CN104360260A - Method for rapidly positioning low-temperature fault chip of circuit board and refrigerating device - Google Patents
Method for rapidly positioning low-temperature fault chip of circuit board and refrigerating device Download PDFInfo
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- CN104360260A CN104360260A CN201410657155.2A CN201410657155A CN104360260A CN 104360260 A CN104360260 A CN 104360260A CN 201410657155 A CN201410657155 A CN 201410657155A CN 104360260 A CN104360260 A CN 104360260A
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Abstract
The invention relates to a method for rapidly positioning a low-temperature fault chip of a circuit board and a refrigerating device. The method comprises the steps of firstly arranging a refrigerating piece on a suspected fault chip of the circuit board and using the refrigerating device to refrigerate the suspected fault chip; detecting whether a circuit board fault reoccurs or not after specified refrigerating time, determining that no low-temperature fault occurs on the suspected fault chip if the fault does not reoccur; stopping suspected fault chip refrigeration and performing natural temperature rise for specified time if the fault reoccurs, then detecting whether the circuit board fault reoccurs or not again, and determining that the low-temperature fault occurs on the suspected fault chip if the fault disappears. By means of the method and the refrigerating device, the fault chip of the circuit board can be accurately positioned in a low-temperature environment, blind chip replacement and manual operation in the low-temperature environment are avoided, and time and manpower and material resource cost are saved.
Description
Technical field
The present invention relates to a kind of method and refrigerating plant of quick position circuit board low temperature failure chip, belong to Electronic Assemblies and field tests.
Background technology
Along with the development of electronic technology and the communication technology, the volume of electronic product is more and more less, density is increasing, the dimensions of components and parts is more and more less, it is more and more that surface mount device SMD uses, this density that circuit board is assembled is more and more higher, localization of fault difficulty is increasing, the high density circuit board of especially two-sided Surface Mount, signal association is many, localization of fault difficulty, particularly at low ambient temperatures, oscillograph, the measurement such as multimeter facility is difficult to stretch into seal box inside to be tested, the personnel of troubleshooting simultaneously are also difficult to long working at low ambient temperatures, this makes the troubleshooting of circuit board low temperature abnormal difficult.Traditional troubleshooting means change at normal temperatures for the chip of suspected malfunctions, and then verify under entering low temperature environment.But when running into BGA, QFP chip, all need circuit board and SMD device continuous drying more than 24 hours during each replacing, the replacement cycle is long, location is also not necessarily accurate, and often repeatedly change, labor intensive material resources, waste the time, increase troubleshooting cost.
There are the products such as cold air circulating system in the market, the similar low temperature fault-location problem of special solution.But system complex, expensive, and air-cooled circulation can affect ambient chip unavoidably while to specified circuit refrigeration, scope control is poor, and cause the operation easier of circuit board low temperature fault troubleshooting technology large, cost is high.
Summary of the invention
The invention provides a kind of method and refrigerating plant of quick position circuit board low temperature failure chip, the low temperature troubleshooting facility being intended to solve volume larger is difficult to the less electronic product of measurement volumes, and troubleshooting personnel can not long-term operation under low temperature environment, replacing chip time is long, localization of fault is inaccurate, the problem that troubleshooting cost is high.
For solving the problems of the technologies described above, the method for quick position circuit board low temperature failure chip of the present invention comprises:
1) cooling piece is located on the suspected malfunctions chip of circuit board;
2) to the suspected malfunctions chip refrigeration being provided with cooling piece;
3) freeze after the fixed time, whether testing circuit plate fault reappears, if fault does not reappear, then low temperature fault does not occur this suspected malfunctions chip; If fault reproduction, to suspected malfunctions chip stop refrigeration and naturally intensification the fixed time after, whether testing circuit plate fault reappears again, if failure vanishes, judges this suspected malfunctions chip generation low temperature fault.
Described step 1) in one or at least two cooling pieces are set, one or at least two cooling pieces respectively correspondence are located on a suspected malfunctions chip or at least two suspected malfunctions chips.
To step 3) the low temperature failure chip that judges is according to step 3) process verify.
