JP2009042093A - Electronic component inspection device and electronic component inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component inspection device and an electronic component inspection method enabling accurate visual inspection of a flaw, a chip or the like of an electronic component stored in a pocket of an embossed tape. <P>SOLUTION: A process is performed, wherein the first illumination light is irradiated from a direction orthogonal to the electronic component 13, and the second illumination light is irradiated from an oblique direction to the electronic component, to generated a contrast difference between the electronic component 13 and a peripheral portion, and to thereby detect the contour of the electronic component 13. A process is also performed, wherein the third illumination light is irradiated from an oblique direction to the electronic component, to thereby inspect the surface of the electronic component 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component inspection apparatus and an electronic component inspection method.

  Electronic components such as an IC package are generally shipped in an embossed tape or the like. For this reason, the appearance inspection of this electronic component is performed in a state where the electronic component is inserted into the embossed tape (a state where the electronic component is not wrapped). Here, the appearance inspection is an inspection for the presence or absence of characters written on the electronic component, such as scratches or chips on the electronic component.

  In general, this type of inspection apparatus includes a camera 4 (for example, a CCD camera) positioned above an electronic component 3 such as an IC package housed in a pocket 2 of an embossed tape 1 as shown in FIG. The coaxial illuminator 5 is disposed below, and the oblique illuminator 6 is disposed between the coaxial illuminator 5 and the electronic component 3. Here, the coaxial illuminator 5 is an illuminator that can irradiate the electronic component 3 with illumination light along the vertical line from above the electronic component 3, and the oblique illuminator 6 is the electronic component 3. This is an illuminator that can irradiate illumination light obliquely onto the electronic component 3 from above. The illumination light from the coaxial illumination device 5 and the illumination light from the oblique illumination device 6 are red.

  The coaxial illuminator 5 includes a casing, an LED (light emitting diode) as a light source housed in the casing, and a half mirror housed in the casing. That is, the irradiation light from the LED is dropped onto the electronic component via the half mirror, and the reflected light from the electronic component 3 enters the camera via the half mirror.

  The oblique illuminator 6 includes a casing and LEDs serving as light sources arranged in a ring shape in the casing. In this case, a plurality of LEDs are arranged in a cone-shaped holding body that expands in the downward direction in the casing. For this reason, it irradiates so that the illumination light from each LED may gather on an axial center toward the downward direction.

  In this case, the coaxial illumination device 5 emits red illumination light from above the electronic component 3, and the oblique illumination device 6 emits red illumination light from obliquely above the electronic component 3. 3 is illuminated. Then, the camera 4 captures an image of the electronic component 3. The presence or absence or lack of characters (numbers) written on the surface of the electronic component 3 and the like are inspected with a binarized area.

  That is, by setting an arbitrary window in the inspection area and counting the number of corresponding pixels in this window, the presence or absence, size, and the like of characters and the like are detected. Then, this “corresponding pixel” is determined by binarization processing. Each pixel is recognized as any one of 256 gradations. Therefore, by providing a threshold value in a pixel, it can be recognized as white and black depending on whether the threshold is brighter or darker. This is called binarization, and this threshold is called a binarization level.

In this type of inspection apparatus, green light is emitted from the first illumination from an oblique direction of the IC package (electronic component), and red light is emitted from above the IC package from the second illumination. (Patent Document 1). In this case, a filter that transmits red light but absorbs or reflects green light and a filter that transmits green light but absorbs or reflects red light are provided. The illumination condition and the illumination condition of the second illumination are set independently.
JP 2001-74427 A

  By the way, the embossed tape is generally black, and if the electronic component is a mold type chip, the surface of the electronic component is also black. For this reason, as shown in FIG. 7, with red illumination, the contrast difference between the embossed tape and the surface of the electronic component is difficult to remove, and the boundary between the electronic component and the embossed tape (the contour of the electronic component) can be grasped. There wasn't. Therefore, the surface of the electronic component cannot be extracted from the camera photographing screen, and even if the presence or absence of characters on the surface can be inspected, it is not possible to detect chipping or scratches on the surface.

