CN207969077U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN207969077U CN207969077U CN201820270686.XU CN201820270686U CN207969077U CN 207969077 U CN207969077 U CN 207969077U CN 201820270686 U CN201820270686 U CN 201820270686U CN 207969077 U CN207969077 U CN 207969077U
- Authority
- CN
- China
- Prior art keywords
- routing region
- top layer
- ground plane
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 38
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002401 inhibitory effect Effects 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a printed circuit board relates to printed circuit board technical field. The printed circuit board includes: the top layer, the middle layer and the bottom layer are arranged in sequence; the intermediate layer includes at least: a ground plane; the non-wiring area of the top layer and/or the non-wiring area of the bottom layer are connected with the ground plane; and a copper film is laid on the non-wiring area of the top layer and/or the non-wiring area of the bottom layer. The utility model discloses printed circuit board is through being connected with the ground plane the no line region of walking of the no line region of top layer and/or bottom, and at the no line region of walking of the no line region of top layer and/or the no line region of bottom lay the copper film, not only can effectively reduce the ground wire impedance, weakens the high frequency signal in the ground wire, plays the inhibitory action to electromagnetic interference to reach electromagnetic shield's effect.
Description
Technical field
The utility model is related to printed circuit board technology fields, more particularly to a kind of printed circuit board.
Background technology
PCB (printed circuit board, Printed Circuit Board) is the support of circuit element and device in electronic product
Device, it provides the electrical connection between circuit element and device, is the most basic component part of various electronic equipments.PCB has
Point of single sided board (lamina), dual platen (doubling plate) and multi-layer board.Single sided board and dual platen are generally used for low, middle density wiring
Circuit and the lower circuit of integrated level, multi-layer board is for high-density wiring and the high circuit of integrated level.From the angle of electromagnetic compatibility
From the point of view of degree, single sided board and dual platen are not suitable for high speed circuit, and single side, double-sided wiring can not meet the requirement of high performance circuit.
And the development of multilayer wiring circuit provides a kind of possibility in order to solve the above problem, and its application becomes more and more extensive.
Nowadays, extensive and super large-scale integration is used widely in the electronic device, and component exists
Packing density on printed circuit board is higher and higher, and the transmission speed of signal is even more to be getting faster, and the electromagnetism caused therefrom is simultaneous
Capacitive problem also becomes more and more prominent.
Utility model content
The purpose of this utility model is to provide a kind of printed circuit boards, to solve the electricity on circuit board in the prior art
Magnetic compatibility issue.
To achieve the goals above, the printed circuit board that the utility model embodiment provides, including：
Top layer, middle layer and the bottom of sequence setting；
The middle layer includes at least：Ground plane；
Being connect with the ground plane without routing region without routing region and/or the bottom of the top layer；
The top layer is laid with copper film without routing region and/or the bottom without routing region.
Wherein, the passing through through-hole without routing region and connect with the ground plane without routing region and the bottom of the top layer
It connects.
Wherein, it is laid in the routing region of the thickness and the top layer without the first copper film on routing region of the top layer
Signal wire thickness it is equal, and be laid in the thickness without the second copper film on routing region of the bottom and the bottom
The thickness of the signal wire of routing region is equal.
Wherein, the ground plane is disposed adjacent with the top layer；
The ground plane is connect with the top layer without routing region；
The top layer is laid with third copper film without routing region.
Wherein, the ground plane is connect without routing region by the first blind hole with the top layer.
Wherein, the thickness of the third copper film is equal with the thickness of the signal wire of the routing region of the top layer.
Wherein, the ground plane is disposed adjacent with the bottom；
The ground plane is connect with the bottom without routing region；
The bottom is laid with the 4th copper film without routing region.
Wherein, the ground plane is connect without routing region by the second blind hole with the bottom.
Wherein, the thickness of the 4th copper film is equal with the thickness of the signal wire of the routing region of the bottom.
Wherein, the middle layer further includes：Bus plane, the bus plane between the ground plane and the bottom,
Or between the ground plane and the top layer.
The above-mentioned technical proposal of the utility model has the beneficial effect that：
In the said program of the utility model embodiment, by by top layer without routing region and/or bottom without cabling
Region is connect with ground plane, and lays copper film without routing region without routing region and/or bottom in top layer, can not only be had
Effect reduces grounding wire impedance, weakens the high-frequency signal in ground wire, inhibiting effect is played to electromagnetic interference, to reach electromagnetic shielding
Effect.
