Tessent Silicon Lifecycle Solutions’ Post

Looking forward to our webinar next week on how to take diagnosis to the next level.

Don't miss this new Tessent webinar, presented by Jayant D'Souza, Principal Technical Product Manager, as it introduces the latest scan chain diagnosis improvements from Siemens EDA. The webinar will detail three new software-based technologies that provide accurate localization to enable efficient failure analysis of both front-end and back-end line defects. As well as sharing the results for each of these techniques, Jayant will also introduce further technologies that can alleviate the pressure on fault isolation for front-end of line defects and provide reduced area for back-end of line defects for Physical Failure Analysis (PFA) With the advent of new technologies, like backside power in advanced process nodes, making fault isolation extremely challenging, don't miss this live webinar to learn how to address these issues. Reserve your free webinar place today. https://sie.ag/7TWFQL #HiResChain #YieldLearning #Scanchaindiagnosis #chiplets #DFT #Tessent #DFTMarketLeader #SiemensEDA #3DIC #semiconductors

Last call for the new, live Tessent webinar taking place tomorrow that will introduce the latest scan chain diagnosis improvements from Siemens EDA. Presented by Jayant D'Souza, Principal Technical Product Manager, Tessent, the webinar will introduce 3 new software-based technologies that provide accurate localization to enable efficient failure analysis of both front-end and back-end line defects. As well as sharing the results for each of these techniques, Jayant will also explain further technologies that can alleviate the pressure on fault isolation for front-end of line defects and provide reduced area for back-end of line defects for Physical Failure Analysis (PFA). With the advent of new technologies, like backside power in advanced process nodes, making fault isolation extremely challenging, don't miss this exclusive opportunity to learn how to address these issues. Register now and reserve your free webinar place. https://sie.ag/BAKvs #HiResChain #YieldLearning #Scanchaindiagnosis #chiplets #DFT #Tessent #DFTMarketLeader #SiemensEDA #3DIC #semiconductors

NI (National Instruments) introduces mioDAQ, a USB #dataacquisition (DAQ) device, that combines modern measurement technology with a simplified user experience. With ±10 V inputs, ±10 V outputs, TTL digital lines, and #NI’s patented counter/timer circuitry, there are hundreds of tasks engineers, researchers, and test professionals can accomplish using #mioDAQ. Find out more! https://bit.ly/3B3DaTw #daq #engineering #productlaunch #testandmeasurement

我們協助半導體客戶導入磁極磁通多軸量測系統, 具備XYZ-C的四軸自動化平面掃瞄系統,量測系統提供靜態及動態的量測模式, 量測的尺寸樣本外徑O.D from 5mm to 600mm,H from 1mm to 300mm , 均可以依照實際的樣本需求客製化設計。此系統可以精準的掃瞄平面的磁場數值資料並且轉換成圖像式的呈現,加速產品的精準開發設計驗證。   We assist semiconductor customers in introducing a magnetic pole flux multi-axis measurement system, it equipped with an XYZ-C four-axis automated plane scanning system. The measurement system provides static and dynamic measurement modes, and the measured size sample outer diameter is from 5mm to 600mm, high is from 1mm to 300mm. Additionally, the system can be customized according to actual sample requirements. This system can accurately scan the plane's magnetic field numerical data and convert it into an image presentation, accelerating the precise development, design and verification of products. #XYZCplatform #mapping #flux

How CoroCut® 2 -RF achieves superior chip control for small depths of cuts? Thanks to a unique, in-house developed patented technology, the chip-breaker geometry is positioned precisely where it needs to be — close to the cutting edge. And the insert edge remains sharp. The result is top process security, even in the most challenging materials. Read more at bit.ly/40asjSd #SandvikCoromant #CoroCut #chipcontrol

A relevant, impactful, and original automotive paper on testing challenges will be presented at #Designcon2024 by Julien HENAUT, PhD - COO & RnD Manager, BitifEye Digital Test Solutions GmbH along with Eyran Lida, CTO, Valens Semiconductor. The session encompasses the necessary methodologies for designing, diagnosing, and conducting compliance testing to guarantee the accuracy of automotive communication links. Additionally, it delves into the specifications of the prevailing HSS automotive standards, including MIPI A-PHY, Automotive Ethernet, and ASA. We can't wait to see you there on January 31, #designcon 2024 #santaclara . Stay tuned! Authors : Julien HENAUT, PhD, Eyran Lida, Ransom Stephens, Yash Pathak   #automotiveindustry #automotivechip #selfdriving #technology #future #testautomation #validation #SIJ #signalintegrity #powerintegrity #highspeeddesign #serdes #keysight #Valiframe #bitifeye #digitalworld #receiver #automationsolutions #Linktraining #calibration #validation #SIJ #highspeeddesign #semiconductor #techinnovation #technologysolutions #Rxtesting #computing #interfaces #digitalsignal #signalautomation #waveforms

Learn about the innovative use of Tessent Test Solutions by Racyics and an outline of the strategy they employ in this exclusive presentation by Naim Lemar, DFT Engineer, RACYICS, and which was delivered at the recent Siemens U2U Europe summit. RACYICS use Tessent Test Solutions to ensure the reliability of 3D stacked ICs, while maintaining economic viability through reduced tester time and resource requirements for Die-to-Die interconnect test in 3D stacked ICs. With the semiconductor industry's shift towards 3D stacked ICs introducing complex challenges in testing, particularly for die-to-die interconnects prone to manufacturing defects. The RACYICS approach utilizes Tessent's User Defined Fault Model (UDFM) to target these specific interconnects rather than the entire netlist to precisely model short and open interconnect defects, thereby optimizing Automatic Test Pattern Generation (ATPG) for improved test coverage and efficiency. Watch the full presentation recording to learn more. https://sie.ag/44qeRw #3DIC #DFTmarketleader #Tessent #designfortest #TessentStreamingScanNetwork #TessentSSN #Semiconductors #ATPG

📢 EIGEMbox: Transforming Semiconductor Fabs with $3M Savings! 💰 Client: Leading Semiconductor Fabrication Companies Product: EIGEMbox - https://lnkd.in/eNHzrWh Results: Saved $3 Million in Equipment Upgrade Costs Revolutionize your fab operations with EIGEMbox! 🚀 🌟 Success Highlights: Massive Cost Savings: Our client avoided $3 million in equipment upgrade expenses. Boosted Efficiency: Seamless integration that enhanced performance and productivity. Minimal Disruptions: Quick setup with minimal impact on existing operations. Compliance Excellence: Easily met and maintained industry standards. EIGEMbox is the ultimate solution for modernizing semiconductor fabs. It adds advanced SECS/GEM communication capabilities to your existing systems without the need for expensive equipment overhauls. Say goodbye to costly upgrades and hello to improved efficiency and savings! Ready to elevate your fab operations? 🌐 Learn More About EIGEMbox #Semiconductor #CostSavings #EIGEMbox #Efficiency #Manufacturing #Innovation

#Manufacturing innovation through collaboration. Teklak Waldemar of Van Pur S.A. expressed excitement for how 14th Gen #IntelCore processors, in collaboration with Arendai, are advancing manufacturing. Learn more. https://intel.ly/3vNfd09