  Moreover, in the thing of the said patent document 1, the color of 1st illumination (illumination for characters) and the color of 2nd illumination (illumination for leads) are changed, and a photography area is divided into a character part and a lead part, Character and lead lighting conditions are set independently, and the characters and leads can be inspected with a single shot. However, even in this case, the outline of the electronic component cannot be grasped.

  In view of the above problems, the present invention provides an electronic component inspection apparatus and an electronic component inspection method capable of accurately performing appearance inspections such as scratches and chips on electronic components stored in a pocket of an embossed tape. .

  The electronic component inspection apparatus of the present invention irradiates the first illumination light from a direction orthogonal to the electronic component, and irradiates the electronic component with the second illumination light from an oblique direction, and the electronic component and the surrounding portion. And an illumination means for detecting a surface for causing a contrast difference and an illumination means for surface inspection for irradiating the electronic component with the third illumination light from an oblique direction.

  According to the electronic component inspection apparatus of the present invention, it is possible to cause a contrast difference between the electronic component and the surrounding portion by the contour detection illumination means. For this reason, the outline of the electronic component can be detected.

  Further, by irradiating the electronic component with the first illumination light from a direction orthogonal to the electronic component and irradiating the electronic component with the second illumination light from an oblique direction, scratches or the like that cannot be detected by the irradiation of the first illumination light. Scratches and the like that can be detected by irradiation with the second illumination light and cannot be detected by irradiation with the second illumination light can be detected by irradiation with the first illumination light.

  By the way, when the electronic component is a molded product and stored in the pocket of the embossed tape, the surface of the electronic component and the embossed tape are black. In such a case, if the first illumination light and the second illumination light of the illumination means for contour detection are blue, the contrast difference between the electronic component and the embossed tape is large. Further, by irradiating the surface of the electronic component that is black with red third illumination light obliquely from above, it is possible to identify the character on the surface of the electronic component.

  As the electronic component inspection apparatus, the contour detection illumination means includes a contour coaxial illuminator that irradiates the first illumination light and a contour oblique illuminator that irradiates the second illumination light. The contour oblique illuminator can be disposed above the electronic component. Further, the surface inspection illumination means includes a character oblique illuminator that emits the third illumination light, and can be disposed above the electronic component.

  Furthermore, irradiation with the second illumination light and the third illumination light may be possible as the contour oblique illuminator of the contour detection illumination means. That is, by irradiating the second illumination light from the contour oblique illuminator, the contour of the electronic component can be detected with the first illumination light of the contour coaxial illuminator. In addition, by irradiating the third illumination light from the contour oblique illuminator, it is possible to inspect characters and the like of the electronic component.

  As an electronic component inspection apparatus, an electronic device illuminated by the illumination unit and an imaging unit that images the surrounding portion, and an image processing unit that performs binarization processing on an image captured by the imaging unit are provided. Are preferred. In this case, at the time of illumination by the contour detection illumination unit, the image captured by the imaging unit is binarized to blacken the part around the electronic component and whiten the surface of the electronic component. . In addition, when the illumination by the surface inspection illumination unit is performed, the image captured by the imaging unit is binarized to whiten the scratches or chips on the surface of the electronic component or the characters displayed on the surface. It can be identified.

  In the electronic component inspection method of the present invention, the first illumination light is irradiated from a direction orthogonal to the electronic component, and the second illumination light is irradiated from an oblique direction to the electronic component. And a step of detecting the contour of the electronic component and irradiating the electronic component with the third illumination light from an oblique direction to inspect the surface of the electronic component. .

  According to the electronic component inspection method of the present invention, the first illumination light is irradiated from a direction orthogonal to the electronic component, and the second illumination light is irradiated from an oblique direction to the electronic component. A contrast difference can be generated between the surrounding portions. For this reason, the outline of the electronic component can be detected.

  If the first illumination light and the second illumination light are blue, when the electronic component is a molded product and is stored in the pocket of the embossed tape, the contrast difference between the electronic component and the embossed tape is large. Moreover, the character of the surface of this electronic component can be identified by irradiating the surface of the electronic component which is black with the red 3rd illumination light from diagonally upward.

  After detecting the contour of the electronic component, the surface of the electronic component can be inspected within the detected contour. That is, the range to be inspected is determined, and the surface of the electronic component can be inspected stably.

