CN111511494B

CN111511494B - Cost-effective lead-free solder alloys for electronic applications

Info

Publication number: CN111511494B
Application number: CN201880072316.8A
Authority: CN
Inventors: 穆德·哈斯宁; 立克·韦·霍
Original assignee: Alpha Metals Inc
Current assignee: Alpha Assembly Solutions Inc
Priority date: 2017-11-08
Filing date: 2018-10-31
Publication date: 2022-08-16
Anticipated expiration: 2038-10-31
Also published as: EP3706949A2; TWI821211B; US20190134757A1; TW201934768A; HUE065268T2; WO2019094241A2; KR102667729B1; CN111511494A; JP7273049B2; KR20200089269A; US20220080535A1; US20230356333A1; EP3706949B1; WO2019094241A3; SG11202004068XA; CN115178910A; JP2021502258A; US11123823B2; US11724342B2; CN115178910B

Abstract

A lead-free and silver-free solder alloy is disclosed that may include tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in place of cobalt. The alloy may also include nickel, germanium, or both. The copper may be present in an amount of about 0.5 wt% to 0.9 wt% of the solder. The bismuth may be present in an amount of about 1.0 wt% to about 3.5 wt% of the solder. The cobalt may be present in an amount of about 0.02 wt% to about 0.08 wt% of the solder. In the case of using gallium in place of cobalt, the gallium may be present in an amount of about 0.2 wt% to about 0.8 wt% of the solder. The antimony may be present in an amount of about 0.0 wt% to about 0.09 wt% of the solder. The balance of the solder is tin.

Description

Cost-effective lead-free solder alloys for electronic applications

Cross Reference to Related Applications

This application claims priority from U.S. provisional patent application Ser. No. 62/583,271 entitled "COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS" filed on 8.11.2017 and U.S. patent application Ser. No. 16/022,330 entitled "COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS" filed on 28.6.2018. U.S. provisional patent application serial No. 62/583,271 and U.S. patent application serial No. 16/022,330 are incorporated by reference herein in their entirety.

Technical Field

The present disclosure generally relates to lead-free, silver-free solder alloys for electronic applications.

Background

Solder alloys are widely used in the manufacture and assembly of a variety of electronic devices. Traditionally, the solder alloy is a tin-lead based alloy. Tin-lead based alloys are used to prepare solders with desired material properties, including suitable melting point and paste range, wetting properties, ductility and thermal conductivity. However, lead is a highly toxic material that is harmful to the environment, and this material may cause a wide range of harmful effects. Research has therefore focused on producing lead-free solder alloys with the desired material properties.

The present disclosure relates to a low cost lead-free solder alloy that provides desirable material properties including lower undercooling temperatures, minimal copper dissolution, improved mechanical properties, and long term reliability under harsh environmental conditions as compared to certain prior art alloys.

Disclosure of Invention

According to one aspect of the present disclosure, a lead-free and silver-free alloy comprises: 0.5 to 0.9 wt.% copper; 1.0 to 3.5 wt% bismuth; 0.02 to 0.08 wt% cobalt; 0.0 to 0.09 wt.% antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy further comprises 0.001 to 0.01 wt% germanium and/or 0.01 to 0.1 wt% nickel.

In accordance with another aspect of the present disclosure, a lead-free and silver-free alloy includes: 0.6 to 0.8 wt.% copper; 1.2 to 1.8 wt% bismuth; 0.04 to 0.06 wt% cobalt; 0.02 to 0.08 weight percent antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy further comprises 0.004 wt% to 0.008 wt% germanium and/or 0.03 wt% to 0.07 wt% nickel.

In accordance with another aspect of the present disclosure, a lead-free and silver-free alloy comprises: 0.7% by weight of copper; 1.5 wt% bismuth; 0.05 wt% cobalt; 0.05% by weight of antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy further comprises 0.006 wt.% germanium and/or 0.05 wt.% nickel.

In accordance with another aspect of the present disclosure, a lead-free and silver-free alloy comprises: 0.5 to 0.9 wt.% copper; 1.0 to 3.5 wt% bismuth; 0.2 to 0.8 wt.% gallium; 0.0 to 0.09 wt.% antimony; and the balance tin, and any unavoidable impurities.

