CN216132947U

CN216132947U - Electronic system

Info

Publication number: CN216132947U
Application number: CN202122475632.1U
Authority: CN
Inventors: 柯廷政; 周昭宇
Original assignee: Altek Biotechnology Co ltd
Current assignee: Altek Biotechnology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-03-25
Anticipated expiration: 2031-10-14

Abstract

The application discloses an electronic system, including electron device and treater, electron device includes first circuit board, sensing subassembly, second circuit board, electronic component, light-emitting component and camera lens. The first circuit board is provided with a first surface, a second surface and a first side surface, wherein the first surface and the second surface are opposite, and the first side surface is positioned between the first surface and the second surface. The sensing assembly is arranged on the first surface of the first circuit board and is electrically connected with the first circuit board. The second circuit board is located on the second surface of the first circuit board and is electrically connected with the first circuit board, and the second circuit board is provided with a third surface facing the first circuit board and a groove sunken in the third surface. The electronic component is arranged on the second surface of the first circuit board and is positioned in the groove. The light emitting component is at least arranged on the first side surface of the first circuit board. The lens is arranged on the sensing assembly. The sensing component receives the image transmitted by the lens, and the processor processes the image received by the sensing component.

Description

Electronic system

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic system.

Background

An endoscope is an electronic device that can enter a narrow duct for sensing. In order to allow the endoscope to smoothly enter a narrow duct, the diameter of the endoscope needs to be reduced. Further, the region of the endoscope where the lens, the circuit module, and other components are provided is not bendable, and the shorter the region that is not bendable, the better in order to allow the endoscope to flexibly move in a narrow duct.

Because the endoscope has a certain number of components, such as circuit components, a certain area of circuit board is required to carry the components and the related circuit layout. The endoscope is characterized in that the current endoscope is provided with parts on a flexible circuit board, and the flexible circuit board can be inserted into a shell with a small caliber in a bending way through the bendable characteristic of the flexible circuit board.

However, the bending of the flexible circuit board requires space, and a support member is required to assist, and the support member also occupies additional space, so that the bending area of the endoscope cannot be reduced.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic system, and the electronic device of the electronic system enables the electronic system to have smaller overall thickness through special configuration of a circuit board and parts.

The application provides an electronic system, which comprises an electronic device and a processor. The electronic device comprises a first circuit board, a sensing assembly, a second circuit board, an electronic assembly, a light-emitting assembly and a lens. The first circuit board is provided with a first surface, a second surface and a first side surface, wherein the first surface and the second surface are opposite, and the first side surface is positioned between the first surface and the second surface. The sensing assembly is arranged on the first surface of the first circuit board and is electrically connected with the first circuit board. The second circuit board is located on the second surface of the first circuit board and is electrically connected with the first circuit board, and the second circuit board is provided with a third surface facing the first circuit board and a groove sunken in the third surface. The electronic component is arranged on the second surface of the first circuit board and is positioned in the groove. The light emitting component is at least arranged on the first side surface of the first circuit board. The lens is arranged on the sensing assembly. The sensing component receives the image transmitted by the lens, and the processor processes the image received by the sensing component.

In some embodiments, the first circuit board has a first long side, the electronic component has a second long side, the first long side is parallel to the second long side, and the groove extends along an extending direction of the first long side.

In some embodiments, the first circuit board has a first long side, the electronic component has a second long side, the first long side is perpendicular to the second long side, and the groove extends along an extending direction of the second long side.

In some embodiments, each of the light emitting devices has two pads, and the two pads are connected to the first side surface of the first circuit board.

In some embodiments, each of the light emitting devices has two pads, one of the two pads is connected to the first side surface of the first circuit board, and the other pad is connected to the second side surface of the second circuit board.

In some embodiments, the electronic device further includes a plurality of transmission lines, the second circuit board has a fourth surface opposite to the third surface and a plurality of blind holes recessed in the fourth surface, and the transmission lines are respectively inserted into the blind holes to electrically connect to the second circuit board.

