JP2006339362A - Wiring board for mounting light emitting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element which can efficiently emit outside the light from a light emitting element mounted on the bottom face of a cavity with the light hardly influenced by light from outside, and which can be manufactured at a low cost. <P>SOLUTION: The wiring board 1 for mounting a light emitting element comprises the main body 2 of the board which is formed of ceramic (insulating material) which takes on a surface color which reflects light and which has a front face 3 and a rear face 4; the cavity 5 which is opened in the front face 3 of the main body 2 of the board and consists of the bottom face 6 and the side face 7; and a ceramic layer (insulation layer) 8 which is stacked on the front face 3 of the main body 2 of the board, and takes on a surface color whose hue H is in a range of 10P-10PB-10B in a hue circle and brightness V in a range of 1.5-5.5 and saturation C in a range of 0-3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting element mounting wiring board for mounting a light emitting element on a bottom surface of a cavity.

In a wiring board on which a light emitting element is mounted, a light reflection layer made of metal is formed on the side surface of the cavity in which the light emitting element is mounted, and light absorption that absorbs external light on the surface of the wiring board in which the cavity is opened By forming the layer, the light emitted from the light-emitting element can be emitted clearly.
For example, a light-emitting element housing in which a concave portion for accommodating a light-emitting element is provided on the surface side of a white insulating base, and a black-brown light absorbing layer is deposited by printing and baking a ceramic paste on the surface of the insulating base. A package has been proposed (see, for example, Patent Document 1).
Also proposed is a light-emitting device in which a light-absorbing layer is disposed by coating a light-emitting element disposed in a recess of a package with a mold member and transferring a thin film to the upper surface of the package by a hot stamping method. (For example, refer to Patent Document 2).

JP-A-8-274378 (pages 1 to 4, FIG. 1) JP 2000-183405 A (pages 1 to 6, FIGS. 1 and 2)

However, when the light absorption layer is formed by printing and firing a ceramic paste, as in the light emitting element storage package of Patent Document 1, the light absorption layer becomes excessively thin, and the insulating base exhibiting a white color located immediately below the light absorption layer As a result, the light from the outside cannot be efficiently absorbed.
Further, the method of forming a light absorption layer by transferring a thin film by a hot stamping method as in the light emitting device of Patent Document 2 has a problem in that the number of manufacturing steps increases, and thus the cost is likely to increase. It was.

  The present invention solves the problems described in the background art, can efficiently radiate the light from the light emitting element mounted on the bottom surface of the cavity to the outside, and such light is not easily affected by the light from the outside, It is an object to provide a wiring board for mounting a light-emitting element that can be manufactured at low cost.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention is conceived by forming a black insulating layer having a predetermined thickness on a surface surrounding a cavity opening in a white substrate body. It has been done.
That is, the wiring board for mounting a light emitting element according to the present invention (Claim 1) is made of an insulating material exhibiting a surface color that reflects light, and has a substrate body having a front surface and a back surface, an opening on the surface of the substrate body, and a bottom surface. And a cavity composed of side surfaces, and laminated on the surface of the substrate body, and in the hue ring, the hue H is in the range of 10P to 10PB to 10B, the lightness V is 1.5 to 5.5, and the saturation C is 0 to 3 And an insulating layer exhibiting a surface color within the range.
The hue H, lightness V, and saturation C are based on JIS Z8721-1933. Moreover, 10P-10PB-10B of the said hue H can also be represented as 10P-10B (however, 10PB is included).

  According to this, on the surface of the substrate body made of an insulating material that exhibits a surface color that reflects light, an insulating layer having a predetermined thickness that exhibits a surface color of hue H, lightness V, and saturation C in the above-described range. Are stacked. For this reason, since the light from the light emitting element mounted on the bottom surface of the cavity opened on the surface of the substrate body is absorbed by the insulating layer, the light reflecting layer deposited on the side surface of the cavity After being reflected, the light is efficiently radiated to the outside with almost no interference with light from the outside. Therefore, light from the light emitting element to be mounted in the cavity can be efficiently emitted to the outside. Moreover, since an insulating layer having a surface color different from that of the substrate body is formed on the surface of the substrate body by lamination, it is possible to manufacture at low cost without requiring special processes and many man-hours. Become.