In accordance with another aspect of the present disclosure, a lead-free and silver-free alloy comprises: 0.6 to 0.8 wt% copper; 1.2 to 1.8% by weight of bismuth; 0.4 to 0.6 wt.% gallium; 0.02 to 0.08 weight percent antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy further comprises 0.004 wt% to 0.008 wt% germanium and/or 0.03 wt% to 0.07 wt% nickel.

In accordance with another aspect of the present disclosure, a lead-free and silver-free alloy comprises: 0.7% by weight of copper; 1.5 wt% bismuth; 0.5 wt.% gallium; 0.05% by weight of antimony; and the balance tin, and any unavoidable impurities. Optionally, the alloy further comprises 0.006 wt.% germanium and/or 0.05 wt.% nickel.

It is to be understood that both the foregoing general description and the following detailed description describe various embodiments, and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.

Drawings

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the office upon request and payment of the necessary fee.

The following is a description of examples depicted in the accompanying drawings. The figures are not necessarily to scale and certain features and certain views of the figures may be shown exaggerated in scale or in schematic in the interest of clarity or conciseness.

FIG. 1A is an SEM micrograph of a prior art tin-copper alloy in a cast condition.

FIG. 1B is an SEM micrograph of a prior art tin-copper alloy that has been aged at 125 degrees Celsius for 24 hours.

Fig. 2A is an SEM micrograph of an alloy according to the present disclosure in a cast condition.

Fig. 2B is an SEM micrograph of an alloy according to the present disclosure that has been aged at 125 degrees celsius for 24 hours.

FIG. 3 is a Differential Scanning Calorimetry (DSC) plot of a prior art tin-copper alloy.

Fig. 4 is a Differential Scanning Calorimetry (DSC) plot of an alloy according to the present disclosure.

Fig. 5A is a bar graph showing a comparison between wetting times for two alloys according to the present disclosure and a prior art tin-copper alloy.

Fig. 5B is a bar graph showing a comparison between the maximum wetting force of two alloys according to the present disclosure and a prior art tin-copper alloy.

Fig. 6A is a bar graph showing a comparison between spreading rates of an alloy according to the present disclosure and tin-copper-nickel and tin-copper alloys of the prior art.

Fig. 6B is a bar graph showing a comparison between the spreadability of alloys according to the present disclosure and tin-copper-nickel and tin-copper alloys of the prior art.

Fig. 7A is a bar graph showing the spreading rate of an alloy according to the present disclosure on three different substrates.

Fig. 7B is a bar graph illustrating the spreadability of alloys according to the present disclosure on three different substrates.

Fig. 8A is a line graph showing a comparison between the copper wire dissolution rates of an alloy according to the present disclosure and a prior art tin-copper alloy at 260 ℃.

Fig. 8B is a line graph showing a comparison between the copper wire dissolution rates of an alloy according to the present disclosure and a prior art tin-copper alloy at 280 ℃.

Fig. 9A shows a series of comparative optical micrographs comparing the copper wire dissolution rate at 260 ℃ for alloys according to the present disclosure and prior art tin-copper alloys.

Fig. 9B shows a series of comparative optical micrographs comparing the copper wire dissolution rate at 280 ℃ for alloys according to the present disclosure and prior art tin-copper alloys.

Fig. 10A is a bar graph showing a comparison between the hardness of an alloy according to the present disclosure and a prior art tin-copper alloy.

Fig. 10B is a bar graph showing a comparison between the hardness of an alloy according to the present disclosure and a prior art tin-copper alloy, where both alloys have been isothermally aged at 150 ℃.

Fig. 11 is a graph showing stress-strain curves for an alloy according to the present disclosure and a prior art tin-copper alloy.

Fig. 12 is a bar graph showing a comparison of the ultimate tensile strength of an alloy according to the present disclosure and a prior art tin-copper alloy.

FIG. 13 is a line graph showing creep strain as a function of time for both an alloy according to the present disclosure and a prior art tin-copper alloy as cast and after aging at 150 ℃ for 144 hours.

Fig. 14A shows a series of photomicrographs of the interface between an alloy according to the present disclosure and an underlying copper substrate after aging at 150 ℃ for 240 hours, 720 hours, and 1440 hours.

Figure 14B shows a series of photomicrographs of the interface between the prior art tin-copper alloy and the underlying copper substrate after aging at 150 ℃ for 240 hours, 720 hours, and 1440 hours.

