CN101920406B - Sn-Ag-Zn-Cr eutectic lead-free solder - Google Patents
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- 230000005496 eutectics Effects 0.000 title claims abstract description 9
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 17
- 238000005260 corrosion Methods 0.000 abstract description 17
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- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 8
- 239000010935 stainless steel Substances 0.000 abstract description 7
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 5
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 238000003723 Smelting Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 12
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- 229910000599 Cr alloy Inorganic materials 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
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- 238000007792 addition Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 239000010963 304 stainless steel Substances 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 4
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010583 slow cooling Methods 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 238000004377 microelectronic Methods 0.000 description 2
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- 241000282414 Homo sapiens Species 0.000 description 1
- 229910019192 Sn—Cr Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
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Abstract
一种焊接材料技术领域的Sn-Ag-Zn-Cr共晶无铅焊料，其组分及质量百分比为：Cr为0.005-1％，Ag为3-5％，Zn为0.5-5％、调节型元素0.5％，余量为Sn。本发明能够提高材料的抗氧化性、耐腐蚀性，同时延展性、强度等机械性能得到改善，并且对不锈钢焊锡槽等的腐蚀作用明显减弱。A Sn-Ag-Zn-Cr eutectic lead-free solder in the technical field of welding materials, the components and mass percentages of which are: Cr is 0.005-1%, Ag is 3-5%, Zn is 0.5-5%, the regulating element is 0.5%, and the balance is Sn. The invention can improve the oxidation resistance and corrosion resistance of the material, and at the same time improve the mechanical properties such as ductility and strength, and significantly reduce the corrosion effect on stainless steel solder baths and the like.
Description
技术领域 technical field
本发明涉及的是一种焊接材料技术领域的焊料，具体是一种Sn-Ag-Zn-Cr共晶无铅焊料。The invention relates to a solder in the technical field of soldering materials, in particular to a Sn-Ag-Zn-Cr eutectic lead-free solder.
背景技术 Background technique
到目前为止，大量用于微电子封装及组装的焊料主要是传统的Sn-Pb系焊料。然而，电子产品、设备作为一般工业废弃物和生活垃圾被丢弃时，在自然环境中焊料中的Pb成分会溶解出来，侵入地下水，从而对环境和人类造成极大的危害。因此，近年来包括我国在内的许多国家纷纷制定或正在制定法律、法规，限制含铅物质的使用，用无铅焊料替代传统的Sn-Pb系含铅焊料已成为全球微电子制造领域不可逆转的大趋势，积极寻找无毒无害的新型焊料也成为了当前电子行业的重要任务。Sn-Ag-Zn系焊料作为较有潜力的焊料合金近两年来越来越受到研究者的关注。So far, a large number of solders used in microelectronic packaging and assembly are mainly traditional Sn-Pb solders. However, when electronic products and equipment are discarded as general industrial waste and domestic garbage, the Pb component in the solder will dissolve out in the natural environment and invade the groundwater, thereby causing great harm to the environment and human beings. Therefore, in recent years, many countries including my country have enacted or are enacting laws and regulations to restrict the use of lead-containing substances. It has become irreversible in the global microelectronics manufacturing field to replace the traditional Sn-Pb lead-containing solder with lead-free solder. Actively looking for new non-toxic and harmless solders has become an important task for the current electronics industry. Sn-Ag-Zn solder as a potential solder alloy has attracted more and more attention from researchers in the past two years.