The insulating material and the insulating layer forming the substrate body include, for example, a ceramic mainly composed of alumina, a glass-ceramic that is a kind of low-temperature fired ceramic, or a resin such as an epoxy resin. . For this reason, the “lamination” includes laminating, pressing and firing a plurality of green sheets exhibiting different surface colors in the case of the ceramic or the low-temperature fired ceramic, and a plurality of different surface colors in the case of the resin. Laminating (attaching) the resin layer.
In addition, the cavity has a substantially conical shape, a substantially elliptical cone shape, a substantially long cone shape, a polygonal pyramid shape that is more than a quadrangular pyramid, and a cylindrical shape and an elliptic cylinder shape. In addition, a long cylindrical shape or a polygonal column shape including a square column is also included.
Further, the light emitting element mounted on the bottom surface of the cavity includes a light emitting diode (LED) and a semiconductor laser (LD).

In the present invention, the insulating material forming the substrate body is a white ceramic layer, and the insulating layer is a colored ceramic layer containing a pigment exhibiting the surface color, for mounting a light emitting element. A wiring board (claim 2) is also included.
According to this, on the surface of the substrate body made of a white ceramic layer, there is an insulating layer made of a colored ceramic layer containing a pigment exhibiting a surface color with hue H, lightness V, and saturation C in the above-mentioned range. Laminated. Therefore, the light from the light emitting element mounted on the bottom surface of the cavity that opens on the surface of the substrate body is absorbed by the side surface of the cavity because the light from outside is reliably absorbed by the insulating layer. After being reflected by the reflective layer, interference by external light is remarkably suppressed and the light is efficiently radiated to the outside.
The substrate body includes a ceramic laminate in which a plurality of white ceramic layers are laminated. The pigment is a metal oxide such as chromium oxide, manganese oxide, cobalt oxide, and molybdenum oxide.

In other words, the present invention may also include a wiring board for mounting a light emitting element in which a metal layer and a light reflecting layer deposited thereon are formed on the side surface of the cavity.
In this case, since the light from the light emitting device mounted on the bottom surface of the cavity can be efficiently reflected by the light reflecting layer, it is more efficiently radiated to the outside in combination with absorption of light from the outside by the insulating layer. It becomes possible.
The light reflecting layer is made of any one of a Ni plating layer, an Au plating layer, and Ag, Pt, Pd, and Rh, and the metal layer is made of, for example, W, Mo, Cu, or Ag.

In the present invention, the hue H is in the range of 10P to 10PB to 10B, the lightness V is in the range of 1.5 to 5.5, and the saturation C is in the range of 0 to 3 on the surface of the white green sheet. A method of manufacturing a wiring board for mounting a light-emitting element, including a step of laminating and pressing a colored green sheet exhibiting a certain surface color may be included.
In this case, it is usual that a colored green sheet containing a pigment exhibiting a surface color in the above-mentioned range is laminated and pressure-bonded on the surface of a single-layer or multiple-layer green sheet exhibiting a white system, and then fired simultaneously. By carrying out this process with relatively few steps, it becomes possible to manufacture the light emitting element mounting wiring board reliably and inexpensively.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a plan view showing a light emitting element mounting wiring board (hereinafter simply referred to as a wiring board) 1 according to the present invention, and FIG. 2 is a cross-sectional view taken along the line XX in FIG. .
As shown in FIGS. 1 and 2, the wiring substrate 1 has a front surface 3 and a back surface 4 and is made of a ceramic body (insulating material) 2. A cavity 5 in which a light emitting diode (light emitting element) 18 is mounted in the center, and a ceramic layer (insulating layer) 8 including a pigment laminated on the surface 3 of the substrate body 2 and exhibiting a surface color in a predetermined range. I have.

