and returned to the template cassette C _T (step in FIG. 8 G8). Thus, a series of release agent processing in the template processing apparatus 1 is completed.

According to the above embodiment, after the resist solution R ₁ is supplied onto the release agent S formed on the surface T ₁ of the template T in the resist coating unit 26, the resist solution R _{1 is} applied to the template T by the squeegee 71. The resist solution R ₁ can be filled in the recess U without any gap, and the resist film R can be formed on the release agent S by being pushed into the recess U of the transfer pattern C. Therefore, when a predetermined resist pattern is formed on the resist film on the wafer using the template T, a predetermined pattern in which the transfer pattern C of the template T is appropriately transferred can be formed on the wafer. Note that the operation, effect, and the like in the case of forming a predetermined resist pattern on the wafer using the template T will be described in detail later.

  Further, when a pattern is formed on the wafer using the template T on which the resist film R is formed, alignment adjustment between the resist film R on the wafer and the transfer pattern C of the template T, which has been conventionally performed, becomes unnecessary. Therefore, the throughput of wafer processing can be improved.

  Furthermore, since the template loading / unloading station 2 can hold a plurality of templates T, the template T can be continuously transferred from the template loading / unloading station 2 to the processing station 3. Further, in the processing station 3, the template T is roller-transferred to the various processing units 21 to 27 arranged on the transfer line A by the plurality of transfer rollers 30, and a predetermined process is performed on the template T being transferred. Therefore, predetermined processing can be continuously performed on the plurality of templates T. Therefore, the resist film R can be continuously formed on the plurality of templates T.

Here, the template T has a thickness of 6.35 mm, for example. According to the present embodiment, since the heating plate 62 is arranged above the transfer roller 30, that is, on the transfer pattern C side (surface T ₁ side) of the template T in the heating unit 23, the surface of the template T From the T ₁ side, the release agent S on the surface T ₁ can be directly heated. Therefore, regardless of the thickness of the template T, the release agent S can be efficiently heated and fired. Further, even when the heating plate 62 is disposed below the template T, it is possible to efficiently heat the release agent S from the back T ₂ side of the template T by thermal conduction.

Further, since the surface of the squeegee 71 that comes into contact with the resist solution R ₁ is subjected to a liquid repellent treatment, the resist solution R ₁ can be prevented from adhering to the squeegee 71.

Further, in the above embodiment, the squeegee 71 is used as the coating liquid filling portion to be pushed into the recess U of the transfer pattern C of the template T. However, the coating liquid filling portion is not limited to the squeegee 71, and the resist as long as the liquid R ₁ can form a resist film R pushing the recess U of the transfer pattern C, may also be used such as roller 101 and brush 102 as shown in FIG. 10 and FIG. 11 for example. Even such a case, the surface in contact with the resist solution R ₁ are preferably subjected to liquid repellent treatment.

In the above embodiment, the squeegee 71 is pressed directly against the resist solution R ₁ applied to the template T. However, as shown in FIG. 12, for example, the upper surface of the resist solution R ₁ applied to the template T. to place the liquid-repellent treated filter F1, or by pressing a squeegee 71 via the filter F to the resist solution R _1. By doing so, adhesion of the resist solution R ₁ to the squeegee 71 can be further suppressed. In addition, for example, particles attached to the squeegee 71 can be prevented from attaching to the template T side.

In place of the filter F1, for example, as shown in FIG. 13, place the filter F2 to the upper surface of the release agent S which is formed on the surface T ₁ of the template T, the resist solution R ₁ on the upper surface of the filter F2 After coating, the resist film R may be formed by the squeegee 71. In such a case, the filter F2, the surface capable permeate repellent treated and the resist solution R ₁ is used. By applying a resist solution R ₁ on the upper surface of the filter F2, it is possible to prevent the dust from adhering to the resist film R is formed on the surface T ₁ of the template T.

  In the above embodiment, the application of the release agent S on the template T and the heating of the template T are performed in separate processing units (the release agent application unit 22 and the heating unit 23). The processing unit may be used. That is, the release agent nozzle 61 and the hot plate 62 described above may be arranged in this order in the direction along the transport line A in one processing unit.