相比目前最常用的Sn-Ag-Cu三元焊料，Sn-Ag-Zn三元焊料的成本和熔点与Sn-Ag-Cu焊料相当。经过对现有技术文件的检索发现，在《无铅焊接技术》(科学出版社，2004.7，第39页)中提到Sn-Ag-Cu系列焊料，该焊料除熔点偏高，价格较贵外，还存在着一些有待解决的问题。如在冷却速度较低或Ag焊料偏高的情况下，易形成粗大的脆性Ag3Sn、Cu6Sn5相，造成脆性增加，延展性降低，疲劳强度下降。而在《The effects of third alloying elements on the bulkAg3Sn formation in slowly cooled Sn-3.5Ag lead-free solder》(J Mater Sci：MaterElectron(2008)19：275-280)和其他一些文献中报道，Sn-Ag-Zn焊料可有效抑制脆性Ag3Sn、Cu6Sn5相的生长，改善材料的力学性能和老化稳定性。但是根据文献《Effect of zincadditions on structure and properties of Sn-Ag eutectic lead-free solder alloy》(J Mater Sci：Mater Electron(2008)19：81-84)和文献《Effect of thermal ageing on(Sn-Ag，Sn-Ag-Zn)/PtAg，Cu/Al2O3 solder joints》(JOURNAL OF MATERIALS SCIENCE：MATERIALS IN ELECTRONICS 9(1998)373-381)及其他一些文献报道，Sn-Ag-Zn焊料在抗氧化性能、润湿性、焊点初始强度和对不锈钢容器的腐蚀性上具有一定劣势。由于以上问题未得到解决，所以目前Sn-Ag-Zn焊料相对Sn Ag-Cu焊料不具备竞争优势。Compared with the most commonly used Sn-Ag-Cu ternary solder, the cost and melting point of Sn-Ag-Zn ternary solder are comparable to Sn-Ag-Cu solder. After searching the existing technical documents, it is found that Sn-Ag-Cu series solders are mentioned in "Lead-Free Soldering Technology" (Science Press, 2004.7, page 39), except that the solders have a high melting point and are more expensive. , there are still some problems to be solved. For example, in the case of low cooling rate or high Ag solder, it is easy to form coarse and brittle Ag 3 Sn and Cu 6 Sn 5 phases, resulting in increased brittleness, decreased ductility, and decreased fatigue strength. However, as reported in "The effects of third alloying elements on the bulkAg3Sn formation in slowly cooled Sn-3.5Ag lead-free solder" (J Mater Sci: MaterElectron (2008) 19: 275-280) and other literatures, Sn-Ag -Zn solder can effectively inhibit the growth of brittle Ag 3 Sn and Cu 6 Sn 5 phases, and improve the mechanical properties and aging stability of materials. However, according to the literature "Effect of zinc additions on structure and properties of Sn-Ag eutectic lead-free solder alloy" (J Mater Sci: Mater Electron (2008) 19: 81-84) and the literature "Effect of thermal aging on (Sn-Ag , Sn-Ag-Zn)/PtAg, Cu/Al 2 O 3 solder joints" (JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS 9 (1998) 373-381) and other literature reports, Sn-Ag-Zn solder is resistant to It has certain disadvantages in oxidation performance, wettability, initial strength of solder joints and corrosion to stainless steel containers. Since the above problems have not been resolved, the current Sn-Ag-Zn solder does not have a competitive advantage over the Sn Ag-Cu solder.
发明内容 Contents of the invention
本发明针对现有技术存在的上述不足，提供一种Sn-Ag-Zn-Cr共晶无铅焊料，能够提高材料的抗氧化性、耐腐蚀性，同时延展性、强度等机械性能得到改善，并且对不锈钢焊锡槽等的腐蚀作用明显减弱。The present invention aims at the above-mentioned deficiencies in the prior art, and provides a Sn-Ag-Zn-Cr eutectic lead-free solder, which can improve the oxidation resistance and corrosion resistance of the material, and at the same time improve the mechanical properties such as ductility and strength. And the corrosion effect on the stainless steel solder bath is obviously weakened.
本发明是通过以下技术方案实现的，本发明的组分及其质量百分比为：Cr为0.005-1％，Ag为3-5％，Zn为0.5-5％、调节型元素0.5％，余量为Sn。The present invention is achieved through the following technical solutions. The components of the present invention and their mass percentages are: 0.005-1% for Cr, 3-5% for Ag, 0.5-5% for Zn, 0.5% for regulating elements, and the balance for Sn.
所述的Cr的含量优选为0.01-0.8％，更进一步优选为0.02-0.5％。The Cr content is preferably 0.01-0.8%, more preferably 0.02-0.5%.
所述的调节型元素为Ni、Ga、In或P中的任意一种。The adjusting element is any one of Ni, Ga, In or P.
本发明涉及上述Sn-Ag-Zn-Cr无铅焊料的制备方法，包括直接熔炼法和分布熔炼法，其中：The present invention relates to the preparation method of above-mentioned Sn-Ag-Zn-Cr lead-free solder, comprises direct smelting method and distributed smelting method, wherein:
所述的直接熔炼法是指：将所述组分直接混合后熔炼制得到无铅焊料；The direct smelting method refers to: directly mixing the components and then smelting to obtain lead-free solder;
所述的组分为粉末状、粒状或块体状的金属元素；The components are powdery, granular or bulk metal elements;
所述的分布熔炼法是指：依次制备Sn-Cr合金、Ag-Cr合金、Zn-Cr合金、Sn-Zn-Cr合金和Sn-Ag-Cr合金，然后将上述合金与调节型元素混合后熔炼得到无铅焊料。The distributed smelting method refers to: sequentially prepare Sn-Cr alloy, Ag-Cr alloy, Zn-Cr alloy, Sn-Zn-Cr alloy and Sn-Ag-Cr alloy, and then mix the above alloys with adjusting elements Melted to obtain lead-free solder.