In some embodiments, the electronic device further includes a coaxial transmission line, the first circuit board has a third side surface adjacent to the first side surface and a first slot recessed in the third side surface, the second circuit board has a second side surface, a fourth side surface adjacent to the second side surface and a second slot recessed in the fourth side surface, the second slot corresponds to the first slot, the coaxial transmission line is located in the first slot and the second slot, an outer layer line of the coaxial transmission line is connected to the second circuit board, and an inner layer line of the coaxial transmission line is connected to the first circuit board.

In some embodiments, the second circuit board has a fourth surface opposite to the third surface and a blind hole recessed in the fourth surface, and the electronic device further includes a transmission line inserted into the blind hole to electrically connect the second circuit board.

In some embodiments, the electronic device further includes a coaxial transmission line, the second circuit board has a second side, a fourth side adjacent to the second side, and a second slot recessed in the fourth side, the coaxial transmission line is located in the second slot, an outer layer of the coaxial transmission line is connected to the second circuit board, and an inner layer of the coaxial transmission line is connected to the second side of the first circuit board.

In some embodiments, the second circuit board has a fourth surface adjacent to the third surface and a blind hole recessed in the fourth surface, and the electronic device further includes a transmission line inserted into the blind hole to electrically connect the second circuit board.

In view of the above, in the electronic system provided in the present application, the sensing component is disposed on the first side of the first circuit board, and the second circuit board is disposed on the second side of the first circuit board. Through the laminated structure of the circuit board, the circuit board does not need to be bent. Therefore, the electronic device in the application can avoid the situation that the flexible circuit board is bent and needs to be provided with the support frame for supporting and occupies a larger space when the flexible circuit board is adopted in the prior art. Therefore, the circuit components of the electronic device in the present application can occupy a small space. And the electronic component is arranged on the second surface of the first circuit board and is positioned in the groove of the second circuit board. The second circuit board can avoid the electronic component through the groove to be connected with the first circuit board, so that the thickness of the laminated structure of the two circuit boards can be effectively reduced. In addition, the light emitting component is at least arranged on the first side surface of the first circuit board. Therefore, the space on the side surface of the circuit board can be effectively utilized to prevent the light-emitting component from additionally occupying the space above and below the circuit board, so that the area of the circuit board can be reduced, the size of the electronic device can be further reduced, and the size of the electronic system can be further reduced.

Drawings

Fig. 1 is a schematic diagram of an electronic system according to an embodiment of the present application.

Fig. 2 is a partial perspective view of the electronic device of fig. 1.

Fig. 3 is an exploded perspective view of fig. 1.

Fig. 4 is a partial perspective side view of fig. 1.

Fig. 5A is a schematic partial perspective cross-sectional view taken along line a-a of fig. 4.

FIG. 5B is a schematic diagram of another embodiment of FIG. 5A.

Fig. 6A to 6D are schematic assembly flow diagrams of fig. 1.

Fig. 7A to 7E are schematic assembly flow diagrams in another embodiment of the present application.

Fig. 8 is a partial perspective view of an electronic device in another embodiment of the present application.

Fig. 9 is an exploded perspective view of fig. 8.

Fig. 10 is a partial perspective view of an electronic device in another embodiment of the present application.

In the figure:

a-a linking region; 10-an electronic system; 20-a processor; 30-a display; 100a, 100b, 100c, 100' -electronic device; 110a, 110b, 110c — a first circuit board; 111-a first side; 112-a second face; 113-a first side; 114-a first long side; 115-a third side; 116-a first slot; 120-a sensing component; 130a, 130b, 130 c-a second circuit board; 131-a third face; 132-a groove; 133-a second side; 134-fourth face; 135-blind hole; 136-a fourth side; 137-a second slot; 140-electronic components; 142-a second long side; 150-a light emitting component; 152-a pad; 160-lens; 172-a transmission line; 174-a coaxial transmission line; 1741-an insulating layer; 1742-outer layer circuit; 1743-an insulating layer; 1744-inner layer circuitry; 180-shell.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 is a schematic diagram of an electronic system in an embodiment of the present application, and fig. 2 is a partial perspective view of the electronic device of fig. 1. Referring to fig. 1 and fig. 2, an electronic system 10 of the present embodiment includes an electronic device 100a, a processor 20 and a display 30. The electronic system 10 is, for example, an endoscope system, and the electronic device 100a is, for example, an endoscope, and can be applied to medicine or industry.

