CN117070183B - Composite insulating heat-conducting adhesive film with multilayer structure and preparation method thereof - Google Patents
Composite insulating heat-conducting adhesive film with multilayer structure and preparation method thereof Download PDFInfo
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- CN117070183B CN117070183B CN202310974902.4A CN202310974902A CN117070183B CN 117070183 B CN117070183 B CN 117070183B CN 202310974902 A CN202310974902 A CN 202310974902A CN 117070183 B CN117070183 B CN 117070183B
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- conducting layer
- heat conducting
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- 239000002131 composite material Substances 0.000 title claims abstract description 54
- 239000002313 adhesive film Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 164
- 239000004917 carbon fiber Substances 0.000 claims abstract description 164
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 54
- 239000004634 thermosetting polymer Substances 0.000 claims abstract description 53
- 238000010382 chemical cross-linking Methods 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract 3
- 239000000945 filler Substances 0.000 claims description 49
- 239000000203 mixture Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 229920002379 silicone rubber Polymers 0.000 claims description 14
- 239000004945 silicone rubber Substances 0.000 claims description 14
- 230000004323 axial length Effects 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000005470 impregnation Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000010426 asphalt Substances 0.000 claims 1
- VNWKTOKETHGBQD-YPZZEJLDSA-N carbane Chemical compound [10CH4] VNWKTOKETHGBQD-YPZZEJLDSA-N 0.000 claims 1
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 238000001947 vapour-phase growth Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 238000010292 electrical insulation Methods 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 106
- 230000000052 comparative effect Effects 0.000 description 17
- 239000011231 conductive filler Substances 0.000 description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000002134 carbon nanofiber Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- 150000005130 benzoxazines Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OKTJSMMVPCPJKN-YPZZEJLDSA-N carbon-10 atom Chemical compound [10C] OKTJSMMVPCPJKN-YPZZEJLDSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a compound insulating heat-conducting adhesive film with a multilayer structure and a preparation method thereof, wherein the compound insulating heat-conducting adhesive film comprises an upper insulating heat-conducting layer, a carbon fiber orientation heat-conducting layer and a lower insulating heat-conducting layer which are sequentially arranged, the carbon fiber orientation heat-conducting layer comprises carbon fibers, the carbon fibers have orientation properties which are axially perpendicular to the upper insulating heat-conducting layer and the lower insulating heat-conducting layer, and insulating thermosetting polymers are filled between the vertically oriented carbon fibers; and the upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer and the lower insulating heat conducting layer are connected through chemical crosslinking to form an interface layer. The composite insulating heat-conducting adhesive film with the multilayer structure has high heat conductivity, good electrical insulation property in the vertical direction and the horizontal direction, high interface stability and low interface thermal resistance, and the problems that the stability of materials is poor, the materials slide easily, the interface thermal resistance is generated, and the heat conducting property of the materials is reduced are avoided.
Description
Technical Field
The invention belongs to the technical field of heat-conducting composite materials, and particularly relates to a composite insulating heat-conducting adhesive film with a multilayer structure and a preparation method thereof.
Background
As electronic devices continue to move toward miniaturization, integration, and higher power, heat generated when the electronic devices are operated is continuously increased and accumulated in the electronic devices, resulting in a drastic increase in the operating temperature of the electronic devices. Since the normal operating temperature range of the electronic component is limited, when the operating temperature of the electronic component is higher than its allowable temperature, the reliability, stability and service life of the electronic component may be severely reduced. With the advent of the 5G era, the energy loss must be increased by the improvement of the transmission speed of the electronic device, the heat generation of the terminal device will be further aggravated, and the requirement of the electronic device on heat dissipation will be further improved.
Under the condition of low filling quantity, the traditional heat conduction polymer composite material is characterized in that fillers are uniformly dispersed in a polymer system, and the fillers are not contacted or interacted, and can not form a heat conduction path, so that the heat conduction coefficient is lower. In order to obtain a higher thermal conductivity, the amount of the thermal conductive filler needs to be increased. The high filler amount may cause deterioration of processability and mechanical properties of the polymer composite, and may cause an increase in density of the composite and an increase in production cost.
The carbon fiber has high thermal conductivity along the axial direction, and the thermal conductivity of the thermal conductive composite material can be greatly improved by utilizing the oriented arrangement of the carbon fiber. However, the application of the carbon fiber composite material is greatly limited due to the conductivity of the carbon fibers.