所述的熔炼是指：在真空、熔盐或惰性气体保护或还原气体保护的环境下进行熔炼。The smelting refers to: smelting under the environment of vacuum, molten salt or inert gas protection or reducing gas protection.
本发明通过加入Cr改善了Sn-Ag-Zn三元共晶焊料的抗氧化性能和抗腐蚀能力，实验表明，Cr的加入会在表面Sn、Cu氧化层和基底金属之间形成Cr阻挡层，在高温或腐蚀环境中，该阻挡层可以阻止Sn、Cu向外扩散，从而改善了焊料的抗氧化性能和耐腐蚀性能；此外Cr的加入使得焊料组织和焊点界面组织有了明显的细化，提高了焊料力学性能和焊点的可靠性；同时在焊料的凝固温度范围形成Sn-Zn-Cr金属间化合物，通过金属间化合物的弥散强化提高了焊料的强度；另外Cr的存在会大大降低焊料对含Cr合金的溶解速度，避免或改善对不锈钢焊锡槽材料的溶蚀。当Cr含量小于0.005％时，无弥散强化作用，在焊料表面附件难以形成Cr的阻挡层，对焊料的化学性能和机械性能改善不够；当含量高于1％时，易造成成分的偏析，这种偏析使Cr阻挡层不均匀，局部过厚，对润湿性和机械性能等的负面影响较大。如果控制焊料中Cr的含量在0.02-0.5％范围时，阻挡层厚度均匀、适中，既能产生弥散强化作用，降低对不锈钢等的溶蚀，又没有明显的偏析现象，使焊料的化学性能和机械性能均处于最佳状态。焊料合金对不锈钢的腐蚀作用明显减弱。本发明中加入的Ga和In不仅可以改善焊料的润湿性能，同时可以和Cr生成金属间化合物，同时可以和Cr生成CrGa4、Cr5Ga6、CrIn2等金属间化合物，在合金中起到弥散强化的效果，从而提高焊料的机械强度。而Ni的加入不仅可以抑制Ag3Sn金属间化合物的生长，提高焊料的塑性，同时还可以改善焊料的抗电迁移能力。P的加入改善了焊料的抗氧化性能，从而提高了焊料的润湿性。相比普通Sn-Ag-Zn焊料，本发明在抗氧化性、耐腐蚀性、延展性、耐疲劳性等机械性能上得到改善，并且对不锈钢焊锡槽等的腐蚀作用明显减弱。The invention improves the oxidation resistance and corrosion resistance of the Sn-Ag-Zn ternary eutectic solder by adding Cr. Experiments show that the addition of Cr will form a Cr barrier layer between the surface Sn, Cu oxide layer and the base metal, In high temperature or corrosive environments, the barrier layer can prevent the outward diffusion of Sn and Cu, thereby improving the oxidation resistance and corrosion resistance of the solder; in addition, the addition of Cr makes the solder structure and solder joint interface structure significantly refined , improving the mechanical properties of the solder and the reliability of the solder joints; at the same time, Sn-Zn-Cr intermetallic compounds are formed in the solidification temperature range of the solder, and the strength of the solder is improved through the dispersion strengthening of the intermetallic compounds; in addition, the presence of Cr will greatly reduce The dissolution rate of the solder to the Cr-containing alloy can avoid or improve the corrosion of the stainless steel solder bath material. When the Cr content is less than 0.005%, there is no dispersion strengthening effect, and it is difficult to form a Cr barrier layer near the solder surface, which does not improve the chemical and mechanical properties of the solder enough; when the Cr content is higher than 1%, it is easy to cause segregation of components, which This kind of segregation makes the Cr barrier layer uneven and locally too thick, which has a great negative impact on wettability and mechanical properties. If the content of Cr in the solder is controlled in the range of 0.02-0.5%, the thickness of the barrier layer is uniform and moderate, which can not only produce dispersion strengthening, reduce the corrosion of stainless steel, etc., but also have no obvious segregation phenomenon, so that the chemical properties and mechanical properties of the solder can be improved. Performance is at its best. The corrosion effect of solder alloy on stainless steel is obviously weakened. The Ga and In added in the present invention can not only improve the wettability of the solder, but also form intermetallic compounds with Cr, and can form intermetallic compounds such as CrGa 4 , Cr 5 Ga 6 , and CrIn 2 with Cr, which play a role in the alloy. To the effect of dispersion strengthening, thereby improving the mechanical strength of the solder. The addition of Ni can not only inhibit the growth of Ag 3 Sn intermetallic compounds, improve the plasticity of the solder, but also improve the resistance to electromigration of the solder. The addition of P improves the oxidation resistance of the solder, thereby improving the wettability of the solder. Compared with ordinary Sn-Ag-Zn solder, the invention has improved mechanical properties such as oxidation resistance, corrosion resistance, ductility and fatigue resistance, and its corrosion effect on stainless steel solder baths is obviously weakened.