Description of the drawings
Fig. 1 is one of the structural schematic diagram of printed circuit board of the utility model embodiment；
Fig. 2 is the second structural representation of the printed circuit board of the utility model embodiment；
Fig. 3 is the third structural representation of the printed circuit board of the utility model embodiment.
Reference sign：
1- top layers；2- bottoms；3- ground planes；4- bus planes；The first copper films of 51-；The second copper films of 52-；53- third copper films；
The 4th copper films of 54-；6- through-holes；The first blind holes of 7-；The second blind holes of 8-.
Specific implementation mode
In order to make the technical problems, technical solutions and advantages to be solved by the utility model clearer, below in conjunction with attached drawing
And specific embodiment is described in detail.
The utility model discloses a kind of printed circuit boards, and as shown in FIG. 1 to 3, which includes：Sequence is set
Top layer 1, middle layer and the bottom 2 set；Middle layer includes at least：Ground plane 3；Top layer 1 without routing region and/or bottom 2
Connect with ground plane 3 without routing region；Top layer 1 is laid with copper film without routing region and/or bottom 2 without routing region.
It should be noted that top layer 1 and bottom 2 are PCB substrate.
As a preferred embodiment, as shown in Figure 1, top layer 1 is logical without routing region without routing region and bottom 2
Through-hole 6 is crossed to connect with ground plane 3.
It should be noted that ground plane 3 is disposed adjacent with top layer 1, as shown in Figure 1.Certainly, ground plane 3 also can be with bottom 2
It is disposed adjacent.
When ground plane 3 is disposed adjacent with bottom 2, top layer 1 leads to without routing region and passing through without routing region for bottom 2
Hole 6 is connect with ground plane 3.
Specifically, as shown in Figure 1, being laid in the thickness and top layer 1 without the first copper film 51 on routing region of top layer 1
The thickness of the signal wire of routing region is equal, and is laid in thickness without the second copper film 52 on routing region and the bottom of bottom 2
The thickness of the signal wire of the routing region of layer 2 is equal.
Here, in top layer 1 without routing region (place i.e. without being laid with conducting wire) laying ground connection copper film (the first copper film
51), and in bottom 2 without routing region (place i.e. without being laid with conducting wire) laying ground connection copper film (the second copper film 52), and
It is connect with ground plane 3 by through-hole 6, grounding wire impedance can be effectively reduced, weaken the height in ground wire from top layer 1 and 2 bilateral of bottom
Frequency signal plays inhibiting effect to electromagnetic interference, to achieve the effect that electromagnetic shielding.
It should be noted that the thickness of the first copper film 51 is equal with the thickness of the signal wire of the routing region of top layer 1, and the
The thickness of two copper films 52 is equal with the thickness of the signal wire of the routing region of bottom 2.The purpose is to facilitate batch machining.
As another preferred embodiment, as shown in Figure 2, it is preferred that ground plane 3 is disposed adjacent with top layer 1；Ground plane
3 connect with top layer 1 without routing region；Top layer 1 is laid with third copper film 53 without routing region.
Preferably, ground plane 3 is connect without routing region by the first blind hole 7 with top layer 1.
Here, in top layer 1 without routing region (place i.e. without being laid with conducting wire) laying ground connection copper film (third copper film
53) it, and by the first blind hole 7 with ground plane 3 connect, grounding wire impedance can be effectively reduced, weaken in ground wire from top layer 1 is unilateral
High-frequency signal plays inhibiting effect to electromagnetic interference, to achieve the effect that electromagnetic shielding.
In order to facilitate batch machining, it is preferred that the thickness of the thickness of third copper film 53 and the signal wire of the routing region of top layer 1
It spends equal.
As another preferred embodiment, as shown in Figure 3, it is preferred that ground plane 3 is disposed adjacent with bottom 2；Ground plane
3 connect with bottom 2 without routing region；Bottom 2 is laid with the 4th copper film 54 without routing region.
Preferably, ground plane 3 is connect without routing region by the second blind hole 8 with bottom 2.
Here, in bottom 2 without routing region (place i.e. without being laid with conducting wire) laying ground connection copper film (the 4th copper film
54) it, and by the second blind hole 8 with ground plane 3 connect, grounding wire impedance can be effectively reduced, weaken in ground wire from bottom 2 is unilateral
High-frequency signal plays inhibiting effect to electromagnetic interference, to achieve the effect that electromagnetic shielding.