In the above embodiment, the resist film R is formed on the surface T ₁ of the template T by supplying the resist solution R ₁ onto the template T in the resist coating unit 26 of the processing station 3. resist solution may be performed by pressing a stamp is applied to the surface T ₁ of the template T on. In this case, as shown in FIG. 14, a stamp unit 110 is arranged on the transport line A of the template processing apparatus 1 instead of the resist coating unit 26 shown in FIG. That is, in this case, the rinse unit 25, the stamp unit 110, and the transition unit 27 are arranged in a line on the line A3 of the transport line A. In the line A1, a transition unit 20, a pre-cleaning unit 21, a release agent coating unit 22, and a heating unit 23 are arranged in a line in order from the template loading / unloading station 2 side. Moreover, the temperature control unit 24 is arrange | positioned at line A2.

In the casing 50 of the stamp unit 110, as with the resist coating unit 26, a transfer roller 30 is arranged as shown in FIG. A rail 111 extending along the Y direction (left-right direction in FIG. 15) is provided on the ceiling surface of the casing 50 as shown in FIG. An arm 112 is attached to the rail 111, and a stamp M provided so that the surface of the arm 111 faces the transfer roller 30, that is, the surface T _{1 of the} template T, is supported. The arm 112 is movable on the rail 111 by the arm driving unit 113. As a result, the stamp M can move to above the template T on the conveyance roller 30. Further, the arm 112 can be moved up and down by an arm driving unit 113, and the stamp M can be pressed against the template T. Note that the surface M _{1 of the} stamp M is subjected to a liquid repellent treatment with a material having higher liquid repellency than the release agent S.

  As shown in FIG. 15, a resist solution nozzle 70 provided with a supply port (not shown) facing upward is provided above the transfer roller 30 and below the rail 111. A template T position detection sensor 114 is provided at a predetermined position below the conveyance roller 30. The position detection sensor 114 detects, for example, the Y direction negative direction side (left direction side in FIG. 15) of the template T conveyed on the conveyance roller 30, and outputs detection information to the control device 100. .

  Next, a method for forming a resist film R on the template T in the stamp unit 110 will be described.

In the stamp unit 110, first, the template T is transported on the transport roller 30 in the Y direction negative direction side in FIG. When the template T is detected by the position detection sensor 114, the conveyance roller 30 temporarily stops the conveyance of the template T and makes the template T stand by at a predetermined position. Next, the stamp M moves along the rail 111 toward the template T. Then, when the stamp M crosses over the resist solution nozzle 70 is supplied from the resist solution nozzle 70 as shown in FIG. 16 (a) on the surface M ₁ of the stamp M, the resist solution R ₁ on the surface M ₁ of the stamp M Is applied.

Thereafter, the stamp M coated with the resist solution R ₁ moves above the template T, and then the stamp M is pressed against the surface T _{1 of the} template T as shown in FIG. In this case, by pressing the stamp M to the template T, the resist solution R ₁ is pushed into the recess portion U of the transfer pattern C of the template T, the resist solution R ₁ is filled without clearance in the recess portion U. Thereafter, the stamp M is raised, and a resist film R is formed on the template T as shown in FIG. In this way, a series of resist film R forming processes in the stamp unit 110 is completed. Although doing the coating of the resist solution R ₁ while moving the stamp M in FIG. 16, for example, the resist solution nozzle 70 is moved may be performed applying the resist solution R _1. Further, although the rail 111 is disposed along the Y direction in FIG. 15, the rail 111 may be disposed along the X direction of FIG. 15, that is, parallel to the central axis of the transport roller 30.

According to the above embodiment, the stamp M, to which the resist solution R ₁ has been applied in advance, is pressed against the template T. Therefore, the application of the resist solution R ₁ to the template T and the application of the resist solution R ₁ into the recess U are performed. The pressing, that is, the formation of the resist film R can be performed at a time. Therefore, in the stamp unit 110, the resist film R can be smoothly formed on the release agent S formed on the template T, and thereby the throughput of the film formation process of the resist film R in the template processing apparatus 1 is achieved. Can be improved.

Incidentally, in the above embodiment, in the stamp unit 110, had been only coating the resist solution R ₁ by the resist solution nozzle 70, as needed, as indicated by a broken line in FIG. 15 for example, the resist solution the squeegee 71 surface in contact with the R ₁ is provided facing upward, in the conveying direction of the template T (Y direction negative direction in FIG. 15) may be disposed on the downstream side of the resist solution nozzle 70.

