CN103454033B - Polycrystalline pressure sensor chip and preparation method thereof - Google Patents
Polycrystalline pressure sensor chip and preparation method thereof Download PDFInfo
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- CN103454033B CN103454033B CN201210177498.XA CN201210177498A CN103454033B CN 103454033 B CN103454033 B CN 103454033B CN 201210177498 A CN201210177498 A CN 201210177498A CN 103454033 B CN103454033 B CN 103454033B
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Abstract
The present invention provides a kind of polycrystalline pressure sensor chip.This polycrystalline pressure sensor chip is internally provided with pressure sensor circuit, and is electrically connected to compensate the compensating element, of the voltage drift caused because of variations in temperature with described pressure sensor circuit.The preparation method that the present invention also provides for this chip.Pressure sensor chip of the present invention is internally provided with the compensating element, compensating the voltage drift caused because of variations in temperature so that the compensation ability of this chip is preferably.
Description
Technical field
The present invention relates to semiconductor technology, more particularly, to the voltage compensation technology that the variations in temperature of polycrystalline pressure transducer causes.
Background technology
At MEMS (Micro-Electro-MechanicalSystem, MEMS) in, as the piezoresistive pressure sensor of force-sensing parts, it has negative temperature coefficient, and this makes the output voltage of this sensor easily raise along with ambient temperature and produce opposite direction drift.
For this problem, conventional solution includes hardware compensating and software compensation two kinds.Hardware compensating is after pressure sensor chip encapsulates, and carries out serial or parallel connection with suitable temperature-sensitive element and this pressure sensor chip, thus the output voltage drift that variations in temperature is caused.But at present comparatively ripe hardware compensating circuit is directed to monocrystalline diffusion silicon pressure sensor, but not polycrystalline pressure transducer.Owing to the temperature-coefficient of electrical resistance of polycrystalline pressure transducer is less than the temperature-coefficient of electrical resistance of monocrystalline pressure transducer, so the hardware compensating mode being applicable to monocrystalline pressure transducer is not necessarily applied to polycrystalline pressure transducer, therefore in the compensation of polycrystalline pressure transducer, it is necessary to carry out test repeatedly to select suitable temperature-sensitive element.When software compensation is to come into operation after the chip is packaged, directly being calibrated compensating with software, although this method is simply controlled, but range of application is narrower.
Summary of the invention
In view of this, the present invention provides a kind of polycrystalline pressure sensor chip, and wherein, described chip internal is provided with pressure sensor circuit, and is electrically connected to compensate the compensating element, of the voltage drift caused because of variations in temperature with described pressure sensor circuit.
Alternatively, described compensating element, is critesistor.
Alternatively, described polycrystalline pressure sensor chip is piezoresistive pressure sensor.
According to an aspect of the present invention, described critesistor and described piezoresistive pressure sensor circuit in parallel.According to another aspect of the present invention, described critesistor and described piezoresistive pressure sensor circuit connected in series.
The present invention also provides for a kind of method preparing polycrystalline pressure sensor chip, and wherein, described method includes injecting trivalent or pentad in chip manufacturing proces in adulterant injection technology to form critesistor.The element injected is preferably boron.Alternatively, adulterant injection technology is injected trivalent or pentad to occur before forming pressure sensor circuit to form critesistor.
Polycrystalline pressure sensor chip according to the present invention, temperature-sensitive element is just formed in the forming process of chip, thus unlike prior art, it is necessary to carry out the compensation of voltage drift caused by variations in temperature after the chip is packaged again.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of polycrystalline pressure sensor chip according to an embodiment of the invention.
Fig. 2 illustrates the embodiment that critesistor 20 is connected with polycrystalline pressure transducer 10.
Detailed description of the invention
The present invention is further illustrated below in conjunction with accompanying drawing.One of skill in the art will understand that, below simply in conjunction with specific embodiment, the purport of the present invention is illustrated, the enforcement of the present invention is not limited with regard to this.The scope that the present invention advocates is determined by appended claim, and any amendment without departing from spirit of the present invention, change all should be contained by the claim of the present invention.
Fig. 1 is the schematic diagram of polycrystalline pressure sensor chip according to an embodiment of the invention.In all examples of the present invention, exemplarily carrying out description below with piezoresistive pressure sensor, but be not limited thereto, polycrystalline pressure transducer of the present invention can also be such as capacitance pressure transducer.As it can be seen, chip 1 be internally provided with pressure sensor circuit 10, the critesistor 20 in parallel with pressure sensor circuit 10, this critesistor 20 has positive temperature-coefficient of electrical resistance.In piezoresistive pressure sensor, sensor circuit is the circuit bridge formed by four resistance (101,102,103 and 104) connection in series-parallel.Critesistor 20 is connected in parallel on the two ends of this circuit bridge.As it can be seen, be input to the electric current I of this polycrystalline pressure sensor chipcc> I0, output voltage is Vout.Along with operating ambient temperature raises, the resistance value R of critesistor 200Become big, flow through the electric current I of this critesistor 20RThen reduce, thus flowing through the electric current I of polycrystalline pressure sensor circuit 100Increase so that output voltage VoutBecoming big, the subzero temperature drift trend of this and polycrystalline pressure sensor circuit 10 itself is contrary, thus the voltage drift caused due to variations in temperature finally exported is reduced to minima.