CN107396610B discloses an anisotropic carbon fiber insulating heat conducting pad prepared by electrostatic flocking, which has the disadvantage that although insulation in the vertical direction is ensured, the horizontal direction still has electric conductivity, and the heat conductivity coefficient in the horizontal direction of the material is not high due to the vertical orientation of the carbon fibers. The double-sided insulating anisotropic insulating heat conducting pad is formed by buckling two heat conducting pads with the same structure, and the method ensures that the material has poor stability, is easy to slip and can generate interface thermal resistance, thereby reducing the heat conducting property.
In view of this, it is an object of the present invention to solve the problems of the conventional insulating and heat conductive material, such as low thermal conductivity in the horizontal direction, electrical conductivity, poor stability of the material, easy sliding, and thermal interface resistance.
Disclosure of Invention
The invention aims to provide a composite insulating heat-conducting adhesive film with a multilayer structure and a preparation method thereof.
In order to achieve the above object, a first aspect of the present invention provides a composite insulating and heat conducting adhesive film with a multilayer structure, which is characterized in that:
The carbon fiber heat conducting layer comprises an upper insulating heat conducting layer, a carbon fiber oriented heat conducting layer and a lower insulating heat conducting layer which are sequentially arranged;
The carbon fiber oriented heat conduction layer comprises carbon fibers, the carbon fibers have orientation properties which are axially perpendicular to the upper insulating heat conduction layer and the lower insulating heat conduction layer, and insulating heat conduction fillers for bridging the carbon fibers and insulating thermosetting polymers for insulating in the horizontal direction are filled between the vertically oriented carbon fibers;
And the upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer and the lower insulating heat conducting layer are connected through chemical crosslinking to form an interface layer.
Preferably, the upper insulating heat conducting layer and the lower insulating heat conducting layer mainly comprise the following components in percentage by weight: 20-80% of insulating heat conducting filler and 20-80% of insulating thermosetting polymer.
Preferably, the carbon fiber oriented heat conducting layer is mainly composed of the following components in percentage by weight: 10-70% of insulating heat-conducting filler, 10-70% of carbon fiber and 10-70% of insulating thermosetting polymer.
Preferably, the insulating and heat conducting filler is one or a mixture of more of aluminum oxide, zinc oxide, magnesium oxide, boron nitride, silicon carbide, aluminum nitride, diamond and silicon micropowder. Wherein, the size and the morphology of the insulating heat conducting filler are not limited.
Preferably, the insulating thermosetting polymer is one of silicone rubber, epoxy resin, polyurethane, phenolic resin and benzoxazine.
Preferably, the carbon fiber is one of polyacrylonitrile carbon fiber, pitch-based carbon fiber, viscose-based carbon fiber, phenolic-based carbon fiber, vapor grown carbon fiber.
Preferably, the thickness of the upper and lower insulating heat conducting layers is 0.1-2mm, and the thickness of the carbon fiber oriented heat conducting layer is 0.5-5mm.
Preferably, the carbon fibers are inserted into a mixture of an insulating heat-conducting filler and an insulating thermosetting polymer through electrostatic flocking, and the mixture of the insulating heat-conducting filler and the insulating thermosetting polymer is filled and wrapped between the carbon fibers in vertical orientation; the carbon fiber, the insulating heat-conducting filler and the insulating thermosetting polymer which are positioned in the middle layer are heated and cured to form the carbon fiber oriented heat-conducting layer, and the insulating heat-conducting filler bridges the carbon fiber to form a heat-conducting channel in the horizontal direction and the vertical direction; and the upper insulating heat conducting layer and the lower insulating heat conducting layer are formed by heating and solidifying the insulating heat conducting filler and the insulating thermosetting polymer which are positioned above and below and exceed the axial length of the carbon fiber.
In order to achieve the above object, a second aspect of the present invention provides a method for preparing a composite insulating and heat conducting adhesive film with a multilayer structure, the method comprising the steps of:
step 100, fully mixing the insulating heat-conducting filler and the insulating thermosetting polymer, and coating the mixture on an upper substrate of the electrostatic flocking equipment;
Step 200, inserting carbon fibers into an insulating heat-conducting layer coated on an upper substrate through electrostatic flocking, and heating and curing;
Step 300, filling and coating a mixture of an insulating heat-conducting filler and an insulating thermosetting polymer by a vacuum impregnation method, wherein the filling length is higher than the axial length of the carbon fiber, and then heating and curing;
the carbon fiber orientation heat conduction layer is formed by heating and solidifying the carbon fiber, the insulating heat conduction filler and the insulating thermosetting polymer which are positioned in the middle layer, the upper insulating heat conduction layer and the lower insulating heat conduction layer are formed by heating and solidifying the insulating heat conduction filler and the insulating thermosetting polymer which are positioned above and below and exceed the axial length of the carbon fiber, and the upper insulating heat conduction layer and the carbon fiber orientation heat conduction layer and the lower insulating heat conduction layer are connected through chemical crosslinking to form an interface layer.