The endoscope can enter the human body or the mechanism to be detected through various narrow pipelines. The sensing element 120 is capable of receiving the image transmitted by the lens 160 and transmitting a signal to the processor 20 through the transmission line 172, the processor 20 processes the image received by the sensing element 120, and the display 30 displays the image processed by the processor 20. Thus, the user can see the image of the human body or the interior of the structure to be detected through the display 30. Of course, the type of the electronic system 10 of the present embodiment is not limited thereto.

Fig. 3 is an exploded perspective view of fig. 1, and fig. 4 is a partial perspective side view of fig. 1. Referring to fig. 2 to 4, in the present embodiment, the electronic device 100a includes a first circuit board 110a, a sensing element 120, a second circuit board 130a, an electronic element 140, a light emitting element 150, a lens 160, and a housing 180. The housing 180 is rigid and encloses the first circuit board 110a, the sensing element 120, the second circuit board 130a, the electronic element 140, the light-emitting element 150 and the lens 160 to define an inflexible area of the electronic device 100 a.

In the embodiment, the first circuit board 110a and the second circuit board 130a are hard boards, so that the first circuit board 110a and the second circuit board 130a can be stably disposed in the housing 180 without the assistance of an additional supporting member, and the supporting member is prevented from occupying the space in the housing 180.

Specifically, the first circuit board 110a has a first surface 111 and a second surface 112 (fig. 4) opposite to each other, and further has a first side surface 113 located between the first surface 111 and the second surface 112. The sensing element 120 is disposed on the first surface 111 of the first circuit board 110a and electrically connected to the first circuit board 110 a. The lens 160 is disposed on the sensing assembly 120. The second circuit board 130a is disposed on the second surface 112 of the first circuit board 110a and electrically connected to the first circuit board 110 a.

In the prior art of using a flexible circuit board to configure components, the components are numerous, the caliber of a shell is small, the flexible circuit board needs to be inserted into the shell in a bending mode, and a support frame is needed to support the flexible circuit board, so that more space in the shell is occupied. Compared with the above situation, the electronic device 100a of the present embodiment configures the required components through the hard first circuit board 110a and the hard second circuit board 130a, so as to avoid the space occupied by the conventional bent circuit board and the conventional supporting frame.

As shown in fig. 2 to 4, the second circuit board 130a has a third surface 131 facing the first circuit board 110a and a groove 132 recessed in the third surface 131. The electronic component 140 is, for example, a capacitor, but the kind of the electronic component 140 is not limited thereto. The electronic component 140 is disposed on the second surface 112 of the first circuit board 110a and located in the groove 132. Therefore, the second circuit board 130a can avoid the electronic component 140 through the groove 132 and be well bonded with the first circuit board 110a for electrical connection, and the thickness of the laminated structure of the first circuit board 110a and the second circuit board 130a can be effectively reduced.

As shown in fig. 4, the portion of the second circuit board 130a in the groove 132 is not connected to the first circuit board 110a due to being recessed in the third surface 131. Therefore, the smaller the overlapping area of the first circuit board 110a and the groove 132 is, the larger the area of the electrical connection between the first circuit board 110a and the second circuit board 130a can be.

Fig. 5A is a schematic partial perspective cross-sectional view taken along line a-a of fig. 4, and fig. 5B is a schematic view of another embodiment of fig. 5A. It should be noted that, in fig. 5A and 5B, the boundary of the first circuit board 110a is indicated by a dotted line, and the area where the electrical connection between the first circuit board 110a and the second circuit board 130a can be performed is the dotted portion in the figure.

As shown in fig. 5A, in the present embodiment, the first circuit board 110a has a first long side 114, and the electronic component 140 has a second long side 142. In fig. 5A, the electronic component 140 yaws in the middle of the first circuit board 110 a. Specifically, the first long side 114 of the first circuit board 110a extends in the vertical direction, the second long side 142 of the electronic component 140 extends in the horizontal direction, and the first long side 114 is perpendicular to the second long side 142. In addition, the first long side 114 of the first circuit board 110a is perpendicular to the extending direction of the groove 132 of the second circuit board 130 a.

