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Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration

Authors:

Ali Abbasinasab,

Malgorzata Marek-SadowskaAuthors Info & Claims

GLSVLSI '19: Proceedings of the 2019 Great Lakes Symposium on VLSI

Pages 117 - 122

https://doi.org/10.1145/3299874.3317973

Published: 13 May 2019 Publication History

Abstract

We investigate the effect of electrically induced thermal load on interconnect reliability and aging. We propose new models for uniform and non-uniform temperature evolution and its steady state distribution in interconnects considering Joule heating and heat convection. The models are verified by comparing the results against those of finite element experiments. We apply our models to study material migration induced aging and failures. We discuss how different non-uniform temperature profiles affect interconnect lifetime. We propose new formulas for accurate temperature aware assessment of the mortality of interconnects. We demonstrate that neglecting thermal effects in modern technologies may lead to incorrect conclusions about interconnect mortality. We also provide a method for modeling the true mean time to failure based on underlying physics.

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Cited By

Kavousi MChen LTan SWang T(2022)Fast Electromigration Stress Analysis Considering Spatial Joule Heating EffectsProceedings of the 27th Asia and South Pacific Design Automation Conference10.1109/ASP-DAC52403.2022.9712535(208-213)Online publication date: 17-Jan-2022
https://dl.acm.org/doi/10.1109/ASP-DAC52403.2022.9712535
Chen LTan SSun ZPeng STang MMao J(2021)A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment InterconnectsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2020.299427140:2(350-363)Online publication date: 1-Feb-2021
https://dl.acm.org/doi/10.1109/TCAD.2020.2994271
Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 1-Oct-2021
https://dl.acm.org/doi/10.1007/s11390-021-0909-8
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cover image ACM Conferences

GLSVLSI '19: Proceedings of the 2019 Great Lakes Symposium on VLSI

May 2019

562 pages

ISBN:9781450362528

DOI:10.1145/3299874

General Chairs:
Houman Homayoun
George Mason University, USA
,
Baris Taskin
Drexel University, USA
,
Program Chairs:
Tinoosh Mohsenin
UMBC, USA
,
Weisheng Zhao
Beihang University, China

Copyright © 2019 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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SIGDA: ACM Special Interest Group on Design Automation

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 13 May 2019

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GLSVLSI '19: Great Lakes Symposium on VLSI 2019

May 9 - 11, 2019

VA, Tysons Corner, USA

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Overall Acceptance Rate 312 of 1,156 submissions, 27%

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Cited By

Kavousi MChen LTan SWang T(2022)Fast Electromigration Stress Analysis Considering Spatial Joule Heating EffectsProceedings of the 27th Asia and South Pacific Design Automation Conference10.1109/ASP-DAC52403.2022.9712535(208-213)Online publication date: 17-Jan-2022
https://dl.acm.org/doi/10.1109/ASP-DAC52403.2022.9712535
Chen LTan SSun ZPeng STang MMao J(2021)A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment InterconnectsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2020.299427140:2(350-363)Online publication date: 1-Feb-2021
https://dl.acm.org/doi/10.1109/TCAD.2020.2994271
Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 1-Oct-2021
https://dl.acm.org/doi/10.1007/s11390-021-0909-8
Kavousi MChen LTan SXie Y(2020)Electromigration immortality check considering joule heating effect for multisegment wiresProceedings of the 39th International Conference on Computer-Aided Design10.1145/3400302.3415634(1-8)Online publication date: 2-Nov-2020
https://dl.acm.org/doi/10.1145/3400302.3415634

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