As shown in FIGS. 1 and 2, the substrate body 2 is a rectangular parallelepiped having a substantially square shape in plan view and having a required thickness. For example, the substrate body 2 is made of a ceramic obtained by laminating and firing a plurality of green sheets mainly composed of alumina. The surface color (for example, white) which reflects light is exhibited. Incidentally, the size of the substrate body 2 is about 5 mm × 5 mm × 0.9 mm, a wiring layer and a via conductor 16 having a predetermined pattern (not shown) mainly composed of W or Mo are formed inside, and the back surface 4 is formed. A plurality of pads 17 are formed.
As the insulating material of the substrate body 2, for example, a glass-ceramic exhibiting the above surface color by laminating a plurality of glass-alumina-based green sheets and firing at low temperature may be used.

  As shown in FIGS. 1 and 2, the cavity 5 includes a bottom surface 6 that is circular in plan view, and a substantially conical side surface 7 that is inclined so as to spread from the periphery of the bottom surface 6 toward the surface 3 side of the substrate body 2. Have. The elevation angle of the side surface 7 is appropriately selected within a range of 30 to 70 degrees. Incidentally, the size of the cavity 5 is an inner diameter of the upper end of about 3.6 mm × depth of about 0.45 mm. The cavity 5 is formed by punching a green sheet with a punch and a die through a required clearance, thereby forming a green sheet in which the substantially conical through hole is formed, and another flat plate on the lower side. And a green sheet.

A metal layer 10 and a light reflecting layer 12 made of W or Mo are formed on the inclined side surface 7 of the cavity 5. The light reflecting layer 12 is composed of an underlying Ni plating layer and an Ag plating layer (both not shown) deposited thereon, and reflects the light from the light emitting diode 18 to radiate outside. In place of the Ag plating layer, a Pt, Pd, or Rh plating layer may be deposited on the uppermost layer.
As shown in FIGS. 1 and 2, a ceramic layer (insulating layer) 8 having a through hole 9 in a circular plan view on the inside and a thickness of about 10 to 30 μm is integrally formed on the surface 3 of the substrate body 2. Are stacked. The ceramic layer 8 has a surface color (e.g., black) in the hue ring in which the hue H is in the range of 10P to 10PB to 10B, the lightness V is in the range of 1.5 to 5.5, and the saturation C is in the range of 0 to 3. The through-hole 9 communicates with the upper end portion of the cavity 5 in substantially the same diameter and concentrically. For this reason, the ceramic layer 8 contains a predetermined amount of pigment in advance in order to exhibit the surface color. Since the ceramic layer 8 has the above thickness, it is difficult to see through. Therefore, when the ceramic layer 8 is laminated on the surface 3 of the substrate body 2, the surface color of the surface 3 can be prevented from appearing.

As shown in FIGS. 1 and 2, a pair of large and small pads 14 and 15 are formed on the bottom surface 6 of the cavity 5, and a light emitting diode 18 is mounted on the large pad 14 via solder (not shown). . The pads 14 and 15 are also made of W or Mo, and a Ni, Au, or Ag plating layer is formed on the surface thereof. The small pad 15 is electrically connected to the light emitting diode 18 via a bonding wire (not shown).
Further, in the cavity 5 in which the light emitting diode 18 is mounted and the pad 15 is connected to the pad 15 through a bonding wire, as shown by a one-dot chain line in FIG. Is filled and solidified, for example, to a position flush with the surface of the ceramic layer 8.

  According to the wiring board 1 as described above, the surface of the hue H, lightness V, and saturation C in the above ranges is formed on the surface 3 of the substrate body 2 made of ceramic exhibiting a surface color (white) that reflects light. A ceramic layer 8 that exhibits color and has a predetermined thickness is laminated. For this reason, since the light from the light emitting diode 18 mounted on the bottom surface 6 of the cavity 5 that opens to the surface 3 of the substrate body 2 is absorbed by the ceramic layer 8, the side surface 7 of the cavity 5. After being reflected by the light reflecting layer 12 deposited on the substrate, the light is efficiently radiated to the outside with almost no interference with light from the outside. Therefore, the light from the light emitting diode 18 to be mounted in the cavity 5 can be efficiently emitted to the outside.