The refrigerating plant of quick position circuit board low temperature failure chip of the present invention: comprise power supply, and at least one cooling piece branch road of parallel connection, each cooling piece branch road is all by a cooling piece (Bn) and gauge tap (Kn) is in series accordingly.
This refrigerating plant also comprises relay and temperature controller, described relay is connected in the main line of described each cooling piece branch road, the coil of relay described in described temperature controller control linkage, each cooling piece correspondence is provided with temperature sensor, and each temperature sensor connects described temperature controller.
Described switch is toggle switch.
Described cooling piece is the semiconductor chilling plate of three-decker.
The invention has the beneficial effects as follows: troubleshooting process is totally enclosed, avoid low temperature frosting problem; Adopt semiconductor material " Peltier " effect refrigeration, static paster heat transfer, little on peripheral devices impact, thermal inertia is little, and adopts multi-stage refrigerating sheet, and refrigerating efficiency is high, multiple multi-stage refrigerating sheet composition low temperature fault diagnosis system, avoids the manual operation under low temperature; Set temperature controller, temperature-controllable is adjustable; Adopt low temperature troubleshooting method of the present invention, can at the low temperature failure chip of the accurate locating circuit board of normal temperature environment, failure chip is made to experience different state of temperatures, thus fault is reappeared and disappears, avoid the manual work under replacing chip blindly and low temperature environment, time and manpower is saved material resources cost.
Accompanying drawing explanation
Fig. 1 is the localization of fault process flow diagram of the embodiment of the present invention;
Fig. 2 is the refrigeration control device circuit diagram of the embodiment of the present invention;
Fig. 3 is the semiconductor refrigerating sheet heat radiator installation diagram of the embodiment of the present invention;
Fig. 4 is the source current of the embodiment of the present invention and the curve map of chill surface temperature.
Embodiment
Circuit board low temperature Fault Locating Method adopts cooling piece local refrigeration to carry out low temperature troubleshooting, therefore needs first to select refrigerating plant.The circuit theory diagrams of refrigeration control device as shown in Figure 2, comprise power supply, n toggle switch, n semiconductor chilling plate, n heat radiator, n temperature sensor, electromagnetic relay J1, current-limiting resistance R1, R2, reverse protection diode V1, temperature controller W1601.Power supply and n cooling piece branch circuit parallel connection, each cooling piece branch road be all by a toggle switch and a cooling piece in series.Electromagnetic relay J1 is connected in the main line of each cooling piece branch road, the coil of temperature controller W1601 control linkage electromagnetic relay J1, and each cooling piece correspondence is provided with temperature sensor, and each temperature sensor connects temperature controller W1601.N toggle switch (is numbered K1, K2, K3 ... Kn, n is natural number, suggestion n is not more than 8), n semiconductor chilling plate (is numbered B1, B2, B3 ... Bn, n is natural number), n heating radiator (is numbered L1, L2, L3 ... Ln, n is natural number), n temperature sensor (is numbered W1, W2, W3 ... Wn, n is natural number), the sub-K switch 1 of positive pole connection button of power supply, K2, K3 ... 1 pin of Kn, 2 pin of K1 connect 1 pin of B1, 2 pin of K2 connect 1 pin of B2, 2 pin of K3 connect 1 pin of B3, 2 pin of Kn connect 1 pin of Bn, B1, B2, B3 ... 2 pin of Bn connect the negative pole of power supply.
Cooling piece need be located on suspected malfunctions chip during detection, the two sides of cooling piece is also pasted with heat radiator and heat conduction rubber cushion respectively, and be also provided with temperature sensor in heat conduction rubber cushion, wherein temperature sensor is connected with temperature controller.Wherein, semiconductor chilling plate selects C1203-3P2040 specification, these specification semiconductor refrigerating sheet resistance values R=4 ~ 5.5 ohm, for 3-tier architecture, ground floor area=40mm × 40mm × 3.8mm, second layer area 30mm × 30mm × 3.8mm, third layer area 20mm × 20mm × 3.8mm, maximum temperature difference T
max=102 DEG C.