  In the present invention, the contour detection illumination means can cause a contrast difference between the electronic component and the surrounding portion, and the contour of the electronic component can be detected. For this reason, the chip | tip of the external part of an electronic component can be detected. Further, by irradiating the third illumination light of the surface inspection illumination means, it is possible to inspect the surface of the electronic component for scratches, chips, and the presence of characters. Thus, the appearance inspection of the electronic component can be performed accurately and stably.

  Further, by irradiating the electronic component with the first illumination light from a direction orthogonal to the electronic component and irradiating the electronic component with the second illumination light from an oblique direction, scratches or the like that cannot be detected by the irradiation of the first illumination light. Scratches and the like that can be detected by irradiation with the second illumination light and cannot be detected by irradiation with the second illumination light can be detected by irradiation with the first illumination light. This improves the detection accuracy of the contour detection illumination means. Specifically, when the electronic component is a molded product, it is possible to distinguish non-defective unevenness (such as gloss unevenness) from scratches and chipping, and a more accurate inspection can be performed.

  If the first illumination light and the second illumination light of the illumination means for contour detection are blue, the contrast difference between the electronic component and the embossed tape is large. As a result, it is possible to detect the chipping of the outer portion of the electronic component with high accuracy. Moreover, the character of the surface of this electronic component can be identified by irradiating the surface of the black electronic component with the red third illumination light obliquely from above. For this reason, the accuracy of the inspection of characters on the surface of the electronic component is improved.

  By binarizing the image photographed by the photographing means at the time of illumination by the contour detecting illumination means, the portion around the electronic component can be blackened and the surface of the electronic component can be whitened. In addition, when the illumination by the surface inspection illumination unit is performed, the image captured by the imaging unit is binarized to whiten the scratches or chips on the surface of the electronic component or the characters displayed on the surface. Can be identified. As a result, the inspection accuracy of the electronic component can be improved.

  If the surface of the electronic component is to be inspected within the detected contour after detecting the contour of the electronic component, the range to be inspected is first determined, so that the surface of the electronic component can be stably inspected. For this reason, it becomes possible to inspect highly accurate electronic components in a short time.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 shows an inspection apparatus of the present invention. This inspection apparatus inspects the surface of the electronic component 13 such as an IC chip for scratches, chips, and the presence of characters. The electronic component 13 is accommodated in the pocket of the embossed tape 11.

  The inspection apparatus irradiates the first illumination light from a direction orthogonal to the electronic component 13 and illuminates the second illumination light from the oblique direction to the electronic component 13, and the electronic component 13. Illuminating means 21 for surface inspection that irradiates the third illumination light from an oblique direction, and photographing means 15 for capturing an image of the electronic component 13 irradiated by the illumination means 20 for contour detection and the illumination means 21 for surface inspection. As a camera 22 (CCD camera).

  The contour detection illumination means 20 includes a contour coaxial illuminator 23 that irradiates the first illumination light, and a contour oblique illuminator 24 that irradiates the second illumination light, and the surface inspection illumination means 21 is the third. A character oblique illuminator 25 for irradiating illumination light is provided.

  As shown in FIG. 2, the contour coaxial illuminator 23 includes a casing 26, a plurality of LEDs (light emitting diodes) 27, a half mirror 28, and the like as light sources housed in the casing 26. The plurality of LEDs 27 are held on a substrate 29 on the side wall 26 a side of the casing 26. An illumination power source 30 is connected to the contour coaxial illuminator 23 (specifically, the substrate 29) via a power cable 31 as shown in FIG. For this reason, a current is supplied to each LED 27 from the illumination power supply 30 via the substrate 29, and each LED 27 emits light. In this case, blue (wavelength: 430 to 460 nm) illumination light (first illumination light) is irradiated toward the other side wall 26b along the horizontal direction.

  The half mirror 28 is arranged to be inclined with respect to the illumination light from the LED 27 and reflects the illumination light from the LED 27 downward. For this reason, the window part 32 is provided in the lower wall 26c of the casing 26, and 1st illumination light can be irradiated from the direction orthogonal to the electronic component 13 through this window part 32. FIG.