Here, a method for manufacturing the wiring board 1 will be described.
As shown in FIG. 3, a plurality of green sheets s1 to s3 are prepared in advance.
The lower and middle green sheets s1 and s2 are sheets made of a ceramic material containing alumina as a main component and a glass component, and exhibit a white surface color that reflects light after firing. On the other hand, the uppermost green sheet s3 is a sheet formed by a doctor blade method after blending a required amount of pigment in order to exhibit a surface color in the above range after firing with respect to the ceramic material.
As shown in FIG. 3, the flat green sheet s1 is a laminate of a plurality of unit green sheets (not shown), and on the front surface 6, paste-like pad conductors 14a and 15a containing W or Mo powder are provided on the back surface. 4, a plurality of pad conductors 17a having the same paste shape as described above are formed by a screen printing method, and a paste-like via conductor 16a containing W powder or the like passes through and is conductive.

In FIG. 3, the green sheet s2 in the middle layer is formed by pressing a substantially conical die into a through hole formed by punching with a punch and a die through a required clearance or punching through a minimum clearance. A substantially conical through hole 7a is formed. A paste-like metal layer 10a containing W or Mo powder is formed on the inner peripheral surface (side surface) of the through hole 7a by a known printing method or the like.
In FIG. 3, the uppermost green sheet s3 has a flat cylindrical through-hole 9 inside by a minimum punching process. The inner diameter of the through hole 9 is substantially the same as the inner diameter of the upper end of the through hole 7a of the green sheet s2.

Next, as shown by the arrows in FIG. 3, the green sheets s1 to s3 are arranged such that the back surface of the green sheet s2 is in contact with the front surface 6 of the green sheet s1, and the back surface of the green sheet s3 is in contact with the front surface 3 of the green sheet s2. After laminating, these are pressure-bonded along the thickness direction. Alternatively, the green sheets s <b> 1 to s <b> 3 may be pressure-bonded each time they are stacked in the adjacent order. At this time, a solvent such as n-butyl phthalate, castor oil, n-butyl alcohol or the like may be applied in advance to the front surface 3 of the green sheet s2 or the back surface of the green sheet s3 so as to permeate with a required thickness.
As a result, as shown in FIG. 4, a green sheet laminate S composed of the substrate body 2 in which the green sheets s2 and s3 are laminated and pressed on the green sheet s1 is formed, and at the same time, the surface 3 of the substrate body 2 is formed. A substantially conical cavity 5 having a bottom surface 6 and a side surface 7 is formed in the through hole 9 of the green sheet s3.

Further, the green sheet laminate S made of the substrate body 2 obtained by laminating and pressing the green sheets s1 to s3 is fired for a predetermined time in a required temperature range.
As a result, as shown in FIG. 5, the green sheets s <b> 1 and s <b> 2 become the fired integrated substrate body 2 and exhibit a white surface color that reflects light. Further, as a result of firing, the green sheet s3 has a hue H in the range of 10P to 10PB to 10B, a lightness V of 1.5 to 5.5, and a saturation C of 0 to 3 in the hue ring. The ceramic layer 8 has a surface color. Further, the metal layer 10a, the pad conductors 14a and 15a, the via conductor 16a and the pad conductor 17a are baked to become the metal layer 10, the pads 14 and 15, the via conductor 16 and the pad 17.

Then, in the substrate body 2, electrolytic Ni plating and electrolytic Ag plating are sequentially performed on the fired metal layer 10. As a result, as shown in FIG. 5, a light reflection layer 12 composed of the Ni plating layer and the Ag plating layer is formed on the metal layer 10 on the side surface 7 of the cavity 5, and the wiring board 1 is obtained. .
According to the method of manufacturing the wiring board 1 through the above steps, the green sheet s3 to be the ceramic layer 8 having a surface color different from that of the board body 2 is laminated and pressure-bonded on the surface 3 of the board body 2 and The wiring substrate 1 can be formed by firing these simultaneously. For this reason, the wiring board 1 can be manufactured at low cost without requiring a special process or a large number of steps.
In addition, the said process can also manufacture the aggregate | assembly of the wiring board 1 using the large plate for multi-piece taking which has the green sheets s1-s3 along a plane direction.