Fig. 15 is a line graph showing the total IMC thickness of an alloy according to the present disclosure and a prior art tin-copper alloy as a function of time of aging at 150 ℃.

FIG. 16 is Cu showing an alloy according to the present disclosure and a prior art tin-copper alloy ₃ Line graph of Sn IMC thickness as a function of time of aging at 150 ℃.

The foregoing summary, as well as the following detailed description, will be better understood when read in conjunction with the appended drawings. It should be understood that the claims are not limited to the arrangements and instrumentality shown in the drawings. Further, the appearance shown in the drawings is one of many decorative appearances that may be used to implement the described functionality of the device.

Detailed Description

In the following detailed description, specific details may be set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, to one skilled in the art, that the disclosed embodiments may be practiced without some or all of these specific details. Well-known features or processes may not be described in detail for the sake of brevity. In addition, like or identical reference numbers may be used to identify common or similar elements.

Described below are novel lead-free and silver-free solder alloy compositions suitable for use in a variety of electronic applications. These solder alloy compositions may be used in a variety of forms. For example, the solder alloy composition may be used in the form of a strip, wire, solder powder, solder paste, or other predetermined preform. These solder alloy compositions are tin-based.

It has been found that the compositions shown in tables 1 to 6 exhibit desirable properties over certain prior art alloys. For example, the lead-free and silver-free solder compositions in tables 1 to 6 provide a narrow paste range, excellent wetting and spreading performance, significantly reduced supercooling temperature, improved mechanical properties, and long-term reliability under severe environmental conditions. The "mushy range" may be defined as the temperature range between which the alloy is fully solid and fully liquid (the range between the solidus and liquidus on the phase diagram).

Table 1 provides several compositions comprising tin, copper, bismuth, cobalt, and antimony in accordance with the present disclosure.

TABLE 1

Tables 2 and 3 provide more compositions according to the present disclosure. As shown, these compositions may additionally comprise germanium or nickel.

TABLE 2

TABLE 3

Table 4 provides several alternative compositions comprising tin, copper, bismuth, gallium, and antimony in accordance with the present disclosure. According to these embodiments shown in table 3, gallium was used instead of cobalt.

TABLE 4

Tables 5 and 6 provide more compositions according to the present disclosure. As shown, these compositions may additionally comprise germanium or nickel.

TABLE 5

TABLE 6

The controlled addition of bismuth, antimony and/or cobalt to the tin-copper system can be used to refine the grain structure of the alloy and improve the mechanical strength of the alloy. More specifically, cobalt may be added to the alloy to refine the grain structure and reduce the undercooling temperature. Both bismuth and antimony are dissolved in tin and may be added to the alloy to provide solid solution strengthening. Bismuth lowers the solidus temperature and lowers its surface tension, thereby improving wettability. Antimony improves the mechanical strength of the alloy. The addition of antimony in small amounts (0 to 0.09 wt%) does not affect the melting characteristics of the alloy. The addition of antimony in large amounts increases the melting temperature of the alloy. Optionally, nickel may be added to further improve the mechanical properties of the alloy. In addition, elements such as germanium or phosphorus may be added to improve the oxidation resistance of the alloy. The proper synergy between the above mechanisms, achieved by the specific composition ranges claimed in this application, optimizes the mechanical properties of the alloy and the resistance of any resulting welds to thermal cycling.

Fig. 1A and 1B show scanning electron microscope ("SEM") micrographs of a surface region of an alloy comprising 99.3 wt.% tin and 0.7 wt.% copper. Fig. 2A and 2B show SEM micrographs of alloy surface areas according to the composition of example 3.4 shown in table 3. FIGS. 1A and 2A show the alloy as cast; while figures 1B and 2B show the alloy after aging at a temperature of 125 c for 24 hours. As can be seen from the SEM micrographs, the grain structure of the tin-copper alloy (as shown in fig. 1A and 1B) coarsens during aging at elevated temperatures. In contrast, the example 3.4 alloy maintained its finer, more uniform grain structure during aging at 125 ℃ (compare fig. 2A and 2B). The microstructure comprises Cu ₆ Sn ₅ And (4) precipitating. Both bismuth and antimony are dissolved in the tin matrix and thus may provide solid solution strengthening. Cobalt acts as a microalloying element to refine the microstructure. Finely distributed Cu ₆ Sn ₅ Precipitates and solid solution strengthening stabilize the microstructure during aging at elevated temperatures.