Preferably, the heating curing temperature in step 200 is 50-180 ℃ and the curing time is 10-60min.
Preferably, the vacuum degree of the vacuum impregnation in the step 300 is less than or equal to 0.09MPa, and the time is more than 10min; the heating curing temperature in the step 300 is 50-200 ℃ and the curing time is 10-80min.
The carbon fiber oriented heat conducting layer in the composite insulating heat conducting adhesive film with the multilayer structure can greatly improve the heat conducting performance of the material, and the insulating heat conducting filler is filled in the middle of the oriented carbon fiber, so that the effect of bridging the carbon fiber can be achieved, and the heat conducting performance of the material in the horizontal direction can be improved. Meanwhile, due to the isolation effect of the insulating heat conducting filler, the electric conductivity of the carbon fiber oriented heat conducting layer in the horizontal direction can be reduced. The upper and lower insulating heat conducting layers can give the material an electrical insulation property in the vertical direction.
The thickness of the insulating heat conducting layer and the thickness of the carbon fiber oriented heat conducting layer in the composite insulating heat conducting adhesive film with the multilayer structure are specifically limited, the thickness of the upper insulating heat conducting layer and the lower insulating heat conducting layer is 0.1-2mm, the thickness of the insulating heat conducting layer is too thin, the electrical insulation of the whole material is affected, and the thickness of the insulating heat conducting layer is too thick, the thermal conductivity of the material is affected. The thickness of the carbon fiber oriented heat conduction layer is 0.5-5mm, the thickness of the carbon fiber oriented heat conduction layer is greatly influenced by the size of the carbon fiber, and too thin the thickness of the carbon fiber oriented heat conduction layer indicates that the length of the carbon fiber is low, the heat conduction performance of the material is not improved, the high orientation of the carbon fiber cannot be ensured if the thickness of the carbon fiber oriented heat conduction layer is too thick, and the heat conduction performance of the material is also not improved.
The invention specifically limits the curing temperature and curing time in the step 200 of the preparation method of the composite insulating and heat conducting adhesive film with the multilayer structure, wherein the heating curing temperature is 50-180 ℃, and the curing time is 10-60min. The purpose of the curing process of this step is mainly to fix the oriented carbon fibers, the insulating thermosetting polymer does not need to be completely cured, and unreacted groups can generate an interfacial reaction during the curing process of the insulating heat conductive filler/insulating thermosetting polymer mixture impregnated and coated in step 300, so as to enhance the interlayer bonding force. The curing temperature and curing time in step 300 are higher than the curing temperature of step 200 to ensure complete curing of the insulating thermosetting polymer.
Compared with the prior art, the invention has the following advantages:
(1) The composite insulating heat-conducting adhesive film with the multilayer structure has high heat conductivity in the vertical direction and the horizontal direction, the carbon fibers are aligned to enable the adhesive film to have high heat conductivity in the vertical direction, and the composite insulating heat-conducting filler enables the adhesive film to have high heat conductivity in the horizontal direction.
(2) The composite insulating heat-conducting adhesive film with the multilayer structure has good electrical insulation, the upper and lower insulating heat-conducting layers ensure the electrical insulation performance of the adhesive film in the vertical direction, and the composite of the carbon fibers and the insulating heat-conducting filler in the middle carbon fiber oriented heat-conducting layer ensures that the electrical insulation of the adhesive film in the horizontal direction is also improved.
(3) The coating before electrostatic flocking and the insulating heat-conducting filler/insulating thermosetting polymer mixture for filling carbon fiber are the same, so that the mixing procedure is reduced.
(4) The upper, middle and lower three-layer structures are connected through chemical crosslinking, so that the problems of poor stability, easy sliding and poor heat conduction performance of the material are avoided, and the heat conduction performance of the material is reduced.
Drawings
FIG. 1 is a schematic cross-sectional view of a composite insulating and heat conducting adhesive film with a multilayer structure according to an embodiment of the invention;
Fig. 2 is a Scanning Electron Microscope (SEM) image of a cross section of a composite insulating and heat conducting adhesive film with a multilayer structure according to an embodiment of the invention.