In the present embodiment, the electronic component 140 extends into the groove 132 of the second circuit board 130a, and the groove 132 extends along the extending direction of the second long side 142 of the electronic component 140. In order to increase the area of the second circuit board 130a, the width of the groove 132 is preferably smaller, and preferably only slightly larger than the width of the electronic component 140.

As shown in fig. 5A, in the case where the extending direction of the groove 132 is perpendicular to the first long side 114 of the first circuit board 110a, the area of the groove 132 across the first circuit board 110a is small. Therefore, the overlapping area of the first circuit board 110a and the groove 132 is smaller, and the connection area a of the first circuit board 110a and the second circuit board 130a is larger. Therefore, a larger space is provided between the first circuit board 110a and the second circuit board 130a for disposing more contacts for electrical connection.

But the application is not limited to the above. As shown in fig. 5B, in other embodiments, the first long side 114 can also be parallel to the second long side 142, and the groove 132 extends along the extending direction of the first long side 114. In addition, in other embodiments, the included angle between the first long side 114 and the second long side 142 may be any angle, and is not limited to the above angle. Similarly, the first circuit board 110a and the second circuit board 130a can have good bonding.

In addition, the light emitting element 150 is, for example, a Light Emitting Diode (LED), and the light emitting element 150 can provide illumination, so that the electronic device 100a can perform sensing well even when entering a dark place without illumination. As shown in fig. 3, in the present embodiment, the number of the light emitting elements 150 is two, and the two light emitting elements are respectively disposed on two opposite sides of the first circuit board 110 a.

In the present embodiment, each light emitting device 150 has two pads 152, and the two pads 152 are connected to the first side surface 113 of the first circuit board 110 a. Based on this, the light emitting assembly 150 can be combined with the first circuit board 110a at the time of manufacturing. Therefore, the alignment of the pads 152 during assembly is not required, and the assembly convenience can be improved.

However, the present application is not limited to the above, and in other embodiments, one of the two pads 152 is connected to the first side surface 113 of the first circuit board 110a, and the other is connected to the second side surface 133 of the second circuit board 130a (fig. 7C to 7E). Since the first circuit board 110a does not need to match the thickness of the light emitting element 150 for connecting two pads 152 at the same time, the first circuit board 110a can have a smaller thickness, so that the overall thickness of the electronic device 100a can be reduced.

As shown in fig. 4, in the present embodiment, the electronic device 100a further includes a plurality of transmission lines 172, and the second circuit board 130a has a fourth surface 134 disposed opposite to the third surface 131 and a plurality of blind holes 135 recessed in the fourth surface 134. The blind holes 135 are recessed in the fourth surface 134 of the second circuit board 130a but do not penetrate through the second circuit board 130a, and the blind holes 135 are connected to the circuit layers inside the second circuit board 130 a. After being inserted into the blind holes 135, the transmission lines 172 can be electrically connected to the circuit layers inside the second circuit board 130 a.

Fig. 6A to 6D are schematic assembly flow diagrams of fig. 1. Referring to fig. 6A to 6D, in the present embodiment, an assembling method of the electronic device 100a is as follows. First, as shown in fig. 6A, the two light emitting elements 150 are respectively disposed on two corresponding sides of the first circuit board 110a, and the sensing element 120 and the electronic element 140 are respectively disposed on the first surface 111 and the second surface 112 of the first circuit board 110 a.

As shown in fig. 6B, the second circuit board 130a is disposed on the second side 112 of the first circuit board 110a, and the electronic component 140 is located in the groove 132. As shown in fig. 6C, the lens 160 is disposed on the sensing assembly 120. Finally, as shown in fig. 6D, the transmission lines 172 are inserted into the blind holes 135 of the second circuit board 130a to electrically connect with the second circuit board 130 a.

Fig. 7A to 7E are schematic assembly flow diagrams of another embodiment of the present application. Referring to fig. 6A to 6D and fig. 7A to 7E, the difference between the assembly method of the present embodiment and the assembly method of fig. 6A to 6D is that the installation sequence of the light emitting elements 150 is different. Referring to fig. 7A to 7E, in the present embodiment, an assembly method of the electronic device 100' is as follows. First, as shown in fig. 7A, the sensing element 120 and the electronic element 140 are disposed on the first surface 111 and the second surface 112 of the first circuit board 110a, respectively.