As shown in fig. 3 and 4, the melting characteristics of the solder alloy were determined by differential scanning calorimetry ("DSC"). The undercooling (i.e., the temperature difference between the start heating temperature and the start cooling temperature) of the solder alloy was measured. Supercooling occurs because the precipitation of crystals is not spontaneous but requires activation energy. Fig. 3 shows the DSC curve for an alloy comprising 99.3 wt.% tin and 0.7 wt.% copper. Figure 4 shows the DSC curve of an alloy according to the composition of example 3.4 shown in table 3. The DSC analysis data are shown in table 7.

TABLE 7

As can be seen by comparing fig. 3 and 4 and in table 7, the alloys of examples 3.3, 3.4 and 3.5 show a significant reduction in undercooling compared to the prior art tin-copper alloy. For tin-copper alloys, the heating temperature (T) is started ₁ ) At 227 ℃ and a starting cooling temperature (T) ₂ ) Is 211 ℃, providing a supercooling (Δ Τ) of 16 ℃. For example 3.4 alloy (e.g.), T ₁ At about 225 ℃ and T ₂ Is about 220 deg.c, providing a supercooling (Δ Τ) of about 5 deg.c.

Fig. 5A and 5B show a comparison between the wetting time (fig. 5A) and the maximum wetting force (fig. 5B) for tin-copper alloy (Sn-0.7Cu), example 3.4 alloy, and example 3.5 alloy. The wetting experiments were performed according to IPC (International Association for electronic industries) standard IPC-TM-650. The standard relates to a wetting balance test, which involves determining a total wetting time and a maximum wetting force. Shorter wetting times correspond to higher wettability. Shorter wetting times and greater wetting forces reflect better wetting performance in a given soldering process and are associated with spreading and fillet formation.

The wetting properties of solder can also be expressed in terms of spreading rate and spreadability. The spread area represents the amount of solder on the pad substrate, and may be expressed as a spread rate. The spreading test was carried out according to IPC (IPC J-STD-004B, TM 2.4.46) and JIS Z3197 standards. The spreading rate and spreadability of three different substrates were studied: bare copper (Cu), Organic Solderability Preservative (OSP) coated copper, and Electroless Nickel Immersion Gold (ENIG) copper plating. A flux is used to melt the solder alloy (circular preform) onto the substrate being tested. The wetted area was measured using an optical microscope before and after the test. The spreading rate was calculated by dividing the wetted area after reflow/melting by the wetted area before reflow/melting. The solder height was measured to calculate the spreadability (or spreading factor). The spreadability was calculated using the formula, where S _R Spreadability, D-solder diameter (assuming a spherical shape), and H-height of spread solderV ═ solder volume (g/cm) ³ ) (estimated from the quality and density of the solder tested):

wherein D is 1.248 XV ^1/3

Fig. 6A shows a comparison between the spreading rates of the example 3.4 alloy and the prior art SnCu-Ni and SnCu alloys on bare copper substrates at two different temperatures (260 ℃ and 300 ℃). Fig. 6B shows a comparison between the spreadability of the example 3.4 alloy and the prior art SnCu-Ni and SnCu alloys at two different temperatures (260 ℃ and 300 ℃).

Fig. 7A shows a comparison between the spreading rates of the example 3.4 alloy on three different copper substrates (OSP, bare copper and ENIG) at 255 ℃. Fig. 7B shows a comparison between the spreadability of the example 3.4 alloy on three different copper substrates (OSP, bare copper and ENIG) at 255 ℃.

Fig. 8A, 8B, 9A and 9B show a comparison between the copper dissolution rates of the tin-copper alloy (Sn-0.7Cu) and the alloy of example 3.4 (alloy-3) at 260 ℃ (fig. 8A and 9A) and 280 ℃ (fig. 8B and 9B). As can be seen from these figures, the copper dissolution rate of the example 3.4 alloy is rather slow compared to the tin-copper alloy. The copper dissolution test was performed using pure copper wire that was washed, degreased, cleaned in an acidic solution, rinsed and dried. The test was carried out at two temperatures (260 ℃ and 280 ℃). The copper wire was exposed to the molten solder for 5 seconds, 10 seconds, and 20 seconds. The cross-section of the copper wire was analyzed by optical microscopy, including area measurement and analysis.

