Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4871—Bases, plates or heatsinks
  • H01L21/4878—Mechanical treatment, e.g. deforming
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
  • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Theoretical Computer Science (AREA)
• Materials Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Manufacturing & Machinery (AREA)
• Human Computer Interaction (AREA)
• General Engineering & Computer Science (AREA)
• Laser Beam Processing (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=50068435

Family Applications (1)

Country Status (8)

Families Citing this family (4)

Family Cites Families (12)

• 2012
  • 2012-08-06 WO PCT/US2012/049694 patent/WO2014025332A1/en active Application Filing
  • 2012-08-06 CN CN201280075150.8A patent/CN104603714A/en active Pending
  • 2012-08-06 JP JP2015526505A patent/JP2015530925A/en active Pending
  • 2012-08-06 GB GB201500847A patent/GB2519253A/en not_active Withdrawn
  • 2012-08-06 BR BR112015002627A patent/BR112015002627A2/en not_active IP Right Cessation
  • 2012-08-06 CA CA2880490A patent/CA2880490A1/en not_active Abandoned
  • 2012-08-06 DE DE112012006782.7T patent/DE112012006782T5/en not_active Withdrawn
  • 2012-08-06 KR KR20157002756A patent/KR20150046015A/en not_active Application Discontinuation

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