As shown in fig. 7B, the second circuit board 130a is disposed on the second side 112 of the first circuit board 110a, and the electronic component 140 is located in the groove 132. As shown in fig. 7C, one of the two pads 152 is connected to the first side surface 113 of the first circuit board 110a, and the other is connected to a second side surface 133 of the second circuit board 130a, so that the light emitting element 150 spans between the first circuit board 110a and the second circuit board 130 a. As shown in fig. 7D, the lens 160 is disposed on the sensing assembly 120. Finally, as shown in fig. 7E, the transmission line 172 is inserted into the blind holes 135 of the second circuit board 130a to electrically connect with the second circuit board 130 a.

It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

Fig. 8 is a partial perspective view of an electronic device according to another embodiment of the present application. Fig. 9 is an exploded perspective view of fig. 8. Referring to fig. 2, fig. 3, fig. 8 and fig. 9, an electronic device 100b of the present embodiment is similar to the electronic device 100a of fig. 2 and fig. 3, and the difference therebetween is: in this embodiment, the electronic device 100b further includes a coaxial transmission line 174. The coaxial transmission line 174 has an outer line 1742 and an inner line 1744, the outer line 1742 is separated from the inner line 1744 by an insulating layer 1743, and the outer line 1742 is covered by an insulating layer 1741 as an outer layer.

The first circuit board 110b has a third side 115 adjacent to the first side 113 and a first slot 116 recessed in the third side 115, the second circuit board 130b has a fourth side 136 adjacent to the second side 133 and a second slot 137 recessed in the fourth side 136, and the second slot 137 corresponds to the first slot 116. The coaxial transmission line 174 is disposed in the first slot 116 and the second slot 137, the outer trace 1742 of the coaxial transmission line 174 is connected to the second circuit board 130b, and the inner trace 1744 of the coaxial transmission line 174 is connected to the first circuit board 110 b.

In the embodiment, the first slot 116 and the second slot 137 are respectively laid with a circuit, so as to electrically connect the circuit layers of the first circuit board 110b and the second circuit board 130 b. The outer layer 1742 of the coaxial transmission line 174 can transmit signals to the second circuit board 130b through the second slot 137 and then to the first circuit board 110b through the contact between the first circuit board 110b and the second circuit board 130 b.

In addition, the inner line 1744 of the coaxial transmission line 174 can directly transmit a signal to the first circuit board 110b through the first slot 116. Therefore, the requirement for signal transmission between the first circuit board 110b and the second circuit board 130b is reduced, and the number of contacts between the first circuit board 110b and the second circuit board 130b is reduced, thereby reducing the requirement for alignment accuracy.

In addition, in the present embodiment, the fourth surface 134 of the second circuit board 130b may also be provided with a blind via 135, and the electronic device 100b further includes a transmission line 172, wherein the transmission line 172 is inserted into the blind via 135 and electrically connected to the second circuit board 130 b. In the present embodiment, since a part of the signal can be transmitted through the inner layer 1744 and the outer layer 1742 of the coaxial transmission line 174, the signal transmission efficiency of one coaxial transmission line 174 can be equal to that of the two transmission lines 172. Therefore, the electronic device 100b of the present embodiment can reduce the number of the transmission lines 172 compared to the electronic device 100 a.

Fig. 10 is a partial perspective view of an electronic device according to another embodiment of the present application. Referring to fig. 8 and fig. 10, an electronic device 100c of the present embodiment is similar to the electronic device 100b of fig. 8, and the difference therebetween is: the electronic device 100c does not have the first slot 116. The coaxial transmission line 174 is disposed in the second slot 137, the outer layer 1742 of the coaxial transmission line 174 is connected to the second circuit board 130c, and the top end of the inner layer 1744 of the coaxial transmission line 174 is connected to the second side 112 of the first circuit board 110 c.

In this embodiment, the inner layer wire 1744 of the coaxial transmission line 174 can also directly transmit signals to the first circuit board 110 c. Therefore, the number of contacts between the first circuit board 110c and the second circuit board 130c is reduced, and the requirement for alignment accuracy is reduced. Moreover, compared with the electronic device 100b, the first circuit board 110c of the embodiment has a larger area because the first circuit board 110c does not have the first slot 116. In addition, since the alignment of the first slot 116 and the second slot 137 is not required, the process is easier.