  A window 33 is provided on the upper wall 26 d of the casing 26, and reflected light from the electronic component 13 exits from the window 33 via the half mirror 28. Reflected light emitted from the window 33 enters the camera 22 through a lens (zoom lens) 34. In FIG. 2, reference numeral 35 denotes a diffusion plate.

  Next, as shown in FIGS. 3 and 4, the contour oblique illuminator 24 includes a casing 37 and a plurality of LEDs 38 as light sources arranged in a ring shape in the casing 37. The casing 37 includes a ring-shaped flat body 37a and a short cylindrical body 37b disposed on the outer peripheral side of the ring-shaped flat body 37a.

  In the casing 37, a cone-shaped substrate 39 having a diameter increasing downward is disposed. The substrate 39 is disposed on the outer diameter side of the axial hole 40 of the ring-shaped flat plate 37a, and a plurality of LEDs 38 are arranged and connected in a ring shape as shown in FIG. A lighting power source 30 is connected to the substrate 39 via a power cable 41. For this reason, current is supplied to each LED 37 from the illumination power supply 30 via the substrate 39, and each LED 37 emits light, and the illumination light (wavelength: 430 to 460 nm) is blue (wavelength is 430 to 460 nm) so as to gather downward. 2nd illumination light) is irradiated. A passage 42 through which the first illumination light of the contour coaxial illuminator 23 passes is formed by the axial hole 40 of the ring-shaped flat body 37 a of the casing 37 and the through hole 39 a of the substrate 39.

  The character oblique illuminator 25 constituting the surface inspection illumination means 21 has the same configuration as the contour oblique illuminator 24. That is, although not shown in the drawings, the character oblique illuminator 25 includes a casing and a plurality of LEDs serving as light sources arranged in a ring shape in the casing. Further, a cone-shaped substrate whose diameter is increased downward is disposed in the casing. A plurality of LEDs are arranged in a ring and connected to this substrate. A lighting power supply 45 is connected to the substrate via an electric cable 44.

  For this reason, current is supplied to each LED from the illumination power supply 45 through the substrate, each LED emits light, and red (wavelength: 610 to 780 nm) illumination light (first wavelength) so that the LED is concentrated downward. 3 illumination light). In the character oblique illuminator 25, a passage (not shown) is formed through which the first illumination light from the contour coaxial illuminator 23 and the second illumination light from the contour oblique illuminator 24 pass. The

  In addition, an image of the electronic component 13 illuminated with the first illumination light and the second illumination light and an image of the electronic component 13 illuminated with the third illumination light are taken by the camera 22, and data of this image is obtained. It is sent to a personal computer 51 as the image processing means 50. The personal computer 51 binarizes the image and displays it on a screen (display) 52.

  Next, an electronic component inspection method using the above-described inspection apparatus will be described. In this case, for example, the dimension d1 from the tip (lower end) of the lens 34 to the electronic component 13 is 225 mm, the dimension d2 from the contour coaxial illuminator 23 to the electronic component 13 is 70 mm, and the contour oblique illuminator 24 D3 to the electronic component 13 is set to 33 mm, and d from the character oblique illuminator 25 to the electronic component 13 is set to 10 mm.

  Further, the electronic component (mold chip) 13 is in a state of being housed in the pocket of the embossed tape 11. On the surface (upper surface) of the electronic component 13, product information, such as a product number and a manufacturing number, is displayed. That is, the black electronic component 13 is housed in the pocket of the black embossed tape 11, and white characters and symbols are written on the black body surface.

  First, the process of detecting the contour of the electronic component 13 is performed. In this case, the blue first illumination light is emitted from the contour coaxial illuminator 23 of the contour detection illumination unit 20 toward the electronic component 13, and the blue color is emitted from the oblique oblique illuminator 24 of the contour detection illumination unit 20. The second illumination light is irradiated toward the electronic component 13.

  That is, the first illumination light is irradiated from a direction orthogonal to the electronic component 13 and the second illumination light is irradiated to the electronic component 13 from an oblique direction. As a result, a contrast difference between the surface of the electronic component 13 and the embossed tape 11 occurs. The surface of the electronic component 13 and a part around the electronic component 13 are photographed (captured) by the camera 22.