The parts of the above figures are shown as follows:
1. An insulating heat conducting layer is arranged on the upper surface of the substrate;
2. A carbon fiber oriented thermally conductive layer;
3. a lower insulating heat conducting layer;
4. an interfacial layer;
5. An insulating thermally conductive filler;
6. An insulating thermoset polymer;
7. Carbon fiber.
Detailed Description
The invention is further described below with reference to the accompanying drawings and examples:
Examples: the present invention will be described in detail with reference to the drawings, wherein modifications and variations are possible in light of the teachings of the present invention, without departing from the spirit and scope of the present invention, as will be apparent to those of skill in the art upon understanding the embodiments of the present invention.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. Singular forms such as "a," "an," "the," and "the" are intended to include the plural forms as well, as used herein.
As used herein, the terms "comprising," "including," "having," and the like are intended to be open-ended terms, meaning including, but not limited to.
The term (terms) as used herein generally has the ordinary meaning of each term as used in this field, in this disclosure, and in the special context, unless otherwise noted. Certain terms used to describe the present disclosure are discussed below, or elsewhere in this specification, to provide additional guidance to those skilled in the art in connection with the description herein.
As shown in fig. 1, the invention provides a composite insulating and heat conducting adhesive film with a multilayer structure, wherein an upper insulating and heat conducting layer 1, a carbon fiber oriented heat conducting layer 2 and a lower insulating and heat conducting layer 3 are sequentially arranged on the composite insulating and heat conducting adhesive film from top to bottom;
The carbon fiber oriented heat conduction layer 2 comprises carbon fibers 7, the carbon fibers 7 have orientation properties perpendicular to the upper insulating heat conduction layer 1 and the lower insulating heat conduction layer 3 in the axial direction, and insulating heat conduction fillers 5 for bridging the carbon fibers 7 and insulating thermosetting polymers 6 for insulating in the horizontal direction are filled between the vertically oriented carbon fibers 7;
The upper insulating heat conducting layer 1 and the carbon fiber oriented heat conducting layer 2 and the lower insulating heat conducting layer 3 are connected through chemical crosslinking to form an interface layer 4.
The invention also provides a preparation method of the composite insulating heat-conducting adhesive film with the multilayer structure, which comprises the following steps:
step 100, fully mixing the insulating heat-conducting filler 5 and the insulating thermosetting polymer 6, and coating the mixture on an upper substrate of the electrostatic flocking equipment;
Step 200, inserting carbon fibers 7 into an insulating heat-conducting layer coated on an upper substrate through electrostatic flocking, and heating and curing;
Step 300, filling and coating the mixture of the insulating heat-conducting filler 5 and the insulating thermosetting polymer 6 by a vacuum impregnation method, wherein the filling length is higher than the axial length of the carbon fiber 7, and then heating and curing;
The carbon fiber orientation heat conduction layer 2 is formed by heating and solidifying the carbon fiber 7, the insulating heat conduction filler 5 and the insulating thermosetting polymer 6 which are positioned in the middle layer, the upper insulating heat conduction layer 1 and the lower insulating heat conduction layer 3 are formed by heating and solidifying the insulating heat conduction filler 5 and the insulating thermosetting polymer 6 which are positioned above and below and exceed the axial length of the carbon fiber 7, and the interface layer 4 is formed by chemical crosslinking connection between the upper insulating heat conduction layer 1 and the carbon fiber orientation heat conduction layer 2 and between the carbon fiber orientation heat conduction layer 2 and the lower insulating heat conduction layer 3.
The present invention will be described in detail with reference to specific examples. The present embodiment is implemented on the premise of the technical scheme of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present invention is not limited to the following examples.
Example 1
The embodiment 1 of the invention provides a composite insulating heat-conducting adhesive film with a multilayer structure, and the structure is shown in the attached figure 1. The insulating heat-conducting filler/insulating thermosetting polymer mixture is prepared by mixing the following components in parts by weight: 30% of silicone rubber and 70% of aluminum oxide. The mixture of the insulating heat conducting filler and the insulating thermosetting polymer is uniformly mixed and then coated on the upper surface substrate of the electrostatic flocking equipment, and the thickness is about 0.5mm. And then, placing the carbon fibers in a powder bin of an electrostatic flocking device for electrostatic flocking to obtain a vertically oriented carbon fiber substrate, and curing the carbon fiber substrate at 120 ℃ for 20min. The thickness of the carbon fiber oriented heat conducting layer is 3.0mm. And then, pouring the insulating heat-conducting filler/insulating thermosetting polymer mixture into the carbon fiber substrate for vacuum impregnation for 30min, wherein the height of the mixture is 0.5mm higher than that of the carbon fiber substrate. And finally, curing for 30min at 150 ℃ to obtain the composite insulating heat-conducting adhesive film with the multilayer structure. The carbon fiber oriented heat conduction layer mainly comprises the following components in percentage by weight: 15% of silicone rubber, 35% of alumina and 50% of carbon fiber. The SEM structure is shown in figure 2.