Fig. 10A shows the hardness values of an example 3.4 alloy according to the present disclosure compared to a prior art tin-copper alloy (comprising 99.3 wt.% tin and 0.7 wt.% copper). As can be seen from the bar graph, the hardness of the example 3.4 alloy is 50% -100% higher than that of the prior art tin-copper alloy. Furthermore, the example 3.4 alloy remained hard after aging at elevated temperatures compared to the prior art tin-copper alloy, as shown in fig. 10B, which shows the hardness test results on casting after aging at 150 ℃ for 144 hours and after aging at 150 ℃ for 720 hours.

The Coefficient of Thermal Expansion (CTE) of the alloys according to the present disclosure was also measured. The mismatch between the CTE of the solder and the underlying substrate can lead to fatigue failure during cyclic loading. As the CTE mismatch increases, the shear strain also increases, which shortens the thermal cycle life of the component. Due to CTE mismatch, cracks may initiate and propagate at stress concentration sites. Cracks in the solder joint can be reduced by reducing the difference between the CTE of the solder and the underlying substrate. Table 8 shows the CTE of the alloy according to the present disclosure compared to the prior art tin-copper alloy and relative to the CTF of the example substrate below.

TABLE 8

The tensile stress-strain plot of the example alloy according to the present disclosure (example 3.4 alloy) compared to the prior art tin-copper alloy is shown in fig. 11. The cast solder was machined and cut into rectangular blocks of 100mm x 6mm x 3 mm. The samples were isothermally aged at 150 ℃ for up to 720 hours. Tensile test at room temperature at 10 ^-2 s ^-1 Is performed. The ultimate tensile strength and yield strength of the alloys are shown in table 9. The significant improvement in tensile strength shown in the example 3.4 alloy may be due to the addition of bismuth and the solid solution strengthening effect. The example 3.4 alloy is also shown to be more ductile than the prior art tin-copper alloy. The tensile strength properties of the alloy of example 3.4 and the prior art tin-copper alloy after aging at 150 ℃ are shown in figure 12. Both the example 3.4 alloy and the prior art tin-copper alloy showed a reduction in ultimate tensile strength after aging at elevated temperatures, but for the prior art tin-copper alloy the reduction was significantly greater, showing a 32% reduction in tensile strength.

TABLE 9

Creep deformation is the dominant failure mode of solder joints in microelectronic packages because of the high temperatures involved in the same source. Due to the difference in Coefficient of Thermal Expansion (CTE) between the chip and other layers within the package, the solder may experience thermomechanical stress. These stresses can cause plastic deformation over long periods of use. The solder alloy may creep even at room temperature. In real-life applications, the electronic module may operate in a temperature range of-40 ℃ to +125 ℃, which is in the range of 0.48 to 0.87T _m (fraction of solder melting temperature). For devices subjected to stress, this is a range of rapid creep deformation. Therefore, a thorough understanding of creep deformation in lead-free solders is a significant concern in the electronics packaging industry. The cast solder was machined and cut into rectangular pieces of 120mm x 6mm x 3 mm. The samples were isothermally aged at 150 ℃ for up to 144 hours. Creep testing was performed at room temperature at a stress level of 10 MPa. As shown in fig. 13, the example 3.4 alloy exhibits superior creep resistance compared to the prior art tin-copper alloy. The creep resistance exhibited by the alloy of example 3.4 may be due to the addition of micro-alloys for refining the microstructure and due to strengthening mechanisms such as solution and precipitation hardening.

During the soldering operation, material from the solid substrate may dissolve and mix with the solder, forming intermetallic compounds (IMCs). A thin, continuous and uniform layer of IMC is often important for good adhesion. Without the IMC, the solder/conductor joint would tend to weaken because no alloying interactions occur during the bonding process. However, a thick IMC layer at the interface may reduce the reliability of the solder joint, as the thick IMC layer may be fragile. The IMC layer formed between the solder and the OSP substrate was examined for changes with exposure time and temperature. The solder alloy is melted on the OSP substrate and reflowed in an Electrovert OmniExcel 7 Zone reflow oven using a flux. The solder alloy samples were then exposed to an elevated temperature of 150 c for 1440 hours. The IMC layers were evaluated at different aging periods.