  In the above embodiment, in the template processing apparatus 1, the templates T are individually conveyed and processed. However, as shown in FIG. 17, a plurality of, for example, nine templates T are held in one holder 120 and processed. May be. In such a case, the holder 120 is formed with a receiving portion 121 that is recessed downward to receive each template T as shown in FIG. For example, a plurality of suction ports (not shown) are formed on the bottom surface of the housing part 121, and each template T is sucked and held in the housing part 121.

  According to the present embodiment, the processing station 3 can perform predetermined processing on a plurality of templates T at a time. Therefore, a resist film can be formed on more templates T in a short time, and the throughput of resist processing can be improved.

The template processing apparatus 1 of the above embodiment may be arranged in the imprint system 200 as shown in FIG. The imprint system 200 includes an imprint unit 210 that forms a resist pattern on a wafer W as a substrate using the template T, and a plurality of, for example, 25 wafers W between the outside and the imprint system 200 in units of cassettes. A wafer loading / unloading station 211 is provided as a substrate loading / unloading station for loading / unloading and loading / unloading the wafer W to / from the wafer cassette _CW . The imprint system 200 has a configuration in which the template processing apparatus 1, the imprint unit 210, and the wafer carry-in / out station 211 are integrally connected.

  In the processing station 3 of the template processing apparatus 1, the transfer line B excluding the transition unit 27 from the transfer line A described above is arranged in a row on the front side (X direction negative direction side in FIG. 19). That is, on the front side of the processing station 3, the transition unit 20, the pre-cleaning unit 21, the release agent coating unit 22, the heating unit 23, the temperature adjustment unit 24, the rinse unit 25, and the resist coating unit 26 are linearly arranged in a line. Has been placed.

  A transport line C for the template T is arranged on the back side of the processing station 3 (the positive side in the X direction in FIG. 19). A transition unit 220 for transferring the template T is provided at the end of the transport line C on the template loading / unloading station 2 side. The plurality of transfer rollers 30 described above are provided between the imprint unit 210 and the transition unit 220, and the template T is transferred. Note that the configuration of the transition unit 220 is the same as the configuration of the transition unit 20 described above, and a description thereof will be omitted.

The wafer loading / unloading station 211 is provided with a cassette mounting table 230. The cassette mounting table 230 can mount a plurality of wafer cassettes _CW in a row in the X direction (left and right direction in FIG. 19). That is, the wafer carry-in / out station 211 is configured to be capable of holding a plurality of wafers W.

The wafer carry-in / out station 211 is provided with a wafer carrier 232 that can move on a conveyance path 231 extending in the X direction. The wafer carrier 232 is also movable in the vertical direction and around the vertical direction (θ direction), and can carry the wafer W between the wafer cassette _CW and the imprint unit 210.

  The wafer carry-in / out station 211 is further provided with an alignment unit 233 for adjusting the orientation of the wafer W. The alignment unit 233 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W, for example. The wafer carry-in / out station 211 is provided with a reversing unit 234 for reversing the front and back surfaces of the wafer W.

  Next, the configuration of the above-described imprint unit 210 will be described. 20 and 21, the imprint unit 210 has a casing 240 in which a loading / unloading port E1 for the template T and a loading / unloading port E2 for the wafer W are formed on the side surfaces.

  As shown in FIGS. 20 and 21, the plurality of transfer rollers 30 described above are arranged in the casing 240. For example, the transport roller 30 in the casing 240 can transport the template T transported from the loading / unloading port E1 through the transport line B to a position above a template holding unit 241 described later, and then unload it again from the loading / unloading port E1. As shown in FIG. 20, they are arranged in a substantially U shape.

  For example, a conveyance guide (not shown) that supports the side surface of the template T is provided on both ends of the central axis of the conveyance roller 30, and the template T is conveyed on the conveyance roller 30 arranged in a substantially U shape. At this time, the template T is prevented from dropping from the U-shaped portion.

A template holder 241 that holds the lower surface of the template T is provided on the bottom surface of the casing 240 as shown in FIG. Template holding portion 241, a predetermined position of the rear surface T ₂ of the template T has a chuck 242 for holding suction. The chuck 242 is movable in the vertical direction by a moving mechanism 243 provided below the chuck.