In order to facilitate batch machining, it is preferred that the thickness of the thickness of the 4th copper film 54 and the signal wire of the routing region of bottom 2
It spends equal.
The printed circuit board of the utility model embodiment, middle layer further include：Bus plane 4, the bus plane 4 are located at ground plane
Between 3 and bottom 2 (as depicted in figs. 1 and 2), or between ground plane 3 and top layer 1 (as shown in Figure 3).
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, under the premise of not departing from principle described in the utility model, it can also make several improvements and retouch, these improvement
The scope of protection of the utility model is also should be regarded as with retouching.
Claims (10)
1. a kind of printed circuit board, which is characterized in that including：Top layer (1), middle layer and the bottom (2) of sequence setting；
The middle layer includes at least：Ground plane (3)；
Being connect with the ground plane (3) without routing region without routing region and/or the bottom (2) of the top layer (1)；
The top layer (1) is laid with copper film without routing region and/or the bottom (2) without routing region.
2. printed circuit board according to claim 1, which is characterized in that the top layer (1) without routing region and described
Bottom (2) is connect by through-hole (6) with the ground plane (3) without routing region.
3. printed circuit board according to claim 2, which is characterized in that be laid in the top layer (1) without routing region
On the first copper film (51) thickness it is equal with the thickness of signal wire of routing region of the top layer (1), and be laid in described
The thickness of the thickness and the signal wire of the routing region of the bottom (2) without the second copper film (52) on routing region of bottom (2)
It spends equal.
4. printed circuit board according to claim 1, which is characterized in that the ground plane (3) is adjacent with the top layer (1)
Setting；
The ground plane (3) connect with the top layer (1) without routing region；
The top layer (1) is laid with third copper film (53) without routing region.
5. printed circuit board according to claim 4, which is characterized in that the nothing of the ground plane (3) and the top layer (1)
Routing region is connected by the first blind hole (7).
6. printed circuit board according to claim 4, which is characterized in that the thickness of the third copper film (53) and the top
The thickness of the signal wire of the routing region of layer (1) is equal.
7. printed circuit board according to claim 1, which is characterized in that the ground plane (3) is adjacent with the bottom (2)
Setting；
The ground plane (3) connect with the bottom (2) without routing region；
The bottom (2) is laid with the 4th copper film (54) without routing region.
8. printed circuit board according to claim 7, which is characterized in that the nothing of the ground plane (3) and the bottom (2)
Routing region is connected by the second blind hole (8).
9. printed circuit board according to claim 7, which is characterized in that the thickness of the 4th copper film (54) and the bottom
The thickness of the signal wire of the routing region of layer (2) is equal.
10. printed circuit board according to claim 1, which is characterized in that the middle layer further includes：Bus plane (4), institute
Bus plane (4) is stated between the ground plane (3) and the bottom (2), or positioned at the ground plane (3) and the top layer
(1) between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820270686.XU CN207969077U (en) | 2018-02-26 | 2018-02-26 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820270686.XU CN207969077U (en) | 2018-02-26 | 2018-02-26 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207969077U true CN207969077U (en) | 2018-10-12 |
Family
ID=63739783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820270686.XU Expired - Fee Related CN207969077U (en) | 2018-02-26 | 2018-02-26 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207969077U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191570A (en) * | 2019-04-30 | 2019-08-30 | 湖南中普技术股份有限公司 | A kind of reduction electromagnetic interference and screen method |
| CN111123065A (en) * | 2018-10-30 | 2020-05-08 | 浙江宇视科技有限公司 | Method and device for inspecting printed circuit board wiring |
| CN116197477A (en) * | 2023-03-22 | 2023-06-02 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
| CN118475062A (en) * | 2023-11-15 | 2024-08-09 | 荣耀终端有限公司 | Electronic equipment |
-
2018
- 2018-02-26 CN CN201820270686.XU patent/CN207969077U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111123065A (en) * | 2018-10-30 | 2020-05-08 | 浙江宇视科技有限公司 | Method and device for inspecting printed circuit board wiring |
| CN110191570A (en) * | 2019-04-30 | 2019-08-30 | 湖南中普技术股份有限公司 | A kind of reduction electromagnetic interference and screen method |
| CN116197477A (en) * | 2023-03-22 | 2023-06-02 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
| CN118475062A (en) * | 2023-11-15 | 2024-08-09 | 荣耀终端有限公司 | Electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 Termination date: 20210226 |