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A high-speed PLA using array logic circuits with latch sense amplifiers and a charge sharing scheme

Published: 30 January 2001 Publication History

Abstract

In this paper, a high-speed PLA based on latch sense amplifiers and a charge sharing scheme is resented. The circuit consists of logic cell arrays, dual-rail bit-lines, latch sense amplifiers, and control blocks. By latch sense amplifiers, a read-out scheme sensing the differential voltage of dual-rail bit-lines caused by charge sharing is used for high-speed operation. As an application of the proposed PLA, a 32-bit binary comparator is designed and implemented in a 0.6-um double-poly, triple-metal CMOS process. Results of HSPICE simulation are 2.9 times faster than the conventional CMOS circuit. The measured results show a good agreement with the simulation.

References

[1]
M.Matsui et al.,"A 200 MHz 13 mm 2 2-D DCT Macrocell Using Sense-Amplifying Pipeline Flip-Flop Scheme," IEEE J. Solid-State Circuits,vol.29,pp.1482-1490,Dec.1994.
[2]
O.Takahashi,N.Aoki,J.Silberman,and S.Dhong,"1GHz Logic Circuits with Sense Ampli .ers," in Symp.VLSI Circuits Dig.Tech.Papers,1998,pp.110-111.

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cover image ACM Conferences
ASP-DAC '01: Proceedings of the 2001 Asia and South Pacific Design Automation Conference
January 2001
662 pages
ISBN:0780366344
DOI:10.1145/370155
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 30 January 2001

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  • IPSJ
  • SIGDA
  • IEEE HK CAS

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Overall Acceptance Rate 466 of 1,454 submissions, 32%

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