  In the image processing unit 50 (personal computer), by performing area determination by binarizing an image photographed (captured) by the camera 22, as shown in FIG. 5, the electronic component 13 can be set in a white state. . As a result, the outline of the electronic component 13 can be grasped, and if the electronic component 13 has scratches or chips, it can be blackened.

  Next, a process for inspecting the surface of the electronic component is performed. In this case, the irradiation of the first illumination light and the second illumination light is stopped, and the third illumination of red from the oblique direction with respect to the electronic component 13 is performed by the character oblique illumination device 25 of the surface inspection illumination means 21. Irradiate light. That is, the surface of the electronic component 13 and a part around the electronic component 13 are photographed (imaged) by the camera 22 by irradiating the surface of the electronic component 13 that is black with red third illumination light obliquely from above. To do. Thereafter, the image processing means 50 (personal computer) performs area determination by binarization of the image photographed (captured) by the camera 22, so that the characters on the surface of the electronic component 13 are displayed as shown in FIG. 6. In addition to whitening, scratches, chips, and foreign objects (such as dust and dirt) can also be whitened. Thereby, the appearance inspection of the electronic component 13 can be performed.

  In the present invention, the contour detection illumination means 20 can cause a contrast difference between the electronic component 13 and the surrounding portion, and the contour of the electronic component 13 can be detected. For this reason, the chip | tip of the external part of the electronic component 13 is detectable. Moreover, by irradiating the 3rd illumination light of the surface inspection illumination means 21, the surface of the electronic component 13 can be inspected for scratches, chips, presence of characters, and the like. Thus, the appearance inspection of the electronic component 13 can be performed with high accuracy and stability.

  In addition, the first illumination light is irradiated from the direction orthogonal to the electronic component 13 and the second illumination light is irradiated from the oblique direction to the electronic component 13, so that scratches that cannot be detected by the irradiation of the first illumination light are detected. Etc. can be detected by irradiation with the second illumination light, and scratches that cannot be detected by irradiation with the second illumination light can be detected by irradiation with the first illumination light. This improves the detection accuracy of the contour detection illumination means. Specifically, when the electronic component is a molded product, non-defective unevenness (such as unevenness in gloss) can be distinguished from scratches and chips, and a more accurate inspection can be performed.

  In particular, in the above-described embodiment, the first illumination light and the second illumination light of the contour detection illumination means 20 are blue, so that the contrast difference between the electronic component 13 and the embossed tape 11 is large. As a result, it is possible to detect the chipping of the outer portion of the electronic component 13 with high accuracy. Moreover, the precision of the external appearance inspection of the surface of the electronic component 13 improves by irradiating the red 3rd illumination light on the surface of the electronic component 13 which is black from diagonally upward.

  After the contour of the electronic component 13 is detected, the surface of the electronic component 13 is inspected within the detected contour, so that a range to be inspected is first determined. Therefore, the surface of the electronic component 13 can be stably inspected, and the electronic component 13 can be inspected with high accuracy in a short time.

  By binarizing the image photographed by the photographing means at the time of illumination by the contour detecting illumination means 20, the portion around the electronic component 12 can be blackened and the surface of the electronic component 12 can be whitened. . Further, when the surface inspection illumination unit 21 illuminates, the image captured by the imaging unit is binarized to whiten the surface of the electronic component 12 such as scratches or chips, or characters displayed on the surface. And can be identified. For this reason, in the inspection of the electronic component 13 by the inspection apparatus, it is possible to improve the inspection accuracy.

  By the way, in the said embodiment, in the external appearance inspection of the surface of the electronic component 13, it performed by irradiation of only 3rd illumination light, However, also in the external appearance inspection of the surface of the electronic component 13, the 1st of the illumination means 20 for outline detection You may grasp | ascertain the outline of the electronic component 13 by irradiating illumination light and 2nd illumination light.