  The template holding unit 241 has a light source 244 provided below the template T held by the chuck 242. The light source 244 emits light such as visible light, near ultraviolet light, and ultraviolet light. The conveyance roller 30a corresponding to the upper side of the light source 244 has a shape in which the position corresponding to the upper side of the light source 244 is cut so as not to block the light from the light source 244 as shown in FIG. Light from 244 is transmitted upward through the template T.

  A wafer holding unit 260 is provided on the ceiling surface of the casing 240 and above the transfer roller 30 as shown in FIG. Wafer holder 260 sucks and holds the back surface of wafer W so that the surface to be processed of wafer W faces downward. That is, the wafer holding unit 260 and the transfer roller 30 are arranged so that the wafer W held by the wafer holding unit 260 and the template T placed on the transfer roller 30 face each other. The wafer holder 260 can be moved in the horizontal direction by a moving mechanism 261 provided above the wafer holder 260.

  The imprint system 200 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 200 will be described. FIG. 22 shows the main processing flow of this imprint processing, and FIG. 23 shows the state of the template T and wafer W in each step of this imprint processing.

First, the template T is carried into the processing station 3 from the template carry-in / out station 2 by the template carrier 12 (step H1 in FIG. 22). In the processing station 3, the cleaning of the surface _{T 1} of the template T (in FIG. 22 step H2), (step H3 of the Fig. 22) the application of the release agent S on the surface _{T 1,} the firing of the release agent S (in FIG. 22 step H4), rinsing of the release agent S (step H5 in FIG. 22) are sequentially performed, the release agent S is formed on the surface _{T 1} of the template T. Thereafter, the template T resist solution _{R 1} is supplied (step H6 in FIG. 22), the resist film R is formed on the release agent on S (step H7 in FIG. 22). In addition, since these processes H2-H7 are the same as the processes G2-G7 in the said embodiment, detailed description is abbreviate | omitted.

  Thereafter, the template T is transported to the imprint unit 210 by the transport roller 30 and sucked and held on the chuck 242 of the template holding unit 241.

In this way, a predetermined process is performed on the template T in the processing station 3, and the template T is being transferred to the imprint unit 210. At the wafer carry-in / out station 211, the wafer cassette C _W on the cassette mounting table 230 is used by the wafer transfer body 232. The wafer W is taken out from the wafer and transferred to the alignment unit 233. Then, the alignment unit 233 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W. Thereafter, the wafer W is reversed by the wafer carry-inversion unit 234 and then transferred to the imprint unit 210 (step H8 in FIG. 22).

  The wafer W transferred to the imprint unit 210 is sucked and held by the wafer holder 260. Subsequently, the wafer W held by the wafer holding unit 260 is moved to a predetermined position in the horizontal direction for alignment, and the template T held by the template holding unit 241 is rotated in a predetermined direction. Then, the template T is raised to the wafer W side as shown by the arrow in FIG. The template T rises to a predetermined position, and the resist film R on the template T is pressed against the wafer W. The predetermined position is set based on the height of the resist pattern formed on the wafer W. Subsequently, light is emitted from the light source 244. The light from the light source 244 passes through the template T and is irradiated onto the resist film R on the wafer W as shown in FIG. 23B, whereby the resist film R is photopolymerized. In this manner, the transfer pattern C of the template T is transferred to the resist film R on the wafer W to form a resist pattern P (step H9 in FIG. 22).

  Thereafter, the template T is lowered as shown in FIG. 23C to form a resist pattern P on the wafer W (step H10 in FIG. 22).

  When the resist pattern P is formed on the wafer W, the used template T is unloaded from the imprint unit 210 to the transport line C by the transport roller 30 (step H11 in FIG. 22). Subsequently, a new template T is transported to the imprint unit 210 by the transport roller 30 on the transport line B, and the template T in the imprint unit 210 is replaced. When the template T is replaced, the template T is raised again to the wafer W side, and a resist pattern P is formed on the wafer W. This operation is repeated.