Example 2
The vast majority of the same is compared to example 1, except that the composition of the insulating thermally conductive filler/insulating thermosetting polymer mixture in this example 2 is: 20% of silicone rubber and 80% of aluminum oxide. The carbon fiber oriented heat conduction layer mainly comprises the following components in percentage by weight: 10% of silicone rubber, 40% of alumina and 50% of carbon fiber.
Example 3
The vast majority of the same is compared to example 1, except that the composition of the insulating thermally conductive filler/insulating thermosetting polymer mixture in this example 3 is: 80% of silicone rubber and 20% of aluminum oxide. The carbon fiber oriented heat conduction layer mainly comprises the following components in percentage by weight: 40% of silicone rubber, 10% of alumina and 50% of carbon fiber.
Example 4
The vast majority of the same is compared to example 1, except that the composition of the insulating thermally conductive filler/insulating thermosetting polymer mixture in this example 4 is: 50% silicone rubber, 50% alumina. The carbon fiber oriented heat conduction layer mainly comprises the following components in percentage by weight: 15% of silicone rubber, 15% of alumina and 70% of carbon fiber.
Example 5
In comparison with example 1, the same applies to the upper surface substrate of the electrostatic flocking device in example 5, except that the thickness of the insulating heat conductive filler/insulating thermosetting polymer mixture applied to the upper surface substrate is about 0.2mm, the height of the carbon fiber substrate impregnated with the insulating heat conductive filler/insulating thermosetting polymer mixture is about 0.2mm higher than the height of the carbon fiber substrate, and the thickness of the carbon fiber oriented heat conductive layer is 1.0mm.
Example 6
In comparison with example 1, the same applies to the upper surface substrate of the electrostatic flocking device in example 6, except that the thickness of the insulating heat conductive filler/insulating thermosetting polymer mixture applied to the upper surface substrate is about 1.0mm, the height of the carbon fiber substrate impregnated with the insulating heat conductive filler/insulating thermosetting polymer mixture is about 1.0mm higher than the height of the carbon fiber substrate, and the thickness of the carbon fiber oriented heat conductive layer is 4.0mm.
Examples 7 to 14
The same as in example 1 was found for the most part, except that the insulating and thermally conductive filler used in examples 7 to 14 was replaced with zinc oxide, magnesium oxide, boron nitride, silicon carbide, aluminum nitride, diamond, and fine silicon powder, respectively.
Example 15
Most of the same as in example 1 except that the insulating thermosetting polymer used in example 15 was replaced with an epoxy resin, the carbon fiber substrate had a curing temperature of 80℃and a curing time of 10 minutes, and the vacuum-impregnated curing temperature was 120℃and the curing time was 40 minutes.
Example 16
Most of the same as in example 1 except that the insulating thermosetting polymer used in this example 16 was replaced with polyurethane, the carbon fiber substrate had a curing temperature of 50℃for 10 minutes, and the vacuum-impregnated carbon fiber substrate had a curing temperature of 50℃for 80 minutes.
Example 17
Most of the same as in example 1 except that the insulating thermosetting polymer used in example 17 was replaced with a phenolic resin, the carbon fiber substrate had a curing temperature of 120℃and a curing time of 60 minutes, and the vacuum-impregnated curing temperature was 150℃and the curing time was 60 minutes.
Example 18
Most of the same as in example 1 except that the insulating thermosetting polymer used in this example 18 was replaced with benzoxazine, the curing temperature of the carbon fiber substrate was 180 ℃, the curing time was 10min, the curing temperature after vacuum impregnation was 200 ℃, and the curing time was 30min.
Example 19
Most of the same as in example 1 except that the insulating and thermally conductive filler in this example 19 was alumina and boron nitride in a weight ratio of 1: 1.
Example 20
Compared with example 1, the insulating and heat conductive filler is the same as in example 20 except that the weight ratio of alumina to silicon carbide is 1: 1.
Example 21
Most of the same as in example 1 except that the insulating and heat conductive filler in this example 21 was alumina and zinc oxide in a weight ratio of 1: 1.