In polycrystalline pressure sensor chip according to still another embodiment of the invention, critesistor 22 can be connected with polycrystalline pressure sensor circuit 10.If it is said that in general, what power to polycrystalline pressure sensor chip is constant current source, then select the mode that the critesistor 20 shown in Fig. 1 is in parallel with polycrystalline pressure sensor circuit 10；If what power to polycrystalline pressure sensor chip is constant voltage source, optional by compensating element, for instance critesistor 22 is connected with polycrystalline pressure transducer 10.Fig. 2 illustrates the embodiment that critesistor 22 is connected with polycrystalline pressure transducer 10.As it can be seen, critesistor 22 is connected on one end of this circuit bridge.The voltage being applied to this polycrystalline pressure sensor chip is Vcc, output voltage is Vout.Along with operating ambient temperature raises, the resistance value of critesistor diminishes, and its voltage got diminishes, simultaneously V0utBecome big, thus inhibiting final output voltage VoutThe trend reduced because of variations in temperature.
The preparation process of polycrystalline pressure sensor chip is prepared essentially identical with conventional chip, is distinctive in that, in the process preparing polycrystalline pressure sensor chip, forms the compensating element, compensating the voltage drift caused because of variations in temperature, such as critesistor.The formation of critesistor can carry out before preparing the sensor circuit of pressure sensor chip.To dopant implant agent in monocrystal silicon in adulterant injection technology in critesistor preparation process, for instance the element of trivalent or pentavalent.In the present embodiment, injection is trivalent boron.Exemplarily, the optional dopant dose injecting 8E13 power, and be annealed subsequently, thus obtaining the thermosensitive resistance of specific temperature-coefficient of electrical resistance.The injection rate of adulterant is determined according to practical situation.
Dopant implant agent preferably carried out before forming pressure sensor circuit, to avoid pressure sensor circuit to stand twice annealing, but carried out after being also not precluded within formation pressure sensor circuit.
According to the polycrystalline pressure sensor chip that embodiments of the invention provide, it is in the preparation process of chip, just the compensating element, for compensating the voltage drift caused because of variations in temperature is defined, such as critesistor, with conventional carry out hardware compensating after the chip is packaged compared with, decrease difficulty and workload that compensating element, selects, and critesistor be integrated in chip, with sensor circuit in parallel or series so that the voltage drift caused because of variations in temperature is canceled out the overwhelming majority.Additionally, due to compensating element, is formed in chip so that the concordance of compensation ability is better.
Claims (2)
1. the method preparing polycrystalline pressure sensor chip, it is characterized in that, described method includes injecting trivalent or pentad in chip manufacturing proces in adulterant injection technology to form critesistor, wherein, adulterant injection technology is injected trivalent or pentad to occur before forming pressure sensor circuit to form critesistor.
2. the method preparing polycrystalline pressure sensor chip according to claim 1, it is characterised in that the element of described injection is boron.
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| CN201210177498.XA CN103454033B (en) | 2012-06-01 | 2012-06-01 | Polycrystalline pressure sensor chip and preparation method thereof |
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| CN201210177498.XA CN103454033B (en) | 2012-06-01 | 2012-06-01 | Polycrystalline pressure sensor chip and preparation method thereof |
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| CN103454033A CN103454033A (en) | 2013-12-18 |
| CN103454033B true CN103454033B (en) | 2016-07-06 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105808010B (en) * | 2016-03-31 | 2018-11-30 | 京东方科技集团股份有限公司 | A kind of substrate, display device and its Pressure identification method |
| CN108253877A (en) * | 2016-12-29 | 2018-07-06 | 中国空气动力研究与发展中心超高速空气动力研究所 | Temperature compensating type semiconductor strain gauge with CMOS temperature transmitter |
| CN108151929A (en) * | 2018-01-03 | 2018-06-12 | 京东方科技集团股份有限公司 | Strain-ga(u)ge transducer and display device |
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| EP1566842A2 (en) * | 2004-02-19 | 2005-08-24 | Canon Kabushiki Kaisha | Solid-state image pick-up device and image system using the same |
| CN101551403A (en) * | 2009-05-22 | 2009-10-07 | 中国科学院上海微系统与信息技术研究所 | Integrated silicon chip for testing acceleration, pressure and temperature, and manufacturing method thereof |
| CN101706345A (en) * | 2009-10-30 | 2010-05-12 | 江苏大学 | Method for compensating for heat drift of sensibility of micro pressure sensor |
| CN102445301A (en) * | 2011-11-23 | 2012-05-09 | 无锡芯感智半导体有限公司 | SOI (silicon on insulator) pressure sensor with self- temperature drift compensation |
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- 2012-06-01 CN CN201210177498.XA patent/CN103454033B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1566842A2 (en) * | 2004-02-19 | 2005-08-24 | Canon Kabushiki Kaisha | Solid-state image pick-up device and image system using the same |
| CN101551403A (en) * | 2009-05-22 | 2009-10-07 | 中国科学院上海微系统与信息技术研究所 | Integrated silicon chip for testing acceleration, pressure and temperature, and manufacturing method thereof |
| CN101706345A (en) * | 2009-10-30 | 2010-05-12 | 江苏大学 | Method for compensating for heat drift of sensibility of micro pressure sensor |
| CN102445301A (en) * | 2011-11-23 | 2012-05-09 | 无锡芯感智半导体有限公司 | SOI (silicon on insulator) pressure sensor with self- temperature drift compensation |
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| 多晶硅压力传感器热灵敏度漂移补偿技术;罗秦川等;《传感器技术》;20030520;第22卷(第05期);33-36 * |
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