The wafer W on which the resist pattern P is formed is transferred to the wafer carrier 232, transferred from the imprint unit 210 to the wafer carry-in / out station 211, and returned to the wafer cassette _CW (step H12 in FIG. 22). A thin resist residual film L may remain in the concave portion of the resist pattern P formed on the wafer W. For example, the residual film L outside the template processing apparatus 1 as shown in FIG. The film L may be removed.

  The used template T transferred to the transfer roller 30 on the transfer line C is transferred to the transition unit 220 at a speed along the transfer roller 30.

Template T already used, which are conveyed to the transition unit 220 is passed to the template carrier 12 by the lifting pins 40, and returned to the template cassette C _T. In this way, in the imprint system 200, the predetermined resist pattern P is continuously formed on the plurality of wafers W while the template T is continuously replaced.

According to the above embodiment, after supplying the resist solution R ₁ on the surface T ₁ release agent is deposited on the S where the template T, the resist solution R ₁ by the squeegee 71 of the transfer pattern C of the template T By pressing into the recess U, the resist solution R ₁ can be filled in the recess U without any gap, and the resist film R can be formed on the release agent S. Therefore, when a predetermined resist pattern is formed on the resist film on the wafer using the template T, a predetermined pattern in which the transfer pattern C of the template T is appropriately transferred can be formed on the wafer.

  Further, since the imprint system 200 includes the template processing apparatus 1, the template T can be continuously supplied to the imprint unit 210 while the resist film R is formed on the template T in the imprint system 200. . Therefore, the predetermined resist pattern P can be continuously formed on the plurality of wafers W. This also enables mass production of semiconductor devices.

  In the template processing apparatus 1 of the above embodiment, the release agent S and the resist film R are formed. However, only the resist film R may be formed. In this case, as shown in FIG. 24, the template processing apparatus 300 has a configuration in which the processing units 21 to 25 constituting the release agent film forming line are omitted from the template processing apparatus 1 shown in FIG. . Further, the template processing apparatus 300 may be arranged in the imprint system 310 as shown in FIG. The other configurations of the template processing apparatus 300 and the imprint system 310 according to the present embodiment are the same as the configurations of the template processing apparatus 1 and the imprint system 200 according to the above-described embodiment, and thus description thereof is omitted. In this embodiment, the template processing apparatus 300 is arranged in the imprint system 310. However, the template processing apparatus 300 may be provided outside the imprint system 310 independently.

In the present embodiment, the release agent S is formed on the surface T _{1 of the} template T outside the template processing apparatus 300, and the release agent S is formed on the surface T ₁ in the template loading / unloading station 2. The filmed template T is carried in. That is, cleaning of the surface _{T 1} of the template T (step H2, shown in FIG. 22), the application of the release agent S on the surface _{T 1} (step H3 shown in FIG. 22), firing of the release agent S (FIG. 22 Step H4) and rinsing of the release agent S (Step H5 shown in FIG. 22) are performed outside the template processing apparatus 300. In the template processing apparatus 300, R ₁ is supplied onto the release agent S of the template T (step H6 shown in FIG. 22), and a resist film R is formed on the release agent S (shown in FIG. 22). Step H7). Thereafter, the template T on which the resist film R is formed and the wafer W are transferred to the imprint unit 210 (step H8 shown in FIG. 22). Subsequently, after the resist film R on the template T is pressed against the wafer W in the imprint unit 210, the resist film R is irradiated with light from the light source 244, and the transfer pattern C of the template T is applied to the resist film R on the wafer W. Is transferred (step H9 shown in FIG. 22). Thereafter, a resist pattern P is formed on the wafer W (step H10 shown in FIG. 22). Since these steps H6 to H10 are the same as those in the above embodiment, detailed description thereof is omitted.

  Also in the present embodiment, the template processing apparatus 300 and the imprint system 310 have the same effects as the template processing apparatus 1 and the imprint system 200 of the above embodiment, respectively. Further, according to the present embodiment, since the film forming process of the release agent S can be omitted, the processing time in the template processing apparatus 300 and the imprint system 310 can be shortened.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  INDUSTRIAL APPLICABILITY The present invention is useful when a release agent is formed on a template having a transfer pattern formed on the surface, and a predetermined treatment is performed on the release agent. This is useful when forming a pattern.