W1601 selected by temperature controller, temperature controlling range-50 DEG C ~ 102 DEG C.Heat conduction rubber cushion selects SP2000-20/AC specification, and this specification is the rubber cushion with biadhesive, and one side is for pasting suspected malfunctions chip, and another side is for pasting semiconductor chilling plate.
As shown in Figure 1, the concrete testing process of quick position circuit board low temperature failure chip method is provided below.
(1) semiconductor chilling plate is pasted to suspected malfunctions chip, installation of heat radiator, and be numbered, should sort to chip by the height of chip possible breakdown rate during numbering, as shown in Figure 3: heat conduction rubber cushion 3 is cut into the square identical with chip 5 surface area, and by heat conduction rubber cushion 3 chip 5 surface is attached to; The installed surface that semiconductor chilling plate 2 heats face and heating radiator 1 is evenly coated heat-conducting silicone grease, semiconductor chilling plate 2 is attached on heating radiator installed surface; Heat conduction rubber cushion 3 is offered a groove, temperature sensor 4 is imbedded wherein; Semiconductor chilling plate 2 with heating radiator 1 is attached on the heat conduction rubber cushion 3 of suspected malfunctions chip 5, is fixed with adhesive tape, come off to prevent semiconductor chilling plate 2.Chip that semiconductor chilling plate pastes is numbered, and the chip title recorded corresponding to each semiconductor chilling plate and item;
(2) faulty board is put into seal box, and be electrically connected;
(3) direct supply is opened, adjustment current parameters, temperature controller parameter, the curve map of electric current and temperature under reference low temperature, as shown in Figure 4, supply voltage should be set to 12V, current limliting 6A, the temperature of temperature controller set temperature needed for circuit board reproduction fault, cooling time is set as 3 minutes, controls refrigeration control device and makes it freeze to No. 1 chip;
(4) judge the step whether fault reappears after the refrigeration fixed time, judge "Yes", perform (5) step; Otherwise, perform (7) step;
(5) stop refrigeration to failure chip and coldly put more than 15 minutes, whether energising detects observes fault and disappears, and judges "Yes", performs (7) step after performing (6) step;
(6) fault under judgement n chip low temperature;
(7) judge n whether as maximal value, judge "No", perform step (10), judge "Yes", perform step (11);
(8) step of failure chip not in the suspected malfunctions chip range of 1 step is judged;
(9) again delimit suspected malfunctions chip range, and skip to 1 sequence of steps execution;
(10) control refrigeration control device, make it stop n chip refrigeration, and to n+1 chip refrigeration (n starts from 1), judge according to step (4); Assuming that when freezing to No. 1 chip, by K1 switch open, other switches should cut out, in like manner, assuming that when freezing to No. 2 chips, by K2 switch open, other switches should cut out ... in like manner, assuming that when freezing to n chip, by Kn switch open, other switches should cut out;
(11) again to freeze checking to the failure chip judged, whether energising detects observation fault and reappears;
(12) opening encapsulation case, removes electrical connection;
(13) low temperature troubleshooting terminates.
First delimit suspected malfunctions chip range in this embodiment, then cooling piece is set by the suspected malfunctions chip within the scope of this, chip in suspected malfunctions chip range may be one, also may be multiple, if two and two or more, then carry out sequencing numbers according to the height of the probability that breaks down, whether successively freeze to suspected malfunctions chip according to numbering, detect is failure chip, if all do not detect in whole suspected malfunctions chip range, fault occurs, then again delimit suspected malfunctions chip range and carry out new detection.In actual testing process, also can freeze to multiple suspected malfunctions chip simultaneously, after the refrigeration fixed time, the fault reproduction of detection failure plate, then illustrate that fault betides among described at least two suspected malfunctions chips of simultaneously freezing, and then carry out exclusive method detection and (successively can remove a chip, continue to detect remaining chip, one that determines that failure chip removes or in the remaining chip detected) or this among a small circle in detect, lock less sensing range rapidly, energy quick position failure chip, improves detection efficiency.