In each of the above embodiments, the carbon fiber uses polyacrylonitrile carbon fiber, pitch-based carbon fiber, viscose-based carbon fiber, phenolic-based carbon fiber, or vapor grown carbon fiber.
Evaluation:
In examples 1 to 6, the insulating and heat conducting layer consisted of alumina and silicone rubber, and the carbon fiber orientation heat conducting layer consisted of alumina, carbon fiber and silicone rubber, and the curing conditions of the carbon fiber substrate were 120℃for 20min, and the dipping time was 30min, and the curing conditions after dipping were 150℃for 30min. The main differences between examples 1-6 and comparative examples 1-3 are shown in Table 1:
TABLE 1
We also prepared comparative example 4, comparative example 5, comparative example 6, comparative example 7, wherein:
Comparative example 4 is largely identical to example 1 except that no alumina is added to the insulating heat conductive layer and the carbon fiber oriented heat conductive layer;
comparative example 5 differs from example 1 in that no insulating and thermally conductive layer was included;
The preparation method of comparative example 6 is to mix the carbon fiber, alumina and silicone rubber uniformly in proportion by an internal mixer and then directly hot press the mixture to form, wherein the proportion of the carbon fiber, the alumina and the silicone rubber is the same as the proportion of the carbon fiber orientation heat conduction layer in example 1.
The preparation method of comparative example 7 is largely the same as that of example 1, except that the height of the mixture of the insulating heat conductive filler and the insulating thermosetting polymer impregnated by vacuum is identical to the axial length of the carbon fiber, and the composite material of the double-sided insulating multilayer structure is synthesized by buckling two heat conductive adhesive films of the same structure.
The heat conduction and electrical insulation properties of the composite insulating heat conduction adhesive films of the multilayer structures prepared in the above examples 1 to 6 of the present invention and the insulating heat conduction adhesive films of comparative examples 1 to 7 prepared additionally were tested as follows. Thermal conductivity test the electrical insulation performance test refers to the standard test method of the direct current resistance or conductance of ASTM D257-2014 insulation materials according to the standard test method of the heat transfer characteristics of ASTM D5470-2017 thermal conductive insulation materials. The performance in the horizontal direction is mainly tested by the performance of the carbon fiber oriented heat conducting layer. In addition, toluene solution stripping test is carried out on the composite material, the sample is soaked in toluene which can be a solvent capable of swelling the sample for 48 hours, whether the sample is stripped or not is observed, and the stability and the binding force of the multilayer structure are tested. The test results are shown in Table 2.
TABLE 2
From table 2 it can be seen that:
Compared with the embodiment 1, when the amount of the filled insulating and heat-conducting filler is less than 10%, the heat conductivity coefficients of the composite material in the vertical direction and the horizontal direction are respectively 5.1W/mk and 1.8W/mk, which obviously reduces, and shows that the heat conductivity of the composite material in the vertical direction and the horizontal direction is poor, and the volume resistivity of the composite material in the horizontal direction is 8.4 multiplied by 10 5 ohm cm, which obviously reduces, and the insulating property of the composite material is reduced. Comparative examples 2,3 compared with example 1, when the carbon fiber orientation heat conduction layer is less than 0.5mm (0.3 mm) or the upper and lower insulation heat conduction layers are more than 2mm (3 mm), the heat conduction property of the composite material in the vertical direction is significantly reduced because the carbon fiber orientation heat conduction layer plays a major role in the improvement of the heat conduction property of the composite material, and when the carbon fiber orientation heat conduction layer is less than 0.5mm or the insulation heat conduction layer is more than 3mm, the ratio of the carbon fiber orientation layer in the composite material is reduced, and thus the heat conduction property of the composite material in the vertical direction is significantly reduced.
Comparative example 4, which is lower in thermal conductivity in the vertical direction of 6.2W/mk, thermal conductivity in the horizontal direction of 1.1W/mk, and volume resistivity in the horizontal direction of 3.3x 4 Ω·cm than example 1 and other examples of the present invention, shows that the thermal conductivity in the entire and electrical insulation properties in the horizontal direction are inferior to those of the examples of the present invention due to the lack of the insulating thermal conductive filler (alumina), and also shows the effect of the insulating thermal conductive filler;
Compared with the embodiment 1 and other embodiments of the invention, the volume resistivity of the comparative example 5 in the vertical direction is 2.7X 2 Ω & cm and is at a lower level, which indicates that the electrical insulation performance in the vertical direction is poorer than the embodiments of the invention due to the absence of the insulating heat conducting layer in the comparative example 5, and the functions of the upper insulating heat conducting layer and the lower insulating heat conducting layer are also reflected;
Comparative example 6 has a thermal conductivity of 2.3W/mk in the vertical direction and a thermal conductivity of 2.2W/mk in the horizontal direction, which are both at a lower level than those of example 1 and other examples of the present invention, indicating that in comparative example 6, the carbon fibers were not vertically oriented due to the fact that the carbon fibers were not disposed in a vertical orientation but were mixed in an internal mixer, resulting in an insulating and thermally conductive film having a poorer thermal conductivity in the vertical direction than those of the examples of the present invention, and also exhibiting the effect of carbon fiber orientation.