本发明提供的焊料可以用在很多领域，如做成焊条、焊丝、焊片、焊球、焊粉、焊膏等。这些产品可以用在电子封装或组装的各个焊接环节，如电子封装中芯片上丝网印刷形成电极凸点(Bump)、芯片粘贴，BGA、CSP焊球，回流焊、波峰焊等SMT组装，各种电子封装用基板、印刷电路版焊点形成，以及各种修补焊、手工焊等。总之，本发明提供的焊料，其应用领域广阔。The solder provided by the invention can be used in many fields, such as being made into welding rods, welding wires, solder sheets, solder balls, solder powder, solder paste and the like. These products can be used in various soldering links of electronic packaging or assembly, such as electrode bumps (Bump) formed by screen printing on chips in electronic packaging, chip paste, BGA, CSP solder balls, reflow soldering, wave soldering and other SMT assembly. Various electronic packaging substrates, printed circuit board solder joint formation, and various repair welding, manual welding, etc. In a word, the solder provided by the present invention has a wide range of applications.
具体实施方式 Detailed ways
下面对本发明的实施例作详细说明，本实施例在以本发明技术方案为前提下进行实施，给出了详细的实施方式和具体的操作过程，但本发明的保护范围不限于下述的实施例。The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.
实施例1Example 1
本发明的组分及其质量百分比为：Cr＝0.005％，Ag＝3.5％，Zn＝1.5％，余量为Sn，通过直接熔炼法或者分步熔炼法制成Sn-3.5Ag-1.5Zn-0.005Cr合金焊料。The components and their mass percentages of the present invention are: Cr=0.005%, Ag=3.5%, Zn=1.5%, and the balance is Sn, which is made into Sn-3.5Ag-1.5Zn-0.005 by direct smelting method or step-by-step smelting method Cr alloy solder.
各种性能测定表明：该焊料的熔点、润湿性、抗拉强度与Sn-3.5Ag-1.5Zn合金焊料基本相同；在85℃，湿度为85％的腐蚀条件下进过24小时实验后，发黄现象减少，且经250℃x25小时高温氧化实验后；光泽性好于Sn-3.5Ag-1.5Zn焊料。对304不锈钢溶蚀较少；延展性比Sn-3.5Ag-1.5Zn焊料提高约5％；在缓慢冷却后脆性增加现象不明显。Various performance measurements show that the melting point, wettability and tensile strength of this solder are basically the same as those of Sn-3.5Ag-1.5Zn alloy solder; The yellowing phenomenon is reduced, and after the high-temperature oxidation test at 250°C x 25 hours; the gloss is better than that of Sn-3.5Ag-1.5Zn solder. There is less corrosion to 304 stainless steel; the ductility is about 5% higher than that of Sn-3.5Ag-1.5Zn solder; the increase in brittleness is not obvious after slow cooling.
实施例2Example 2
本发明的组分及其质量百分比为：Cr＝0.01％，Ag＝3.5％，Zn＝1.5％，余量为Sn，通过直接熔炼法或者分步熔炼法制成Sn-3.5Ag-1.5Zn-0.01Cr合金焊料。The components and their mass percentages of the present invention are: Cr=0.01%, Ag=3.5%, Zn=1.5%, and the balance is Sn, which is made into Sn-3.5Ag-1.5Zn-0.01 by direct smelting method or step-by-step smelting method Cr alloy solder.
各种性能测定表明：该焊料的熔点、润湿性、抗拉强度与Sn-3.5Ag-1.5Zn合金焊料基本相同；在85℃，湿度为85％的腐蚀条件下进过24小时实验后，发黄现象进一步减少，且经250℃x25小时高温氧化实验后；光泽性也好于Sn-3.5Ag-1.5Zn焊料。对304不锈钢溶蚀较少；延展性比Sn-3.5Ag-1.5Zn焊料提高约5-10％；在缓慢冷却后脆性增加现象不明显。Various performance measurements show that the melting point, wettability and tensile strength of this solder are basically the same as those of Sn-3.5Ag-1.5Zn alloy solder; The yellowing phenomenon is further reduced, and after the high-temperature oxidation test at 250°C x 25 hours; the gloss is also better than that of Sn-3.5Ag-1.5Zn solder. There is less corrosion to 304 stainless steel; the ductility is about 5-10% higher than that of Sn-3.5Ag-1.5Zn solder; the increase in brittleness is not obvious after slow cooling.