It should be noted last that: above embodiment is the non-limiting technical scheme of the present invention in order to explanation only, although with reference to above-described embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that; Still can modify to the present invention or equivalent replacement, and not depart from any modification or partial replacement of the spirit and scope of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (7)
1. a method for quick position circuit board low temperature failure chip, it is characterized in that, the method comprises the steps:
1) cooling piece is located on the suspected malfunctions chip of circuit board;
2) to the suspected malfunctions chip refrigeration being provided with cooling piece;
3) freeze after the fixed time, whether testing circuit plate fault reappears, if fault does not reappear, then low temperature fault does not occur this suspected malfunctions chip; If fault reproduction, to suspected malfunctions chip stop refrigeration and naturally intensification the fixed time after, whether testing circuit plate fault reappears again, if failure vanishes, judges this suspected malfunctions chip generation low temperature fault.
2. the method for a kind of quick position circuit board low temperature failure chip according to claim 1, it is characterized in that, described step 1) in one or at least two cooling pieces are set, one or at least two cooling pieces respectively correspondence are located on a suspected malfunctions chip or at least two suspected malfunctions chips.
3. a kind of method of quick position circuit board low temperature failure chip according to claim 1 or 2, is characterized in that, to step 3) the low temperature failure chip that judges is again according to step 3) process verify.
4. the refrigerating plant of a quick position circuit board low temperature failure chip, it is characterized in that, comprise power supply, and at least one cooling piece branch road of parallel connection, each cooling piece branch road is all by a cooling piece (Bn) and gauge tap (Kn) is in series accordingly.
5. the refrigerating plant of a kind of quick position circuit board low temperature failure chip according to claim 4, it is characterized in that, also comprise relay and temperature controller, described relay is connected in the main line of described each cooling piece branch road, the coil of relay described in described temperature controller control linkage, each cooling piece correspondence is provided with temperature sensor, and each temperature sensor connects described temperature controller.
6. a kind of refrigerating plant of quick position circuit board low temperature failure chip according to claim 4 or 5, it is characterized in that, described switch is toggle switch.
7. the refrigerating plant of a kind of quick position circuit board low temperature failure chip according to claim 6, it is characterized in that, described cooling piece is the semiconductor chilling plate of three-decker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410657155.2A CN104360260A (en) | 2014-11-18 | 2014-11-18 | Method for rapidly positioning low-temperature fault chip of circuit board and refrigerating device |
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| CN201410657155.2A CN104360260A (en) | 2014-11-18 | 2014-11-18 | Method for rapidly positioning low-temperature fault chip of circuit board and refrigerating device |
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| CN201410657155.2A Pending CN104360260A (en) | 2014-11-18 | 2014-11-18 | Method for rapidly positioning low-temperature fault chip of circuit board and refrigerating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467296A (en) * | 2015-12-05 | 2016-04-06 | 中国航空工业集团公司洛阳电光设备研究所 | A circuit board fault detection method and a protection processing method thereof |
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| CN101303369A (en) * | 2007-01-22 | 2008-11-12 | 三星电子株式会社 | Test sockets, test equipment including the same and methods of testing semiconductor packages using the same |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH02312254A (en) * | 1989-05-26 | 1990-12-27 | Fujitsu Ltd | Low-temperature characteristic measuring device |
| US6407567B1 (en) * | 2000-06-29 | 2002-06-18 | Advanced Micro Devices | IC Device burn-in method and apparatus |
| US20030197518A1 (en) * | 2002-04-23 | 2003-10-23 | Fujitsu Limited | Semiconductor device low temperature test apparatus using electronic cooling element |
| TWI226445B (en) * | 2003-10-22 | 2005-01-11 | Progenic Technologies Co Ltd | Integrated circuit testing system |
| JP2005156172A (en) * | 2003-11-20 | 2005-06-16 | Nippon Eng Kk | Test burn-in device for middle power and high power ic |
| CN101303369A (en) * | 2007-01-22 | 2008-11-12 | 三星电子株式会社 | Test sockets, test equipment including the same and methods of testing semiconductor packages using the same |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
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| CN105467296A (en) * | 2015-12-05 | 2016-04-06 | 中国航空工业集团公司洛阳电光设备研究所 | A circuit board fault detection method and a protection processing method thereof |
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Application publication date: 20150218 |
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