Compared with the embodiment 1 and other embodiments of the invention, the embodiment 7 shows the condition of interfacial peeling after solution peeling test, which shows that the interfacial stability and the bonding force of the composite insulating and heat conducting adhesive film with the multilayer structure prepared by the invention are obviously better than those of the composite insulating and heat conducting adhesive film with the double-sided insulating and multilayer structure prepared by a buckling mode, because the interlayer interfaces of the multilayer structure are connected by chemical covalent bonds, and a stable interface structure is formed.
In addition, electron microscopy scanning is performed on the composite insulating and heat conducting adhesive film with the multilayer structure prepared in the embodiment 1, and fig. 2 is a Scanning Electron Microscopy (SEM) image of a cross section of the composite insulating and heat conducting adhesive film with the multilayer structure, in the SEM image, it can be seen that in the composite insulating and heat conducting adhesive film prepared by the preparation method in the embodiment 1, carbon fibers in a carbon fiber oriented and heat conducting layer are basically vertically oriented, insulating and heat conducting filler in the carbon fiber oriented and heat conducting layer is uniformly mixed with insulating and heat-curable polymer, and the insulating and heat conducting filler bridges the carbon fibers, so that the heat conducting performance of the carbon fiber oriented and heat conducting layer in the horizontal direction is improved, and meanwhile, due to the isolation effect of the insulating and heat conducting filler, the electric conductivity of the carbon fiber oriented and heat conducting layer in the horizontal direction can be reduced; in the SEM image, it can be seen that the upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer are connected through chemical crosslinking to form an interface layer, the interface layer enables the upper insulating heat conducting layer to be tightly connected with the carbon fiber oriented heat conducting layer (the lower insulating heat conducting layer and the carbon fiber oriented heat conducting layer are the same), the stability between the upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer is strong, sliding can not be generated except cutting, and interface resistance can not be generated, so that the composite insulating heat conducting adhesive film of the multilayer structure can be ensured to have good heat conducting performance all the time. In summary, compared with the comparative example, the composite insulating heat-conducting adhesive film with the multilayer structure prepared by the invention has high heat conductivity and good electrical insulation property in the vertical direction, the heat conductivity in the horizontal direction is also in a higher level, and the electrical insulation property in the horizontal direction is also improved.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (9)
1. A compound insulating heat conduction adhesive film with a multilayer structure is characterized in that:
The carbon fiber heat conducting layer comprises an upper insulating heat conducting layer, a carbon fiber oriented heat conducting layer and a lower insulating heat conducting layer which are sequentially arranged;
The carbon fiber oriented heat conduction layer comprises carbon fibers, the carbon fibers have orientation properties which are axially perpendicular to the upper insulating heat conduction layer and the lower insulating heat conduction layer, and insulating heat conduction fillers for bridging the carbon fibers and insulating thermosetting polymers for insulating in the horizontal direction are filled between the vertically oriented carbon fibers;
The upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer and the lower insulating heat conducting layer are connected through chemical crosslinking to form an interface layer, wherein the interface layer is formed as follows:
The carbon fiber is inserted into the insulating heat conducting layer coated on the upper substrate through electrostatic flocking and is heated and cured, and the insulating thermosetting polymer is not required to be completely cured at the moment; then, the carbon fiber, the insulating heat conducting filler and the insulating thermosetting polymer which are positioned in the middle layer are heated and cured to form a carbon fiber oriented heat conducting layer, the insulating heat conducting filler and the insulating thermosetting polymer which are positioned above and below and exceed the axial length of the carbon fiber are heated and cured to form an upper insulating heat conducting layer and a lower insulating heat conducting layer, and the upper insulating heat conducting layer and the carbon fiber oriented heat conducting layer and the lower insulating heat conducting layer are connected through chemical crosslinking to form an interface layer;
the upper insulating heat conducting layer and the lower insulating heat conducting layer mainly comprise the following components in percentage by weight: 20-80% of insulating heat conducting filler and 20-80% of insulating thermosetting polymer;
The carbon fiber oriented heat conduction layer mainly comprises the following components in percentage by weight: 10-70% of insulating heat-conducting filler, 10-70% of carbon fiber and 10-70% of insulating thermosetting polymer;
The thickness of the upper insulating heat conducting layer and the lower insulating heat conducting layer is 0.1-2mm, and the thickness of the carbon fiber oriented heat conducting layer is 0.5-5mm.