FIG. 6 is a cross-sectional view showing a wiring board 1 a which is an application form of the wiring board 1.
As shown in FIG. 6, the wiring board 1 a has the same board body 2, cavity 5, pads 14, 15, and the like as described above, and on the surface 3 of the board body 2 than the inner diameter of the upper end portion of the cavity 5. The same ceramic layer 8 having a through hole 9 having a small inner diameter is laminated integrally. For this reason, the inner peripheral portion 8 a surrounding the through hole 9 of the ceramic layer 8 protrudes in a ring shape on the center side of the opening portion of the cavity 5.
In the same manner as described above, after the light emitting diode 18 is mounted on the bottom surface 6 of the cavity 5 and wire bonding is performed between the light emitting diode 18 and the small pad 15, before solidification in the cavity 5, as indicated by a one-dot chain line in FIG. The sealing resin j is filled and solidified.
As a result, since the ceramic layer 8 has the inner peripheral portion 8a, the solidified sealing resin j is difficult to peel off from the cavity 5, and the mounted light emitting diode 18 is protected, and the light is clear. It is possible to radiate outside.

FIG. 7 is a vertical cross section showing a wiring board 20 of a different form.
As shown in FIG. 7, the wiring board 20 has a front surface 23 and a back surface 24 and is made of a ceramic (insulating material) 22. The wiring board 20 is open to the front surface 23 of the substrate main body 22 and at the center of the bottom surface 26. A cavity 25 in which the light-emitting diode 18 is mounted, and a ceramic layer (insulating layer) 28 laminated on the surface 23 of the substrate body 22 and exhibiting a surface color in the above range are provided.
The substrate body 22 is made of the same ceramic as the substrate body 2, exhibits a surface color (for example, white) that reflects light, and has the same size as described above. A wiring layer or via conductor 16 having a predetermined pattern (not shown) mainly composed of W or Mo is formed inside the substrate body 22, and a plurality of pads 17 are formed on the back surface 24.
Note that the insulating material of the substrate body 22 may be, for example, a glass-ceramic exhibiting the above-described surface color obtained by firing a glass-alumina-based green sheet at a low temperature.

As shown in FIG. 7, the cavity 25 includes a bottom surface 26 having a circular shape in plan view, and a cylindrical side surface 27 erected vertically from the periphery of the bottom surface 26 toward the surface 23 side of the substrate body 22. The whole is cylindrical. The same metal layer 10 and light reflecting layer 12 as those described above are formed on the entire side surface 27 of the cavity 25.
As shown in FIG. 7, on the surface 23 of the substrate body 22, a ceramic layer 28 having a through-hole 29 having a circular shape in plan view and having a predetermined thickness is integrally laminated. The ceramic layer 28 has a surface color (for example, black) in the hue ring in which the hue H is in the range of 10P to 10PB to 10B, the lightness V is in the range of 1.5 to 5.5, and the saturation C is in the range of 0 to 3. ).
The through hole 29 of the ceramic layer 28 communicates with the cavity 25 approximately concentrically and concentrically with the cavity 25.

As shown in FIG. 7, the same pads 14 and 15 are formed on the bottom surface 26 of the cavity 25, and the light emitting diode 18 is mounted on the large pad 14 in the same manner as described above. It is electrically connected to the light emitting diode 18 through the bonding wire that is not.
Further, in the cavity 25 in which the light emitting diode 18 is mounted and the pad 15 is connected to the pad 15 through a bonding wire, as shown by a one-dot chain line in FIG. Is filled and solidified to a position that is flush with the surface of the ceramic layer 28.