实施例3Example 3
本发明的组分及其质量百分比为：Cr＝0.03％，Ag＝3.5％，Zn＝1.5％，余量为Sn，通过直接熔炼法或者分步熔炼法制成Sn-3.5Ag-1.5Zn-0.03Cr合金焊料。The components and their mass percentages of the present invention are: Cr=0.03%, Ag=3.5%, Zn=1.5%, and the balance is Sn, which is made into Sn-3.5Ag-1.5Zn-0.03 by direct smelting method or step-by-step smelting method Cr alloy solder.
各种性能测定表明：该焊料的熔点、润湿性、抗拉强度与Sn-3.5Ag-1.5Zn合金焊料基本相同；在85℃，湿度为85％的腐蚀条件下进过24小时实验后，无发黄现象，且经250℃x25小时高温氧化实验后；光泽性远好于Sn-3.5Ag-1.5Zn焊料。对304不锈钢溶蚀无明显溶蚀；延展性比Sn-3.5Ag-1.5Zn焊料提高约15％；在缓慢冷却后脆性增加现象不明显。Various performance measurements show that the melting point, wettability and tensile strength of this solder are basically the same as those of Sn-3.5Ag-1.5Zn alloy solder; No yellowing phenomenon, and after 250 ℃ x 25 hours high temperature oxidation test; gloss is much better than Sn-3.5Ag-1.5Zn solder. There is no obvious corrosion of 304 stainless steel; the ductility is about 15% higher than that of Sn-3.5Ag-1.5Zn solder; the increase in brittleness is not obvious after slow cooling.
实施例4Example 4
本发明的组分及其质量百分比为：Cr＝0.03％，Ag＝3.5％，Zn＝4％，余量为Sn，通过直接熔炼法或者分步熔炼法制成Sn-3.5Ag-4Zn-0.03Cr合金焊料。The components and their mass percentages of the present invention are: Cr=0.03%, Ag=3.5%, Zn=4%, the balance is Sn, and Sn-3.5Ag-4Zn-0.03Cr is made by direct smelting method or step-by-step smelting method alloy solder.
各种性能测定表明：该焊料的抗拉强度与Sn-3.5Ag-1.5Zn合金焊料基本相同；经DSC检测，液相线温度降低约2℃，同时熔程扩大约1℃。通过铺展实验，润湿性较Sn-3.5Ag-1.5Zn焊料提高约7％。在85℃，湿度为85％的腐蚀条件下进过24小时实验后，无发黄现象，且经250℃x25小时高温氧化实验后；光泽性远好于Sn-3.5Ag-1.5Zn焊料。对304不锈钢无明显溶蚀；延展性比Sn-3.5Ag-1.5Zn焊料提高约20％；在缓慢冷却后脆性增加现象明显。Various performance measurements show that the tensile strength of the solder is basically the same as that of the Sn-3.5Ag-1.5Zn alloy solder; the liquidus temperature decreases by about 2°C and the melting range expands by about 1°C through DSC detection. Through the spreading experiment, the wettability is about 7% higher than that of Sn-3.5Ag-1.5Zn solder. After 24 hours of testing under the corrosion conditions of 85°C and 85% humidity, there is no yellowing phenomenon, and after 250°C x 25 hours high temperature oxidation test; the gloss is much better than that of Sn-3.5Ag-1.5Zn solder. There is no obvious corrosion to 304 stainless steel; the ductility is about 20% higher than that of Sn-3.5Ag-1.5Zn solder; the brittleness increases obviously after slow cooling.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2599890B2 (en) * | 1993-02-22 | 1997-04-16 | エイ・ティ・アンド・ティ・コーポレーション | Lead-free solder material |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN101214589A (en) * | 2008-01-14 | 2008-07-09 | 哈尔滨工业大学 | Multi-component leadless solder |
| CN101733577A (en) * | 2009-11-26 | 2010-06-16 | 上海大学 | Sn-Ag-Cu-Zn-Cr quinary alloy lead-free solder |
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|---|---|---|---|---|
| JP2599890B2 (en) * | 1993-02-22 | 1997-04-16 | エイ・ティ・アンド・ティ・コーポレーション | Lead-free solder material |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN101214589A (en) * | 2008-01-14 | 2008-07-09 | 哈尔滨工业大学 | Multi-component leadless solder |
| CN101733577A (en) * | 2009-11-26 | 2010-06-16 | 上海大学 | Sn-Ag-Cu-Zn-Cr quinary alloy lead-free solder |
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