2. The composite insulating and heat conducting adhesive film with a multilayer structure according to claim 1, wherein: the insulating heat conducting filler is one or a mixture of more of aluminum oxide, zinc oxide, magnesium oxide, boron nitride, silicon carbide, aluminum nitride, diamond and silicon micropowder.
3. The composite insulating and heat conducting adhesive film with a multilayer structure according to claim 1, wherein: the insulating thermosetting polymer is one of silicone rubber, epoxy resin, polyurethane and phenolic resin.
4. The composite insulating and heat conducting adhesive film with a multilayer structure according to claim 1, wherein: the carbon fiber is one of polyacrylonitrile carbon fiber, asphalt-based carbon fiber, viscose-based carbon fiber, phenolic-based carbon fiber and vapor-phase growth carbon fiber.
5. The composite insulating and heat conducting adhesive film with a multilayer structure according to claim 1, wherein:
the carbon fibers are inserted into a mixture of an insulating heat-conducting filler and an insulating thermosetting polymer through electrostatic flocking, and the mixture of the insulating heat-conducting filler and the insulating thermosetting polymer is filled and wrapped between the carbon fibers in vertical orientation;
the carbon fiber, the insulating heat-conducting filler and the insulating thermosetting polymer which are positioned in the middle layer are heated and cured to form the carbon fiber oriented heat-conducting layer, and the insulating heat-conducting filler bridges the carbon fiber to form a heat-conducting channel in the horizontal direction and the vertical direction;
And the upper insulating heat conducting layer and the lower insulating heat conducting layer are formed by heating and solidifying the insulating heat conducting filler and the insulating thermosetting polymer which are positioned above and below and exceed the axial length of the carbon fiber.
6. A method for preparing a composite insulating and heat conducting adhesive film with a multilayer structure, which is used for preparing the composite insulating and heat conducting adhesive film with the multilayer structure according to any one of claims 1 to 5, and is characterized in that the preparation method comprises the following steps:
step 100, fully mixing the insulating heat-conducting filler and the insulating thermosetting polymer, and coating the mixture on an upper substrate of the electrostatic flocking equipment;
Step 200, inserting carbon fibers into an insulating heat-conducting layer coated on an upper substrate through electrostatic flocking, and heating and curing, wherein the insulating thermosetting polymer is not required to be completely cured;
Step 300, filling and coating a mixture of an insulating heat-conducting filler and an insulating thermosetting polymer by a vacuum impregnation method, wherein the filling length is higher than the axial length of the carbon fiber, and then heating and curing; the carbon fiber, the insulating heat-conducting filler and the insulating thermosetting polymer are positioned in the middle layer and are heated and cured to form a carbon fiber orientation heat-conducting layer, the insulating heat-conducting filler and the insulating thermosetting polymer which are positioned above and below and exceed the axial length of the carbon fiber are heated and cured to form an upper insulating heat-conducting layer and a lower insulating heat-conducting layer, and the upper insulating heat-conducting layer is connected with the carbon fiber orientation heat-conducting layer and the carbon fiber orientation heat-conducting layer is connected with the lower insulating heat-conducting layer through chemical crosslinking to form an interface layer.
7. The method for preparing the composite insulating and heat conducting adhesive film with the multilayer structure according to claim 6, wherein the method comprises the following steps: the heating curing temperature in the step 200 is 50-180 ℃ and the curing time is 10-60min.
8. The method for preparing the composite insulating and heat conducting adhesive film with the multilayer structure according to claim 6, wherein the method comprises the following steps: the vacuum degree of the vacuum impregnation in the step 300 is less than or equal to 0.09MPa, and the time is more than 10min; the heating curing temperature in the step 300 is 50-200 ℃ and the curing time is 10-80min.
9. The method for preparing the composite insulating and heat conducting adhesive film with the multilayer structure according to claim 6, wherein the method comprises the following steps: the curing temperature and curing time in step 300 are both higher than those in step 200.
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