  The wiring board 20 as described above also includes a pigment exhibiting the surface colors of hue H, lightness V, and saturation C within the above ranges on the surface 23 of the substrate body 22 made of ceramic exhibiting a surface color that reflects light. A ceramic layer 28 having a predetermined thickness is laminated. For this reason, the light from the light emitting diode 18 mounted on the bottom surface 26 of the cavity 25 is absorbed by the ceramic layer 28, so that the light reflecting layer 12 deposited on the side surface 27 of the cavity 25. After being reflected, the light is efficiently radiated to the outside with almost no interference with light from the outside. Therefore, the light from the light emitting diode 18 mounted in the cavity 25 can be efficiently emitted to the outside.

Here, an outline of a method for manufacturing the wiring board 20 will be described.
As shown in FIG. 8, a plurality of green sheets s1, s4, and s5 are prepared in advance.
The lower and middle green sheets s1 and s4 are ceramic material sheets containing alumina and glass components as main components, and exhibit a white system with a surface color that reflects light after firing. On the other hand, the uppermost green sheet s5 is a sheet formed by the doctor blade method after further blending the same pigment as the above ceramic material. The flat green sheet s1 is the same as described above.
In FIG. 8, the middle layer green sheet s4 has a cylindrical through hole 27a formed inside by punching with a punch and a die with a minimum clearance. The same metal layer 10a as described above is formed on the inner peripheral surface (side surface) of the through hole 27a.

In FIG. 8, the uppermost green sheet s <b> 5 also has a flat cylindrical through-hole 29 formed inside by a minimum punching process. The inner diameter of the through hole 29 is substantially the same as the inner diameter of the through hole 27a of the green sheet s4.
Next, as indicated by the arrows in FIG. 8, the green sheets s1, s4 are arranged such that the back surface of the green sheet s4 is in contact with the front surface 26 of the green sheet s1, and the back surface of the green sheet s5 is in contact with the front surface 23 of the green sheet s4. , S5 are laminated, and these are crimped along the thickness direction. Alternatively, the green sheets s1, s4, and s5 may be pressure bonded each time they are stacked in the adjacent order. At this time, the same solvent may be applied in advance to the front surface 23 of the green sheet s4 or the back surface of the green sheet s5.
As a result, a green sheet laminate similar to the above is formed, and a cavity 25 is formed that opens in the surface 23 of the substrate body 22 and the through hole 29 of the green sheet s5.

Further, the green sheet laminate S is fired for a predetermined time in a required temperature range.
As a result, as shown in FIG. 7, the green sheets s1 and s4 are fired to form an integrated substrate body 22 and exhibit a white surface color that reflects light.
Further, as a result of firing, the green sheet s5 has a hue H in the range of 10P to 10PB to 10B, a lightness V of 1.5 to 5.5, and a saturation C of 0 to 3 in the hue ring. The ceramic layer 28 has a surface color (black). Further, the metal layer 10a, the pad conductors 14a, 15a, etc. become the fired metal layer 10, the pads 14, 15 and the like.

Then, by sequentially performing electrolytic Ni plating and electrolytic Ag plating on the metal layer 10 in the fired substrate body 22, as shown in FIG. 7, on the metal layer 10 on the side surface 27 of the cavity 25, The light reflection layer 12 composed of the Ni plating layer and the Ag plating layer is formed, and the wiring board 20 is obtained.
Also in the method of manufacturing the wiring board 20 through the above steps, a ceramic layer 28 having a surface color different from that of the substrate body 22 is laminated and pressure-bonded on the surface 23 of the substrate body 22 and these are simultaneously fired. Since it is formed, the wiring board 20 can be manufactured at low cost without requiring a special process or a large number of steps.
In each of the above steps, it is also possible to manufacture an assembly of wiring boards 20 by using a large-sized plate having a large number of green sheets s1, s4, and s5.