DESCRIPTION OF SYMBOLS 1 Template processing apparatus 2 Template carrying in / out station 3 Processing station 12 Template conveyance body 21 Pre-cleaning unit 22 Release agent application unit 23 Heating unit 24 Temperature adjustment unit 25 Rinse unit 26 Resist application unit 27 Transition unit 30 Rolling roller 30a Temperature adjustment Roller 50 Casing 52 Loading / unloading port 61 Release agent nozzle 70 Resist liquid nozzle 71 Squeegee 72 Rail 73 Arm 74 Arm drive part 75 Standby part 76 Rail 77 Arm 78 Arm drive part 79 Standby part 100 Control part 101 Roller 102 Brush 110 Stamp unit 111 Rail 112 Arm 113 Arm Drive Unit 114 Position Detection Sensor 120 Holder 121 Storage Unit 200 Imprint System 21 Imprint unit 211 wafer unloading station 240 casing 241 template holder 242 chuck 243 moving mechanism 260 wafer holder 300 template processing apparatus 310 in the printing system A transport line C transfer pattern F1, F2 filtering M stamp P resist pattern R resist film R ₁ Resist liquid S Release agent T Template U Recessed part W Wafer

Claims (19)

A template processing apparatus in which a transfer pattern is formed on a surface of a template, and a coating film is formed on a release agent formed on the surface,
A processing station for performing predetermined processing on the template;
A template loading / unloading station capable of holding a plurality of the templates and loading / unloading the template to / from the processing station;
The processing station is
A coating liquid supply unit for supplying a coating liquid onto the release agent;
A template processing apparatus, comprising: a coating liquid filling unit that pushes the coating liquid coated on the mold release agent into a depression of the transfer pattern of the template. The template processing apparatus according to claim 1, wherein the processing station further includes a release agent film formation block that forms a release agent film on the surface of the template. The template processing apparatus according to claim 1, wherein the coating liquid filling unit is a squeegee. The template processing apparatus according to claim 1, wherein the coating liquid filling unit is a roller. The template processing apparatus according to claim 1, wherein the coating liquid filling unit is a brush. 6. The template processing apparatus according to claim 3, wherein a surface of the coating liquid filling unit that comes into contact with the coating liquid is subjected to a liquid repellent treatment. The filter is disposed on an upper surface of the coating liquid applied on the mold release agent, and the coating liquid filling unit pushes the coating liquid into the recess through the filter. The template processing apparatus in any one of 1-6. A filter capable of penetrating the coating solution is disposed on the release agent,
The coating liquid is supplied onto the filter,
The template processing apparatus according to claim 1, wherein the coating liquid filling unit pushes the coating liquid into the depression through the filter. In place of the coating liquid supply unit and the coating liquid filling unit, the processing station has a stamp with a coating liquid applied on the surface thereof,
3. The template processing apparatus according to claim 1, wherein the application liquid is pushed into the recessed portion of the transfer pattern by pressing the stamp against the transfer pattern. 4. The template processing apparatus according to claim 9, wherein a surface of the stamp is subjected to a liquid repellent treatment. The template processing apparatus according to claim 1, wherein the plurality of templates are held by a single holder. An imprint system comprising the template processing apparatus according to claim 1,
Using the template processed at the processing station, an imprint unit that transfers the transfer pattern to a coating film formed on a substrate and forms a predetermined pattern on the coating film;
An imprint system comprising: a substrate loading / unloading station that can hold a plurality of the substrates and loads / unloads the substrates to / from the imprint unit. A template processing method in which a transfer pattern is formed on a surface of a template using a template processing apparatus, and a coating film is formed on a release agent formed on the surface,
Apply a coating solution on the release agent,
A template processing method, wherein a coating liquid applied on the mold release agent is pushed into a recess of a transfer pattern of the template. The template processing method according to claim 13, wherein in the template processing apparatus, a release agent is formed on the surface of the template. 15. The template processing method according to claim 13, wherein the coating liquid is pushed into a recess of the template transfer pattern using a squeegee. The template processing method according to claim 13, wherein the application liquid is pushed into a recess of the template transfer pattern using a roller. The template processing method according to claim 13 or 14, wherein the application liquid is pushed into a recess of the template transfer pattern using a brush. A program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method according to any one of claims 13 to 17. A readable computer storage medium storing the program according to claim 18.

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