FIG. 14A and FIG. 14BA comparison between IMC layer growth of the example 3.4 alloy and tin-copper alloy (Sn-0.7Cu) after aging at 150 ℃ for up to 1440 hours is shown. As can be seen from these figures, both the example 3.4 alloy and the tin-copper alloy show growth of the IMC layer. However, tin-copper alloys show signs of brittleness as shown by the presence of kirkendall voids (e.g., after 720 hours of aging). Both alloys show the formation of Cu at the boundary between the solder and the copper substrate ₆ Sn ₅ Layer and Cu ₃ And a Sn layer. FIG. 15 shows the total IMC thickness as a function of aging time. As shown in fig. 15, the IMC layer of the tin-copper alloy is much thicker than the IMC layer of the example 3.4 alloy. The addition of micro-alloys to refine the microstructure may limit diffusion and therefore also limit the overall IMC growth. The smaller IMC thickness in the example 3.4 alloy may make the example 3.4 alloy suitable for longer life applications at elevated temperatures. FIG. 16 shows total Cu ₃ Sn thickness as a function of aging time. In Cu ₆ Sn ₅ At the interface with the Cu substrate, both alloys form Cu ₃ A new layer of IMC in the form of Sn. In the alloy of example 3.4, the addition of the microalloy inhibited Cu ₃ Sn growth, which may limit the formation of kirkendall voids.

Some elements described herein are explicitly identified as optional, while other elements are not identified in this manner. Even if not so identified, it should be noted that in some embodiments, some of these other elements are not intended to be construed as being required, and are understood by those skilled in the art to be optional.

While the disclosure has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the method and/or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the scope thereof. For example, the systems, blocks, and/or other components of the disclosed embodiments may be combined, divided, rearranged, and/or otherwise modified. Therefore, the present disclosure is not limited to the particular embodiments disclosed. On the contrary, this disclosure is to cover all embodiments which fairly fall within the scope of the appended claims both literally and under the doctrine of equivalents.

Claims

1. A lead-free and silver-free solder alloy comprising:

0.6 to 0.8 wt.% copper;

1.2 to 1.8% by weight of bismuth;

0.04 to 0.06 wt% cobalt;

0.02 to 0.08 weight percent antimony; and

the balance tin, and any unavoidable impurities.

2. The lead-free and silver-free solder alloy of claim 1, further comprising 0.004 wt% to 0.008 wt% germanium.

3. The lead-free and silver-free solder alloy of claim 2, comprising 0.006% by weight germanium.

4. The lead-free and silver-free solder alloy of any of claims 1-3, further comprising 0.03 to 0.07 weight percent nickel.

5. The lead-free and silver-free solder alloy of claim 4, comprising 0.05 wt% nickel.

6. The lead-free and silver-free solder alloy of claim 1, comprising 0.7 wt% copper.

7. The lead-free and silver-free solder alloy of claim 1, comprising 1.5 wt% bismuth.

8. The lead-free and silver-free solder alloy of claim 1, comprising 0.05 wt% cobalt.

9. The lead-free and silver-free solder alloy of claim 1, comprising 0.05 weight percent antimony.

10. A lead-free and silver-free solder alloy comprising:

0.5 to 0.9 wt.% copper;

1.2 to 1.8% by weight of bismuth;

0.2 to 0.8 wt.% gallium;

0.02 to 0.08 weight percent antimony; and

the balance tin, and any unavoidable impurities.

11. The lead-free and silver-free solder alloy of claim 10, further comprising 0.001 to 0.01 weight percent germanium.

12. The lead-free and silver-free solder alloy of claim 11, comprising 0.006% by weight germanium.

13. The lead-free and silver-free solder alloy of claim 10, further comprising 0.01 to 0.1 wt% nickel.

14. The lead-free and silver-free solder alloy of claim 13, comprising 0.05 wt% nickel.

15. The lead-free and silver-free solder alloy of claim 10, comprising 0.7 wt.% copper.

16. The lead-free and silver-free solder alloy of claim 10, comprising 1.5 wt% bismuth.

17. The lead-free and silver-free solder alloy of claim 10, comprising 0.5 wt% gallium.

18. The lead-free and silver-free solder alloy of claim 10, comprising 0.05 weight percent antimony.