FIG. 9 is a cross-sectional view showing a wiring board 20a which is an application form of the wiring board 20. As shown in FIG.
As shown in FIG. 9, the wiring board 20 a has the same substrate body 22, cavity 25, pads 14, 15, and the like as described above, and on the surface 23 of the substrate body 22, the inner diameter of the upper end portion of the cavity 25 is larger. The same ceramic layer 28 having a small inner diameter through hole 29 is integrally laminated. For this reason, the inner peripheral portion 28 a surrounding the through hole 29 of the ceramic layer 28 protrudes in a ring shape toward the center side of the opening portion of the cavity 25.
In the same manner as described above, after the light emitting diode 18 is mounted on the bottom surface 26 of the cavity 25 and wire bonding is performed between the light emitting diode 18 and the small pad 15, as shown by the one-dot chain line in FIG. The sealing resin j is filled and solidified.
As a result, since the ceramic layer 28 has the inner peripheral portion 28a, the sealing resin j is difficult to peel off from the cavity 25, protects the mounted light emitting diode 18, and makes the light clear and external. It is possible to radiate.

The present invention is not limited to the embodiments described above.
The ceramic which is an insulating material forming the substrate bodies 2 and 22 and the like may be mainly composed of mullite or aluminum nitride, for example. Alternatively, a glass-ceramic which is a kind of low-temperature fired ceramic may be used. In this case, Cu, Ag, or the like is used for the metal layer 10, the pads 14, 15 and the like.
The insulating material forming the substrate bodies 2 and 22 may be an epoxy resin or the like, and a plurality of resin insulating layers made of, for example, an epoxy resin are applied on the surface of the resin thin plate or metal thin plate. Alternatively, the cavities may be sequentially formed by pasting, and cavities may be formed in the relatively upper resin insulation layers by a known photolithography technique.

Further, the shape of the cavity is not limited to the substantially conical shape or the cylindrical shape, but includes a substantially elliptical cone shape whose diameter is reduced on the bottom side with respect to the opening side, a substantially long cone shape, and a polygonal pyramid shape having a quadrangular pyramid shape or more. The whole may be in the form of an elliptical cylinder, a long cylinder, or a polygonal column including a quadrangular column, and metal plating of the metal layer and the light reflection layer may be formed on these side surfaces.
Further, the inner peripheral portion surrounding the through hole of the uppermost insulating layer and projecting toward the center side of the cavity is not only in a form located on the entire circumference along the opening of the cavity, but also in a plurality of locations in the opening of the cavity. It is good also as a form which is located mutually apart.
In addition, the wiring board of the present invention has a plurality of cavities opening on the surface of one wiring board, or a plurality of mounting areas arranged on the bottom surface of a single cavity, and a plurality of light emitting elements are individually mounted on them. It is also possible to adopt a form.

The top view which shows the wiring board of one form in this invention. Sectional drawing along the arrow of the XX in FIG. Schematic which shows one manufacturing process of the said wiring board. Schematic which shows the manufacturing process following FIG. Schematic which shows the manufacturing process following FIG. The vertical sectional view which shows the application form of the said wiring board. The vertical sectional view which shows the wiring board of a different form. Schematic which shows one manufacturing process of the said wiring board. The vertical sectional view which shows the application form of the said wiring board.

Explanation of symbols

1, 1a, 20, 20a ......... Wiring board 2,22 …………………… Board body 3,23 ………………………… Surface 4,24 ……………… ………… Back 5,25 ………………………… Cavity 6,26 ………………………… Cavity bottom 7,27 ………………………… Side 8, 28 ………………………… Ceramic layer (insulating layer)
12 ……………………………… Light Reflecting Layer 18 ……………………………… Light Emitting Diode (Light Emitting Element)
s1 to s5 ……………………… Green sheet (insulating layer)

Claims (2)

A substrate body made of an insulating material exhibiting a surface color that reflects light, and having a front surface and a back surface;
Opening in the surface of the substrate body, a cavity composed of a bottom surface and a side surface;
Surface color that is laminated on the surface of the substrate body and has a hue H in the range of 10P to 10PB to 10B, a lightness V in the range of 1.5 to 5.5, and a saturation C in the range of 0 to 3 in the hue ring. An insulating layer exhibiting,
A wiring board for mounting a light-emitting element. The insulating material forming the substrate body is a white ceramic layer,
The insulating layer is a colored ceramic layer containing a pigment exhibiting the surface color.
The wiring board for mounting a light emitting element according to claim 1.

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