  In the above embodiment, the oblique illuminator 24 for irradiating the second illumination light and the oblique illuminator 25 for irradiating the third illumination light are provided. However, as another embodiment, the oblique illuminator 25 is provided. Omitted, the oblique illuminator 24 may be irradiated with the third illumination light. In this case, the oblique illuminator 24 is provided with two types of LEDs, a blue light emitting LED and a red light emitting LED. The blue LED emits light when detecting the outline, and the red light is emitted during the appearance inspection. What is necessary is just to make it light-emit LED. Thus, if the oblique illuminator 25 is omitted, the apparatus can be made compact.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the embodiment, and various modifications are possible. For example, in the embodiment, the electronic component 13 is a molded product. Or a wafer or the like. Moreover, although the 1st illumination light and the 2nd illumination light were made into blue and the 3rd illumination light was made into red, this is preferable when the surface of the electronic component 13 is black and the embossed tape 11 is black. It is. For this reason, when the color of the surface of the electronic component 13 and the embossed tape is not black, the third illumination light is a color other than red even if the first illumination light and the second illumination light are colors other than blue. Also good.

  Further, the inclination angle of the illumination light of the contour oblique illuminator 24 and the character oblique illuminator 25 can be, for example, about 45 degrees with respect to the vertical plane. Any contrast difference may be used. In the embodiment, the illuminators 23, 24, and 25 are arranged on the same vertical line on the electronic component 13. However, when detecting the contour of the electronic component 13, the illuminator 25 escapes to the outside or an appearance inspection is performed. In this case, the illuminators 23 and 24 may escape to the outside. Further, in the embodiment, the contour detection illumination unit 20 is disposed above the surface inspection illumination unit 21. However, the surface inspection illumination unit 21 may be disposed above the contour detection illumination unit 20. . Further, the electronic component 14 to be inspected is not limited to being irradiated from the upper side with illumination light from each illumination means, but can be irradiated from the lower side or from the side (horizontal direction). .

It is a simplified perspective view which shows the inspection apparatus of embodiment of this invention. It is sectional drawing of the coaxial illuminator for an outline used for the inspection apparatus shown in the said FIG. It is sectional drawing of the oblique illuminator for outlines used for the inspection apparatus shown in the said FIG. It is a principal part simplification figure of the said oblique illumination device for outlines. It is a figure which shows the image in the process of detecting the outline of an electronic component. It is a figure which shows the image in the process of test | inspecting the surface of an electronic component. It is a simplified diagram of a conventional inspection apparatus.

Explanation of symbols

15 Imaging means 20 Contour detection illumination means 21 Surface inspection illumination means 23 Contour coaxial illuminator 24 Contour oblique illuminator 25 Character oblique illuminator 50 Image processing means

Claims (9)

A contour that irradiates the electronic component with the first illumination light from a direction orthogonal to the electronic component and irradiates the electronic component with the second illumination light from an oblique direction to cause a contrast difference between the electronic component and the surrounding portion. Illumination means for detection;
An electronic component inspection apparatus comprising: an illumination means for surface inspection that irradiates the electronic component with the third illumination light from an oblique direction.   The electronic component inspection apparatus according to claim 1, wherein the first illumination light and the second illumination light of the contour detection illumination means are blue, and the third illumination light of the surface inspection illumination means is red.   The contour detection illumination means includes a contour coaxial illuminator that irradiates the first illumination light and a contour oblique illuminator that irradiates the second illumination light. 3. The electronic component inspection apparatus according to claim 1, wherein a side illuminator is disposed above the electronic component.   4. The electronic component inspection apparatus according to claim 3, wherein the surface inspection illumination means includes a character oblique illuminator that irradiates the third illumination light, and is disposed above the electronic component.   4. The electronic component inspection apparatus according to claim 3, wherein the contour oblique illuminator of the contour detection illumination means is capable of emitting the second illumination light and the third illumination light.   An image pickup means for taking an image of an electronic component illuminated by the illumination means and a portion around the electronic component, and an image processing means for performing a binarization process on an image taken by the image pickup means are provided. The electronic component inspection apparatus according to claim 1. Irradiating the first illumination light from the direction orthogonal to the electronic component, and irradiating the second illumination light from the oblique direction to the electronic component, causing a contrast difference between the electronic component and the surrounding portion, Detecting the contour of the electronic component;
And a step of inspecting the surface of the electronic component by irradiating the electronic component with the third illumination light from an oblique direction.   8. The electronic component inspection method according to claim 7, wherein the first illumination light and the second illumination light are blue, and the third illumination light is red.   10. The electronic component inspection method according to claim 8, wherein after detecting the contour of the electronic component, the surface of the electronic component is inspected within the detected contour.

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