In summary, in the electronic device of the present application, the sensing element is disposed on the first surface of the first circuit board, and the second circuit board is disposed on the second surface of the first circuit board. By adopting the laminated structure of the circuit board, the circuit board does not need to be bent. Therefore, when this novel electronic device of creating can keep away to have the adoption flexible circuit board now, flexible circuit board buckles and need set up the support frame support, and occupies the situation in great space. Therefore, the circuit components of the electronic device in the present application can occupy a small space. And the electronic component is arranged on the second surface of the first circuit board and is positioned in the groove of the second circuit board. The second circuit board can avoid the electronic component through the groove to be connected with the first circuit board, so that the thickness of the laminated structure of the two circuit boards can be effectively reduced. In addition, the light emitting component is at least arranged on the first side surface of the first circuit board. Therefore, the space on the side surface of the circuit board can be effectively utilized to prevent the light-emitting component from additionally occupying the space above and below the circuit board, so that the area of the circuit board can be reduced, and the size of the electronic device can be further reduced.

It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the utility model. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An electronic system, comprising an electronic device and a processor, wherein:

the electronic device includes:

the first circuit board comprises a first face and a second face which are opposite, and a first side face located between the first face and the second face;

the sensing assembly is arranged on the first surface of the first circuit board and is electrically connected with the first circuit board;

the second circuit board is positioned on the second surface of the first circuit board and is electrically connected with the first circuit board, and the second circuit board is provided with a third surface facing the first circuit board and a groove sunken in the third surface;

the electronic component is arranged on the second surface of the first circuit board and is positioned in the groove;

the light-emitting component is at least arranged on the first side surface of the first circuit board;

a lens disposed on the sensing assembly;

the processor is electrically connected with the electronic device, the sensing component receives the image transmitted by the lens, and the processor processes the image received by the sensing component.

2. The electronic system of claim 1, wherein the first circuit board has a first long side, the electronic component has a second long side, the first long side is parallel to the second long side, and the groove extends along an extending direction of the first long side.

3. The electronic system of claim 1, wherein the first circuit board has a first long side, the electronic component has a second long side, the first long side is perpendicular to the second long side, and the groove extends along an extending direction of the second long side.

4. The electronic system of claim 1, wherein each of the light emitting devices has two pads, and the two pads are connected to the first side of the first circuit board.

5. The electronic system of claim 1, wherein each of the light emitting devices has two pads, one of the two pads is connected to the first side of the first circuit board, and the other pad is connected to the second side of the second circuit board.

6. The electronic system of claim 1, wherein the electronic device further comprises a plurality of transmission lines, the second circuit board has a fourth surface opposite to the third surface and a plurality of blind holes recessed in the fourth surface, and the plurality of transmission lines are respectively inserted into the blind holes to electrically connect the second circuit board.

7. The electronic system of claim 1, wherein the electronic device further comprises a coaxial transmission line, the first circuit board has a third side adjacent to the first side and a first slot recessed in the third side, the second circuit board has a second side, a fourth side adjacent to the second side and a second slot recessed in the fourth side, the second slot corresponds to the first slot, the coaxial transmission line is located in the first slot and the second slot, an outer layer line of the coaxial transmission line is connected to the second circuit board, and an inner layer line of the coaxial transmission line is connected to the first circuit board.

8. The electronic system of claim 7, wherein the second circuit board has a fourth surface opposite to the third surface and a blind hole recessed in the fourth surface, the electronic device further comprising a transmission line inserted into the blind hole to electrically connect to the second circuit board.

9. The electronic system of claim 1, wherein the electronic device further comprises a coaxial transmission line, the second circuit board has a second side, a fourth side adjacent to the second side, and a second slot recessed in the fourth side, the coaxial transmission line is disposed in the second slot, an outer layer of the coaxial transmission line is connected to the second circuit board, and an inner layer of the coaxial transmission line is connected to the second side of the first circuit board.

10. The electronic system of claim 9, wherein the second circuit board has a fourth surface opposite to the third surface and a blind hole recessed in the fourth surface, the electronic device further comprising a transmission line inserted into the blind hole to electrically connect to the second circuit board.